JP2002042083A - Non-contact communication type information carrier - Google Patents

Non-contact communication type information carrier

Info

Publication number
JP2002042083A
JP2002042083A JP2000227455A JP2000227455A JP2002042083A JP 2002042083 A JP2002042083 A JP 2002042083A JP 2000227455 A JP2000227455 A JP 2000227455A JP 2000227455 A JP2000227455 A JP 2000227455A JP 2002042083 A JP2002042083 A JP 2002042083A
Authority
JP
Japan
Prior art keywords
non
type information
information carrier
booster coil
insulating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000227455A
Other languages
Japanese (ja)
Inventor
Tomonori Kanai
Yuji Kikuchi
裕二 菊地
友範 金井
Original Assignee
Hitachi Maxell Ltd
日立マクセル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd, 日立マクセル株式会社 filed Critical Hitachi Maxell Ltd
Priority to JP2000227455A priority Critical patent/JP2002042083A/en
Publication of JP2002042083A publication Critical patent/JP2002042083A/en
Application status is Withdrawn legal-status Critical

Links

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive and thin non-contact communication type information carrier having good communication characteristics and allowing a high degree of freedom in setting an IC element relative to a booster coil. SOLUTION: The non-contact communication type information carrier is constituted of the IC element 2 having an antenna coil 1 formed integrally therewith, the booster coil 3 for strengthening the electromagnetic coupling between the antenna coil 1 formed integrally with the IC element 2 and another antenna coil provided in a reader/writer, and an insulating member 6 supporting the IC element 2 and the booster coil 3. One booster coil 3 is formed on the insulating member 6 and the IC element 2 is arranged in an opposite relationship to a portion of the one booster coil 3.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、アンテナコイルが一体形成されたIC素子とブースタコイルとを有する非接触通信式情報担体に関する。 The present invention relates to an antenna coil for non-contact communication type information carrier having an IC element and the booster coil are integrally formed.

【0002】 [0002]

【従来の技術】従来より、絶縁性の基体内にIC素子と当該IC素子の端子部に電気的に接続されたアンテナコイルとを備え、リーダライタからの電力の受給及びリーダライタとの間のデジタル信号の送受信を電磁波を用いて非接触で行う非接触式の情報担体が知られている。 BACKGROUND ART Conventionally, an electrically connected antenna coil to the terminal section of the IC element and the IC element on an insulating the substrate, between the power receiving and writer of the reader-writer noncontact information carrier for transmitting and receiving digital signals in a non-contact manner using electromagnetic waves is known. この種の情報担体としては、その外形により、カード形、 As this type of information carrier, the outer shape, card shape,
コイン形又はボタン形などがある。 There is such as a coin-shaped or button-shaped.

【0003】従来、この種の情報担体としては、アンテナコイルを絶縁部材にパターン形成したもの、或いは、 Conventionally, as this type of the information carrier, which was formed pattern antenna coil insulating member, or,
巻線からなるアンテナコイルを絶縁部材に担持したものが用いられているが、近年に至って、アンテナコイルとIC素子との接続点の保護処理や防湿対策が不要で安価に作成できること、及び絶縁部材に曲げやねじれ等のストレスが作用した場合にもコイルに断線を生じることがなく耐久性に優れることなどから、IC素子自体にアンテナコイルが一体形成されたIC素子を絶縁部材上に搭載したものが提案されている。 Although the antenna coil formed of a winding that carries the insulating member is used, led to recent years, the protection process and moisture protection at the connection point between the antenna coil and the IC element can be created unnecessary at low cost, and the insulating member bending and the like that stress distortion, etc., excellent in durability without causing disconnection in the coil even when working, the IC element antenna coil is integrally formed on the IC element itself that is mounted on an insulating member There has been proposed.

【0004】アンテナコイルをIC素子に一体形成した場合、アンテナコイルを絶縁部材にパターン形成したり、巻線からなるアンテナコイルを絶縁部材に担持する場合に比べて、コイルの巻径や導体幅が小さくなり、巻数についても自ずと限界があるため、リーダライタとの間の通信距離を大きくすることが困難で、必要な通信距離を確保することできない場合がある。 [0004] When formed integrally antenna coil in the IC device, the antenna coil or a pattern formed in the insulating member, as compared with the case of carrying the antenna coil made of winding insulation member, the winding diameter and the conductor width of the coil decreases, since there naturally is a limit for the number of turns, it is difficult to increase the communication distance between the reader-writer, it may not be possible to secure the necessary communication distance. そこで、従来より、特開平8−532904号公報等に記載されているように、IC素子に一体形成されたアンテナコイルとリーダライタに備えられたアンテナコイルとの間に、各アンテナコイル間の電磁誘導結合を強化するための導体ループを配置する技術が提案されている。 Therefore, conventionally, as disclosed in JP-A-8-532904 discloses such, between the antenna coil provided in the antenna coil and the reader-writer which is integrally formed on the IC element, electromagnetic between the antenna coil technique of placing a conductor loop for enhancing the inductive coupling has been proposed.

【0005】なお、本明細書においては、このアンテナコイル間の電磁結合を強化するための導体ループを、 [0005] In this specification, the conductor loop to enhance the electromagnetic coupling between the antenna coil,
「ブースタコイル」という。 It referred to as a "booster coil".

【0006】前記公知例に記載のブースタコイルは、I [0006] The booster coil according to the known example, I
C素子に一体形成されたアンテナコイルとほぼ同一寸法に形成され、IC素子に一体形成されたアンテナコイルと主に電磁結合する第1コイルと、当該第1コイルと電気的に接続され、絶縁部材の寸法範囲で当該第1コイルよりも大型に形成されて、リーダライタに備えられたアンテナコイルと主に電磁結合する第2コイルとを有する構成になっている。 Is formed on substantially the same dimensions as the integrally formed with an antenna coil C element, a first coil which mainly electromagnetically coupled to the antenna coil which is integrally formed on the IC element, is connected the first to coil and electrically insulating member is formed on a large than the first coil in the size range of, has a structure and a second coil which mainly electromagnetically coupled to the antenna coil provided in the reader-writer.

【0007】ブースタコイルを備えた非接触式情報担体においては、リーダライタに備えられたアンテナコイル、ブースタコイル及びIC素子に一体形成されたアンテナコイルを含めた系において効率的なエネルギ伝達を行うため、所要の静電容量を備える必要がある。 [0007] In the non-contact information carriers provided with a booster coil, to ensure efficient energy transfer in a system including an antenna coil provided in the reader-writer, an antenna coil that is integrally formed on the booster coil and the IC element , it is necessary to provide the required capacitance. 従来より、非接触式情報担体に静電容量を備える手段としては、絶縁部材にチップコンデンサを搭載する方法や、例えば特開平10−69533号公報等に記載されているように、絶縁部材の表裏両面に導電体膜を対向に形成し、ブースタコイルとこれら導電体膜とを接続するため、絶縁部材の表裏両面に形成された導電体膜の一部をスルーホールやクリンピング等の手段で電気的に接続する方法が提案されている。 Conventionally, as a means comprising a capacitance in the non-contact type information carrier, and a method of mounting a chip capacitor on the insulating member, as described, for example, in JP-A 10-69533 Patent Publication, the front and back of the insulating member a conductive film formed on the opposite both sides, for connecting the booster coil and these conductor films, electrical part of both sides to form a conductive film of the insulating member in the through hole and crimping or the like means how to connect have been proposed.

