JP2009017284A - Antenna device - Google Patents

Antenna device Download PDF

Info

Publication number
JP2009017284A
JP2009017284A JP2007177381A JP2007177381A JP2009017284A JP 2009017284 A JP2009017284 A JP 2009017284A JP 2007177381 A JP2007177381 A JP 2007177381A JP 2007177381 A JP2007177381 A JP 2007177381A JP 2009017284 A JP2009017284 A JP 2009017284A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
conductor
antenna device
portion
embodiment
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007177381A
Other languages
Japanese (ja)
Inventor
Kunio Imai
Kazutaka Iwase
Takaaki Koike
Shusuke Suzuki
邦夫 今井
貴章 小池
和尊 岩瀬
秀典 鈴木
Original Assignee
Panasonic Corp
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Images

Abstract

PROBLEM TO BE SOLVED: To provide an antenna device which is suitably made compact, is capable of expanding a communication distance and is also suitable for high-speed communication.
SOLUTION: The antenna device includes a first conductor 12, a power feeding section 13 connected to the first conductor 12, and a second conductor 14 at least a part of which is disposed away from a connection part of the first conductor 12 with the power feeding section 13 a distance such that the second conductor 14 can be capacitively coupled to the first conductor 12, wherein the first conductor 12 and the second conductor 14 are disposed in parallel while facing each other.
COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、アンテナ装置に係り、特に高速通信と通信距離の拡大を図ることができるアンテナ装置に関する。 The present invention relates to an antenna device, and more particularly to an antenna device can be enlarged communication distance high-speed communication.

近年、各種機器には様々なアンテナ装置が開発され使用されている。 Recently, a variety of antenna devices have been developed and used in various devices. このようなアンテナ装置としては、例えば特許文献1に記載のものが知られている。 Such an antenna device, for example, has been known one described in Patent Document 1.

このアンテナ装置101は、図7(A)に示すように、基板101上に形成されたループアンテナを構成するループ導体102と、同一基板101上に形成され一方の先端部分がループ導体102に給電接合点Qで接続する平衡不平衡変成器(バラン)103と、高周波電源104とを有している。 The antenna device 101, as shown in FIG. 7 (A), feeding the loop conductor 102 constituting the loop antenna formed on the substrate 101, one tip portion of the formed on the same substrate 101 within the loop conductor 102 balun for connecting at the junction Q and (balun) 103, and a high-frequency power source 104.
特許第3334079号公報 Patent No. 3334079 Publication

しかしながら、このアンテナ装置101にあっては、図7(B)に示すように、機器に内蔵されるこのアンテナに、高周波電源104からの高周波電流を同軸ケーブル201などで給電するためには、整合を取る必要がある。 However, in this antenna device 101, as shown in FIG. 7 (B), in the antenna built in the device, in order to feed the high-frequency current from the high-frequency power source 104 in such a coaxial cable 201, matching there is a need to take. そこで、前述した平衡不平衡変成器(バラン)103が必要であるので、小型化の点からまたコストの面からも、都合のよいものではなかった。 Therefore, since it is necessary balun (balun) 103 described above, in terms of also cost in terms of downsizing, was not convenient.

本発明は、上記事情に鑑みてなされたもので、小型化に好適であって、通信距離を拡大させることができるとともに高速通信にも適したアンテナ装置を提供することを目的とする。 The present invention has been made in view of the above circumstances, a suitable size reduction, and an object thereof is to provide an antenna device suitable for high-speed communication as well as being able to expand the communication distance.

本発明のアンテナ装置は、第1の導体と、前記第1の導体に接続された給電部と、少なくとも一部が、前記第1の導体における前記給電部との接続箇所から容量結合可能な距離に離間して配設された第2の導体と、を備えるものである。 The antenna device of the present invention includes a first conductor, said the first feeding part connected to the conductor, at least a portion, the first capacitive coupling can distance from the connecting portion between the feeding portion of the conductor a second conductor disposed in spaced, but with a.

また、前記第1の導体と前記第2の導体は平行に配設するのが好ましい。 Further, the first conductor and the second conductor are preferably arranged in parallel.

また、前記第2の導体は、前記少なくとも一部が前記第1の導体に対向して配設するのが好ましい。 The second conductor is preferably at least a portion is disposed to face the first conductor.

また、前記第1の導体は、当該第1の導体を構成する第3の導体と第4の導体が交差するようにしてもよい。 Further, the first conductor, the third conductor and the fourth conductor constituting the first conductor may be cross.

また、前記第2の導体は、当該第1の導体を構成する第5の導体と第6の導体が交差するのが好ましい。 The second conductor is preferably the fifth conductor and the conductor of the sixth constituting the first conductor intersect.

また、前記第1の導体、前記第2の導体及び前記給電部は、回路基板の同一面に形成されるようにしてもよい。 Further, the first conductor, the second conductor and the power supply unit may be formed on the same surface of the circuit board.

また、前記第1の導体前記給電部は、回路基板の同一面に形成され、前記第2の導体は、前記回路基板に隣接して配設されるようにしてもよい。 Further, the first conductor the power supply portion is formed on the same surface of the circuit board, the second conductor may be disposed adjacent to the circuit board.

また、前記第1の導体及び前記給電部は、回路基板の第1の面に形成され、前記第2の導体は、前記回路基板の第2の面に形成されるようにしてもよい。 Further, the first conductor and the feeding portion is formed on a first surface of the circuit board, the second conductor may be formed on the second surface of the circuit board.

従って、本発明によれば、第1の導体と、第1の導体に接続された給電部と、少なくとも一部が、第1の導体における給電部との接続箇所から容量結合可能な距離に離間して配設された第2の導体とを備えており、バランが不要であるため小型化に好適であって、通信距離を拡大させることができるとともに高速通信にも適したアンテナ装置を提供できる。 Therefore, according to the present invention, apart from the first conductor, the first power supply portion connected to the conductor, at least partially, the capacitive coupling can distance from the connection point between the power supply unit in the first conductor and includes a second conductor disposed to a suitable size reduction because the balun is not required, it is possible to provide an antenna device suitable for high-speed communication as well as being able to expand the communication distance .

