JP5573937B2 - Antenna module - Google Patents

Antenna module Download PDF

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Publication number
JP5573937B2
JP5573937B2 JP2012286485A JP2012286485A JP5573937B2 JP 5573937 B2 JP5573937 B2 JP 5573937B2 JP 2012286485 A JP2012286485 A JP 2012286485A JP 2012286485 A JP2012286485 A JP 2012286485A JP 5573937 B2 JP5573937 B2 JP 5573937B2
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Prior art keywords
coil
antenna
insulating layer
magnetic
magnetic core
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JP2013078144A (en
Inventor
勉 家木
浩行 久保
正道 安藤
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株式会社村田製作所
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H01Q7/08Ferrite rod or like elongated core
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/40Radiating elements coated with or embedded in protective material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F17/0033Printed inductances with the coil helically wound around a magnetic core
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/022Encapsulation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/027Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances

Description

The present invention relates to an antenna module used in an RFID (Radio Frequency Identification) system that communicates with an external device via an electromagnetic field signal.

  In an RFID system that has been used in recent years, an antenna for information communication is mounted on each of a portable electronic device such as a mobile phone and a reader / writer to exchange data with each other. As an RFID antenna, a magnetically coupled antenna having a structure in which a coil is wound around a magnetic core is generally used. Of these, magnetic coupling antennas mounted on portable electronic devices are particularly required to have high impact resistance that does not fluctuate the antenna characteristics due to impact such as dropping. One factor that causes the antenna characteristics to fluctuate due to an external impact is the damage to the magnetic core due to the impact.

  As a measure for preventing fluctuations in antenna characteristics due to breakage of the magnetic core, Patent Document 1 proposes the following shape of a magnetically coupled antenna (hereinafter, the magnetically coupled antenna is simply referred to as an antenna). . 15-A and 15-B are diagrams showing the structure of the antenna described in Patent Document 1, FIG. 15-A is a top view, and FIG. 15-B is a cross section taken along the line AA in FIG. 15-A. FIG.

  In the antenna 1000 illustrated in FIGS. 15A and 15B, a magnetic core member 1012 is sandwiched between two insulating layers 1010a and 1010b. The antenna 1000 includes an upper surface conductor 1016 formed on the upper surface of the upper insulating layer 1010a, a lower surface conductor 1018 formed on the lower surface of the lower insulating layer 1010b, and a connecting conductor 1020 that connects the upper surface conductor 1016 and the lower surface conductor 1018. Is provided. A coil 1014 is formed around the insulating layers 1010a and 1010b by the upper surface conductor 1016, the lower surface conductor 1018, and the connection conductor 1020. The connection conductor 1020 is a through hole formed from the upper surface of the upper insulating layer 1010a to the lower surface of the lower insulating layer 1010b. The upper surface conductor 1016 and the lower surface conductor 1018 are electrically connected by the plating layer formed on the inner wall of the through hole.

Due to the structure in which the magnetic core member 1012 is sandwiched between the upper and lower insulating layers 1010a and 1010b, the impact applied to the entire antenna 1000 is not directly applied to the magnetic core member 1012. Accordingly, the magnetic core member 1012 is not easily damaged, and the antenna characteristics are not easily changed due to the magnetic core member 1012 being damaged.
JP 2005-184094 A

  In the antenna 1000, the magnetic core member 1012 is formed by applying a paint containing a magnetic material to the lower insulating layer 1010b. Thereafter, the upper insulating layer 1010a is bonded to the lower insulating layer 1010b so as to cover the magnetic core member 1012.

  In the RFID antenna, a magnetic flux from the outside passes through the coil axis of the coil and communicates by inducing a voltage. At that time, since the magnetic core, that is, the magnetic core member in Patent Document 1, guides the magnetic flux so as to pass through the coil axis, it is necessary to have a certain thickness or more in order to achieve high antenna sensitivity. However, according to the method of forming the magnetic core member 1012 by applying paint, there is a problem that only a very thin magnetic core member can be formed. In addition, there is a problem that if the thickness is increased, the coating must be repeated.

  Further, the antenna 1000 described in Patent Document 1 also discloses a method using a plate-like magnetic core member 1012. Specifically, an insulating member is pasted around the plate-shaped magnetic core member 1012, and the same cross-sectional shape as the insulating layers 1010a and 1010b is formed by the plate-shaped magnetic core member 1012 and the insulating member. Then, the magnetic core member 1012 is sandwiched between the insulating layers 1010a and 1010b. According to this method, an extra step of attaching the insulating member is required, and it is difficult to easily manufacture the antenna 1000.

Accordingly, an object of the present invention is to realize an antenna module including a magnetic field coupling antenna that is easy to manufacture and has high antenna sensitivity while maintaining impact resistance.

  In order to solve the above problems, the present invention has the following configuration.

