JP2015144160A - Antenna apparatus, antenna unit for non-contact power transmission, and electronic apparatus - Google Patents

Antenna apparatus, antenna unit for non-contact power transmission, and electronic apparatus Download PDF

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Publication number
JP2015144160A
JP2015144160A JP2014016435A JP2014016435A JP2015144160A JP 2015144160 A JP2015144160 A JP 2015144160A JP 2014016435 A JP2014016435 A JP 2014016435A JP 2014016435 A JP2014016435 A JP 2014016435A JP 2015144160 A JP2015144160 A JP 2015144160A
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Japan
Prior art keywords
antenna device
spiral coil
circuit board
magnetic
magnetic layer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2014016435A
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Japanese (ja)
Inventor
久村 達雄
Tatsuo Hisamura
達雄 久村
佑介 久保
Yusuke Kubo
佑介 久保
弘幸 良尊
Hiroyuki Yoshitaka
弘幸 良尊
Original Assignee
デクセリアルズ株式会社
Dexerials Corp
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Application filed by デクセリアルズ株式会社, Dexerials Corp filed Critical デクセリアルズ株式会社
Priority to JP2014016435A priority Critical patent/JP2015144160A/en
Publication of JP2015144160A publication Critical patent/JP2015144160A/en
Application status is Abandoned legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/40Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H02J50/12Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/70Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields

Abstract

PROBLEM TO BE SOLVED: To provide a thin antenna apparatus having a plurality of antennas, in which a thin formation is required.SOLUTION: An antenna apparatus includes a spiral coil, a magnetic layer for supporting the spiral coil, and a circuit board having a plurality of conductor patterns formed thereon. In a part of the magnetic layer, there is provided a recess or a through hole for accommodating a lead-out part of the spiral coil from the inner periphery. At least a part of the circuit board is included in the magnet layer. Further, there are formed, on the circuit board, a terminal part for connecting the spiral coil to the conductor pattern, and a connection terminal part for connecting the conductor pattern to an external circuit board.

Description

  The present invention relates to an antenna device and the like, and more particularly to, for example, a non-contact power supply spiral coil and one or more spiral coils for communication, a magnetic layer that supports these spiral coils, and an antenna device having a circuit board. A non-contact power supply spiral is provided in a part of the magnetic layer by providing a notch for a lead wire drawn from the inner peripheral side of the spiral coil for non-contact power supply and a notch for storing a part of the circuit board. The present invention relates to an antenna device in which a leader line from the inner peripheral side of a coil passes through a notch and is connected to a terminal formed on a circuit board, a non-contact power transmission antenna unit including the antenna device, and an electronic apparatus.

  In recent wireless communication devices, a plurality of RF antennas such as a telephone communication antenna, a GPS antenna, a wireless LAN / BLUETOOTH (registered trademark) antenna, and an RFID (Radio Frequency Identification) are mounted. In addition to these, with the introduction of non-contact charging, antenna coils for power transmission have also been mounted. Examples of the power transmission method used in the non-contact charging method include an electromagnetic induction method, a radio wave reception method, and a magnetic resonance method. These all use electromagnetic induction and magnetic resonance between the primary side coil and the secondary side coil, and the above-described RFID also uses electromagnetic induction.

  Even if these antennas are designed so that the maximum characteristics can be obtained at a target frequency with a single antenna, it is difficult to obtain the target characteristics when actually mounted on an electronic device. This is because the magnetic field component around the antenna interferes (couples) with the surrounding metal and the like, and the inductance of the antenna coil is substantially reduced, so that the resonance frequency is shifted. In addition, the reception sensitivity is lowered due to a substantial decrease in inductance. As countermeasures against these problems, by inserting a magnetic shield material between the antenna coil and the metal existing around it, the magnetic flux generated from the antenna coil is collected on the magnetic shield material, thereby reducing the interference caused by the metal. it can. Further, by arranging such a magnetic shield material in the vicinity of the antenna coil, it is possible to increase the coupling coefficient representing the inductance of the antenna coil and the good magnetic coupling between the antennas during communication.

JP 2013-21902 A Japanese Patent No. 4572953 Japanese Patent No. 5077476 JP 2010-50345 A

  However, with the trend of downsizing and high functionality of electronic devices, when trying to attach a plurality of antennas as described above to electronic devices such as portable terminal devices, the space allocated to mount the antenna is extremely small, It is required to design each antenna small. Further, in some cases, it is required to provide a connection terminal for connection to the external circuit in the antenna portion because of a connection method with the external circuit.

