JPWO2002061675A1 - Non-contact identification medium - Google Patents

Non-contact identification medium Download PDF

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Publication number
JPWO2002061675A1
JPWO2002061675A1 JP2002561768A JP2002561768A JPWO2002061675A1 JP WO2002061675 A1 JPWO2002061675 A1 JP WO2002061675A1 JP 2002561768 A JP2002561768 A JP 2002561768A JP 2002561768 A JP2002561768 A JP 2002561768A JP WO2002061675 A1 JPWO2002061675 A1 JP WO2002061675A1
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JP
Japan
Prior art keywords
antenna coil
capacitor
capacitance
rfid
identification medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002561768A
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Japanese (ja)
Inventor
武宏 大川
武宏 大川
宏 吉木
宏 吉木
Original Assignee
株式会社ルネサステクノロジ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ルネサステクノロジ filed Critical 株式会社ルネサステクノロジ
Priority to PCT/JP2001/000652 priority Critical patent/WO2002061675A1/en
Publication of JPWO2002061675A1 publication Critical patent/JPWO2002061675A1/en
Granted legal-status Critical Current

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B5/00Near-field transmission systems, e.g. inductive loop type
    • H04B5/0012Near-field transmission systems, e.g. inductive loop type using capacitive coupling
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0726Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Abstract

In a non-contact identification medium having a resonance circuit, an IC is connected to a portion of the resonance circuit that has little influence on the resonance frequency in order to eliminate a step of correcting a difference in manufacturing the capacitor between the IC terminals. By doing so, there is an advantage that an inexpensive non-contact identification medium can be provided that eliminates the step of correcting the manufacturing difference in capacitance between IC terminals.

