JP4848764B2 - Non-contact data carrier device - Google Patents

Non-contact data carrier device Download PDF

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Publication number
JP4848764B2
JP4848764B2 JP2005372741A JP2005372741A JP4848764B2 JP 4848764 B2 JP4848764 B2 JP 4848764B2 JP 2005372741 A JP2005372741 A JP 2005372741A JP 2005372741 A JP2005372741 A JP 2005372741A JP 4848764 B2 JP4848764 B2 JP 4848764B2
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non
data carrier
type data
contact type
inlet
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JP2007172527A (en
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樋口  拓也
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大日本印刷株式会社
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Description

  The present invention relates to a non-contact data carrier apparatus that performs non-contact communication of information.

  Conventionally, a non-contact type data carrier employing an electromagnetic induction method may not be able to respond to a reader / writer in a usage environment in which it is attached to a metal or the like, that is, a usage environment in which eddy currents may be generated. For this reason, a metal-compatible non-contact type data carrier that prevents the generation of eddy currents by disposing a magnetic material having high permeability such as ferrite between the internal antenna coil and a metal mounting portion is provided. It has been developed (see, for example, Patent Document 1).

  On the other hand, as for the electromagnetic induction type non-contact type data carrier, an IC card type is widely used by general users, but in recent years, a size much smaller than the size of this IC card is also available. It is being developed and further miniaturization is expected.

For example, an antenna coil is formed by connecting each antenna pattern divided into a plurality of layers to form one antenna coil, and a non-contact type data carrier that is miniaturized by this multilayered antenna coil has been proposed ( For example, see Patent Document 2).
JP 2002-261524 A JP 2004-240529 A

  However, in non-contact type data carriers in pursuit of miniaturization, it is difficult to provide an adhesive layer for attaching to the object to be attached or to attach the data carrier body to the object to be attached. Become. In addition, when a non-contact data carrier with a reduced size is made compatible with the above-described metal, it is difficult to incorporate magnetic parts such as ferrite into the data carrier body, and the addition of this magnetic part increases the manufacturing cost. Will be invited.

  Accordingly, the present invention has been made to solve the above-described problems, and can improve the attachment property to an object to be attached while achieving downsizing, and can also be applied to a conductor such as a metal while suppressing an increase in manufacturing cost. It is an object of the present invention to provide a non-contact type data carrier device that can be easily mounted and used.

In order to achieve the above object, a non-contact type data carrier device according to the present invention includes a multi-layered antenna coil configured by inter-connecting antenna patterns provided in a plurality of layers, and connected to the antenna coil. A non-contact type data carrier inlet provided with at least a memory circuit and an IC chip on which a communication control circuit is mounted, and the non-contact type data carrier inlet is supported while the non-contact type data carrier inlet is supported. Holders of Bei and the base portion made of an insulating resin, a having a function of separating from the base portion is provided with elastically deformable portion having a spring property, wherein a call.

  That is, according to this invention, the formation pattern of the antenna coil is multilayered in order to reduce the size of the structure, and the pedestal is actively provided as a part for attachment to the attached object side. However, it is possible to improve the attachment property to the attached object. In addition, according to the present invention, for example, when the object to be attached is a metal, by configuring the pedestal portion made of insulating resin at a height that can ignore the influence of eddy current that can occur during communication, It is possible to easily realize use by attaching to a conductor such as metal without providing a magnetic part having high permeability for preventing eddy current generation.

  Here, it is preferable that the shortest distance from the mounting surface of the pedestal portion attached to the surface of the attachment target object to the antenna coil included in the non-contact type data carrier inlet is 2 mm or more.

In the non-contact type data carrier device of the present invention, the non-contact type data carrier inlet is resin-sealed on the pedestal portion.
According to the present invention, the non-contact type data carrier inlet can be protected from the external environment and mechanical stress. Here, examples of the resin sealing method include a transfer molding method.

Furthermore, in the non-contact type data carrier device of the present invention, the pedestal portion and the resin sealing portion for sealing the non-contact type data carrier inlet are integrally formed by injection molding using an insulating resin material. It is characterized by that.
According to this invention, the non-contact type data carrier inlet can be protected from the external environment by the sealing resin, and the manufacturing process can be simplified by integrally molding the resin sealing portion and the pedestal portion using injection molding. Can do.

  Further, in the non-contact type data carrier device of the present invention, in order to further improve the attachment property to the object to be attached, the bottom portion of the pedestal portion is configured with an adhesive layer, or the pedestal portion is screwed to the pedestal portion. For example, the provision of a hole for the purpose. Furthermore, in consideration of the case where the object to be attached is a metal having magnetism, etc., a structure in which a magnet is provided on the attachment surface at the bottom of the pedestal portion attached to the object to be attached is applied as the present invention. You can also

Further, according to the present invention , for example, even when an impact is applied from the attached object side to the non-contact type data carrier device side, the impact force can be mitigated by the spring property of the elastically deforming portion. Breakage on the contact data carrier inlet side can be suppressed.

Furthermore, the non-contact type data carrier device of the present invention is characterized in that the pedestal part further includes an inlet mounting part having a claw part to which the non-contact type data carrier inlet is mounted.
According to this invention, since the integration of the non-contact type data carrier inlet and the pedestal portion can be realized by a mounting operation that is mechanical fitting, an adhesive or the like is not required for joining each other, and productivity is increased. Can do. In addition, according to the present invention, the non-contact type data carrier inlet can be held relatively firmly on the pedestal portion side by the claw portion provided in the inlet mounting portion, so that the non-contact type data carrier inlet is detached from the pedestal portion. For example, it can be prevented from being lost.

In the non-contact type data carrier device of the present invention, the external size of the non-contact type data carrier inlet viewed from a direction orthogonal to the pattern surface of the antenna coil is, for example, 10 mm × 10 mm or less. Here, examples of the shape of the non-contact type data carrier inlet include various shapes such as a square, a substantially square, a rectangle, a substantially rectangular, a circle, and an ellipse, and may be configured in other shapes.
Furthermore, in the non-contact type data carrier device of the present invention, the outer size of the pedestal portion viewed from the same direction is larger than the outer size of the non-contact type data carrier inlet viewed from the direction orthogonal to the pattern surface of the antenna coil. It is large.
That is, according to the present invention, the handleability of the entire non-contact type data carrier device is improved by configuring the base portion larger than the small-size non-contact type data carrier inlet as described above.

  As described above, according to the present invention, it is possible to improve the attachment property to the attachment target object while reducing the size, and to easily use it by attaching it to a conductor such as metal while suppressing an increase in manufacturing cost. A non-contact type data carrier device can be provided.

