JP6288350B2 - Surface mount antenna and electronic equipment - Google Patents

Description

  The present invention relates to a surface mount antenna, and more particularly to a surface mount antenna used in a communication system such as an HF band. The present invention also relates to an electronic device, and more particularly to an electronic device used in a communication system such as an HF band.

  Conventionally, various surface mount type coil antennas used in HF communication systems have been devised.

  For example, Patent Document 1 discloses a magnetic layer in which a plurality of magnetic bodies are stacked, a coil conductor wound with the winding axis direction aligned with a direction orthogonal to the stacking direction of the magnetic layers, and a magnetic layer. A coil antenna including a dielectric layer laminated on the outer layer is disclosed. Patent Document 2 discloses a coil having a core having a magnetic layer, a linear conductor portion, and a plurality of via-hole conductor portions, the winding axis being parallel to the main surface of the core. A coil antenna with a conductor is disclosed.

International Publication No. 2013/094667 International Publication No. 2013/168558

  However, in the coil antennas shown in Patent Documents 1 and 2, the mounting surface for the printed wiring board or the like and the winding axis are parallel. Therefore, it is mounted (arranged) on the printed wiring board or the like so that the winding axis of the coil antenna is parallel to the main surface of the printed wiring board or the like. However, in the above configuration, other electronic components mounted on the main surface such as a printed wiring board and surrounding structures are unnecessarily coupled to the coil antenna, so that there is little magnetic flux interlinking with the coil antenna on the communication partner side. Become. For this reason, the coupling coefficient with the communication-side antenna is lowered, and as a result, the communication characteristics of the coil antenna are lowered.

  An object of the present invention is to provide a surface-mounted antenna having excellent communication characteristics and directivity above a direction along a mounting surface, and an electronic device including the surface-mounted antenna.

(1) The surface mount antenna of the present invention is
A substrate having first main surface as a real Somen, and a second major surface opposite the first major surface,
A helical coil conductor formed on the substrate and having a winding axis in a direction along the first main surface and the second main surface;
With
The coil conductor has a first main surface side conductor and a second main surface side conductor,
The length in the winding axis direction of the formation region of the first main surface side conductor at the same position as viewed from the second main surface, and the length in the winding axis direction of the formation region of the second main surface side conductor. The length in the winding axis direction of the formation region of the second main surface side conductor is shorter than the length in the winding axis direction of the formation region of the first main surface side conductor in comparison with the length. It is characterized by having.

  In this configuration, not only the direction along the mounting surface, but also the magnetic flux entering and exiting diagonally above the surface-mounted antenna can be linked to the coil opening of the coil conductor, so that it is above the direction along the mounting surface. A surface-mounted antenna having directivity can be realized. Therefore, even when a surface-mounted antenna is mounted on a printed wiring board or the like, the magnetic flux interlinking with the coil opening of the coil conductor is caused by other electronic components mounted on the main surface of the printed wiring board or the like and surrounding structures. It is possible to suppress the obstruction. In addition, since the effective coil opening that functions as an antenna increases, the range and distance for radiating (collecting) magnetic flux increases, and it becomes easy to couple with the coil antenna on the communication partner side. Therefore, a surface mount antenna having excellent communication characteristics can be realized without using a large coil.

(2) In the above (1), the base material is a resin member, and a portion of the coil conductor that extends from the first main surface to the second main surface is the first main surface of the base material. It is preferable that the metal post reaches the second main surface. In this configuration, since the metal post is used for a part of the pattern constituting the coil conductor, it is not necessary to form a coil on the multilayer substrate, and it is not necessary to route complicated wiring. Therefore, it is possible to easily realize a coil structure having a relatively large height dimension and excellent freedom in designing the coil opening size. In addition, since the resistance of the coil conductor can be reduced, a highly sensitive surface mount antenna or a small surface mount antenna can be obtained for high sensitivity.

  Furthermore, since a portion having a relatively large height can be formed by a metal post, for example, compared with a case where a plurality of base material layers having interlayer conductors are stacked to form a connection portion in the height direction. And the electrical reliability of the coil conductor is increased.

(3) In the above (1), the base material is a laminate of a plurality of base material layers, and a portion of the coil conductor that extends from the first main surface to the second main surface is the base material. It may be an interlayer conductor formed in the layer.

(4) In any one of the above (1) to (3), it is preferable that the base material has a magnetic member (for example, a magnetic ferrite material) constituting a magnetic core. With this configuration, a surface mount antenna having a predetermined inductance value can be obtained without increasing the size of the coil.

(5) In the above (4), the coil conductor may be configured such that portions of the base material reaching the first main surface and the second main surface are formed inside the magnetic member. In this configuration, the portion of the coil conductor that reaches the first main surface and the second main surface of the base material is embedded in the magnetic member, so that radiation of the magnetic field from the side surface of the base material is suppressed by the shielding effect. Therefore, unnecessary coupling with other electronic components mounted on the main surface such as a printed wiring board and surrounding structures is suppressed.

(6) The electronic device of the present invention
The surface mount antenna according to any one of (1) to (5) above;
A power feeding circuit connected to a coil conductor of the surface mount antenna;
Is provided.

  With this configuration, it is possible to realize an electronic device including a surface mount antenna used for a communication system in the HF band or the UHF band.

(7) In the above (6), the surface-mounted antenna is preferably surface-mounted in the substrate in a plan view of the substrate. With this configuration, it is difficult to be influenced by other conductive members near the edge of the substrate.

(8) In the above (6), the surface mount antenna is preferably surface mounted on the substrate together with other electronic components. With this configuration, the surface mount antenna can be easily provided in the electronic apparatus together with other electronic components without providing a substrate dedicated to the antenna.

  According to the present invention, it is possible to realize a surface mount antenna having excellent communication characteristics and directivity above the direction along the mounting surface. In addition, an electronic device including the surface mount antenna can be realized.

FIG. 1 is an external perspective view of a surface mount antenna 101 according to the first embodiment. 2A is a plan view of the surface-mounted antenna 101, FIG. 2B is a bottom view of the surface-mounted antenna 101, and FIG. 2C is a cross-sectional view taken along the line AA in FIG. FIG. FIG. 3A is a plan view of the surface-mounted antenna 101 showing the formation area PA2 of the second linear conductor patterns 51A to 51E, viewed from the second main surface VS2 (through the −Z direction). FIG. FIG. 3B is a plan view of the surface-mounted antenna 101 showing the formation area PA1 of the first linear conductor patterns 21A to 21D, as viewed from the second main surface VS2 (through the −Z direction). FIG. FIG. 3C is a diagram for comparing the formation area PA1 of the first linear conductor patterns 21A to 21D and the formation area PA2 of the second linear conductor patterns 51A to 51E. FIG. 4A is a plan view showing the operating principle of the surface-mounted antenna 101 according to the first embodiment, and FIG. 4B is a cross-sectional view showing the operating principle of the surface-mounted antenna 101. FIG. 5 is a cross-sectional view showing a path of magnetic flux interlinking with the coil opening of the coil conductor when the surface-mounted antenna 101 is mounted on the circuit board 80. 6A is a plan view of the surface-mounted antenna 102A according to the second embodiment, FIG. 6B is a bottom view of the surface-mounted antenna 102A, and FIG. It is BB sectional drawing in (A) and FIG. 6 (B). FIG. 7A is a plan view of a surface mount antenna 102B according to the second embodiment, FIG. 7B is a bottom view of the surface mount antenna 102B, and FIG. It is CC sectional drawing in (A) and FIG.7 (B). FIG. 8A is a plan view of the surface mount antenna 103 according to the third embodiment, FIG. 8B is a bottom view of the surface mount antenna 103, and FIG. It is DD sectional drawing in (A) and FIG. 8 (B). FIG. 9A is a plan view of the surface-mounted antenna 104 according to the fourth embodiment, FIG. 9B is a bottom view of the surface-mounted antenna 104, and FIG. It is EE sectional drawing in (A) and FIG. 9 (B). FIG. 10 is an external perspective view of a surface mount antenna 105 according to the fifth embodiment. FIG. 11A is a plan view of the surface-mounted antenna 105, FIG. 11B is a bottom view of the surface-mounted antenna 105 with the second base material layer 12 removed, and FIG. It is a bottom view of the surface mount antenna 105. FIG. 12 is a cross-sectional view taken along line FF in FIGS. 11A, 11B, and 11C. FIG. 13 is an external perspective view of a wireless IC device 201 according to the fifth embodiment. 14A is a plan view of the wireless IC device 201, FIG. 14B is a bottom view of the wireless IC device 201, and FIG. 14C is a plan view of the substrate 4 (the first main surface PS1). View). FIG. 15 is a circuit diagram of the wireless IC device 201. FIG. 16 is a perspective view of an electronic device 301 according to the sixth embodiment. FIG. 17 is a cross-sectional view of the electronic device 301. FIG. 18 is a partially enlarged view of FIG. FIG. 19 is a perspective view of the booster antenna 120. FIG. 20 is a circuit diagram of the booster antenna 120.

  Hereinafter, several specific examples will be given with reference to the drawings to show a plurality of modes for carrying out the present invention. In each figure, the same reference numerals are assigned to the same portions. Each embodiment is an exemplification, and a partial replacement or combination of the configurations shown in different embodiments is possible.

<< First Embodiment >>
FIG. 1 is an external perspective view of a surface mount antenna 101 according to the first embodiment. 2A is a plan view of the surface-mounted antenna 101, FIG. 2B is a bottom view of the surface-mounted antenna 101, and FIG. 2C is a cross-sectional view taken along the line AA in FIG. FIG. Note that in FIG. 2C, the thickness of each portion is exaggerated. The same applies to the sectional views in the following embodiments.

  The surface-mounted antenna 101 includes a base material 1 having a first main surface VS1 and a second main surface VS2 facing the first main surface VS1, and a coil conductor (described in detail later) formed on the base material 1. Prepare. In the present invention, the first main surface VS1 corresponds to a “mounting surface”, and the second main surface VS2 corresponds to a “top surface”.

  The base material 1 is a rectangular parallelepiped insulator whose longitudinal direction matches the lateral direction (X direction in FIG. 2A). As shown in FIG. 1, the base material 1 is a laminate of a first base material layer 11, a second base material layer 12, and a third base material layer 13, and both main surfaces (first surfaces) of the first base material layer 11. 1 main surface LS <b> 1 and second main surface LS <b> 2) are sandwiched between the second base material layer 12 and the third base material layer 13.