Description

TECHNICAL FIELD The present invention relates to a non-contact identification medium having no battery, such as a non-contact IC card and a wireless tag.
Background Art A non-contact identification medium such as a non-contact IC card or a wireless tag that stores information in an electronic circuit and performs non-contact information communication (hereinafter referred to as a RFID (radio frequency) that indicates a non-contact identification medium in the present specification. RFID that does not have a battery receives an electromagnetic field of a specific frequency radiated from an antenna of an external device for communication as a carrier wave in an antenna coil, and performs direct current power in an IC connected to the antenna coil. And used by the IC itself. The IC communicates with an external device via an RFID antenna coil and an external device antenna.
In recent years, expectations for RFID have increased, and it has been demanded that the communication distance between the external device and the RFID be extended as much as possible under given conditions such as the electromagnetic field output of the external device in order to use the device more conveniently.
As means for extending the communication distance between the external device and the RFID, as shown in the circuit block configuration of the basic circuit block diagram of the RFID as an example of the prior art in FIG. A technique of connecting a capacitor in parallel with a coil to form a resonance circuit in accordance with the frequency of a carrier is generally used. An IC is also connected in parallel with the capacitor to receive maximum power. In an RFID basic circuit block diagram as an example of the prior art shown in FIG. 1, a capacitor 2 for parallel resonance is connected to both ends of an antenna coil 1 and a terminal capacitance 3A having a smaller value than the capacitance of the capacitor. An IC 3 is connected in parallel with the capacitor 2.
The resonance frequency is determined by the sum of the capacitance of the capacitor 2 and the capacitance 3A between the terminals of the IC 3 and the inductance of the antenna coil 1.
The capacitor 2 is formed by a double-sided metallized pattern on an ultra-thin dielectric which is an RFID substrate.
Although the inductance of the antenna coil 1 and the capacitance of the capacitor 2 formed by the double-sided metallized pattern can maintain the manufacturing accuracy, the capacitance 3A of the connection end of the IC 3 with the antenna coil varies by about 20 to 30% due to various manufacturing factors. Has to be born. This variation directly affects the resonance frequency. Therefore, as means for adjusting the resonance circuit to a predetermined resonance frequency, trimming of a capacitor formed by the metallized pattern (for example, Japanese Patent Application Laid-Open No. 11-353440) is performed.
FIG. 2 is a circuit block diagram of the RFID when the resonance capacitor 2 as an example of the conventional technique is formed by a double-sided metallized pattern.
1 is obtained by adding trimming capacitors 2A to 2H to the circuit block configuration of FIG. 1. The total capacitance of the capacitors 2A to 2H is formed to a value that includes the manufacturing difference of the capacitance 3A between the connection terminals of the IC 3. In order to correct the difference in resonance frequency due to the capacitance 3A between the connection terminals of the IC 3, trimming is performed to cut off the corresponding connection point to match the required resonance frequency of the capacitors 2A to 2H.
FIG. 3 is an example of a mounting diagram in which the above-described configuration is applied to a card-type RFID.
In FIG. 3, the base material 4 is shown as transparent, but an extremely thin 1/50 mm thick polyimide material is used, and the antenna coil 1 is metallized on both surfaces of the base material 4 by the metallization pattern on the back surface of the base material 4. The resonance capacitors 2 and 2A to 2H are formed by the pattern. The outer peripheral end of the antenna coil 1 is connected to the front side pattern by through-hole processing, connected to the front side of the capacitors 2 and 2A to 2H, connected to the back side pattern by through-hole processing, and connected to one terminal of the IC3. . The inner peripheral end of the antenna coil 1 is connected to the other terminal of the IC and to the back side of the capacitors 2 and 2A to 2H. After mounting the IC 3, the resonance frequency is measured, and trimming for mechanically cutting the corresponding connection point of the capacitors 2A to 2H is performed to obtain a required resonance frequency.
FIG. 4 shows another example of the conventional technique, and is a circuit block configuration diagram of a case where a capacitor corresponding to a capacitor based on an external metallization pattern is formed in a semiconductor in an IC.
The same trimming as described above is performed by laser processing or the like to set the capacitance of the capacitor formed of the semiconductor to a predetermined value.
Also, a resonance circuit is formed in parallel with an antenna coil in Japanese Patent Application Laid-Open No. 2000-278172, and a point in the middle or extension of the antenna coil where the input impedance of the load circuit is equal to the output impedance from the resonance circuit and the load circuit are connected. A non-contact identification medium (RFID) that efficiently transmits power by connecting (so-called impedance matching) is described.
DISCLOSURE OF THE INVENTION Since the capacitance between the antenna coil connection terminals of the IC varies depending on factors in manufacturing the IC, it is necessary to trim the capacitor formed by a metallized pattern or to adjust the resonance frequency as the RFID accurately. The trimming process by either of the methods of trimming the internal capacitor forming circuit portion is inevitable, resulting in a large amount of work time and cost. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and eliminates the need for trimming by employing a circuit configuration that minimizes the influence on the resonance frequency due to variations in the capacitance between the antenna coil connection terminals of the IC. An RFID can be provided.
In the RFID of the present invention, in an RFID in which a resonance circuit is formed in accordance with a power carrier frequency by an inductance of an antenna coil and a capacitance of a resonance capacitor connected to the antenna coil, an IC receiving power supply and the antenna coil are connected. The connection point is not connected in parallel with the capacitor. The reason for having this feature is as follows.