An antenna module according to the present invention is an antenna module in which an integrated circuit element incorporating an RFID processing circuit and a magnetically coupled antenna connected to the integrated circuit element are integrated into a resin insulating layer,
The magnetic field coupling antenna includes a coil having a coil axis parallel to an upper surface and a lower surface of the resin insulating layer, and a magnetic core embedded in the resin insulating layer inside the coil. The upper surface conductor provided on the upper surface side of the magnetic core, the lower surface conductor provided on the lower surface side of the magnetic core, and the resin insulating layer provided to connect the upper surface conductor and the lower surface conductor And the end surface of the magnetic field coupling antenna in the coil axis direction faces the end surface of the resin insulation layer, and the integrated circuit element extends in the direction in which the coil axis of the magnetic field coupling antenna extends. The coil is provided in a region between one end and the other end of the coil .

According to the present invention, since the antenna module is formed by integrating an integrated circuit element incorporating an RFID processing circuit and a magnetically coupled antenna connected to the integrated circuit element into a resin insulating layer, it functions as an RFID antenna. Therefore, the necessary elements are integrated and can be packaged in a portable electronic device .

1 is a perspective view showing a structure of a magnetic field coupling antenna according to a first embodiment of the present invention. It is a perspective view which shows the manufacturing method of the magnetic field coupling type antenna which concerns on the 1st Embodiment of this invention. It is a perspective view which shows the manufacturing method of the magnetic field coupling type antenna which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the magnetic field coupling type antenna which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the magnetic field coupling type antenna which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the magnetic field coupling type antenna which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the magnetic field coupling type antenna which concerns on the 1st Embodiment of this invention. It is a perspective view which shows the modification of the magnetic field coupling type antenna which concerns on the 1st Embodiment of this invention. It is a figure which shows the structure of the magnetic coupling type antenna which concerns on the 2nd Embodiment of this invention. It is a perspective view which shows the structure of the magnetic coupling type antenna which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the magnetic coupling type antenna which concerns on the 3rd Embodiment of this invention. It is a perspective view which shows the structure of the magnetic coupling type antenna which concerns on the 4th Embodiment of this invention. It is a perspective view which shows the structure of the magnetic coupling type antenna which concerns on the 5th Embodiment of this invention. It is a schematic diagram which shows the flow of the magnetic flux in the magnetic field coupling type antenna which concerns on the 5th Embodiment of this invention. It is a perspective view which shows the structure of the magnetic coupling type antenna module which concerns on the 6th Embodiment of this invention. It is a perspective view which shows the modification of the magnetic field coupling type antenna module which concerns on the 6th Embodiment of this invention. It is a perspective view which shows the structure of the magnetic coupling type antenna apparatus which concerns on the 7th Embodiment of this invention. It is a perspective view which shows the structure of the magnetic coupling type antenna apparatus which concerns on the 8th Embodiment of this invention. It is sectional drawing which shows the structure of the magnetic coupling type antenna apparatus which concerns on the 8th Embodiment of this invention. It is a perspective view which shows the modification of the magnetic coupling type antenna apparatus which concerns on the 8th Embodiment of this invention. It is sectional drawing which shows the modification of the magnetic coupling type antenna apparatus which concerns on the 8th Embodiment of this invention. It is a perspective view which shows the structure of the magnetic coupling type antenna apparatus which concerns on the 9th Embodiment of this invention. It is a top view which shows the structure of a prior art example. It is sectional drawing which shows the structure of a prior art example.

Among several embodiments described below, the seventh embodiment and the eighth embodiment are included in the present invention.
<< First Embodiment >>
A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a perspective view showing the structure of a magnetic field coupling antenna according to the first embodiment. In the following description, the magnetic field coupling antenna is simply referred to as an antenna.

  The antenna 100 according to the first embodiment includes an insulating layer 110 and a magnetic core 112 embedded in the insulating layer 110 with one surface exposed from the lower surface of the insulating layer 110. The embedding is a state in which the magnetic core 112 is surrounded by the insulating layer 110 by pressurizing the semi-cured insulating layer 110 to the magnetic core 112. As in this embodiment, a state in which a part of the magnetic core 112 is exposed from the insulating layer 110 is also included.

  The insulating layer 110 is made of a thermosetting resin or a mixture of a thermosetting resin and an inorganic filler. As the magnetic core 112, a ferrite plate is suitable and is molded into a rectangular parallelepiped. The thickness of the magnetic core 112 is designed to be an optimum thickness that can realize a desired antenna sensitivity. Further, an upper surface conductor 116 is formed on the upper surface of the insulating layer 110, a lower surface conductor 118 is formed on the lower surface, a side conductor 120 is formed on the side surface, and a via 122 is formed inside. The side conductor 120 and the via 122 constitute a connection conductor that connects the upper conductor 116 and the lower conductor 118. Here, the via refers to a state in which a through hole formed from the upper surface to the lower surface of the insulating layer 110 is filled. More specifically, after filling the conductive paste or forming a plating layer on the inner wall of the through hole, the conductive paste or the non-conductive paste is filled, so that the top conductor 116 and the bottom conductor 118 are connected. It is in an electrically connected state. A coil 114 having a coil axis parallel to the upper surface of the insulating layer 110 is formed around the insulating layer 110 by the upper surface conductor 116, the lower surface conductor 118, the side surface conductor 120 constituting the connection conductor, and the via 122. The end portion of the coil 114 is drawn out to the side surface of the insulating layer 110 so that the connection is easy, and a connection portion 126 is formed.