【0008】 [0008]

【発明が解決しようとする課題】前記したように、従来のブースタコイルは、IC素子に一体形成されたアンテナコイルと主に電磁結合する第1コイルとリーダライタに備えられたアンテナコイルと主に電磁結合する第2コイルとを有するが、第2コイルの巻径を大きくするためには第1コイルを第2コイルの内側に配置せざるを得ず、したがってIC素子を絶縁部材の中央部分に設定せざるを得ないので、絶縁部材に不正な外力が作用したとき、IC素子に大きなストレスが作用し、IC素子の破壊や動作不良といった不都合を生じやすいという問題がある。 As described above [0008], the conventional booster coil, mainly an antenna coil provided in the first coil and the reader-writer which mainly electromagnetically coupled to the antenna coil which is integrally formed on the IC element has a second coil electromagnetically coupled, in order to increase the winding diameter of the second coil is inevitable to arrange the first coil on the inside of the second coil, thus the IC elements in the central portion of the insulating member because inevitably set, when the unauthorized external force acts on the insulating member, a large stress acts on the IC element, there is a problem that tends to occur a disadvantage destruction and malfunction of the IC element.

【0009】一方、非接触式情報担体に静電容量を備える手段に関しては、絶縁部材にチップコンデンサを搭載する方法をとった場合には、非接触式情報担体が厚型化すると共に、部品点数の増加と製造工程の複雑化を避けられないので、非接触式情報担体が高コスト化するという問題がある。 On the other hand, with regard to the means comprising a capacitance in the non-contact information carriers, when taking the method of mounting a chip capacitor on the insulating member is a non-contact type information medium is thick-type, the number of parts since an increase in the inevitable complication of the manufacturing process, there is a problem that a non-contact type information medium is higher cost.

【0010】また、絶縁部材の表裏両面に導電体膜を対向に形成し、これらの各導電体膜をスルーホールやクリンピング等の手段で電気的に接続する方法をとった場合にも、ブースタコイルの製造工程が複雑化するため、やはり非接触式情報担体が高コスト化する。 Further, both surfaces of the insulating member a conductive film formed on the counter, even when taking the method of electrically connecting by a means of the through hole and crimping, etc. Each of these conductor films, the booster coil since the process of manufacturing is complicated, also non-contact information medium is higher cost.

【0011】本発明は、かかる従来技術の不備を解決するためになされたものであって、その課題は、ブースタコイルに対するIC素子の設定自由度が大きい非接触通信式情報担体を提供すること、安価かつ薄形にして通信特性が良好な非接触通信式情報担体を提供することにある。 [0011] The present invention was made to solve the deficiencies of the prior art, that the problem is to provide a non-contact communication type information carrier is greater flexibility in setting the IC device against the booster coil, communication characteristics in the inexpensive and thin is to provide a good contact communication type information carrier.

【0012】 [0012]

【課題を解決するための手段】本発明は、前記の課題を解決するため、第1に、アンテナコイルが一体形成されたIC素子と、前記IC素子に一体形成されたアンテナコイルとリーダライタに備えられたアンテナコイルとの電磁結合を強化するブースタコイルと、これらIC素子及びブースタコイルを担持する絶縁部材とを備えた非接触通信式情報担体において、前記絶縁部材上に1つのブースタコイルを形成し、当該1つのブースタコイルの一部と対向に前記IC素子を配置した。 The present invention SUMMARY OF THE INVENTION In order to solve the above problems, the first, the IC element antenna coil are integrally formed, the antenna coil and the reader-writer which is integrally formed on the IC element forming a booster coil, the non-contact communication type information carrier and an insulating member for carrying these IC elements and the booster coil, the single booster coil on the insulating member to strengthen the electromagnetic coupling between the antenna coil provided and it was placed the IC element to a portion opposite the one booster coil.

【0013】このように、絶縁部材上に1つのブースタコイルを形成し、当該1つのブースタコイルの一部と対向にIC素子を配置すると、ブースタコイルひいては絶縁部材に対するIC素子の設定自由度を大きくすることができるので、例えばIC素子をブースタコイル(絶縁部材)の中央領域を除く部分に配置することによって、 [0013] Thus, to form a single booster coil on the insulating member, placing an IC element on a portion opposite the one booster coil, increase the degree of freedom in setting the IC element for the booster coil turn insulating member it is possible to, by placing for example the IC device in the portion except for the central region of the booster coil (insulation member),
絶縁部材に不正な外力が作用したときにIC素子に作用するストレスを緩和することができ、IC素子の破壊や動作不良といった不都合を解消できる。 It can relieve stress acting on the IC device when an invalid external force acts on the insulating member, can eliminate a disadvantage such destruction and malfunction of the IC element.

【0014】第2に、前記第1の手段におけるブースタコイルを、前記絶縁部材の片面にのみに形成するという構成にした。 [0014] Second, the booster coil in the first means, and the configuration of forming only on one surface of the insulating member.

【0015】このように、ブースタコイルを絶縁部材の片面にのみ形成すると、ブースタコイル付き絶縁部材の製造を容易に行うことができるので、非接触通信式情報担体の製造コストを安価にすることができる。 [0015] In this manner, when the booster coil is formed on only one surface of the insulating member, since the manufacture of the booster coil with an insulating member can be easily performed, to be inexpensive manufacturing cost of the non-contact communication type information carrier it can.

【0016】第3に、前記第1の手段におけるブースタコイルを、前記絶縁部材の表裏両面に分割して形成するという構成にした。 [0016] Third, a booster coil in the first means, and the configuration of forming divided into front and rear surfaces of the insulating member.

【0017】このように、ブースタコイルを絶縁部材の表裏両面に分割して形成すると、ブースタコイルの巻数を増やすことができるので、リーダライタとの間の通信距離をさらに延長することができる。 [0017] Thus, when formed by dividing the booster coil on both sides of the insulating member, it is possible to increase the number of turns of the booster coil can be further extended communication distance between the reader writer.

【0018】第4に、前記第3の手段における絶縁部材の片面側に形成されたブースタコイルの両端部に、当該ブースタコイルと電気的に接続された第1導体膜を形成すると共に、前記絶縁部材の裏面の前記第1導体膜と対向する部分に、互いに電気的に接続された2つの導体膜からなる第2導体膜を形成し、スルーホールを形成することなく、前記ブースタコイルに共振用の静電容量を接続した。 [0018] Fourth, the both end portions of the third insulating member in means of the booster coil formed on one side of, the forming the booster coil and electrically connected to the first conductive layer, the insulation the first conductive film and the facing portion of the rear surface of the member to form a second conductive film consisting of two conductive films which are electrically connected to each other, without forming a through hole, for resonance in the booster coil the electrostatic capacity was connected.

【0019】このように、絶縁部材の表裏面に第1導体膜及び第2導体膜を対向に形成し、これによってブースタコイルに共振用の静電容量を接続すると、第1及び第2導体膜をブースタコイルと同一プロセスで形成することができるので、非接触通信式情報担体の製造コストを安価にすることができると共に、静電容量を薄形に形成できるので、チップコンデンサを搭載する場合に比べて、非接触通信式情報担体を薄形化することができる。 [0019] Thus, the first conductive film and the second conductive film is formed on the opposite front and rear surfaces of the insulating member and thereby to connect the electrostatic capacitance for resonance to the booster coil, the first and second conductive films the can be formed by the booster coil and the same process, with the cost of manufacturing the non-contact communication type information carrier can be made inexpensive, because it forms a capacitance thin, when mounting the chip capacitor compared to the non-contact communication type information carrier can be thinned.
また、スルーホールを形成することなく、静電容量付きのブースタコイルを形成するので、ブースタコイル及び静電容量付き絶縁部材の製造を容易に行うことができ、 Further, without forming a through hole, because it forms a booster coil with capacitance, the manufacture of the booster coil and capacitance with insulation member can be easily performed,
非接触通信式情報担体の製造コストを安価にすることができる。 The manufacturing cost of the non-contact communication type information carrier can be made inexpensive.

【0020】第5に、前記第3の手段における絶縁部材の表面側に形成されたブースタコイルと前記絶縁部材の裏面側に形成されたブースタコイルとをスルーホールを介して接続した。 [0020] Fifth, to connect the booster coil formed on the back side of the third booster coil formed on the surface side of the insulating member in section the insulating member through the through hole.

