JP2002150245A - Ic module for ic card and ic card using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the manufacturing efficiency of an IC card and improve the yield. SOLUTION: This IC module 10 with an antenna pattern AP is installed in a card substrate 1 and a booster coil 20 is buried therein. The booster coil 20 is electromagnetically coupled to the antenna pattern AP to materialize a large data transmission distance while it is unnecessarily electrically connected to the IC chip in the IC module 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card for an IC card capable of improving manufacturing efficiency and improving yield.
The present invention relates to a C module and an IC card using the same.

[0002]

2. Description of the Related Art A contactless IC card in which an antenna coil is embedded in a card substrate has been developed.

[0003] By connecting a large-sized antenna coil that uses almost the entire area of a card base material to an IC chip, it is possible to exchange data with high sensitivity and to easily realize a large data communication distance. Can be.

[0004]

According to the prior art, when an IC chip is mounted on a card base, the antenna coil is mounted on the IC chip by, for example, wire bonding.
Since it was necessary to connect to a predetermined terminal of the chip, there was a problem that the manufacturing efficiency was low and it was not easy to improve the yield. This is because the antenna coil needs to be connected to the IC chip on the back side of the IC module on which the IC chip is mounted, that is, on the card substrate side.

Accordingly, an object of the present invention is to provide an IC capable of improving the manufacturing efficiency and easily improving the yield by forming an antenna pattern on an insulating substrate on which an IC chip is mounted in view of the problems of the prior art. An object of the present invention is to provide an IC module for a card and an IC card using the same.

[0006]

According to a first aspect of the present invention, there is provided an insulating substrate, an antenna pattern formed on a back surface of the insulating substrate, and a mounting structure on the back surface of the insulating substrate. The main point is that the antenna pattern is connected to the corresponding terminal of the IC chip.

[0007] A capacitor for resonance can be connected to the antenna pattern.

A contact pattern connected to a corresponding terminal of the IC chip may be formed on the front side of the insulating substrate, and an intermittent linear pattern electromagnetically coupled to the antenna pattern is formed around the contact pattern. May be formed.

A second aspect of the present invention comprises a card base, an IC module according to the first aspect mounted on the card base, and a booster coil embedded in the card base. The gist of the invention is to make electromagnetic coupling.

[0010] The booster coil may be embedded in the card base material via an auxiliary base material.
The end of winding may be aligned in parallel to form a aligned portion.

Further, the booster coil can avoid the embossed area on the card base material and can electromagnetically couple to the antenna pattern while avoiding the magnetic stripe on the card base material.

[0012]

According to the first aspect of the present invention, the antenna pattern is electromagnetically coupled to the booster coil on the card base by mounting the IC module on the card base to form a non-contact type IC card. A predetermined high-sensitivity data transfer can be realized, and the booster coil at this time does not need to be electrically connected to the IC chip at all. Note that the insulating substrate is preferably a thin flexible film-shaped printed circuit board so as to be embedded in the card base material.

The antenna pattern can realize both higher sensitivity and sharper selection characteristics by connecting a resonance capacitor to resonate at the operating frequency.

If a contact pattern is formed on the front side of the insulating substrate, not only a non-contact type but also a contact type operation mode can be realized. However, the insulating substrate at this time is a double-sided substrate having plated through holes, and IC
The module is to be mounted on the card base with the contact pattern on the front side exposed. In addition, as the IC chip, an IC card chip commonly used for a contact type and a non-contact type is used.

The intermittent linear pattern provided around the contact pattern physically protects the contact pattern and electromagnetically couples with the antenna pattern, so that the Q of the antenna pattern can be electrically improved.

According to the structure of the second aspect, the booster coil embedded in the card base material is electromagnetically coupled to the antenna pattern on the IC module, thereby greatly improving the sensitivity of the antenna pattern. The booster coil is formed in a large two-dimensional coil shape using substantially the entire area of the card base material, and is formed so as to orbit around the IC module. Further, the IC module having the contact pattern exposes the contact pattern and is mounted on the card base material.

By embedding the booster coil in the card base material via the auxiliary base material, the shape of the booster coil can be easily maintained correctly. The auxiliary substrate is preferably an arbitrary sheet material such as paper or a plastic film, and preferably has good affinity with the card substrate. In addition, the booster coil may mechanically hold the wire on the auxiliary base material, or may use the auxiliary base material as a film-shaped printed board and form a printed wiring.