The best mode for carrying out the present invention will be described below with reference to the drawings.
[First Embodiment]
FIG. 1 is a plan view showing a non-contact type data carrier device according to the first embodiment of the present invention, and FIG. 2 is a front view of the non-contact type data carrier device. 3 is a cross-sectional view of the non-contact type data carrier device shown in FIG. 1 taken along the line AA, and FIG. 4 is a cross-sectional view taken along the line BB. 5 is an exploded perspective view showing the structure of a non-contact type data carrier inlet provided in the non-contact type data carrier device of FIG. 1, and FIG. 6 is a cross-sectional view of the non-contact type data carrier inlet shown in FIG. . In the exploded perspective view of the non-contact type data carrier inlet shown in FIG. 5, the surface of the conductor pattern including the antenna coil is hatched.

  As shown in FIGS. 1 to 4, a non-contact type data carrier device 1a according to this embodiment includes a non-contact type data carrier inlet (FIGS. 5 and 6) provided with an antenna coil 52 and an IC chip 51, which will be described in detail later. Reference) 5 and insulating resin having a function of separating the non-contact type data carrier inlet 5 from the side of the object to be attached (article to which the non-contact type data carrier device 1a is attached) while supporting the non-contact type data carrier inlet 5 And a pedestal 2 made of metal.

  The pedestal portion 2 has a substantially quadrangular pyramid shape, the base portion 8 formed in a rectangular shape, and the inlet mounting portion 3 provided as a mounting portion for the non-contact data carrier inlet 5. The four rib-like support portions 6a, 6b, 6c, and 6d that are arranged in a standing posture on the diagonal of the surface of the base portion 8 and support the inlet mounting portion 3 on the base portion 8 mainly. Composed. Further, as shown in FIGS. 1 and 4, a pair of screw insertion holes 7 described in the second embodiment is formed in the base portion 8 constituting the bottom portion of the pedestal portion 2.

  Here, the pedestal portion 2 is formed by, for example, injection molding or the like, and is provided on the core side for molding the bottom surface of the inlet mounting portion 3 and the shape of the side surfaces of the rib-like support portions 6a, 6b, 6c, 6d. A hole 9 corresponding to the mold shape is provided in the central portion. That is, as the material of the pedestal portion 2, ABS (acrylonitrile, butadiene, styrene) resin, vinyl chloride resin, polyethylene, polypropylene, nylon (registered trademark), polyacetal, polystyrene, AS (acrylonitrile, styrene) resin, Examples thereof include insulating resin materials having excellent injection moldability such as methacrylic resin, polycarbonate, and cellulose acetate.

  Further, as shown in FIGS. 2 to 4, an adhesive layer (adhesive layer) 12 to which a release paper 11 is bonded is provided at the bottom of the pedestal 2 (base 8). Thereby, the release paper 11 can be peeled off and the main body of the non-contact type data carrier device 1 can be easily attached (attached) to the attached object side.

  Next, the configuration of the non-contact type data carrier inlet 5 will be described with reference to FIGS. Here, in FIG. 5, in order to make it easy to grasp the connection relation of each wiring layer, the number of windings is reduced from the actual number to simplify the illustration. The actual number of turns of the antenna pattern is, for example, about 9 turns, although it depends on the required inductance value and design. In addition, here, the non-contact type data carrier inlet 5 in which one antenna coil is configured by a four-layer antenna pattern is shown, but the antenna coil may be configured by the number of layers other than four layers, for example. .

  As shown in FIG. 5, the non-contact type data carrier inlet 5 includes a multi-layered antenna coil 52 configured by connecting antenna patterns 62, 72, 82, and 92 provided in a plurality of layers, respectively. Is. That is, the non-contact type data carrier inlet 5 includes four unit antenna substrates 60, 70, 80, 90 each having a wiring layer including a spiral antenna pattern on one main surface of a substantially square insulating substrate. A four-layer wiring board laminated and integrated with each other.

  As shown in FIGS. 5 and 6, spiral antenna patterns 62, 72, 82, and 92 are formed in each wiring layer in order from the first wiring layer. Each antenna pattern 62, 72, 82, 92 includes one inner end 62a, 72a, 82a, 92a and one outer end 62b, 72b, 82b, 92b. One inner connection terminal 63, 73, 83, 93 is connected to each of the inner ends 62a, 72a, 82a, 92a. One outer connection terminal 64, 74, 84, 94 is connected to each of the outer ends 62b, 72b, 82b, 92b. The inner connection terminals 63, 73, 83, and 93 are provided inside the spiral of the antenna pattern, and are arranged so that the inner terminals of the wiring layers connected to each other are overlapped at the same position. Each of the inner connection terminals 63, 73, 83, 93 is formed so that only one of the plurality of through-through holes 55a, 55b is conducted. The outer connection terminals 64, 74, 84, and 94 are provided at one of the four corners of the antenna substrate so that the outer terminals of the wiring layers connected to each other are in the same position. Each outer connection terminal 64, 74, 84, 94 is formed so that only one of the plurality of through-through holes 56a, 56b is conducted.

  In addition, wiring areas 69a, 69b, 79a, 79b, 89a, 89b, 99a, 99b having substantially right-angled isosceles triangles without through holes are formed at two of the four corners of each wiring layer. Has been. These are dummy patterns which are integrated with the spiral antenna pattern but may or may not be a component of the antenna.

  As shown in FIG. 5, the antenna pattern 62 of the first wiring layer and the antenna pattern 72 of the second wiring layer are connected via the through holes 56b that are electrically connected to the outer connection terminals 64 and 74 at the outer end of the spiral. Has been. The antenna pattern 72 of the second wiring layer and the antenna pattern 82 of the third wiring layer are connected to each other via a through hole 55a that is electrically connected to the inner connection terminals 73 and 83 at the inner end of the spiral. The antenna pattern 82 of the third wiring layer and the antenna pattern 92 of the fourth wiring layer are connected to each other via a through hole 56a electrically connected to the outer connection terminals 84 and 94 at the outer end of the spiral. The antenna pattern 92 of the fourth wiring layer and the antenna pattern 62 of the first wiring layer are connected to each other via the through holes 55b that are electrically connected to the inner connection terminals 93 and 63 at the inner end of the spiral.

  That is, each of the antenna patterns 62, 72, 82, and 92 is electrically connected in series via the connection terminals and the interlayer connection conductor as shown in FIG. A single antenna coil 52 having both terminals on the upper layer is formed. Specifically, one end of the antenna coil 52 is the inner connection terminal 63 (chip connection terminal 66a) of the first wiring layer, and the other end is a chip connection connected to the inner through-through hole 55b of the first wiring layer. Terminal 66b. Here, through-holes are used for connection between layers, but it is also possible to apply an interlayer connection method called B2it (registered trademark) that breaks through the interlayer insulation layer with a substantially conical conductor bump. It is. Thereby, it is possible to reduce the total number of manufacturing steps.