【0021】このように、ブースタコイルを絶縁部材の表裏両面に分割して形成し、絶縁部材の表裏面に形成された各ブースタコイルを電気的に接続すると、絶縁部材の表裏両面を有効利用することができ、ブースタコイルの巻数を増やすことができるので、通信特性が良好な非接触通信式情報担体を得ることができる。 [0021] Thus, formed by dividing the booster coil on both sides of the insulating member and electrically connecting each booster coil formed on the front and back surfaces of the insulating member, to effectively utilize the front and rear surfaces of the insulating member it can, it is possible to increase the number of turns of the booster coil can communicate characteristics to obtain good non-contact communication type information carrier.

【0022】第6に、前記第3の手段における絶縁部材の表面側に形成されたブースタコイルと当該絶縁部材の裏面側に形成されたブースタコイルの全部又は一部を対向に配置し、ブースタコイルに共振用の静電容量を接続した。 [0022] The 6, arranged all or part of the third means booster coil and the insulating member formed on the surface side of the insulating member in the booster coil formed on the back side of the opposing, booster coil connecting the capacitance for resonance to.

【0023】このように、ブースタコイルを構成する導体の全部又は一部を対向に配置することによってブースタコイルに共振用の静電容量を接続すると、静電容量を形成するための特別な導体膜を絶縁部材状に形成する必要がないので、絶縁部材の表裏両面を有効利用できてブースタコイルの巻数を増やすことができ、通信特性が良好な非接触通信式情報担体を得ることができる。 [0023] Thus, when connecting the electrostatic capacitance for resonance to the booster coil by placing all or part of the conductor constituting the booster coil opposed special conductive film for forming a capacitance the it is not necessary to form the insulating member form, and can be effectively utilized both sides of the insulating member can be more turns of the booster coil can communicate characteristics to obtain good non-contact communication type information carrier.

【0024】第7に、前記第3の手段における絶縁部材の表面側に形成されたブースタコイルの導体幅と前記絶縁部材の裏面側に形成されたブースタコイルの導体幅とを互いに異ならせた。 [0024] Seventh, was different from the conductor width of the third means booster coil formed on the back side of the conductor width of the booster coil formed on the surface side of the insulating member and the insulating member in the mutually.

【0025】このように、絶縁部材の表面側及び裏面側に形成されるブースタコイルの導体幅とを互いに異ならせると、製造上、絶縁部材の表面側に形成されたブースタコイルと絶縁部材の裏面側に形成されたブースタコイルとの形成位置が各ブースタコイルの導体幅の差の範囲でずれたとしても、静電容量の値が変化しないので、通信特性のばらつきが小さい非接触通信式情報担体を提供できる。 [0025] Thus, when made different from the conductor width of the booster coil formed on the first surface and the second surface of the insulating member to each other, manufacturing, the back surface of the booster coil formed on the surface side of the insulating member insulating member even formation positions of the booster coil formed on the side is shifted in the range of the difference between the conductor width of each booster coil, the value of the capacitance does not change, variations in the communication characteristics are small non-contact communication type information carrier It can provide.

【0026】 [0026]

【発明の実施の形態】以下、本発明に係る非接触通信式情報担体の第1実施形態例を、図1乃至図7に基づいて説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the non-contact communication type information carrier according to the present invention will be described with reference to FIGS. 1 to 7. 図1は本例の非接触通信式情報担体に備えられたブースタコイルとIC素子との配列を示す平面図、 Figure 1 is a plan view showing the arrangement of the booster coil and the IC element provided in a non-contact communication type information carrier of this embodiment,
図2は図1のA−A断面図、図3は本例の非接触通信式情報担体に搭載される絶縁部材の表面図、図4は本例の非接触通信式情報担体に搭載される絶縁部材の裏面図、 Figure 2 is A-A sectional view of FIG. 1, FIG. 3 is a surface view of an insulating member which is mounted in the contactless communication type information carrier of this embodiment is mounted 4 in a non-contact communication type information carrier of this embodiment rear view of the insulating member,
図5は本例の非接触通信式情報担体に搭載されるIC素子の斜視図、図6は本例の非接触通信式情報担体に搭載されるIC素子の平面図、図7は本例の非接触通信式情報担体に備えられたブースタコイルの等価回路図である。 Figure 5 is a perspective view of an IC element mounted on the non-contact communication type information carrier of this embodiment, FIG. 6 is a plan view of an IC element mounted on the non-contact communication type information carrier of the present example, FIG. 7 of the present example it is an equivalent circuit diagram of the booster coil provided in the non-contact communication type information carrier.

【0027】図1及び図2に示すように、本例の非接触通信式情報担体は、アンテナコイル1が一体形成されたIC素子2と、ブースタコイル3及び静電容量接続用の導体膜4a,4b,5a,5bが形成された絶縁部材6 As shown in FIGS. 1 and 2, the non-contact communication type information carrier of this embodiment, the IC element 2 antenna coil 1 is integrally formed, the conductive film 4a for the booster coil 3 and the capacitance connected , 4b, 5a, 5b are formed insulating member 6
と、これらIC素子2及び絶縁部材6を一体にケーシングする基体7とからなる。 When composed of these IC elements 2 and the insulating member 6 from the substrate 7 for the casing together. IC素子2は、図1に示すように、アンテナコイル1を絶縁部材6側に向けて、絶縁部材6のブースタコイル形成面側に設定される。 IC element 2, as shown in FIG. 1, the antenna coil 1 toward the insulating member 6 side, is set to the booster coil forming surface of the insulating member 6.

【0028】IC素子2は、図5及び図6に示すように、入出力端子2aの形成面に、ポリイミド樹脂膜等からなる絶縁層2bを介して矩形スパイラル状のアンテナコイル1を一体に形成してなる。 The IC element 2, as shown in FIGS. 5 and 6 formed on the forming surface of the input-output terminal 2a, the rectangular spiral antenna coil 1 together with the insulating layer 2b made of a polyimide resin film or the like and composed. アンテナコイル1は、 Antenna coil 1,
フォトレジスト法、即ち、IC素子2の絶縁層2b上に導電性金属材料をスパッタリング又は真空蒸着し、IC Photoresist method, i.e., a conductive metal material is sputtered or vacuum deposited on the insulating layer 2b of the IC element 2, IC
素子2(より実際的には、個々のIC素子に分割される以前の完成ウエハ)の絶縁層形成面に、フォトレジスト層を均一の厚さに形成し、このフォトレジスト層に所要のコイルパターンを露光・現像した後、フォトレジスト層をマスクとしてエッチングし、しかる後に、フォトレジスト層を除去して入出力端子4aの形成面に導電性金属材料からなるコイルパターンを形成するといった方法で形成することができる。 (More practically, the previous finished wafer is divided into individual IC element) element 2 in the insulating layer forming surface of a photoresist layer to a uniform thickness, the required coil pattern the photoresist layer after exposed and developed to etch the photoresist layer as a mask, thereafter, formed by a method such as forming a coil pattern made of a conductive metal material forming surface of the input-output terminals 4a by removing the photoresist layer be able to. なお、コイルパターンの電気抵抗を減少するため、導電性金属膜の表面に銅めっき層を形成することもできる。 In order to reduce the electrical resistance of the coil patterns, it is also possible to form a copper plating layer on the surface of the conductive metal film.

