JP4034676B2 - Non-contact communication type information carrier - Google Patents

Non-contact communication type information carrier Download PDF

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Publication number
JP4034676B2
JP4034676B2 JP2003078180A JP2003078180A JP4034676B2 JP 4034676 B2 JP4034676 B2 JP 4034676B2 JP 2003078180 A JP2003078180 A JP 2003078180A JP 2003078180 A JP2003078180 A JP 2003078180A JP 4034676 B2 JP4034676 B2 JP 4034676B2
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JP
Japan
Prior art keywords
coil
non
semiconductor chip
booster
information carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003078180A
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Japanese (ja)
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JP2004287767A (en
Inventor
和成 中川
透 梶山
伸太郎 鈴村
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日立マクセル株式会社
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Publication date
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Priority to JP2003078180A priority Critical patent/JP4034676B2/en
Publication of JP2004287767A publication Critical patent/JP2004287767A/en
Application granted granted Critical
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Application status is Expired - Fee Related legal-status Critical
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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact communication information carrier having a semiconductor chip and a booster coil integrally formed with an antenna coil, and more particularly to the shape and arrangement of the antenna coil and the booster coil.
[0002]
[Prior art]
Conventionally, an insulating member includes a semiconductor chip and an antenna coil electrically connected to a terminal portion of the semiconductor chip, and uses electromagnetic waves to receive power from the reader / writer and transmit / receive signals to / from the reader / writer. There are known non-contact information carriers that are contactless. As this type of information carrier, there are a card shape, a coin shape, a button shape, a tag shape, and the like depending on its outer shape.
[0003]
Conventionally, as this type of information carrier, an antenna coil having a pattern formed on an insulating member, or an antenna coil having a winding formed on an insulating member has been used. Protection of the connection point with the semiconductor chip and moisture-proof measures are unnecessary and can be made at low cost, and even when stress such as bending or twisting acts on the insulating member, the coil does not break and has excellent durability Thus, a semiconductor chip in which an antenna coil is integrally formed on the semiconductor chip itself is mounted on an insulating member.
[0004]
When the antenna coil is integrally formed on the semiconductor chip, the coil diameter and the conductor width of the coil are smaller than when the antenna coil is patterned on the insulating member or when the antenna coil consisting of the winding is carried on the insulating member, Since the number of turns is naturally limited, it may be difficult to increase the communication distance between the reader / writer and the necessary communication distance may not be ensured. Therefore, conventionally, in order to reinforce the electromagnetic induction coupling between each antenna coil between the antenna coil integrally formed on the semiconductor chip and the antenna coil provided in the reader / writer, it has at least one turn and its cross-sectional area. Has a second conductor loop having a size approximately equal to that of the data medium device (insulating member), and a first conductor loop having at least one turn and having a cross-sectional area connected to the semiconductor chip (an antenna formed integrally with the semiconductor chip) The first and third conductor loops are arranged substantially concentrically, and the first and second conductor loops are inductively coupled to each other via the third loop. The technique to do is proposed (for example, refer patent document 1).
[0005]
In this specification, the conductor loop for reinforcing the electromagnetic induction coupling between the antenna coils is referred to as a “booster coil”.
[0006]
[Patent Document 1]
JP-A-8-532904 (FIG. 1)
[0007]
[Problems to be solved by the invention]
According to the technique described in the patent document, the antenna coil integrally formed on the semiconductor chip via the booster coil and the antenna coil provided in the reader / writer are electromagnetically coupled to each other. Inductive coupling is strengthened, and the communication distance between the non-contact communication type information carrier and the reader / writer can be extended.
[0008]
However, the technique described in the above-mentioned patent document arranges the antenna coil (first conductor loop) integrally formed on the semiconductor chip and the third conductor loop formed on the booster coil in a predetermined positional relationship that is substantially concentric. Therefore, good electromagnetic induction coupling between the conductor loops can be realized. Therefore, unless the arrangement position of each conductor loop is strictly regulated, good electromagnetic induction coupling cannot be obtained. There is a problem that the communication distance between the carrier and the reader / writer is likely to vary. In addition, since the arrangement positions of the conductor loops must be strictly regulated, there is a problem that the mounting process of the semiconductor chip on the insulating member becomes complicated and the cost of the non-contact communication type information carrier increases.
[0009]
The present invention has been made to solve such deficiencies of the prior art, and its object is to provide a non-contact communication type information carrier that can be manufactured at low cost and has stable communication characteristics with a reader / writer. There is.