  Further, when the antenna patterns 62, 72, 82, 92 having the spiral shape are traced from one end of the antenna coil 52 along the connection relation of the antenna patterns, the swirling directions of the spirals are the same (for example, clockwise). Is clockwise, and counterclockwise is counterclockwise). That is, each antenna pattern is formed in a direction that does not cancel out the current generated when a magnetic field in a certain direction is received.

  The IC chip 51 is fixed on the chip mounting pad 55 using an adhesive. The electrode terminals 53a and 53b of the IC chip 51 are connected to chip connection terminals 66a and 66b via low-profile wires 54a and 54b, respectively. The chip connection terminal 66b is connected to the through hole 55b via the wiring 62c. Further, the IC chip 51 and the electrode terminals 53 a and 53 b of the IC chip 51 are sealed with a sealing resin 57.

  Here, the IC chip 51 is mainly composed of a read-only memory (ROM), a random access memory (RAM), a logic circuit, and a central processing unit (CPU) (not shown). The CPU executes various types of arithmetic processing such as communication control with a reader / writer and response processing using programs and data stored in the ROM and RAM. Further, the ROM stores a tag identification code which is identification information uniquely given to each non-contact type data carrier inlet 5 when the non-contact type data carrier inlet 5 is manufactured, and this tag identification code cannot be rewritten. It has become. The IC chip 51 is also equipped with a capacitor and the like in addition to a nonvolatile memory that is a rewritable storage circuit that does not require power backup and an RF circuit that is a communication control circuit for wireless communication.

  The non-contact type data carrier inlet 5 configured as described above has the unit antenna substrate 90 side (the bottom side of the non-contact type data carrier inlet 5 in FIG. 6) on which the antenna pattern 92 is wired as shown in FIGS. As shown, it is joined to the surface (upper surface) of the inlet mounting portion 3 of the pedestal portion 2 via an adhesive or the like. Here, in the above configuration, the unit antenna substrate 90 side is bonded to the pedestal portion 2, but the configuration is not limited to the configuration in which the unit antenna substrate 90 side is bonded to the pedestal portion 2 in this way. For example, the sealing resin 57 of the non-contact type data carrier inlet 5 is made the same size as the unit antenna substrate 90 and the surface is flattened so that the sealing resin 57 side is the surface of the inlet mounting portion 3 of the base portion 2. It is also possible to join to (upper surface) via an adhesive or the like. By applying such a structure, the object to be attached which can be made of metal, for example, and the antenna coil 52 can be further separated, thereby stabilizing the operation of the non-contact type data carrier inlet 5. Can be achieved.

  Further, in the non-contact type data carrier device 1a of the present embodiment, the outer size of the non-contact type data carrier inlet 5 as viewed from the direction orthogonal to the pattern surfaces of the antenna patterns 62, 72, 82, and 92 constituting the antenna coil 52. Is, for example, a size of 10 mm × 10 mm or less. Furthermore, the non-contact type data carrier device 1a includes a pedestal portion viewed from the same direction as the outer size of the non-contact type data carrier inlet 5 viewed from the direction orthogonal to the pattern surfaces of the antenna patterns 62, 72, 82, and 92. The outer size 2 is formed to be larger. In other words, the handleability of the entire non-contact type data carrier device 1a is enhanced by configuring the pedestal 2 larger than the small size non-contact type data carrier inlet 5 of 10 mm square or less as described above.

Next, a configuration for separating the non-contact type data carrier inlet 5 from the mounting object side of the base portion 2 made of insulating resin will be described with reference to FIGS. 2 and 6.
As shown in FIGS. 2 and 6, the shortest distance from the mounting surface of the pedestal 2 attached to the surface of the object to be attached to the antenna coil 52 included in the non-contact type data carrier inlet 5, that is, as shown in FIG. The height of the pedestal 2 (as a spacer) so that the separation distance h1 (see FIG. 2) from the surface (bottom surface) of the adhesive layer 12 to the pattern surface (bottom surface) of the antenna pattern 92 shown in FIG. Thickness) is defined. By setting the separation distance h1 to 2 mm or more, even if the object to be attached to which the non-contact type data carrier device 1a is attached is made of a conductor such as metal, the vortex on the object to be attached side during communication Generation of current is prevented, thereby realizing communication between the non-contact type data carrier device 1a side and the reader / writer side.

  2 to 4, an example in which the non-contact type data carrier device 1 a itself is arranged on the attachment target in a posture in which the surface of the adhesive layer 12 of the pedestal portion 2 is a horizontal surface is illustrated. However, instead of this, the non-contact type data carrier device 1a can be arranged on the object to be attached in such a posture that the surface of the adhesive layer 12 of the pedestal 2 is a vertical surface or an inclined surface. 2 to 4 show an example in which the surface of the inlet mounting portion 3 of the pedestal portion 2 is shown as a horizontal surface, and the non-contact type data carrier inlet 5 is placed in a horizontal position on this surface. However, instead of this, the surface of the inlet mounting portion 3 is formed by an inclined surface or a surface standing upright in the vertical direction, and the non-contact type data carrier inlet 5 is inclined in accordance with this, You may arrange | position with the attitude | position which stood up in the direction. Note that the mounting surface (adhesive layer) of the pedestal portion 2 that is mounted on the surface of the object to be mounted is also provided when the non-contact type data carrier inlet 5 is disposed in a vertically upright posture or is inclined obliquely. 12) to the antenna coil 52 is preferably set to 2 mm or more as described above.

  Here, the shortest distance from the mounting surface (bottom surface) of the pedestal 2 to the antenna coil 52 is 2 mm or more. When this distance is shorter than 2 mm, a suitable communication distance with the reader / writer cannot be obtained. Because. On the other hand, if this distance is 2 mm or more, a suitable communication distance with the reader / writer can be obtained, but considering the practical size of the non-contact type data carrier device 1a, for example, about 50 mm is set as the upper limit value. However, this value can be appropriately changed depending on the application.

  It is preferable that the shortest distance from the mounting surface (bottom surface) of the pedestal 2 to the antenna coil 52 is 2 mm or more. The antenna size (antenna patterns 62, 72, 82, The vertical and horizontal lengths of the outermost circumferential pattern of 92 are 4.75 mm × 4.75 mm. In the case of 5 mm × 5 mm, from the mounting surface (bottom surface) of the pedestal 2 to the antenna coil 52 If the shortest distance is 1 mm or more, even if the object to be attached to which the non-contact type data carrier device 1a is attached is made of a conductor such as metal, the eddy current on the object to be attached side during communication Thus, communication between the non-contact data carrier device 1a side and the reader / writer side is realized. In other words, the preferred separation distance h1 from the mounting surface of the base portion 2 to the antenna coil 52 varies depending on the size of the antenna coil 52 used in the non-contact type data carrier device 1a, but this separation distance h1 is 2 mm or more. Thus, even if the object to be attached is made of metal or the like for all antenna sizes of the non-contact type data carrier inlet 5 used in the non-contact type data carrier device 1a of the present embodiment Communication with the reader / writer can be performed without hindering communication of information.