  Since the magnetic core 112 is embedded in the insulating layer 110, even if an impact is applied to the antenna 100 by dropping or the like, the magnetic core 112 is not easily damaged because the magnetic core 112 is not directly impacted. In the present embodiment, one surface of the magnetic core 112 is exposed from the lower surface of the insulating layer 110, but since three surfaces are covered with the insulating layer 110, an effect of improving impact resistance can be obtained. Needless to say, when all the surfaces of the magnetic core 112 are surrounded by the insulating layer 110, the effect of improving the impact resistance is further enhanced.

  The embedding of the magnetic core 112 in the insulating layer 110 is not affected by the thickness of the magnetic core 112. That is, even when the thick magnetic core 112 is used, the magnetic core 112 is embedded in the insulating layer 110 by a single step of pressing the semi-cured insulating layer 110 onto the magnetic core 112. Can do. Therefore, the antenna sensitivity can be easily improved by selecting the thickness of the magnetic core according to the desired antenna sensitivity.

  The antenna 100 is a magnetic field coupling antenna in which a voltage is induced in the coil 114 when magnetic flux passes through the coil axis of the coil 114. Magnetic flux enters the magnetic core 112 from one of the side surfaces of the insulating layer 110 located in the coil axis direction and is radiated from the other. When the flow of the magnetic flux is obstructed, the magnetic flux passing through the coil axis of the coil 114 is reduced, and the antenna sensitivity of the antenna 100 is lowered. Therefore, it is preferable that the thing which inhibits the flow of magnetic flux is not arrange | positioned at the both sides | surfaces located in the coil axial direction of the magnetic body core 112. FIG.

  Hereinafter, a method for manufacturing the antenna 100 will be described with reference to FIGS. 2A to 2F are perspective views showing each manufacturing process of the antenna 100. FIG.

  FIG. 2-A shows a lower surface conductor forming step. The lower conductor 118 is formed on a support plate or substrate 130. The lower conductor 118 can be formed by a known method such as forming a plating layer on the support plate or substrate 130 by electrolytic plating and etching the plating layer. Hereinafter, a case where a transfer plate made of SUS is used as the support plate will be described.

  FIG. 2-B shows a magnetic core mounting process. The magnetic core 112 is mounted on the support plate 130 so as to overlap the lower conductor 118. The magnetic core 112 is fixed on the support plate 130 with an adhesive sheet or an adhesive.

  FIG. 2C shows an insulating layer forming process and shows a cross section perpendicular to the upper surface of the insulating layer 110. An insulating layer 110 in which a copper foil 150 is pasted on the upper surface is prepared. The insulating layer 110 is made of a thermosetting resin or a mixture of a thermosetting resin and an inorganic filler, and is in a semi-cured state (prepreg). The insulating layer 110 is pressed and heated from the magnetic core 112 side to the component obtained by the magnetic core mounting step. As a result, the magnetic core 112 is embedded in the insulating layer 110. Since the lower surface of the magnetic core 112 is in contact with the support plate 130, the lower surface of the magnetic core 112 is not covered with the insulating layer 110. Thereafter, the insulating layer 110 is cured by further heating.

  FIG. 2D shows a via formation step and shows a cross section perpendicular to the upper surface of the insulating layer 110. First, the copper foil 150 on the upper surface of the insulating layer 110 is etched to form openings at locations where vias are to be formed. Then, a laser is irradiated from the upper surface direction of the insulating layer 110 so as to pass through the opening, thereby forming a through hole having the lower surface conductor 118 as a bottom surface. After that, a plating layer 140 is formed on the inner wall of the through hole by electroless plating and electrolytic plating, and then the non-conductive paste 142 is filled. The via 122 formed by this process forms part of the connection conductor.

  FIG. 2E shows the upper surface conductor forming step and shows a cross section perpendicular to the upper surface of the insulating layer 110. A plated layer 152 is formed by electrolytic plating on a copper foil 150 that has been affixed to the insulating layer 110 in advance. By etching the plating layer 152 and the copper foil 150 simultaneously, the upper surface conductor 116 can be formed. The upper surface conductor 116 is formed at a location overlapping the via 122 and overlapping the magnetic core 112 when viewed from the upper surface direction of the insulating layer 110.

  FIG. 2-F shows a side conductor forming process. The side conductor 120 is formed on the side surface of the insulating layer 110 by pattern printing. The side conductor 120 is electrically connected to the upper conductor 116 and the lower conductor 118. The side conductor 120 formed by this process forms part of the connection conductor.

  Through the above steps, the upper conductor 116 and the lower conductor 118 are electrically connected by the side conductor 120 and the via 122, and the coil 114 is formed around the insulating layer 110. Finally, the support plate 130 is peeled from the lower conductor 118 and the insulating layer 110, and the antenna 100 is formed.

  In the present embodiment, the connection conductor is formed by the side conductor 120 formed on the side surface of the insulating layer 110 and the via 122 formed inside the insulating layer 110. However, the present invention is not limited to this. First, it is possible to use a through hole instead of the via 122. Here, the through hole refers to a state in which a through hole formed from the upper surface to the lower surface of the insulating layer 110 is not filled. By forming a plating layer on the inner wall of the through hole, the upper conductor 116 and the lower conductor 118 are electrically connected. It is also possible to form the connection conductor only by the side conductor, or only by the via or the through hole.