[0010]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides, firstly, a semiconductor chip integrally formed with an antenna coil, an antenna coil integrally formed on the semiconductor chip, and an antenna coil provided in a reader / writer and electromagnetic induction coupling. In the non-contact communication type information carrier provided with the booster coil and the insulating member that supports the semiconductor chip and the booster coil, both the booster coil and the antenna coil integrally formed on the semiconductor chip are provided in the inner peripheral portion. A part of an antenna coil formed integrally with the semiconductor chip is overlapped with a part of the booster coil, when formed in a spiral shape having a coil non-formation region and viewed from the plane direction of the insulating substrate, and the semiconductor Another part of the antenna coil integrally formed on the chip is connected to the coil non-forming region of the booster coil. Superimposed on the parts, and that the non-coil-forming regions of the antenna coil which is integrally formed on the non-coil-forming regions and said semiconductor chip of said booster coil is disposed between the semiconductor chip and the booster coil so as to overlap at least a portion Made the configuration.
[0011]
In this way, a part of the antenna coil integrally formed on the semiconductor chip is overlapped with a part of the booster coil, and another part of the antenna coil integrally formed on the semiconductor chip is overlapped with the coil non-formation region of the booster coil. When the semiconductor chip and the booster coil are arranged so that they overlap each other and the coil non-formation region of the booster coil and the coil non-formation region of the antenna coil formed integrally with the semiconductor chip overlap at least partially, it is possible to out dew conductor of each turn that constitute the antenna coil turns and the booster coil regardless the number of turns of the antenna coil coil unformed region of the electromagnetic induction coupling with no magnetic interference in the exposed portion To strengthen the electromagnetic induction coupling between the booster coil and the antenna coil. It made it, it is possible to extend the communication distance of the non-contact communication type information carrier and the reader-writer. In addition, as long as each coil non-formation region is arranged so as to overlap at least partly, good electromagnetic induction coupling between the booster coil and the antenna coil can be achieved even if the semiconductor chip and the booster coil are slightly misaligned. Since the semiconductor chip mounting process on the insulating member can be simplified and the cost of the non-contact communication type information carrier can be reduced, the communication distance between the non-contact communication type information carrier and the reader / writer can be varied. Can be reduced.
[0012]
In order to solve the above problems, the present invention secondly, in the non-contact communication type information carrier according to the first problem solving means, an antenna coil integrally formed with the booster coil and the semiconductor chip. Both are formed in a rectangular spiral shape having a coil non-formation region on the inner periphery, and the semiconductor chip is arranged at the corners of the booster coil.
[0013]
In this way, when the semiconductor chip is arranged at the corner corner of the booster coil formed in a rectangular spiral shape, electromagnetic induction coupling between the booster coil and the antenna coil formed integrally with the semiconductor chip can be further enhanced. As a result, the communication distance between the non-contact communication type information carrier and the reader / writer can be further extended.
[0014]
In order to solve the above problems, the present invention thirdly, in the non-contact communication type information carrier according to the first problem solving means, an antenna coil integrally formed with the booster coil and the semiconductor chip. Both are formed in a rectangular spiral shape having a coil non-formation region on the inner peripheral portion, and the semiconductor chip is arranged along the side portion of the booster coil.
[0015]
Thus, when the semiconductor chip is arranged along the side part of the booster coil formed in a rectangular spiral shape, the degree of freedom of the setting position of the semiconductor chip can be increased in the direction along the side of the booster coil. The process of mounting the semiconductor chip on the insulating member can be simplified, and the cost of the non-contact communication type information carrier can be reduced.
[0016]
Moreover, in order to solve the above-mentioned problem, the present invention fourthly forms a booster coil on the insulating substrate in the non-contact communication type information carrier described in the first problem-solving means, A plurality of the semiconductor chips are arranged for one booster coil.
[0017]
As described above, when one booster coil is formed on an insulating substrate, a plurality of the semiconductor chips are arranged with respect to one booster coil as compared with the case where a plurality of booster coils are formed on an insulating member. Since different functions can be exhibited for each chip and applied to different applications, the non-contact communication type information carrier can be made multifunctional and versatile.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a non-contact communication information carrier according to the present invention will be described with reference to FIGS. 1 is a plan view showing an arrangement of booster coils and semiconductor chips provided in a non-contact communication type information carrier according to an embodiment, FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 3 is a booster coil and a semiconductor. FIG. 4 schematically shows the arrangement of the antenna coil integrally formed on the chip, FIG. 4 schematically shows the arrangement of the booster coil and the antenna coil integrally formed on the semiconductor chip, and FIG. 5 shows the surface of the insulating member. 6 is a back view of the insulating member, FIG. 7 is a plan view of the semiconductor chip, and FIG. 8 is an equivalent circuit diagram of a booster coil provided in the non-contact communication type information carrier of this example.