  FIG. 7 shows a configuration in which the non-contact type data carrier inlet 5 is resin-sealed with epoxy resin or the like on the pedestal 2 (inlet mounting portion 3) for the non-contact type data carrier device 1a. A non-contact data carrier device 1b is shown. Examples of the resin sealing method include a transfer molding method. According to this non-contact type data carrier device 1b, the non-contact type data carrier inlet 5 can be protected from an external environment and mechanical stress.

  As described above, according to the non-contact type data carrier devices 1a and 1b of the present embodiment, the formation pattern of the antenna coil 52 is multilayered for the downsizing of the structure, and the attachment to the attached object side is further performed. By actively providing the pedestal portion 2 as a part for use, it is possible to reduce the size while improving the attachment property to the attachment target object. In addition, according to the non-contact type data carrier devices 1a and 1b of the present embodiment, for example, when the object to be attached is a metal, the height is such that the influence of eddy currents that can occur during communication can be ignored. Since the pedestal portion 2 is configured, it is possible to easily realize the use by attaching to a conductor such as metal without providing a magnetic part having a high magnetic permeability for preventing eddy current generation.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG.
Here, FIG. 8 is a sectional view showing a non-contact type data carrier device according to the second embodiment of the present invention. In FIG. 8, the same components as those provided in the non-contact data carrier devices 1a and 1b according to the first embodiment are given the same reference numerals, and descriptions thereof are omitted.

  As shown in FIG. 8, the non-contact type data carrier device 1c of this embodiment removes the adhesive layer 12 (and the release paper 11) from the non-contact type data carrier device 1b of the first embodiment shown in FIG. While being deleted, the base part 42 made of an insulating resin having a partial structure different from that of the base part 2 is applied. That is, instead of the adhesive layer 12, a screw (male screw member) 16 through which the screw insertion hole 7 on the pedestal portion 42 (base portion 48) is inserted is connected to the female screw portion 17 formed on the attachment target object 15 side. The non-contact type data carrier device 1c is attached to the attachment target 15 by screwing.

  Further, in the non-contact type data carrier device 1c of this embodiment, in order to set the shortest distance (separation distance h2) from the mounting surface of the pedestal portion (the bottom surface of the base portion 48) to the antenna coil 52 to 2 mm or more, bonding is performed. A pedestal portion 42 having a base portion 48 in which the base portion is thickened by the amount corresponding to the deletion of the layer 12 is applied. Therefore, also in the non-contact type data carrier device 1c of this embodiment, as in the first embodiment, it can be easily attached to the object 15 and can be used by being attached to a conductor such as metal. It becomes.

[Third Embodiment]
Next, a third embodiment of the present invention will be described with reference to FIG.
Here, FIG. 9 is a cross-sectional view showing a non-contact type data carrier device according to a third embodiment of the present invention. In FIG. 9, the same components as those provided in the non-contact data carrier devices 1a and 1b according to the first embodiment are given the same reference numerals, and the description thereof is omitted.

As shown in FIG. 9, the non-contact type data carrier device 1d of this embodiment has an adhesive layer 12 that forms the bottom of the base 2 of the non-contact type data carrier device 1b of the first embodiment shown in FIG. It is comprised in the form which attached the magnet 18 to the bottom face of. In the non-contact type data carrier device 1d, the shortest distance (separation distance h3) from the interface between the adhesive layer 12 at the bottom of the pedestal 2 and the magnet 18 to the antenna coil 52 is 2 mm or more. .
That is, according to the non-contact type data carrier device 1d according to the present embodiment, the attachment is easy when the object to be attached is a metal having magnetism, and the communication with the reader / writer side is preferable. Can be done.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described with reference to FIGS.
Here, FIG. 10 is a plan view showing a non-contact type data carrier device according to the fourth embodiment of the present invention, and FIG. 11 is a cross-sectional view of the non-contact type data carrier device shown in FIG. It is. Moreover, FIG. 12 is sectional drawing which shows the non-contact-type data carrier apparatus of the other structure based on 4th Embodiment. 10 to 12, the same components as those provided in the non-contact data carrier devices 1 a and 1 b of the first embodiment are given the same reference numerals, and the description thereof is omitted.

  First, as shown in FIG. 10 and FIG. 11, the non-contact type data carrier device 1e of this embodiment is partly different from the base 2 of the non-contact type data carrier device 1b of the first embodiment shown in FIG. A base portion 22 made of an insulating resin having a different structure is applied. In the non-contact type data carrier device 1e of this embodiment, the shortest distance (separation distance h4) from the mounting surface of the base portion 22 (the surface of the adhesive layer 12) to the antenna coil 52 is set to 2 mm or more. . Further, the pedestal portion 22 supports the support portions 6a, 6b, 6c, and 6d of the pedestal portion 2 of the first embodiment so that the inlet mounting portion 3 on which the non-contact type data carrier inlet 5 is mounted can be elastically supported. Elastically deforming portions 26a, 26b, 26c, and 26d having a spring property in the form of thinly formed.

  Therefore, according to the non-contact type data carrier device 1e, for example, even when an impact is applied from the attached object side to the non-contact type data carrier device 1e side, the impact force is applied to the elastic deformation portions 26a, 26b, 26c, 26d. Therefore, the damage on the non-contact type data carrier inlet 5 side including the IC chip 51 can be suppressed.

  FIG. 12 illustrates a non-contact data carrier device 1f to which a base portion 32 made of an insulating resin having a structure different from that of the base portion 22 is applied. Also in this non-contact type data carrier device 1f, the shortest distance (separation distance h5) from the mounting surface of the base portion 32 (the surface of the adhesive layer 12) to the antenna coil 52 is set to 2 mm or more. In addition, the pedestal portion 32 included in the non-contact type data carrier device 1f supports the inlet mounting portion 33 on which the non-contact type data carrier inlet 5 is mounted in a cantilever manner by an elastic deformation portion 36 having a spring property. Further, a claw portion 35 is formed at the tip of the inlet mounting portion 33 that is supported in a cantilever manner. The claw portion 35 is located on the inner side (elastic deformation portion 36), and the base portion 8 and the inlet mounting portion. A bundled wire portion 39 for bundling signal lines of electrical components, for example, is formed in a space portion sandwiched between 33.