【0029】また、図5及び図6の例では、アンテナコイル1が複数のターン数を有する矩形スパイラル状に形成されているが、当該アンテナコイル1のターン数や平面形状はこれに限定されるものではない。 Further, in the example of FIG. 5 and FIG. 6, the antenna coil 1 is formed in a rectangular spiral shape having a number of plurality of turns, the number of turns and the planar shape of the antenna coil 1 is limited to not. 即ち、ターン数に関しては、1ターン以上の任意のターン数とすることができ、平面形状に関しては、角部に斜線状又は円弧状の面取りが施された矩形や円形など、任意の形状に形成できる。 That is, with respect to the number of turns, can be any number of turns of one or more turns, with respect to the planar shape, the hatched-like or arc-shaped chamfer and a rectangle or a circle which has been subjected to the corners, formed into any shape it can.

【0030】ブースタコイル3は、図1乃至図3に示すように、絶縁部材6の表面側にのみ形成されており、その両端部は、静電容量接続用の導体膜4a,4bにそれぞれ接続されている。 The booster coil 3, as shown in FIGS. 1 to 3 are formed only on the surface side of the insulating member 6, both ends thereof, respectively connecting conductor film 4a for the capacitance connected to 4b It is. また、ブースタコイル3は、その平面形状及び寸法が、絶縁部材6に収まる範囲でなるべく大きく形成される。 Moreover, the booster coil 3 has a plane shape and dimensions are possible larger the extent that fits the insulating member 6.

【0031】なお、図1及び図3の例では、ブースタコイル3が複数のターン数を有する矩形スパイラル状に形成されているが、ブースタコイル3のターン数や平面形状はこれに限定されるものではなく、前述のアンテナコイル1と同様に、任意のターン数及び形状に形成することができる。 [0031] In the example of FIGS. 1 and 3, those booster coil 3 are formed in a rectangular spiral shape having a number of plurality of turns, the number of turns and the planar shape of the booster coil 3 is not limited to this rather, like the antenna coil 1 described above can be formed into any number of turns and shape.

【0032】静電容量接続用の導体膜4aと5a及び4 The conductive films 4a and 5a and 4 for capacitive connection
bと5bは、絶縁部材6の表面及び裏面に対向に形成される。 b and 5b are formed on the opposite front and rear surfaces of the insulating member 6. また、絶縁部材6の表面側に形成された静電容量接続用の導体膜4a,4bは、前記したように、ブースタコイル3を介して電気的に接続され、絶縁部材6の裏面側に形成された静電容量接続用の導体膜5a,5b The conductive films 4a for forming the capacitances connected to the surface side of the insulating member 6, 4b, as described above, are electrically connected via the booster coil 3, formed on the rear surface side of the insulating member 6 conductors film 5a for capacitive connection, 5b
は、図4に示すように、導線8を介して電気的に接続される。 As shown in FIG. 4, it is electrically connected through a lead wire 8. したがって、前記ブースタコイル3は、相対向に配置された静電容量接続用の導体膜4aと5a及び4b Therefore, the booster coil 3, the conductor layer 4a and 5a and 4b for placed capacitance connected to the opposite
と5bを介してその両端部で容量結合されており、図7 5b are capacitively coupled at its opposite ends via a, 7
に模式的に示すように、両端に導体膜4aと5aとで形成される静電容量C と導体膜4bと5bとで形成される静電容量C とが接続されたブースタコイル3が得られる。 A As shown schematically, the capacitance C A and the conductive film 4b and the capacitance C booster coil 3 B and is connected formed by the 5b formed by the conductive film 4a and 5a at both ends can get. 各導体膜4a,5a,4b,5bの面積は、 Each conductor films 4a, 5a, 4b, the area of ​​5b,
前記2個の静電容量C ,C の直列インピーダンスが、IC素子2に一体形成されたアンテナコイル1及びブースタコイル3を含む系において、アンテナコイル1 The two capacitances C A, the series impedance of C B is, in a system including the antenna coil 1 and the booster coil 3 which is integrally formed on the IC element 2, the antenna coil 1
の両端に最大電圧が得られるように調整される。 The maximum voltage is adjusted so as to obtain across the.

【0033】前記ブースタコイル3及び静電容量接続用の導体膜4a,5a,4b,5bは、絶縁部材6の片面に形成された均一厚さの導電性金属層にエッチングを施して所要のコイルパターンを形成するエッチング法や、 [0033] The booster coil 3 and the conductive film 4a for capacitive connection, 5a, 4b, 5b, the required coil by etching a uniform thickness conductive metal layer formed on one surface of the insulating member 6 and etching to form a pattern,
絶縁部材6の片面に導電性インクを用いて所要の導電パターンを印刷形成する印刷法などをもって形成することができる。 It can be formed with a printing method of printing form desired conductive pattern by using a conductive ink on one surface of the insulating member 6.

【0034】絶縁部材6は、所要の誘電率と剛性とをもった絶縁材料をもって形成される。 The insulating member 6 is formed with an insulating material having a desired dielectric constant and rigidity. 絶縁部材6を構成するに好適な絶縁材料としては、一例として、ガラスエポキシ樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリエチレンテレフタレート樹脂(以下、PETと略称する。) Suitable insulating material constituting the insulating member 6, as an example, a glass epoxy resin, polyimide resin, polyamide resin, polyethylene terephthalate resin (hereinafter, abbreviated as PET.)
又は塩化ビニル樹脂などを挙げることができる。 Or vinyl chloride resins.

【0035】基体7は、カバーシート8と接着剤層9とをもって構成される。 The substrate 7 is configured with a cover sheet 8 and the adhesive layer 9. このうち、カバーシート7は、紙やプラスチックシートなど、任意のシート状材料をもって形成することができるが、廃棄しても分解し、焼却してもダイオキシン等の有害物質を発生しないことから、 Of these, the cover sheet 7, such as paper or plastic sheet, since it can be formed with any sheet material, which be discarded decomposed, does not generate harmful substances such as dioxin even when incinerated,
紙をもって形成することが最も好ましい。 It is most preferable to form with paper. カバーシート材料としてプラスチックシートを用いる場合には、焼却してもダイオキシン等の有害物質を発生しないことから、PETのような塩素を含まないプラスチックシートを用いることが特に好ましい。 When using a plastic sheet as the cover sheet material, since it be incinerated without generating harmful substances such as dioxin, it is particularly preferable to use a plastic sheet that does not contain chlorine, such as PET. 一方、接着剤層9を構成する接着剤としては、硬化後に所要の硬度を有する任意の接着剤を用いることができるが、ブースタコイル1、 On the other hand, the adhesive which constitutes the adhesive layer 9, but may be any adhesive having the required hardness after curing, the booster coil 1,
アンテナコイル3及びIC素子4の保護効果を高めるため、例えばエポキシ樹脂のように吸湿性の低い樹脂材料を用いることが特に好ましい。 To enhance the protective effect of the antenna coil 3 and the IC element 4, particularly preferable to use a low resin material hygroscopicity, for example, as an epoxy resin.

