TWI402709B - 動態陣列結構內之元件相位調整與配置方法及其實施 - Google Patents
動態陣列結構內之元件相位調整與配置方法及其實施 Download PDFInfo
- Publication number
- TWI402709B TWI402709B TW098124107A TW98124107A TWI402709B TW I402709 B TWI402709 B TW I402709B TW 098124107 A TW098124107 A TW 098124107A TW 98124107 A TW98124107 A TW 98124107A TW I402709 B TWI402709 B TW I402709B
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- virtual
- phase
- semiconductor wafer
- wafer
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 69
- 239000004065 semiconductor Substances 0.000 claims abstract description 98
- 239000011295 pitch Substances 0.000 claims description 68
- 235000012431 wafers Nutrition 0.000 claims 83
- 238000010586 diagram Methods 0.000 description 12
- 238000009792 diffusion process Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- 238000013461 design Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000007717 exclusion Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000005352 clarification Methods 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H01L27/0207—
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/34—Circuit design for reconfigurable circuits, e.g. field programmable gate arrays [FPGA] or programmable logic devices [PLD]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H01L27/11803—
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Architecture (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Description
本發明係關於動態陣列結構內之元件相位調整方法與配置方法及其實施。
在近代的半導體晶片(chip)設計中,於晶片上配置標準元件以定義特定邏輯功能。為了確保當各標準元件任意地配置於晶片上時,各標準元件將為可製造,故定義各標準元件具有邊緣排除區,邊緣排除區之大小等於鄰接導電特徵部之間的設計法則(DR)間隔要求的一半。依此方式,當任何兩標準元件彼此緊鄰配置時,在它們的界面邊界上,它們的合併排除區尺寸將至少等於鄰接導電特徵部之間的DR間隔要求。因此,排除區使特徵部能被任意配置於標準元件內,而不需考量元件對元件之界面問題。然而,當許多標準元件一起配置於晶片上時,與標準元件相關之邊緣排除區能聯合佔據大量晶片區域。
概觀前述,考量到將元件佈局及配置最佳化以使晶片區域及佈線資源能最有效率地被使用,尤其是當元件係依據受限的佈局結構而定義時。
在一實施例中,揭露一半導體晶片。半導體晶片包含一邏輯區塊區域。邏輯區塊區域包含第一晶片階層,佈局特徵部係依據第一虛擬格柵而配置於其中。邏輯區塊區域亦包含第二晶片階層,佈局特徵部係依據第二虛擬格柵而配置於其中。有理空間關係存在於第一及第二虛擬格柵之間。數個元件係置於邏輯區塊區域內。數個元件之每一者係依據數個元件相位中之合適者而定義。當佈局特徵部被安置於既定之配置元件內時,合適的元件相位使既定之配置元件之第一及第二晶片階層中的佈局特徵部對準第一及第二虛擬格柵。
在另一實施例中,揭露用以定義不同元件相位之元件版本以使元件能在半導體晶片之指定區域內配置之方法。此方法包含針對半導體晶片之指定區域識別相位空間之作業。相位空間係定義為:在半導體晶片之指定區域內具有有理空間關係之兩虛擬格柵之間的相同關係連續出現之間的垂直延伸距離。此方法亦包含將主要元件之左邊界對準相位空間之左邊緣之作業。在主要元件之左邊界對準相位空間之左邊緣的情況下,執行一作業:基於相對於主要元件之左邊界的兩虛擬格柵之位置來定義主要元件之第一相位。將主要元件之第一相位儲存於元件庫中。此方法更包含將主要元件之左邊界從其目前位置橫越相位空間移動至相位空間內主要元件之左邊界之下一個可能位置。在主要元件之左邊界對準下一個可能位置的情況下,執行一作業:基於相對於主要元件之左邊界的兩虛擬格柵之位置來定義主要元件之下一個相位。將主要元件之下一個相位儲存於元件庫中。此方法繼續將主要元件之左邊界移動至相位空間內其可能位置之每一者,且於相位空間內主要元件之左邊界之各可能位置上定義及儲存主要元件之不同相位。
在另一實施例中,揭露在半導體晶片之指定區域內配置元件之方法。此方法包含一作業:在半導體晶片之指定區域內分別定義兩相位調整之晶片階層之每一者的虛擬格柵。兩相位調整之晶片階層之虛擬格柵被定義為具有有理空間關係。此方法亦包含配置元件於半導體晶片之指定區域內之作業。此方法更包含決定半導體晶片之指定區域內的各配置元件所需的元件相位。執行一作業:以具有所需的元件相位之配置元件之版本代替半導體晶片之指定區域內的各配置元件,以使在配置元件之替代版本內在兩相位調整之晶片階層之每一者中的佈局特徵部對準兩相位調整之晶片階層的虛擬格柵。
在一實施例中,揭露一電腦可讀儲存媒體包含以數位格式記錄之半導體晶片佈局。半導體晶片佈局包含一邏輯區塊區域,其包含第一晶片階層,佈局特徵部係依據第一虛擬格柵而配置於其中。半導體晶片佈局亦包含第二晶片階層,佈局特徵部係依據第二虛擬格柵而配置於其中。有理空間關係存在於第一及第二虛擬格柵之間。半導體晶片佈局更包含置於邏輯區塊區域內的數個元件。該數個元件之每一者係依據數個元件相位中之合適者而定義。當佈局特徵部被安置於既定之配置元件內時,該數個元件相位中之合適者使既定之配置元件之第一及第二晶片階層中的佈局特徵部對準第一及第二虛擬格柵。
在一實施例中,揭露一以數位格式儲存於電腦可讀儲存媒體中的元件庫。元件庫包含對應至既定元件之不同相位的複數之元件佈局。既定元件包含至少一晶片階層,佈局特徵部係依據虛擬格柵而配置於此階層中。虛擬格柵係藉由一組平行之相同間隔的虛擬線路(其橫越元件佈局延伸)來定義。既定元件之各不同相位係藉由參考元件邊界與虛擬格柵之最近的虛擬線路之間的不同間隔而定義。
以下將在本發明之詳細說明連同附圖中,對本發明之上述及其他特徵詳加說明。
為了要提供本發明之全面性的了解,許多的具體的細節會在接下來的敘述中提出。然而對熟悉本技藝者,本發明在沒有這些具體細節的情況下仍可實施。在其他情況下,為了避免不必要地混淆本發明,熟知的製程步驟並未詳細地描述。
依據本發明之實施例,圖1A為顯示半導體晶片(chip)101之圖,定義此晶片包含邏輯區塊103。此邏輯區塊103包含積體電路元件,其以多階(multi-level)結構之形式定義於晶片101的矽基板上。在基板階層上形成具有擴散區域之電晶體元件,在隨後之階層上,互連的金屬化線路被加以圖案化且電性連接至電晶體元件,以定義期望的積體電路元件。此外,圖案化的導電層乃透過介電材料而與其他導電層絕緣。在晶片101之各階層內定義擴散區域、電晶體元件、金屬化線路、內連線(interconnect)等等之結構特徵部係依據既定佈局而定義。此外,晶片101之既定階層的整體佈局可被切割成許多小佈局區域,其中各佈局區域與既定的邏輯構成有關。並且,在晶片101之既定垂直欄內,晶片101之多重階層內的佈局區域能合併形成稱為元件(cell)之邏輯單元。
在此提及之元件表示邏輯功能之抽象概念,且涵蓋用以執行邏輯功能之低階積體電路佈局。應了解既定的邏輯功能可藉由多重元件差異來表示,其中元件差異可由特徵部尺寸、效能、及製程補償技術(PCT,process compensation technique)處理來區分。例如,既定的邏輯功能之多重元件差異可由電力消耗、信號時序、電流漏電、晶片面積、光學鄰近校正(OPC,optical proximity correction)、光罩增強技術(RET,reticle enhancement technology)等等來區分。亦應了解各元件描述包含晶片之相關垂直欄內的晶片各階層中的元件佈局,按照要求以執行元件之邏輯功能。具體而言,元件描述包含晶片各階層中(從基板階層向上延伸直到特定的內連線階層)的元件佈局。
在一實施例中,藉由將數個具有各種邏輯功能的元件在邏輯區塊103內設置成列來定義邏輯區塊103。例如,考慮到在邏輯區塊103內數個元件A-Z為可利用,各元件A-Z係用以執行不同的邏輯功能。在此例示性實施例中,可藉由在邏輯區塊103之列1-10內配置元件A-Z來定義邏輯區塊103,如圖1B所示。在此例示性實施例中,從左到右橫越既定之列所量測的元件寬度可因元件而異。然而,在既定之列內垂直量測的元件高度本質上各元件之間都相同,從而容許邏輯區塊103具有被鄰接定義之高度一致的元件列。此外,在某些實施例中,元件高度可因列而異且/或在一列之內變化。
動態陣列結構表示一半導體裝置設計典範,於此典範中佈局特徵部係沿著固定間隔的虛擬格柵(grate)(或固定間隔的虛擬網格(grid))定義於元件之數個階層中,即,半導體晶片(如晶片101)之數個階層中。虛擬格柵係藉由一組相同間隔、平行的虛擬線路(其橫越既定晶片區域中的既定階層)來定義。在虛擬格柵之鄰接虛擬線路之間垂直量測之相同間隔係定義為虛擬格柵節距(pitch)。例如,依據本發明之實施例,圖2A顯示晶片101之邏輯區塊103區域具有兩不同虛擬格柵定義於其上。具體而言,一虛擬格柵係針對晶片101之閘階層(gate-level)而定義於邏輯區塊103上,而另一虛擬格柵係針對晶片101之第二內連線階層(M2階層)而定義於邏輯區塊103之上。
在一實施例中,既定階層之虛擬格柵係定位為本質上與鄰接階層之虛擬格柵垂直。例如,在此實施例中,第一內連線階層(M1階層)(未顯示)之虛擬格柵在與閘階層及M2階層兩者之虛擬格柵垂直的方向上延伸。然而,應察知,在某些實施例中,既定階層之虛擬格柵可定位為與鄰接階層之虛擬格柵垂直或平行。
在一實施例中,晶片之不同階層內的各虛擬格柵被定位至單一座標系統之原點。因此,座標系統能控制晶片不同階層內的虛擬格柵之間的空間關係。例如,在圖2A之例示性實施例中,閘階層及M2階層之每一者的虛擬格柵被定位至座標系統之原點(0,0),其中原點(0,0)位於晶片101上的邏輯區塊103之左下角。應了解座標系統之原點(0,0)可坐落於晶片101之任何位置上,且不需位於欲被設置元件之邏輯區塊中的特定位置上(例如,在邏輯區塊103之左下角)。此外,應了解將虛擬格柵定位至既定的空間位置代表:界定虛擬格柵,以使其虛擬線路之其中一者通過既定的空間位置。
本質上能以任何方式來定義晶片之不同階層中的虛擬格柵之間的空間關係,然而,通常方位(即,平行於橫過晶片之寬度方向)之虛擬格柵之間的空間關係可由有理數(rational number)定義,以使虛擬格柵以特定的空間頻率互相對準。尤其是,對於被定位至相同座標系統之原點之任兩虛擬格柵,可由有理數定義它們的虛擬格柵節距比率,以使兩虛擬格柵以特定的空間頻率對準。例如,圖2A顯示M2階層與閘階層之虛擬格柵之間的空間關係乃由4/3之M2階層對閘階層之虛擬格柵節距比率所定義。因此,相對於原點(0,0),M2階層及閘階層之虛擬格柵每隔四個閘階層虛擬格柵線路互相對準一次。通常方位、被定位至一般空間位置、且它們的虛擬格柵節距之比率由有理數定義的兩虛擬格柵被認為具有有理空間關係。
依據本發明之實施例,圖8顯示定義於動態陣列結構內的虛擬線路801A-801E之例子。虛擬線路801A-801E以平行方式橫越佈局,虛擬線路之間具有等於特定節距807的垂直間隔。為了說明,圖8顯示互補的擴散區域803及805。應了解擴散區域803及805係定義於閘階層下方之擴散階層中。此外,應了解擴散區域803及805係經由舉例方式提供,並不代表關於擴散區域尺寸、形狀、及/或相對於動態陣列結構之擴散階層內的配置之任何限制。
於動態陣列結構內,特徵部佈局通道係定義在既定的虛擬線路附近,俾能在鄰接既定虛擬線路之虛擬線路之間延伸。例如,特徵部佈局通道801A-1到801E-1係個別定義在虛擬線路801A到801E附近。應了解各虛擬線路具有對應的特徵部佈局通道。此外,針對鄰接指定的佈局空間之邊緣的虛擬線路,例如,鄰接元件邊界,相對應的特徵部佈局通道延伸猶如有虛擬線路在指定的佈局空間外面,如特徵部佈局通道801A-1及801E-1所示。更應了解各特徵部佈局通道係定義為沿著其相對應的虛擬線路之整體長度延伸。
圖8更顯示數個例示性佈局特徵部809-823,其係依據分別對應至虛擬線路801A到801E的特徵部佈局通道801A-1到801E-1而定義。於動態陣列結構中,與既定之虛擬線路相關的佈局特徵部係定義於與虛擬線路相關之特徵部佈局通道內。此外,禁止定義於與鄰接虛擬線路相關之特徵部佈局通道中的佈局特徵部之間的實體接觸。
連續的佈局特徵部可包含兩部分:定義電路主動部之部分,及未定義電路部之部分。例如,在閘階層中,連續的佈局特徵部可在下方晶片階層之擴散區域及介電區域上方延伸。在一實施例中,形成電晶體之閘電極的閘階層佈局特徵部之各部分本質上係位於既定之虛擬線路中心上。再者,在此實施例中,未形成電晶體之閘電極的閘階層佈局特徵部之部分可被置於與既定之虛擬線路相關的特徵部佈局通道內。因此,只要既定的閘階層佈局特徵部之閘電極部位於對應至既定特徵部佈局通道之虛擬線路中心上,且只要既定的閘階層佈局特徵部相對於鄰接特徵部佈局通道中的其他閘階層佈局特徵部而言遵守設計法則之間隔需求,則既定的閘階層佈局特徵部本質上能在特徵部佈局通道內之任何地方被定義。
如圖8所示,佈局特徵部809係定義於與虛擬線路801A相關之特徵部佈局通道801A-1內。佈局特徵部809之某些部分本質上位於虛擬線路801A之中心上。此外,佈局特徵部809之其他部分與定義於鄰接的特徵部佈局通道801B-1內之佈局特徵部811及813維持設計法則之間隔要求。同樣地,佈局特徵部811-823係定義於它們各自的特徵部佈局通道內,且包含本質上位於對應至它們各自的特徵部佈局通道之虛擬線路之中心上的部分。此外,應察知佈局特徵部811-823之每一者與定義於鄰接特徵部佈局通道內之佈局特徵部維持設計法則之間隔要求,且避免與定義於鄰接特徵部佈局通道內的其他佈局特徵部有實體接觸。
如圖8之範例特徵部佈局通道801A-1到801E-1所示,各特徵部佈局通道與既定之虛擬線路相關且對應至佈局區域,該佈局區域從既定的虛擬線路到鄰接虛擬線路或佈局邊界外的虛擬線路中之最接近者,沿著既定的虛擬線路並在各對向方向垂直向外延伸。此外,應了解各佈局特徵部係定義於其特徵部佈局通道內且不與定義於鄰接特徵部佈局通道內的其他佈局特徵部有實體接觸。
某些佈局特徵部可具有一個以上的接觸頭(contact head)部,其係沿著它們的長度在任何數目之位置定義。定義既定的佈局特徵部之接觸頭部為具有足夠尺寸之高度及寬度以容納接觸部(contact)結構的佈局特徵部片段,其中『寬度』係在垂直於既定佈局特徵部之虛擬線路之方向上橫越基板而定義,且其中『高度』係在平行於既定佈局特徵部之虛擬線路之方向上橫越基板而定義。應察知當從上方察看,佈局特徵部之接觸頭本質上能定義為任何佈局形狀,包含正方形或長方形。此外,依據佈局需求及電路設計,佈局特徵部之既定的接觸頭部可能具有或可能不具有定義於其上之接觸部。