  Therefore, according to the non-contact type data carrier device 1f, the impact force that can be applied to the non-contact type data carrier inlet 5 side can be suitably mitigated by the spring property of the cantilevered elastic deformation portion 36, and a bundle of signal lines and the like Can also be done.

[Fifth Embodiment]
Next, a fifth embodiment of the present invention will be described with reference to FIGS.
13 to 15 are cross-sectional views showing a non-contact data carrier device according to a fifth embodiment, each of which has a partially different configuration. 13 to 15, the same components as those provided in the contactless data carrier devices 1 a to 1 f of the first to fourth embodiments are denoted by the same reference numerals and the description thereof is omitted. To do.

  As shown in FIG. 13, the non-contact type data carrier device 1g is made of an insulating resin having a partly different structure from the pedestal 2 of the non-contact type data carrier device 1b of the first embodiment shown in FIGS. The pedestal 102 is provided. The pedestal portion 102 is provided with an inlet mounting portion 104 having, for example, a pair of claw portions 103 on a base portion 108 having an adhesive layer 12 with a release paper 11 at the bottom. The inlet mounting portion 104 is formed as a gap portion for accommodating the non-contact type data carrier inlet 5 in the pedestal portion 102. The non-contact type data carrier inlet 5 is mounted in the inlet mounting portion 104 from the thickness direction so that the pair of claws 103 are temporarily bent.

  As shown in FIG. 14, the non-contact type data carrier device 1 h includes a pedestal portion 112 in which an inlet mounting portion 114 having a claw portion 113 is provided on a base portion 118. The claw portion 113 is provided on the side portion of the inlet mounting portion 114. That is, the non-contact type data carrier inlet 5 is slid from a direction orthogonal to the thickness direction so that the claw portion 113 is temporarily bent, and the inlet mounting portion 114 which is a gap portion in the pedestal portion 112. It is mounted (contained) inside.

  As shown in FIG. 15, the non-contact type data carrier device 1 i has a pedestal part 122 in which an inlet mounting part 124 having a pair of claw parts 123 is provided on a base part 128, for example. The pedestal portion 122 is screwed to the attachment target 15 side through a female screw portion 17 that is screwed with a screw (male screw member) 16 inserted into the screw insertion hole 7 of the base portion 128. The pair of claws 123 are temporarily bent, and the non-contact data carrier inlet 5 is mounted (accommodated) in the inlet mounting portion 124 from the thickness direction.

  Therefore, according to the non-contact type data carrier devices 1g to 1i according to the present embodiment, the integration of the non-contact type data carrier inlet 5 and the pedestal portions 102, 112, and 122 is performed by mounting work that is mechanical fitting. Since it is realizable, an adhesive agent etc. become unnecessary for mutual joining, and the productivity of a non-contact-type data carrier apparatus main body can be improved. In addition, according to the non-contact type data carrier devices 1g to 1i of the present embodiment, the non-contact type data carrier inlet 5 is relatively strong on the pedestal side by the claw portions provided in the inlet mounting portions 104, 114, and 124. Therefore, it is possible to prevent the non-contact type data carrier inlet 5 from being removed from the pedestal portion side and lost, for example.

  Here, also in these non-contact type data carrier devices 1g to 1i of the present embodiment, from the attachment surface (the bottom surface of the adhesive layer 12 or the bottom surface of the pedestal portion 122) of the pedestal portions 102, 112, 122 to the attachment target object. The shortest distance (separation distances h6, h7, h8) from the non-contact type data carrier inlet 5 to the antenna coil 52 is 2 mm or more. 13 to 15 illustrate a mode in which the non-contact type data carrier inlet 5 is disposed substantially parallel to the mounting surfaces of the pedestals 102, 112, and 122. However, the non-contact type data carrier inlet 5 is illustrated. The structure of the inlet mounting portion described above may be modified so that it can be disposed obliquely or can be disposed in an upright posture orthogonal to the mounting surfaces of the pedestal portions 102, 112, and 122. Further, even when the non-contact type data carrier inlet 5 is disposed in an inclined manner as described above, or when it is disposed in an upright posture, the antenna coil is mounted from the mounting surface of the pedestal portions 102, 112, 122 to the mounted object. The shortest distance to 52 is preferably 2 mm or more. Moreover, you may arrange | position a magnet in the bottom part of the contact bonding layer 12 of the non-contact-type data carrier apparatuses 1g and 1h shown in FIG.13 and FIG.14. When the magnet is disposed, it is preferable that the shortest distance from the interface between the adhesive layer and the magnet to the antenna coil 52 is 2 mm or more.

[Sixth Embodiment]
Next, a sixth embodiment of the present invention will be described with reference to FIGS.
16 to 18 are cross-sectional views showing a non-contact type data carrier device according to a sixth embodiment, which is partially different in configuration. 16 to 18, the same components as those provided in the non-contact data carrier devices 1 a to 1 i of the first to fifth embodiments are denoted by the same reference numerals and description thereof is omitted. To do.

  As shown in FIGS. 16 to 18, the non-contact type data carrier devices 1 j, 1 k, 1 m according to this embodiment extend from the attachment surface to the attachment target 15 to the antenna coil 52 of the non-contact type data carrier inlet 5. Pedestal portions 132, 142 for holding the non-contact type data carrier inlet 5 so as to surround the non-contact type data carrier inlet 5 with the attachment target 15 while taking the shortest distances h9, h10, h11 of 2 mm or more. 152 respectively.

  These pedestal portions 132, 142, and 152 are screwed to the attachment target 15 side through female screw portions 17 that are screwed into screws (male screw members) 16 that are inserted into the screw insertion holes 7 of the base portion 133. Yes. The pedestal portions 132, 142, and 152 are provided with inlet holding portions 138, 148, and 158 that directly hold the non-contact type data carrier inlet 5 on the attachment target 15 side (inside).

  More specifically, in the pedestal portion 132 of the non-contact type data carrier device 1j, as shown in FIG. 16, the non-contact type data carrier inlet 5 is joined to the inside of the inlet holding portion 138 using, for example, an adhesive. Yes. Further, as shown in FIG. 17, in the non-contact type data carrier device 1k, a resin sealing part that seals the pedestal part 142 and the non-contact type data carrier inlet 5 by, for example, injection molding using an insulating resin material, That is, the inlet holding part 148 is integrally formed. According to this non-contact type data carrier device 1k, the manufacturing process can be simplified by integral molding of the resin sealing portion and the pedestal portion using injection molding. Further, as shown in FIG. 18, an inlet mounting portion 154 having a pair of claw portions 153 is provided in the inlet holding portion 158 in the pedestal portion 152 of the non-contact type data carrier device 1 m. That is, the non-contact type data carrier inlet 5 is held by the inlet holding portion 158 so as to be mounted in the inlet mounting portion 154 formed as a gap portion.