【0036】前記第1実施形態例に係る非接触通信式情報担体は、1つのブースタコイル3条の一部にIC素子2を搭載したので、ブースタコイル3ひいては絶縁部材6に対するIC素子2の設定自由度を大きくすることができ、例えばIC素子2をブースタコイル3(絶縁部材6)の中央領域を除く部分に配置することによって、絶縁部材6に不正な外力が作用したときにIC素子2に作用するストレスを緩和することができ、IC素子2の破壊や動作不良といった不都合を解消できる。 The non-contact communication type information carrier according to the first embodiment, since mounting the IC element 2 in a part of Article one booster coil, set the IC device 2 for the booster coil 3 and thus the insulating member 6 it is possible to increase the degree of freedom, for example, by placing the IC element 2 in a portion excluding the central region of the booster coil 3 (the insulating member 6), the IC element 2 when an invalid external force acts on the insulating member 6 can relieve stress acting, it can eliminate a disadvantage such as breakage or malfunction of the IC element 2. また、IC In addition, IC
素子2をブースタコイル3と対向に配置するので、IC Since placing the element 2 to the booster coil 3 and the counter, IC
素子2に一体形成されたアンテナコイル1とリーダライタに備えられたアンテナコイルとの電磁結合を強化することができ、リーダライタとの間の通信距離を延長することができる。 Can enhance the electromagnetic coupling between the antenna coil provided integrally formed antenna coil 1 and the reader writer device 2, it is possible to extend the communication distance between the reader writer. また、ブースタコイル3を絶縁基板6の片面にのみ形成するので、ブースタコイル付き絶縁部材の製造を容易に行うことができ、非接触通信式情報担体の製造コストを安価にすることができる。 Moreover, since forming the booster coil 3 only on one surface of the insulating substrate 6, the manufacturing of the booster coil with an insulating member can be easily performed, the manufacturing cost of non-contact communication type information carrier can be made inexpensive. また、絶縁部材6の表裏面に導体膜4aと5a及び4bと5bを対向に形成し、これによってブースタコイル3に共振用の静電容量を接続するので、各導体膜4a,4b,5a,5 Further, the conductive film 4a and 5a and 4b, 5b formed on opposed front and back surfaces of the insulating member 6, since thereby connecting the electrostatic capacitance for resonance to the booster coil 3, the conductive films 4a, 4b, 5a, 5
bをブースタコイル3と同一プロセスで形成することができ、非接触通信式情報担体の製造コストを安価にすることができる。 b to be formed by the booster coil 3 and the same process, the manufacturing cost of the non-contact communication type information carrier can be made inexpensive. また、静電容量を薄形に形成できるので、チップコンデンサを搭載する場合に比べて、非接触通信式情報担体を薄形化することができる。 Further, it is possible to form a capacitance thin, as compared with the case of mounting a chip capacitor, a non-contact communication type information carrier can be thinned. さらに、スルーホールを形成することなく、静電容量付きのブースタコイル3を形成するので、ブースタコイル及び静電容量付き絶縁部材の製造を容易に行うことができ、非接触通信式情報担体の製造コストを安価にすることができる。 Further, without forming a through hole, because it forms a booster coil 3 with capacitance, the manufacture of the booster coil and capacitance with insulation member can be easily performed, the production of non-contact communication type information carrier it can be made inexpensive cost.

【0037】次に、本発明に係る非接触通信式情報担体の第2実施形態例を、図8に基づいて説明する。 Next, a second embodiment of the non-contact communication type information carrier according to the present invention will be described with reference to FIG. 図8は本例の非接触通信式情報担体に搭載される絶縁部材の表面図である。 Figure 8 is a top plan view of the insulating member to be mounted in a non-contact communication type information carrier of this embodiment.

【0038】図8から明らかなように、本例の非接触通信式情報担体は、ブースタコイル3のIC素子2が設定される部分の形状を巻径が小さいコイルに近似した形状に形成し、当該部分とIC素子2に一体形成されたアンテナコイル1とを対向に配置したことを特徴とする。 [0038] As apparent from FIG. 8, a non-contact communication type information carrier of this embodiment forms a shape of the portion where the IC element 2 of the booster coil 3 is set to a shape approximate to the coil winding diameter is small, characterized by being arranged to face the antenna coil 1 which is integrally formed on the portion and the IC element 2. その他については、第1実施形態例に係る非接触通信式情報担体と同じであるので、重複を避けるために説明を省略する。 The rest is the same as the non-contact communication type information carrier according to the first embodiment, the description thereof is omitted to avoid duplication.

【0039】本例の非接触通信式情報担体は、ブースタコイル3のIC素子2が設定される部分の形状を巻径が小さいコイルに近似した形状に形成し、当該部分とIC The non-contact communication type information carrier of this embodiment forms a shape of the portion where the IC element 2 of the booster coil 3 is set to a shape approximate to the coil winding diameter is small, the part and the IC
素子2に一体形成されたアンテナコイル1とを対向に配置したので、アンテナコイル1とブースタコイル3との電磁結合をより強化することができ、リーダライタとの間に通信距離を延長することができる。 Having arranged the antenna coil 1 which is integrally formed on the element 2 in the opposite, it is possible to strengthen the electromagnetic coupling between the antenna coil 1 and the booster coil 3, it is to extend the communication distance between the reader-writer it can.

【0040】次に、本発明に係る非接触通信式情報担体の第3実施形態例を、図9乃至図11に基づいて説明する。 Next, a third embodiment of the non-contact communication type information carrier according to the present invention will be described with reference to FIGS. 9 to 11. 図9は本例の非接触通信式情報担体に搭載される絶縁部材の表面図、図10は本例の非接触通信式情報担体に搭載される絶縁部材の裏面図、図11は本例の非接触通信式情報担体に備えられたブースタコイルの等価回路図である。 Figure 9 is a surface view of an insulating member which is mounted in the contactless communication type information carrier of this embodiment, FIG. 10 is a rear view of the insulating member to be mounted in a non-contact communication type information carrier of this embodiment, FIG. 11 of the present embodiment it is an equivalent circuit diagram of the booster coil provided in the non-contact communication type information carrier.

【0041】本例の非接触通信式情報担体は、ブースタコイルを絶縁部材6の表面及び裏面に分割して形成し、 The non-contact communication type information carrier of this embodiment, formed by dividing the booster coil on the front and back surfaces of the insulating member 6,
絶縁部材6を介してブースタコイルを構成する導体の一部を対向させることによって、ブースタコイルに共振用の静電容量を接続したことを特徴とする。 By opposing the part of the conductor constituting the booster coil via an insulation member 6, characterized in that to connect the electrostatic capacitance for resonance to the booster coil.

【0042】即ち、本例の非接触通信式情報担体におけるブースタコイル3は、図9及び図10に示すように、 [0042] That is, the booster coil 3 in the non-contact communication type information carrier of this embodiment, as shown in FIGS. 9 and 10,
絶縁部材6の表面側に形成された表面パターン3b Surface pattern 3b 1 formed on the surface side of the insulating member 6
と、絶縁部材6の裏面側に形成された裏面パターン3b If, back-side pattern 3b formed on the rear surface side of the insulating member 6
とからなる。 Consisting of 2. これら表面パターン3b を構成する導体と裏面パターン3b を構成する導体とは、図9及び図10から明らかなように、絶縁部材6の表面側から見て巻線の方向が互いに逆向きになっており、図9 The conductors constituting the conductor and back surface patterns 3b 2 constituting these surface patterns 3b 1, as apparent from FIGS. 9 and 10, in the directions opposite to each other in the winding as viewed from the front side of the insulating member 6 it has, as shown in FIG. 9
に示す4カ所の黒塗りの部分A,B,C,Dにおいて互いに対向に配置され、図11に示す4個の静電容量C ,C ,C ,C を構成している。 Part A, the black of the four positions shown in B, C, disposed opposite each other in the D, and constitute an electrostatic capacitance of the four shown in FIG. 11 C A, C B, C C, the C D. また、これら表面パターン3b を構成する導体と裏面パターン3b The conductor and the back surface pattern 3b constituting these surface patterns 3b 1
を構成する導体とは、図9及び図10から明らかなように、絶縁部材6に開設されたスルーホール10を介して、各コイル3b ,3b の内周端で電気的に接続され、表面パターン3b を構成する導体の外周端Xが裏面パターン3b を構成する導体の外周端の近傍X′と対向に配置され、裏面パターン3b を構成する導体の外周端Yが表面パターン3b を構成する導体の外周端の近傍Y′と対向に配置されている。 The conductors constituting the two, as is apparent from FIGS. 9 and 10, through the through hole 10 which is opened in the insulating member 6 is electrically connected with the inner circumferential end of each coil 3b 1, 3b 2 , the outer peripheral end X of the conductor constituting the surface pattern 3b 1 is disposed opposed to the vicinity X 'of the outer peripheral edge of the conductor constituting the rear surface pattern 3b 2, the outer peripheral end Y of the conductor constituting the rear surface pattern 3b 2 surface pattern It is disposed opposed to the vicinity Y 'of the outer peripheral edge of the conductor constituting the 3b 1. これにより、図11に示すように、表裏面のブースタコイル3b ,3b が1点で接続され、かつこれら表裏面のブースタコイル3b ,3b を合わせたブースタコイル3の両端部又はその近傍部分に4個の静電容量C ,C ,C ,C が接続されたブースタコイル3が得られる。 Thus, as shown in FIG. 11, the booster coil 3b 1 of the front and back surfaces, 3b 2 are connected at one point, and both ends of the booster coil 3 was combined booster coil 3b 1, 3b 2 of the front and back surfaces or the capacitance of the four adjacent portion C a, C B, C C , C D is the booster coil 3 is connected is obtained.