在一實施例中,定義佈局特徵部以提供有限數量之受控的佈局形狀對形狀之微影相互作用,其能在製造及設計程序中被準確地預測及最佳化。在此實施例中,定義佈局特徵部以避免會在佈局內產生負面微影相互作用之佈局形狀對形狀之空間關係,其被準確預測及緩和的機率不高。然而,應了解當對應的微影相互作用為可預測且可控制時,在它們的特徵部佈局通道內之佈局特徵部之方向上的變更為可接受。
在一實施例中,既定階層之各佈局特徵部本質上位於與既定階層相關之虛擬格柵的虛擬線路之其中一者的中心上。當佈局特徵部之中線與虛擬格柵之特定線路之間的對準偏差夠小而能不降低製程適用範圍(process window)時(與佈局特徵部之中線與虛擬格柵之線路間準確對準時可達成者相較),佈局特徵部被視為本質上位於虛擬格柵之特定線路之中心上。因此,在此實施例中,依據有理空間關係之虛擬格柵而置於不同晶片階層之佈局特徵部將以由有理空間關係所定義之空間頻率來進行對準。在一實施例中,上述的製程適用範圍係由產生可接受的佈局特徵部保真度(fidelity)的聚焦及曝光之微影區域所定義。在一實施例中,佈局特徵部之保真度係由佈局特徵部之特性尺寸(dimension)所定義。
在動態陣列結構中,只要從製造觀點可預測垂直橫剖面形狀之差異,且對於既定佈局特徵部之製造或其鄰近的佈局特徵部沒有不利影響,所製造的佈局特徵部之垂直橫剖面形狀中的差異能在一定程度上被容忍。就這一點而言,在垂直於佈局特徵部之中線與晶片之基板兩者之平面上,垂直橫剖面形狀對應至所製造的佈局特徵部之截面。應察知在所製造的佈局特徵部之垂直橫剖面中沿著其長度的差異能對應至沿著其長度之佈局特徵部之寬度差異。因此,動態陣列結構亦能容納沿著其長度之所製造的佈局特徵部之寬度差異,只要寬度差異從製造觀點為可預測,且對於佈局特徵部之製造或其鄰近的佈局特徵部沒有不利影響。
此外,既定階層內的不同佈局特徵部能被設計成具有相同寬度或不同寬度。此外,沿著既定之虛擬格柵之鄰近線路所定義之數個佈局特徵部之寬度能被設計,以使數個佈局特徵部互相接觸,俾能形成單一佈局特徵部,其寬度等於數個佈局特徵部之寬度的總合。
在依據動態陣列結構所定義之既定階層內,鄰接的、相互對準的線形佈局特徵部之鄰近端可被本質上相同的間隙(gap)互相隔開。具體而言,沿著虛擬格柵之共同線路定義之線形佈局特徵部之鄰近端被末端間隔隔開,且在與虛擬格柵相關之階層內的上述末端間隔可被定義以橫越本質上相同的距離。此外,在一實施例中,末端間隔之尺寸在製程能力範圍內被最小化,俾能將既定階層之線形佈局特徵部之填充最佳化。
此外,在動態陣列結構中,能定義階層以具有被任何數量之佈局特徵部所佔用之任何數量之虛擬格柵線路。在一例子中,能定義既定階層以使其虛擬格柵之所有線路被至少一佈局特徵部所占用。在另一例子中,能定義既定階層以使其虛擬格柵之某些線路被至少一佈局特徵部所佔用,而其虛擬格柵之其他線路未被佔用,即,未被任何佈局特徵部佔用。再者,在既定階層中,任何數量之連續鄰接的虛擬格柵線路能被保留成未被佔用。此外,可依據橫越既定階層之圖樣或重複之圖樣來定義在該既定階層中虛擬格柵線路被佈局特徵部佔用與未佔用的情形。
此外,在動態陣列結構內,定義介層窗(via)及接觸部以將不同階層中的數個佈局特徵部互相連接,俾能形成數個功能電子元件(如電晶體)與電子電路。介層窗及接觸部之佈局特徵部能對準至一虛擬網格,其中此虛擬網格之設計規格為與不同階層相關之虛擬格柵之設計規格的函數,其中介層窗及接觸部將連接至該不同階層。因此,不同階層中的數個佈局特徵部形成電子電路之功能組件。此外,不同階層內的某些佈局特徵部對於電子電路為無功能,但仍然被製造俾能強化鄰接佈局特徵部之製造。
應了解動態陣列結構係用以使半導體裝置之可製造性能被準確預測的機率很高,即使當半導體裝置之佈局特徵部被製作成小於微影製程中用來將佈局特徵部成像之光的波長。此外,應了解動態陣列結構係藉由在元件(cell)之數個階層中配置佈局特徵部於固定間隔的格柵上(或固定間隔的網格)而定義,以使元件之既定階層中的佈局特徵部受限於它們的特徵部佈局通道內,且以使鄰接的特徵部佈局通道中的佈局特徵部彼此不會有實體接觸。再者,應了解動態陣列結構能應用於一層以上之晶片階層。例如,在一實施例中,僅晶片之閘階層依據動態陣列結構定義。在另一實施例中,閘階層及一層以上之內連線階層係依據動態陣列結構定義。
參考圖1B,藉由在列1-10內配置元件A-Z而定義例示性邏輯區塊103。圖2B為顯示例示性邏輯區塊103連同閘階層及M2階層之虛擬格柵之圖,該虛擬格柵被定位至邏輯區塊103左下角之原點(0,0)。在動態陣列結構之實施例中,為了各元件A-Z可於邏輯區塊103內確立位置,各元件A-Z應基於利用邏輯區塊103之閘階層及M2階層之虛擬格柵而定義。然而,依據元件置於邏輯區塊103之位置,閘階層及M2階層之虛擬格柵之位置可於元件邊界內且相對於元件之邊界而變化。例如,元件之左邊界與元件內最近的閘階層虛擬格柵線路之間的距離可在邏輯區塊103中元件之不同位置之間變化。同樣地,元件之左邊界與元件內最近的M2階層虛擬格柵線路之間的距離可在邏輯區塊103中既定元件之不同位置之間變化。
置於邏輯區塊103內的各元件應使其以元件為基礎之閘階層及M2階層之虛擬格柵與邏輯區塊103之閘階層及M2階層之虛擬格柵對準。由於邏輯區塊103之閘階層及M2階層之虛擬格柵之位置能在既定元件內,依據既定元件置於邏輯區塊103中的位置而變化,必須具有在邏輯區塊103中可配置之既定元件之不同版本,以使既定元件之至少一版本被定義以使其閘階層及M2階層之虛擬格柵分別與邏輯區塊103之閘階層及M2階層之虛擬格柵對準。
一般而言,各元件被定義為具有虛擬格柵節距或虛擬格柵節距的一半之整數倍的寬度,以使元件邊界對準虛擬格柵線路或鄰接虛擬格柵線路之間的中點。在一實施例中,各元件被定義為具有閘階層虛擬格柵節距的一半之整數倍的寬度。在另一實施例中,各元件被定義為具有閘階層虛擬格柵節距之整數倍的寬度。此外,各元件能被置於邏輯區塊103中以使其左元件邊界對準閘階層虛擬格柵線路或鄰接閘階層虛擬格柵線路之間的中點。因此,當元件寬度為閘階層虛擬格柵節距的一半之整數倍時,右元件邊界亦將對準閘階層虛擬格柵線路或鄰接閘階層虛擬格柵線路之間的中點。為了方便討論,配置元件以使其左元件邊界對準閘階層虛擬格柵線路或鄰接閘階層虛擬格柵線路之間的中點被稱為以閘階層虛擬格柵半節距配置元件。
以閘階層虛擬格柵半節距配置元件結合閘階層及M2階層之虛擬格柵之間的有理空間關係能使既定元件產生有限數量之佈局差異,以使既定元件之合適的佈局差異對於可能發生於既定元件內的閘階層及M2階層之虛擬格柵配置之各種可能的組合為有效(依據既定元件置於邏輯區塊103中的位置)。就這點而言,既定元件之各佈局差異定義一元件相位,其中各元件相位係藉由既定元件內相對於既定元件之參考邊界之閘階層及M2階層之虛擬格柵配置之不同組合而定義,例如,相對於既定元件之左邊界。
應了解於上述實施例中,各元件之寬度為閘階層虛擬格柵半節距之整數倍,但不必為M2階層虛擬格柵節距之整數倍,因此,雖然左及右元件邊界將對準閘階層虛擬格柵,左及右元件邊界可能不總是對準M2階層虛擬格柵。然而,在此說明之元件相位調整方法容許有效M2階層佈局形狀配置於M2階層虛擬格柵上。因此,在此說明之元件相位調整及元件配置方法,結合動態陣列結構,藉由使M2階層佈局形狀不置於鄰接的M2階層之虛擬格柵線路之間而以一M2階層佈局形狀消耗兩鄰接之M2階層之虛擬格柵線路來將佈線(routing)資源最佳化。
圖3A-3H闡明一元件在下列情況下被安置之可能存在的不同元件相位:
1.元件置於依據動態陣列結構所定義之邏輯區塊中,其中M2階層及閘階層之虛擬格柵之間的有理空間關係乃由4/3之M2階層對閘階層之虛擬格柵節距比率所定義。
2.元件置於閘階層之虛擬格柵半節距上;及
3.元件寬度為閘階層之虛擬格柵節距的一半之整數倍。
應了解闡明於圖3A-3H中的元件相位調整原理能適用於具有任何有理空間關係(即,除了4/3之M2對閘之節距比率之外)之通常方位之晶片階層之任何組合(即,除了所闡明之閘及M2階層之外),只要與元件相位調整相關之邏輯區塊的虛擬格柵被定位至通常空間位置。
圖3A顯示元件300之第一相位(ph1),元件300包含左元件邊界301,元件300係藉由閘階層之虛擬格柵(由通常方位之實線表示)以及M2階層之虛擬格柵(由通常方位之虛線表示)來定義。M2階層及閘階層之虛擬格柵之間的節距比率為4/3。因此,M2階層及閘階層之虛擬格柵將每隔四個閘階層虛擬格柵線路互相對準一次。在閘階層及M2階層之虛擬格柵之對準之間的閘階層虛擬格柵線路數目定義相位空間303。一般而言,相位空間定義為:在具有有理空間關係之兩虛擬格柵之間的同樣關係連續出現之間的垂直延伸距離。在圖3A-3H之例示性實施例中,具有有理空間關係之兩虛擬格柵之間的同樣關係連續出現相當於具有有理空間關係之兩虛擬格柵之連續對準。
各元件相位與相位空間303內的左元件邊界301(例如,參考元件邊界)之不同允許位置相關。在圖3A-3H之例子中,左元件邊界301能置於閘階層之虛擬格柵半節距上。因此,左元件邊界301能置於相位空間303內的各閘階層虛擬格柵線路上,以及相位空間303內的鄰接閘階層虛擬格柵線路之間的中點上。因此,由於相位空間303包含四個閘階層虛擬格柵節距,且由於元件能置於閘階層虛擬格柵半節距上,可能的元件相位數目為八。在圖3A-3H中,八個可能的元件相位之每一者的左元件邊界301位置係由標示為ph1-ph8之各箭頭來識別。由於閘階層及M2階層之虛擬格柵與邏輯區塊103相關,當左元件邊界301移位通過八個可能的相位(ph1-ph8),它們的各自位置在圖3A-3H之每一者中保持未改變。
應了解圖3A-3H之八個可能的元件相位為例示性實施例之特定規格之結果。例如,在另一實施例中,假如相位空間303包含四個閘階層虛擬格柵節距,但元件僅能置於閘階層虛擬格柵(整個)節距上,可能的元件相位數目為四而非八,且相當於圖3A-3H所示之元件相位(ph1,ph3,ph5,ph7)。
一般而言,元件相位係藉由與相位調整相關之各晶片階層的索引值組合而定義。用於定義元件相位的既定晶片階層之索引值表示在元件之左邊界與既定晶片階層之虛擬格柵之最近的虛擬線路之間垂直量測之距離。應了解既定元件之各相位調整晶片階層具有對應的索引值。此外,應了解元件之相位調整晶片階層為由虛擬格柵所定義之元件之任何晶片階層,該虛擬格柵具有與元件之至少一其他晶片階層之虛擬格柵的有理空間關係。此外,如先前所述,當兩晶片階層之每一者由通常方位虛擬格柵所定義時(其中虛擬格柵被定位至通常空間位置且具有由有理數定義之它們的虛擬格柵節距比率),有理空間關係存在於兩晶片階層之間。在圖3A-3H之例示性實施例中,各元件相位(ph1-ph8)由兩索引值定義:1)Gindex
,及2)M2index
,其中Gindex
為閘階層之索引值而M2index
為M2階層之索引值。如圖3A-3H所示,各相位係由Gindex
及M2index
數值之獨特組合定義。
由圖3A-3H所闡明之元件相位調整例子係基於虛擬格柵相位調整關係,於此關係中兩虛擬格柵被定位以依據它們的有理空間關係週期性地互相對準。應了解,然而,在某些實施例中,虛擬格柵能互相被相位調整而不實際地互相對準。例如,圖3I-3P闡明另一實施例,於其中M2階層與閘階層之虛擬格柵之間的節距比率為4/3,且於其中以與閘階層之虛擬格柵之偏位關係定位M2階層之虛擬格柵,以使M2階層及閘階層之虛擬格柵不在任何相位互相對準。關於圖3A-3H所說明之相同概念亦適用於圖3I-3P。一般而言,應了解圖3I-3P中的相位空間303’係定義於在相位調整的虛擬格柵之間的同樣關係之延伸的連續出現之間的區域上方。具體而言,在相位(ph1’),閘階層之索引值為Gindex
=0,而M2階層之索引值為M2index
=(1/6)*Gpitch
。因此,相位空間303’延伸至相位(ph1’)再次出現之位置,即Gindex
=0且M2index
=(1/6)*Gpitch
。為了方便說明,在此提供關於如圖3A-3H所示之相位調整之剩餘說明。
在一實施例中,編譯元件庫以包含數個不同元件,其依據動態陣列結構定義,且更基於特定晶片階層之間的特定有理空間關係定義。例如,關於圖2A-2B之邏輯區塊103實施例,元件庫能被編譯以包含元件A-Z,各元件A-Z係依據動態陣列結構定義,且更基於M2階層及閘階層之虛擬格柵節距之間的4/3之有理空間關係定義。為了確保元件庫中各元件之閘階層及M2階層佈局能對準邏輯區塊103之閘階層及M2階層虛擬格柵,無論邏輯區塊內的元件配置,元件庫應包含分別對應至各可能的元件相位之各元件之不同版本。因此,關於圖2A-2B之實施例,元件庫應包含各元件A-Z之八個不同的元件版本(每一者對應至各元件相位)。對於元件相位1到8之元件A-Z之不同版本可被識別為A-ph1,A-ph2,...Z-ph7,Z-ph8。
在一實施例中,首先元件可置於邏輯區塊103中而不考慮元件相位調整,如圖2B所示。接著,各配置元件能相對於邏輯區塊103之閘階層及M2階層之虛擬格柵,基於其在邏輯區塊103中的確切位置被對應至需要的元件相位之適當版本取代。在另一實施例中,當元件最初被置於邏輯區塊103中時,能決定對應至需要的元件相位調整之適當的元件版本。圖2C顯示圖2B之元件配置,基於邏輯區塊103內的各種元件配置所需要的元件相位調整而以適當的元件版本代替各元件。
如先前所述,各元件相位係藉由相位調整之晶片階層的索引值之組合而定義。因此,為了決定用於既定之元件配置的適當元件相位,計算配置元件之相位調整晶片階層的索引值,接著,配置元件之相位調整晶片階層的計算索引值與各種元件相位之索引值相比,以識別匹配的元件相位,接著,配置元件之匹配的元件相位代替配置元件。
例如,在圖2B之實施例中,各元件相位係藉由閘階層索引值(Gindex
)及M2階層索引值(M2index
)之組合而定義。因此,為了決定用於既定之元件配置的適當元件相位,計算配置元件之Gindex
與M2index
值。接著,配置元件之計算的Gindex
與M2index
值與各種元件相位之Gindex
與M2index
值相比,以識別匹配的元件相位,接著,配置元件之匹配的元件相位代替原本的配置元件。
為了進一步闡明,將圖2B之邏輯區塊103中列1之置於最左的元件A視為主要元件。主要元件之Gindex
值被計算為零,即,左元件邊界301係對準閘階層之虛擬格柵。主要元件之M2index
值被計算為零,即,左元件邊界301係對準M2階層之虛擬格柵。主要元件之計算索引值(Gpitch
=0,且M2index
=0)匹配元件相位1之索引值,如圖3A所示。因此,元件相位1應為主要元件所使用,如圖2C之列1中對應的元件A-ph1所示。
為了進一步闡明,將圖2B之邏輯區塊103中列4之置於最右的元件U視為主要元件。主要元件之Gindex
值被計算為((1/2)*Gpitch
),其中Gpitch
為閘階層虛擬格柵節距。主要元件之M2index
值被計算為((1/6)*Gpitch
)。主要元件之計算索引值(Gpitch
=((1/2)*Gpitch
),且M2index
=((1/6)*Gpitch
))匹配元件相位6之索引值,如圖3F所示。因此,元件相位6應為主要元件所使用,如圖2C之列4中對應的元件U-ph6所示。
圖4顯示圖2C之邏輯區塊103之列1,具有用以描述於其中之各元件的例示性閘階層及M2階層之佈局形狀。由於列1中各元件之適當元件相位之載明,能看到各元件之閘階層佈局形狀對準邏輯區塊103之閘階層之虛擬格柵,而各元件之M2階層佈局形狀對準邏輯區塊103之M2階層之虛擬格柵。
在此說明之關於M2階層對閘階層有理空間關係的元件相位調整方法同樣能適用於任何複數之晶片階層。此外,在任何兩晶片階層之間的有理空間關係本質上能基於兩晶片階層之間之任何虛擬格柵節距比率。例如,雖然圖2A-4之例示性實施例係基於4/3之M2階層對閘階層之節距比率,但在其他實施例中的M2階層對閘階層之節距比率可為3/2、5/3、5/4、2/3、3/5、4/5等等。
應察知在此說明之元件相位調整方法在既定之晶片區域(例如,邏輯區塊103)內提供元件之最大壓縮,而不包含對動態陣列結構之依附(adherence)。換言之,在此說明之元件相位調整方法允許元件在既定之晶片區域內以元件邊界對元件邊界之方式設置,同時確保元件之相位調整之晶片階層內的佈局形狀對準相位調整之晶片階層的虛擬格柵。因此,在此說明之元件相位調整方法減輕擴張元件寬度以滿足元件內佈局特徵部對準多重虛擬格柵之需要,從而提供晶片區域利用之最佳化結合動態陣列結構之使用。此外,在此說明之元件相位調整方法減輕於鄰接配置之元件間保留未被佔據的晶片區域以滿足元件內佈局特徵部對準多重虛擬格柵之需要,從而提供晶片區域利用之最佳化結合動態陣列結構之使用。
