JP2004280390A - Rf-id media and method for manufacturing the same - Google Patents

Rf-id media and method for manufacturing the same Download PDF

Info

Publication number
JP2004280390A
JP2004280390A JP2003070109A JP2003070109A JP2004280390A JP 2004280390 A JP2004280390 A JP 2004280390A JP 2003070109 A JP2003070109 A JP 2003070109A JP 2003070109 A JP2003070109 A JP 2003070109A JP 2004280390 A JP2004280390 A JP 2004280390A
Authority
JP
Japan
Prior art keywords
antenna
ic chip
connection terminal
noble metal
base sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003070109A
Other languages
Japanese (ja)
Inventor
Masao Sekihashi
正雄 関端
Original Assignee
Toppan Forms Co Ltd
トッパン・フォームズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Forms Co Ltd, トッパン・フォームズ株式会社 filed Critical Toppan Forms Co Ltd
Priority to JP2003070109A priority Critical patent/JP2004280390A/en
Publication of JP2004280390A publication Critical patent/JP2004280390A/en
Pending legal-status Critical Current

Links

Images

Abstract

To prevent a decrease in conductivity between an antenna and an IC chip.
A surface of an antenna is covered with a coating thin film made of an inert noble metal to prevent oxidation on the surface of the antenna.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an RF-ID medium such as a non-contact type IC card capable of writing and reading information in a non-contact state, and a method of manufacturing the RF-ID medium.
[0002]
[Prior art]
In recent years, with the progress of the information society, information is recorded on a card, and information management, settlement, and the like using the card are performed. Further, information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag.
[0003]
In information management using such a card, label, or tag, a non-contact type IC mounted with an IC capable of writing and reading information in a non-contact state with respect to the card, label, or tag Cards, non-contact IC labels, and non-contact IC tags are rapidly spreading due to their excellent convenience.
[0004]
5A and 5B are views showing an example of the structure of a general non-contact type IC tag. FIG. 5A is a view showing an internal structure, and FIG. It is.
[0005]
As shown in FIG. 5, the non-contact type IC tag in this conventional example has an IC chip 511 capable of writing and reading information from outside, mounted on a resin sheet 515 via an adhesive 516, and both ends. Is connected to an IC chip 511 via a connection terminal 514 at a pad portion provided on the IC chip 511, and supplies a current to the IC chip 511 by electromagnetic induction from an externally provided information writing / reading device (not shown). An inlet 510 having a coiled conductive antenna 512 for writing and reading information to and from the chip 511 in a non-contact state, and an adhesive layer 550 on a surface of the inlet 510 on which the IC chip 511 is mounted. A surface on which information is printed while protecting the IC chip 511 and the antenna 512 It is constructed from over door 520 Metropolitan.
[0006]
In the non-contact type IC tag 500 configured as described above, the antenna 512 is connected to the IC chip 511 by electromagnetic induction from the information writing / reading device by approaching the information writing / reading device provided outside. Current is supplied to the IC chip 511 in the non-contact state, and the information written in the IC chip 511 is read by the information writing / reading device in the non-contact state. Or be done.
[0007]
Hereinafter, a method of manufacturing the above-described non-contact type IC tag 500 will be described.
[0008]
FIG. 6 is a diagram for explaining a method of manufacturing the non-contact type IC tag 500 shown in FIG.
[0009]
First, a coil-shaped antenna 512 having pad portions at both ends is formed on a resin sheet 515 by etching, printing, or the like (FIG. 6A). In addition, as a material of the antenna 512, copper, silver, aluminum, or the like is given as an example. However, when aluminum is used, manufacturing cost can be reduced.
[0010]
Next, the IC chip 511 is placed on the resin sheet 515 via an adhesive 516 containing conductive particles so that the connection terminal 514 of the IC chip 511 comes into contact with a pad portion of the antenna 512 which is a connection portion with the IC chip 511. Mounted on top (FIG. 6 (b)). Here, the connection terminals 514 of the IC chip 511 are made of a noble metal base such as gold, silver, or palladium.
[0011]
Next, the IC chip 511 and the resin sheet 515 are heated by applying a predetermined pressure to the IC chip 511 in a direction toward the resin sheet 515 so that the IC chip 511 is bonded to the resin sheet 515 with an adhesive 516. The antenna 512 and the IC chip 511 are electrically connected via the provided connection terminal 514 to complete the inlet 510 (FIG. 6C). Here, the adhesive 516 contains minute conductive particles, and the adhesive 516 alone does not have conductivity, and only those that come into contact through the conductive particles conduct. Therefore, only the connection between the antenna 512 and the connection terminal 514 is conducted.
[0012]
