JP2002150245A - Ic module for ic card and ic card using the same - Google Patents

Ic module for ic card and ic card using the same

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Publication number
JP2002150245A
JP2002150245A JP2000320102A JP2000320102A JP2002150245A JP 2002150245 A JP2002150245 A JP 2002150245A JP 2000320102 A JP2000320102 A JP 2000320102A JP 2000320102 A JP2000320102 A JP 2000320102A JP 2002150245 A JP2002150245 A JP 2002150245A
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Japan
Prior art keywords
ic
card
substrate
antenna pattern
coil
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2000320102A
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Japanese (ja)
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JP4615695B2 (en
Inventor
Shiro Sugimura
詩朗 杉村
Original Assignee
Dasung Hightech:Kk
Fec:Kk
Samsung Sds Co Ltd
三星エスディーエス株式会社
株式会社 多成ハイテク
株式会社エフ・イー・シー
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Application filed by Dasung Hightech:Kk, Fec:Kk, Samsung Sds Co Ltd, 三星エスディーエス株式会社, 株式会社 多成ハイテク, 株式会社エフ・イー・シー filed Critical Dasung Hightech:Kk
Priority to JP2000320102A priority Critical patent/JP4615695B2/en
Publication of JP2002150245A publication Critical patent/JP2002150245A/en
Application granted granted Critical
Publication of JP4615695B2 publication Critical patent/JP4615695B2/en
Application status is Expired - Fee Related legal-status Critical
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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details

Abstract

PROBLEM TO BE SOLVED: To improve the manufacturing efficiency of an IC card and improve the yield.
SOLUTION: This IC module 10 with an antenna pattern AP is installed in a card substrate 1 and a booster coil 20 is buried therein. The booster coil 20 is electromagnetically coupled to the antenna pattern AP to materialize a large data transmission distance while it is unnecessarily electrically connected to the IC chip in the IC module 10.
COPYRIGHT: (C)2002,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】この発明は、製造効率を高め、歩留りを向上させることができるICカード用のI TECHNICAL FIELD The present invention increases the production efficiency, I for IC card which can improve the yield
Cモジュールと、それを使用するICカードに関する。 And C module, relates to an IC card to use it.

【0002】 [0002]

【従来の技術】カード基材にアンテナコイルを埋設する無接触形のICカードが開発されている。 BACKGROUND ART Contactless type IC card to embed the antenna coil to the card substrate has been developed.

【0003】このものは、カード基材のほぼ全面積を利用する大形のアンテナコイルをICチップに接続することにより、高感度のデータ授受を可能とし、大きなデータ通信距離を容易に実現することができる。 [0003] This material may be by connecting the large antenna coil utilizing almost the entire area of ​​the card substrate to the IC chip, and enables the exchange of data sensitive, easily realize a large data communication distance can.

【0004】 [0004]

【発明が解決しようとする課題】かかる従来技術によるときは、アンテナコイルは、カード基材にICチップを装着する際に、たとえばワイヤボンディングによりIC When according to the invention will to challenge to be solved] Such prior art antenna coil, when mounting the IC chip on the card substrate, for example IC by wire bonding
チップの所定の端子に接続する必要があったから、製造効率が低く、歩留りを向上させることが容易でないという問題があった。 Because it is necessary to connect to a predetermined terminal of the chip, low production efficiency, there is a problem that it is not easy to increase the yield. アンテナコイルは、ICチップを搭載するICモジュールの裏面側、すなわちカード基材側においてICチップに接続する必要があるから、接続箇所が外部になく、接続条件の最適設定が難しいからである。 Antenna coil, the back surface side of the IC module for mounting the IC chip, i.e. it is necessary to connect to the IC chip in the card substrate side and it is connected portion is not in the external, the optimum setting is difficult connection conditions.

【0005】そこで、この発明の目的は、かかる従来技術の問題に鑑み、ICチップを搭載する絶縁基板にアンテナパターンを形成することによって、製造効率を高め、歩留りを容易に向上させることができるICカード用のICモジュールと、それを使用するICカードを提供することにある。 [0005] Therefore, IC object of the present invention, the conventional view of the art problems, by forming the antenna pattern on the insulating substrate for mounting an IC chip, which increases the manufacturing efficiency can be easily improved yield an IC module for the card, is to provide an IC card that uses it.