依據本發明之實施例,圖5為顯示定義不同元件相位之元件版本以使元件能夠在依據動態陣列結構所定義之半導體晶片區域內配置之方法的流程圖。應了解半導體晶片上的區域可對應至本質上小於半導體晶片總面積之區域。該方法包含基於在相位調整之晶片階層之虛擬格柵之間的有理空間關係來識別相位空間之作業501。相位調整之晶片階層之虛擬格柵代表用來定義半導體晶片區域之動態陣列結構之一部分。如先前所述,相位空間係定義為:在具有有理空間關係之兩虛擬格柵的連續對準位置之間的垂直延伸距離。例如,假如第一及第二虛擬格柵具有一有理空間關係,以使第一及第二虛擬格柵在第一虛擬格柵之每四個虛擬線路對準,則相位空間橫跨第一虛擬格柵之四倍節距之距離(在第一及第二虛擬格柵之連續對準之間延伸)。
該方法繼續作業503,於其中主要元件之左邊界對準相位空間之左邊緣。因此,在作業503之後,主要元件之左邊界同時對準相位調整之晶片階層的各虛擬格柵之虛擬線路。圖3A顯示元件300之左邊界301與相位空間303之左邊緣之間對準之例子。因此,在圖3A之例子中,元件300之左邊界301同時對準相位調整之晶片階層(即,閘階層及M2階層)的各虛擬格柵之虛擬線路。
在主要元件之左邊界對準相位空間之左邊緣的情況下,該方法繼續作業505,其係基於相位調整晶片階層的虛擬格柵位置(相對於左元件邊界)來定義主要元件之第一相位。主要元件之第一相位代表主要元件之第一版本,其適合配置於半導體晶片上需要既定元件之第一相位的位置上。主要元件之第一相位能由各相位調整之晶片階層的索引值加以特徵化,既定之相位調整之晶片階層的索引值被定義為:在相位空間內元件之左邊界與既定晶片階層之虛擬格柵之最近的虛擬線路之間垂直量測的距離。圖3A-3H顯示閘及M2之相位調整晶片階層之相對應的索引值Gindex
及M2index
。作業505包含將主要元件之第一相位儲存在元件庫中以供未來召回及利用。在一實施例中,元件庫以數位格式儲存於電腦可讀媒體。
在作業505之後,該方法繼續進行到作業507,於其中元件之左邊界從其目前位置橫越相位空間移動至相位空間內元件之左邊界之下一個可能位置。應了解在作業507中,元件之左邊界橫越相位空間移動,而不移動相位空間內相位調整之晶片階層的虛擬格柵。圖3B顯示一例子:元件300之左邊界301從其目前位置(即,從其於圖3A中的位置)移動至元件空間303內元件之左邊界的下一個可能位置(ph2)。
假如半導體晶片區域之特定動態陣列結構實施例允許元件寬度為閘階層虛擬格柵半節距之整數倍,則相位空間內左元件邊界之可能的位置對應至相位空間內各閘階層虛擬格柵線路,及對應至相位空間內閘階層虛擬格柵線路之各鄰接對之間的各中點。此情況係例示於圖3A-3H中。假如半導體晶片區域之特定動態陣列結構實施例僅允許元件寬度為閘階層虛擬格柵(整體)節距之整數倍,則相位空間內左元件邊界之可能位置對應至相位空間內閘階層虛擬格柵線路或閘階層虛擬格柵線路之鄰接對之間的中點。
在主要元件之左邊界對準相位空間內元件之左邊界之下一個可能位置的情況下,該方法繼續作業509,其係基於相對於左元件邊界的相位調整晶片階層的虛擬格柵之位置來定義主要元件之下一個相位。主要元件之下一個相位代表主要元件之另一版本,其適合配置於半導體晶片上需要既定元件之該下一個相位的位置上。主要元件之下一個相位亦能由各相位調整之晶片階層的索引值加以特徵化。作業509包含將主要元件之下一個相位儲存在元件庫中以供未來召回及利用。
該方法接著繼續進行一決策作業511,用以決定是否有元件之左邊界之另一可能位置存在於相位空間內。假如元件之左邊界之另一可能位置存在於相位空間內,方法回到作業507。然而,假如元件之左邊界之另一可能位置不存在於相位空間內,則方法結束。在圖5之方法完成之後,元件庫將包含各可能元件相位之主要元件之版本,其可能發生於依據動態陣列結構之相位調整之晶片階層所定義的半導體晶片上之區域內。
依據本發明之實施例,圖6為顯示於依據動態陣列結構所定義的部分半導體晶片內配置元件之方法的流程圖。該方法包含作業601,其分別定義部分半導體晶片內兩相位調整之晶片階層之每一者的虛擬格柵。兩相位調整之晶片階層被定義為具有有理空間關係。如先前所述,通常方位、被定位至通常空間位置,且使它們的虛擬格柵節距之比率由有理數定義的兩虛擬格柵被視為具有有理空間關係。在一實施例中,兩相位調整之晶片階層相當於閘階層及第二內連線階層。然而,應了解在其他實施例中,兩相位調整之晶片階層能相當於任何兩晶片階層。
接著方法繼續進行配置元件於部分晶片內之作業603。在一實施例中,兩相位調整之晶片階層被定位至部分晶片之左下角,且元件被設置成列,從左到右橫越部分晶片。此外,在一實施例中,元件能被配置以使它們的邊界(其以兩相位調整之晶片階層的虛擬格柵為通常方位)對準具有較小虛擬格柵節距的相位調整晶片階層之虛擬格柵半節距。
接著方法繼續進行到作業605,決定於作業603中設置之各元件所需的元件相位。在一實施例中,既定元件之所需的元件相位係藉由配置元件內相位調整之晶片階層之索引值所識別。再次,配置元件內既定之相位調整之晶片階層的索引值被定義成在配置元件之左邊界與配置元件內既定之相位調整晶片階層之虛擬格柵的最近虛擬線路之間垂直量測之距離,即,既定之相位調整晶片階層之虛擬格柵的最近虛擬線路在元件左邊界之右方。各配置元件之相位調整晶片階層的計算索引值能與元件庫內相同的配置元件之版本之對應索引值相比,以識別具有所需的元件相位之相同配置元件之特定版本。接著執行作業607,以具有所需的元件相位之配置元件之特定版本代替各配置元件,從而導致各配置元件之相位調整之晶片階層中的佈局特徵部對準橫越半導體晶片部分而定義的相位調整之晶片階層的虛擬格柵。
基於前述,在一實施例中,半導體晶片定義為包含邏輯區塊區域。邏輯區塊區域包含第一晶片階層,佈局特徵部係依據第一虛擬格柵而配置於其中。邏輯區塊區域亦包含第二晶片階層,佈局特徵部係依據第二虛擬格柵而配置於其中。有理空間關係存在於第一及第二虛擬格柵之間。數個元件係置於邏輯區塊區域內。數個元件之每一者係依據數個元件相位中之合適者而定義。當佈局特徵部被安置於既定之配置元件內時,合適的元件相位使既定之配置元件之第一及第二晶片階層中的佈局特徵部對準第一及第二虛擬格柵。應了解依據數個元件相位之每一者而定義的既定元件係用以執行與既定元件相關之相同邏輯功能。此外,在一實施例中,定義既定元件之各版本(對應至各種元件相位)以具有相似的電氣特性為所考慮的。此外,在一實施例中,某些元件包含至少一佈局特徵部,其沿著元件邊界以本質上位於中心之方式配置於第一晶片階層或第二晶片階層,元件邊界係平行第一及第二虛擬格柵之虛擬線路。
在一實施例中,數個元件於邏輯區塊區域內設置成列,以使界面元件邊界互相對準。此外,在一實施例中,數個元件之每一者的高度為一致。數個元件之每一者的高度以平行於第一及第二虛擬格柵之虛擬線路的方向量測。此外,在一實施例中,數個元件之每一者的寬度為第一虛擬格柵之節距的整數倍,而各配置元件之各邊界(其係平行於第一虛擬格柵之虛擬線路)乃對準第一虛擬格柵之虛擬線路。在另一實施例中,數個元件之每一者的寬度為第一虛擬格柵之節距的整數倍,而各配置元件之各邊界(其係平行於第一虛擬格柵之虛擬線路)乃對準第一虛擬格柵之鄰接虛擬線路之間的中點。在又另一實施例中,數個元件之每一者的寬度為第一虛擬格柵之半節距的整數倍,而各配置元件之各邊界(其係平行於第一虛擬格柵之虛擬線路)乃對準第一虛擬格柵之虛擬線路或第一虛擬格柵之鄰接虛擬線路之間的中點。
此外,雖然上述實施例係針對配置於既定邏輯區塊內的各元件進行相位調整而於上下文中加以說明,應了解在替代的實施例中,在此說明之元件相位調整方法可被應用至配置於既定邏輯區塊內的部分元件,邏輯區塊中的剩餘元件保持未受相位調整。例如,假如既定邏輯區塊內之第一組元件係依據動態陣列結構定義且被配置時利用適當的相位調整,而既定邏輯區塊內之第二組元件係依據未利用相位調整之另一結構(即,非動態陣列結構)定義,第一組元件能依據在此說明之方法被配置以及進行相位調整,而第二組元件能保持未受相位調整。
動態陣列區段(DAS,dynamic array section)係定義為動態陣列結構之分部,於其中出現於分部之各垂直描繪階層的特徵部係考慮到分部中的其他特徵部而依據一組規則定義,其中建立規則以管理分部之既定階層中的特徵部之間的關係以及分部之不同階層中的特徵部之間的關係。DAS能被定義以佔據任意形狀及大小之基板區域。DAS亦能被定義以佔據在基板上方之任意形狀及大小之區域。
此外,如共同申請之美國專利申請案第12/013,342號中所說明,邏輯元件之既定階層中(即,包含邏輯元件之DAS之既定階層中)的導電特徵部能相對於邏輯元件之原點而被定位。例如,當從垂直於基板平面之方向察看時,既定階層中的邏輯元件之原點被認為位於邏輯元件之左下角。由於邏輯元件寬度為可變,在寬度方向之邏輯元件邊界可能不總是落於既定之DAS階層內的導電特徵部節距或半節距上。因此,依據邏輯元件之原點相對於既定DAS階層之虛擬格柵,當邏輯元件置於晶片上時,邏輯元件之既定DAS階層中的導電特徵部可能需要相對於邏輯元件原點而被移位,以對準既定DAS階層之虛擬格柵。如上所述,相對於邏輯元件之原點的邏輯元件之既定階層中的導電特徵部之移位被稱為相位調整。因此,依據邏輯元件之原點位置,相位調整提供邏輯元件之既定階層中的導電特徵部對準於既定晶片階層之DAS之虛擬格柵。例如,在閘電極虛擬格柵橫越邏輯元件邊界之情況下,可能需要相位調整以維持既定邏輯元件中的第二內連線階層導電特徵部與第二內連線階層之虛擬格柵之對準。
依據本發明之實施例,圖7為顯示在定義於DAS內之鄰接配置之邏輯元件的第二內連線階層中不同相位調整之例子的圖。圖7對應至共同申請之美國專利申請案第12/013,342號之圖33。圖7顯示三個例示性元件(元件1,相位A;元件1,相位B;及元件1,相位C),其在DAS中互相鄰接配置。因此,三元件之每一者在DAS之各階層中共用一虛擬格柵。為了輔助說明相位調整之概念,將各元件之第二內連線階層導電特徵部3303於各元件之閘電極階層導電特徵部3301上方疊加顯示。在寬度方向之元件邊界落於閘電極半節距上。
應了解用於圖2A-4之例子中以闡明元件相位調整原理的4/3之M2階層對閘階層虛擬格柵節距比率為能在不同晶片階層之間實施之許多可能虛擬格柵節距比率之一例。例如,在圖7之例示性實施例中,使用3/4之M2階層對閘階層虛擬格柵節距比率,以使每三個閘電極階層導電特徵部節距提供四個第二內接線階層導電特徵部節距。
各元件之原點乃顯示於元件之左下角。第二內接線階層之元件1的各相位調整係由將第二內接線階層導電特徵部定位至元件原點而定義。如圖7之例子所示,對於相位A、B、及C之每一者而言,相對於原點之第二內連線階層導電特徵部之索引(即間隔)乃連續減少,藉由定義各邏輯元件之各階層以具有一適當相位,在共同的DAS中配置邏輯元件互相緊鄰乃為可能,以使定義於各種邏輯元件內的導電特徵部在既定之DAS階層內能對準與既定之DAS階層相關之共同虛擬格柵。此外,應察知在一實施例中,能定義且配置DAS內的鄰接元件,俾能在DAS之一層以上之階層中共用導電特徵部。例如圖7中元件1之相位B及C實例乃描繪成共享第二內連線階層之導電特徵部。
應了解在某些實施例中,動態陣列結構僅可實施於一晶片階層之一部分,而其他晶片階層之重疊部分不受動態陣列結構限制。例如,在一實施例中,定義閘電極階層以遵守動態陣列結構,而以不受限制之方式(即,以非動態陣列方式)定義較高的內連線階層。在此實施例中,閘電極階層係由虛擬格柵及其相對應的特徵部佈局通道所定義,於通道中定義閘電極階層導電特徵部,如以上所述。此外,在一實施例中,非動態陣列較高內連線階層之佈局特徵部能不受虛擬格柵及相關的特徵部佈局通道限制。例如,在此特定實施例中,在閘電極階層上方之任何內連線階層中的佈局特徵部能包含彎曲部分,俾能形成任意的二維形狀佈局特徵部
作為上述實施例之替代方案,其他實施例能存在於其中,多重晶片階層係依據動態陣列結構定義。應了解在此說明之相位調整技術同樣可實施於使用動態陣列結構之任何實施例中,不論依據動態陣列結構所定義的晶片階層數目。
應了解在此揭露之元件相位調整技術能被定義於佈局中,該佈局係以有形的型式儲存,如以數位格式儲存於電腦可讀媒體。例如,在此揭露之元件相位調整佈局能被儲存於一個以上之元件之佈局資料檔案中且可從一個以上之元件庫選取。佈局資料檔案能被格式化成GDS II(Graphic Data System)資料庫檔案、OASIS(Open Artwork System Interchange Standard)資料庫檔案、或適合儲存及傳遞半導體裝置佈局之任何其他型式之資料檔案格式。此外,利用元件相位調整技術之多階層佈局能包含於較大的半導體裝置之多階層佈局內。較大的半導體裝置之多階層佈局亦能以佈局資料檔案之型式被儲存,如以上所述。
此外,在此說明之發明能於電腦可讀媒體上體現成電腦可讀碼。例如,電腦可讀碼能包含佈局資料檔案,包含元件相位調整技術之一個以上的佈局乃儲存於其內。電腦可讀碼亦能包含用以選取一個以上之佈局庫及/或元件(其包含利用定義於其中之元件相位調整技術之佈局)的程式指令。佈局及/或元件亦能以數位格式被儲存於電腦可讀媒體。
在此提及之電腦可讀媒體為任何資料儲存裝置,其能儲存之後可被電腦系統讀取之資料,電腦可讀媒體之例子包含:硬碟、網路附接儲存器(NAS)、唯讀記憶體、隨機存取記憶體、CD-ROM、CD-R、CD-RW、磁帶、及其他光學及非光學資料儲存裝置。電腦可讀媒體亦能被分散於連接的電腦系統之網路上,俾能使電腦可讀碼以分散方式被儲存及執行。
形成本發明之一部分之在此說明之任何作業為有用的機械作業。本發明亦關於用以執行這些操作之裝置或設備。可為了需要目的而特別建構設備,如特殊目的之電腦。當被定義成特殊目的之電腦時,電腦亦能執行非為特殊目的之部分的其他處理、程式執行或例行工作,同時仍能夠為了特殊目的而運作。或者,作業之處理可藉由一般目的之電腦,其藉由儲存於電腦記憶體、快取記憶體、或於網路上獲得之一個以上之電腦程式而被選擇性啟動或配置。當資料於網路上獲得時,資料可藉由網路上的其他電腦來處理,例如雲端計算資源。
本發明之實施例亦能定義為將資料從一狀態轉換成另一狀態之機器。資料可表示一物品,其能被表示成電子信號及電子操作資料。在某些情況下,轉換資料能被形象化地描繪於顯示器上,代表由於資料轉換而產生之物體。轉換資料一般能被儲存於儲存裝置,或以可使實體且有形之物體構成及描繪之特定格式被儲存於儲存裝置。在某些實施例中,能利用處理器執行操作,在這樣的例子中,處理器從而將資料從一物轉換成另一物。再者,該方法可藉由能被連接至網路之一個以上的機器或處理器來處理。各機器能將資料從一狀態或一物轉換成另一者,且亦能處理資料、儲存資料至儲存裝置、在網路上傳送資料、顯示結果、或傳遞結果至另一機器。
更應了解在此揭露之元件相位調整實施例能被製造成半導體裝置或晶片之部分。在半導體裝置(如積體電路、記憶體單元等等)之製造中,執行一系列製造操作以於半導體晶圓上定義特徵部。晶圓包含以多層結構之型式定義於矽基板上的積體電路裝置。在基板階層,形成具有擴散區域之電晶體元件。在隨後之階層,內連線金屬化線路被加以圖案化且電性連接至電晶體元件以定義期望之積體電路裝置。此外,圖案化之導電層係藉由介電材料而與其他導電層隔絕。
雖然本發明已參照數個實施例說明,熟習此項技藝者在閱讀先前之說明書及研究圖示後將了解其各種修改、添加、變更及等效設計。因此,本發明可解釋為包含所有在本發明之精神及範疇內之修改、添加、變更及等效設計。
101...晶片
103...邏輯區塊
300...元件
301...左元件邊界
303...相位空間
303’...相位空間
501...基於相位調整之晶片階層之虛擬格柵之間的有理空間關係來識別相位空間
503...將元件左邊界對準相位空間之左邊緣
505...在元件左邊界對準相位空間之左邊緣的情況下,基於與相位調整晶片階層相關之虛擬格柵位置來定義元件之第一相位
507...橫越相位空間將元件左邊界移動至相位空間內的左元件邊界之下一個可能位置,而不移動相位調整之晶片階層的虛擬格柵
509...在元件左邊界移動至相位空間中下一個位置的情況下,基於與相位調整晶片階層相關之虛擬格柵位置來定義元件之下一個相位
511...是否有左元件邊界之另一可能位置存在於相位空間內
601...分別定義晶片部內兩相位調整之晶片階層之每一者的虛擬格柵,其中兩虛擬格柵具有有理空間關係
603...配置元件於晶片部內
605...決定各配置元件所需的元件相位
607...基於所需的元件相位代替各配置元件之版本
3301...閘電極階層導電特徵部
3303...第二內連線階層導電特徵部
801A...虛擬線路
801A-1...特徵部佈局通道
801B...虛擬線路
801B-1...特徵部佈局通道
801C...虛擬線路
801C-1...特徵部佈局通道
801D...虛擬線路
801D-1...特徵部佈局通道
801E...虛擬線路
801E-1...特徵部佈局通道