  In this embodiment, a three-turn coil 114 is formed as shown in FIG. However, the present invention is not limited to this. By increasing the number of the upper conductors 116, the lower conductors 118, the side conductors 120, and the vias 122, a coil having a large number of turns can be easily formed. As a result, a coil having a high inductance value can be realized.

  In this embodiment, the magnetic core 112 is a rectangular parallelepiped. However, it is preferable that the corners of the rectangular parallelepiped are chamfered and rounded. When heat is further applied to the insulating layer 110 after the insulating layer 110 after embedding the magnetic core 112 is cured, the moisture contained in the insulating layer 110 is vaporized, and the volume of the moisture is increased. Stress is generated in 110. This is because this stress tends to concentrate on the corners of the magnetic core 112 embedded in the insulating layer 110, and cracks may occur from the corners as the base point. By chamfering the corners to keep them round, stress can be dispersed and cracks can be prevented.

  It is also effective to provide a donut shape by providing a cavity penetrating from the upper surface to the lower surface of the magnetic core 112 at the center of the magnetic core 112. By making the magnetic core 112 into a donut shape, when the insulating layer 110 is pressed against the magnetic core 112, the resin constituting the insulating layer 110 also flows into the cavity provided in the center of the magnetic core 112. As a result, the area where the magnetic core 112 and the insulating layer 110 are in contact with each other increases, so that the bonding strength between the magnetic core 112 and the insulating layer 110 is improved. Therefore, a stronger antenna 100 can be formed. However, it is preferable that the cavity has a size that does not hinder the flow of magnetic flux passing through the inside of the magnetic core 112.

(Modification)
A modification of the antenna 100 according to the first embodiment will be described below with reference to FIG. FIG. 3 is a perspective view showing a modification of the antenna according to the first embodiment.

  In FIG. 3, the magnetic core 112 is embedded in the insulating layer 110. A pattern 160 is formed on one side surface of the magnetic core 112. In addition, a via 123 is formed in the insulating layer 110 from the upper surface of the insulating layer 110 to the upper surface of the magnetic core 112. The via 123 and the pattern 160 are formed at positions overlapping each other when viewed from the upper surface of the insulating layer 110, and these are electrically connected. The connection conductor includes a connection conductor 120 a formed on the side surface of the insulating layer 110, a via 123, and a pattern 160.

  A magnetic core 112 having a pattern 160 formed on its side surface is embedded in the insulating layer 110 in advance. After embedding the magnetic core 112 in the insulating layer 110, the insulating layer 110 is cured and the via 123 is formed. Since the via 123 is formed from the upper surface of the insulating layer 110 to the upper surface of the magnetic core 112, the depth of the via 123 in FIG. 3 is shallower than the depth of the via 122 in FIG.

  When the bottomed hole is formed by a laser or the like and the plating layer is formed on the inner wall of the bottomed hole, the aspect ratio, which is the ratio of the depth to the diameter of the bottomed hole, must be considered. In FIG. 1, since the via 120b is formed with the lower surface conductor 118 as the bottom surface, it is necessary to set the diameter and depth of the bottomed hole in consideration of the aspect ratio. In general, when the aspect ratio is 2 or more, it is difficult to form a plating layer up to the bottom surface of the bottomed hole. Therefore, when the depth of the bottomed hole is deep, it is necessary to increase the diameter of the bottomed hole in order to form the plating layer up to the bottom surface of the bottomed hole.

  As described above, in this modified example, since the shallow depth of the via 123 may be formed, the diameter of the bottomed hole may be small. Therefore, the vias 123 can be formed with higher density. Since the pattern 160 formed on the side surface of the magnetic core 112, the upper surface conductor 116, the lower surface conductor 118, and the side surface conductor 120 formed on the side surface of the insulating layer 110 can be formed with high density, the number of vias 123 formed is reduced. By increasing the number, the number of turns of the coil 114 can be increased.

<< Second Embodiment >>
A second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a perspective view showing the structure of a magnetic field coupling antenna according to the second embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the following description, the magnetically coupled antenna is simply referred to as an antenna.

  In FIG. 4, the antenna 200 is formed by embedding two magnetic cores 212 a and 212 b in an insulating layer 110. Each of the magnetic cores 212a and 212b is obtained by dividing the magnetic core used in the first embodiment into two equal parts, and the total volume of the two magnetic cores 212a and 212b is equal to that of the first embodiment. It is. The direction in which the magnetic cores 212a and 212b are arranged is a direction orthogonal to the coil axis of the coil 114, and the magnetic flux passing through the coil axis of the coil 114 passes through one of the magnetic cores 212a and 212b. Therefore, the gap between the magnetic cores 212a and 212b does not hinder the flow of magnetic flux passing through the coil axis of the antenna 200.

  By using the magnetic core used in the first embodiment in two equal parts, the size of each magnetic core can be reduced while maintaining the antenna sensitivity. When stress such as bending is applied to the antenna 200, stress is also applied to the magnetic cores 212 a and 212 b through the insulating layer 110. By reducing the size of the individual magnetic cores 212a and 212b, even if stress is applied to the magnetic cores 212a and 212b, breakage such as cracks is less likely to occur.