  Further, the inlet holding portions 138, 148, 158 for holding the non-contact type data carrier inlet 5 are formed to have a relatively thin wall thickness in substantially the same manner as the non-contact type data carriers 1e, 1f of the fourth embodiment. And it is supported by the elastic deformation part 136 which gave spring property.

  Therefore, according to the non-contact type data carrier devices 1j, 1k, and 1m of the present embodiment configured as described above, for example, even when an impact is applied from the attached object 15 side to the non-contact type data carrier device 1e side. Since the impact force can be alleviated by the spring property of the elastic deformation portion 156, damage on the non-contact type data carrier inlet 5 side including the IC chip 51 can be suppressed. Further, according to the non-contact type data carrier devices 1j, 1k, and 1m of the present embodiment, the non-contact type data carrier inlet 5 is externally attached by the inlet holding portions 138, 148, and 158 of the pedestal portions 132, 142, and 152. Since it is held so as to be covered, the non-contact type data carrier inlet 5 can be protected from the external environment and mechanical stress.

  The present invention has been specifically described above with reference to the embodiments. However, the present invention is not limited to these embodiments, and various modifications can be made without departing from the scope of the invention. For example, the above-described pedestal portion may be made of an electrically insulating material other than the insulating resin material.

  Moreover, in the non-contact type data carrier apparatus of embodiment described using FIGS. 7-15, the unit antenna board | substrate 90 (refer FIG. 5) side of the non-contact-type data carrier inlet 5 is attached to the to-be-attached target object (FIG. Although the example of a structure joined with the base part side toward the lower side of FIGS. 7-15 was demonstrated, this invention is not limited to this structure. That is, instead of such a configuration, the non-contact type data carrier inlet 5 and the pedestal portion may be joined to each other with the sealing resin 14 side of the non-contact type data carrier inlet 5 facing the attached object side. Is possible. Here, in the case of applying bonding using an adhesive or the like, it is desirable that the bonding surface of the sealing resin 14 bonded to the pedestal portion is flattened. By applying such a structure, for example, the object to be attached which can be made of metal or the like and the antenna coil can be further separated, thereby stabilizing the operation of the non-contact type data carrier inlet 5. Can be planned. In addition, in the non-contact type data carrier device having the structure illustrated in FIGS. 7 to 12, a configuration in which the unit antenna substrate 90 side of the non-contact type data carrier inlet 5 is joined to the pedestal portion toward the attached object side. Is applied, the sealing resin 14 (resin sealing) for further sealing the IC chip 51 sealed with the sealing resin 57 (see FIGS. 5 and 6) from the outside is shown in FIGS. It is also possible to delete as in the embodiment shown in FIG.

  Further, in the non-contact type data carrier device of the sixth embodiment described with reference to FIGS. 16 to 18, the sealing resin 14 side of the non-contact type data carrier inlet 5 is directed toward the attachment target object 15 side. Although the configuration in which the contact type data carrier inlet 5 and the pedestal portion are integrated is illustrated, instead of this, the unit antenna board 90 (see FIG. 5) side of the non-contact type data carrier inlet 5 is connected to the attachment target 15 side. For this, a configuration in which the non-contact type data carrier inlet 5 and the pedestal portion are integrated can also be applied. In addition, in the non-contact type data carrier device having the structure illustrated in FIG. 16, a configuration in which the unit antenna substrate 90 side of the non-contact type data carrier inlet 5 is directed to the mounted object 15 side and the base part is applied. In this case, it is possible to delete the sealing resin 14 that further seals the IC chip 51 sealed with the sealing resin 57 (see FIGS. 5 and 6) from the outside.

[Example]
Next, an example explains the present invention.
That is, in this example, in the non-contact type data carrier device of the first to sixth embodiments shown in FIGS. 1 to 18, the mounting surface of the pedestal portion attached to the surface of the object to be attached (see FIG. 9). In the non-contact type data carrier device 1d of the third embodiment shown, the shortest distance from the antenna coil 52 provided in the non-contact type data carrier inlet 5 to the interface between the adhesive layer 12 and the magnet 18 at the bottom of the pedestal 2 is determined. The reason why the thickness is preferably 2 mm or more will be described.

  That is, a non-contact type data carrier inlet was installed on a metal plate via a spacer portion that can change the thickness by adjusting the number of laminated plate-like spacers. This plate-like spacer is made of polypropylene (PP), and the thickness of one sheet is 1 mm. The non-contact type data carrier inlet uses an antenna size (vertical and horizontal lengths of the outermost peripheral pattern of the antenna pattern constituting the antenna coil) of 4.75 mm × 4.75 mm, 5 mm × 5 mm. It was.

  By adjusting the number of stacked plate spacers, the distance between the surface of the metal plate and the pattern surface of the antenna coil of the non-contact data carrier inlet facing the surface of the metal plate can be changed to measure the communication distance. Carried out. Here, the measurement of the communication distance was carried out by changing the position of the reader / writer (manufactured by Takaya; output 10 mW) on the pattern surface of the antenna coil of the non-contact type data carrier inlet and the upper position facing it. The communication distance here is the distance between the reader / writer and the pattern surface of the antenna coil of the non-contact type data carrier inlet facing the reader / writer.

  FIG. 19 shows the measurement result of the communication distance. As shown in FIG. 19, in both cases where the antenna size is 4.75 mm × 4.75 mm and 5 mm × 5 mm, the distance between the surface of the metal plate and the pattern surface of the antenna coil is 2 mm or more and 10 mm or more. The communication distance was obtained. When the antenna size was 5 mm × 5 mm, the distance between the surface of the metal plate and the pattern surface of the antenna coil was 1 mm or more, and a communication distance of 5 mm or more was obtained.

  From this measurement result, even when the non-contact type data carrier device is attached to the metal surface, the distance between the surface of the metal plate and the pattern surface of the antenna coil is set to 2 mm or more, which is suitable for the reader / writer. It was found that the communication distance can be obtained. It was also found that when the antenna size was 5 mm × 5 mm, the distance between the surface of the metal plate and the pattern surface of the antenna coil was 1 mm, and a suitable communication distance with the reader / writer was already obtained.