以下、本発明の実施形態について、添付図面を参照しながら詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
(第1の実施形態) (First Embodiment)
図1及び図2は、本発明の第1の実施形態に係るRFIDタグのアンテナ部分を構成するアンテナ装置10を示すものであり、このアンテナ装置10は、基板を構成するプリント基板11と、このプリント基板11の一面(以下、表面11Aとよぶ)に取り付けた給電素子を構成する第1の導体12と、プリント基板11の同一面である表面11Aに設けた高周波電源からなる給電部13と、プリント基板11の反対面(以下、裏面11Bとよぶ)に設けた無給電素子を構成する第2の導体14と、GNDである地板15とを備えている。 1 and 2, which shows the antenna device 10 constituting the antenna portion of the RFID tag according to a first embodiment of the present invention, the antenna device 10 includes a printed board 11 which constitutes the substrate, this one surface of the printed circuit board 11 (hereinafter, referred to as surface 11A) and the first conductor 12 constituting a feeding element attached to, a feeding unit 13 composed of a high-frequency power source provided on the surface 11A of the same surface of the printed board 11, opposite surface of the printed circuit board 11 (hereinafter, referred to as the back surface 11B) includes a second conductor 14 constituting a parasitic element provided on the main plate 15 is GND.

プリント基板11は、本実施形態の場合、縦(Y方向)の長さGyが55mm、横(X方向)の長さGxが85mmであって、厚さは0.8mmを有する。 Printed circuit board 11 is, in this embodiment, the vertical (Y-direction) length Gy is 55 mm, length in the horizontal (X direction) Gx is a 85 mm, the thickness has a 0.8 mm. また、このプリント基板11には、例えば、ガラス繊維を編んだ布にエポキシ樹脂を含浸させた板であるガラスエポキシ基板をベース基材として用いており、誘電率(ε )が4.3〜4.7のものを使用している。 Further, this printed circuit board 11, for example, a glass epoxy substrate is a plate obtained by impregnating the epoxy resin into the knitted fabric with glass fiber is used as the base material, the dielectric constant (epsilon r) is 4.3~ We are using the thing of 4.7.

第1の導体12は、X,Y方向に折れ曲がるL字形に形成したものであって、互いに交差する第3の導体(以下、「X導体部121」とよぶ)と第4の導体(以下、「Y導体部122」とよぶ)で構成されているとともに、マイクロストリップ線路123を介して給電部13と接続されており、全長が約80mm前後となっている。 The first conductor 12, X, be those formed in an L shape bent in the Y direction, a third conductor which cross each other (hereinafter, referred to as "X conductor portion 121") and a fourth conductor (hereinafter, together is constituted by referred to as "Y conductor portion 122"), which is connected to the feeding portion 13 via the microstrip line 123, the total length is about 80mm and forth. 即ち、この第1の導体12は、本実施形態のRFIDで使用する周波数帯がUHFの950MHzでその中心波長(λ。)315mmに対して、約1/4程度に設定されている。 That is, the first conductor 12, the frequency band used in the RFID of this embodiment with respect to the center wavelength (lambda.) 315 mm in the UHF of 950 MHz, is set to about 1/4. なお、第1の導体12及び後述する第2の導体14は、外縁部がプリント基板11の縁部からの距離Dが5mmのところに位置するように設置してあるとともに、内縁部が地板15の外縁部からの距離Eが6mmのところに位置するように配置してある。 The second conductor 14 of the first conductor 12 and later, with distance D from the edge of the outer edge portion printed circuit board 11 is installed so as to be located at the 5 mm, inner edge the base plate 15 distance E from the outer edge of is arranged to be located at the 6 mm.

このうち、X導体部121は、一端部121Aがマイクロストリップ線路123との接続箇所となっている。 Among, X conductor portion 121 has one end portion 121A is in the connecting portion between the microstrip line 123. 本実施形態のX導体部121は、長さL 1xが38mm、幅W 1xが5mmの大きさであって、プリント基板11の表面11AにおいてX方向に沿って形成した銅板(又は銅箔)などからなる。 X conductor portion 121 of the present embodiment, the length L 1x is 38mm, a size of the width W 1x is 5 mm, a copper plate which is formed along the X direction in the surface 11A of the printed circuit board 11 (or copper foil), etc. consisting of.

Y導体部122は、X導体部121の一端部121Aとは反対側である他端部に一端部が接続されている。 Y conductor portion 122 has one end to the other end which is opposite side is connected to the one end portion 121A of the X conductor portion 121. 本実施形態のY導体部122は、長さL 1yが46mm、幅W 1yが5mmの大きさであって、プリント基板11の表面11AにおいてY方向に沿って形成した、同じく銅板(又は銅箔)などからなる。 Y conductor portion 122 of the present embodiment, the length L 1y is 46 mm, a size of the width W 1y is 5 mm, the surface 11A of the printed circuit board 11 is formed along the Y direction, like a copper plate (or foil ) and the like.

マイクロストリップ線路123は、X導体部121と電気的に接続させるため、X導体部121と一体で銅板(又は銅箔)などから形成されたものがプリント基板11の表面11AにおいてY方向に沿って形成されている。 Microstrip line 123 for connecting electrically the X conductor portion 121, the by those formed from such a copper plate (or foil) integral with the X conductor portion 121 along the Y direction on the surface 11A of the printed circuit board 11 It is formed. なお、本実施形態のマイクロストリップ線路123は、長さC が6mm、幅C が1.5mmに形成されている。 Incidentally, the microstrip line 123 of the present embodiment, the length C y is 6 mm, the width C x is formed in 1.5 mm.

第1の導体12は、互いに直交する状態に交差させたX導体部121及びY導体部122で構成することで、2方向の偏波を効率よく送信または受信することができる。 The first conductor 12, by configuring the X conductors 121 and Y conductor 122 crossed in a state of mutually orthogonal, it is possible to transmit or receive in two directions polarization efficiently. 即ち、重力の作用する方向に対してプリント基板11が起立するような配置(例えば、図1において、−Y方向を重力加速度の方向となるように起立)状態にすれば、図示外のRFIDタグリーダから放射される所定波長帯の電波に対して、水平偏波をX導体部121で垂直偏波をY導体部122で、それぞれ効率的に捉えることができる。 That is, arranged as printed circuit board 11 with respect to the gravitational direction is standing (e.g., in FIG. 1, a -Y direction standing so that the direction of the gravitational acceleration) if the state, unillustrated RFID tag reader against radio wave having a predetermined wavelength band emitted from a vertical polarization in Y conductor portion 122 at the X conductor portion 121 horizontally polarized, it is possible to capture each efficiently. その結果、RFIDタグリーダへ効率的に応答を送信することができる。 As a result, it is possible to efficiently transmit the response to the RFID tag reader.