【0006】 [0006]

【課題を解決するための手段】かかる目的を達成するためのこの出願に係る第1発明の構成は、絶縁基板と、絶縁基板の裏面側に形成するアンテナパターンと、絶縁基板の裏面側に搭載するICチップとを備えてなり、アンテナパターンは、ICチップの対応する端子に接続することをその要旨とする。 The configuration of the first invention according to this application to achieve SUMMARY OF THE INVENTION The above object includes an insulating substrate, an antenna pattern formed on the rear surface side of the insulating substrate, mounted on the rear surface side of the insulating substrate It becomes and an IC chip, the antenna pattern, as its gist to be connected to the corresponding terminals of the IC chip.

【0007】なお、アンテナパターンには、共振用のコンデンサを接続することができる。 [0007] Note that the antenna pattern, can be connected to a capacitor for resonance.

【0008】また、絶縁基板の表面側には、ICチップの対応する端子に接続するコンタクトパターンを形成してもよく、コンタクトパターンの周囲には、アンテナパターンと電磁結合する断続的な線状パターンを形成してもよい。 Further, on the surface side of the insulating substrate may be formed a contact pattern connected to the corresponding terminals of the IC chip, around the contact pattern, intermittent linear pattern electromagnetically coupled to the antenna pattern it may be formed.

【0009】第2発明の構成は、カード基材と、カード基材に装着する第1発明に係るICモジュールと、カード基材に埋設するブースタコイルとを備えてなり、ブースタコイルは、アンテナパターンに電磁結合させることをその要旨とする。 [0009] configuration of the second invention comprises comprises a card substrate, and an IC module according to the first aspect of the present invention to be mounted on the card substrate, and a booster coil embedded in the card substrate, the booster coil antenna pattern that is electromagnetically coupled to the gist thereof.

【0010】なお、ブースタコイルは、補助基材を介してカード基材に埋設してもよく、コイル部分の巻始め、 [0010] Incidentally, the booster coil through an auxiliary substrate may be embedded in the card substrate, winding start of the coil portion,
巻終りを平行に引き揃えて引揃え部分を形成してもよい。 The winding end may be formed 引揃 handle portion parallel to pull aligned.

【0011】また、ブースタコイルは、カード基材上のエンボス領域を避けることができ、カード基材上の磁気ストライプを避けてアンテナパターンに電磁結合させることができる。 Further, the booster coil can avoid embossed area on the card substrate can be electromagnetically coupled to the antenna pattern to avoid the magnetic stripe on the card substrate.

【0012】 [0012]

【作用】かかる第1発明の構成によるときは、アンテナパターンは、ICモジュールをカード基材に装着して無接触形のICカードを形成することにより、カード基材側のブースタコイルと電磁結合させて所定の高感度のデータ授受を実現することができ、このときのブースタコイルは、ICチップに対して電気的に何ら接続することを要しない。 [Action] When due to configuration of the first invention, the antenna pattern, by forming the IC card of non-contact type by mounting an IC module on the card substrate, is electromagnetically coupled to the booster coil of the card substrate side Te can achieve data transfer of a predetermined high sensitivity, booster coil in this case is not required to electrically any connection to the IC chip. なお、絶縁基板は、カード基材に埋設するために、薄い可撓性のフィルム状のプリント基板とすることが好ましい。 The insulating substrate, in order to bury the card substrate, it is preferable that the thin flexible film-like printed circuit board.

【0013】アンテナパターンは、共振用のコンデンサを接続して使用周波数に共振させることにより、一層の高感度と、鋭い選択特性とを併せて実現することができる。 [0013] antenna pattern, by resonance with the frequency used by connecting a capacitor for resonance can be realized in conjunction with further high sensitivity, a sharp selection properties.

【0014】絶縁基板の表面側にコンタクトパターンを形成すれば、無接触形に加えて、接触形の動作形態を併せて実現することができる。 [0014] By forming the contact pattern on the surface side of the insulating substrate, in addition to the non-contact type, it can be implemented together operation form of the contact type. ただし、このときの絶縁基板は、めっきスルーホールを有する両面基板とし、IC However, an insulating substrate in this case is a double-sided board having plated through holes, IC
モジュールは、表面側のコンタクトパターンを露出させてカード基材に装着するものとする。 Module, to expose the contact pattern on the surface side shall be attached to the card base material. また、ICチップは、接触形、無接触形に共用のICカード用チップを使用するものとする。 Moreover, IC chip, contact type, and shall use the chip shared IC card in a contactless form.