1 is a plan view showing a non-contact type data carrier device according to a first embodiment of the present invention. The front view of the non-contact-type data carrier apparatus shown in FIG. FIG. 2 is a cross-sectional view of the non-contact type data carrier device shown in FIG. BB sectional drawing of the non-contact-type data carrier apparatus shown in FIG. The disassembled perspective view which shows the structure of the non-contact-type data carrier inlet with which the non-contact-type data carrier apparatus of FIG. 1 is provided. Sectional drawing of the non-contact-type data carrier inlet shown in FIG. Sectional drawing which shows the non-contact-type data carrier apparatus of the other structure which concerns on 1st Embodiment. Sectional drawing which shows the non-contact-type data carrier apparatus which concerns on the 2nd Embodiment of this invention. Sectional drawing which shows the non-contact-type data carrier apparatus which concerns on the 3rd Embodiment of this invention. The top view which shows the non-contact-type data carrier apparatus which concerns on the 4th Embodiment of this invention. CC sectional drawing of the non-contact-type data carrier apparatus shown in FIG. Sectional drawing which shows the non-contact-type data carrier apparatus of the other structure which concerns on 4th Embodiment. Sectional drawing which shows the non-contact-type data carrier apparatus which concerns on the 5th Embodiment of this invention. FIG. 14 is a cross-sectional view showing another non-contact type data carrier device having a configuration different from that of the non-contact type data carrier device shown in FIG. 13 in the fifth embodiment. FIG. 15 is a cross-sectional view showing another non-contact type data carrier device having a configuration different from that of the non-contact type data carrier device shown in FIGS. 13 and 14 in the fifth embodiment. Sectional drawing which shows the non-contact-type data carrier apparatus which concerns on the 6th Embodiment of this invention. FIG. 17 is a cross-sectional view showing another non-contact type data carrier device having a configuration different from that of the non-contact type data carrier device shown in FIG. 16 in the sixth embodiment. FIG. 18 is a cross-sectional view showing another non-contact type data carrier device having a configuration different from that of the non-contact type data carrier device shown in FIGS. 16 and 17 in the sixth embodiment. The figure which shows the measurement result of the communication distance in the Example of this invention.

Explanation of symbols

  1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 1j, 1k, 1m ... non-contact data carrier device, 2, 22, 32, 42, 102, 112, 122, 132, 142, 152 ... base part, 5 ... non-contact data carrier inlet, 7 ... screw insertion hole, 26a, 26b, 26c, 26d, 36, 136 ... elastic deformation part, 12 ... adhesive layer, 14, 57 ... sealing resin, 15 ... 16 ... screw (male screw member), 17 ... female screw portion, 18 ... magnet, 51 ... IC chip, 52 ... antenna coil, 62,72,82,92 ... antenna pattern, 104,114,124,154 ... Inlet mounting part, 103, 113, 123, 153 ... Claw part.

Claims (10)

  1. Non-contact including an antenna coil having a multi-layer structure formed by connecting antenna patterns provided in a plurality of layers, and an IC chip mounted with at least a memory circuit and a communication control circuit connected to the antenna coil Formula data carrier inlet,
    Holders of Bei and the base portion made of an insulating resin, a having a function of separating the non-contact data carrier inlet while supporting the non-contact data carrier inlet from the attachment object side,
    The pedestal portion includes an elastically deformable portion having a spring property,
    Non-contact data carrier device comprising a call.
  2.   The shortest distance from the attachment surface of the said base part attached to the surface of the said to-be-attached target object to the said antenna coil with which the said non-contact-type data carrier inlet is provided is 2 mm or more, The non-character of Claim 1 characterized by the above-mentioned. Contact data carrier device.
  3.   3. The non-contact type data carrier device according to claim 1, wherein the non-contact type data carrier inlet is resin-sealed on the pedestal portion.
  4.   3. The non-molding device according to claim 1, wherein the base portion and a resin sealing portion that seals the non-contact type data carrier inlet are integrally formed by injection molding using an insulating resin material. Contact data carrier device.
  5. The non-contact type data carrier device according to any one of claims 1 to 3 , wherein the pedestal portion further includes an inlet mounting portion having a claw portion to which the non-contact type data carrier inlet is mounted. .
  6. The non-contact type data carrier device according to any one of claims 1 to 5 , wherein a bottom portion of the pedestal portion is formed of an adhesive layer.
  7. The non-contact type data carrier device according to any one of claims 1 to 6 , wherein the pedestal portion is provided with a screwing hole.
  8. The non-contact type data carrier device according to any one of claims 1 to 7 , wherein a magnet is provided on the attachment surface of the pedestal portion attached to the attached object side.
  9. The external size of the non-contact data carrier inlet as viewed from a direction perpendicular to the surface of the antenna coil according to claim 1 to a non according to any one of 8, characterized in that a size below 10 mm × 10 mm Contact data carrier device.
  10. Any of the above seen from the direction perpendicular to the surface of the antenna coil than the outer size of the non-contact data carrier inlet, claims 1, characterized in that towards the outer size of the base portion viewed from the same direction is large 9 The non-contact type data carrier device according to 1.
JP2005372741A 2005-12-26 2005-12-26 Non-contact data carrier device Expired - Fee Related JP4848764B2 (en)