  Both the magnetic cores 212a and 212b are fixed on the support plate, and the semi-cured (prepreg) insulating layer 110 can be pressed and heated to be embedded in the insulating layer 110 at the same time. Therefore, it is very easy to manufacture the antenna 200 in which two magnetic cores 212a and 212b are embedded.

  In the present embodiment, the magnetic cores 212a and 212b are provided so that the direction in which the magnetic cores 212a and 212b are arranged is orthogonal to the coil axis of the coil 114, but the present invention is not limited to this embodiment. It is also possible to arrange the magnetic cores 212a and 212b along the coil axis of the coil 114. It is also possible to embed three or more magnetic cores.

<< Third Embodiment >>
A third embodiment of the present invention will be described with reference to FIGS. 5-A and 5-B. FIG. 5 shows the structure of the magnetic field coupling antenna according to the third embodiment, FIG. 5-A is a perspective view, and FIG. 5-B is a cross-sectional view taken along the line AA in FIG. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the following description, the magnetic field coupling antenna is simply referred to as an antenna.

  5A and 5B, three rectangular parallelepiped magnetic cores 312a, 312b, and 312c are embedded in the insulating layer 110. FIG. The three magnetic cores 312a, 312b, 312c are arranged along the coil axis direction of the coil 114. FIG. 5-B shows a cross section perpendicular to the top surface of the insulating layer 110 and along the coil axis of the coil 114. In this cross section, of the three magnetic cores 312a, 312b, 312c, the height of the two magnetic cores 312a, 312c located at both ends in the coil axis direction is higher than the height of the magnetic core 312b located in the center. high. That is, the area of the surfaces of the three magnetic cores 312a, 312b, 312c located at both ends in the coil axis direction is larger than the area of an arbitrary cross section orthogonal to the coil axis of the magnetic cores 312a, 312b, 312c. Magnetic flux from the outside of the antenna 300 enters one of the two magnetic cores 312a and 312c located at both ends in the coil axis direction. Since these magnetic cores 312a and 312c have a large area on the surface of the coil 114 positioned in the coil axis direction, a large entrance of the magnetic flux is secured, and the magnetic flux is more likely to enter. Further, magnetic flux is radiated from a magnetic core different from the magnetic core into which the magnetic flux has entered among the magnetic cores 312a and 312c. Since the area of the surface located in the coil axis direction is also large here, a large exit of the magnetic flux is secured, and the magnetic flux is more easily radiated to the outside. As described above, the structure in which the magnetic flux easily enters and radiates increases the amount of magnetic flux passing through the coil axis of the coil 114, and the sensitivity of the antenna 300 is improved.

  All the three magnetic cores 312a, 312b, 312c are fixed on the support plate, and the semi-cured (prepreg) insulating layer 110 is pressed to be embedded in the insulating layer 110 at the same time. By such a manufacturing method, it is possible to form a structure in which magnetic flux easily enters and radiates without forming the magnetic core into a special shape.

  In this embodiment, magnetic cores having a large area are arranged at both ends in the coil axis direction, but the present invention is not limited to this embodiment. A certain effect can be obtained even when it is arranged only at one end. In addition, even if the magnetic core is molded so that the area of the surfaces located at both ends in the coil axis direction is larger than the area of an arbitrary cross section perpendicular to the coil axis of the magnetic core, the magnetic flux enters. This makes it easy to radiate and improves the antenna sensitivity. However, in this case, it is necessary to mold the magnetic core into a special shape.

<< Fourth Embodiment >>
A fourth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a perspective view showing the structure of a magnetic field coupling antenna according to the fourth embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the following description, the magnetic field coupling antenna is simply referred to as an antenna.

  In FIG. 6, the magnetic core 412 b is embedded in the insulating layer 110. Further magnetic cores 412a and 412c are provided on the side surface of the insulating layer 110 located in the coil axial direction of the coil 114. The magnetic cores 412a and 412c can be provided on the side surface of the insulating layer 110 by pressing the insulating core 110 in a semi-cured state and curing the insulating layer 110 in the pressed state. Each of the magnetic cores 412a and 412c is formed so as to cover the entire side surface of the insulating layer 110.

  Since the magnetic cores 412a and 412c positioned at the end of the coil 114 in the coil axial direction are formed so as to cover the entire side surface of the insulating layer 110, the antenna 400 is viewed from the entire side surface of the coil 114 positioned in the coil axis direction. Magnetic flux can enter. Similarly, magnetic flux can be emitted from the entire side surface. Therefore, as compared with the third embodiment, the amount of magnetic flux passing through the coil axis of the coil 114 is increased, and the antenna sensitivity is improved. Since the magnetic cores 412a and 412c are not covered by the insulating layer 110, they may be damaged. However, since the magnetic core 412b located in the center is covered with the insulating layer, the magnetic cores 412a and 412c are damaged. Even so, a certain antenna sensitivity can be realized.

  In the present embodiment, the magnetic cores 412a and 412c are provided on the side surfaces of the insulating layer 110 by pressure bonding to the semi-cured insulating layer 110. However, the magnetic cores 412a and 412c are provided on the side surfaces of the cured insulating layer 110. Bonding with an adhesive is also possible.