  The first base layer 11 is a rectangular parallelepiped magnetic plate, and the second base layer 12 and the third base layer 13 are rectangular parallelepiped non-magnetic plates. The first base material layer 11 is, for example, magnetic ferrite, and the second base material layer 12 and the third base material layer 13 are, for example, nonmagnetic ferrite.

  The second base material layer 12 is laminated on the first main surface LS1 of the first base material layer 11, and the third base material layer 13 is laminated on the second main surface LS2 of the first base material layer 11. That is, as shown in FIG. 2C, the second base material layer 12 is disposed on the first main surface VS1 side of the base material 1, and the third base material layer 13 is on the second main surface VS2 side of the base material 1. Placed in. The second base material layer 12 has surface mounting connection terminals 2A and 2B and NC terminals 3A and 3B. In other words, the base material 1 has surface mounting connection terminals 2A and 2B and NC terminals 3A and 3B on the first main surface VS1. The connection terminals 2A, 2B and NC terminals 3A, 3B for surface mounting are conductor patterns having a rectangular planar shape, for example, a metal film mainly composed of Cu, Ni, or Au.

  The surface mount antenna 101 includes first linear conductor patterns 21A, 21B, 21C, and 21D, second linear conductor patterns 51A, 51B, 51C, 51D, and 51E, and first metal posts 31A, 31B, 31C, and 31D. , 31E and second metal posts 41A, 41B, 41C, 41D, 41E.

  The first linear conductor patterns 21A, 21B, 21C, and 21D are formed on the first main surface LS1 of the first base material layer 11. That is, the first linear conductor patterns 21A to 21D are formed inside the substrate 1 as shown in FIG. The first linear conductor patterns 21A to 21D are conductors formed by, for example, forming a conductor film such as a Cu film on the first main surface LS1 of the first base material layer 11 by plating or the like, and patterning the film by photolithography. It is a pattern. Alternatively, the first linear conductor patterns 21A to 21D may be formed by screen printing a conductive paste. In the present embodiment, these first linear conductor patterns 21A to 21D correspond to the “first main surface side conductor” of the coil conductor according to the present invention.

  The second linear conductor patterns 51A, 51B, 51C, 51D, 51E are formed on the second main surface LS2 of the first base material layer 11. That is, the second linear conductor patterns 51A to 51E are formed inside the substrate 1 as shown in FIG. The second linear conductor patterns 51A to 51E are, for example, conductors formed by forming a conductor film such as a Cu film on the second main surface LS2 of the first base material layer 11 by plating or the like, and patterning this by photolithography. It is a pattern. Alternatively, the second linear conductor patterns 51A to 51E may be formed by screen printing a conductive paste. In the present embodiment, these second linear conductor patterns 51A to 51E correspond to the “second main surface side conductor” of the coil conductor according to the present invention.

  The second linear conductor patterns 51A to 51E are arranged in the longitudinal direction of the substrate 1 (X direction in FIG. 2A) and stretched in the short direction of the substrate 1 (Y direction in FIG. 2A). doing. In the present embodiment, as shown in FIG. 2 (A), the second linear conductor pattern 51C arranged in the center of the longitudinal direction (X direction) of the substrate 1 is the short direction (Y direction) of the substrate 1. ). And as for 2nd linear conductor pattern 51A, 51B, 51D, 51E, the center part of the transversal direction (Y direction) of the base material 1 bends toward the center part of the longitudinal direction (X direction) of the base material 1. It is formed as follows. In other words, the second linear conductor patterns 51A, 51B, 51D, and 51E are formed such that the central portion in the short direction (Y direction) of the substrate 1 is bent toward the second linear conductor pattern 51C. I can say that.

  The first metal posts 31A to 31E and the second metal posts 41A to 41E are, for example, columnar Cu pins. These are obtained, for example, by cutting a Cu wire having a circular cross section in a predetermined length unit, and the aspect ratio (height / bottom diameter) is preferably 5 or more and less than 30.

  The first metal posts 31 </ b> A to 31 </ b> E are arranged so as to extend from the first main surface VS <b> 1 of the base material 1 toward the second main surface VS <b> 2, and the first main surface LS <b> 1 and the second main surface LS <b> 1 of the first base material layer 11. It reaches the main surface LS2. Further, as shown in FIG. 1 and the like, the first metal posts 31A to 31E are arranged so as to extend in the normal line direction with respect to the first main surface VS1 of the substrate 1, and the first metal posts 31A to 31E It is arranged in the vicinity. The first ends of the first metal posts 31A to 31E are connected to the surface mounting connection terminals 2A and the first linear conductor patterns 21A to 21D.

  Specifically, the first end of the first metal post 31A is connected to the surface mounting connection terminal 2A. The first end of the first metal post 31B is connected to the first linear conductor pattern 21A. The first end of the first metal post 31C is connected to the first linear conductor pattern 21B. The first end of the first metal post 31D is connected to the first linear conductor pattern 21C. The first end of the first metal post 31E is connected to the first linear conductor pattern 21D.

  The second metal posts 41 </ b> A to 41 </ b> E are arranged so as to extend from the first main surface VS <b> 1 of the base material 1 toward the second main surface VS <b> 2, and the first main surface LS <b> 1 and the second main surface LS <b> 1 of the first base material layer 11. It reaches the main surface LS2. Further, as shown in FIG. 1 and the like, the second metal posts 41 </ b> A to 41 </ b> E are arranged so as to extend in the normal direction with respect to the first main surface VS <b> 1 of the substrate 1, and the second metal posts 41 </ b> A to 41 </ b> E It is arranged in the vicinity. The first ends of the second metal posts 41A to 41E are connected to the surface mounting connection terminals 2B and the first linear conductor patterns 21A to 21D.

  Specifically, the first end of the second metal post 41A is connected to the first linear conductor pattern 21A. The first end of the second metal post 41B is connected to the first linear conductor pattern 21B. The first end of the second metal post 41C is connected to the first linear conductor pattern 21C. The first end of the second metal post 41D is connected to the first linear conductor pattern 21D. The first end of the second metal post 41E is connected to the connection terminal 2B for surface mounting.

  The first ends of the second linear conductor patterns 51A to 51E are connected to the second ends of the first metal posts 31A to 31E, and the second ends of the second linear conductor patterns 51A to 51E are the second metal posts 41A. To the second end of -41E.

  Specifically, the first end of the second linear conductor pattern 51A is connected to the second end of the first metal post 31A, and the second end of the second linear conductor pattern 51A is the second of the second metal post 41A. Connected to the end. The first end of the second linear conductor pattern 51B is connected to the second end of the first metal post 31B, and the second end of the second linear conductor pattern 51B is connected to the second end of the second metal post 41B. . The first end of the second linear conductor pattern 51C is connected to the second end of the first metal post 31C, and the second end of the second linear conductor pattern 51C is connected to the second end of the second metal post 41C. . The first end of the second linear conductor pattern 51D is connected to the second end of the first metal post 31D, and the second end of the second linear conductor pattern 51D is connected to the second end of the second metal post 41D. . The first end of the second linear conductor pattern 51E is connected to the second end of the first metal post 31E, and the second end of the second linear conductor pattern 51E is connected to the second end of the second metal post 41E. .

  The first linear conductor patterns 21A to 21D, the first metal posts 31A to 31E, the second linear conductor patterns 51A to 51E, and the second metal posts 41A to 41E constitute a 5-turn rectangular helical coil conductor. In the present embodiment, the first linear conductor patterns 21A to 21D, the first metal posts 31A to 31E, the second linear conductor patterns 51A to 51E, and the second metal posts 41A to 41E are “helical” according to the present invention. Corresponds to “coil conductor”.

  As shown in FIG. 1 and FIG. 2C, the coil conductor is formed on the substrate 1 and has a winding axis AX1 in a direction along the first main surface VS1 and the second main surface VS2. As shown in FIG. 2A, the winding axis AX1 can be represented by a straight line extending in the lateral direction (X direction) when viewed from the first main surface VS1.

  FIG. 3A is a plan view of the surface-mounted antenna 101 showing the formation area PA2 of the second linear conductor patterns 51A to 51E, viewed from the second main surface VS2 (through the −Z direction). FIG. FIG. 3B is a plan view of the surface-mounted antenna 101 showing the formation area PA1 of the first linear conductor patterns 21A to 21D, as viewed from the second main surface VS2 (through the −Z direction). FIG. FIG. 3C is a diagram for comparing the formation area PA1 of the first linear conductor patterns 21A to 21D and the formation area PA2 of the second linear conductor patterns 51A to 51E.

  In FIG. 3A, illustration of the first base material layer and the third base material layer is omitted. In FIG. 3B, the third base material layer is not shown.

  As shown in FIG. 3B, the formation area PA1 of the first linear conductor patterns 21A to 21D of the surface-mounted antenna 101 has a parallelogram shape as viewed from the second main surface VS2. Further, the formation area PA2 of the second linear conductor patterns 51A to 51E of the surface mount antenna 101 is, as shown in FIG. 3A, viewed from the second main surface VS2 in the short direction ( The center portion in the Y direction is bent inward.

  Further, as shown in FIG. 3C, the second linear conductor patterns 51A to 51E at the same position as viewed from the second major surface VS2 (the central portion in the short direction (Y direction) of the base material 1). The length X2 of the forming area PA2 in the direction of the winding axis AX1 is shorter than the length X1 of the forming area PA1 of the first linear conductor patterns 21A to 21D in the direction of the winding axis AX1.

  Thus, the coil conductor of the surface mount antenna 101 has a length X2 in the direction of the winding axis AX1 of the formation area PA2 of the second linear conductor patterns 51A to 51E at the same position as viewed from the second main surface VS2. However, it has part SP1 (area | region where the relationship of X2 <X1 is satisfied) shorter than length X1 in winding axis AX1 direction of formation area PA1 of 1st linear conductor pattern 21A-21D.

  Therefore, as shown in FIG. 2C, the coil opening C1 of the coil conductor can be made larger (C1> C0) than the coil opening C0 in the case of not having the above-described configuration, and the substantial coil opening functioning as an antenna can be obtained. Can be bigger.