After that, the topsheet 520 is laminated on the inlet 510 via the adhesive layer 550 to complete the non-contact type IC tag 500 (FIG. 6D).
[0013]
In the non-contact type IC tag 500 manufactured by the above-described process, the antenna 512 and the IC chip 511 are electrically connected to each other at the pad portion of the antenna 512 and the connection terminal 514 of the IC chip 511 via the conductive adhesive 516. For example, when aluminum is used as the material of the antenna 512, the surface of the antenna 512 is oxidized because aluminum has high activity and is easily oxidized. The resistance value may increase, and the conductivity between the antenna 512 and the IC chip 511 may be reduced. In particular, if aluminum is left in a high-temperature and high-humidity environment, oxides on the surface of aluminum increase, and a connection failure between the antenna 512 and the IC module 511 due to an increase in resistance may occur. .
[0014]
Here, a technique has been considered in which the antenna 512 is covered with a resin composition containing a compound having an antioxidant function, thereby preventing the antenna 512 from being oxidized (for example, see Patent Document 1).
[0015]
[Patent Document 1]
JP-A-11-306306
[Problems to be solved by the invention]
However, as described above, when the antenna is covered with the resin composition containing the compound having an antioxidant function, thereby preventing the antenna from being oxidized, the portion of the antenna connected to the IC chip has conductivity. It is not coated with a resin composition to secure it, and therefore, the connection portion of the antenna with the IC chip is oxidized, thereby reducing the conductivity between the antenna and the IC chip, as described above. There is a risk of doing this.
[0017]
The present invention has been made in view of the above-mentioned problems of the conventional technology, and has been made in consideration of the RF-ID media and the RF-ID media capable of preventing a decrease in conductivity between an antenna and an IC chip. An object of the present invention is to provide a method for manufacturing an ID medium.
[0018]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides
An antenna having conductivity is formed over the base sheet, and a connection terminal for connecting to the antenna is provided. At least an IC chip from which information can be read is connected to the antenna by the connection terminal. An RF-ID medium comprising at least a base material mounted on the base sheet so that reading of information from the IC chip via the antenna is performed in a non-contact state.
The antenna is characterized in that the antenna is covered with a material made of an inert noble metal.
[0019]
Further, the antenna is characterized in that only a region connected to the connection terminal is covered with the material made of the inactive noble metal.
[0020]
Further, a eutectic layer composed of the material forming the antenna and the material composed of the inert noble metal is provided between the antenna and the material composed of the inert noble metal.
[0021]
In addition, an antenna having conductivity is formed over the base sheet, and a connection terminal for connecting to the antenna is provided. An IC chip from which information can be read at least is connected to the antenna by the connection terminal. A method of manufacturing an RF-ID medium, comprising at least a base material mounted on the base sheet so as to be connected, and reading information from the IC chip through the antenna in a non-contact state. So,
Forming the antenna on the base sheet;
Coating the antenna with a material made of an inert noble metal,
Mounting the IC chip on the base sheet so that the connection terminal and the antenna are connected via a material made of the inert noble metal;
Connecting the connection terminal and the antenna via the inert noble metal material by applying pressure to the IC chip mounted on the base sheet in a direction toward the base sheet. It is characterized by having.
[0022]
In addition, an antenna having conductivity is formed over the base sheet, and a connection terminal for connecting to the antenna is provided, and an IC chip capable of writing and reading information is connected to the antenna by the connection terminal. A base material mounted on the base sheet so as to be connected to the RF-ID medium, in which writing and reading of information to and from the IC chip are performed in a non-contact state via the antenna. A manufacturing method,
Forming the antenna on the base sheet;
A step of coating only a region of the antenna connected to the connection terminal with a material made of an inert noble metal,
Mounting the IC chip on the base sheet so that the connection terminal and the antenna are connected via a material made of the inert noble metal;
Connecting the connection terminal and the antenna via the inert noble metal material by applying pressure to the IC chip mounted on the base sheet in a direction toward the base sheet. It is characterized by having.
[0023]