  Here, in Patent Document 1, an antenna device (in the same document, “non-contact”) is configured such that a non-contact power supply coil and a non-contact communication coil as shown in FIG. "Contact transmission device"). In this example, the non-contact communication coil 120 is made of a flexible substrate, and a connection terminal is provided at an end of the substrate. However, since the non-contact communication coil 120 and the non-contact power supply coil 130 are mounted on the magnetic body 110 and there is no space for housing the lead-out portion from the inner periphery of the coil, The thickness cannot be reduced sufficiently.

  In Patent Document 2, as shown in FIG. 6, a space is provided in a part of a circuit board 220 having a connection terminal with the outside, a coil 210 is embedded therein, and a magnetic body 240 is attached via a spacer 230. An antenna device (described as “coil unit” in the same document) is disclosed. However, in this example as well, although the coil 210 is housed in the circuit board 220, the thickness of the antenna device cannot be made sufficiently thin because an extra spacer is interposed.

  Further, Patent Document 3 discloses a non-contact charging module that pulls out a lead wire at an inner peripheral end of a non-contact charging coil to the outside of the coil through a slit provided in a magnetic shield material and a portable terminal including the same. Yes. However, what is provided in the shield material is a “slit” that is completely open, and there is no disclosure of a terminal portion that is used to connect the lead-out line drawn through the slit to an external circuit.

  Patent Document 4 discloses a coil element in which a flat air-core coil is disposed on one surface of a printed wiring board, and a sheet-like electromagnetic shielding member is disposed on the other surface. The substrate is formed with a recess for accommodating the lead wire portion from the inner peripheral end of the coil. However, the concave portion is formed on the printed wiring board, and the electromagnetic wave shielding member is provided separately from the board, so that the thickness is increased by the amount of the board.

  Therefore, an object of the present invention is to reduce the thickness of an antenna device in an antenna device that has a plurality of antennas and is required to be thin.

  In order to solve the above-described problem, an antenna device according to one embodiment of the present invention includes a spiral coil, a magnetic layer that supports the spiral coil, and a circuit board on which a plurality of conductor patterns are formed. A recess or a through hole is provided in a part of the magnetic layer for accommodating a lead-out portion from the inner periphery of the spiral coil, and the magnetic layer includes at least a part of the circuit board. Are characterized in that a terminal portion for connecting the spiral coil to the conductor pattern and a connection terminal portion for connecting the conductor pattern to an external circuit board are formed.

  Therefore, according to the antenna device, the non-contact power transmission antenna unit including the antenna device, and the electronic apparatus according to the present invention, the magnetic layer supporting the plurality of spiral coils, the lead-out portion from the inner peripheral side of the spiral coil, and the circuit By housing a part of the substrate, the antenna device itself can be thinned.

(A) is a top view which shows the antenna device which concerns on 1st Embodiment to which this invention was applied, (b) is a perspective view of (a). It is explanatory drawing which shows the manufacturing method of the antenna device which concerns on 1st Embodiment to which this invention was applied. (A) is a top view which shows the antenna device which concerns on 2nd Embodiment to which this invention was applied, (b) is a perspective view of (a). (A) is a top view which shows the antenna apparatus which concerns on 3rd Embodiment to which this invention was applied, (b) is a perspective view of (a). It is a top view which shows the antenna device which is embodiment of a prior art invention. It is the perspective view which decomposed | disassembled and shown the antenna apparatus which is embodiment of conventional invention.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention.

(First embodiment)

  <Configuration of antenna device>

  FIG. 1A and FIG. 1B show an antenna device according to the first embodiment of the present invention. Here, in order to make the structure easy to understand, FIG. 1A shows the adhesive layer 4 and the magnetic layer 5 in a transparent state. As shown in FIGS. 1A and 1B, the coil module 20 includes spiral coils 2 and 12 formed by winding a conducting wire in a spiral shape, magnetic layers 5 and 15, and an adhesive layer 4. The circuit board 7 is provided.

  In FIG. 1, the spiral coils 2 and 12 are drawn as large one-turn coils for simplification. In this example, the spiral coil 2 is used for non-contact power feeding, and the spiral coil 12 is used for non-contact communication.

  The magnetic layer 5 has notches 9a, 9b, 19, 29 formed therein. The notch 9 a is a part that houses the lead-out part 3 b from the inner periphery of the spiral coil 2. The notch 9 b is a part that houses the lead-out part 3 a from the outer periphery of the spiral coil 2. This notch 9b may not be formed. The notch 19 is a part for accommodating the magnetic layer 15, and the notch 29 is a part for accommodating the circuit board 7.