[0019]
As shown in FIGS. 1 and 2, the non-contact communication type information carrier of this example includes a semiconductor chip 2 in which an antenna coil 1 is integrally formed, a booster coil 3 and conductor films 4a, 4b that form capacitance. It comprises an insulating member 6 on which 5a and 5b are formed, and a base 7 that integrally casings the semiconductor chip 2 and the insulating member 6.
[0020]
As shown in FIG. 7, the semiconductor chip 2 is a rectangular spiral antenna having a coil non-formation region 1a on its inner peripheral portion on the formation surface of the input / output terminal 2a via an insulating layer 2b made of a polyimide resin film or the like. The coil 1 is formed integrally. The antenna coil 1 is formed by a photoresist method, that is, a photo of the semiconductor chip 2 (more practically, a completed wafer before being divided into individual semiconductor chips) on the insulating layer forming surface except for the input / output terminal forming portion. A resist layer is formed to a uniform thickness, and a required coil pattern is exposed and developed on the photoresist layer. Then, a conductive metal material is sputtered or vacuumed on the insulating layer 2b of the semiconductor chip 2 using the photoresist layer as a mask. After vapor deposition, the photoresist layer can be removed and a coil pattern made of a conductive metal material can be formed on the formation surface of the input / output terminal 2a. In order to reduce the electrical resistance of the coil pattern, a copper plating layer can be formed on the surface of the conductive metal film.
[0021]
In the example of FIG. 7, the antenna coil 1 is formed in a rectangular spiral shape having a plurality of turns, but the number of turns and the planar shape of the antenna coil 1 are not limited to this. In other words, the number of turns can be an arbitrary number of turns of 1 or more, and the planar shape is formed in an arbitrary shape such as a rectangle or a circle with diagonal or arc chamfered corners. it can.
[0022]
As shown in FIG. 5, the booster coil 3 is formed on the surface side of the insulating member 6 in a rectangular spiral shape having a coil non-formation region 3 a on the inner peripheral portion. The booster coil 3 is formed as large as possible within a range that can be accommodated in the base body 7, and conductive films 4a and 4b that form electrostatic capacitances are connected to both ends of the booster coil 3, respectively.
[0023]
In the example of FIG. 5, the booster coil 3 is formed in a rectangular spiral shape having a plurality of turns, but the number of turns and the planar shape of the booster coil 3 are not limited to this, and the above-described antenna Similar to the coil 1, it can be formed in any number of turns and shape.
[0024]
As shown in FIGS. 1 to 4, the semiconductor chip 2 has the antenna coil 1 facing the insulating member 6, and the coil non-formation region 1 a of the antenna coil 1 and the coil non-formation region 3 a of the booster coil 3 are identical. The corners of the booster coil 3 are set so as to overlap each other.
[0025]
The conductor films 4a and 5a and 4b and 5b forming the capacitance are formed on the front and back surfaces of the insulating member 6 so as to face each other. Further, the conductive films 4a and 4b that form the capacitance formed on the front surface side of the insulating member 6 are electrically connected via the booster coil 3 and formed on the back surface side of the insulating member 6 as described above. As shown in FIG. 6, the conductor films 5a and 5b that form the electrostatic capacitance are electrically connected through a conductive wire 5c. Therefore, the booster coil 3 is capacitively coupled at both ends thereof via conductor films 4a and 5a and 4b and 5b that form capacitances arranged opposite to each other, as schematically shown in FIG. In addition, the booster coil 3 is obtained in which the capacitance Ca formed by the conductor films 4a and 5a and the capacitance Cb formed by the conductor films 4b and 5b are connected to both ends. The area of each of the conductor films 4a, 5a, 4b, and 5b is such that the series impedance of the two capacitances Ca and Cb includes an antenna coil 1 and a booster coil 3 that are integrally formed on the semiconductor chip 2. Adjustment is made so that the maximum voltage is obtained at both ends of the coil 1.
[0026]
The booster coil 3 and the conductive films 4a, 5a, 4b, and 5b that form the capacitance are etched on a conductive metal layer having a uniform thickness formed on one side of the insulating member 6 to form a required coil pattern. It can be formed by an etching method, a printing method of printing a required conductive pattern on one surface of the insulating member 6 using a conductive ink, or the like.