【0015】コンタクトパターンの周囲に設ける断続的な線状パターンは、コンタクトパターンを物理的に保護するとともに、アンテナパターンと電磁結合し、アンテナパターンのQを電気的に向上させることができる。 [0015] intermittent linear pattern provided around the contact pattern is configured to physically protect the contact pattern, the antenna pattern and electromagnetically coupled, it is possible to electrically enhance the Q of the antenna pattern.

【0016】第2発明の構成によるときは、カード基材に埋設するブースタコイルは、ICモジュール上のアンテナパターンと電磁結合し、アンテナパターンの感度を大幅に向上させる。 [0016] When by the configuration of the second invention, the booster coil embedded in the card substrate, the antenna pattern and the electromagnetic coupling of the IC module, greatly improve the sensitivity of the antenna pattern. なお、ブースタコイルは、カード基材のほぼ全面積を使用して大形の二次元コイル状に形成し、ICモジュールのまわりを周回するように形成する。 Incidentally, the booster coil is formed in a large two-dimensional coiled using almost the entire area of ​​the card substrate is formed so as to surround around the IC module. また、コンタクトパターンを有するICモジュールは、コンタクトパターンを露出させてカード基材に装着する。 Furthermore, IC modules having a contact pattern is mounted on the card substrate to expose the contact pattern.

【0017】ブースタコイルは、補助基材を介してカード基材に埋設することにより、その形状を容易に正しく保持することができる。 The booster coil, by embedding the card substrate through an auxiliary substrate can be held easily correct its shape. なお、補助基材は、紙、プラスチックフィルム等の任意のシート材であって、カード基材との親和性が良好なものが好ましい。 The auxiliary substrate may be paper, be any sheet material such as a plastic film, preferably has good affinity with the card substrate. また、ブースタコイルは、補助基材上に線材を機械的に保持させてもよく、補助基材をフィルム状のプリント基板とし、プリント配線として形成してもよい。 Moreover, the booster coil may be mechanically retain the wire on the auxiliary substrate, the auxiliary substrate is a film-like printed board may be formed as a printed circuit.

【0018】ブースタコイルの巻始め、巻終りを平行に引き揃えて引揃え部分を形成すれば、引揃え部分を利用して共振用のコンデンサを形成することができる。 The winding of the booster coil beginning, by forming the 引揃 handle portion parallel to pull aligned winding end, it is possible to form the capacitor for resonance by using 引揃 handle portion. なお、引揃え部分は、その有効長さを調整することにより、形成されるコンデンサの容量を調節することができる。 Incidentally, 引揃 example portion by adjusting the effective length, it is possible to adjust the capacitance of the capacitor formed.

【0019】ブースタコイルは、カード基材上のエンボス領域を避けることにより、カード基材に施されるカード番号や、有効期限、カード保持者の氏名などのエンボス加工によって不用意に破断するおそれがない。 The booster coil, by avoiding the embossed area on the card substrate, and the card number to be applied to the card substrate, the expiration date, the risk of inadvertently broken by embossing, such as name of cardholder Absent. また、 Also,
ブースタコイルは、磁気ストライプを避けることにより、磁気ストライプによってアンテナパターンとの電磁結合が弱められるおそれがない。 Booster coil, by avoiding a magnetic stripe, the electromagnetic coupling there is no risk of weakened the antenna pattern by a magnetic stripe.

【0020】 [0020]

【発明の実施の形態】以下、図面を以って発明の実施の形態を説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of the invention drives out drawings.

【0021】ICカードは、カード基材1に対し、IC [0021] The IC card, to the card substrate 1, IC
モジュール10を装着し、ブースタコイル20を埋設してなる(図1、図2)。 The module 10 is attached, formed by burying a booster coil 20 (FIG. 1, FIG. 2). ただし、ブースタコイル20 However, the booster coil 20
は、補助基材2を介してカード基材1に埋設されている。 It is embedded in the card base member 1 through the auxiliary substrate 2.

【0022】ICモジュール10は、絶縁基板11の裏面側にICチップ12を搭載して構成されている。 The IC module 10 is constructed by mounting the IC chip 12 on the back side of the insulating substrate 11. なお、ICチップ12は、シール材12aによって保護されている。 Incidentally, IC chip 12 is protected by the sealing member 12a.