  The “position” in “the same position as viewed from the second main surface VS2” in the present invention is the direction (Y direction) orthogonal to the winding axis AX1 direction (X direction) as viewed from the second main surface VS2. The position of That is, the “same position” in the present invention means the winding viewed from the second main surface VS2 in the formation area PA2 of the second linear conductor patterns 51A to 51E and the formation area PA1 of the first linear conductor patterns 21A to 21D. The same position in the orthogonal direction (Y direction) to the rotation axis AX1 direction.

  Further, the second main surface side (second linear conductor patterns 51A to 51E) of the coil conductor is in the direction of the winding axis AX1 at the center in the short direction (Y direction) as shown in FIG. The inter-line distance D1 is narrower than the inter-line distance D2 in the direction of the winding axis AX1 on the first main surface side (first linear conductor patterns 21A to 21D) of the coil conductor (D1 <D2).

  Moreover, in this embodiment, the part extended toward the 2nd main surface VS2 from 1st main surface VS1 among coil conductors is comprised by 1st metal post 31A-31E and 2nd metal post 41A-41E. Therefore, a portion of the coil conductor that extends from the first main surface VS1 toward the second main surface VS2 is formed inside the first base material layer that is a magnetic member.

  Further, as shown in FIG. 1 and the like, the coil conductor of the surface mount antenna 101 is configured to wind inside and outside the first base material layer 11 that is a magnetic member. Therefore, in this embodiment, the 1st base material layer 11 comprises the magnetic core of a coil conductor.

  Next, the operation principle of the surface mount antenna 101 will be described with reference to the drawings. FIG. 4A is a plan view showing the operating principle of the surface-mounted antenna 101 according to the first embodiment, and FIG. 4B is a cross-sectional view showing the operating principle of the surface-mounted antenna 101.

  As shown in FIG. 4B, when the magnetic flux φ1 is linked to the coil opening of the coil conductor in the direction along the first main surface VS1 (mounting surface), the magnetic flux in the direction to cancel the magnetic flux φ1 to the coil conductor. A current i1 is generated that generates.

  Further, the coil conductor has a length X2 in the direction of the winding axis AX1 of the formation area PA2 of the second linear conductor patterns 51A to 51E at the same position as viewed from the second main surface VS2, and the first linear conductor pattern. The portion SP1 is shorter than the length X1 in the direction of the winding axis AX1 of the formation area PA1 of 21A to 21D. Therefore, at the central portion in the short direction (Y direction) of the surface-mounted antenna 101, as shown in FIG. 4B, the magnetic flux φ2 that enters from the diagonally upper side of the surface-mounted antenna 101 and tries to pass diagonally upward. Are interlinked with the coil opening of the coil conductor, and a current i1 is generated that generates a magnetic flux in a direction that cancels the magnetic flux φ2 in the coil conductor.

  In this way, not only the direction along the mounting surface but also the magnetic flux entering and exiting obliquely above the surface-mounted antenna 101 can be linked to the coil opening of the coil conductor. A surface-mounted antenna having directivity above the direction along one main surface VS1) can be realized.

  Next, the operation when the surface-mounted antenna 101 is mounted on a circuit board will be described with reference to the drawings. FIG. 5 is a cross-sectional view showing a path of magnetic flux interlinking with the coil opening of the coil conductor when the surface-mounted antenna 101 is mounted on the circuit board 80.

  As shown in FIG. 5, the surface mount antenna 101 is mounted on one main surface (the upper surface in FIG. 5) of the circuit board 80 having the ground conductor 81 inside, and in the vicinity of the edge of the circuit board 80. Has been placed. The circuit board 80 is a printed wiring board, for example. The surface mount antenna 101 and the circuit board 80 are provided in an electronic device (not shown).

  The ground conductor 81 is formed on the substantially entire surface of the circuit board 80. Therefore, the surface mount antenna 101 is disposed in the vicinity of the edge portion of the ground conductor 81.

  With this configuration, in addition to the magnetic fluxes φ1 and φ2 described above, the magnetic flux φ3 that wraps around the mounting surface (the lower surface in FIG. 5) of the surface-mounted antenna 101 at the coil opening of the coil conductor of the surface-mounted antenna 101. Also interlink. In this way, it is possible to suppress the magnetic flux interlinking with the coil opening of the coil conductor from being blocked by the ground conductor 81 formed on the circuit board 80.

  In the above example, the operation in the case where the surface-mounted antenna 101 is a receiving antenna has been described. However, even if transmission / reception is reversed by the antenna reversibility theorem (reciprocity theorem). That is, the same effect is obtained when the surface-mounted antenna 101 is a transmitting antenna.

  According to the present embodiment, the following effects can be obtained.

(A) As described above, not only the direction along the mounting surface, but also the magnetic flux entering and exiting obliquely above the surface-mounted antenna 101 can be linked to the coil opening of the coil conductor. A surface-mounted antenna having directivity above the direction along the first main surface VS1) can be realized. Therefore, even when the surface-mounted antenna 101 is mounted on a printed wiring board or the like, the magnetic flux interlinked with the coil opening of the coil conductor by other electronic components mounted on the main surface of the printed wiring board or the like and the surrounding structure Can be prevented from being hindered.

(B) Further, as described above, since the effective coil opening that functions as an antenna is increased, the range and distance for radiating (magnetizing) magnetic flux is increased, and the coil antenna on the communication partner side is easily coupled. Therefore, a surface mount antenna having excellent communication characteristics can be realized without using a large coil.

(C) On the second main surface side of the coil conductor, the line distance D1 in the winding axis AX1 direction at the center in the short side direction (Y direction) is the winding axis AX1 direction on the first main surface side of the coil conductor. It is narrower than the distance D2 between lines (D1 <D2). For this reason, in the central portion in the short side direction (Y direction) on the second main surface side of the coil conductor, cancellation of magnetic fluxes generated from adjacent coil conductors (second linear conductor patterns) is suppressed, and inductance is improved. To do. Therefore, as a result, the inductance value contributing to the antenna is increased, and a surface mount antenna having a high Q value can be realized.

(D) Since the surface-mounted antenna 101 has the magnetic member constituting the magnetic core on the base material 1, a surface-mounted antenna having a predetermined inductance value can be obtained without increasing the size of the coil.

(E) Since a metal post is used for a part of a pattern constituting the coil conductor, it is not necessary to constitute a part of the coil conductor with a via conductor in the multilayer substrate, and it is not necessary to route complicated wiring. Therefore, it is possible to easily realize a coil conductor having a relatively large height and excellent freedom in designing the coil opening size. In addition, since the resistance of the coil conductor can be reduced, a highly sensitive surface mount antenna or a small surface mount antenna can be obtained for high sensitivity.

(F) Since a portion having a relatively large height can be formed by a metal post, for example, compared to a case where a plurality of base material layers having interlayer connection conductors are stacked to form a connection portion in the height direction, Connection points can be reduced, and the electrical reliability of the coil conductor is increased.

(G) The direct current resistance component of the metal post can be made sufficiently smaller than the direct current resistance (DCR) of a conductor film such as an aggregate of metal particles of a conductive paste or a thin metal film formed by etching a conductive thin film. Therefore, with this configuration, a surface mount antenna having a coil conductor having a high Q value (low loss) can be obtained.

(H) In the surface-mounted antenna 101, the second main surface side (second linear conductor patterns 51A to 51E) of the coil conductor is formed and exposed on the surface of the first base material layer 11 that is a magnetic member. Therefore, a minor loop (local loop) of magnetic flux is hardly generated, and a magnetic field can be radiated efficiently.

(I) In the surface-mounted antenna 101, a portion of the coil conductor extending from the first main surface VS1 toward the second main surface VS2 is formed inside the first base material layer 11 that is a magnetic member. Therefore, the radiation of the magnetic field from the side surface of the base material 1 is suppressed by the shielding effect. Therefore, unnecessary coupling with other electronic components mounted on the main surface such as a printed wiring board and surrounding structures is suppressed.

(J) By disposing the surface mount antenna 101 in the vicinity of the edge of the ground conductor 81, the magnetic flux interlinking with the coil opening of the coil conductor is prevented by the ground conductor 81 formed on the circuit board 80. Can be suppressed. Therefore, the magnetic flux interlinking with the coil antenna on the communication partner side increases, and the communication distance can be increased. In addition, by disposing the surface mount antenna near the edge of the ground conductor, the range of coupling with the coil antenna on the communication partner side can be increased.

  In this embodiment, an example in which a 5-turn rectangular helical coil conductor is configured has been described, but the present invention is not limited to this configuration. The shape of the coil conductor, the number of turns, and the like can be changed as appropriate.

  In addition, in this embodiment, although the base material 1 showed the example which is the laminated body of the 1st base material layer 11, the 2nd base material layer 12, and the 3rd base material layer 13, it is not limited to this structure. Absent. In the surface mount antenna of the present invention, the second base material layer 12 and the third base material layer 13 are not essential components. For example, the base material 1 may be composed of only the first base material layer 11, and either the second base material layer 12 or the third base material layer 13 is on one main surface of the first base material layer 11. A structure in which only the layers are stacked may be used.

  In the present embodiment, an example in which the planar shapes of the surface mounting connection terminals 2A and 2B and the NC terminals 3A and 3B are rectangular has been described, but the present invention is not limited to this configuration. The planar shapes of the surface mounting connection terminals 2A and 2B and the NC terminals 3A and 3B can be appropriately changed. In the surface mount antenna of the present invention, the NC terminals 3A and 3B are not essential components.

  In the present embodiment, the example in which the first metal posts 31A to 31E and the second metal posts 41A to 4E are embedded in the base material 1 is shown, but the present invention is not limited to this configuration. The side parts of the first metal posts 31A to 31E and the second metal posts 41A to 41E may be partially exposed from the first side surface VS3 and the second side surface VS4 of the substrate 1.

  In the present embodiment, the winding axis AX1 of the coil conductor is curved so as to face upward of the mounting surface on the printed wiring board or the like, as shown in FIG. 1 and FIG. That is, in the present invention, the state where the winding axis AX1 of the coil conductor is “along” with the first main surface VS1 and the second main surface VS2 is, for example, that the winding axis AX1 is the first main surface VS1 and the second main surface. It is within the range of 0 ° to less than ± 45 ° with respect to VS2. The same applies to the embodiments described below.