That is, in order to reduce the influence of the difference in capacitance between the terminals of the IC on the resonance frequency, a resonance circuit is formed by an antenna coil and a capacitor formed by a metallization pattern connected to the antenna coil, and a part of the antenna coil is formed. Connect to IC. FIG. 5 is a circuit block diagram of an RFID as an example of the present invention. In FIG. 5, a resonance capacitor 2 is connected to both ends of an antenna coil 1, and an IC 3 having a terminal capacitance 3A having a smaller value than the capacitance of the capacitor 2 is connected to one end and the middle of the antenna coil. .
The resonance frequency is dominated by the inductance of the entire antenna coil 1 and the capacitance of the capacitor 2, and the influence on the change in the capacitance between the terminals of the IC 3 is significantly reduced. However, the effect is greater as the ratio of the capacitance of the capacitor 2 to the capacitance between the terminals of the IC 3 is larger, and it is preferable that the ratio is 2: 1 or more.
Further, the damping effect on the Q of the resonance circuit due to the resistance between the terminals of the IC 3 is significantly reduced, and the influence on the communicable distance due to manufacturing differences is also significantly reduced.
Further, by forming the capacitor 2 acting dominantly on the resonance frequency with a double-sided metallized pattern on the dielectric substrate, it is not necessary to consider the withstand voltage of the capacitor, and the number of turns of the antenna coil 1 is set to be large. By selecting a connection point between the antenna coil 1 and the IC 3, it is possible to supply a minimum necessary power to the IC 3, and an overvoltage for preventing damage to the IC 3 due to excessive power supply is prevented. There is no need to provide a protection circuit.
FIG. 6 is an example of a graph showing the voltage between both ends of the antenna coil 1 of the RFID according to the distance between the RFID and the transmitting antenna coil in the circuit block configuration shown in FIG. The measurement was performed by replacing a capacitor having the same value with the IC3. In this case, the ratio of the capacitance between the terminals of the capacitor 2 and the IC 3 is about 9: 1.
In FIG. 6, the resonance frequency is adjusted to the carrier frequency from the external device by adjusting the capacitance of the capacitor 2 connected in parallel with the capacitor equal to the capacitance between the terminals of the IC 3 shown by the curve 6A, and shown by the curve 6B. This shows a comparison with the case where the capacitance of the capacitor replaced with the IC 3 in the state of the adjusted capacitor 2 is increased by 30%. As is apparent from the figure, the prior art shows that a slight difference in the combined capacitance of the capacitor 2 and the IC 3 has a great effect on the communication distance.
Note that the curve 6C is a measured value when an actual IC is connected, and has a locus different from that of the curve 6A because the Q of the resonance circuit decreases due to the resistance between the terminals of the IC.
As technology advances, it is inevitable that the power consumption of ICs will decrease, but this will mean that the resistance between terminals will increase, and the damping effect on the resonant circuit will decrease, resulting in a higher Q and, consequently, a higher voltage. Will affect the IC. This also indicates that when the power consumption of the IC decreases, it is necessary to redesign the antenna coil from the viewpoint of the withstand voltage of the IC.
FIG. 7 shows an example of the characteristics of the RFID of FIG. 5 which is an example of the present invention, in which a capacitor having the same value as the inter-terminal capacitance of IC3 is replaced with IC3 and the voltage across the capacitor replaced with IC3 is measured. FIG. 5 is an example of a graph of the distance between the antenna and the transmitting-side antenna coil. In FIG. 5, the case where the carrier frequency from the external device and the resonance frequency of the RFID are accurately matched by the same treatment as the previous item shown by the curve 7A, and FIG. 7B shows a comparison between a case where the capacitance of the capacitor replaced with IC3 is increased by 30% and a case where the capacitance is increased by 100% as shown by a curve 7C in the same manner as in the previous section shown by 7B. When the amount is increased by 30%, the locus is substantially the same as the curve 7A. As is apparent from the figure, the influence on the resonance frequency due to the change in the inter-terminal capacitance in the manufacture of the IC 3 is small.
The curve 7D is a measured value when an actual IC is connected, and the Q change of the resonance circuit due to the influence of the resistance between the terminals of the IC is very small and has a locus substantially equal to the curve 7A.
In the related art, unless the resistance of the antenna coil is made as small as possible, the Q of the resonance circuit becomes small and the communication distance does not increase. Therefore, the RFID that requires a large communication distance has to form the antenna coil with copper, aluminum, or the like. However, according to the present invention, a material having a high specific resistance, for example, a material such as silver paste can be used for forming the antenna coil.
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited by the following examples.
FIG. 8 is an example of a mounting diagram in which the circuit block configuration shown in FIG. 5 is applied to a card-shaped RFID as an example of the present invention. In FIG. 8, the base material 4 is shown as transparent, but a very thin 1/50 mm thick polyimide material is used, and the antenna coil 1 is metallized on both surfaces of the base material 4 by the metallization pattern on the back surface of the base material 4. The resonance capacitor 2 is formed by the pattern. The inner peripheral end of the antenna coil 1 is connected to one terminal of the IC 3 and the back side of the capacitor 2. One turn from the inner peripheral end of the antenna coil 1 is connected to the other terminal of the IC 3. The outer peripheral end of the antenna coil 1 is connected to the front side by through-hole processing, and connected to the front side of the capacitor 2.