第2の導体14は、X,Y方向に沿って略L字形に形成したものであって、互いに交差する第5の導体(以下、「X導体部141」とよぶ)と第6の導体(以下、「Y導体部142」とよぶ)で構成されているとともに、プリント基板11を介して第1の導体12(特に、X導体部121)と容量結合可能な距離に離間して配設されている。 The second conductor 14, X, be those formed into a substantially L-shape along the Y direction, the fifth conductor (hereinafter, referred to as "X conductor portion 141") crossing each other and the sixth conductor ( hereinafter, with is composed of referred) to as "Y conductor portion 142 ', a first conductor 12 through the printed circuit board 11 (in particular, disposed apart from the capacitive coupling allows distance X conductor portion 121) ing. なお、第2の導体14も、本実施形態のRFIDで使用する波長(λ。)315mmに対して、約1/4程度の長さに形成されている。 The second conductor 14 is also a wavelength for use in RFID of this embodiment (lambda.) With respect to 315 mm, and is formed to a length of about 1/4.

このうち、X導体部141は、一端部寄りの定点141Aがマイクロストリップ線路123と高周波的に接続される箇所となっている。 Among, X conductor portion 141 has a portion where the fixed point 141A one end closer is high frequency coupled with the microstrip line 123. 本実施形態のX導体部141は、長さL 2xが45mm、幅W 2xが5mmの大きさであって、プリント基板11の裏面11BにおいてX方向に沿って形成した銅板(又は銅箔)などからなる。 X conductor portion 141 of the present embodiment, the length L 2x is 45 mm, a size of the width W 2x is 5 mm, a copper plate which is formed along the X direction in the back surface 11B of the printed circuit board 11 (or copper foil), etc. consisting of. なお、このX導体部141は、プリント基板11を挟んで第1の導体12のX導体部121と一部重合して容量結合するようになっており、本実施形態では、その容量結合部分Aを構成する重合領域Bがおよそ8mm形成されている。 Incidentally, the X conductor portion 141, and partially polymerizing with X conductor portion 121 of the first conductor 12 across the printed circuit board 11 is adapted to capacitive coupling, in this embodiment, the capacitive coupling portion A constituting the polymerization zone B is approximately 8mm formed.

Y導体部142は、X導体部141の一端部とは反対の他端部に一端部が接続されている。 Y conductor portion 142 has one end to the other end portion opposite is connected to one end portion of the X conductor portion 141. 本実施形態のY導体部122は、長さL 2yが46mm、幅W 2yが5mmの大きさであって、プリント基板11の裏面11BにおいてY方向に沿って形成した、X導体部141と同じ銅板(又は銅箔)などからなる。 Y conductor portion 122 of the present embodiment, the length L 2y is 46 mm, a size of the width W 2y is 5 mm, the rear surface 11B of the printed circuit board 11 is formed along the Y direction, the same as the X conductors 141 made of a copper plate (or copper foil).

本発明では、容量結合部分Aを構成する重合部Bにより、第1の導体12のX導体部121と第2の導体14のX導体部141との物理的な位置のずれ(換言すれば、プリント基板11を介在させた重複)を形成することで双方のX導体間121、141間での誘導電流に位相のずれを発生させ、これによってバランの代替手段を構成させるものである。 In the present invention, the polymerization unit B constituting the capacitive coupling portion A, if the deviation (i.e. the physical location of the X conductor portion 121 of the first conductor 12 and the X conductor portion 141 of the second conductor 14, to generate a phase shift in the induced current between between both X conductors 121 and 141 by forming a duplicate) which is interposed printed circuit board 11, whereby those which constitute the alternative balun. このため、重合領域Bは、電気的には容量結合部分Aを構成するものであって、本実施形態では、周波数(f)がUHF帯の950MHzを使用しているので、使用する波長帯(中心波長λ。;315mm)の約1/40程度に設定されており、前述した約8mm程度に設定している。 Thus, the polymerization region B, the electrical be those constituting the capacitive coupling portion A, in the present embodiment, the frequency (f) is using 950MHz in the UHF band, the wavelength band used ( central wavelength lambda;. is set to about 1/40 of 315 mm), it is set to about 8mm described above.

次に、第1の導体12のX導体部121と第2の導体14のX導体部141との容量結合について説明する。 Next, a description will be given of a capacitive coupling between the X conductor portion 121 of the first conductor 12 and the X conductor portion 141 of the second conductor 14.

図3は、本実施形態のアンテナ装置10の等価回路を示すものであり、これに基づいて双方のX導体部121,141間の静電容量値を理論的に算出する。 FIG. 3 shows an equivalent circuit of the antenna device 10 of the present embodiment, theoretically calculating the electrostatic capacitance value between both the X conductor portions 121 and 141 based on this.
双方のX導体部121,141間には平行平板コンデンサが形成されているものとすると、平行平板コンデンサの容量Cは、一般に、次式から算出することができる。 When Between both the X conductor portions 121 and 141 is assumed to be formed parallel plate capacitor, the capacitance C of a parallel plate capacitor, generally, can be calculated from the following equation.
C=ε ・ε ・S/d・・・(1) C = ε r · ε 0 · S / d ··· (1)
但し、ε ;空気の誘電率(=8.85×10 −12 )[F/m]、 However, epsilon 0; dielectric constant of air (= 8.85 × 10 -12) [ F / m],
ε ;プリント基板(ガラスエポキシ基板)の誘電率[F/m]、 epsilon r; print permittivity of the substrate (glass epoxy substrate) [F / m],
S;平板の面積(重合領域=(15×10 −3 )・(5×10 −3 ))[m ]、 S; area of the plate (polymerization zone = (15 × 10 -3) · (5 × 10 -3)) [m 2],
d;平板間の距離(プリント基板の厚さ=0.8×10 −3 )[m]。 d; distance between the plates (the PC board thickness = 0.8 × 10 -3) [m ].

ここで、ガラスエポキシ基板の誘電率ε は材質厚さその他の各種パラメータに依存するので一意に決定するのが難しい。 Here, the dielectric constant epsilon r of the glass epoxy substrate are difficult to uniquely determine because it depends on the material thickness and other various parameters. 従って、本実施形態では、次のような範囲、ε =4.3〜4.7[F/m]で定義すると、X導体部121,141間の静電容量の値は、(1)式から、C=3.6〜3.9[pF]となる。 Accordingly, in the present embodiment, the following ranges, the epsilon r = 4.3 to 4.7 as defined [F / m], the value of the capacitance between the X conductor portions 121 and 141, (1) from equation, the C = 3.6~3.9 [pF].