In addition, after the antenna is coated with the material made of the inert noble metal, the material forming the antenna and the inert noble metal are formed between the antenna and the material made of the inert noble metal by annealing. Forming a eutectic layer composed of a material.
[0024]
(Action)
In the present invention configured as described above, since the antenna is covered with the inert noble metal material, the surface of the antenna is prevented from being oxidized. Here, when the surface of the antenna is oxidized, the resistance value of the surface of the antenna increases, thereby reducing the conductivity between the antenna and a connection terminal connected to the antenna. Therefore, as in the present invention, the antenna is covered with a material made of an inert noble metal, and the antenna and the connection terminal of the IC chip are connected via the material made of the inert noble metal. Thus, the surface of the antenna is prevented from being oxidized, and the conductivity between the antenna and the connection terminal does not decrease, whereby the conductivity between the antenna and the IC chip can be prevented from decreasing. In addition, when aluminum is used as a material for forming the antenna, the manufacturing cost can be reduced. However, since aluminum has high activity, the surface is easily oxidized. Therefore, by adopting a structure capable of preventing the surface of the antenna from being oxidized as in the present invention, the manufacturing cost can be reduced.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0026]
(First Embodiment)
1A and 1B are diagrams showing a first embodiment of a non-contact type IC tag according to the present invention, wherein FIG. 1A shows an internal structure, and FIG. 1B shows an AA ′ portion shown in FIG. FIG.
[0027]
In this embodiment, as shown in FIG. 1, an IC chip 111 capable of externally writing and reading information is mounted on a resin sheet 115 serving as a base sheet via an adhesive 116 and provided at both ends. The pad portion is connected to the IC chip 111 via the connection terminal 114 at the pad portion, and supplies a current to the IC chip 111 by electromagnetic induction from an externally provided information writing / reading device (not shown). A coiled conductive antenna 112 for writing and reading information in a non-contact state is formed, and a coating thin film 117 made of an inert noble metal is formed on the antenna 112 by a method such as plating. Through the adhesive layer 150 on the surface of the inlet 110 on which the IC chip 111 is mounted. It protects the IC chip 111 and the antenna 112, information on the surface and a surface sheet 120. to be printed.
[0028]
In the non-contact type IC tag 100 configured as described above, the antenna 112 approaches the IC chip 111 by electromagnetic induction from the information writing / reading device by approaching the information writing / reading device provided outside. Current is supplied to the IC chip 111 in the non-contact state, and the information written in the IC chip 111 is read by the information writing / reading device in the non-contact state. Or be done.
[0029]
Hereinafter, a method for manufacturing the above-described non-contact IC tag 100 will be described.
[0030]
FIG. 2 is a view for explaining a method of manufacturing the non-contact type IC tag 100 shown in FIG.
[0031]
First, a coil-shaped antenna 112 made of copper, silver, or aluminum and having pad portions at both ends is formed on a resin sheet 115 (FIG. 2A). As a method for forming the antenna 112, when the antenna 112 is formed from copper, a method such as etching or printing is considered. When the antenna 112 is formed from silver, a method such as screen printing of silver paste is used. Can be considered. When the antenna 112 is formed from aluminum, an aluminum foil is adhered to the resin sheet 115 with an adhesive, and then formed using a photoresist coating-exposure phenomenon, or an aluminum wire is formed on the resin sheet 115. A method of forming the antenna 112 by arranging it in a coil shape and then rolling both ends of the coiled aluminum wire to be the pad portion of the antenna 112 is conceivable. When aluminum is used as the material of the antenna 112, the manufacturing cost can be reduced.
[0032]
Next, a coating thin film 117 made of an inactive noble metal such as gold, silver, or palladium is formed on the antenna 112 by a method such as plating (FIG. 2B). The coating thin film 117 is formed by, for example, a general zinc-substitution type electric nickel-gold plating method using nickel as a base, but may be composed of only nickel. It is also conceivable to form a gold wire by arranging it on the antenna 112 and rolling the gold wire. In addition, the antenna 112 is formed from aluminum, and as a forming method, an aluminum wire is arranged in a coil shape on the resin sheet 115, and then both ends of the coil-shaped aluminum wire serving as a pad portion of the antenna 112 are rolled. When the antenna 112 is formed by the method described above, a gold foil is wrapped around the aluminum wire before rolling, and both ends of the aluminum wire on which the gold foil is wrapped, which are pad portions of the antenna 112, are rolled to cover the antenna 112 with the coating thin film 117. It is possible to do.