FIG. 9 shows another example of a mounting diagram in which the circuit block configuration shown in FIG. 5 is applied to a card-shaped RFID as an example of the present invention. In order to avoid damage to the IC 3, the IC 3 is mounted on the outside of the card as much as possible. . In FIG. 9, the substrate 4 is shown as transparent, but a very thin 1/50 mm thick polyimide material is used, and the antenna coil 1 is metallized on both surfaces of the substrate 4 by the metallization pattern on the back surface of the substrate 4. The resonance capacitor 2 is formed by the pattern. The outer peripheral end of the antenna coil 1 is connected to one terminal of the IC 3 and the back side of the capacitor 2. One turn from the outer peripheral end of the antenna coil 1 is connected to the other terminal of the IC 3. The inner peripheral end of the antenna coil 1 is connected to the front side by through-hole processing, and connected to the front side of the capacitor 2.
FIG. 10 is a circuit block diagram as an example of the application of the present invention.
FIG. 11 is a diagram of an example in which the circuit configuration shown in FIG. 10 is mounted on a card-shaped RFID. In FIG. 11, the substrate 4 is shown as transparent, but a very thin 1/50 mm thick polyimide material is used, and the antenna coil 1 is metallized on both surfaces of the substrate 4 by the metallization pattern on the back surface of the substrate 4. The resonance capacitor 2 is formed by the pattern. The outer peripheral end of the antenna coil 1 is connected to one terminal of the IC 3, and one turn from the outer peripheral end of the antenna coil 1 is connected to the other terminal of the IC 3 and the back side of the capacitor 2. The inner peripheral end of the antenna coil 1 is connected to the front side by through-hole processing, and connected to the front side of the capacitor 2.
FIG. 12 is a circuit block diagram as another example of application of the present invention. FIG. 13 is a diagram of an example in which the circuit configuration shown in FIG. 12 is mounted on a card-shaped RFID. In FIG. 13, the base material 4 is shown as transparent, but a very thin 1/50 mm thick polyimide material is used, and the antenna coil 1 and the antenna coil 1A are formed by the metallization pattern on the back surface of the base material 4. The resonance capacitor 2 is formed by the four-sided metallized pattern. Both ends of the antenna coil 1A are connected to the IC3. The outer peripheral end of the antenna coil 1 disposed inside the antenna coil 1A is connected to the back side of the capacitor 2, and the inner peripheral end of the antenna coil 1 is connected to the front side by through-hole processing. Connected to the front side.
FIG. 14 is a mounting diagram of a card-shaped RFID as another example of the application of the present invention. The RFID described in FIG. 9 is different from the RFID described in FIG. It is stored in.
Industrial Applicability There is an advantage that an inexpensive RFID can be provided without the need for a process of correcting a manufacturing difference in capacitance between terminals of an IC. Further, there is an advantage that power supply to the IC can be optimized easily, heat generation of the IC can be suppressed, breakage can be prevented, and a highly reliable RFID can be provided.
[Brief description of the drawings]
FIG. 1 is a block diagram of an RFID basic circuit as an example of the prior art.
FIG. 2 is a circuit block diagram of an RFID as an example of the related art.
FIG. 3 is a mounting diagram of a card-shaped RFID as an example of the embodiment of the prior art shown in FIG.
FIG. 4 is a circuit block diagram of an RFID as another example of the related art.
FIG. 5 is a circuit block diagram of an RFID as an example of the present invention.
FIG. 6 is a graph showing the influence of inter-terminal capacitance of an IC in an RFID as an example of a conventional technology.
FIG. 7 is a graph showing the influence of inter-terminal capacitance of an IC in an RFID as an example of an embodiment of the present invention.
FIG. 8 is a mounting diagram of a card-shaped RFID as an example to which the circuit block configuration of the present invention shown in FIG. 5 is applied.
FIG. 9 is a mounting diagram of a card-shaped RFID as another example to which the circuit block configuration of the present invention shown in FIG. 5 is applied.
FIG. 10 is a circuit configuration block diagram as an example of the application of the present invention.
FIG. 11 is a mounting diagram of a card-shaped RFID as an example to which the circuit block configuration of the present invention shown in FIG. 10 is applied.
FIG. 12 is a block diagram of a circuit configuration as another example of the application of the present invention.
FIG. 13 is a mounting diagram of a card-shaped RFID as an example to which the circuit block configuration of the present invention shown in FIG. 12 is applied.
FIG. 14 is a mounting diagram of a card-shaped RFID in which the RFID of the present invention and another RFID are mounted on one card.

Claims (5)

  1. An IC (Integrated Circuit) receiving power supply in a non-contact identification medium in which a resonance circuit adjusted to a power carrier frequency is formed by an inductance of an antenna coil and a capacitance of a resonance capacitor connected to the antenna coil; Wherein the connection point is not connected in parallel with the capacitor.
  2. 2. The non-contact identification medium according to claim 1, wherein a connection between the antenna coil and an IC supplied with electric power is equal to or less than half the number of turns of the antenna coil.
  3. 2. The non-contact identification medium according to claim 1, wherein the capacitance of the resonance capacitor is at least twice the capacitance of the input terminal of the IC.
  4. 2. The non-contact identification medium according to claim 1, wherein the resonance capacitor is formed by a metallized pattern on both surfaces of a dielectric as a non-contact identification medium base material.
  5. 4. The non-contact identification medium according to claim 3, wherein the antenna coil and the capacitor are formed by silver paste printing.
JP2002561768A 2001-01-31 2001-01-31 Non-contact identification medium Granted JPWO2002061675A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/000652 WO2002061675A1 (en) 2001-01-31 2001-01-31 Non-contact identification medium

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JPWO2002061675A1 true JPWO2002061675A1 (en) 2004-06-03

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