[0027]
The insulating member 6 is formed of an insulating material having a required dielectric constant and rigidity. Examples of the insulating material suitable for forming the insulating member 6 include glass epoxy resin, polyimide resin, polyamide resin, polyethylene terephthalate resin (hereinafter abbreviated as PET), vinyl chloride resin, and the like.
[0028]
The substrate 7 includes a cover sheet 8 and an adhesive layer 9. Of these, the cover sheet 8 can be formed of any sheet-like material such as paper or plastic sheet. However, the cover sheet 8 decomposes even when discarded and does not generate harmful substances such as dioxin even when incinerated. It is most preferable to form it. When a plastic sheet is used as the cover sheet material, it is particularly preferable to use a plastic sheet that does not contain chlorine, such as PET, since no harmful substances such as dioxin are generated even when incinerated. On the other hand, as an adhesive constituting the adhesive layer 9, any adhesive having a required hardness after curing can be used, but in order to enhance the protection effect of the booster coil 1, the antenna coil 3 and the semiconductor chip 4, For example, it is particularly preferable to use a resin material having low hygroscopicity such as an epoxy resin.
[0029]
The non-contact communication type information carrier of the present example is formed on the semiconductor chip 2 so that the coil non-formation region 1a of the antenna coil 1 and the booster coil 3 which are integrally formed on the semiconductor chip 2 partially overlap each other. Since the booster coil 3 is disposed, the antenna coil 1 is configured in the coil non-formation region 3a of the booster coil 3 regardless of the number of turns of the antenna coil 1 and the number of turns of the booster coil 3, as schematically shown in FIG. A portion of the conductor of each turn can be exposed. And in the said exposed part, since interference does not arise in the magnetic force line radiated | emitted from the booster coil 3, optimal electromagnetic induction coupling is performed and electromagnetic induction coupling of a non-contact communication type information carrier and a reader / writer is strengthened. Can do. When transmitting from the antenna coil 1 to the booster coil 3, optimum electromagnetic induction coupling is performed for the same reason. Further, as long as the non-contact communication type information carrier of this example is arranged so that the respective coil non-forming regions 1a and 3a partially overlap, even if the arrangement of the semiconductor chip 2 and the booster coil 3 is slightly shifted. Since good electromagnetic induction coupling between the antenna coil 1 and the booster coil 3 can be maintained, the mounting process of the semiconductor chip 2 on the insulating member 6 can be simplified, and the cost of the non-contact communication type information carrier can be reduced. At the same time, the variation in the communication distance between the non-contact communication type information carrier and the reader / writer can be reduced. Furthermore, since the semiconductor chip 2 is arranged at the corner of the booster coil 3 formed in a rectangular spiral shape in the non-contact communication type information carrier of this example, the electromagnetic induction coupling between the antenna coil 1 and the booster coil 3 is further improved. It can be made stronger.
[0030]
Hereinafter, other embodiments of the present invention will be listed. FIG. 9 is a diagram schematically showing another arrangement example of the antenna coil 1 with respect to the booster coil 3.
[0031]
(1) In the embodiment, the semiconductor chip 2 and the booster coil 3 are arranged so that the coil non-formation region 1a of the antenna coil 1 and the coil non-formation region 3a of the booster coil 3 partially overlap. The gist of the present invention is not limited to this, and as shown in FIG. 9A, the coil non-forming region 1a of the antenna coil 1 and the coil non-forming region 3a of the booster coil 3 are completely overlapped. The semiconductor chip 2 and the booster coil 3 can also be arranged.
[0032]
(2) In the above embodiment, the semiconductor chip 2 is disposed at the corner of the booster coil 3. However, the gist of the present invention is not limited to this, as shown in FIG. The semiconductor chip 2 can also be arranged along the side part of the booster coil 3. As described above, when the semiconductor chip 2 is arranged along the side portion of the booster coil 3, the degree of freedom of the set position of the semiconductor chip 2 with respect to the direction along the side side of the booster coil 3 can be increased. The semiconductor chip 2 mounting process can be simplified, and the cost of the non-contact communication type information carrier can be reduced.
[0033]
(3) In the above embodiment, only one semiconductor chip 2 is mounted on one insulating substrate 6, but the gist of the present invention is not limited to this, and is shown in FIG. 9 (c). As described above, a plurality of semiconductor chips 2 can be mounted on one insulating substrate 6. When a plurality of semiconductor chips 2 are mounted on one insulating substrate 6 in this way, different functions can be exhibited for each semiconductor chip 2 and applied to different applications. Can be made multifunctional and versatile.