【0043】前記4個の静電容量C ,C ,C ,C [0043] The four capacitance C A, C B, C C , C
は、IC素子2に一体形成されたアンテナコイル1及びブースタコイル3を含む系において、アンテナコイル1の両端に最大電圧が得られるように調整される。 D is the system including the antenna coil 1 and the booster coil 3 which is integrally formed on the IC element 2 is adjusted so that the maximum voltage is obtained across the antenna coil 1.

【0044】なお、前記表面パターン3b を構成する導体と裏面パターン3b を構成する導体の導体幅とは、同一幅に形成することもできるし、異なる幅に形成することもできる。 [0044] Incidentally, the conductor width of the conductor forming the conductor and back surface patterns 3b 2 forming the surface pattern 3b 1 can either be be formed in the same width, may be formed in different widths. これら各導体の導体幅を異ならせると、製造上、表面パターン3b When varying the conductor width of each conductor, manufacturing, surface pattern 3b を構成する導体と裏面パターン3b を構成する導体の形成位置が導体幅の差の範囲でずれたとしても静電容量の値が変化しないので、非接触通信式情報担体の通信特性のばらつきを小さくすることができる。 Since the formation position of the conductors constituting the conductor and back surface patterns 3b 2 constituting one value of the electrostatic capacitance does not change even when deviation in the range of difference in conductor width, variations in the communication characteristic of the non-contact communication type information carrier it can be reduced.

【0045】その他については、第1実施形態例に係る非接触通信式情報担体と同じであるので、重複を避けるために説明を省略する。 [0045] Other Be is the same as the non-contact communication type information carrier according to the first embodiment, the description thereof is omitted to avoid duplication.

【0046】本例の非接触通信式情報担体は、第1実施形態例に係る非接触通信式情報担体と同様の効果を有するほか、ブースタコイル3を絶縁部材6の表裏両面に分割して形成し、絶縁部材6の表裏面に形成された各ブースタコイル3b ,3b The non-contact communication type information carrier of this embodiment, in addition to the same effects as the non-contact communication type information carrier according to the first embodiment, formed by dividing the booster coil 3 on both surfaces of the insulating member 6 and, each booster coil 3b 1 formed on the front and back surfaces of the insulating member 6, 3b 2 を電気的に接続するので、 Since the electrical connection,
絶縁部材6の表裏両面を有効利用できて、ブースタコイル3の巻数を増やすことができ、通信特性が良好な非接触通信式情報担体を得ることができる。 Made effective use of both front and back surfaces of the insulating member 6, can increase the number of turns of the booster coil 3 can communicate characteristics to obtain good non-contact communication type information carrier. ブースタコイル3を構成する導体の一部を対向に配置することによってブースタコイル3に共振用の静電容量C ,C Capacitance for resonance to the booster coil 3 by placing a part of the conductor constituting the booster coil 3 on the counter C A, C B,
,C を接続するので、静電容量を形成するための特別な導体膜を絶縁部材上に形成する必要がなく、絶縁部材6の表裏両面を有効利用できることから、ブースタコイルの巻数を増やすことができ、通信特性が良好な非接触通信式情報担体を得ることができる。 C C, so connecting the C D, there is no need to form a special conductive film for forming a capacitance on the insulating member, because it can effectively use both the front and back surfaces of the insulating member 6, the number of turns of the booster coil can be increased, it is possible to communicate characteristics to obtain good non-contact communication type information carrier.

【0047】なお、前記各実施形態例においては、IC It should be noted, in the above respective embodiments are, IC
素子2が固着された絶縁部材6を2枚のカバーシート8 An insulating member 6 which element 2 is fixed two cover sheets 8
でケーシングしたが、かかる構成に代えて、ブースタコイル3が備えられていない非接触通信式情報担体の片面に、ブースタコイル3が形成された絶縁部材6を接着することもできる。 In was casing, instead of such a configuration, on one surface of the non-contact communication type information carrier has the booster coil 3 is not provided, it is also possible to bond the insulating member 6 which booster coil 3 is formed.

【0048】 [0048]

【発明の効果】請求項1に記載の発明は、絶縁部材上に1つのブースタコイルを形成し、当該1つのブースタコイルの一部と対向にIC素子を配置したので、ブースタコイルひいては絶縁部材に対するIC素子の設定自由度を大きくすることができるので、例えばIC素子をブースタコイル(絶縁部材)の中央領域を除く部分に配置することによって、絶縁部材に不正な外力が作用したときにIC素子に作用するストレスを緩和することができ、 [Effect of the Invention] The invention according to claim 1, to form one booster coil on the insulating member, since the arrangement of the IC element to a portion opposite the one booster coil, against the booster coil turn insulating member it is possible to increase the degree of freedom in setting the IC element, for example, by placing the IC device in the portion except for the central region of the booster coil (insulating member), the IC element when an invalid external force acts on the insulating member it is possible to alleviate the stress that act,
IC素子の破壊や動作不良といった不都合を解消できる。 You can eliminate a disadvantage such as the destruction or malfunction of the IC element.

【0049】請求項2に記載の発明は、ブースタコイルを絶縁部材の片面にのみ形成するので、ブースタコイル付き絶縁部材の製造を容易に行うことができ、非接触通信式情報担体の製造コストを安価にすることができる。 [0049] According to a second aspect of the invention, because it forms a booster coil on only one side of the insulating member, the manufacturing of the booster coil with an insulating member can be easily performed, the manufacturing cost of non-contact communication type information carrier it can be made inexpensive.

【0050】請求項3に記載の発明は、ブースタコイルを絶縁部材の表裏両面に分割して形成したので、ブースタコイルの巻数を増やすことができ、リーダライタとの間の通信距離をさらに延長することができる。 [0050] According to a third aspect of the invention, since the formed by dividing the booster coil on both sides of the insulating member, it is possible to increase the number of turns of the booster coil, further extend the communication distance between the reader writer be able to.

【0051】請求項4に記載の発明は、絶縁部材の表裏面に第1導体膜及び第2導体膜を対向に形成し、これによってブースタコイルに共振用の静電容量を接続するので、第1及び第2導体膜をブースタコイルと同一プロセスで形成することができ、非接触通信式情報担体の製造コストを安価にすることができる。 [0051] According to a fourth aspect of the invention, the first conductive film and the second conductive film is formed on the opposite front and rear surfaces of the insulating member, since this by connecting a capacitance for resonance to the booster coil, the the first and the second conductive film can be formed by the booster coil and the same process, the manufacturing cost of the non-contact communication type information carrier can be made inexpensive. また、静電容量を薄形に形成できるので、チップコンデンサを搭載する場合に比べて、非接触通信式情報担体を薄形化することができる。 Further, it is possible to form a capacitance thin, as compared with the case of mounting a chip capacitor, a non-contact communication type information carrier can be thinned. さらに、スルーホールを形成することなく、静電容量付きのブースタコイルを形成するので、ブースタコイル及び静電容量付き絶縁部材の製造を容易に行うことができ、非接触通信式情報担体の製造コストを安価にすることができる。 Further, without forming a through hole, because it forms a booster coil with capacitance, the manufacture of the booster coil and capacitance with insulation member can be easily performed, the manufacturing cost of the non-contact communication type information carrier the can be made inexpensive.