一方、実測では、第1の導体12のX導体部121と第2の導体14のX導体部141との静電容量Cが、C=2〜5[pF]であることが確認されている。 On the other hand, in the actual measurement, the electrostatic capacitance C between the X conductor portion 141 of the X conductor portion 121 of the first conductor 12 second conductor 14, it has been confirmed that C = a 2 to 5 [pF] . これにより、上述の理論値は、実測値と近似的に十分に一致する範囲内のものであることから、本発明のアンテナ装置10について、この等価回路(モデル)が理論的に正しいことの裏づけが得られる。 Thus, the theoretical value of the above, since it is within the scope of approximately good agreement with the measured values, the antenna device 10 of the present invention, confirmed that the equivalent circuit (model) theoretically correct It is obtained. 従って、本実施形態のアンテナ装置10によれば、プリント基板11の同一面上に第1の導体12及び第2の導体14を設置し、かつ、これらの間を5[pF]程度のコンデンサで接続させたものと同程度に、アンテナ特性を得ることができるわけである(但し、通信用の周波数帯として950MHzのものを使用)。 Therefore, according to the antenna device 10 of the present embodiment, the first conductor 12 and second conductor 14 is placed on the same surface of the printed circuit board 11, and, between them at 5 [pF] of approximately capacitor to the same extent as that to be connected, it is not able to obtain the antenna characteristics (however, using those 950MHz as a frequency band for communication).

なお、両面側の地板15は、互いに図示外のスルーホールで接続されている。 Incidentally, the ground plate 15 of both sides are connected by an unillustrated through hole to each other.

従って、本実施形態によれば、無給電素子を構成する第2の導体14のX導体部141を、給電素子を構成する第1の導体12のマイクロストリップ線路123の近傍の重合部Bでプリント基板11を介して重ね合わせることで、バランを必要とせずにアンテナ装置10側と図示外の回路側との整合を取ることができる。 Therefore, according to this embodiment, the X conductor portion 141 of the second conductor 14 of the parasitic element, the polymerization unit B in the vicinity of the microstrip line 123 of the first conductor 12 constituting a feeding element print by superimposing over the substrate 11, it is possible to achieve matching between the circuit side of the outer shown the antenna device 10 without requiring a balun. この結果、プリント基板11での実装容積がそのバランの分だけ削減でき、アンテナ装置10の小型化を図ることができるので、デザインの自由が高まるとともに、製造コストの削減が可能になる。 As a result, mounting volume can be reduced by the amount of the balun in the printed circuit board 11, it is possible to reduce the size of the antenna device 10, with the free increases the design allows a reduction in manufacturing cost.

さらに、通信距離は、一般に、波長及び帯域幅や基板誘電率で通信距離が変動するほかに、容量結合となる重合部Bがあるとでも通信距離が増大し、延いては放射利得が向上するとともに、バランが不要なのでリアクタンス成分がなくなる分、高速通信も可能となる。 Further, the communication distance will generally, in addition to the communication distance in wavelength and bandwidth or the substrate dielectric constant varies, the communication distance even if there is a polymerization unit B as a capacitive coupling is increased, and by extension is improved radiation gain together, amount that the reactance component is eliminated because the balun is not required, it is possible high-speed communication. 換言すれば、RFIDの負荷変調(アンテナに到来した電波が反射して再び放出される量、または/及び位相を制御することで送信回路に代える)方式では、バランがある場合よりもバランがない方がスイッチ特性が良好なので、スイッチの高速応答性、つまり高速通信が実現可能になる。 In other words, (replaced by transmission circuit by controlling the amount radio waves arriving at the antenna is released again by reflecting and / or phase,) RFID of load modulation in the method, there is no balun than when there is a balun it is because good switching characteristic, high-speed response of the switch, i.e. high-speed communication can be realized.

また、双方のX導体部121、141は、前述したように、誘電体であるプリント基板15を介して容量結合させているので、誘電率による波長の短縮(誘電体の実効誘電率の二乗に反比例した波長短縮)のため、無給電素子である第2の導体14の電気長を短縮させることも可能となり、さらにアンテナ装置10の小型化を図ることができる。 Further, both the X conductor portion 121 and 141, as described above, since by capacitive coupling through the printed circuit board 15 which is a dielectric, to the square of the effective dielectric constant of the shortening of the wavelength (dielectric due to dielectric constant for wavelength shortening) that is inversely proportional to the, it becomes possible to shorten the electrical length of the second conductor 14 is a passive element, it is possible to further reduce the size of the antenna device 10.

しかも、本実施形態では、それぞれ、第1の導体12及び第2の導体14のX導体部121,141とY導体部122,142とが90度の角度で交差しているので、水平偏波と垂直偏波との2種類の偏波状態の電波を確実に捉えることができるようになり、通信範囲が拡大する。 Moreover, in the present embodiment, respectively, since the X conductor portion 121, 141 and the Y conductors 122, 142 of the first conductor 12 and second conductor 14 intersect at an angle of 90 degrees, horizontal polarization will be able to reliably capture two types of radio wave polarization state of the vertically polarized wave and the communication range is expanded. 即ち、本発明に係る発明者が行ったシミュレーションによれば、中心周波数が1GHzに対して、通信特性として良好なVSWR2以下を200MHz確保することができたことが確認されている。 That is, according to the simulation by the inventors has made according to the present invention, with respect to the center frequency of 1 GHz, it was able to 200MHz securing has been confirmed good VSWR2 below as communication characteristics. これは、従来のものに比べて、20%程度の広帯域化を実現できたことになる。 This is compared with the conventional, so that could be realized bandwidth of about 20%.

さらに、従来のようなループアンテナを使用せずに済むので、アンテナ装置10のケーシング、延いてはこのアンテナ装置10を組み込んだRFIDタグ本体の筐体(ケース)の特に薄型化を図ることもできるようになる。 Furthermore, since unnecessary to use the conventional loop antenna, such as the casing of the antenna device 10, and by extension may also be made, especially thinning of the housing of the RFID tag main body incorporating the antenna device 10 (casing) so as to.