If the start and end of the winding of the booster coil are aligned in parallel to form the aligned portion, a resonance capacitor can be formed using the aligned portion. The capacity of the formed capacitor can be adjusted by adjusting the effective length of the aligned portion.

By avoiding the embossed area on the card base material, the booster coil may be inadvertently broken by embossing such as a card number, an expiration date, and the name of the card holder applied to the card base material. Absent. Also,
By avoiding the magnetic stripe of the booster coil, there is no possibility that the magnetic stripe weakens the electromagnetic coupling with the antenna pattern.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

[0021] The IC card has an IC
The module 10 is mounted, and the booster coil 20 is embedded (FIGS. 1 and 2). However, the booster coil 20
Are embedded in the card base 1 via the auxiliary base 2.

The IC module 10 has an IC chip 12 mounted on the back surface of an insulating substrate 11. Note that the IC chip 12 is protected by a sealing material 12a.

The insulating substrate 11 is a flexible printed circuit board with plated through holes,
A contact pattern CP conforming to the 816 standard is formed on the front side (FIG. 3). Further, an intermittent linear pattern LP is formed around the contact pattern CP. Each terminal C1, C2 ... of the contact pattern CP
The signal type of C8 is as shown in FIG. The IC module 10 is mounted on the card substrate 1 with the contact pattern CP on the front side of the insulating substrate 11 exposed (FIG. 2).

An antenna pattern AP is formed on the back side of the insulating substrate 11 (FIG. 5), and is electrically connected to the terminals C1, C2... C8 on the front side via plated through holes, and via wire bonding or flip chips. A terminal pattern connected to the corresponding terminals C1, C2,... C8 of the IC chip 12 is formed. The outer end of the two-dimensional coil-shaped antenna pattern AP is connected to the terminal A1 of the IC chip 12 via a jumper pattern JP on the front side having plated through holes at both ends, and the inner end is connected to the terminal of the IC chip 12. Connected to A2. A resonance capacitor Ca and an adjustment capacitor Cb are connected in parallel to the antenna pattern AP. However, the adjustment capacitor Cb may be provided as needed.
This may be omitted. The sealing material 12a is made of an IC
In addition to the chip 12, the terminals C1 of the contact pattern CP,
C2... C8 are provided so as to cover the capacitors Ca and Cb.

FIG. 6 shows an equivalent electric circuit of the IC module 10.
Shown in That is, the linear pattern LP on the front surface side of the insulating substrate 11 has capacitors Cc, Cc... Formed at the intermittent portions thereof and is electromagnetically coupled to the antenna pattern AP on the rear surface side. Resonant and adjusting capacitors Ca and Cb are connected in parallel to the antenna pattern AP, and both ends of the antenna pattern AP are connected to antenna terminals A1 and A2 of the IC chip 12. The terminals C1, C2,..., C8 of the contact pattern CP correspond to the corresponding contact terminals C1, C2,.
Connected to 8. The IC chip 12 is a chip for an IC card that is commonly used for a contact type and a non-contact type, and includes a series of circuit elements including a microcomputer, a ROM, and a RAM.

The booster coil 20 is formed in a two-dimensional coil shape via, for example, a small-diameter formal insulated wire.
It is held on the auxiliary substrate 2 (FIGS. 1 and 2). In addition,
The auxiliary substrate 2 may be formed in the same shape and the same size as the card substrate 1 irrespective of FIGS.

The coil portion 21 of the booster coil 20 is
Almost the entire area of the card substrate 1 is used, and the IC module 1
0 and surrounds the IC module 10. The booster coil 20 bends a part of the coil portion 21 toward the IC module 10 so as to avoid the magnetic stripe 1 a attached to the back surface side of the card base material 1.
The antenna pattern AP on the C module 10 is tightly electromagnetically coupled. Further, the booster coil 20
Is formed by dividing a part of the coil portion 21 and avoiding the embossed regions 1b and 1b on the card base material 1.

The booster coil 20 forms the aligned portion 22 by winding and winding the coil portion 21 in parallel and meandering. Alignment part 22
Forms a resonance capacitor, and resonates with the coil portion 21 at the operating frequency. In addition, the alignment part 22 is
It is possible to adjust the effective length by cutting one or both of the winding start and end which form it, and adjust the capacitance of the capacitor to be formed (dotted line in FIG. 1).