[0033]
In this state, when the resin sheet 115 on which the coating thin film 117 is formed on the antenna 112 is overheat-annealed in an atmosphere of an inert gas such as nitrogen, the antenna 112 is formed between the antenna 112 and the coating thin film 117. A eutectic layer is formed by fusing the crystal of the material and the crystal of the material constituting the coating thin film 117.
[0034]
Next, via an adhesive 116 containing conductive particles, the connection terminal 114 of the IC chip 111 is brought into contact with the coating thin film 117 formed on a pad portion serving as a connection portion of the antenna 112 with the IC chip 111. The IC chip 111 is mounted on the resin sheet 115 (FIG. 2C). Here, the connection terminals 114 of the IC chip 111 are made of a noble metal base such as gold, silver, or palladium.
[0035]
Next, by heating the IC chip 111 in a direction toward the resin sheet 115 while applying a predetermined pressure, the IC chip 111 and the resin sheet 115 are adhered by the adhesive 116 and the IC chip 111 The antenna 112 and the IC chip 111 are electrically connected via the provided connection terminals 114 and the covering thin film 117 formed on the antenna 112, thereby completing the inlet 110 (FIG. 2D). Here, the adhesive 116 contains minute conductive particles, and the adhesive 116 alone does not have conductivity, and only those that come into contact through the conductive particles conduct. Therefore, only the antenna 112 and the connection terminal 114 conduct through the coating thin film 117.
[0036]
After that, the topsheet 120 is laminated on the inlet 110 via the adhesive layer 150 to complete the non-contact type IC tag 100 (FIG. 2E).
[0037]
In the non-contact type IC tag 100 manufactured in the above-described process, since the antenna 112 is covered with the coating thin film 117 made of an inert noble metal, the surface of the antenna 112 is not oxidized. A decrease in conductivity between the antenna 112 and the IC chip 111 can be prevented. In particular, even when, for example, highly active aluminum or the like is used for the antenna 112, oxidation of the surface of the antenna 112 can be prevented, so that manufacturing cost can be reduced.
[0038]
(Second embodiment)
3A and 3B are views showing a second embodiment of the non-contact type IC tag according to the present invention, wherein FIG. 3A shows the internal structure, and FIG. 3B shows the AA 'part shown in FIG. FIG.
[0039]
In this embodiment, as shown in FIG. 3, an IC chip 211 capable of writing and reading information from the outside is mounted on a resin sheet 215 as a base sheet via an adhesive 216 and provided at both ends. The pad portion is connected to the IC chip 211 via the connection terminal 214 and supplies a current to the IC chip 211 by electromagnetic induction from an externally provided information writing / reading device (not shown). A coil-shaped conductive antenna 212 for writing and reading information in a non-contact state is formed, and furthermore, only a pad portion which is a region connected to the connection terminal 214 on the antenna 212 is inactive. The inlet 210 provided with the coating thin film 217 made of a noble metal, and the surface of the inlet 210 on which the IC chip 211 is mounted. Are stacked through a Chakuzaiso 250 protects the IC chip 211 and the antenna 212, information on the surface and a surface sheet 220. to be printed.
[0040]
In the non-contact type IC tag 200 configured as described above, the antenna 212 is connected to the IC chip 211 by electromagnetic induction from the information writing / reading device by approaching the information writing / reading device provided outside. Current is supplied to the IC chip 211 in the non-contact state, and the information written in the IC chip 211 is read by the information writing / reading device in the non-contact state. Or be done.
[0041]
Hereinafter, a method for manufacturing the above-described non-contact type IC tag 200 will be described.
[0042]
FIG. 4 is a diagram for explaining a method of manufacturing the non-contact type IC tag 200 shown in FIG.
[0043]
First, a coil-shaped antenna 212 made of copper, silver, or aluminum and having pad portions at both ends is formed on a resin sheet 215 (FIG. 4A). As a method for forming the antenna 212, when the antenna 212 is formed from copper, a method such as etching or printing is considered, and when the antenna 212 is formed from silver, a method such as screen printing of silver paste is used. Can be considered. When the antenna 212 is formed from aluminum, an aluminum foil is adhered onto the resin sheet 215 with an adhesive, and then formed using a photoresist coating-exposure phenomenon, or an aluminum wire is formed on the resin sheet 215 by using an aluminum wire. A method of forming the antenna 212 by arranging it in a coil shape and then rolling both ends of a coiled aluminum wire to be a pad portion of the antenna 212 is conceivable. When aluminum is used as the material of the antenna 212, the manufacturing cost can be reduced.
[0044]