(第2の実施形態) (Second Embodiment)
次に、本発明の第2の実施形態について説明する。 Next, a description will be given of a second embodiment of the present invention. なお、本実施形態において、第1の実施形態と同一部分には同一符号を付して重複説明を避ける。 In the present embodiment, the same parts as those of the first embodiment to avoid duplication will be denoted by the same reference numerals.
図4は、本発明の第2の実施形態に係るRFIDタグのアンテナ部分を構成するアンテナ装置20を示すものであり、このアンテナ装置20では、第1の実施形態とは異なり、第1の導体21及び第2の導体22が、プリント基板11の同一面(この場合、表面11A)上で、かつ、互いに平行で、しかも互いに対向した状態に配設されている。 Figure 4 shows an antenna device 20 of the antenna portion of the RFID tag according to a second embodiment of the present invention, in the antenna device 20, unlike the first embodiment, the first conductor 21 and the second conductor 22, the same surface of the printed circuit board 11 (in this case, the surface 11A) on and are arranged in a state in, yet opposed to each other parallel to each other. また、このアンテナ装置20では、第1の導体21の方が第2の導体22よりも幅広で、ストレートな形状を呈している。 Further, the antenna device 20, a direction of the first conductor 21 is wider than the second conductor 22, and has a straight shape.

第1の導体21は、X方向の長さL 1xが70mm、Y方向の長さであるL 1yが20mmの大きさであって、プリント基板11の表面11AにおいてX,Y方向に沿って略L字形に形成した銅板(又は銅箔)などからなる。 The first conductor 21, X direction length L 1x is 70 mm, a size of L 1y is 20mm in length in the Y direction, the surface 11A of the printed circuit board 11 X, along the Y direction substantially made of a copper plate which is formed in an L-shape (or copper foil).

第2の導体22は、X,Y方向に沿って略L字形に形成したもので、X方向(X導体部221)の長さL 2x及びY方向(Y導体部222)の長さであるL 2yがいずれも46mmの大きさであって、プリント基板11の表面11Aに形成した銅板(又は銅箔)などからなる。 The second conductor 22, X, which was formed into a substantially L-shape along the Y direction is the length in the X direction (X conductor portion 221) of the length L 2x and Y direction (Y conductor portion 222) L 2y is a size of 46mm none, and the like copper plate formed on the surface 11A of the printed circuit board 11 (or copper foil). なお、容量結合部分Aを構成する重合部Bの長さは、9mmである。 The length of the overlapping portion B constituting the capacitive coupling moiety A is 9 mm.

従って、本実施形態によれば、導体の長さは通信周波数に対応するが、本実施形態の第1の導体21及び第2の導体22では、第1の実施形態の第1の導体12及び第2の導体14の長さ(第1の導体12及び第2の導体14それぞれにおける、幅の中間点を結ぶ線分の長さ。)である157mmと同じ長さとなっているので、通信周波数もほぼ同じである。 Therefore, according to the present embodiment, the length of the conductor corresponds to the communication frequency, the first conductor 21 and second conductor 22 of the present embodiment, the first conductor 12 and the first embodiment (in each first conductor 12 and second conductor 14, the line segment length. connecting the midpoint of the width) length of the second conductor 14 so has the same length as a 157 mm, communication frequency it is almost the same.

(第3の実施形態) (Third Embodiment)
次に、本発明の第3の実施形態について説明する。 Next, a description will be given of a third embodiment of the present invention. なお、本実施形態において、第1の実施形態と同一部分には同一符号を付して重複説明を避ける。 In the present embodiment, the same parts as those of the first embodiment to avoid duplication will be denoted by the same reference numerals.

図5は、本発明の第3の実施形態に係るRFIDタグのアンテナ部分を構成するアンテナ装置30を示すものであり、このアンテナ装置30は、第1の実施形態とは異なり、第2の導体32がRFIDタグ本体の筐体(ケース)5の外面に貼り付けてある。 Figure 5 shows an antenna device 30 constituting the antenna portion of the RFID tag according to a third embodiment of the present invention, the antenna device 30 is different from the first embodiment, the second conductor 32 are affixed to the outer surface of the housing (case) 5 of the RFID tag main body. なお、この筐体5は、内部に、プリント基板11と、第1の導体31と、高周波電源13と、地板15とを備えている。 Incidentally, the housing 5 includes, inside, the printed circuit board 11, a first conductor 31, a high frequency power source 13, and a ground plane 15.

第1の導体31は、第1の実施形態のものよりも若干大きい、X方向(X導体部311)の長さL 1xが37mm、Y方向(Y導体部312)の長さL 1yが50mmの大きさであって、プリント基板11の表面11AにおいてX,Y方向に沿って形成した銅板(又は銅箔)などからなる。 The first conductor 31 is slightly larger than that of the first embodiment, the length L 1x in the X direction (X conductor 311) is 37 mm, the length L 1y in the Y direction (Y conductor portion 312) 50 mm a size, consisting of the surface 11A of the printed circuit board 11 X, copper plate formed along the Y direction (or copper) and the like. また、この第1の導体31は、X導体部311と地板15との間の距離Exが5mm、Y導体部312と地板15との間の距離Eyが7mmとなっており、第1の実施形態とは若干距離が異なる。 Further, the first conductor 31, the distance Ex is 5mm between X conductor portion 311 and the base plate 15, has a distance Ey is 7mm between the Y conductor portion 312 and the base plate 15, a first embodiment slightly from the form distance is different.

第2の導体32は、X,Y方向に沿って略L字形に形成したもので、第1の実施形態のものよりも若干大きい、X方向(X導体部321)の長さL 2xが46mm、Y方向(Y導体部322)の長さL 2yが52mmの大きさであって、銅板(又は銅箔)などからなるものが筐体5の外側面の所定位置に貼り付けてある。 The second conductor 32, X, which was formed into a substantially L-shape along the Y direction is slightly larger than that of the first embodiment, the length L 2x in the X direction (X conductor portion 321) is 46mm , a length L 2y size of 52mm in the Y direction (Y conductor portion 322), those made of copper (or copper foil) is are adhered to a predetermined position of the outer side surface of the housing 5. また、この第2の導体31は、第1の導体31との間で、容量結合部分Aを構成する長さ9mmの重合部Bを有している。 Further, the second conductor 31, between the first conductor 31, and has an overlapping portion B of length 9mm constituting the capacitive coupling portion A.