【0023】絶縁基板11は、可撓性のフィルム状のめっきスルーホール付きのプリント基板であり、ISO7 The insulating substrate 11 is a printed circuit board with a flexible film-like plated through hole, ISO 7
816規格に準拠するコンタクトパターンCPが表面側に形成されている(図3)。 Contact pattern CP that conforms to 816 standard is formed on the surface side (FIG. 3). また、コンタクトパターンCPの周囲には、断続的な線状パターンLPが形成されている。 Around the contact pattern CP, intermittent line pattern LP are formed. コンタクトパターンCPの各端子C1 、C2… Each of the terminals of the contact pattern CP C1, C2 ...
C8 の信号種別は、図4のとおりである。 C8 signal type of is shown in Figure 4. なお、ICモジュール10は、絶縁基板11の表面側のコンタクトパターンCPを露出させてカード基材1に装着されている(図2)。 Incidentally, IC module 10 to expose the contact pattern CP of the surface side of the insulating substrate 11 is mounted in the card base member 1 (Figure 2).

【0024】絶縁基板11の裏面側には、アンテナパターンAPが形成され(図5)、めっきスルーホールを介して表面側の端子C1 、C2 …C8 に導通するとともに、ワイヤボンディングまたはフリップチップを介してICチップ12の対応する端子C1 、C2 …C8 に接続する端子パターンが形成されている。 [0024] on the rear surface side of the insulating substrate 11, the antenna pattern AP is formed (FIG. 5), as well as conducting the terminals C1, C2 ... C8 surface side through the plated through hole, through wire bonding or flip-chip terminal pattern to be connected to corresponding terminals C1, C2 ... C8 of the IC chip 12 Te is formed. なお、二次元コイル状のアンテナパターンAPの外側端は、両端にめっきスルーホールを有する表面側のジャンパパターンJPを介してICチップ12の端子A1 に接続され、内側端は、ICチップ12の端子A2 に接続されている。 Incidentally, the outer end of the two-dimensional coiled antenna pattern AP is connected to a terminal A1 of the IC chip 12 via the jumper pattern JP surface side having a plated through hole in both ends, the inner end, the IC chip 12 pin It is connected to the A2. アンテナパターンAPには、共振用のコンデンサCa 、調整用のコンデンサCb が並列接続されている。 The antenna pattern AP, a capacitor Ca for resonance capacitor Cb for adjustment is connected in parallel. ただし、調整用のコンデンサCb は、必要に応じて設ければよく、 However, the capacitor Cb for adjustment may be provided as necessary,
これを省略してもよい。 This may be omitted. また、シール材12aは、IC In addition, the sealing material 12a is, IC
チップ12の他、コンタクトパターンCPの端子C1 、 Other chip 12, contact pattern CP of the terminals C1,
C2 …C8 、コンデンサCa 、Cb をカバーするように施されている。 C2 ... C8, are subjected to cover the capacitor Ca, Cb.

【0025】ICモジュール10の等価電気回路を図6 [0025] The equivalent electrical circuit of the IC module 10 6
に示す。 To show. すなわち、絶縁基板11の表面側の線状パターンLPは、その断続部分にコンデンサCc 、Cc …を形成するとともに裏面側のアンテナパターンAPに電磁結合している。 That is, a linear pattern LP surface side of the insulating substrate 11 is electromagnetically coupled to the rear surface side of the antenna pattern AP with forming the capacitor Cc, the Cc ... on the intermittent part. アンテナパターンAPには、共振用、調整用の各コンデンサCa 、Cb が並列接続され、アンテナパターンAPの両端は、ICチップ12のアンテナ用の端子A1 、A2 に接続されている。 The antenna pattern AP, for resonance, the capacitor Ca for adjustment, Cb are connected in parallel, both ends of the antenna pattern AP is connected to the terminals A1, A2 of the antenna of the IC chip 12. また、コンタクトパターンCPの端子C1 、C2 …C8 は、それぞれICチップ12の対応するコンタクト用の端子C1 、C2 …C The terminal C1, C2 ... C8 of the contact pattern CP, the terminal C1 for the corresponding contact of each IC chip 12, C2 ... C
8 に接続されている。 It is connected to the 8. なお、ICチップ12は、接触形、無接触形に共用のICカード用チップであって、マイクロコンピュータ、ROM、RAMを含む一連の回路素子を内蔵するものとする。 Incidentally, IC chip 12, contact type, a chip shared IC card to the non-contact, it is assumed that a built-in set of circuit elements including a microcomputer, ROM, a RAM.