Next, a coating thin film 217 made of an inert noble metal such as gold, silver, or palladium is formed on a pad portion of the antenna 212 that is to be connected to the connection terminal 214 on the antenna 212 (FIG. 4B). )). The formation of the coating thin film 217 may be performed by, for example, arranging a gold foil on the pad portion of the antenna 212 or arranging a gold ball on the pad portion of the antenna 212 and rolling.
[0045]
In this state, when the resin sheet 215 in which the coating thin film 217 is formed on the pad portion of the antenna 212 is overheat-annealed in an atmosphere of an inert gas such as nitrogen, the antenna 212 is placed between the antenna 212 and the coating thin film 217. The eutectic layer is formed by fusing the crystal of the material constituting the material and the crystal of the material constituting the coating thin film 217.
[0046]
Next, the IC chip 211 is placed on the resin sheet 215 via the adhesive 216 containing conductive particles so that the connection terminal 214 of the IC chip 211 comes into contact with the coating thin film 217 formed on the pad portion of the antenna 212. (FIG. 4C). Here, the connection terminals 214 of the IC chip 211 are made of a noble metal base such as gold, silver, or palladium.
[0047]
Next, by heating the IC chip 211 while applying a predetermined pressure in a direction toward the resin sheet 215, the IC chip 211 and the resin sheet 215 are bonded to each other with an adhesive 216, and the IC chip 211 The antenna 212 and the IC chip 211 are electrically connected via the provided connection terminal 214 and the coating thin film 217 formed on the pad portion of the antenna 212, thereby completing the inlet 210 (FIG. 4D). Here, the adhesive 216 contains minute conductive particles, and the adhesive 216 alone does not have conductivity, and only those that come into contact via the conductive particles conduct. Therefore, only the connection between the antenna 212 and the connection terminal 214 is conducted through the coating thin film 217.
[0048]
Then, the topsheet 220 is laminated on the inlet 210 via the adhesive layer 250 to complete the non-contact type IC tag 200 (FIG. 4E).
[0049]
In the non-contact type IC tag 200 manufactured in the above-described process, the pad portion which is a region connected to the connection terminal 214 of the antenna 212 is covered with the coating thin film 217 made of an inert noble metal. A pad portion which is a region connected to the connection terminal 214 on the surface of the 212 is not oxidized, so that a decrease in conductivity between the antenna 212 and the IC chip 211 can be prevented. In particular, even when, for example, highly active aluminum or the like is used for the antenna 212, oxidation of a pad portion which is a region connected to the connection terminal 214 of the antenna 212 can be prevented, so that manufacturing cost is reduced. be able to.
[0050]
In the above-described embodiment, a non-contact type IC tag has been described as an example of the RF-ID medium in which information can be written and read in a non-contact state. The same effect can be obtained with an IC chip capable of performing the above operation. Furthermore, the IC chip is not limited to a non-contact type IC tag, but may be a non-contact type IC label or a non-contact type IC card. The present invention can be applied to any configuration including an inlet mounted so as to be connected to the antenna via the antenna.
[0051]
【The invention's effect】
As described above, in the present invention, an antenna having conductivity is formed on a base sheet, and a connection terminal for connecting to the antenna is provided. An RF-ID medium including at least a base material mounted on a base sheet so as to be connected to an antenna by a connection terminal, and reading information from an IC chip through the antenna in a non-contact state, Since the antenna is configured to be covered with an inert noble metal material, a decrease in conductivity between the antenna and the IC chip can be prevented.
[Brief description of the drawings]
FIG. 1 is a view showing a first embodiment of a non-contact type IC tag according to the present invention, in which (a) shows an internal structure, and (b) shows an AA ′ part shown in (a). FIG.
FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC tag shown in FIG.
3A and 3B are diagrams showing a second embodiment of the non-contact type IC tag according to the present invention, wherein FIG. 3A shows an internal structure, and FIG. 3B shows an AA ′ portion shown in FIG. FIG.
FIG. 4 is a view for explaining a method of manufacturing the non-contact type IC tag shown in FIG.
5A and 5B are diagrams illustrating an example of the structure of a general non-contact type IC tag, wherein FIG. 5A illustrates an internal structure, and FIG. 5B is a cross-sectional view taken along the line AA ′ illustrated in FIG. It is.
FIG. 6 is a diagram for explaining a method of manufacturing the non-contact type IC tag shown in FIG.
[Explanation of symbols]
100, 200 Non-contact type IC tag 110, 200 Inlet 111, 211 IC chip 112, 212 Antenna 114, 214 Connection terminal 115, 215 Resin sheet 116, 216 Adhesive 117, 217 Coating thin film 120, 220 Surface sheet 150, 250 Adhesion Agent layer