<< Second Embodiment >>
6A is a plan view of the surface-mounted antenna 102A according to the second embodiment, FIG. 6B is a bottom view of the surface-mounted antenna 102A, and FIG. It is BB sectional drawing in (A) and FIG. 6 (B). FIG. 7A is a plan view of a surface mount antenna 102B according to the second embodiment, FIG. 7B is a bottom view of the surface mount antenna 102B, and FIG. It is CC sectional drawing in (A) and FIG.7 (B).

  The surface-mounted antennas 102A and 102B according to the second embodiment are different from the surface-mounted antenna 101 in the shapes of the second linear conductor patterns 52A to 52E. The surface mount antennas 102A and 102B do not have NC terminals, and the planar shapes of the surface mount connection terminals 2A and 2B are different from those of the surface mount antenna 101. Other configurations are the same as those of the surface mount antenna 101 according to the first embodiment.

  Hereinafter, only different portions from the surface-mounted antenna 101 according to the first embodiment will be described.

  In the surface mount antenna 102A according to the present embodiment, as shown in FIG. 6A, the second linear conductor pattern 51B is linearly formed in the short direction (Y direction) of the substrate. Yes. The second linear conductor patterns 51A, 51C, 51D, and 51E are formed so that the central portion in the short direction (Y direction) of the substrate 1 is bent toward the second linear conductor pattern 51B. . Further, the connection terminals 2A and 2B for surface mounting are conductor patterns having an L shape in plan view, and are arranged close to both sides in the longitudinal direction (X direction) of the second base material layer 12 (base material 1). Has been.

  Even in such a configuration, as shown in FIGS. 6A and 6B, the coil conductor of the surface-mounted antenna 102A is located at the same position as viewed from the second main surface VS2 (short of the base material). The length X2 in the direction of the winding axis AX2A of the formation region of the second linear conductor patterns 52A to 52E from the center in the hand direction (Y direction) to the second side surface VS4 is the first linear conductor. It has a portion shorter than the length X1 in the direction of the winding axis AX2A of the formation region of the patterns 22A to 22D (region where the relationship of X2 <X1 is established). Therefore, the same operation and effect as the surface-mounted antenna 101 are obtained.

  Note that the winding axis AX2A of the coil conductor of the surface mount antenna 102A is different from the winding axis AX1 of the coil conductor of the surface mount antenna 101 as shown in FIG. 6B. Therefore, a surface-mounted antenna 102A having a different directivity from the surface-mounted antenna 101 can be realized.

  Next, as shown in FIG. 7B, the surface-mounted antenna 102B according to the present embodiment includes the second linear conductor patterns 52A, 52B, 52C, 52D, and 52E and the second linear conductor pattern 51A. It is formed to bend between the second linear conductor pattern 51B. In addition, 2nd linear conductor pattern 52A-52E is not the center part of the transversal direction (Y direction) of the base material 1, but the one side (FIG. 7 (A)) of the transversal direction (Y direction) of the base material 1. The upper part is bent.

  Further, the connection terminals 2A and 2B for surface mounting are conductor patterns having an L shape in plan view, and are arranged close to both sides in the longitudinal direction (X direction) of the second base material layer 12 (base material 1). Is done.

  Even in such a configuration, as shown in FIGS. 7A and 7B, the coil conductor of the surface-mounted antenna 102B is located at the same position as viewed from the second main surface VS2 (short of the base material). The length X2 in the direction of the winding axis AX2B of the formation area of the second linear conductor patterns 52A to 52E from the center in the hand direction (Y direction) to the second side surface VS4 is the first linear conductor. It has a portion shorter than the length X1 in the direction of the winding axis AX2B of the formation region of the patterns 22A to 22D (region where the relationship of X2 <X1 is established). Therefore, the same operation and effect as the surface-mounted antenna 101 are obtained.

  As shown in the present embodiment, the second main surface side (second linear conductor pattern) of the coil conductor is formed so that the central portion in the short direction (Y direction) of the substrate 1 is bent. The configuration is not limited. As shown by the surface-mounted antenna 102B, the second linear conductor pattern is not a central portion in the short direction (Y direction) of the base material 1, but closer to one side in the short direction (Y direction) of the base material 1. These portions may be bent.

  In the surface-mounted antenna of the present invention, the second linear conductor pattern (for example, the second linear shape in the surface-mounted antenna 102A) is formed linearly in the short direction (Y direction) of the substrate 1. The conductor pattern 51B) is not an essential configuration. As shown by the surface-mounted antenna 102B, the second linear conductor pattern may be entirely bent.

<< Third Embodiment >>
FIG. 8A is a plan view of the surface mount antenna 103 according to the third embodiment, FIG. 8B is a bottom view of the surface mount antenna 103, and FIG. It is DD sectional drawing in (A) and FIG. 8 (B).

  The surface mount antenna 103 according to the third embodiment is different from the surface mount antenna 101 in the configuration of the coil conductor. The surface mount antenna 103 is different from the surface mount antenna 101 in that the substrate 1 is a laminate of a plurality of first substrate layers 11a, 11b, 11c, and 11d. Other configurations are the same as those of the surface mount antenna 101 according to the first embodiment.

  The surface-mounted antenna 103 includes a base material 1 having a first main surface VS1 and a second main surface VS2, and a coil conductor (described in detail later) formed on the base material 1.

  As shown in FIG. 8C, the base material 1 is a laminated body in which a plurality of first base material layers 11a to 11d are stacked in this order in the stacking direction (Z direction). The plurality of first base material layers 11a to 11d are rectangular parallelepiped magnetic plates. The base material 1 has connection terminals 2A and 2B for surface mounting on the first main surface VS1. The connection terminals 2A and 2B for surface mounting are conductor patterns having a rectangular planar shape.

  Further, the surface mount antenna 103 includes a first linear conductor pattern 23A, 23B, 23C, 23D, 23E, a second linear conductor pattern 53A, 53B, 53C, 53D, 53E, 53F, a plurality of internal conductor patterns 5 and A plurality of interlayer connection conductors 6 are provided. The plurality of conductor patterns 5 are formed on the main surfaces of the plurality of first base material layers 11a to 11d, and the plurality of interlayer connection conductors 6 extend in the stacking direction (Z direction) of the plurality of first base material layers 11a to 11d. Conductor. The plurality of interlayer connection conductors are, for example, via conductors.

  The first linear conductor patterns 23 </ b> A to 23 </ b> E are conductor patterns formed on the first main surface VS <b> 1 of the substrate 1, and are arranged in the longitudinal direction (X direction) of the substrate 1. The second linear conductor patterns 53 </ b> A to 53 </ b> F are conductor patterns formed on the second major surface VS <b> 2 of the substrate 1, arranged in the longitudinal direction (X direction) of the substrate 1, and the short direction of the substrate 1. It extends in the (Y direction). The surface mounting connection terminals 2 </ b> A and 2 </ b> B are conductor patterns having a rectangular planar shape formed on the first main surface VS <b> 1 of the substrate 1, and are disposed in the vicinity of the corners of the substrate 1.

  As shown in FIG. 8C, the first linear conductor patterns 23A to 23E and the surface mounting connection terminals 2A and 2B are connected to the second line via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6, respectively. Connected to the conductor patterns 53A to 53F. In FIG. 8C, only the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6 that connect the first linear conductor pattern 23A and the second linear conductor pattern 53A are shown as representatives.

  Specifically, the surface mounting connection terminal 2 </ b> A is connected to the second end of the second linear conductor pattern 53 </ b> A via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6. The first end of the second linear conductor pattern 53A is connected to the first end of the first linear conductor pattern 23A via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6. The second end of the first linear conductor pattern 23A is connected to the second end of the second linear conductor pattern 53B via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6. The first end of the second linear conductor pattern 53B is connected to the first end of the first linear conductor pattern 23B via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6. The second end of the first linear conductor pattern 23B is connected to the second end of the second linear conductor pattern 53C via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6. The first end of the second linear conductor pattern 53C is connected to the first end of the first linear conductor pattern 23C via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.

  The second end of the first linear conductor pattern 23C is connected to the second end of the second linear conductor pattern 53D via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6. The first end of the second linear conductor pattern 53D is connected to the first end of the first linear conductor pattern 23D via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6. The second end of the first linear conductor pattern 23D is connected to the second end of the second linear conductor pattern 53E via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6. The first end of the second linear conductor pattern 53E is connected to the first end of the first linear conductor pattern 23E via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6. The second end of the first linear conductor pattern 23E is connected to the second end of the second linear conductor pattern 53F via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6. The first ends of the second linear conductor patterns 53F are connected to the surface mounting connection terminals 2B via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.

  The first linear conductor patterns 23A to 23E, the plurality of conductor patterns 5, the plurality of interlayer connection conductors 6, and the second linear conductor patterns 53A to 53F constitute a six-turn helical coil conductor. In the present embodiment, the first linear conductor patterns 23A to 23E, the plurality of conductor patterns 5, the plurality of interlayer connection conductors 6, and the second linear conductor patterns 53A to 53F are the “helical coil conductors” according to the present invention. Is equivalent to.

  As shown in FIG. 8B, the coil conductor has a winding axis AX3 in a direction along the first main surface VS1 and the second main surface VS2. As shown in FIG. 8A, the winding axis AX3 can be represented by a straight line extending in the lateral direction (X direction) when viewed from the first main surface VS1.

  As shown in FIGS. 8A and 8B, the coil conductor of the surface-mounted antenna 103 is located at the same position as viewed from the second major surface VS2 (the center in the short direction (Y direction) of the substrate 1). ), The length X2 in the direction of the winding axis AX3 of the formation region of the second linear conductor patterns 53A to 53F is the length in the direction of the winding axis AX3 of the formation region of the first linear conductor patterns 23A to 23E. It has a portion shorter than X1 (a region where the relationship of X2 <X1 is established). With this configuration, the coil opening of the coil conductor can be made larger than the coil opening in the case where the above configuration is not used, and the substantial coil opening that functions as an antenna can be made larger.

  Moreover, in this embodiment, the part extended from 1st main surface VS1 to 2nd main surface VS2 is comprised by the interlayer connection conductor 6 among coil conductors.

  Even in such a configuration, the basic configuration of the surface-mounted antenna 103 is the same as that of the surface-mounted antenna 101 according to the first embodiment, and functions and effects similar to those of the surface-mounted antenna 101 are obtained. Play.