803...擴散區域
805...擴散區域
807...節距
809...佈局特徵部
811...佈局特徵部
813...佈局特徵部
815...佈局特徵部
817...佈局特徵部
819...佈局特徵部
821...佈局特徵部
823...佈局特徵部
依據本發明之實施例,圖1A為顯示定義為包含邏輯區塊之半導體晶片的圖;
依據本發明之實施例,圖1B為顯示邏輯區塊中元件配置的圖;
依據本發明之實施例,圖2A為顯示具有兩相異虛擬格柵定義於其上之晶片之邏輯區塊區域的圖;
依據本發明之實施例,圖2B為顯示例示性邏輯區塊連同閘階層及M2階層之虛擬格柵的圖,該虛擬格柵被定位至邏輯區塊左下角之原點;
依據本發明之實施例,圖2C為顯示圖2B之元件配置的圖,基於邏輯區塊內的各種元件配置所需要的元件相位調整而以適當的元件版本代替各元件;
依據本發明之實施例,圖3A-3H為顯示配置於圖2A之邏輯區塊中之元件可能存在的不同元件相位的圖;
依據本發明之實施例,圖3I-3P為顯示不同元件相位的圖,於其中虛擬格柵互相相位調整而不實際地互相對準;
依據本發明之實施例,圖4為顯示圖2C之邏輯區塊之列1的圖,具有用以描述於其中之各元件的例示性閘階層及M2階層之佈局形狀;
依據本發明之實施例,圖5為顯示定義不同元件相位之元件版本以使元件能夠在依據動態陣列結構所定義之半導體晶片區域內配置之方法的流程圖;
依據本發明之實施例,圖6為顯示於依據動態陣列結構所定義的部分半導體晶片內配置元件之方法的流程圖;
依據本發明之實施例,圖7為顯示在定義於DAS內之鄰接配置之邏輯元件的第二內連線階層中不同相位調整之例子的圖;
依據本發明之實施例,圖8顯示定義於動態陣列結構內的虛擬線路之例子。
501...基於相位調整之晶片階層之虛擬格柵之間的有理空間關係來識別相位空間
503...將元件左邊界對準相位空間之左邊緣
505...在元件之左邊界對準相位空間之左邊緣的情況下,基於與相位調整晶片階層相關之虛擬格柵位置來定義元件之第一相位
507...橫越相位空間將元件左邊界移動至相位空間內的左元件邊界之下一個可能位置,而不移動相位調整之晶片階層的虛擬格柵
509...在元件之左邊界移動至相位空間中下一個位置的情況下,基於與相位調整晶片階層相關之虛擬格柵位置來定義元件之下一個相位
511...是否有左元件邊界之另一可能位置存在於相位空間內
Claims (39)
- 一種半導體晶片,包含:一邏輯區塊區域,包含:一第一晶片階層,佈局特徵部係依據一第一虛擬格柵而配置於該第一晶片階層中,及一第二晶片階層,佈局特徵部係依據一第二虛擬格柵而配置於該第二晶片階層中,其中一有理空間關係存在於該第一及第二虛擬格柵之間;及數個元件,其係置於該邏輯區塊區域內,其中該數個元件之每一者係依據數個元件相位中之合適者而定義,其中當佈局特徵部被安置於既定配置元件內時,該數個元件相位中之該合適者使該既定配置元件之該第一及第二晶片階層中的佈局特徵部對準該第一及第二虛擬格柵。
- 如申請專利範圍第1項之半導體晶片,其中該第一虛擬格柵係藉由第一組相同間隔、平行的虛擬線路橫越該邏輯區塊區域中的該第一晶片階層來定義,而其中該第二虛擬格柵係藉由第二組相同間隔、平行的虛擬線路橫越該邏輯區塊區域中的該第二晶片階層來定義。
- 如申請專利範圍第1項之半導體晶片,其中該第一及第二虛擬格柵之間的該有理空間關係表示該第一及第二虛擬格柵為通常方位、被定位至一通常空間位置、且具有由有理數所定義之它們的虛擬格柵節距之比率。
- 如申請專利範圍第3項之半導體晶片,其中該第一及第二虛擬格柵週期性地依據該有理空間關係互相對準。
- 如申請專利範圍第3項之半導體晶片,其中在該數個元件相位之任一者中,該第一及第二虛擬格柵並不互相對準。
- 如申請專利範圍第1項之半導體晶片,其中依據該數個元件相位之任一者所定義的一既定元件係定義以執行與該既定元件相關之相同邏輯功能。
- 如申請專利範圍第1項之半導體晶片,其中該數個元件係於該邏輯區塊區域內設置成列,以使界面元件邊界互相對準。
- 如申請專利範圍第1項之半導體晶片,其中該數個元件之每一者的高度一致,且其中該數個元件之每一者的高度係在平行於該第一及第二虛擬格柵之虛擬線路之方向上量測。
- 如申請專利範圍第1項之半導體晶片,其中該數個元件之每一者的寬度為該第一虛擬格柵之節距的整數倍,且其中平行於該第一虛擬格柵之虛擬線路的各配置元件之各邊界乃對準該第一虛擬格柵之虛擬線路。
- 如申請專利範圍第1項之半導體晶片,其中該數個元件之每一者的寬度為該第一虛擬格柵之節距的整數倍,且其中平行於該第一虛擬格柵之虛擬線路的各配置元件之各邊界乃對準該第一虛擬格柵之鄰接虛擬線路之間的中點。
- 如申請專利範圍第1項之半導體晶片,其中該數個元件之每一者的寬度為該第一虛擬格柵之半節距的整數倍,且其中平行於該第一虛擬格柵之虛擬線路的各配置元件之各邊界乃對準該第一虛擬格柵之虛擬線路或該第一虛擬格柵之鄰接虛擬線路之間的中點。
- 如申請專利範圍第1項之半導體晶片,其中該數個元件相位之每一者係藉由該第一晶片階層之第一索引值以及該第二晶片階層之第二索引值而定義,其中該第一索引值等於一第一距離,其從該既定配置元件之左邊界向右垂直延伸到該第一虛擬格柵之最近的虛擬線路,而其中該第二索引值等於一第二距離,其從該既定配置元件之左邊界向右垂直延伸到該第二虛擬格柵之最近的虛擬線路。
- 如申請專利範圍第1項之半導體晶片,其中該第一晶片階層為該晶片之閘階層,而該第二晶片階層為該晶片之第二內連線階層。
- 如申請專利範圍第13項之半導體晶片,其中該第一及第二虛擬格柵之間的該有理空間關係由3/4之該第二內連線階層與該閘階層之間的虛擬格柵節距比率所定義。
- 如申請專利範圍第1項之半導體晶片,其中某些該數個元件包含至少一佈局特徵部,其沿著平行於該第一及第二虛擬格柵之虛擬線路的元件邊界以本質上位於中心之方式配置,且存在於該第一晶片階層或該第二晶片階層中。
- 一種定義不同元件相位之元件版本以使元件配置於半導體晶片之指定區域內的方法,包含:a)針對該半導體晶片之該指定區域識別一相位空間,其中該相位空間係定義為在該半導體晶片之該指定區域內具有一有理空間關係之兩虛擬格柵之間的相同關係連續出現之間的垂直延伸距離;b)將主要元件之左邊界對準該相位空間之左邊緣;c)在該主要元件之左邊界對準該相位空間之左邊緣的情況下,基於該兩虛擬格柵相對於該主要元件之左邊界的位置來定義該主要元件之第一相位;d)將該主要元件之該第一相位儲存於元件庫中;e)將該主要元件之左邊界從其目前位置橫越該相位空間移動至該相位空間內該主要元件之左邊界之下一個可能位置;f)在該主要元件之左邊界對準該下一個可能位置的情況下,基於該兩虛擬格柵相對於該主要元件之左邊界的位置來定義該主要元件之下一個相位;g)將該主要元件之該下一個相位儲存於該元件庫中;及h)對於該相位空間內該主要元件之左邊界之各可能位置重複作業e)到g)。
- 如申請專利範圍第16項之定義不同元件相位之元件版本以使元件配置於半導體晶片之指定區域內的方法,其中該兩虛擬格柵之每一者係藉由各組相同間隔、平行的虛擬線路橫越該半導體晶片之該指定區域中的各晶片階層來定義。
- 如申請專利範圍第16項之定義不同元件相位之元件版本以使元件配置於半導體晶片之指定區域內的方法,其中該兩虛擬格柵之間的該有理空間關係表示該兩虛擬格柵為通常方位、被定位至該半導體晶片上的一通常空間位置、且具有由有理數所定義之它們的虛擬格柵節距之比率。
- 如申請專利範圍第16項之定義不同元件相位之元件版本以使元件配置於半導體晶片之指定區域內的方法,其中該主要元件之既定相位表示該主要元件之版本,其被定義以配置在需要該主要元件之該既定相位的該半導體晶片之該指定區域中,且其中該主要元件之各相位被定義以執行與該主要元件相關之相同邏輯功能。
- 如申請專利範圍第16項之定義不同元件相位之元件版本以使元件配置於半導體晶片之指定區域內的方法,其中該主要元件之各相位係由一組索引值加以特徵化,該組索引值包含針對定義該相位空間之該兩虛擬格柵之每一者的各索引值,其中針對在該主要元件之特定相位中一特定虛擬格柵之索引值係定義為:該主要元件之左邊界與該相位空間內該特定虛擬格柵之最近的虛擬線路之間垂直量測的距離。
- 如申請專利範圍第16項之定義不同元件相位之元件版本以使元件配置於半導體晶片之指定區域內的方法,其中於該相位空間內該主要元件之左邊界之一組可能位置包含相對於該相位空間內該兩虛擬格柵之其中一者的各允許之元件邊界位置。
- 如申請專利範圍第16項之定義不同元件相位之元件版本以使元件配置於半導體晶片之指定區域內的方法,其中針對該半導體晶片之閘階層定義該兩虛擬格柵之第一虛擬格柵,且其中針對該半導體晶片之第二內連線階層定義該兩虛擬格柵之第二虛擬格柵。
- 如申請專利範圍第22項之定義不同元件相位之元件版本以使元件配置於半導體晶片之指定區域內的方法,其中該第一及第二虛擬格柵之間的該有理空間關係由3/4之該第二內連線階層與該閘階層之間的虛擬格柵節距比率所定義。
- 如申請專利範圍第16項之定義不同元件相位之元件版本以使元件配置於半導體晶片之指定區域內的方法,其中將該元件庫以數位格式儲存於一電腦可讀媒體。
- 一種在半導體晶片之指定區域內配置元件之方法,包含:在該半導體晶片之該指定區域內分別定義兩相位調整之晶片階層之每一者的虛擬格柵,其中該兩相位調整之晶片階層之該虛擬格柵被定義為具有一有理空間關係;配置元件於該半導體晶片之該指定區域內;決定該半導體晶片之該指定區域內各配置元件所需的元件相位;及以具有該所需的元件相位之配置元件之版本代替該半導體晶片之該指定區域內的各配置元件,以使在該配置元件之替代版本內在該兩相位調整之晶片階層之每一者中的佈局特徵部對準該兩相位調整之晶片階層之該虛擬格柵。
- 如申請專利範圍第25項之在半導體晶片之指定區域內配置元件之方法,其中該虛擬格柵之每一者係藉由各組相同間隔、平行的虛擬線路橫越該半導體晶片之該指定區域中其相對應之相位調整之晶片階層來定義,且其中該兩相位調整之晶片階層之間的該有理空間關係表示該兩相位調整之晶片階層之該虛擬格柵為通常方位、被定位至該半導體晶片上的一通常空間位置、且具有由有理數所定義之它們的虛擬格柵節距之比率。
- 如申請專利範圍第25項之在半導體晶片之指定區域內配置元件之方法,其中該兩相位調整之晶片階層各自對應至一閘階層及一第二內連線階層。
- 如申請專利範圍第25項之在半導體晶片之指定區域內配置元件之方法,其中該兩相位調整之晶片階層兩者皆定位至該半導體晶片之該指定區域之左下角,且使它們的虛擬格柵定位以垂直延伸橫越該半導體晶片之該指定區域,且其中元件被設置成列,水平延伸橫越該半導體晶片之該指定區域,以使各元件之寬度在垂直於該兩相位調整之晶片階層之該虛擬格柵的方向被量測。
- 如申請專利範圍第25項之在半導體晶片之指定區域內配置元件之方法,其中該兩相位調整之晶片階層中之較低者的該虛擬格柵定義一基底虛擬格柵,且其中各元件被定義為具有該基底虛擬格柵之節距之整數倍的寬度,且其中各元件被配置以使其平行於該基底虛擬格柵之虛擬線路的元件邊界對準該基底虛擬格柵之鄰接虛擬線路之間的中點。
- 如申請專利範圍第25項之在半導體晶片之指定區域內配置元件之方法,其中該兩相位調整之晶片階層中之較低者的該虛擬格柵定義一基底虛擬格柵,且其中各元件被定義為具有該基底虛擬格柵之半節距之整數倍的寬度,且其中各元件被配置以使其平行於該基底虛擬格柵之虛擬線路的元件邊界對準該基底虛擬格柵之鄰接虛擬線路之間的中點或該基底虛擬格柵之虛擬線路。
- 如申請專利範圍第25項之在半導體晶片之指定區域內配置元件之方法,其中一既定之配置元件之該所需的元件相位係藉由針對該兩相位調整之晶片階層的各索引值所識別,其中針對該配置元件內特定相位調整之晶片階層之索引值係定義為在該配置元件之左邊界與該特定相位調整之晶片階層之該虛擬格柵之最近的虛擬線路之間向右垂直量測的距離。
- 如申請專利範圍第25項之在半導體晶片之指定區域內配置元件之方法,更包含:對於各配置元件,計算該配置元件之針對該兩相位調整晶片階層的索引值;及比較該計算索引值與元件庫內該配置元件之版本之相對應的索引值,以識別具有匹配索引值之該配置元件之特定版本,其中該配置元件之該特定版本在該半導體晶片之該指定區域中代替該配置元件。
- 一種電腦可讀儲存媒體,包含:一半導體晶片佈局,其係以數位格式記錄,其中該半導體晶片佈局包含一邏輯區塊區域,其包含:第一晶片階層,佈局特徵部係依據第一虛擬格柵而配置於其中;及第二晶片階層,佈局特徵部係依據第二虛擬格柵而配置於其中,其中一有理空間關係存在於該第一及第二虛擬格柵之間,及其中該半導體晶片佈局亦包含置於該邏輯區塊區域內的數個元件,其中該數個元件之每一者係依據數個元件相位中之合適者而定義,其中當佈局特徵部被安置於既定之配置元件內時,該數個元件相位中之合適者使該既定之配置元件之該第一及第二晶片階層中的佈局特徵部對準該第一及第二虛擬格柵。
- 如申請專利範圍第33項之電腦可讀儲存媒體,其中該數位格式為用以儲存及傳遞一個以上之半導體裝置佈局的資料檔案格式。
- 如申請專利範圍第33項之電腦可讀儲存媒體,其中該電腦可讀媒體包含用以從該電腦可讀媒體以該數位格式存取及檢索該半導體晶片佈局或其一部分的程式指令。
- 如申請專利範圍第35項之電腦可讀儲存媒體,其中用以存取及檢索之該程式指令包含用以選取包含該數位格式之該半導體晶片佈局之可選部分之庫、元件、或庫及元件兩者之程式指令。
- 一種以數位格式儲存於電腦可讀儲存媒體中的元件庫,包含:複數之元件佈局,其對應至既定元件之不同相位,其中該既定元件包含至少一晶片階層,佈局特徵部係依據一虛擬格柵而配置於該晶片階層中,其中該虛擬格柵係藉由橫越該元件佈局之一組平行之相同間隔的虛擬線路來定義,且其中該既定元件之各不同相位係藉由一參考元件邊界與該虛擬格柵之最近的虛擬線路之間的不同間隔而定義。
- 如申請專利範圍第37項之以數位格式儲存於電腦可讀儲存媒體中的元件庫,其中依據該虛擬格柵配置的任何既定佈局特徵部係定義於一特徵部佈局通道內,該通道沿著該虛擬格柵之既定虛擬線路縱長地延伸,且在鄰接該既定虛擬線路之鄰近的虛擬線路之間橫向地延伸。
- 如申請專利範圍第38項之以數位格式儲存於電腦可讀儲存媒體中的元件庫,其中禁止定義於一既定特徵部佈局通道內的各佈局特徵部與定義於任何其他特徵部佈局通道內的任何其他佈局特徵部有實體接觸。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8137008P | 2008-07-16 | 2008-07-16 | |
US12/497,052 US8214778B2 (en) | 2007-08-02 | 2009-07-02 | Methods for cell phasing and placement in dynamic array architecture and implementation of the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201020836A TW201020836A (en) | 2010-06-01 |
TWI402709B true TWI402709B (zh) | 2013-07-21 |
Family
ID=41550966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098124107A TWI402709B (zh) | 2008-07-16 | 2009-07-16 | 動態陣列結構內之元件相位調整與配置方法及其實施 |
Country Status (8)
Country | Link |
---|---|
US (6) | US8214778B2 (zh) |
EP (1) | EP2321748B1 (zh) |
JP (4) | JP5599395B2 (zh) |
KR (4) | KR101903975B1 (zh) |
MY (2) | MY167970A (zh) |
SG (2) | SG10201608214SA (zh) |
TW (1) | TWI402709B (zh) |
WO (1) | WO2010008948A2 (zh) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7448012B1 (en) | 2004-04-21 | 2008-11-04 | Qi-De Qian | Methods and system for improving integrated circuit layout |
US9563733B2 (en) | 2009-05-06 | 2017-02-07 | Tela Innovations, Inc. | Cell circuit and layout with linear finfet structures |