  Here, the notch 9a is particularly provided for the lead-out portion 3b of the spiral coil 2 because, as will be described later, when the spiral coil 2 is used for non-contact power feeding for power transmission, the resistance of the coil In order to reduce the total thickness of the antenna device, it is necessary to increase the wire diameter and pass the lead-out portion 3b through the notch 9a of the magnetic layer 5. Similarly, the notch 9b is provided specifically for the lead-out part 3a of the spiral coil 2 in order to suppress the total thickness by allowing the lead-out part 3a to pass through the notch 9b under the spiral coil 12. It is.

  The notch 9 a extends to the tip of the intersecting portion of the two spiral coils 2 and 12 in order to suppress an increase in the total thickness even in a portion where the lead portion 3 b of the spiral coil 2 intersects the spiral coil 12. It is preferable.

  These notches 9a, 9b, 19, and 29 do not have to be through-holes, that is, openings, but may be groove-like shapes, that is, recessed portions that are dug in such a way that a part of the magnetic layer 5 remains. The composite substrate produced by installing the circuit board 7 and the magnetic layer 15 on the magnetic layer 5 is connected to the spiral coils 2 and 12 through the adhesive layer 4.

  The circuit board 7 has a lead portion 3a, 3b from the spiral coil 2, a terminal portion 8 for connecting the lead portions 13a, 13b from the spiral coil 12, a connection terminal portion 18 for connecting to an external circuit, and these. A circuit pattern for electrical connection is formed.

  The lead-out portion 3b on the inner peripheral side of the spiral coil 2 is connected to one of the terminal portions 8 formed on the circuit board 7 through a notch 9a by solder or the like, and the lead-out portion 3a from the outer peripheral side of the spiral coil 2 is It is connected to one of the terminal portions 8 formed on the circuit board 7 by solder or the like through the notch portion 9b. Further, the lead portions 13a and 13b of the spiral coil 12 are directly connected to other terminal portions 8 formed on the circuit board 7 by soldering or the like. And the secondary side circuit of a non-contact charge circuit is comprised by connecting the rectifier circuit etc. which are not shown in figure to the connection terminal 18 connected to each terminal part 8. FIG.

  As the circuit board 7, a circuit board made of a conductive material is formed on one side or both sides of a dielectric board, and a rigid board, a flexible board having high flexibility, or a rigid / flex board that is a composite of both is used. .

  The magnetic layers 5 and 15 are used as binders for metal magnetic materials such as Fe-based, Fe-Si-based, Sendust, Permalloy, and amorphous, MnZn-based ferrite, NiZn-based ferrite, or magnetic particles made of the above magnetic materials. A magnetic resin material prepared by adding a resin or a powder molding material prepared by compression molding by adding a small amount of a binder to magnetic particles can be used. These magnetic materials can be used alone or in combination.

  Further, the magnetic layers 5 and 15 may be used as a composite structure in which a plurality of magnetic layers made of the above materials are combined or a laminated structure. In the example of FIG. 1, a magnetic resin material is used for the magnetic layer 5, and NiZn-based ferrite is used for the magnetic layer 15, and the magnetic material can be properly used corresponding to the frequency used in this way.

  The wire diameter and wire configuration of the spiral coils 2 and 12 are determined depending on the use and frequency used. For example, when the spiral coil 2 is used for non-contact power supply and used at a frequency of about 100 to 200 kHz with a charge output capacity of about 5 W, it is made of 0.15 mm to 0.45 mm diameter Cu or an alloy containing Cu as a main component. It is preferable to use a single wire.

  In addition, when the spiral coil 12 is used for non-contact communication at a frequency of about several tens of MHz, it is preferable to use a single wire made of 0.05 to 0.15 mm diameter Cu or an alloy containing Cu as a main component.

  In any case, in order to reduce the skin effect of the conducting wire, a parallel line or a knitted line obtained by bundling a plurality of fine wires thinner than the above-mentioned single wire may be used, and a thin rectangular wire or flat wire is used. It is good also as an alpha winding of 1 layer or 2 layers.