【0026】ブースタコイル20は、たとえば細径のホルマール絶縁線材を介して二次元コイル状に形成され、 The booster coil 20, for example via the small-diameter formal insulated wire formed in a two-dimensional coil,
補助基材2上に保持されている(図1、図2)。 Is held on the auxiliary substrate 2 (FIG. 1, FIG. 2). なお、 It should be noted that,
補助基材2は、図1、図2に拘らず、カード基材1と同形、同大に形成してもよい。 Auxiliary substrate 2, Fig. 1, regardless of the FIG. 2, the card substrate 1 and the same shape, may be formed on the university.

【0027】ブースタコイル20のコイル部分21は、 [0027] The coil portion 21 of the booster coil 20,
カード基材1のほぼ全面積を使用し、ICモジュール1 Using the substantially the entire area of ​​the card substrate 1, IC module 1
0を囲むようにしてICモジュール10のまわりに周回している。 Orbiting around the IC module 10 so as to surround the 0. ブースタコイル20は、カード基材1の裏面側に付設する磁気ストライプ1aを避けるようにコイル部分21の一部をICモジュール10側に屈曲させ、I Booster coil 20, the part of the coil portion 21 is bent IC module 10 side so as to avoid a magnetic stripe 1a that attached to the back side of the card substrate 1, I
Cモジュール10上のアンテナパターンAPに対して密に電磁結合させている。 And intimately bringing electromagnetically coupled to the antenna pattern AP on C module 10. さらに、ブースタコイル20 In addition, the booster coil 20
は、コイル部分21の一部を分割し、カード基材1上のエンボス領域1b、1bを避けて形成されている。 Divides a portion of the coil portion 21 is formed to avoid embossed area 1b on the card substrate 1, a 1b.

【0028】ブースタコイル20は、コイル部分21の巻始め、巻終りを平行に引き揃えて蛇行させることにより、引揃え部分22を形成している。 The booster coil 20, winding start of the coil portion 21, by meandering aligned drawn parallel to winding end, and forms a 引揃 handle portion 22. 引揃え部分22引揃 handle portion 22
は、共振用のコンデンサを形成し、コイル部分21とともに使用周波数に共振する。 Forms a capacitor for resonance, resonating with the frequency used with the coil portion 21. なお、引揃え部分22は、 It should be noted, 引揃 handle portion 22,
それを形成する巻始め、巻終りの一方または双方を切断して有効長さを調節し、形成するコンデンサの容量を調整することができる(図1の点線)。 Winding start to form it, by cutting one or both of the winding end to adjust the effective length, it can be adjusted capacitance of the capacitor formed (dotted line in FIG. 1).

【0029】かかるICカードは、大面積のブースタコイル20が使用周波数に共振し、電磁結合によってIC [0029] Such an IC card is a booster coil 20 having a large area resonates in use frequency, IC by electromagnetic coupling
モジュール10のアンテナパターンAPに大きな電圧を誘起させるので、無接触形の動作形態において、大きなデータ通信距離を容易に実現することができる。 Since induces a large voltage to the antenna pattern AP module 10, the operation mode of the non-contact type, a large data communication distance can be easily realized. なお、 It should be noted that,
このとき、アンテナパターンAPも、共振用のコンデンサCa を介して使用周波数に共振し、ブースタコイル2 At this time, the antenna pattern AP also resonates to the frequency used through the capacitor Ca for resonance, the booster coil 2
0は、アンテナパターンAP、ICチップ12に対し、 0, antenna pattern AP, the IC chip 12,
電気的に接続する必要がない。 There is no need to be electrically connected. また、ICカードは、表面に露出するICモジュール10のコンタクトパターンCPを利用することにより、接触形の動作形態をも併せ実現することができる。 Furthermore, IC cards, by utilizing a contact pattern CP of the IC module 10 exposed on the surface, can be realized also to the mode of operation of the contact type.