US9230910B2 (en) | 2006-03-09 | 2016-01-05 | Tela Innovations, Inc. | Oversized contacts and vias in layout defined by linearly constrained topology |
US7763534B2 (en) | 2007-10-26 | 2010-07-27 | Tela Innovations, Inc. | Methods, structures and designs for self-aligning local interconnects used in integrated circuits |
US9009641B2 (en) | 2006-03-09 | 2015-04-14 | Tela Innovations, Inc. | Circuits with linear finfet structures |
US7908578B2 (en) | 2007-08-02 | 2011-03-15 | Tela Innovations, Inc. | Methods for designing semiconductor device with dynamic array section |
US7446352B2 (en) | 2006-03-09 | 2008-11-04 | Tela Innovations, Inc. | Dynamic array architecture |
US7956421B2 (en) | 2008-03-13 | 2011-06-07 | Tela Innovations, Inc. | Cross-coupled transistor layouts in restricted gate level layout architecture |
US8541879B2 (en) | 2007-12-13 | 2013-09-24 | Tela Innovations, Inc. | Super-self-aligned contacts and method for making the same |
US8448102B2 (en) | 2006-03-09 | 2013-05-21 | Tela Innovations, Inc. | Optimizing layout of irregular structures in regular layout context |
US9035359B2 (en) | 2006-03-09 | 2015-05-19 | Tela Innovations, Inc. | Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods |
US8839175B2 (en) | 2006-03-09 | 2014-09-16 | Tela Innovations, Inc. | Scalable meta-data objects |
US8653857B2 (en) | 2006-03-09 | 2014-02-18 | Tela Innovations, Inc. | Circuitry and layouts for XOR and XNOR logic |
US8658542B2 (en) | 2006-03-09 | 2014-02-25 | Tela Innovations, Inc. | Coarse grid design methods and structures |
US8667443B2 (en) | 2007-03-05 | 2014-03-04 | Tela Innovations, Inc. | Integrated circuit cell library for multiple patterning |
US8453094B2 (en) | 2008-01-31 | 2013-05-28 | Tela Innovations, Inc. | Enforcement of semiconductor structure regularity for localized transistors and interconnect |
US7939443B2 (en) | 2008-03-27 | 2011-05-10 | Tela Innovations, Inc. | Methods for multi-wire routing and apparatus implementing same |
KR101903975B1 (ko) | 2008-07-16 | 2018-10-04 | 텔라 이노베이션스, 인코포레이티드 | 동적 어레이 아키텍쳐에서의 셀 페이징과 배치를 위한 방법 및 그 구현 |
US9122832B2 (en) | 2008-08-01 | 2015-09-01 | Tela Innovations, Inc. | Methods for controlling microloading variation in semiconductor wafer layout and fabrication |
US8631377B2 (en) * | 2009-05-14 | 2014-01-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for designing cell rows with differing cell heights |
US8661392B2 (en) * | 2009-10-13 | 2014-02-25 | Tela Innovations, Inc. | Methods for cell boundary encroachment and layouts implementing the Same |
US9159627B2 (en) | 2010-11-12 | 2015-10-13 | Tela Innovations, Inc. | Methods for linewidth modification and apparatus implementing the same |
KR101888940B1 (ko) * | 2012-03-28 | 2018-08-17 | 삼성전자주식회사 | 패턴 레이아웃을 디자인하는 방법 |
US20140167815A1 (en) * | 2012-12-18 | 2014-06-19 | Broadcom Corporation | Area reconfigurable cells of a standard cell library |
US8739104B1 (en) * | 2013-02-28 | 2014-05-27 | Broadcom Corporation | Systems and methods for forming an integrated circuit using a standard cell library |
US9254998B2 (en) * | 2013-03-11 | 2016-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS device with a capping substrate |
US9501600B2 (en) * | 2013-05-02 | 2016-11-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Standard cells for predetermined function having different types of layout |
US9245076B2 (en) * | 2013-06-03 | 2016-01-26 | International Business Machines Corporation | Orthogonal circuit element routing |
KR101579467B1 (ko) | 2014-02-27 | 2016-01-04 | 엘지전자 주식회사 | 디지털 디바이스 및 그의 서비스 처리 방법 |
US9361418B2 (en) * | 2014-06-23 | 2016-06-07 | Synopsys, Inc. | Nanowire or 2D material strips interconnects in an integrated circuit cell |
US9378320B2 (en) | 2014-06-23 | 2016-06-28 | Synopsys, Inc. | Array with intercell conductors including nanowires or 2D material strips |
US10037397B2 (en) | 2014-06-23 | 2018-07-31 | Synopsys, Inc. | Memory cell including vertical transistors and horizontal nanowire bit lines |
US9400862B2 (en) * | 2014-06-23 | 2016-07-26 | Synopsys, Inc. | Cells having transistors and interconnects including nanowires or 2D material strips |
US9449136B2 (en) * | 2015-01-20 | 2016-09-20 | Yu-Hsiang Pan | Integrated circuit layout structure and method having different cell row heights with different row ratios for area optimization |
US9684754B2 (en) * | 2015-10-02 | 2017-06-20 | Arm Limited | Standard cell architecture layout |
US10282503B2 (en) * | 2016-06-25 | 2019-05-07 | Qualcomm Incorporated | Mitigating length-of-diffusion effect for logic cells and placement thereof |
US9977854B2 (en) * | 2016-07-12 | 2018-05-22 | Ati Technologies Ulc | Integrated circuit implementing standard cells with metal layer segments extending out of cell boundary |
US10312229B2 (en) | 2016-10-28 | 2019-06-04 | Synopsys, Inc. | Memory cells including vertical nanowire transistors |
US10402530B1 (en) | 2016-12-30 | 2019-09-03 | Cadence Design Systems, Inc. | Method, system, and computer program product for implementing placement using row templates for an electronic design |
US10503858B1 (en) * | 2016-12-30 | 2019-12-10 | Cadence Design Systems, Inc. | Method, system, and computer program product for implementing group legal placement on rows and grids for an electronic design |
US10515180B1 (en) | 2016-12-30 | 2019-12-24 | Cadence Design Systems, Inc. | Method, system, and computer program product to implement snapping for an electronic design |
US10346943B2 (en) * | 2017-01-03 | 2019-07-09 | Microsoft Technology Licensing, Llc | Prefetching for a graphics shader |
US10452807B1 (en) | 2017-03-31 | 2019-10-22 | Cadence Design Systems, Inc. | Method, system, and computer program product for implementing routing aware placement for an electronic design |
US10642949B2 (en) * | 2017-06-07 | 2020-05-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Cell placement site optimization |
KR20230132607A (ko) * | 2017-06-20 | 2023-09-15 | 인텔 코포레이션 | 메모리 비트 셀들을 위한 내부 노드 점퍼 |
US10515177B1 (en) | 2017-06-29 | 2019-12-24 | Cadence Design Systems, Inc. | Method, system, and computer program product for implementing routing aware placement or floor planning for an electronic design |
US10741539B2 (en) * | 2017-08-30 | 2020-08-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Standard cells and variations thereof within a standard cell library |
DE102017127276A1 (de) * | 2017-08-30 | 2019-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Standardzellen und abwandlungen davon innerhalb einer standardzellenbibliothek |
KR20200044810A (ko) | 2017-09-20 | 2020-04-29 | 인텔 코포레이션 | 멀티 버전 라이브러리 셀 핸들링 및 그로부터 제조된 집적 회로 구조들 |
US10628544B2 (en) * | 2017-09-25 | 2020-04-21 | International Business Machines Corporation | Optimizing integrated circuit designs based on interactions between multiple integration design rules |
KR101966949B1 (ko) | 2017-11-15 | 2019-04-09 | (주)티에스이 | 스마트폰 보호 케이스 및 이의 제조방법 |
US10495443B1 (en) * | 2018-07-26 | 2019-12-03 | Qiagen Sciences, Llc | Fiducial marking system |