<< Fifth Embodiment >>
A fifth embodiment of the present invention will be described with reference to FIGS. FIG. 7 is a perspective view showing the structure of a magnetically coupled antenna according to the fifth embodiment. FIG. 8 is a schematic diagram for explaining the course of magnetic flux in the fifth embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the following description, the magnetic field coupling antenna is simply referred to as an antenna.

  In FIG. 7, two magnetic cores 512 a and 512 b are embedded in the insulating layer 110. The coil 514 is divided and wound into a first coil portion 515a and a second coil portion 515b, and no coil is formed between the first coil portion 515a and the second coil portion 515b. Part 570. The first coil portion 515a is formed around the magnetic core 512a, and the second coil portion 515b is formed around the magnetic core 512b.

  In addition, the coil portions 515a, 515a, 515b, and the coil portions 515a, 515b are configured so that no voltage is induced by the magnetic flux in the same direction passing through the coil axes of the coil portions 515a, 515b. The winding direction of 515b and the connection method of both coil parts 515a and 515b are set. More specifically, in FIG. 7, the first coil portion 515a and the second coil portion 515b have the same number of turns, and the winding directions are reversed when viewed from the same direction. Further, when viewed from the same direction, the end of the first coil portion 515a and the start end of the second coil portion 515b are connected to each other. When the first coil portion 515a and the second coil portion 515b are formed in this way, when the magnetic flux in the same direction passes through the coil axes of the first coil portion 515a and the second coil portion 515b, A reverse voltage is induced in the coil portion 515a and the second coil portion 515b. However, since the first coil portion 515a and the second coil portion 515b are connected to each other, the voltages in the opposite directions are canceled from each other, and no voltage is induced in the coil 514.

  The operation of the antenna 500 will be described below with reference to FIG. FIG. 8 is a schematic diagram showing the path of the magnetic flux in the BB cross section of FIG. As shown in FIG. 8, the magnetic flux φ coming from the upper surface direction of the antenna 500 enters the non-winding portion 570 provided between the two magnetic cores 512a and 512b. Thereafter, the magnetic flux is divided into two directions and is guided to the two magnetic cores 512a and 512b embedded in the insulating layer 110. In this way, magnetic fluxes in the opposite directions pass through the first coil portion 515a and the second coil portion 515b. As described above, the winding direction of the first coil portion 515a and the second coil portion 515b is opposite to each other. Therefore, the first coil portion 515a and the second coil portion 515b are induced by the magnetic fluxes in the opposite directions. The applied voltages are in the same direction. Therefore, the coil 514 generates a voltage obtained by adding the voltages induced in the first coil portion 515a and the second coil portion 515b.

  In portable electronic devices that are required to be thin, the antenna 500 is installed so that the upper surface of the antenna 500 and the main surface of the portable electronic device are parallel to each other. Also, it is usually used in a form in which the main surface of the portable electronic device faces the direction of arrival of magnetic flux. That is, the upper surface of the antenna 500 faces the direction of arrival of the magnetic flux. Since the antenna 500 according to the fifth embodiment has a structure for capturing the magnetic flux on the upper surface, the structure for capturing the magnetic flux most efficiently in such a usage pattern. Therefore, the antenna 500 contributes to a portable electronic device having both a thin thickness and high antenna sensitivity.

<< Sixth Embodiment >>
A sixth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a perspective view showing the structure of a magnetically coupled antenna module according to the sixth embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the following description, the magnetically coupled antenna module is simply referred to as an antenna module.

  In FIG. 9, the antenna module 601 is formed by burying a magnetic core 112 and a capacitor 680 in an insulating layer 110. The capacitor 680 is located between the side surface of the insulating layer 110 and the via 122 when viewed from the outside of the coil 114, that is, from the upper surface direction of the insulating layer 110. The capacitor 680 forms a resonance circuit together with the coil 114. A particularly large voltage can be induced when the resonance frequency of the resonance circuit matches the frequency of the magnetic flux captured by the antenna module 601.

  In this embodiment, the antenna module 601 is formed by integrating the capacitor 680 and the coil 114 constituting the resonance circuit. Therefore, the resonance frequency does not fluctuate after the antenna module 601 is manufactured, and high antenna sensitivity can be realized stably.

  Capacitor 680 and magnetic core 112 are embedded in a semi-cured resin (prepreg) in the same process. Therefore, the capacitor 680 can be easily embedded without having an extra step.

  Capacitor 680 is embedded in insulating layer 110 as an element. Therefore, by embedding capacitors having different characteristics, the antenna module 601 can be easily formed without changing the shapes and locations of the upper surface conductor 116, the lower surface conductor 118, the side surface conductor 120, and the via 122 formed in the insulating layer 110. It is possible to change the characteristics. Further, by selecting a capacitor having a large capacity such as a multilayer capacitor as the capacitor 680, the characteristics of the antenna module 601 can be changed greatly.