【0052】請求項5に記載の発明は、ブースタコイルを絶縁部材の表裏両面に分割して形成し、絶縁部材の表裏面に形成された各ブースタコイルを電気的に接続するので、絶縁部材の表裏両面を有効利用できて、ブースタコイルの巻数を増やすことができ、通信特性が良好な非接触通信式情報担体を得ることができる。 [0052] The invention according to claim 5, formed by dividing the booster coil on both sides of the insulating member, because the electrically connecting each booster coil formed on the front and back surfaces of the insulating member, the insulating member made effective use of both sides, it is possible to increase the number of turns of the booster coil can communicate characteristics to obtain good non-contact communication type information carrier.

【0053】請求項6に記載の発明は、ブースタコイルを構成する導体の全部又は一部を対向に配置することによってブースタコイルに共振用の静電容量を接続するので、静電容量を形成するための特別な導体膜を絶縁部材状に形成する必要がなく、絶縁部材の表裏両面を有効利用できることから、ブースタコイルの巻数を増やすことができ、通信特性が良好な非接触通信式情報担体を得ることができる。 [0053] The invention according to claim 6, since the connecting capacitance for resonance to the booster coil by placing all or part of the conductor constituting the booster coil opposed to form an electrostatic capacitance special conductive film is not necessary to form the insulating member shaped for, since it can be effectively utilized both sides of the insulating member, it is possible to increase the number of turns of the booster coil, the communication characteristic favorable non-contact communication type information carrier it is possible to obtain.

【0054】請求項7に記載の発明は、絶縁部材の表面側及び裏面側に形成されるブースタコイルの導体幅とを互いに異ならせるので、製造上、絶縁部材の表面側に形成されたブースタコイルと絶縁部材の裏面側に形成されたブースタコイルとの形成位置が各ブースタコイルの導体幅の差の範囲でずれたとしても、静電容量の値が変化せず、通信特性のばらつきが小さい非接触通信式情報担体を提供できる。 [0054] The invention according to claim 7, since the different conductor width of the booster coil formed on the first surface and the second surface of the insulating member to each other, manufacturing, booster coil formed on the surface side of the insulating member and forming positions of the booster coil formed on the rear surface side of the insulating member as shifted in the range of the difference between the conductor width of each booster coil, the value of the capacitance is not changed, the non-variation in communication characteristics is small It can provide contact communication type information carrier.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】第1実施形態例に係る非接触通信式情報担体に備えられるブースタコイルとIC素子との配列を示す平面図である。 1 is a plan view showing an arrangement of a non-contact communication-type booster coil provided in the information carrier and the IC element according to the first embodiment.

【図2】図1のA−A断面図である。 2 is an A-A sectional view of FIG.

【図3】第1実施形態例に係る非接触通信式情報担体に搭載される絶縁部材の表面図である。 3 is a top plan view of the mounting an insulated member in a non-contact communication type information carrier according to the first embodiment.

【図4】第1実施形態例に係る非接触通信式情報担体に搭載される絶縁部材の裏面図である。 4 is a rear view of the mounting an insulated member in a non-contact communication type information carrier according to the first embodiment.

【図5】第1実施形態例に係る非接触通信式情報担体に搭載されるIC素子の斜視図である。 5 is a perspective view of an IC element mounted on the non-contact communication type information carrier according to the first embodiment.

【図6】第1実施形態例に係る非接触通信式情報担体に搭載されるIC素子の平面図である。 6 is a plan view of an IC element mounted on the non-contact communication type information carrier according to the first embodiment.

【図7】第1実施形態例に係るブースタコイルの等価回路図である。 7 is an equivalent circuit diagram of the booster coil according to the first embodiment.

【図8】第2実施形態例に係る非接触通信式情報担体に搭載される絶縁部材の表面図である。 8 is a top plan view of the mounting an insulated member in a non-contact communication type information carrier according to the second embodiment.

【図9】第3実施形態例に係る非接触通信式情報担体に搭載される絶縁部材の表面図である。 9 is a top plan view of the mounting an insulated member in a non-contact communication type information carrier according to the third embodiment.

【図10】第3実施形態例に係る非接触通信式情報担体に搭載される絶縁部材の裏面図である。 10 is a rear view of the mounting an insulated member in a non-contact communication type information carrier according to the third embodiment.

【図11】第3実施形態例に係る非接触通信式情報担体に備えられたブースタコイルの等価回路図である。 11 is an equivalent circuit diagram of the booster coil provided in the non-contact communication type information carrier according to the third embodiment.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 アンテナコイル 2 IC素子 3 ブースタコイル 3b 表面パターン 3b 裏面パターン 4a,4b,5a,5b 静電容量接続用の導体膜 6 絶縁部材 7 絶縁部材 8 カバーシート 9 接着剤層 10 スルーホール 1 antenna coil 2 IC element 3 booster coil 3b 1 surface pattern 3b 2 backside pattern 4a, 4b, 5a, the conductive film 6 insulating member 7 insulating member 8 cover sheet 9 adhesive layer 10 through-hole for 5b capacitance connected

Claims (7)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 アンテナコイルが一体形成されたIC素子と、前記IC素子に一体形成されたアンテナコイルとリーダライタに備えられたアンテナコイルとの電磁結合を強化するブースタコイルと、これらIC素子及びブースタコイルを担持する絶縁部材とを備えた非接触通信式情報担体において、前記絶縁部材上に1つのブースタコイルを形成し、当該1つのブースタコイルの一部と対向に前記IC素子を配置したことを特徴とする非接触通信式情報担体。 And 1. A IC antenna coil are integrally formed element, and the booster coil to enhance electromagnetic coupling between the antenna coil provided in the antenna coil and the reader-writer which is integrally formed on the IC element, and these IC elements the non-contact communication type information carrier and an insulating member which carries the booster coil, said insulation to form a single booster coil on member, and disposing the IC element facing the part of the single booster coil non-contact communication type information carrier, characterized in.
  2. 【請求項2】 請求項1に記載の非接触通信式情報担体において、前記ブースタコイルを前記絶縁部材の片面にのみ形成したことを特徴とする非接触通信式情報担体。 2. A non-contact communication type information carrier as claimed in claim 1, the non-contact communication type information carrier, characterized in that said booster coil is formed on only one surface of the insulating member.
  3. 【請求項3】 請求項1に記載の非接触通信式情報担体において、前記ブースタコイルを前記絶縁部材の表裏両面に分割して形成したことを特徴とする非接触通信式情報担体。 3. wherein in the non-contact communication type information carrier as claimed in claim 1, the non-contact communication type information carrier, characterized in that said booster coil is formed by dividing on both sides of the insulating member.
  4. 【請求項4】 請求項3に記載の非接触通信式情報担体において、前記絶縁部材の片面側に形成されたブースタコイルの両端部に、当該ブースタコイルと電気的に接続された第1導体膜を形成すると共に、前記絶縁部材の裏面の前記第1導体膜と対向する部分に、互いに電気的に接続された2つの導体膜からなる第2導体膜を形成し、 4. A non-contact communication type information carrier according to claim 3, wherein at both ends of the booster coil formed on one side of the insulating member, a first conductive film which is connected the booster coil and the electrically to form a, on the first conductive film opposite to the portion of the back surface of the insulating member, forming a second conductor film composed of two conductive films which are electrically connected to each other,
    スルーホールを形成することなく、前記ブースタコイルに共振用の静電容量を接続したことを特徴とする非接触通信式情報担体。 Without forming a through hole, the non-contact communication type information carrier, characterized in that connecting the electrostatic capacitance for resonance to the booster coil.
  5. 【請求項5】 請求項3に記載の非接触通信式情報担体において、前記絶縁部材の表面側に形成されたブースタコイルと前記絶縁部材の裏面側に形成されたブースタコイルとをスルーホールを介して接続したことを特徴とする非接触通信式情報担体。 5. A non-contact communication type information carrier as claimed in claim 3, via the through hole and a booster coil formed on the back surface side of the insulating member surface side formed booster coil and the insulating member non-contact communication type information carrier, characterized in that the connecting Te.
  6. 【請求項6】 請求項3に記載の非接触通信式情報担体において、前記絶縁部材の表面側に形成されたブースタコイルと前記絶縁部材の裏面側に形成されたブースタコイルの全部又は一部を対向に配置し、前記ブースタコイルに共振用の静電容量を接続したことを特徴とする非接触通信式情報担体。 6. The non-contact communication type information carrier according to claim 3, all or part of the booster coil formed on the back surface side of the insulating member and the booster coil formed on the surface side of the insulating member placed opposite, non-contact communication type information carrier, characterized in that connecting the electrostatic capacitance for resonance to the booster coil.
  7. 【請求項7】 請求項3に記載の非接触通信式情報担体において、前記絶縁部材の表面側に形成されたブースタコイルの導体幅と前記絶縁部材の裏面側に形成されたブースタコイルの導体幅とを互いに異ならせたことを特徴とする非接触通信式情報担体。 The non-contact communication type information carrier according to claim 7 claim 3, the conductor width of the booster coil formed on the back side of the conductor width and the insulating member of the booster coil formed on the surface side of the insulating member non-contact communication type information carrier, characterized in that with different bets with each other.
JP2000227455A 2000-07-27 2000-07-27 Non-contact communication type information carrier Withdrawn JP2002042083A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000227455A JP2002042083A (en) 2000-07-27 2000-07-27 Non-contact communication type information carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000227455A JP2002042083A (en) 2000-07-27 2000-07-27 Non-contact communication type information carrier