KR102628894B1 (ko) * | 2018-12-05 | 2024-01-24 | 삼성전자주식회사 | 단위 배선 구조를 갖는 집적 회로, 그 제조 방법 및 설계 방법 |
KR20200130020A (ko) | 2019-05-10 | 2020-11-18 | 삼성전자주식회사 | 하우징, 하우징 제조 방법 및 그것을 포함하는 전자 장치 |
KR20210128842A (ko) | 2020-04-17 | 2021-10-27 | 삼성전자주식회사 | 금속 하우징을 포함하는 전자 장치 |
US11403454B2 (en) * | 2020-11-09 | 2022-08-02 | Synopsys, Inc. | Placement and simulation of cell in proximity to cell with diffusion break |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7028285B2 (en) * | 2000-07-05 | 2006-04-11 | Synopsys, Inc. | Standard cell design incorporating phase information |
TW200813587A (en) * | 2006-07-19 | 2008-03-16 | Koninkl Philips Electronics Nv | Arrays of particle containing cells |
Family Cites Families (697)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3521242A (en) | 1967-05-02 | 1970-07-21 | Rca Corp | Complementary transistor write and ndro for memory cell |
US4069493A (en) | 1970-10-02 | 1978-01-17 | Thomson-Csf | Novel integrated circuit and method of manufacturing same |
US4197555A (en) | 1975-12-29 | 1980-04-08 | Fujitsu Limited | Semiconductor device |
JPS5746536A (en) | 1980-09-04 | 1982-03-17 | Matsushita Electric Ind Co Ltd | Gate circuit |
US4424460A (en) * | 1981-07-14 | 1984-01-03 | Rockwell International Corporation | Apparatus and method for providing a logical exclusive OR/exclusive NOR function |
JPS5943824B2 (ja) | 1982-03-03 | 1984-10-24 | 三菱電機株式会社 | 半導体集積回路装置 |
JPS58182242A (ja) | 1982-04-19 | 1983-10-25 | Nec Corp | 半導体集積回路装置 |
JPS58182242U (ja) | 1982-05-28 | 1983-12-05 | パイオニア株式会社 | スライドロツク付プツシユボタン |
JPS58215827A (ja) | 1982-06-09 | 1983-12-15 | Toshiba Corp | 論理回路 |
JPS5943548A (ja) | 1982-09-06 | 1984-03-10 | Hitachi Ltd | 半導体集積回路装置 |
US4613940A (en) | 1982-11-09 | 1986-09-23 | International Microelectronic Products | Method and structure for use in designing and building electronic systems in integrated circuits |
JPS6035532A (ja) | 1983-07-29 | 1985-02-23 | Fujitsu Ltd | マスタスライス集積回路装置 |
US4575648A (en) | 1983-12-23 | 1986-03-11 | At&T Bell Laboratories | Complementary field effect transistor EXCLUSIVE OR logic gates |
US5121186A (en) | 1984-06-15 | 1992-06-09 | Hewlett-Packard Company | Integrated circuit device having improved junction connections |
KR940002772B1 (ko) | 1984-08-31 | 1994-04-02 | 가부시기가이샤 히다찌세이사꾸쇼 | 반도체 집적회로 장치 및 그 제조방법 |
US5545904A (en) | 1986-01-17 | 1996-08-13 | Quick Technologies Ltd. | Personalizable gate array devices |
JPH0695570B2 (ja) | 1985-02-07 | 1994-11-24 | 三菱電機株式会社 | 半導体集積回路装置 |
JPS61202451A (ja) * | 1985-03-05 | 1986-09-08 | Nec Corp | 半導体集積回路の配線構体 |
US4657628A (en) | 1985-05-01 | 1987-04-14 | Texas Instruments Incorporated | Process for patterning local interconnects |
US4975756A (en) | 1985-05-01 | 1990-12-04 | Texas Instruments Incorporated | SRAM with local interconnect |
US4804636A (en) | 1985-05-01 | 1989-02-14 | Texas Instruments Incorporated | Process for making integrated circuits having titanium nitride triple interconnect |
JPH0216605Y2 (zh) | 1985-05-02 | 1990-05-08 | ||
US4602270A (en) | 1985-05-17 | 1986-07-22 | United Technologies Corporation | Gate array with reduced isolation |
JPS6247148A (ja) * | 1985-08-27 | 1987-02-28 | Toshiba Corp | 半導体集積回路装置 |
JPS62169472A (ja) | 1986-01-22 | 1987-07-25 | Hitachi Ltd | 半導体集積回路装置 |
US5097422A (en) | 1986-10-10 | 1992-03-17 | Cascade Design Automation Corporation | Method and apparatus for designing integrated circuits |
US4745084A (en) | 1986-11-12 | 1988-05-17 | Vlsi Technology, Inc. | Method of making a customized semiconductor integrated device |
US4884115A (en) | 1987-02-27 | 1989-11-28 | Siemens Aktiengesellschaft | Basic cell for a gate array arrangement in CMOS Technology |
US4801986A (en) * | 1987-04-03 | 1989-01-31 | General Electric Company | Vertical double diffused metal oxide semiconductor VDMOS device with increased safe operating area and method |
JP2742052B2 (ja) | 1987-06-12 | 1998-04-22 | 日本電信電話株式会社 | 相補型misマスタスライス論理集積回路 |
JPH067345B2 (ja) | 1987-06-24 | 1994-01-26 | 株式会社 エイ・ティ・ア−ル自動翻訳電話研究所 | ベクトル量子化を用いた音声認識方式 |
US5119313A (en) | 1987-08-04 | 1992-06-02 | Texas Instruments Incorporated | Comprehensive logic circuit layout system |
KR100212098B1 (ko) | 1987-09-19 | 1999-08-02 | 가나이 쓰도무 | 반도체 집적회로 장치 및 그 제조 방법과 반도체 집적 회로 장치의 배선기판 및 그 제조 방법 |
US5068603A (en) | 1987-10-07 | 1991-11-26 | Xilinx, Inc. | Structure and method for producing mask-programmed integrated circuits which are pin compatible substitutes for memory-configured logic arrays |
US4812688A (en) | 1987-12-30 | 1989-03-14 | International Business Machines Corporation | Transistor delay circuits |
JPH01284115A (ja) | 1988-05-11 | 1989-11-15 | Sharp Corp | 論理回路 |
US5268319A (en) | 1988-06-08 | 1993-12-07 | Eliyahou Harari | Highly compact EPROM and flash EEPROM devices |
JPH0289342A (ja) * | 1988-09-27 | 1990-03-29 | Nec Corp | スタンダードセル上配線通過位置登録方法 |
US4928160A (en) | 1989-01-17 | 1990-05-22 | Ncr Corporation | Gate isolated base cell structure with off-grid gate polysilicon pattern |
JPH02198154A (ja) | 1989-01-27 | 1990-08-06 | Hitachi Ltd | 配線の形成方法及びこれを利用した半導体装置 |
US5224057A (en) | 1989-02-28 | 1993-06-29 | Kabushiki Kaisha Toshiba | Arrangement method for logic cells in semiconductor IC device |
US5351197A (en) * | 1989-04-13 | 1994-09-27 | Cascade Design Automation Corporation | Method and apparatus for designing the layout of a subcircuit in an integrated circuit |
JPH03165061A (ja) | 1989-11-22 | 1991-07-17 | Hitachi Ltd | 半導体集積回路装置 |
US5298774A (en) | 1990-01-11 | 1994-03-29 | Mitsubishi Denki Kabushiki Kaisha | Gate array system semiconductor integrated circuit device |
US5483104A (en) | 1990-01-12 | 1996-01-09 | Paradigm Technology, Inc. | Self-aligning contact and interconnect structure |
KR100199258B1 (ko) | 1990-02-09 | 1999-06-15 | 가나이 쓰도무 | 반도체집적회로장치 |
US6100025A (en) | 1990-04-20 | 2000-08-08 | Cold Spring Harbor Laboratory | Cloning by complementation and related processes |
US5977305A (en) | 1990-04-20 | 1999-11-02 | Cold Spring Harbor Laboratories | Cloning by complementation and related processes |
US5047979A (en) | 1990-06-15 | 1991-09-10 | Integrated Device Technology, Inc. | High density SRAM circuit with ratio independent memory cells |
US5208765A (en) | 1990-07-20 | 1993-05-04 | Advanced Micro Devices, Inc. | Computer-based method and system for product development |
US5079614A (en) | 1990-09-26 | 1992-01-07 | S-Mos Systems, Inc. | Gate array architecture with basic cell interleaved gate electrodes |
JP3017789B2 (ja) | 1990-10-18 | 2000-03-13 | 三菱電機株式会社 | 半導体集積回路装置のレイアウト設計方法 |
JP2851447B2 (ja) | 1991-03-08 | 1999-01-27 | 三菱電機株式会社 | 形状シミュレーション方法 |
JPH05152937A (ja) | 1991-11-26 | 1993-06-18 | Hitachi Ltd | 論理ゲート回路 |
JP3129336B2 (ja) | 1991-12-09 | 2001-01-29 | 沖電気工業株式会社 | 半導体記憶装置 |
US7071060B1 (en) | 1996-02-28 | 2006-07-04 | Sandisk Corporation | EEPROM with split gate source side infection with sidewall spacers |
US5242770A (en) | 1992-01-16 | 1993-09-07 | Microunity Systems Engineering, Inc. | Mask for photolithography |
JP2760195B2 (ja) | 1992-01-20 | 1998-05-28 | 日本電気株式会社 | 論理回路 |
US5526307A (en) | 1992-01-22 | 1996-06-11 | Macronix International Co., Ltd. | Flash EPROM integrated circuit architecture |