In such an IC card, the large-area booster coil 20 resonates at the operating frequency, and the IC is coupled by electromagnetic coupling.
Since a large voltage is induced in the antenna pattern AP of the module 10, a large data communication distance can be easily realized in a contactless operation mode. In addition,
At this time, the antenna pattern AP also resonates at the operating frequency via the resonance capacitor Ca, and the booster coil 2
0 indicates that the antenna pattern AP and the IC chip 12
There is no need to connect electrically. The IC card can also realize a contact-type operation mode by using the contact pattern CP of the IC module 10 exposed on the surface.

In the above description, the booster coil 20
May be omitted from the auxiliary base material 2 on which is mounted. At this time, the booster coil 20 is embedded in the card base material 1 while maintaining its shape. Also, the booster coil 20
Alternatively, the auxiliary substrate 2 may be formed as a printed wiring board in the form of a film and printed wiring.

The IC module 10 can realize only the non-contact type operation mode by deleting all the contact patterns CP on the front side. At this time, the IC module 1
0 can be entirely embedded in the card base material 1;
As the IC chip 12, an IC card chip dedicated to a non-contact type is used.

[0032]

As described above, according to the first aspect of the present invention, an antenna pattern is formed on the back surface of an insulating substrate and an IC chip is mounted thereon, so that the whole is mounted on a card base material. When an IC card is formed, the antenna pattern can be electromagnetically coupled to a large-area booster coil on the IC card side to achieve high-sensitivity data transfer and a large data communication distance.
Since there is no need to connect to a C module or an IC chip, there is an excellent effect that the manufacturing efficiency can be increased and the yield can be easily improved.

According to the second invention, the same effect can be realized by mounting the IC module according to the first invention on a card base material.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of the overall configuration.

FIG. 2 is an enlarged sectional view of a main part of FIG. 1;

FIG. 3 is an enlarged view of the front side of the IC module.

FIG. 4 Signal correspondence table of contact patterns

FIG. 5 is an enlarged view of the back side of the IC module.

FIG. 6 is an equivalent electric circuit diagram of the IC module.

[Explanation of symbols]

 AP: Antenna pattern CP: Contact pattern LP: Linear pattern Ca: Capacitor C1, C2: C8: Terminal 1: Card base 1a: Magnetic stripe 1b: Embossed area 2: Auxiliary base 10: IC module 11: Insulating substrate 12 ... IC chip 20 ... Booster coil 21 ... Coil part 22 ... Aligned part

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01Q 7/00 G06K 19/00 H 23/00 K (71) Applicant 595119486 FEC Ishikawa 1414 Uchigi-Higashi, Kanazawa-shi, Japan (72) Inventor Shiro Shigimura 1414 Higashi-Uchigi-cho, Kanazawa-shi, Ishikawa F-Terminal Co., Ltd. BA05 BB09 BC00 CA01 CA23 5J021 AA01 AB04 CA06 JA08 5J046 AA09 AA19 AB11 PA07 PA09 5J047 AA09 AA19 AB11 FC03 FC05 FC06

Claims (9)

[Claims] 1. An insulating substrate, comprising: an antenna pattern formed on the back side of the insulating substrate; and an IC chip mounted on the back side of the insulating substrate, wherein the antenna pattern corresponds to the IC chip. An IC module for an IC card, which is connected to a terminal. 2. The method according to claim 1, wherein a capacitor for resonance is connected to the antenna pattern.
IC module for C card. 3. The IC module for an IC card according to claim 1, wherein a contact pattern connected to a corresponding terminal of the IC chip is formed on a front side of the insulating substrate. 4. The IC module for an IC card according to claim 3, wherein an intermittent linear pattern electromagnetically coupled with the antenna pattern is formed around the contact pattern. 5. A booster comprising: a card base; an IC module according to claim 1 mounted on the card base; and a booster coil embedded in the card base. An IC card, wherein the coil is electromagnetically coupled to the antenna pattern. 6. The card according to claim 5, wherein the booster coil is embedded in the card base via an auxiliary base.
The described IC card. 7. The IC card according to claim 5, wherein the booster coil forms a aligned portion by aligning the beginning and end of winding of the coil portion in parallel. 8. The IC card according to claim 5, wherein the booster coil avoids an embossed area on the card base. 9. The antenna according to claim 5, wherein the booster coil is electromagnetically coupled to the antenna pattern while avoiding a magnetic stripe on the card base.
The IC card according to any one of the above.