筐体5は、この内外にある第1の導体31及び第2の導体32の間での容量結合を確保できるような材料、例えば厚さtが1mm程度に薄い適宜の樹脂材料で形成されている。 Housing 5, materials that ensure capacitive coupling between the first conductor 31 and second conductor 32 in this out, for example, the thickness t is formed in a thin appropriate resin material about 1mm there. また、この容量結合を確実にするため、第1の導体31は、外縁部が筐体5の内面から1mm離間して、換言すれば1mmの隙間(d)を介して近接・配置されている。 Further, in order to ensure this capacitive coupling, the first conductor 31, the outer edge portion and 1mm apart from the inner surface of the housing 5 are close-arranged through other words 1mm clearance (d) .

従って、本実施形態によれば、第2の導体32がRFIDタグ本体の筐体(ケース)5の外面に貼り付けてあるので、第1、第2の実施形態のアンテナ装置10、20に比べて、さらなる小型化、または、製品の組立て後でも外側の素子を動かすことができるため製品時の調整が容易になる、といった効果が得られる。 Therefore, according to this embodiment, since the second conductor 32 are affixed to the outer surface of the housing (case) 5 of the RFID tag main body, compared to the first antenna device 10 and 20 of the second embodiment Te, further miniaturization or adjusted during product is facilitated because it is possible to move the outer element even after assembly of the product, the effect is obtained such.

なお、本実施形態においても、第1の導体31及び第2の導体32は、第1の実施形態の第1の導体12及び第2の導体14の長さより若干大きく、また、誘電率による波長の短縮が若干少なくなっているが、素子の配置と長さを適切に設定することによって、通信周波数はほぼ同じに設定できる。 Also in this embodiment, the first conductor 31 and second conductor 32 is slightly greater than the length of the first conductor 12 and second conductor 14 of the first embodiment, also, the wavelength due to dielectric constant Although shorter becomes slightly less, by appropriately setting the placement and length of the device, the communication frequency can be set to be substantially the same. また、本実施形態によれば、本実施形態の第1の導体31及び第2の導体32では、第1の実施形態の第1の導体12及び第2の導体14の面積とほぼ同じ面積を有するので、同様の利得も得られる。 Further, according to this embodiment, the first conductor 31 and second conductor 32 of the present embodiment, substantially the same area as the area of ​​the first conductor 12 and second conductor 14 of the first embodiment because it has the same gain can be obtained.

(第4の実施形態) (Fourth Embodiment)
次に、本発明の第4の実施形態について説明する。 Next, a description will be given of a fourth embodiment of the present invention. なお、本実施形態において、第1〜第3の実施形態と同一部分には同一符号を付して重複説明を避ける。 In the present embodiment, the first to third embodiments, the same parts of the avoid duplication will be denoted by the same reference numerals.

図6は、本発明の第4の実施形態に係るRFIDタグのアンテナ部分を構成するアンテナ装置40を示すものであり、このアンテナ装置40は、第3の実施形態とは異なり、第2の導体42が、アンテナ装置40を収容させたRFIDタグ本体の筐体(ケース)6の内面に貼り付けてある。 Figure 6 shows an antenna device 40 constituting the antenna portion of the RFID tag according to a fourth embodiment of the present invention, the antenna device 40 is different from the third embodiment, the second conductor 42, are affixed to the inner surface of the housing of the RFID tag main body in which is housed an antenna device 40 (casing) 6. なお、この筐体6は、内部に、プリント基板11と、第1の導体41と、高周波電源13と、地板15とを備えている。 Incidentally, the casing 6, inside, the printed board 11, a first conductor 41, a high frequency power source 13, and a ground plane 15.

第1の導体41は、第3の実施形態の第1の導体31と同一の形状であって、かつ、同一寸法に形成されており、第1〜第3の実施形態と同様、プリント基板11の一面(この場合は、上面11A)に形成されている。 The first conductor 41 is the same shape as the first conductor 31 of the third embodiment, and are formed in the same size, similar to the first to third embodiments, the printed circuit board 11 one surface (in this case, the upper surface 11A) are formed on. また、この第1の導体41は、第3の実施形態の場合と同様、X導体部411と地板15との間の距離Exが5mm、Y導体部412と地板15との間の距離Eyが7mmとなっており、第1の実施形態とは若干距離が異なる。 Further, the first conductor 41, as in the third embodiment, the distance Ex is 5mm between X conductor portion 411 and the base plate 15, the distance Ey between the Y conductor portion 412 and the ground plane 15 It has a 7 mm, the first embodiment slightly different distance.

また、第2の導体42も、第3の実施形態の第2の導体32と同一の形状であって、かつ、同一寸法に形成されているが、前述したように、プリント基板11ではなく、RFIDタグ本体の筐体(ケース)6の内面に貼り付けてある。 The second conductor 42 also have the same shape and the second conductor 32 of the third embodiment, and are formed in the same size, as described above, rather than the printed circuit board 11, are affixed to the inner surface of the RFID tag the housing of the main body (casing) 6.

また、第1の導体41と第2の導体42の間には、容量結合部分Aを構成する長さ8mmの重合部Bを有している。 Further, the first conductor 41 between the second conductor 42, and a polymerization unit B of 8mm length constituting the capacitive coupling portion A.

筐体(ケース)6は、電磁シールド作用が発生することのない非導電性及び非磁性の材料で形成されており、本実施形態では適宜の樹脂材料で形成されている。 Housing (casing) 6 is formed of a non-conductive and non-magnetic material without the electromagnetic shielding effect is produced, in the present embodiment is formed by a suitable resin material.

従って、本実施形態によれば、第2の導体42がRFIDタグ本体の筐体(ケース)6の内面に貼り付けてあるので、第1、第2の実施形態のアンテナ装置10、20に比べて、基板を小型にできるので製造コストを抑えることができるといった効果が得られる。 Therefore, according to this embodiment, since the second conductor 42 are affixed to the inner surface of the RFID tag main body of the housing (casing) 6, compared to the first antenna device 10 and 20 of the second embodiment Te, effects are obtained such a substrate can be suppressed manufacturing cost since it compact.

なお、本実施形態においても、第1の導体41及び第2の導体42は、第1の実施形態の第1の導体12及び第2の導体14の長さとほぼ同じ長さとなっているので、各部位の配置や形状の工夫によって、通信周波数はほぼ同じに設定できる。 Also in this embodiment, the first conductor 41 and second conductor 42, since almost the same length as the length of the first conductor 12 and second conductor 14 of the first embodiment, by devising the arrangement and shape of each part, the communication frequency can be set to be substantially the same. また、本実施形態によれば、本実施形態の第1の導体41及び第2の導体42は、第1の実施形態の第1の導体12及び第2の導体14の面積とほぼ同じ面積を有するので、同様の利得も得られる。 Further, according to this embodiment, the first conductor 41 and second conductor 42 of this embodiment, substantially the same area as the area of ​​the first conductor 12 and second conductor 14 of the first embodiment because it has the same gain can be obtained.