JPH05218362A (ja) | 1992-02-04 | 1993-08-27 | Sharp Corp | ゲートアレイのベーシックセル |
US5367187A (en) | 1992-12-22 | 1994-11-22 | Quality Semiconductor, Inc. | Master slice gate array integrated circuits with basic cells adaptable for both input/output and logic functions |
IT1257184B (it) | 1992-12-22 | 1996-01-10 | Applied Research Systems | Preparato ad attivita' antinfiammatoria, anticoagulante e antitumorale |
US5420447A (en) | 1993-01-29 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Double buffer base gate array cell |
US5359226A (en) | 1993-02-02 | 1994-10-25 | Paradigm Technology, Inc. | Static memory with self aligned contacts and split word lines |
US5497334A (en) | 1993-02-19 | 1996-03-05 | International Business Machines Corporation | Application generator for use in verifying a hierarchical circuit design |
US5410107A (en) | 1993-03-01 | 1995-04-25 | The Board Of Trustees Of The University Of Arkansas | Multichip module |
US5723908A (en) | 1993-03-11 | 1998-03-03 | Kabushiki Kaisha Toshiba | Multilayer wiring structure |
US5536955A (en) | 1993-03-29 | 1996-07-16 | Toppan Electronics (Usa) Inc. | Electronic devices for use in generating integrated circuit structures and method therefor |
US5338963A (en) | 1993-04-05 | 1994-08-16 | International Business Machines Corporation | Soft error immune CMOS static RAM cell |
US5691218A (en) | 1993-07-01 | 1997-11-25 | Lsi Logic Corporation | Method of fabricating a programmable polysilicon gate array base cell structure |
US5396128A (en) | 1993-09-13 | 1995-03-07 | Motorola, Inc. | Output circuit for interfacing integrated circuits having different power supply potentials |
JP3285438B2 (ja) | 1993-10-29 | 2002-05-27 | 三菱電機株式会社 | 半導体記憶装置 |
JP3144967B2 (ja) | 1993-11-08 | 2001-03-12 | 株式会社日立製作所 | 半導体集積回路およびその製造方法 |
JP2746087B2 (ja) | 1993-12-01 | 1998-04-28 | 日本電気株式会社 | 半導体集積回路 |
US5625568A (en) | 1993-12-22 | 1997-04-29 | Vlsi Technology, Inc. | Method and apparatus for compacting integrated circuits with standard cell architectures |
JP2684980B2 (ja) | 1993-12-24 | 1997-12-03 | 日本電気株式会社 | 半導体記憶装置及びその製造方法 |
US6675361B1 (en) | 1993-12-27 | 2004-01-06 | Hyundai Electronics America | Method of constructing an integrated circuit comprising an embedded macro |
US5378649A (en) * | 1994-04-08 | 1995-01-03 | United Microelectronics Corporation | Process for producing non-volatile memory devices having closely spaced buried bit lines and non-overlapping code implant areas |
US5636002A (en) | 1994-04-29 | 1997-06-03 | Lucent Technologies Inc. | Auxiliary mask features for enhancing the resolution of photolithography |
JP3463180B2 (ja) | 1994-05-02 | 2003-11-05 | Necトーキン株式会社 | 磁性ガーネット酸化物粉末の製造方法及び磁性ガーネット酸化物膜の製造方法 |
US5591995A (en) | 1994-05-10 | 1997-01-07 | Texas Instruments, Incorporated | Base cell for BiCMOS and CMOS gate arrays |
TW297158B (zh) | 1994-05-27 | 1997-02-01 | Hitachi Ltd | |
JP3202490B2 (ja) | 1994-07-22 | 2001-08-27 | 株式会社東芝 | 集積回路のレイアウト方法及び集積回路のレイアウト装置 |
JP3469362B2 (ja) | 1994-08-31 | 2003-11-25 | 株式会社東芝 | 半導体記憶装置 |
US5528177A (en) | 1994-09-16 | 1996-06-18 | Research Foundation Of State University Of New York | Complementary field-effect transistor logic circuits for wave pipelining |
US5497337A (en) | 1994-10-21 | 1996-03-05 | International Business Machines Corporation | Method for designing high-Q inductors in silicon technology without expensive metalization |
US5852562A (en) * | 1994-12-13 | 1998-12-22 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for designing an LSI layout utilizing cells having a predetermined wiring height in order to reduce wiring zones |
JPH08292938A (ja) | 1995-02-24 | 1996-11-05 | Fujitsu Ltd | 有限要素メッシュ発生方法及び装置、並びに解析方法及び装置 |
JP2647045B2 (ja) | 1995-02-28 | 1997-08-27 | 日本電気株式会社 | 半導体記憶装置及びその製造方法 |
US5682323A (en) | 1995-03-06 | 1997-10-28 | Lsi Logic Corporation | System and method for performing optical proximity correction on macrocell libraries |
US5581098A (en) | 1995-05-05 | 1996-12-03 | Circuit Integration Technology, Inc. | Circuit routing structure using fewer variable masks |
JP3708168B2 (ja) | 1995-06-13 | 2005-10-19 | 富士通株式会社 | 遅延装置 |
JP3535615B2 (ja) | 1995-07-18 | 2004-06-07 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
US5774367A (en) | 1995-07-24 | 1998-06-30 | Motorola, Inc. | Method of selecting device threshold voltages for high speed and low power |
US5764533A (en) | 1995-08-01 | 1998-06-09 | Sun Microsystems, Inc. | Apparatus and methods for generating cell layouts |
US5754826A (en) | 1995-08-04 | 1998-05-19 | Synopsys, Inc. | CAD and simulation system for targeting IC designs to multiple fabrication processes |
US5841663A (en) | 1995-09-14 | 1998-11-24 | Vlsi Technology, Inc. | Apparatus and method for synthesizing integrated circuits using parameterized HDL modules |
US5789776A (en) | 1995-09-22 | 1998-08-04 | Nvx Corporation | Single poly memory cell and array |
JPH0993118A (ja) | 1995-09-22 | 1997-04-04 | Kawasaki Steel Corp | パストランジスタ論理回路 |
JPH0997885A (ja) | 1995-09-28 | 1997-04-08 | Denso Corp | ゲートアレイ |
US5973369A (en) | 1997-03-11 | 1999-10-26 | Nec Corporation | SRAM having P-channel TFT as load element with less series-connected high resistance |
US5723883A (en) | 1995-11-14 | 1998-03-03 | In-Chip | Gate array cell architecture and routing scheme |
US5640342A (en) | 1995-11-20 | 1997-06-17 | Micron Technology, Inc. | Structure for cross coupled thin film transistors and static random access memory cell |
JP3400215B2 (ja) | 1995-11-21 | 2003-04-28 | 沖電気工業株式会社 | 半導体装置 |
JP3486725B2 (ja) | 1995-11-28 | 2004-01-13 | 株式会社ルネサステクノロジ | 可変論理集積回路 |
JP3934719B2 (ja) | 1995-12-22 | 2007-06-20 | 株式会社東芝 | 光近接効果補正方法 |
US6043562A (en) | 1996-01-26 | 2000-03-28 | Micron Technology, Inc. | Digit line architecture for dynamic memory |
KR100229577B1 (ko) | 1996-01-31 | 1999-11-15 | 포만 제프리 엘 | 게이트 어레이 셀 및 이것을 포함한 집적 회로 칩 |
US5798298A (en) | 1996-02-09 | 1998-08-25 | United Microelectronics Corporation | Method of automatically generating dummy metals for multilevel interconnection |
US5705301A (en) * | 1996-02-27 | 1998-01-06 | Lsi Logic Corporation | Performing optical proximity correction with the aid of design rule checkers |
US6269472B1 (en) | 1996-02-27 | 2001-07-31 | Lsi Logic Corporation | Optical proximity correction method and apparatus |
US5698873A (en) | 1996-03-08 | 1997-12-16 | Lsi Logic Corporation | High density gate array base cell architecture |
JPH09282349A (ja) | 1996-04-17 | 1997-10-31 | Shinko Electric Ind Co Ltd | データ変換処理装置 |
JP2914292B2 (ja) | 1996-04-25 | 1999-06-28 | 日本電気株式会社 | 半導体装置 |
US5740068A (en) | 1996-05-30 | 1998-04-14 | International Business Machines Corporation | Fidelity enhancement of lithographic and reactive-ion-etched images by optical proximity correction |
JP2809200B2 (ja) | 1996-06-03 | 1998-10-08 | 日本電気株式会社 | 半導体装置の製造方法 |
US5935763A (en) | 1996-06-11 | 1999-08-10 | International Business Machines Corporation | Self-aligned pattern over a reflective layer |
US6026223A (en) * | 1996-06-28 | 2000-02-15 | Scepanovic; Ranko | Advanced modular cell placement system with overlap remover with minimal noise |