【0030】以上の説明において、ブースタコイル20 [0030] In the above description, the booster coil 20
を搭載する補助基材2は、これを省略してもよい。 The auxiliary substrate 2 to be mounted may be omitted. このときのブースタコイル20は、その形状を維持しながらカード基材1に埋設する。 Booster coil 20 at this time is embedded in the card base member 1 while maintaining its shape. また、ブースタコイル20 In addition, the booster coil 20
は、補助基材2をフィルム状のプリント基板とし、プリント配線として形成してもよい。 It is an auxiliary substrate 2 is a film-like printed board may be formed as a printed circuit.

【0031】ICモジュール10は、表面側のコンタクトパターンCPを全部削除し、無接触形の動作形態のみを実現することができる。 The IC module 10 can remove all contact pattern CP of the surface side, to achieve only the operation mode of the non-contact type. このとき、ICモジュール1 In this case, IC module 1
0は、その全体をカード基材1に埋設することができ、 0 can be embedded in their entirety card substrate 1,
ICチップ12は、無接触形専用のICカード用チップを使用する。 IC chip 12 uses the non-contact type chip dedicated IC card.

【0032】 [0032]

【発明の効果】以上説明したように、この出願に係る第1発明によれば、絶縁基板の裏面側にアンテナパターンを形成し、ICチップを搭載することによって、全体をカード基材に装着してICカードを形成すると、アンテナパターンは、ICカード側の大面積のブースタコイルに電磁結合させ、高感度のデータ授受、大きなデータ通信距離を実現することができる上、ブースタコイルをI As described in the foregoing, according to the first invention according to this application, the antenna pattern is formed on the rear surface side of the insulating substrate, by mounting an IC chip was mounted across the card substrate When forming the IC card Te, antenna pattern, is electromagnetically coupled to the booster coil having a large area of ​​the IC card side, the data transfer of the high sensitivity over that can realize a large data communication distance, the booster coil I
CモジュールやICチップに接続する必要が全くないから、製造効率を高め、歩留りを容易に向上させることができるという優れた効果がある。 Since there is no need to connect to the C modules and IC chip, increase production efficiency, there is excellent effect that the yield can be improved easily.

【0033】第2発明によれば、第1発明に係るICモジュールをカード基材に装着することによって、同様の効果を実現することができる。 According to the second invention, by mounting an IC module according to the first aspect of the present invention to a card substrate, it is possible to achieve the same effect.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】 全体構成説明図 FIG. 1 is an overall configuration diagram

【図2】 図1の要部拡大断面図 [Figure 2] enlarged sectional view of FIG. 1

【図3】 ICモジュールの表面側拡大図 [Figure 3] surface side enlarged view of the IC module

【図4】 コンタクトパターンの信号対応表 Signal correspondence table of FIG. 4 contact pattern

【図5】 ICモジュールの裏面側拡大図 [5] the back side enlarged view of the IC module

【図6】 ICモジュールの等価電気回路図 FIG. 6 is an equivalent electrical circuit diagram of an IC module

【符号の説明】 DESCRIPTION OF SYMBOLS

AP…アンテナパターン CP…コンタクトパターン LP…線状パターン Ca …コンデンサ C1 、C2 …C8 …端子 1…カード基材 1a…磁気ストライプ 1b…エンボス領域 2…補助基材 10…ICモジュール 11…絶縁基板 12…ICチップ 20…ブースタコイル 21…コイル部分 22…引揃え部分 AP ... antenna pattern CP ... contact pattern LP ... linear pattern Ca ... capacitors C1, C2 ... C8 ... terminal 1 ... card substrate 1a ... magnetic stripe 1b ... embossed area 2 ... auxiliary substrate 10 ... IC module 11 ... insulating substrate 12 ... IC chip 20 ... booster coil 21 ... coil portion 22 ... 引揃 handle portion