[0034]
(4) In the above embodiment, the conductor films 4a, 5a, 4b, and 5b that form the capacitance are formed on the insulating substrate 6. However, the gist of the present invention is not limited to this, and the chip capacitor It is also possible to connect a chip component such as the booster coil 3 formed on the insulating substrate 6.
[0035]
【The invention's effect】
As described above, the non-contact communication type information carrier according to the present invention is a semiconductor chip in which the coil non-formation region of the antenna coil and the booster coil non-formation region integrally formed on the semiconductor chip overlap at least partially. Since the booster coil is arranged, a part of the conductor of each turn constituting the antenna coil can be exposed in the coil non-formation region of the booster coil regardless of the number of turns of the antenna coil and the number of booster coils. Optimum electromagnetic induction coupling without magnetic interference between the antenna coil and the booster coil can be performed in the exposed portion, and electromagnetic induction coupling between the non-contact communication type information carrier and the reader / writer can be enhanced. . In addition, the non-contact communication type information carrier of the present invention includes a semiconductor chip and a booster coil as long as the coil non-formation region of the antenna coil and the coil non-formation region of the booster coil overlap each other at least partially. Even if the arrangement is slightly deviated, good electromagnetic induction coupling between the antenna coil and the booster coil can be maintained, so that the mounting process of the semiconductor chip on the insulating member can be simplified and the non-contact communication type information carrier can be reduced. The cost can be reduced and the variation in the communication distance between the non-contact communication type information carrier and the reader / writer can be reduced.
[Brief description of the drawings]
FIG. 1 is a plan view showing an arrangement of booster coils and semiconductor chips provided in a non-contact communication type information carrier according to an embodiment.
FIG. 2 is a cross-sectional view taken along the line AA of FIG.
FIG. 3 is a diagram schematically showing an arrangement of a booster coil and an antenna coil integrally formed on a semiconductor chip.
FIG. 4 is a diagram schematically showing an arrangement of a booster coil and an antenna coil integrally formed on a semiconductor chip.
FIG. 5 is a surface view of an insulating member.
FIG. 6 is a rear view of the insulating member.
FIG. 7 is a plan view of a semiconductor chip.
FIG. 8 is an equivalent circuit diagram of a booster coil provided in a non-contact communication type information carrier.
FIG. 9 is a diagram schematically showing another arrangement example of the semiconductor chips with respect to the booster coil.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Antenna coil 1a Coil non-formation area | region 2 Semiconductor chip 3 Booster coil 3a Coil non-formation area | region 4a, 4b, 5a, 5b Conductive film | membrane 6 which forms electrostatic capacitance 6 Insulation member 7 Base | substrate 8 Cover sheet 9 Adhesive layer

Claims (4)

  1. A semiconductor chip integrally formed with an antenna coil, an antenna coil integrally formed on the semiconductor chip and a booster coil electromagnetically coupled to the antenna coil provided in the reader / writer, and an insulation carrying these semiconductor chip and booster coil In the non-contact communication type information carrier provided with a member, both the booster coil and the antenna coil integrally formed with the semiconductor chip are formed in a spiral shape having a coil non-formation region on the inner periphery, and the insulating substrate When viewed from the plane direction, a part of the antenna coil integrally formed on the semiconductor chip is overlapped with a part of the booster coil, and another part of the antenna coil integrally formed on the semiconductor chip is overlapped with the booster. superimposed on the part of the coil-formed region of the coil, and co of the booster coil A non-contact communication type information carrier, wherein the semiconductor chip and the booster coil are arranged so that at least part of the non-formation region and the coil non-formation region of the antenna coil integrally formed on the semiconductor chip overlap each other .
  2.   2. The non-contact communication type information carrier according to claim 1, wherein both the booster coil and the antenna coil integrally formed with the semiconductor chip are formed in a rectangular spiral shape having a coil non-formation region in an inner peripheral portion, A non-contact communication type information carrier characterized in that the semiconductor chip is arranged at a corner of a coil.
  3.   2. The non-contact communication type information carrier according to claim 1, wherein both the booster coil and the antenna coil integrally formed with the semiconductor chip are formed in a rectangular spiral shape having a coil non-formation region in an inner peripheral portion, A non-contact communication type information carrier, wherein the semiconductor chip is arranged along a side portion of a coil.
  4.   2. The non-contact communication type information carrier according to claim 1, wherein one booster coil is formed on the insulating substrate, and a plurality of the semiconductor chips are arranged with respect to the one booster coil. Contact communication type information carrier.
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