<< Fourth Embodiment >>
FIG. 9A is a plan view of the surface-mounted antenna 104 according to the fourth embodiment, FIG. 9B is a bottom view of the surface-mounted antenna 104, and FIG. It is EE sectional drawing in (A) and FIG. 9 (B).

  The surface-mounted antenna 104 according to the fourth embodiment is the third embodiment in that a portion of the coil conductor extending from the first main surface VS1 to the second main surface VS2 of the base material 1 is a metal post. Different from the surface mount antenna 103 according to FIG. Other configurations are the same as those of the surface mount antenna 103 according to the third embodiment.

  The substrate 1 of the present embodiment is a magnetic resin member containing magnetic powder such as ferrite powder.

  The surface-mounted antenna 104 includes first linear conductor patterns 24A, 24B, 24C, 24D, and 24E, first metal posts 34A, 34B, 34C, 34D, 34E, and 34F, a second metal post (not shown), and a second metal post. It has linear conductor patterns 54A, 54B, 54C, 54D, 54E, 54F and connection terminals 2A, 2B for surface mounting.

  The configurations of the first linear conductor patterns 24A to 24E, the second linear conductor patterns 54A to 54F, and the surface mounting connection terminals 2A and 2B are the same as those of the surface mount antenna 103 according to the third embodiment.

  The first metal posts 34A to 34F are arranged so as to extend from the first main surface VS1 of the base material 1 to the second main surface VS2, and reach the first main surface VS1 and the second main surface VS2 of the base material 1. . Further, as shown in FIG. 9C, the first metal posts 34 </ b> A to 34 </ b> F are arranged at a predetermined angle with respect to the first main surface VS <b> 1 of the substrate 1, and the first side surface of the substrate 1. It is arranged in the vicinity of VS3.

  The first ends of the first metal posts 34A to 34F are connected to the surface mounting connection terminals 2B and the first linear conductor patterns 24A to 24E.

  The second metal post is disposed so as to extend from the first main surface VS1 of the base material 1 to the second main surface VS2, and reaches the first main surface VS1 and the second main surface VS2 of the base material 1. Further, the second metal post is arranged so as to be at a predetermined angle with respect to the first main surface VS1 of the base material 1 in the same manner as the first metal posts 34A to 34F. It is arranged in the vicinity.

  In the present embodiment, the above-mentioned “predetermined angle” is an acute angle, and for example, an angle formed between the second main surface VS2 of the substrate 1 and the first metal posts 34A to 34F or the second metal post. An angle greater than 0 ° and less than ± 90 °.

  The first end of the second metal post is connected to the surface mounting connection terminal 2A and the first linear conductor patterns 24A to 24E.

  The first ends of the second linear conductor patterns 54A to 54F are connected to the second ends of the first metal posts 34A to 34F, and the second ends of the second linear conductor patterns 54A to 54F are the second metal posts. Connected to the second end.

  The first linear conductor patterns 24A to 24E, the first metal posts 34A to 34F, the second metal posts, and the second linear conductor patterns 53A to 53F constitute a six-turn helical coil conductor. In the present embodiment, the first linear conductor patterns 24A to 24E, the first metal posts 34A to 34F, the second metal posts, and the second linear conductor patterns 53A to 53F are the “helical coil conductors” according to the present invention. Is equivalent to.

  Even in such a configuration, the basic configuration of the surface-mounted antenna 104 is the same as that of the surface-mounted antenna 103 according to the third embodiment, and functions and effects similar to those of the surface-mounted antenna 103 are obtained. Play.

<< Fifth Embodiment >>
FIG. 10 is an external perspective view of a surface mount antenna 105 according to the fifth embodiment. FIG. 11A is a plan view of the surface-mounted antenna 105, FIG. 11B is a bottom view of the surface-mounted antenna 105 with the second base material layer 12 removed, and FIG. It is a bottom view of the surface mount antenna 105. FIG. 12 is a cross-sectional view taken along line FF in FIGS. 11A, 11B, and 11C.

  The surface-mounted antenna 105 according to the fifth embodiment is different from the surface-mounted antenna 101 in the shapes of the connection terminals 2A and 2B, the first linear conductor patterns 25A to 25F, and the second linear conductor patterns 55A to 55E. Other configurations are substantially the same as those of the surface mount antenna 101 according to the first embodiment.

  Hereinafter, only different portions from the surface-mounted antenna 101 according to the first embodiment will be described.

  In the surface-mounted antenna 105, as shown in FIG. 11B, the first linear conductor patterns 25A, 25B, 25C, 25D, 25E, and 25F are substantially the second main surface LS2 of the first base material layer 11. It is formed on the entire surface. The first linear conductor patterns 25 </ b> A to 25 </ b> F are arranged in order along the longitudinal direction (X direction) of the first base material layer 11.

  The first linear conductor pattern 25A is a conductor pattern having a right triangle shape in plan view. The first linear conductor pattern 25 </ b> A is adjacent to one side in the short direction of the first base material layer 11 (upper side of the first base material layer 11 in FIG. 11B), and the first base material layer 11. It is a taper shape which becomes thin toward the other side (lower side of the 1st base material layer 11 in Drawing 11 (B)) from one side of the transverse direction. The first linear conductor pattern 25 </ b> A is disposed in the vicinity of one side in the longitudinal direction of the first base material layer 11 (the left side of the first base material layer 11 in FIG. 11B).

  The first linear conductor pattern 25F is a conductor pattern having a right triangle shape in plan view. The first linear conductor pattern 25F is tapered such that its bottom side is close to the other side of the first base material layer 11 in the short direction and becomes thinner from the other side of the first base material layer 11 toward the one side. Shape. The first linear conductor pattern 25F is arranged in the vicinity of the other side in the longitudinal direction of the first base material layer 11 (the right side of the first base material layer 11 in FIG. 11B).

  The first linear conductor patterns 25 </ b> B, 25 </ b> C, 25 </ b> D, and 25 </ b> E are conductor patterns having a parallelogram in plan view, and extend from one side of the first base material layer 11 toward the other side. The first linear conductor patterns 25B, 25C, 25D, and 25E are disposed between the first linear conductor patterns 25A and 25F.

  In the surface-mounted antenna 105, the second linear conductor patterns 55A, 55B, 55C, 55D, and 55E are formed on the first main surface LS1 of the first base material layer 11. The second linear conductor patterns 55 </ b> A to 55 </ b> E are sequentially arranged along the longitudinal direction of the first base material layer 11.

  The second linear conductor pattern 55C is disposed at the center in the longitudinal direction of the first base material layer 11, and is linear (I-shaped) toward the short direction (Y direction) of the first base material layer 11. Is formed. The second linear conductor patterns 55B and 55D have such a shape that the central portion in the short direction (Y direction) of the first base material layer 11 is bent (recessed) toward the second linear conductor pattern 55C. Is formed. The second linear conductor patterns 55A and 55E are formed such that the central portion in the short direction (Y direction) of the first base material layer 11 is bent toward the second linear conductor pattern 55C.

  The first metal posts 35A1, 35A2, 35B1, 35B2, 35C1, 35C2, 35D1, 35D2, 35E1, and 35E2 are disposed so as to extend from the first main surface VS1 to the second main surface VS2 of the base material 1, and The first base surface LS1 and the second main surface LS2 of the first base material layer 11 are reached. 1st metal post 35A1-35E2 is arrange | positioned along the longitudinal direction (X direction) of the base material 1 (1st base material layer 11). The first ends of the first metal posts 35A1 to 35E2 are connected to the first linear conductor patterns 25A to 21E.

  Specifically, the first ends of the first metal posts 35A1 and 35A2 are connected in parallel to the first linear conductor pattern 25A. The first ends of the first metal posts 35B1 and 35B2 are connected in parallel to the first linear conductor pattern 25B. The first ends of the first metal posts 35C1 and 35C2 are connected in parallel to the first linear conductor pattern 25C. The first ends of the first metal posts 35D1 and 35D2 are connected in parallel to the first linear conductor pattern 25D. The first ends of the first metal posts 35E1 and 35E2 are connected in parallel to the first linear conductor pattern 25E.

  The second metal posts 45A1, 45A2, 45B1, 45B2, 45C1, 45C2, 45D1, 45D2, 45E1, and 45E2 face the second main surface VS2 from the first main surface VS1 of the base material 1 (first base material layer 11). And extend to the first main surface LS1 and the second main surface LS2 of the first base material layer 11. The second metal posts 45A1 to 45E2 are arranged along the longitudinal direction (X direction) of the substrate 1. The first ends of the second metal posts 45A1 to 45E2 are connected to the first linear conductor patterns 25A to 21E.

  Specifically, the first ends of the second metal posts 45A1 and 45A2 are connected in parallel to the first linear conductor pattern 25B. The first ends of the second metal posts 45B1 and 45B2 are connected in parallel to the first linear conductor pattern 25C. The first ends of the second metal posts 45C1 and 45C2 are connected in parallel to the first linear conductor pattern 25D. The first ends of the second metal posts 45D1 and 45D2 are connected in parallel to the first linear conductor pattern 25E. The first ends of the second metal posts 45E1 and 45E2 are connected in parallel to the first linear conductor pattern 25F.

  The first ends of the second linear conductor patterns 55A to 55E are connected to the second ends of the first metal posts 35A1 to 35E2, and the second ends of the second linear conductor patterns 55A to 55E are the second metal posts 45A1. To the second end of ~ 45E2.

  Specifically, the first end of the second linear conductor pattern 55A is connected to the second ends of the first metal posts 35A1 and 35A2, and the second end of the second linear conductor pattern 55A is the second metal post. Connected to the second ends of 45A1 and 45A2. The first end of the second linear conductor pattern 55B is connected to the second end of the first metal posts 35B1 and 35A2, and the second end of the second linear conductor pattern 55B is the second end of the second metal posts 45B1 and 45B2. Connected to the two ends. The first end of the second linear conductor pattern 55C is connected to the second end of the first metal posts 35C1 and 35C2, and the second end of the second linear conductor pattern 55C is the second end of the second metal posts 45C1 and 45C2. Connected to the two ends. The first end of the second linear conductor pattern 55D is connected to the second end of the first metal posts 35D1 and 35D2, and the second end of the second linear conductor pattern 55D is the second end of the second metal posts 45D1 and 45D2. Connected to the two ends. The first end of the second linear conductor pattern 55E is connected to the second end of the first metal posts 35E1 and 35E2, and the second end of the second linear conductor pattern 55E is the second end of the second metal posts 45E1 and 45E2. Connected to the two ends.