(Modification)
FIG. 10 shows a modification of the present embodiment. In FIG. 10, the capacitor 680 is located inside the coil 114, that is, between the magnetic core 112 and the via 122 when viewed from the upper surface direction of the insulating layer 110. Also in this modified example, since the capacitor 680 and the magnetic core 112 are simultaneously embedded in the insulating layer 110 in the same process, it can be easily manufactured.

  In a variation, the capacitor 680 is surrounded by the top conductor 116, the bottom conductor 118, and the via 122. The upper surface conductor 116, the lower surface conductor 118, and the via 122 not only form the coil 114, but also function as a shield for the capacitor 680, so that the capacitor 680 can be less affected by an external electromagnetic field. Therefore, in the antenna module 602, fluctuations in the resonance frequency of the resonance circuit including the coil 114 and the capacitor 680 are further suppressed, and the antenna sensitivity of the antenna module 602 is further stabilized.

  In the present embodiment, the capacitor 680 is embedded in the insulating layer 110. However, the embedded electronic component may be a component other than the capacitor. A plurality of capacitors 680 embedded in the insulating layer 110 may be provided.

<< Seventh Embodiment >>
A seventh embodiment of the present invention will be described with reference to FIG. FIG. 11 is a perspective view showing the structure of a magnetic field coupling antenna device according to the seventh embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the following description, the magnetic field coupling antenna device is simply referred to as an antenna device.

  In FIG. 11, the antenna device 703 includes a magnetic core 112, a capacitor 780, and an integrated circuit element 782 embedded in an insulating layer 110. The integrated circuit element 782 includes an RFID processing circuit.

  By embedding the integrated circuit element 782 in the insulating layer 110, all elements necessary for the antenna 700 including the magnetic core 112 and the coil 114 to function as an RFID antenna are integrated. Therefore, it can be collectively mounted on a portable electronic device.

  Further, the magnetic core 112, the coil 114, and the integrated circuit element 782 can be simultaneously embedded in the insulating layer 110 in the same process. Therefore, the antenna device 703 is very easy to manufacture.

<< Eighth Embodiment >>
An eighth embodiment of the present invention will be described with reference to FIGS. 12-A and 12-B. 12A and FIG. 12B are views showing the structure of the magnetic field coupling antenna device according to the eighth embodiment, FIG. 12A is a perspective view, and FIG. 12B is the view of FIG. It is sectional drawing in CC cross section. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the following description, the magnetic field coupling antenna device is simply referred to as an antenna device.

  12A and 12B, an antenna device 803 is formed by embedding a magnetic core 112, a capacitor 880, and an integrated circuit element 882 in an insulating layer 110. The integrated circuit element 882 includes an RFID processing circuit. A lower insulating layer 811 is further provided on the lower surface of the insulating layer 110, and a lower electrode layer 890 is formed on the lower surface of the lower insulating layer 811.

  The lower surface of the antenna device 803 is mounted on the parent substrate of the portable electronic device. In the present embodiment, a lower electrode layer 890 is formed on the lower surface of the antenna device 803. Therefore, the electromagnetic field of the circuit formed on the parent substrate is shielded by the lower electrode layer 890, and the antenna device 803 is not affected by the circuit of the parent substrate. Accordingly, fluctuations in the inductance value of the coil 114 constituting the antenna device 803 and the resonance frequency of the resonance circuit constituted by the capacitor 880 and the coil 114 can be suppressed.

(Modification)
FIG. 13-A and FIG. 13-B show a modification of the present embodiment. 13A and 13B are views showing a modification of the eighth embodiment, FIG. 13A is a perspective view, and FIG. 13B is a cross-sectional view taken along the DD line of FIG. 13A. is there.

  13A and 13B, in addition to the antenna device 800 shown in FIGS. 12A and 12B, the upper surface electrode layer is formed on the upper surface of the insulating layer 110 where the upper surface conductor 116 is not formed. 892 is formed. The upper electrode layer 892 is connected to the lower electrode layer 890 through a via 894. The upper electrode layer 892 shields not only the lower surface of the antenna device 800 but also the upper surface from the influence of an external electromagnetic field, and the characteristics of the antenna device 800 are further stabilized. Note that the upper electrode layer 892 is not limited to the lower electrode layer 890 and may be connected to an electrode serving as a ground.

  In the present embodiment, the lower insulating layer 811 and the lower electrode layer 890 are formed on the lower surface of the antenna device 803 in which the magnetic core 112, the capacitor 880, and the integrated circuit element 882 are embedded in the insulating layer 110. However, the lower insulating layer 811 and the lower electrode layer 890 can also be formed on the lower surface of the antenna module in which only the magnetic core and the capacitor are embedded in the insulating layer 110. Also in this case, the antenna module is not affected by the electromagnetic field of the circuit formed on the parent substrate, and fluctuations in the inductance value of the coil and the resonance frequency of the resonance circuit composed of the capacitor and the coil can be suppressed.

<< Ninth embodiment >>
A ninth embodiment of the present invention will be described with reference to FIG. FIG. 14 is a perspective view showing the structure of a magnetic field coupling antenna device according to the ninth embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the following description, the magnetic field coupling antenna device is simply referred to as an antenna device.

  In FIG. 14, an antenna device 903 is formed by embedding two magnetic cores 912a and 912b, a capacitor 980, and an integrated circuit element 982 in an insulating layer 110. The integrated circuit element 982 includes an RFID processing circuit.