なお、本発明は上述した実施形態に何ら限定されるものではなく、その要旨を逸脱しない範囲において種々の形態で実施し得るものである。 The present invention is not in any way limited to the embodiment described above, but may be practiced in various forms without departing from the scope and spirit thereof. 即ち、例えば、給電部に非接触な第2の導体は、基板以外の場所に設置する構成であってもよく、またRFIDタグ本体の筐体(ケース)6内外のどこに置いてもよい。 That is, for example, a second conductive non-contact with the power supply unit may be configured to be installed in a location other than the substrate, also RFID tag main body of the housing (casing) 6 anywhere may put the inside and outside. さらに、第1、第2の導体は、基板に取り付けた銅板、金属棒、細めの板、広めの面、又は各種の適宜形状が適用できる。 Further, first, second conductor, a copper plate mounted on the substrate, a metal rod, thin plate, it faces the wider, or various appropriate shapes for applications. また、この第1、第2の導体は、筐体の内面に貼る、外面に貼る、筐体に貼らないで置くだけ、外部の機器や部品と共用、さらには内蔵のほかの部品と共用するといった各種の対応が可能である。 Further, the first, second conductors being attached to the inner surface of the housing, being attached to the outer surface, just put not stick to the housing, shared with an external device or component, more shared with built other components various correspondence of such is possible. さらに、人体を素子として扱うような構成としてもよい。 Furthermore, it may be configured as handle body as an element. また、給電側の素子、つまり第1の導体は、図4に示すように、各種の形状、例えば、棒、板、面などに適宜に変更することができる。 Further, elements of the power supply side, i.e. the first conductor, as shown in FIG. 4, various shape, for example, can be changed rod, plate, appropriately like the plane.

以上のように、本発明によれば、バランを必要としなくて済むので、小型化に好適であって、通信距離を拡大させることができるとともに高速通信も可能であり、RFIDタグリーダとの組み合わせで使用するICタグ(例えば、物流部門の荷札用などとして商品に取り付けて使用する)やICカードなどに適用するのに好適である。 As described above, according to the present invention, since it is not necessary to require a balun, a suitable for miniaturization, and high-speed communication is possible as well as being able to expand the communication distance, in combination with the RFID tag reader IC tag used (e.g., the logistics department use attached to the product as such for label) is suitable for application such as or IC card.

本発明の第1の実施形態に係るアンテナ装置をプリント基板の一面から見たときの状態を示す構成図である。 It is a configuration diagram showing a state when viewed from one surface of the printed circuit board antenna device according to a first embodiment of the present invention. そのアンテナ装置をプリント基板の反対面から見たときの状態を示す構成図 Diagram showing a state when viewed its antenna device from the opposite side of the printed circuit board そのアンテナ装置の等価回路を示す説明図である。 Is an explanatory view showing an equivalent circuit of the antenna device. 本発明の第2の実施形態に係るアンテナ装置を示すものであり、(A)はその構成図、(B)はその各要素の大きさを示す説明図である。 Are those of an antenna device according to a second embodiment of the present invention, is an explanatory diagram showing (A) is its block diagram, (B) the size of each element. 本発明の第3の実施形態に係るアンテナ装置を示すものであり、(A)はその構成図、(B)はその各要素の大きさを示す説明図である。 Are those of an antenna device according to a third embodiment of the present invention, is an explanatory diagram showing (A) is its block diagram, (B) the size of each element. 本発明の第4の実施形態に係るアンテナ装置を示すものであり、(A)はその構成図、(B)はその各要素の大きさを示す説明図 Are those of an antenna device according to a fourth embodiment of the present invention, (A) is the block diagram, (B) is an explanatory view showing the size of each element (A)は従来のアンテナ装置を示す構成図、(B)はその原理を示す説明図である。 (A) is a configuration diagram showing a conventional antenna device, (B) is an explanatory view showing the principle.

符号の説明 DESCRIPTION OF SYMBOLS

10、20、30、40 アンテナ装置 11 プリント基板(基板) 10, 20, 30, 40 antenna apparatus 11 a printed circuit board (substrate)
11A 表面 11B 裏面 12、21、31、41 第1の導体(給電素子) 11A surface 11B back surface 12,21,31,41 first conductor (feed element)
121 X導体部(第3の導体) 121 X conductor portion (third conductor)
122 Y導体部(第4の導体) 122 Y conductor portion (fourth conductor)
123 マイクロストリップ線路 13 給電部 14、22、32、42 第2の導体(無給電素子) 123 micro-strip line 13 feeding portion 14,22,32,42 second conductors (parasitic element)
141 X導体部(第5の導体) 141 X conductor portion (the fifth conductor)
142 Y導体部(第6の導体) 142 Y conductor portion (6 conductor)
15 地板(GND) 15 base plate (GND)
A 容量結合部分 B 重合部 5、6 RFIDタグ本体の筐体(ケース) A capacitive coupling portion B polymerized unit 5, 6 RFID tag main body of the housing (case)

Claims (8)