  Further, the connection terminals 2A and 2B for surface mounting are conductor patterns having a straight line shape (I shape) in plan view, and are arranged close to both sides in the longitudinal direction (X direction) of the second base material layer 12. ing.

  The first metal posts 35A3 and 35A4 are arranged so as to extend from the first main surface VS1 of the base material 1 toward the second main surface VS2, and the first main surface LS1 of the first base material layer 11 and the base material The first main surface VS1 is reached. The first metal posts 35A3 and 35A4 connect the connection terminals 2A for surface mounting and the first linear conductor pattern 25A in parallel.

  The second metal posts 45E3 and 45E4 are arranged so as to extend from the first main surface VS1 of the base material 1 toward the second main surface VS2, and the first main surface LS1 of the first base material layer 11 and the base material The first main surface VS1 is reached. The second metal posts 45E3 and 45E4 connect the connection terminals 2B for surface mounting and the first linear conductor pattern 25F in parallel.

  First linear conductor patterns 25A-25F, first metal posts 35A1, 35A2, 35B1, 35B2, 35C1, 35C2, 35D1, 35D2, 35E1, 35E2, second linear conductor patterns 55A-55E and second metal posts 45A1, 45A2, 45B1, 45B2, 45C1, 45C2, 45D1, 45D2, 45E1, and 45E2 constitute a helical coil conductor of about 4.5 turns. In the present embodiment, the first linear conductor patterns 25A to 25F, the first metal posts 35A1 to 35E2, the second linear conductor patterns 55A to 55E, and the second metal posts 45A1 to 45E2 are “helical” according to the present invention. Corresponds to “coil conductor”.

  As shown in FIG. 12 and the like, the coil conductor is formed on the substrate 1 and has a winding axis AX5 in a direction along the first main surface VS1 and the second main surface VS2. As shown in FIG. 2A, the winding axis AX5 can be represented by a straight line extending in the lateral direction (X direction) when viewed from the first main surface VS1.

  Even in such a configuration, as shown in FIGS. 11A and 11B, the coil conductor of the surface-mounted antenna 105 is located at the same position as viewed from the second main surface VS2 (on the base material 1). The length X2 in the direction of the winding axis AX5 of the formation region of the second linear conductor patterns 55A to 55E in the short direction (the center portion in the Y direction) is the formation region of the first linear conductor patterns 25A to 25D. Has a portion shorter than the length X1 in the direction of the winding axis AX5 (region where the relationship of X2 <X1 is established). Therefore, the same operation and effect as the surface-mounted antenna 101 are obtained.

  In this embodiment, as shown in FIG. 11B, the widths of the first linear conductor patterns 25A to 25F (the length of the first linear conductor pattern in the winding axis AX5 direction) are adjacent to each other. It is larger than the gap between the first linear conductor patterns (the gap between the adjacent first linear conductor patterns in the winding axis AX5 direction). Further, as shown in FIG. 11A, the width of the second linear conductor patterns 55A to 55E is larger than the gap between the adjacent second linear conductor patterns. Therefore, the direct current resistance (DCR) of the coil conductor can be reduced. In addition, this configuration makes it difficult for minor loops (local loops) due to leakage of magnetic flux from the gaps between adjacent linear conductor patterns (the first linear conductor pattern and the second linear conductor pattern) to efficiently generate magnetic fields. Can radiate well.

  In the present embodiment, as shown in FIG. 12 and the like, the metal posts 35A1 to 35E2 and 45A1 to 45E2 are connected in parallel to the first linear conductor patterns 25A to 25F and the second linear conductor patterns 55A to 55E, respectively. And disposed along the longitudinal direction (X direction) of the substrate 1. Therefore, in this embodiment, the direct current resistance (DCR) of the coil conductor can be further reduced. Moreover, in this embodiment, the gap | interval of adjacent metal post 35A1-35E2, 45A1-45E2 is small compared with the metal post in the above-mentioned embodiment. Therefore, a minor loop (local loop) due to leakage of magnetic flux from the gap between adjacent metal posts 35A1 to 35E2 and 45A1 to 45E2 is further less likely to occur.

  Further, in the present embodiment, as shown in FIG. 11B, the first linear conductor patterns 25A to 25F are formed on the substantially entire surface of the second main surface LS2 of the first base material layer 11, and adjacent to each other. The gap between the first linear conductor patterns 25A to 25F is small. Therefore, the magnetic flux leaking from the gap between the adjacent first linear conductor patterns can be reduced. Therefore, when a surface mount antenna is mounted on a substrate, even if a metal member such as a ground conductor is formed on the substrate, unnecessary coupling between the metal member and the coil antenna is suppressed, resulting in a coil A change in communication characteristics of the antenna can be suppressed.

<< Sixth Embodiment >>
FIG. 13 is an external perspective view of a wireless IC device 201 according to the sixth embodiment. 14A is a plan view of the wireless IC device 201, FIG. 14B is a bottom view of the wireless IC device 201, and FIG. 14C is a plan view of the substrate 1 (first of the substrate 4). FIG.

  The wireless IC device 201 includes a base material 1, a coil conductor (described in detail later), and an RFIC element 61. In the present embodiment, the RFIC element 61 corresponds to a “feed circuit connected to a coil conductor” according to the present invention. Moreover, the base material 1 of this embodiment has the resin member 70 and the flat board | substrate 4 which has 1st main surface PS1 and 2nd main surface PS2.

  The resin member 70 has a rectangular parallelepiped shape, the first main surface VS1, the second main surface VS2 facing the first main surface VS1, and the first side surface VS3 connected to the first main surface VS1 and the second main surface VS2. And a second side surface VS4. The board 4 is a printed wiring board having a rectangular planar shape, and wiring conductor patterns 7A and 7B and power supply terminals 8A and 8B are formed on the first main surface PS1 of the board 4 (the upper surface of the board 4 from the viewpoint of FIG. 13). And NC terminals 9A and 9B are formed. These wiring conductor patterns 7A and 7B, power supply terminals 8A and 8B, and NC terminals 9A and 9B are patterned by, for example, etching of Cu foil or the like.

  As shown in FIG. 13, the substrate 4 is embedded in the resin member 70 so that the second main surface PS <b> 2 of the substrate 4 and the second main surface VS <b> 2 of the resin member 70 are the same surface. The first linear conductor patterns 26A, 26B, 26C, 26D, 26E, 26F, and 26G are formed on the second main surface PS2 of the substrate 4 and the second main surface VS2 of the resin member 70 that are the same surface.

  The substrate 4 includes interlayer connection conductors 10A and 10B (through-hole plating). The first linear conductor pattern 26A and the wiring conductor pattern 7A are electrically connected through the interlayer connection conductor 10A, respectively, and the first linear conductor pattern 26G and the wiring conductor pattern 7B are respectively connected through the interlayer connection conductor 10B. Electrically connected. That is, the first linear conductor pattern 26A is connected in series to the wiring conductor pattern 7A including the power supply terminal 8A, and the first linear conductor pattern 26G is connected in series to the wiring conductor pattern 7B including the power supply terminal 8B. Connected to.

  The interlayer connection conductors 10A and 10B may be through-hole conductor type interlayer conductors as described above, but may also be end face conductor type interlayer conductors in which a conductor is formed on the end face of the substrate by coating or the like. Alternatively, a via-hole type interlayer conductor formed by forming a through hole in a substrate and filling a conductive paste or the like therewith may be used.

  The wireless IC device 201 includes first metal posts 36A, 36B, 36C, 36D, 36E, 36F and second metal posts 46A, 46B, 46C, 46D, 46E, 46F.

  The first metal posts 36 </ b> A to 36 </ b> F are arranged to extend in the normal direction to the second main surface VS <b> 2 of the resin member 70, and reach the first main surface VS <b> 1 and the second main surface VS <b> 2 of the resin member 70. . Further, the first metal posts 36A to 36F are arranged in the vicinity of the first side surface VS3 of the resin member 70 as shown in FIG. The first ends of the first metal posts 36A to 36F are connected to the first linear conductor patterns 26B to 26G.

  Specifically, the first end of the first metal post 36A is connected to the first linear conductor pattern 26B. The first end of the first metal post 36B is connected to the first linear conductor pattern 26C. The first end of the first metal post 36C is connected to the first linear conductor pattern 26D. The first end of the first metal post 36D is connected to the first linear conductor pattern 26E. The first end of the first metal post 36E is connected to the first linear conductor pattern 26F. The first end of the first metal post 36F is connected to the first linear conductor pattern 26G.

  The second metal posts 46A to 46F are arranged so as to extend in the normal direction with respect to the second main surface VS2 of the resin member 70, and reach the first main surface VS1 and the second main surface VS2 of the resin member 70. . Further, the second metal posts 46A to 46F are disposed in the vicinity of the second side surface VS4 of the resin member 70 as shown in FIG. The first ends of the second metal posts 46A to 46F are connected to the first linear conductor patterns 26A to 26F.

  Specifically, the first end of the second metal post 46A is connected to the first linear conductor pattern 26A. The first end of the second metal post 46B is connected to the first linear conductor pattern 26B. The first end of the second metal post 46C is connected to the first linear conductor pattern 26C. The first end of the second metal post 46D is connected to the first linear conductor pattern 26D. The first end of the second metal post 46E is connected to the first linear conductor pattern 26E. The first end of the second metal post 46F is connected to the first linear conductor pattern 26F.

  The wireless IC device 201 includes second linear conductor patterns 56A, 56B, 56C, 56D, 56D, 56E, and 56F formed on the first main surface VS1 of the resin member 70. The first ends of the second linear conductor patterns 56A to 56F are connected to the second ends of the first metal posts 36A to 36F, and the second ends of the second linear conductor patterns 56A to 56F are the second metal posts 46A to 46F. Is connected to the second end.