Publications (1)

Publication Number Publication Date
JP2002042083A true JP2002042083A (en) 2002-02-08

Family

ID=18720903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000227455A Withdrawn JP2002042083A (en) 2000-07-27 2000-07-27 Non-contact communication type information carrier

Country Status (1)

Country Link
JP (1) JP2002042083A (en)

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002109492A (en) * 2000-10-02 2002-04-12 Dainippon Printing Co Ltd Contactless data carrying device and wiring member for booster antenna section
JP2002175508A (en) * 2000-12-07 2002-06-21 Dainippon Printing Co Ltd Non-contact type data carrier device, and wiring member for booster antenna part
JP2002175511A (en) * 2000-12-07 2002-06-21 Dainippon Printing Co Ltd Contactless data carrier device and wiring member for booster antenna part
JP2006276594A (en) * 2005-03-30 2006-10-12 National Printing Bureau Resonant element, method for manufacturing the same and reader of the same
JP2006272815A (en) * 2005-03-30 2006-10-12 National Printing Bureau Printed matter and its reading out device
JP2006272816A (en) * 2005-03-30 2006-10-12 National Printing Bureau Printed matter and its reading out device
JP2008226099A (en) * 2007-03-15 2008-09-25 Dainippon Printing Co Ltd Noncontact data carrier device
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8528827B2 (en) 2010-06-18 2013-09-10 Semiconductor Energy Laboratory Co., Ltd. Antenna, semiconductor device, and method of manufacturing antenna
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
JP2015106331A (en) * 2013-12-02 2015-06-08 凸版印刷株式会社 Dual ic card
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US9830552B2 (en) 2007-07-18 2017-11-28 Murata Manufacturing Co., Ltd. Radio IC device
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag

Cited By (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4562892B2 (en) * 2000-10-02 2010-10-13 大日本印刷株式会社 Non-contact data carrier device and the booster antenna unit interconnection member
JP2002109492A (en) * 2000-10-02 2002-04-12 Dainippon Printing Co Ltd Contactless data carrying device and wiring member for booster antenna section
JP2002175508A (en) * 2000-12-07 2002-06-21 Dainippon Printing Co Ltd Non-contact type data carrier device, and wiring member for booster antenna part
JP2002175511A (en) * 2000-12-07 2002-06-21 Dainippon Printing Co Ltd Contactless data carrier device and wiring member for booster antenna part
JP4641095B2 (en) * 2000-12-07 2011-03-02 大日本印刷株式会社 Non-contact data carrier device and the booster antenna unit interconnection member
JP4641096B2 (en) * 2000-12-07 2011-03-02 大日本印刷株式会社 Non-contact data carrier device and the booster antenna unit interconnection member
JP2006272816A (en) * 2005-03-30 2006-10-12 National Printing Bureau Printed matter and its reading out device
JP2006272815A (en) * 2005-03-30 2006-10-12 National Printing Bureau Printed matter and its reading out device
JP2006276594A (en) * 2005-03-30 2006-10-12 National Printing Bureau Resonant element, method for manufacturing the same and reader of the same
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8725071B2 (en) 2006-01-19 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
JP2008226099A (en) * 2007-03-15 2008-09-25 Dainippon Printing Co Ltd Noncontact data carrier device
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8662403B2 (en) 2007-07-04 2014-03-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US9830552B2 (en) 2007-07-18 2017-11-28 Murata Manufacturing Co., Ltd. Radio IC device
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8973841B2 (en) 2008-05-21 2015-03-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US9022295B2 (en) 2008-05-21 2015-05-05 Murata Manufacturing Co., Ltd. Wireless IC device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8876010B2 (en) 2009-04-14 2014-11-04 Murata Manufacturing Co., Ltd Wireless IC device component and wireless IC device
US9203157B2 (en) 2009-04-21 2015-12-01 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9564678B2 (en) 2009-04-21 2017-02-07 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9111195B2 (en) 2010-06-18 2015-08-18 Semiconductor Energy Laboratory Co., Ltd. Antenna, semiconductor device, and method of manufacturing antenna
US8528827B2 (en) 2010-06-18 2013-09-10 Semiconductor Energy Laboratory Co., Ltd. Antenna, semiconductor device, and method of manufacturing antenna
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8757502B2 (en) 2011-02-28 2014-06-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag
JP2015106331A (en) * 2013-12-02 2015-06-08 凸版印刷株式会社 Dual ic card

Similar Documents

Publication Publication Date Title
EP1792272B1 (en) Rfid device with combined reactive coupler
EP2086052B1 (en) Wireless ic device
JP5024372B2 (en) Wireless ic device
US6367143B1 (en) Coil element and method for manufacturing thereof
KR100416410B1 (en) Contactless ic card and its manufacturing method
KR100799140B1 (en) Radio frequency identificationrfid tag and manufacturing method thereof
CN1175521C (en) Variable capacitance coupling antenna and method for making same and non-contact chip card
JP4186149B2 (en) Auxiliary antenna for Ic card
US8006910B2 (en) Wireless IC device
US5760456A (en) Integrated circuit compatible planar inductors with increased Q
JP5392382B2 (en) Wireless ic device
EP1410321B1 (en) Rfid tag with bridge circuit assembly and methods of use
JP3687459B2 (en) Ic card
US7967216B2 (en) Wireless IC device
JP4867830B2 (en) Wireless ic device
US7345647B1 (en) Antenna structure with distributed strip
JP4289478B2 (en) Method for manufacturing a contactless chip card using the transfer sheet
JP3936840B2 (en) Semiconductor device and manufacturing method thereof
US8474726B2 (en) RFID antenna modules and increasing coupling
JP3262804B2 (en) Method for manufacturing a chip card module
CN1144155C (en) IC module and IC card
US5999409A (en) Contactless IC card
JP4286977B2 (en) A contactless ic card its antenna characteristic adjustment method
US9390364B2 (en) Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
US20070200711A1 (en) Antenna and non-contact tag

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20071002