  1. 第1の導体と、 A first conductor,
    前記第1の導体に接続された給電部と、 A feeding part connected to the first conductor,
    少なくとも一部が、前記第1の導体における前記給電部との接続箇所から容量結合可能な距離に離間して配設された第2の導体と、 At least partially, a second conductor disposed at a distance from each other in capacitive coupling can distance from the connecting portion between the feeding portion of the first conductor,
    を備えるアンテナ装置。 Antenna device comprising a.
  2. 請求項1記載のアンテナ装置であって、 The antenna device according to claim 1,
    前記第1の導体と前記第2の導体は平行に配設される、 Said first conductor and said second conductor is disposed parallel to,
    アンテナ装置。 The antenna device.
  3. 請求項2記載のアンテナ装置であって、 The antenna device according to claim 2,
    前記第2の導体は、前記少なくとも一部が前記第1の導体に対向して配設される、 Said second conductor, said at least a portion is arranged opposite to the first conductor,
    アンテナ装置。 The antenna device.
  4. 請求項1から3のいずれか一項に記載のアンテナ装置であって、 The antenna device according to any one of claims 1 to 3,
    前記第1の導体は、当該第1の導体を構成する第3の導体と第4の導体が交差する、 The first conductor, the third conductor and the fourth conductor constituting the first conductor intersect,
    アンテナ装置。 The antenna device.
  5. 請求項1から4のいずれか一項に記載のアンテナ装置であって、 The antenna device according to any one of claims 1 to 4,
    前記第2の導体は、当該第1の導体を構成する第5の導体と第6の導体が交差する、 Said second conductors, fifth conductor and the conductor of the sixth constituting the first conductor intersect,
    アンテナ装置。 The antenna device.
  6. 請求項1から5のいずれか一項に記載のアンテナ装置であって、 The antenna device according to any one of claims 1 to 5,
    前記第1の導体、前記第2の導体及び前記給電部は、回路基板の同一面に形成される、 Said first conductor, said second conductor and said feeding portion is formed on the same surface of the circuit board,
    アンテナ装置。 The antenna device.
  7. 請求項1から5のいずれか一項に記載のアンテナ装置であって、 The antenna device according to any one of claims 1 to 5,
    前記第1の導体前記給電部は、回路基板の同一面に形成され、前記第2の導体は、前記回路基板に隣接して配設される、 Said first conductor the power supply portion is formed on the same surface of the circuit board, the second conductor is disposed adjacent to the circuit board,
    アンテナ装置。 The antenna device.
  8. 請求項1から5のいずれか一項に記載のアンテナ装置であって、 The antenna device according to any one of claims 1 to 5,
    前記第1の導体及び前記給電部は、回路基板の第1の面に形成され、前記第2の導体は、前記回路基板の第2の面に形成される、 The first conductor and the feeding portion is formed on a first surface of the circuit board, the second conductor is formed on the second surface of the circuit board,
    アンテナ装置。 The antenna device.
JP2007177381A 2007-07-05 2007-07-05 Antenna device Pending JP2009017284A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007177381A JP2009017284A (en) 2007-07-05 2007-07-05 Antenna device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007177381A JP2009017284A (en) 2007-07-05 2007-07-05 Antenna device

Publications (1)

Publication Number Publication Date
JP2009017284A true true JP2009017284A (en) 2009-01-22

Family

ID=40357609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007177381A Pending JP2009017284A (en) 2007-07-05 2007-07-05 Antenna device

Country Status (1)

Country Link
JP (1) JP2009017284A (en)

Cited By (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010140429A1 (en) * 2009-06-03 2010-12-09 株式会社村田製作所 Wireless ic device and production method thereof
JP2011234187A (en) * 2010-04-28 2011-11-17 Central Glass Co Ltd Planar antenna
JP2012526423A (en) * 2009-05-08 2012-10-25 ▲華▼▲為▼▲終▼端有限公司 Antenna design method and data card single plate of a wireless terminal for wireless terminals
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
JP2015154328A (en) * 2014-02-17 2015-08-24 株式会社国際電気通信基礎技術研究所 Antenna device and radio communication apparatus
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
WO2016185834A1 (en) * 2015-05-19 2016-11-24 富士フイルム株式会社 Touch sensor panel and substrate
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device

Cited By (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8725071B2 (en) 2006-01-19 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8662403B2 (en) 2007-07-04 2014-03-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US9830552B2 (en) 2007-07-18 2017-11-28 Murata Manufacturing Co., Ltd. Radio IC device
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US9022295B2 (en) 2008-05-21 2015-05-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8973841B2 (en) 2008-05-21 2015-03-10 Murata Manufacturing Co., Ltd. Wireless IC device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8876010B2 (en) 2009-04-14 2014-11-04 Murata Manufacturing Co., Ltd Wireless IC device component and wireless IC device
US9203157B2 (en) 2009-04-21 2015-12-01 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9564678B2 (en) 2009-04-21 2017-02-07 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
JP2012526423A (en) * 2009-05-08 2012-10-25 ▲華▼▲為▼▲終▼端有限公司 Antenna design method and data card single plate of a wireless terminal for wireless terminals
US8618986B2 (en) 2009-05-08 2013-12-31 Huawei Device Co., Ltd. Antenna designing method and data card single board of wireless terminal
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
WO2010140429A1 (en) * 2009-06-03 2010-12-09 株式会社村田製作所 Wireless ic device and production method thereof
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
JP2011234187A (en) * 2010-04-28 2011-11-17 Central Glass Co Ltd Planar antenna
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8757502B2 (en) 2011-02-28 2014-06-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
JP2015154328A (en) * 2014-02-17 2015-08-24 株式会社国際電気通信基礎技術研究所 Antenna device and radio communication apparatus
JP2016220000A (en) * 2015-05-19 2016-12-22 富士フイルム株式会社 Touch sensor panel and the substrate
WO2016185834A1 (en) * 2015-05-19 2016-11-24 富士フイルム株式会社 Touch sensor panel and substrate

Similar Documents

Publication Publication Date Title
US6600459B2 (en) Antenna
US6903692B2 (en) Dielectric antenna
US20090262041A1 (en) Wireless ic device
US20080266191A1 (en) Broadband Antenna For a Transponder of a Radio Frequency Identification System
EP0932219A2 (en) Planar antenna
US7408512B1 (en) Antenna with distributed strip and integrated electronic components
US20090109102A1 (en) Antenna and radio ic device
US20110128125A1 (en) Antenna device and system including antenna device
US20100308118A1 (en) Wireless ic device, electronic apparatus, and method for adjusting resonant frequency of wireless ic device
JP4301346B2 (en) Wireless ic devices and electronic equipment
US20020101382A1 (en) Chip antenna and antenna unit including the same
US20110253795A1 (en) Wireless ic device, wireless ic module and method of manufacturing wireless ic module
US7345647B1 (en) Antenna structure with distributed strip
US20110186641A1 (en) Radio ic device
US20080143620A1 (en) Increasing the bandwidth of a RFID dipole tag
US6369762B1 (en) Flat antenna for circularly-polarized wave
US20090309703A1 (en) Rfid device with conductive loop shield
US5861854A (en) Surface-mount antenna and a communication apparatus using the same
JP2011205384A (en) Antenna device and wireless communication device
US6642904B2 (en) Antenna
US6456250B1 (en) Multi frequency-band antenna
JP2009260758A (en) Radio ic device
US20080246664A1 (en) Wireless ic device
WO2000026993A1 (en) Radio frequency tag with optimum power transfer
US7330161B2 (en) Antenna, radio device, method of designing antenna, and method of measuring operating frequency of antenna