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl. 7識別記号 FI テーマコート゛(参考) H01Q 7/00 G06K 19/00 H 23/00 K (71)出願人 595119486 株式会社エフ・イー・シー 石川県金沢市打木町東1414番地 (72)発明者 杉村 詩朗 石川県金沢市打木町東1414番地 株式会社 エフ・イー・シー内 Fターム(参考) 2C005 MA18 MA19 MA20 NA08 NA09 NA36 NB03 PA03 PA27 QC12 5B035 AA04 BA05 BB09 BC00 CA01 CA23 5J021 AA01 AB04 CA06 JA08 5J046 AA09 AA19 AB11 PA07 PA09 5J047 AA09 AA19 AB11 FC03 FC05 FC06 ────────────────────────────────────────────────── ─── of the front page continued (51) Int.Cl. 7 identification mark FI theme Court Bu (reference) H01Q 7/00 G06K 19/00 H 23/00 K (71) applicant 595,119,486 TRACEPRO E. Sea Ishikawa prefecture Kanazawa Uchiki Machihigashi address 1414 (72) inventor Sugimura Shiro Kanazawa, Ishikawa Prefecture Uchiki Machihigashi 1414 address TRACEPRO E. Sea in the F-term (reference) 2C005 MA18 MA19 MA20 NA08 NA09 NA36 NB03 PA03 PA27 QC12 5B035 AA04 BA05 BB09 BC00 CA01 CA23 5J021 AA01 AB04 CA06 JA08 5J046 AA09 AA19 AB11 PA07 PA09 5J047 AA09 AA19 AB11 FC03 FC05 FC06

Claims (9)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 絶縁基板と、該絶縁基板の裏面側に形成するアンテナパターンと、前記絶縁基板の裏面側に搭載するICチップとを備えてなり、前記アンテナパターンは、前記ICチップの対応する端子に接続することを特徴とするICカード用のICモジュール。 And 1. A insulating substrate, it includes an antenna pattern formed on the back surface side of the insulating substrate, and an IC chip to be mounted on the back side of the insulating substrate, wherein the antenna pattern, the corresponding of said IC chip IC module for the IC card, characterized in that connected to the terminal.
  2. 【請求項2】 前記アンテナパターンには、共振用のコンデンサを接続することを特徴とする請求項1記載のI The method according to claim 2, wherein the antenna pattern, I of claim 1, wherein the connecting a capacitor for resonance
    Cカード用のICモジュール。 IC module for the C card.
  3. 【請求項3】 前記絶縁基板の表面側には、前記ICチップの対応する端子に接続するコンタクトパターンを形成することを特徴とする請求項1または請求項2記載のICカード用のICモジュール。 Wherein the front surface side of the insulating substrate, IC module for claim 1 or claim 2, wherein IC cards and forming a contact pattern connected to the corresponding terminals of the IC chip.
  4. 【請求項4】 前記コンタクトパターンの周囲には、前記アンテナパターンと電磁結合する断続的な線状パターンを形成することを特徴とする請求項3記載のICカード用のICモジュール。 4. around the contact pattern, IC module for claim 3, wherein IC cards, which comprises forming an intermittent linear pattern that the antenna pattern and the electromagnetic coupling.
  5. 【請求項5】 カード基材と、該カード基材に装着する請求項1ないし請求項4のいずれか記載のICモジュールと、前記カード基材に埋設するブースタコイルとを備えてなり、該ブースタコイルは、前記アンテナパターンに電磁結合させることを特徴とするICカード。 5. A card substrate, it includes an IC module according to any one of claims 1 to 4 mounted on the card substrate, and a booster coil embedded in the card substrate, said booster IC card coil for causing electromagnetically coupled to the antenna pattern.
  6. 【請求項6】 前記ブースタコイルは、補助基材を介して前記カード基材に埋設することを特徴とする請求項5 Wherein said booster coil has claim via the auxiliary substrate, characterized in that embedded in the card substrate 5
    記載のICカード。 IC card described.
  7. 【請求項7】 前記ブースタコイルは、コイル部分の巻始め、巻終りを平行に引き揃えて引揃え部分を形成することを特徴とする請求項5または請求項6記載のICカード。 Wherein said booster coil is winding start of the coil portion, claim 5 or claim 6 IC card according to winding end parallel to pull aligned and forming a 引揃 handle portion.
  8. 【請求項8】 前記ブースタコイルは、前記カード基材上のエンボス領域を避けることを特徴とする請求項5ないし請求項7のいずれか記載のICカード。 Wherein said booster coil, IC card according to any one of claims 5 to 7, characterized in that to avoid the embossed area on the card substrate.
  9. 【請求項9】 前記ブースタコイルは、前記カード基材上の磁気ストライプを避けて前記アンテナパターンに電磁結合させることを特徴とする請求項5ないし請求項8 Wherein said booster coil has claims 5 to 8, characterized in that electromagnetically coupled to the antenna pattern to avoid the magnetic stripe on the card substrate
    のいずれか記載のICカード。 IC card according to any one of.
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