  The coil 914 is wound by being divided into a first coil portion 915a and a second coil portion 915b. Each of the first coil portion 915a and the second coil portion 915b has a coil axis parallel to the upper surface of the insulating layer 110. Between the 1st coil part 915a and the 2nd coil part 915b, it is the non-winding part 970 in which a coil is not formed. The first coil portion 915a is formed around the magnetic core 912a, and the second coil portion 915b is formed around the magnetic core 912b. The first coil portion 915a and the second coil portion 915b are connected so that no voltage is induced by magnetic flux in the same direction passing through the coil axis of each of the coil portions 915a and 915b.

  The capacitor 980 and the integrated circuit element 982 are respectively installed between the first coil part 915a and the second coil part 915b, that is, between the two magnetic cores 912a and 912b. The entire antenna device 903 can be reduced in size by overlapping the non-winding portion 970 for capturing the magnetic flux on the upper surface of the insulating layer 110 and causing the coil 914 to function, and the installation region of the capacitor 980 and the integrated circuit element 982. . In this embodiment, even if the capacitor 980 and the integrated circuit element 982 exist in the non-winding portion 970, the entry of magnetic flux is not hindered by the capacitor 980 and the integrated circuit element 982.

  In the present embodiment, two magnetic cores 912 a and 912 b are embedded in the insulating layer 110. However, it is possible to embed one magnetic core.

  Further, in the present embodiment, in the antenna device in which the magnetic cores 912a and 912b, the capacitor 980, and the integrated circuit element 982 are embedded in the insulating layer 110, the first coil portion 915a and the second coil portion 915b are interposed. A non-winding portion 970 was formed. However, the non-winding portion 970 can be formed in an antenna module in which only the magnetic core and the capacitor are embedded in the insulating layer 110. Also in this case, the antenna module can be reduced in size by overlapping the non-winding portion and the capacitor installation region.

100, 200, 300, 400, 500 ... magnetic field coupling antenna 110 ... insulating layer 112 ... magnetic core 114 ... coil 116 ... upper surface conductor 118 ... lower surface conductor 120 ... side conductor 120a ... connection conductor 120b, 122, 123 ... via 126 ... Connector 130 ... Support plate (substrate)
140 ... plating layer 142 ... non-conductive paste 150 ... copper foil 152 ... plating layer 160 ... patterns 212a, 212b ... magnetic cores 312a, 312b, 312c ... magnetic cores 412a, 412b, 412c ... magnetic cores 512a, 512b ... Magnetic core 514 ... Coil 515a ... First coil part 515b ... Second coil part 570 ... Unwinding part 601, 602 ... Magnetic field coupling type antenna module 680 ... Capacitor 700 ... Antennas 703, 803, 903 ... Magnetic field coupling type Antenna device 780 ... Capacitor 782 ... Integrated circuit element 800 ... Antenna device 811 ... Lower insulating layer 880 ... Capacitor 882 ... Integrated circuit element 890 ... Lower electrode layer 892 ... Upper electrode layer 894 ... Vias 912a, 912b ... Magnetic core 914 ... Coil 915a ... 1st coil part 915b ... Second coil portion 970 ... non-winding portion 980 ... capacitor 982 ... integrated circuit device 1000 ... antenna 1010a, 1010b ... insulating layer 1012 ... magnetic core member 1014 ... coil 1016 ... top conductors 1018 ... lower surface conductors 1020 ... connection conductor

Claims (5)

  1. An antenna module formed by integrating an integrated circuit element incorporating an RFID processing circuit and a magnetically coupled antenna connected to the integrated circuit element into a resin insulating layer,
    The magnetic field coupling antenna includes a coil having a coil axis parallel to the upper surface and the lower surface of the resin insulation layer, and a magnetic core embedded in the resin insulation layer inside the coil,
    The coil is provided on an upper surface conductor provided on an upper surface side of the magnetic core, a lower surface conductor provided on a lower surface side of the magnetic core, and provided on the resin insulating layer, and the upper surface conductor and the lower surface conductor The end surface in the coil axis direction of the magnetic field coupling antenna is opposed to the end surface of the resin insulation layer .
    The antenna module , wherein the integrated circuit element is provided in a region between one end and the other end of the coil in a direction in which a coil axis of the magnetic field coupling antenna extends .
  2.   The antenna module according to claim 1, wherein a capacitor constituting a resonance circuit together with the coil is embedded in the resin insulating layer.
  3.   The antenna module according to claim 1, wherein the magnetic core is a plurality of magnetic cores.
  4.   The antenna module according to claim 3, wherein the plurality of magnetic cores are arranged in a direction orthogonal to the coil axis.
  5.   The antenna module according to claim 1, wherein the magnetic core is a ferrite plate.
JP2012286485A 2007-04-13 2012-12-28 Antenna module Active JP5573937B2 (en)

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GB2461443A (en) 2010-01-06
WO2008133018A1 (en) 2008-11-06
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GB2485318A (en) 2012-05-09
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GB2485318B (en) 2012-10-10
JPWO2008133018A1 (en) 2010-07-22

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