  On the other hand, the adhesive layer 4 is used for bonding the spiral coils 2 and 12 and the one surface of the composite substrate composed of the magnetic layers 5 and 15 and the circuit board 7, as long as it has adhesiveness. Either is acceptable. For example, a double-sided adhesive tape in which an adhesive layer is formed on both surfaces of a thin sheet such as PET can be used, and a magnetic resin sheet prepared by mixing a magnetic powder with a resin can also be used. When a magnetic resin sheet is used, the magnetic shield property can be further enhanced because the portion of the adhesive layer 4 also acts as a magnetic body. In this case, if the magnetic resin sheet is made thick and embedded so that the spiral coils 2 and 12 are embedded, the adhesion and magnetic shielding properties can be further improved. In addition, an effect of easily releasing heat generated in the spiral coils 2 and 12 can be expected.

  1 (a) and 1 (b), the connection between the lead portions 3a, 3b, 13a, 13b and the terminal portion 8 provided on the circuit board 7 in the later step and the connection terminal portion 18 on the adhesive layer 4; The opening 6 is provided so as not to hinder the connection with the external substrate.

  <Manufacturing method of antenna device>

  Next, an example of a procedure for manufacturing the antenna device according to the first embodiment of the present invention shown in FIGS. 1A and 1B will be described with reference to FIG.

  First, a sheet of the magnetic layer 5 is prepared. This sheet converges the magnetic flux around the spiral coils 2 and 12, and generally has a larger size than the spiral coils 2 and 12. In the example of FIG. 1, a part of the magnetic layer 5 is replaced with a magnetic layer 15 as a magnetic layer that supports a part of the spiral coil 12. In the example of FIG. 1, since it is assumed that the spiral coil 2 is used for non-contact power supply that communicates at about 100 KHz and the spiral coil 12 is used for non-contact communication at 13.56 MHz, a magnetic material suitable for each communication is used. Thus, in this antenna device, a plurality of magnetic layers can be used in combination.

  Further, the magnetic layer 5 is provided with a notch 9a for passing the inner lead-out portion 3b of the spiral coil 2 and a notch 9b for letting the outer lead-out portion 3a pass under the spiral coil 12. It has been. Furthermore, the magnetic layer 5 is also provided with a notch 19 for installing the magnetic layer 15 and a notch 29 for installing the circuit board 7.

  Next, the magnetic layer 15 and the circuit board 7 are inserted into the notches 19 and 29, respectively.

  Thereafter, the adhesive layer 4 is attached to one surface of the composite of the magnetic layer 5 and the circuit board 7. An opening 6 is provided in the adhesive layer 4. This is provided to enable connection between the lead-out portions 3a and 3b from the later spiral coil 2 and the conductor pattern formed on the circuit board 7 by soldering or the like.

  Finally, the spiral coils 2 and 12 are sequentially applied to the predetermined positions of the adhesive layer 4 and pressed, and the lead portions 3a, 3b, 13a, and 13b are soldered to the predetermined terminal portions 8 formed on the circuit board 7. In addition, the antenna device 20 can be completed. When a magnetic resin layer is used as the adhesive layer 4, it is preferable to perform a heat treatment simultaneously with pressurization to cure the resin and thereby strengthen the bonding.

  When using this antenna device, a protective sheet that can be bonded on one or both sides may be attached to one or both of the installation surface and non-installation surface of the spiral coils 2 and 12 of the antenna device.

  As described above, according to the first embodiment of the present invention, the antenna unit 20 has the laminated structure of the magnetic layer 5, the adhesive layer 4, and the spiral coils 2, 12. Since 9a and 9b are provided, the lead-out portion 3b on the inner peripheral side of the spiral coil 2 can be extended through the notch 9a, so that the diameter of the spiral coil 2, the adhesive layer 4, and the magnetic layer It is possible to suppress the total thickness consisting of the sum of 5 or the total thickness consisting of the adhesive coil and twice the diameter of the spiral coil 2. That is, the antenna device itself can be thinned. Furthermore, connectivity with an external circuit can be improved.

(Second Embodiment)

  FIGS. 3A and 3B show the configuration of the antenna device according to the second embodiment of the present invention. In order to make the structure easy to understand, in FIG. Layer 5 is shown through. The same components as those of the first embodiment (FIG. 1) are denoted by the same reference numerals, and redundant description will be omitted, and description will be made focusing on characteristic portions.

  As shown in FIG. 3A and FIG. 3B, the second embodiment uses a flexible cable as the circuit board 7, and the cable length is set to facilitate connection with an external element. It extends from the magnetic layer 5 to the outside and can be used after being bent.