Claims (6)

  1. An antenna having conductivity is formed over the base sheet, and a connection terminal for connecting to the antenna is provided. At least an IC chip from which information can be read is connected to the antenna by the connection terminal. An RF-ID medium comprising at least a base material mounted on the base sheet so that reading of information from the IC chip via the antenna is performed in a non-contact state.
    The said antenna is coated with the material which consists of inert noble metals, The RF-ID medium characterized by the above-mentioned.
  2. The RF-ID medium according to claim 1,
    The RF-ID medium according to claim 1, wherein only a region of the antenna connected to the connection terminal is coated with the material made of the inactive noble metal.
  3. In the RF-ID medium according to claim 1 or claim 2,
    An RF-ID medium comprising, between the antenna and the material made of the inert noble metal, a eutectic layer made of a material made up of the antenna and a material made of the inert noble metal. .
  4. An antenna having conductivity is formed over the base sheet, and a connection terminal for connecting to the antenna is provided. At least an IC chip from which information can be read is connected to the antenna by the connection terminal. A base material mounted on the base sheet so as to read information from the IC chip via the antenna in a non-contact state. ,
    Forming the antenna on the base sheet;
    Coating the antenna with a material made of an inert noble metal,
    Mounting the IC chip on the base sheet so that the connection terminal and the antenna are connected via a material made of the inert noble metal;
    Connecting the connection terminal and the antenna via the inert noble metal material by applying pressure to the IC chip mounted on the base sheet in a direction toward the base sheet. A method for manufacturing an RF-ID medium, comprising:
  5. An antenna having conductivity is formed over a base sheet, and a connection terminal for connecting to the antenna is provided. An IC chip capable of writing and reading information is connected to the antenna by the connection terminal. At least a base material mounted on the base sheet so that writing and reading of information to and from the IC chip via the antenna are performed in a non-contact state. And
    Forming the antenna on the base sheet;
    A step of coating only a region of the antenna connected to the connection terminal with a material made of an inert noble metal,
    Mounting the IC chip on the base sheet so that the connection terminal and the antenna are connected via a material made of the inert noble metal;
    Connecting the connection terminal and the antenna via the inert noble metal material by applying pressure to the IC chip mounted on the base sheet in a direction toward the base sheet. A method for manufacturing an RF-ID medium, comprising:
  6. In the method for manufacturing an RF-ID medium according to claim 4 or 5,
    After covering the antenna with the material made of the inert noble metal, the material forming the antenna and the material made of the inert noble metal between the antenna and the material made of the inert noble metal by annealing treatment. Forming an eutectic layer composed of: an RF-ID medium.
JP2003070109A 2003-03-14 2003-03-14 Rf-id media and method for manufacturing the same Pending JP2004280390A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003070109A JP2004280390A (en) 2003-03-14 2003-03-14 Rf-id media and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003070109A JP2004280390A (en) 2003-03-14 2003-03-14 Rf-id media and method for manufacturing the same