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Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7519328B2 (en) 2006-01-19 2009-04-14 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
CN101467209B (en) 2006-06-30 2012-03-21 株式会社村田制作所 Optical disc
DE112007002024B4 (en) 2006-09-26 2010-06-10 Murata Mfg. Co., Ltd., Nagaokakyo-shi An inductively coupled module and element inductively coupled module
AT540377T (en) 2007-04-26 2012-01-15 Murata Manufacturing Co Wireless ic device
EP2148449B1 (en) 2007-05-11 2012-12-12 Murata Manufacturing Co., Ltd. Wireless ic device
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
EP2166617B1 (en) 2007-07-09 2015-09-30 Murata Manufacturing Co. Ltd. Wireless ic device
CN101578616A (en) 2007-07-17 2009-11-11 株式会社村田制作所 Wireless IC device and electronic apparatus
EP2568419B1 (en) 2007-07-18 2015-02-25 Murata Manufacturing Co., Ltd. Apparatus comprising an RFID device
EP2096709B1 (en) 2007-12-20 2012-04-25 Murata Manufacturing Co., Ltd. Radio ic device
EP2557528A3 (en) 2007-12-26 2017-01-18 Murata Manufacturing Co., Ltd. Antenna device and wireless IC device
EP2251934B1 (en) 2008-03-03 2018-05-02 Murata Manufacturing Co. Ltd. Wireless ic device and wireless communication system
CN103295056B (en) 2008-05-21 2016-12-28 株式会社村田制作所 Wireless device ic
CN104077622B (en) 2008-05-26 2016-07-06 株式会社村田制作所 Authenticity wireless systems and wireless devices ic ic device determination method
KR101148534B1 (en) 2008-05-28 2012-05-21 가부시키가이샤 무라타 세이사쿠쇼 Wireless ic device and component for a wireless ic device
EP2320519B1 (en) 2008-08-19 2017-04-12 Murata Manufacturing Co., Ltd. Wireless ic device and method for manufacturing same
JP5429182B2 (en) 2008-10-24 2014-02-26 株式会社村田製作所 Wireless IC device
CN102197537B (en) 2008-10-29 2014-06-18 株式会社村田制作所 Wireless IC device
DE112009002384T5 (en) 2008-11-17 2012-05-16 Murata Manufacturing Co., Ltd. Antenna and wireless ic component
CN102273012B (en) 2009-01-09 2013-11-20 株式会社村田制作所 Wireless IC device, wireless IC module and wireless IC module manufacturing method
CN103594455A (en) 2009-01-16 2014-02-19 株式会社村田制作所 Wireless IC device
EP2385580B1 (en) 2009-01-30 2014-04-09 Murata Manufacturing Co., Ltd. Antenna and wireless ic device
WO2010119854A1 (en) 2009-04-14 2010-10-21 株式会社村田製作所 Component for wireless ic device and wireless ic device
JP4687832B2 (en) 2009-04-21 2011-05-25 株式会社村田製作所 Antenna device
JP5447515B2 (en) 2009-06-03 2014-03-19 株式会社村田製作所 Wireless IC device and manufacturing method thereof
JP5516580B2 (en) 2009-06-19 2014-06-11 株式会社村田製作所 Wireless IC device and method for coupling power feeding circuit and radiation plate
WO2011001709A1 (en) 2009-07-03 2011-01-06 株式会社村田製作所 Antenna and antenna module
WO2011037234A1 (en) 2009-09-28 2011-03-31 株式会社村田製作所 Wireless ic device and method for detecting environmental conditions using same
CN102577646B (en) 2009-09-30 2015-03-04 株式会社村田制作所 Circuit substrate and method of manufacture thereof
JP5304580B2 (en) 2009-10-02 2013-10-02 株式会社村田製作所 Wireless IC device
WO2011045970A1 (en) 2009-10-16 2011-04-21 株式会社村田製作所 Antenna and wireless ic device
WO2011052310A1 (en) 2009-10-27 2011-05-05 株式会社村田製作所 Transmitting/receiving apparatus and wireless tag reader
WO2011055703A1 (en) 2009-11-04 2011-05-12 株式会社村田製作所 Communication terminal and information processing system
CN102473244B (en) 2009-11-04 2014-10-08 株式会社村田制作所 Ic wireless tag, the reader and the information processing system
GB2487315B (en) 2009-11-04 2014-09-24 Murata Manufacturing Co Communication terminal and information processing system
CN102576929B (en) 2009-11-20 2015-01-28 株式会社村田制作所 The antenna device and a mobile communication terminal
WO2011077877A1 (en) 2009-12-24 2011-06-30 株式会社村田製作所 Antenna and handheld terminal
JP5652470B2 (en) 2010-03-03 2015-01-14 株式会社村田製作所 Wireless communication module and wireless communication device
CN102782937B (en) 2010-03-03 2016-02-17 株式会社村田制作所 The wireless communication device and a radio communication terminal
CN102576940B (en) 2010-03-12 2016-05-04 株式会社村田制作所 The wireless communication device and a metal article
JP5370581B2 (en) 2010-03-24 2013-12-18 株式会社村田製作所 RFID system
JP5630499B2 (en) 2010-03-31 2014-11-26 株式会社村田製作所 Antenna apparatus and wireless communication device
JP5170156B2 (en) 2010-05-14 2013-03-27 株式会社村田製作所 Wireless IC device
JP5299351B2 (en) 2010-05-14 2013-09-25 株式会社村田製作所 Wireless IC device
WO2012005278A1 (en) 2010-07-08 2012-01-12 株式会社村田製作所 Antenna and rfid device
GB2495418B (en) 2010-07-28 2017-05-24 Murata Manufacturing Co Antenna apparatus and communication terminal instrument
JP5423897B2 (en) 2010-08-10 2014-02-19 株式会社村田製作所 Printed wiring board and wireless communication system
JP5234071B2 (en) 2010-09-03 2013-07-10 株式会社村田製作所 RFIC module
WO2012043432A1 (en) 2010-09-30 2012-04-05 株式会社村田製作所 Wireless ic device
CN103053074B (en) 2010-10-12 2015-10-21 株式会社村田制作所 The antenna device and communication terminal apparatus
JP5527422B2 (en) 2010-10-21 2014-06-18 株式会社村田製作所 Communication terminal device
JP5510560B2 (en) 2011-01-05 2014-06-04 株式会社村田製作所 Wireless communication device
CN103299325B (en) 2011-01-14 2016-03-02 株式会社村田制作所 Rfid rfid tag chip package, and
CN103119786B (en) 2011-02-28 2015-07-22 株式会社村田制作所 The wireless communication device
JP5630566B2 (en) 2011-03-08 2014-11-26 株式会社村田製作所 Antenna device and communication terminal device
EP2618424A4 (en) 2011-04-05 2014-05-07 Murata Manufacturing Co Wireless communication device
JP5482964B2 (en) 2011-04-13 2014-05-07 株式会社村田製作所 Wireless IC device and wireless communication terminal
JP5569648B2 (en) 2011-05-16 2014-08-13 株式会社村田製作所 Wireless IC device
EP2683031B1 (en) 2011-07-14 2016-04-27 Murata Manufacturing Co., Ltd. Wireless communication device
CN103370886B (en) 2011-07-15 2015-05-20 株式会社村田制作所 The wireless communication device
CN204189963U (en) 2011-07-19 2015-03-04 株式会社村田制作所 The antenna apparatus and a communication terminal apparatus
WO2013035821A1 (en) 2011-09-09 2013-03-14 株式会社村田製作所 Antenna device and wireless device
CN103380432B (en) 2011-12-01 2016-10-19 株式会社村田制作所 Ic wireless device and manufacturing method thereof
WO2013115019A1 (en) 2012-01-30 2013-08-08 株式会社村田製作所 Wireless ic device
JP4978857B1 (en) 2012-01-31 2012-07-18 株式会社プロビデント RFID tag
JP5464307B2 (en) 2012-02-24 2014-04-09 株式会社村田製作所 Antenna device and wireless communication device
JP5304975B1 (en) 2012-04-13 2013-10-02 株式会社村田製作所 RFID tag inspection method and inspection apparatus
WO2017072963A1 (en) * 2015-10-30 2017-05-04 株式会社Iro Tag to be attached to bolt, bolt with built-in ic tag, and bolt to which tag is to be attached

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11227935A (en) * 1998-02-16 1999-08-24 Mitsubishi Heavy Ind Ltd Non-contact tag fixture
JP2001024145A (en) * 1999-07-13 2001-01-26 Shinko Electric Ind Co Ltd Semiconductor device and its manufacture
JP2001330014A (en) * 2000-05-24 2001-11-30 Fukui Byora Co Ltd Rivet having non-contact ic tag
JP2001356688A (en) * 2000-06-09 2001-12-26 Toshiba Corp Information management method for container, mounting method and mounting device for radio information memory medium

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