  Specifically, the first end of the second linear conductor pattern 56A is connected to the second end of the first metal post 36A, and the second end of the second linear conductor pattern 56A is the second end of the second metal post 46A. Connected to the end. The first end of the second linear conductor pattern 56B is connected to the second end of the first metal post 36B, and the second end of the second linear conductor pattern 56B is connected to the second end of the second metal post 46B. . The first end of the second linear conductor pattern 56C is connected to the second end of the first metal post 36C, and the second end of the second linear conductor pattern 56C is connected to the second end of the second metal post 46C. . The first end of the second linear conductor pattern 56D is connected to the second end of the first metal post 36D, and the second end of the second linear conductor pattern 56D is connected to the second end of the second metal post 46D. . The first end of the second linear conductor pattern 56E is connected to the second end of the first metal post 36E, and the second end of the second linear conductor pattern 56E is connected to the second end of the second metal post 46E. . The first end of the second linear conductor pattern 56F is connected to the second end of the first metal post 36F, and the second end of the second linear conductor pattern 56F is connected to the second end of the second metal post 46F. .

  The first linear conductor patterns 26A to 26G extend in the longitudinal direction of the resin member 70 (Y direction in FIG. 14B), and the second linear conductor patterns 56A to 56F extend in the longitudinal direction of the resin member 70 (Y direction). It extends to. Here, the meaning of “extending in the longitudinal direction (Y direction) of the resin member 70” is not limited to the fact that the first linear conductor patterns 26A to 26G and the second linear conductor patterns 56A to 56F are all parallel. The direction in which the first linear conductor patterns 26A to 26G and the second linear conductor patterns 56A to 56F extend generally faces the longitudinal direction (Y direction) of the resin member 70, that is, substantially extends in the Y direction. Including.

  The second linear conductor patterns 56 </ b> A to 56 </ b> F are arranged in the short direction of the resin member 70 (X direction in FIG. 14A) and extend in the longitudinal direction of the resin member 70 (Y direction). In the present embodiment, as shown in FIG. 14A, the second linear conductor patterns 56C and 56D arranged in the center in the short direction (X direction) of the resin member 70 are arranged in the longitudinal direction ( (Y direction) is linearly formed. The second linear conductor patterns 56 </ b> A, 56 </ b> B, 56 </ b> E, and 56 </ b> F bend toward the central portion of the resin member 70 in the longitudinal direction (Y direction). It is formed as follows. In other words, the second linear conductor patterns 56A, 56B, 56E, and 56F are formed such that the center portion in the longitudinal direction (Y direction) of the resin member 70 is bent toward the second linear conductor patterns 56C and 56D. It can be said that.

  As illustrated in FIG. 13 and the like, the first metal posts 36A to 36F are arranged in the short direction (X direction) of the resin member 70 and extend in the height direction (Z direction) of the resin member 70. Similarly, the second metal posts 46 </ b> A to 46 </ b> F are arranged in the short direction (X direction) of the resin member 70 and extend in the height direction (Z direction) of the resin member 70. That is, these metal posts are parallel to each other.

  The first linear conductor patterns 26A to 26G, the first metal posts 36A to 36F, the second linear conductor patterns 56A to 56F, and the second metal posts 46A to 46F constitute a six-turn rectangular helical coil conductor. In the present embodiment, the first linear conductor patterns 26A to 26G, the first metal posts 36A to 36F, the second linear conductor patterns 56A to 56F, and the second metal posts 46A to 46F are “helical” according to the present invention. Corresponds to “coil conductor”.

  As shown in FIGS. 14A and 14B, the coil conductor has a winding axis AX6 in a direction along the first main surface VS1 and the second main surface VS2. As shown in FIG. 14A, the winding axis AX6 can be represented by a straight line extending in the lateral direction (X direction) when viewed from the first main surface VS1.

  As shown in FIGS. 14A and 14B, the coil conductor of the wireless IC device 201 is located at the same position as viewed from the second main surface VS2 (the short direction (Y direction of the base member 1 or the resin member 70). ) In the direction of the winding axis AX6 of the formation region of the second linear conductor patterns 56A to 56F at the position near the first side surface VS3) from the center portion of the first linear conductor patterns 26B to 26F. It has a portion shorter than the length X1 in the direction of the winding axis AX6 of the formation region (region where the relationship of X2 <X1 is established). With this configuration, the coil opening of the coil conductor can be made larger than the coil opening in the case where the above configuration is not used, and the substantial coil opening that functions as an antenna can be made larger. Therefore, the basic configuration of the wireless IC device 201 is the same as that of the surface mount antenna 101 according to the first embodiment, and has the same operations and effects as the surface mount antenna 101.

  An RFIC element 61 in which an RFIC chip (bare chip) is packaged is connected (mounted) to the power supply terminal 8A of the wiring conductor pattern 7A and the power supply terminal 8B of the wiring conductor pattern 7B. That is, the RFIC element 61 as a power feeding circuit is connected to the coil conductor of the surface mount antenna.

  As shown in FIG. 13, the RFIC element 61 is mounted on the first main surface PS <b> 1 of the substrate 4 and embedded in the resin member 70. The RFIC element 61 may be a bare chip RFIC. In this case, the RFIC has an Au electrode terminal and is connected to the Au plating film of the power supply terminal by ultrasonic bonding.

  In the wireless IC device 201, not only the RFIC element 61 but also chip capacitors 62 and 63 are mounted on the substrate 4. Similarly to the RFIC element 61, the chip capacitors 62 and 63 are connected to the wiring conductor pattern 7A and the wiring conductor pattern 7B, mounted on the first main surface PS1 of the substrate 4, and embedded in the resin member 70.

  FIG. 15 is a circuit diagram of the wireless IC device 201. The coil conductor ANT is connected to the RFIC element 61, and chip capacitors 62 and 63 are connected in parallel to the coil conductor ANT. The LC conductor circuit is constituted by the coil conductor ANT, the chip capacitors 62 and 63, and the capacitance component of the RFIC element 61 itself. The capacitances of the chip capacitors 62 and 63 are selected so that the resonance frequency of the LC resonance circuit is substantially equal to the communication frequency of the RFID system (for example, 13.56 MHz). One of the chip capacitors 62 and 63 is a coarse adjustment capacitor, and the other is a fine adjustment capacitor. Note that the number of capacitors for setting the resonance frequency may be one.

  In the [DETAILED DESCRIPTION], the “RFID element” may be an RFIC chip itself or an RFIC package in which a matching circuit or the like is integrated with the RFIC chip. An “RFID tag” has an RFIC element and a coil conductor connected to the RFIC element, and uses non-contact information to read and write data in a built-in memory using radio waves (electromagnetic waves) or magnetic fields. Defined as medium. That is, the wireless IC device of this embodiment is configured as an RFID tag.

  The RFIC element 61 includes, for example, an HF band high frequency wireless IC chip for an HF band RFID system. The wireless IC device 201 is provided, for example, on an article to be managed. By bringing the wireless IC device 201 (that is, the RFID tag) attached to the article close to the reader / writer device, the coil conductor of the wireless IC device 201 and the coil conductor of the RFID reader / writer device are magnetically coupled. Thus, RFID communication is performed between the RFID tag and the reader / writer device.

  In addition, according to this embodiment, there exist the following effects further.

(A) Since the mounting surface of the RFIC element 61 in the wireless IC device 201 is parallel to the winding axis (X axis) of the coil conductor, the mounting electrode (land pattern) of the RFIC element 61 forms a magnetic field of the coil conductor. It is hard to disturb. Further, the adverse effect (malfunction, unstable operation, etc.) on the RFIC element 61 due to the magnetic field of the coil conductor is small. Further, the adverse effect on the coil conductor due to noise generated from the digital circuit portion of the RFIC element 61 (decrease in reception sensitivity, wraparound of the transmission signal to the reception circuit, etc.) is small.

(B) Of the patterns constituting the coil conductor, the first linear conductor patterns 26A to 26G and the second linear conductor patterns 56A to 56F extending in the X-axis direction are all formed by forming a plating film such as Cu. The film thickness can be increased. Therefore, the direct current resistance component of the coil conductor can be further reduced.

(C) Since the wireless IC device 201 includes a capacitor connected to the RFIC element, a circuit for matching the RFIC element 61 and the coil conductor or setting a resonance frequency can be easily configured, and an external circuit can be eliminated or simplified. It can be made.

(D) Since the surface mount chip components such as the RFIC element 61 and the chip capacitors 62 and 63 and the metal posts 36A to 36F and 46A to 46F are protected by the resin member 70, the entire wireless IC device 201 is robust. In particular, when the wireless IC device 201 is embedded in a resin molded article, the solder connection portion of the surface mount chip component is protected against a high temperature resin (for example, a high temperature resin of 300 ° C. or higher) that flows during injection molding. In addition, even when the solder joint is once melted at a high temperature, the resin member 70 and the substrate 4 are bonded together by joining the resins, and the mounted components and metal posts do not come off or deform. The joined state of the joined portion returns to normal. Therefore, the inductance value of the coil conductor can be maintained.

(E) The RFIC element 61 is not exposed to the outside of the wireless IC device 201, the protection function of the RFIC element 61 is enhanced, and an increase in size caused by mounting the RFIC element 61 outside can be avoided. Further, the reliability of the connection portion of the RFIC element 61 to the substrate 4 is increased. As a result, it is possible to realize a highly heat-resistant wireless IC device that can be built into a resin molded product such as plastic, that is, can withstand high temperatures during injection molding.

(F) The wireless IC device 201 has a structure in which the substrate 4 is embedded in the resin member 70 so that the second main surface PS2 of the substrate 4 and the second main surface VS2 of the resin member 70 are flush with each other. Therefore, the first linear conductor patterns 26A and 26G are routed across the second main surface PS2 of the substrate 4 and the second main surface VS2 of the resin member 70. Thereby, the connection between the interlayer connection conductors 10A and 10B of the substrate 4 and the first linear conductor patterns 26A and 26G can be facilitated.

(G) Since it is not the structure which mounts the metal post (1st metal post 36A-36F, 2nd metal post 46A-46F) on the board | substrate 4, it is not necessary to form the land for mounting a metal post on the board | substrate 4. The metal posts can be arranged at a narrow pitch. Therefore, the size can be reduced for the number of turns (that is, even if the number of metal posts increases).

(H) In addition, the first linear conductor patterns 26B to 26F pass through the region overlapping the second main surface PS2 of the substrate 4 when viewed from the Z direction, and the first ends of the first metal posts 36A to 36E and the second The first ends of the metal posts 46B to 46F are connected. That is, the bridge pattern (jumper wiring) can be formed using the second main surface PS2 opposite to the first main surface PS1 on which the RFIC element 61 is mounted.