Publications (1)

Publication Number Publication Date
JP2004280390A true JP2004280390A (en) 2004-10-07

Family

ID=33286944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003070109A Pending JP2004280390A (en) 2003-03-14 2003-03-14 Rf-id media and method for manufacturing the same

Country Status (1)

Country Link
JP (1) JP2004280390A (en)

Cited By (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008136226A1 (en) 2007-04-26 2008-11-13 Murata Manufacturing Co., Ltd. Wireless ic device
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US8011589B2 (en) 2008-06-25 2011-09-06 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US8078106B2 (en) 2006-01-19 2011-12-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8191791B2 (en) 2007-07-17 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8360330B2 (en) 2007-12-26 2013-01-29 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8610636B2 (en) 2007-12-20 2013-12-17 Murata Manufacturing Co., Ltd. Radio frequency IC device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag

Cited By (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8326223B2 (en) 2006-01-19 2012-12-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8725071B2 (en) 2006-01-19 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8078106B2 (en) 2006-01-19 2011-12-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
WO2008136226A1 (en) 2007-04-26 2008-11-13 Murata Manufacturing Co., Ltd. Wireless ic device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8662403B2 (en) 2007-07-04 2014-03-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8191791B2 (en) 2007-07-17 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US9830552B2 (en) 2007-07-18 2017-11-28 Murata Manufacturing Co., Ltd. Radio IC device
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US8610636B2 (en) 2007-12-20 2013-12-17 Murata Manufacturing Co., Ltd. Radio frequency IC device
US8360330B2 (en) 2007-12-26 2013-01-29 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8915448B2 (en) 2007-12-26 2014-12-23 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US8960557B2 (en) 2008-05-21 2015-02-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8973841B2 (en) 2008-05-21 2015-03-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US9022295B2 (en) 2008-05-21 2015-05-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8047445B2 (en) 2008-05-22 2011-11-01 Murata Manufacturing Co., Ltd. Wireless IC device and method of manufacturing the same
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
US8011589B2 (en) 2008-06-25 2011-09-06 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8876010B2 (en) 2009-04-14 2014-11-04 Murata Manufacturing Co., Ltd Wireless IC device component and wireless IC device
US9564678B2 (en) 2009-04-21 2017-02-07 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9203157B2 (en) 2009-04-21 2015-12-01 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8757502B2 (en) 2011-02-28 2014-06-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag

Similar Documents

Publication Publication Date Title
JP4618462B2 (en) Disposable chip electronic device and manufacturing method
JP4290233B2 (en) Method of wire bonding an integrated circuit to a super flexible substrate
EP1014302B1 (en) Noncontact ic card and manufacture thereof
TWI337428B (en)
EP0869453B1 (en) Chip card manufacturing process
US7405709B2 (en) Magnetic core member, antenna module, and mobile communication terminal having the same
JP3907461B2 (en) Manufacturing method of semiconductor module
JP2818605B2 (en) Electronic module for small portable objects such as cards or keys with integrated circuits and method of manufacturing the same
ES2328337T3 (en) Data support with integrated circuit.
US6659356B2 (en) Hybrid IC card
US6910636B2 (en) IC card and manufacturing method thereof
EP1117067B1 (en) Ic card
CN100388305C (en) RFID tag
EP1394734B1 (en) Ic card
KR100679502B1 (en) Rfid tag, rfid-tag antenna, rfid-tag antenna sheet, and method of manufacturing rfid tag
EP1818860B1 (en) RFID device
JP4241147B2 (en) IC card manufacturing method
US6572022B2 (en) Information recording tag
JP2814477B2 (en) Non-contact IC card and method of manufacturing the same
US20150129665A1 (en) Connection bridges for dual interface transponder chip modules
JP4367013B2 (en) Non-contact communication medium
EP1048483B1 (en) Card-like semiconductor device
ES2306479T3 (en) Procedure for manufacturing intelligent cards suitable to ensure operation by contact and without contact.
US7150406B2 (en) Thin electronic label and method for making same
JP4744442B2 (en) Antenna circuit, IC inlet and IC tag

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060224

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080716

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080723

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20081119