  In this example, a sensing element 10 is further provided on the circuit board 7. The element 10 may be of any shape, such as a chip type for mounting or a lead wire type, but a low-profile chip element is preferable from the viewpoint of suppressing the thickness of the antenna device and ease of mounting. Is mounted on the circuit board 7 with solder or the like.

  The sensing element 10 is, for example, a temperature sensitive element such as a thermistor for monitoring the temperature rise of the antenna device, a hall element for monitoring the magnetic field strength, and the like, and a plurality of these elements may be installed in combination. it can. The element 10 may have a structure covered with the adhesive layer 4, or an opening (not shown) may be provided in the adhesive layer 4 so that the adhesive layer 4 does not contact.

  In the example of FIG. 3, an opening 6 is provided in a part on the surface of the circuit board 7 of the adhesive layer 4. This is to enable connection of the lead-out portions 3a and 3b from the later spiral coil 2 and lead-out portions 13a and 13b from the spiral coil 12 and the terminal portion 8 formed on the circuit board 7 by soldering or the like. It is provided.

  Also in the second embodiment, similarly to the first embodiment described above, the lead-out portion 3b on the inner peripheral side of the spiral coil 2 passes through the notch portion 9a and is connected to the terminal portion 8 formed on the circuit board 7. One of them is connected by solder or the like. Further, a notch 9b is provided at the intersection of the lead-out portion 3a from the outer peripheral side of the spiral coil 2 and the spiral coil 12, and the lead-out portion 3a is formed on the circuit board 7 after passing through the notch 9b. One of the terminal portions 8 is connected by solder or the like. This notch 9b may not be provided.

  As described above, according to the second embodiment of the present invention, the antenna unit 50 has a laminated structure of the magnetic layers 5 and 15, the adhesive layer 54, and the spiral coils 2 and 12. Since the notch portion 9a is provided, the lead-out portion 3b on the inner peripheral side of the spiral coil 2 can be extended through the notch portion 9a. Therefore, it is possible to keep the diameter of the spiral coil 2, the total thickness composed of the total of the adhesive layer 54 and the magnetic layer 5, or the total thickness composed of the adhesive coil 54 and twice the diameter of the spiral coil 2. That is, the antenna device itself can be thinned. Furthermore, connectivity with an external circuit can be improved.

(Third embodiment)

  FIGS. 4A and 4B show an antenna device according to the third embodiment of the present invention. Here, in order to make the structure easy to understand, FIG. 4A shows the adhesive layer 64 and the magnetic layer 55 through. As shown in FIGS. 4A and 4B, the coil module 60 includes a spiral coil 52 formed by winding a conducting wire in a spiral shape, a magnetic layer 55, an adhesive layer 64, and a circuit board 58. Is provided. 4A and 4B, the spiral coil 52 is drawn as a large one-turn coil for the sake of simplicity. In this example, the spiral coil 52 is used for non-contact power feeding.

  A notch 51 is formed in the magnetic layer 55. The cutout portion 51 is a portion that houses the lead-out portion 53 a from the inner periphery of the spiral coil 52. The notch 51 is provided when the spiral coil 52 is used for non-contact power supply for power transmission, and it is necessary to increase the wire diameter in order to reduce the resistance of the coil. This is because the total thickness of the antenna device is suppressed by passing through the notch 51. The notch 51 does not need to be a through-hole, that is, an opening, but may be a groove-like shape, that is, a recess, in which a part of the magnetic layer 55 remains. The composite substrate manufactured by installing the circuit board 58 on the magnetic layer 55 is connected to the spiral coil 52 via the adhesive layer 64. The adhesive layer 64 may also be provided with the notch 51 provided by the magnetic layer 55.

  The circuit board 58 is formed with a terminal portion 56 for connecting the lead portions 53a and 53b from the spiral coil 52, a connection terminal portion 57 for connecting to an external circuit, and a circuit pattern for electrically connecting them. . The lead-out portion 53a on the inner peripheral side of the spiral coil 52 is connected to one of the terminal portions 56 formed on the circuit board 58 through the notch 51 by solder or the like, and the lead-out portion 53b from the outer peripheral side of the spiral coil 52 is also used. One terminal 56 is connected by solder or the like. As the circuit board 58, a circuit board made of a conductive material is formed on one side or both sides of a dielectric board, and a rigid board, a flexible board having high flexibility, or a rigid / flex board that is a composite of both is used. . As the magnetic layer 55, the same kind of metal magnetic material, magnetic resin material, and dust molding material as those described in the first embodiment can be used.