(I) The RFIC element 61 of the wireless IC device 201 is connected to the interlayer connection conductors 10A and 10B via the wiring conductor patterns 7A and 7B formed on the first main surface PS1 of the substrate 4. Therefore, the bridge pattern can be easily formed. The RFIC element 61 may be directly connected to the interlayer connection conductors 10A and 10B. However, the RFIC element 61 is connected to the interlayer connection conductors 10A and 10B via the wiring conductor patterns 7A and 7B for routing. The interlayer connection conductors 10A and 10B can be drawn out to any position of the four second main surfaces PS2.

(J) Since the power supply terminals 8A and 8B are formed on the wiring conductor patterns 7A and 7B and the RFIC element 61 is connected to the power supply terminals 8A and 8B, the RFIC element 61 and the mounting electrode form the magnetic field of the coil conductor. It becomes difficult to block, and the mutual interference between the coil conductor and the RFIC element 61 can be minimized.

<< Seventh Embodiment >>
FIG. 16 is a perspective view of an electronic apparatus 301 according to the seventh embodiment. FIG. 18 is a partially enlarged view of FIG.

  The electronic device 301 is a portable electronic device such as a smartphone, for example, and includes a wireless IC device 201 and a booster antenna 120 having a resonance frequency. From the viewpoint of FIG. 16, there is a lower housing 401 on the upper surface side of the electronic device 301 and an upper housing 402 on the lower surface side. A circuit board 80, a wireless IC device 201, and a booster antenna 120 having a resonance frequency are provided in a space surrounded by the lower casing 401 and the upper casing 402.

  The wireless IC device 201 is as shown in the sixth embodiment. The wireless IC device 201 is mounted on the circuit board 80 as shown in FIGS. Components other than the wireless IC device 201 are also mounted on the circuit board 80.

  A booster antenna 120 having a resonance frequency is attached to the inner surface of the lower housing 401. The booster antenna 120 is disposed at a position that does not overlap the battery pack 130. Booster antenna 120 includes insulator base material 123 and coil patterns 121 and 122 formed on insulator base material 123.

  The wireless IC device 201 is arranged so that the magnetic flux is linked to the coil conductor and the booster antenna 120. That is, the wireless IC device 201 and the booster antenna 120 are arranged so that the coil conductor of the wireless IC device 201 is magnetically coupled to the coil of the booster antenna 120. The broken line in FIG. 18 conceptually represents the magnetic flux contributing to the magnetic field coupling.

  The RFIC element 61 of the wireless IC device 201 faces (closes) the circuit board 80 side, and the coil conductor faces (closes) the booster antenna 120 side. Therefore, the degree of coupling between the coil conductor of the wireless IC device 201 and the booster antenna 120 is high. Further, since the wiring (particularly the digital signal line and the power supply line) connecting the RFIC element 61 and other circuit elements is wired substantially in parallel with the magnetic flux of the coil conductor, the coupling with the coil conductor is small.

  FIG. 19 is a perspective view of the booster antenna 120. FIG. 20 is a circuit diagram of the booster antenna 120. In the booster antenna 120, the first coil pattern 121 and the second coil pattern 122 are conductors patterned in a rectangular spiral shape, and are patterned so as to be capacitively coupled in a state where current flows in the same direction in plan view. . A stray capacitance is formed between the first coil pattern 121 and the second coil pattern 122. An LC resonance circuit is configured by the inductance of the first coil pattern 121 and the second coil pattern 122 and the capacitance of the stray capacitance. The resonance frequency of the LC resonance circuit is substantially equal to the communication frequency of the RFID system. The communication frequency is, for example, the 13.56 MHz band.

  According to this embodiment, since communication is possible using a large coil opening of the booster antenna, the longest communicable distance can be extended.

  With this configuration, it is possible to realize an electronic device including a surface mount antenna used for a communication system in the HF band or the UHF band.

  Further, as shown in this embodiment, the surface mount antenna (and also the RFID tag) in the present invention can be used as a primary antenna for supplying a magnetic field to a booster antenna.

<< Other Embodiments >>
In the above-described embodiment, the example in which the connection terminals 2A and 2B are provided on the first main surface VS1 of the base 1 is shown, but the present invention is not limited to this configuration. The connection terminal connected to the coil conductor may be configured to be formed other than the first main surface VS1 of the base 1.

  Note that the surface mount antenna (and also the RFID tag) in the present invention is not limited to the HF band, and can also be applied to the UHF band. In the case of a surface mount antenna for the UHF band, one end and the other end of the coil conductor may be used as a feeding end, but one end may be used as a feeding end and the other end may be an open end.

  The first linear conductor pattern on the first main surface VS1 (mounting surface) side and the second linear conductor pattern on the second main surface VS2 (top surface) constituting the coil conductor are connected on the side surface of the substrate 1. It may be a structure. That is, the metal post and the interlayer connection conductor may be exposed on the side surface of the substrate 1. Further, the first linear conductor pattern and the second linear conductor pattern constituting the coil conductor may be connected by a conductor pattern formed on the side surface of the substrate 1 without using a metal post or an interlayer connection conductor. Good.

ANT ... Coil conductors AX1, AX2A, AX2B, AX3, AX5, AX6 ... Winding axes C0, C1 ... Coil openings D1, D2 ... Distance between lines i1 ... Current LS1 ... First main surface LS2 of first base material layer 11 ... Second main surface PS1 of the first base material layer 11 ... First main surface PS2 of the substrate 4 ... Second main surface VS1 of the substrate 4 ... First main surface VS2 of the base material 1 ... Second main surface VS3 of the base material 1 ... 1st side surface VS4 of base material 1 ... 2nd side surface 1 of base material 1 ... Base material 2A, 2B ... Connection terminal 3A, 3B, 9A, 9B ... NC terminal 4 ... Board | substrate 5 ... Internal conductor pattern 6 ... Interlayer connection conductor 7A, 7B ... Wiring conductor patterns 8A, 8B ... Feed terminals 10A, 10B ... Interlayer connection conductors 11, 11a, 11b, 11c, 11d ... First base layer 12 ... Second base layer 13 ... Third base layer 21A , 21B, 21C, 21D, 22A, 22B, 22C, 22D, 23A 23B, 23C, 23D, 23E, 24A, 24B, 24C, 24D, 24E, 25A, 25B, 25C, 25D, 25E, 25F, 26A, 26B, 26C, 26D, 26E, 26F, 26G... (First linear conductor pattern)
31A, 31B, 31C, 31D, 31E, 34A, 34B, 34C, 34D, 34E, 34F, 35A1, 35A2, 35A3, 35A4, 35B1, 35B2, 35C1, 35C2, 35D1, 35D2, 35E1, 35E2, 36A, 36B, 36C, 36D, 36E, 36F ... 1st metal post 41A, 41B, 41C, 41D, 41E, 44A, 44B, 44C, 44D, 44E, 44F, 45A1, 45A2, 45B1, 45B2, 45C1, 45C2, 45D1, 45D2, 45E1, 45E2, 45E3, 45E4, 46A, 46B, 46C, 46D, 46E, 46F ... second metal posts 51A, 51C, 51D, 51E, 52A, 52B, 52C, 52D, 52E, 53A, 53B, 53C, 53D, 53E, 53F, 54A 54B, 54C, 54D, 54E, 55A, 55B, 55C, 55D, 55E, 56A, 56B, 56C, 56D, 56D, 56E, 56F ... second main surface side conductors (second linear conductor pattern)
X1... Length X2 in the winding axis direction of the formation region of the first main surface side conductor (first linear conductor pattern)... Winding axis of the formation region of the second main surface side conductor (second linear conductor pattern) Length PA1 in the direction ... formation region PA2 of the first main surface side conductor (first linear conductor pattern) ... formation region SP1 of the second main surface side conductor (second linear conductor pattern) ... second main surface side conductor The length of the forming region in the winding axis direction is shorter than the length of the first main surface side conductor forming region in the winding axis direction 61... RFIC elements 62 and 63... Chip capacitor 70. Substrate 81 ... Ground conductors 101, 102A, 102B, 103, 104, 105 ... Surface mount antenna 120 ... Booster antenna 121 ... First coil pattern 122 ... Second coil pattern 123 ... Insulator base 130 ... Battery Click 201 ... wireless IC device 301 ... electronic device 401 ... lower housing 402 ... upper housing

Claims (8)

A base material having a first main surface that is a mounting surface and a second main surface facing the first main surface;
A helical coil conductor formed on the substrate and having a winding axis in a direction along the first main surface and the second main surface;
With
The coil conductor has a first main surface side conductor and a second main surface side conductor,
The length in the winding axis direction of the formation region of the first main surface side conductor at the same position as viewed from the second main surface, and the length in the winding axis direction of the formation region of the second main surface side conductor. The length in the winding axis direction of the formation region of the second main surface side conductor is shorter than the length in the winding axis direction of the formation region of the first main surface side conductor in comparison with the length. A surface mount antenna. The base material is a resin member,
The portion of the coil conductor that extends from the first main surface to the second main surface is a metal post that reaches the first main surface and the second main surface of the base material. Surface mount antenna. The substrate is a laminate of a plurality of substrate layers,
2. The surface-mount antenna according to claim 1, wherein a portion of the coil conductor extending from the first main surface to the second main surface is an interlayer conductor formed on the base material layer.   The surface mount antenna according to any one of claims 1 to 3, wherein the base member includes a magnetic member that forms a magnetic core.   5. The surface-mount antenna according to claim 4, wherein portions of the coil conductor reaching the first main surface and the second main surface of the base are formed inside the magnetic member. A surface mount antenna,
A feeding circuit connected to the surface mount antenna,
With
The surface mount antenna is
A base material having a first main surface that is a mounting surface and a second main surface facing the first main surface;
A helical coil conductor formed on the substrate and having a winding axis in a direction along the first main surface and the second main surface;
With
The coil conductor has a first main surface side conductor and a second main surface side conductor,
The length in the winding axis direction of the formation region of the first main surface side conductor at the same position as viewed from the second main surface, and the length in the winding axis direction of the formation region of the second main surface side conductor. The length in the winding axis direction of the formation region of the second main surface side conductor is shorter than the length in the winding axis direction of the formation region of the first main surface side conductor in comparison with the length. Electronic equipment.   The electronic device according to claim 6, wherein the surface-mounted antenna is surface-mounted in the substrate in a plan view of the substrate.   The electronic device according to claim 6, wherein the surface-mounted antenna is surface-mounted on a substrate together with other electronic components.

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