  The wire diameter and wire configuration of the spiral coil 52 are determined by the use and frequency used. For example, when the spiral coil 52 is used for non-contact power feeding and is used at a frequency of about 100 to 200 kHz with a charge output capacity of about 5 W, it is made of 0.15 mm to 0.45 mm diameter Cu or an alloy containing Cu as a main component. It is preferable to use a single wire, a parallel wire, or a knitted wire.

  The adhesive layer 64 is used for joining the spiral coil 52 and one surface of the composite substrate composed of the magnetic layer 55 and the circuit board 58, and any adhesive layer may be used. This point is also the same as that described in the first embodiment.

  As described above, according to the third embodiment of the present invention, the antenna unit 60 has a laminated structure of the magnetic layer 55, the adhesive layer 64, and the spiral coil 52, but the magnetic layer 55 has the notch 51. Since it is provided, the lead-out portion 53 a on the inner peripheral side of the spiral coil 52 can be extended through the cutout portion 51. Therefore, it is possible to keep the diameter of the spiral coil 52, the total thickness composed of the sum of the adhesive layer 64 and the magnetic layer 55, or the total thickness composed of the adhesive layer 54 and twice the diameter of the spiral coil 52. That is, the antenna device itself can be thinned. Furthermore, connectivity with an external circuit can be improved.

  As described above in detail, according to the antenna device according to the first to third embodiments of the present invention, the magnetic layer supporting the plurality of spiral coils is provided with the lead-out portion from the inner peripheral side of the spiral coil and the circuit board. The antenna device can be thinned by storing.

  The first to third embodiments of the present invention have been described above. However, the present invention is not limited to these embodiments, and various improvements and modifications can be made without departing from the scope of the present invention. . For example, the antenna device according to the present embodiment can be applied to an electronic device such as a smartphone.

2, 12, 52 Spiral coil 3a, 3b, 13a, 13b, 53a, 53b Lead part 4, 54, 64 Adhesive layer 5, 15, 55 Magnetic layer 6 Opening part 7, 58 Circuit board 8, 56 Terminal part 9, 19 , 29, 59 Notch portion 10 Element 18, 57 Connection terminal portion 20, 50, 60 Antenna device

Claims (9)

  1. In an antenna device having a spiral coil, a magnetic layer that supports the spiral coil, and a circuit board on which a plurality of conductor patterns are formed,
    A recess or a through hole is provided in a part of the magnetic layer to store a lead portion from the inner periphery of the spiral coil.
    The magnetic layer includes at least a part of the circuit board,
    An antenna device comprising: a terminal portion for connecting the spiral coil to the conductor pattern; and a connection terminal portion for connecting the conductor pattern to an external circuit substrate.
  2.   2. The antenna device according to claim 1, wherein the connection terminal portion is processed into a shape to be connected to an external circuit by a connector or anisotropic conductive particles.
  3.   3. The antenna device according to claim 1, wherein the plurality of spiral coils and the magnetic layer are connected by a magnetic resin layer containing magnetic powder.
  4.   4. The antenna device according to claim 1, wherein the magnetic layer is a magnetic resin layer containing magnetic powder, ferrite, a compacted body, or a composite magnetic body that is a combination thereof.
  5.   The antenna device according to claim 1, wherein a sensing element is installed on the circuit board.
  6.   6. The antenna device according to claim 1, wherein the circuit board is a flexible board.
  7.   7. Two lead portions are drawn out from the spiral coil, and the concave portion or the through hole is provided at two positions in the magnetic layer so as to correspond to each lead portion. The antenna device according to any one of the above.
  8.   An antenna unit for contactless power transmission, comprising the antenna device according to claim 1.
  9.   An electronic apparatus comprising the antenna device according to claim 1.
JP2014016435A 2014-01-31 2014-01-31 Antenna apparatus, antenna unit for non-contact power transmission, and electronic apparatus Abandoned JP2015144160A (en)

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JP2014016435A JP2015144160A (en) 2014-01-31 2014-01-31 Antenna apparatus, antenna unit for non-contact power transmission, and electronic apparatus
US14/605,293 US20150222017A1 (en) 2014-01-31 2015-01-26 Antenna device, non-contact power transmission antenna unit, and electronic apparatus
CN201510043627.XA CN104821437A (en) 2014-01-31 2015-01-28 Antenna device, non-contact power transmission antenna unit, and electronic apparatus

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JP2017041875A (en) * 2015-08-21 2017-02-23 矢崎総業株式会社 Power transmission communication unit

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