JP3311244B2 (ja) * | 1996-07-15 | 2002-08-05 | 株式会社東芝 | 基本セルライブラリ及びその形成方法 |
US5796128A (en) | 1996-07-25 | 1998-08-18 | Translogic Technology, Inc. | Gate array with fully wired multiplexer circuits |
JP2918101B2 (ja) | 1996-07-25 | 1999-07-12 | 日本電気株式会社 | 半導体集積回路のレイアウト方法 |
US5920486A (en) | 1996-08-16 | 1999-07-06 | International Business Machines Corporation | Parameterized cells for generating dense layouts of VLSI circuits |
JP3152635B2 (ja) | 1996-09-09 | 2001-04-03 | 三洋電機株式会社 | マスタスライス方式の基本セル、半導体集積回路装置、フリップフロップ回路、排他的論理和回路、マルチプレクサ及び加算器 |
US5858580A (en) * | 1997-09-17 | 1999-01-12 | Numerical Technologies, Inc. | Phase shifting circuit manufacture method and apparatus |
US5790417A (en) | 1996-09-25 | 1998-08-04 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of automatic dummy layout generation |
US5923060A (en) | 1996-09-27 | 1999-07-13 | In-Chip Systems, Inc. | Reduced area gate array cell design based on shifted placement of alternate rows of cells |
US5684733A (en) | 1996-09-30 | 1997-11-04 | Holtek Microelectronics, Inc. | Fixed resistance high density parallel ROM device |
JP3529563B2 (ja) * | 1996-10-09 | 2004-05-24 | 株式会社東芝 | 半導体集積回路の再レイアウト方法及び半導体集積回路の再レイアウトプログラムを記録した媒体 |
US6209123B1 (en) | 1996-11-01 | 2001-03-27 | Motorola, Inc. | Methods of placing transistors in a circuit layout and semiconductor device with automatically placed transistors |
US5984510A (en) | 1996-11-01 | 1999-11-16 | Motorola Inc. | Automatic synthesis of standard cell layouts |
US6099584A (en) | 1996-12-06 | 2000-08-08 | Vsli Technology, Inc. | System to fix post-layout timing and design rules violations |
JP3523762B2 (ja) | 1996-12-19 | 2004-04-26 | 株式会社東芝 | 半導体記憶装置 |
JP3352895B2 (ja) | 1996-12-25 | 2002-12-03 | 株式会社東芝 | 半導体集積回路、半導体集積回路の設計方法および製造方法 |
JPH10189746A (ja) | 1996-12-27 | 1998-07-21 | Oki Electric Ind Co Ltd | Lsi論理回路の配線レイアウト方法 |
JP3420694B2 (ja) | 1996-12-27 | 2003-06-30 | 株式会社東芝 | スタンダードセル方式の集積回路 |
JP3036588B2 (ja) | 1997-02-03 | 2000-04-24 | 日本電気株式会社 | 半導体記憶装置 |
JP3180700B2 (ja) | 1997-02-03 | 2001-06-25 | 日本電気株式会社 | 半導体集積回路装置 |
JP3352349B2 (ja) | 1997-02-24 | 2002-12-03 | シャープ株式会社 | 双方向サイリスタ素子 |
US5900340A (en) | 1997-03-03 | 1999-05-04 | Motorola, Inc. | One dimensional lithographic proximity correction using DRC shape functions |
US5977574A (en) | 1997-03-28 | 1999-11-02 | Lsi Logic Corporation | High density gate array cell architecture with sharing of well taps between cells |
US5880991A (en) | 1997-04-14 | 1999-03-09 | International Business Machines Corporation | Structure for low cost mixed memory integration, new NVRAM structure, and process for forming the mixed memory and NVRAM structure |
US6393601B1 (en) | 1997-04-14 | 2002-05-21 | Matsushita Electric Industrial Co., Ltd. | Layout designing apparatus for integrated circuit, transistor size determining apparatus, circuit characteristic evaluating method, and transistor size determining method |
JP3178799B2 (ja) | 1997-04-18 | 2001-06-25 | シャープ株式会社 | Mos論理回路及びこのmos論理回路を備えた半導体装置 |
KR100227621B1 (ko) | 1997-05-22 | 1999-11-01 | 김영환 | 반도체 소자의 트랜지스터 제조방법 |
US6005296A (en) | 1997-05-30 | 1999-12-21 | Stmicroelectronics, Inc. | Layout for SRAM structure |
US6445049B1 (en) | 1997-06-30 | 2002-09-03 | Artisan Components, Inc. | Cell based array comprising logic, transfer and drive cells |
US6282696B1 (en) | 1997-08-15 | 2001-08-28 | Lsi Logic Corporation | Performing optical proximity correction with the aid of design rule checkers |
US6470489B1 (en) | 1997-09-17 | 2002-10-22 | Numerical Technologies, Inc. | Design rule checking system and method |
US6370679B1 (en) | 1997-09-17 | 2002-04-09 | Numerical Technologies, Inc. | Data hierarchy layout correction and verification method and apparatus |
US6009251A (en) | 1997-09-30 | 1999-12-28 | Synopsys, Inc. | Method and system for layout verification of an integrated circuit design with reusable subdesigns |
US6114071A (en) | 1997-11-24 | 2000-09-05 | Asml Masktools Netherlands B.V. | Method of fine feature edge tuning with optically-halftoned mask |
EP0920025B1 (en) | 1997-11-28 | 2004-02-11 | STMicroelectronics S.r.l. | A low power RAM memory cell |
JP3701781B2 (ja) | 1997-11-28 | 2005-10-05 | 株式会社ルネサステクノロジ | 論理回路とその作成方法 |
JP3926011B2 (ja) | 1997-12-24 | 2007-06-06 | 株式会社ルネサステクノロジ | 半導体装置の設計方法 |
JP3777768B2 (ja) | 1997-12-26 | 2006-05-24 | 株式会社日立製作所 | 半導体集積回路装置およびセルライブラリを記憶した記憶媒体および半導体集積回路の設計方法 |
KR100278273B1 (ko) | 1997-12-30 | 2001-02-01 | 김영환 | 반도체장치의콘택홀형성방법 |
US6249902B1 (en) | 1998-01-09 | 2001-06-19 | Silicon Perspective Corporation | Design hierarchy-based placement |
US6571140B1 (en) | 1998-01-15 | 2003-05-27 | Eutech Cybernetics Pte Ltd. | Service-oriented community agent |
JPH11214662A (ja) | 1998-01-29 | 1999-08-06 | Mitsubishi Electric Corp | 半導体装置 |
US6091845A (en) | 1998-02-24 | 2000-07-18 | Micron Technology, Inc. | Inspection technique of photomask |
US6230299B1 (en) | 1998-03-31 | 2001-05-08 | Mentor Graphics Corporation | Method and apparatus for extracting and storing connectivity and geometrical data for a deep sub-micron integrated circuit design |
US6378110B1 (en) | 1998-03-31 | 2002-04-23 | Synopsys, Inc. | Layer-based rule checking for an integrated circuit layout |
JPH11297856A (ja) | 1998-04-16 | 1999-10-29 | Mitsubishi Electric Corp | スタティック半導体記憶装置 |
US5915199A (en) | 1998-06-04 | 1999-06-22 | Sharp Microelectronics Technology, Inc. | Method for manufacturing a CMOS self-aligned strapped interconnection |
US6262487B1 (en) | 1998-06-23 | 2001-07-17 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device, semiconductor integrated circuit wiring method, and cell arranging method |
US6063132A (en) | 1998-06-26 | 2000-05-16 | International Business Machines Corporation | Method for verifying design rule checking software |
US6480989B2 (en) | 1998-06-29 | 2002-11-12 | Lsi Logic Corporation | Integrated circuit design incorporating a power mesh |
US6714903B1 (en) | 1998-07-10 | 2004-03-30 | Lsi Logic Corporation | Placement and routing of circuits using a combined processing/buffer cell |
US6240542B1 (en) | 1998-07-14 | 2001-05-29 | Lsi Logic Corporation | Poly routing for chip interconnects with minimal impact on chip performance |
US6182272B1 (en) * | 1998-07-16 | 2001-01-30 | Lsi Logic Corporation | Metal layer assignment |
JP3562975B2 (ja) | 1998-09-29 | 2004-09-08 | 株式会社東芝 | 集積回路設計方法及び集積回路設計装置 |
US20020008257A1 (en) | 1998-09-30 | 2002-01-24 | John P. Barnak | Mosfet gate electrodes having performance tuned work functions and methods of making same |
JP2000114262A (ja) * | 1998-10-05 | 2000-04-21 | Toshiba Corp | 半導体装置及びその製造方法 |
JP3852729B2 (ja) | 1998-10-27 | 2006-12-06 | 富士通株式会社 | 半導体記憶装置 |
US6174742B1 (en) * | 1998-10-30 | 2001-01-16 | Lsi Logic Corporation | Off-grid metal layer utilization |
US6275973B1 (en) | 1998-10-30 | 2001-08-14 | Lsi Logic Corporation | Integrated circuit design with delayed cell selection |
US6166415A (en) | 1998-11-02 | 2000-12-26 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device with improved noise resistivity |
JP3680594B2 (ja) | 1998-11-10 | 2005-08-10 | 株式会社日立製作所 | 半導体集積回路 |
TW476069B (en) | 1998-11-20 | 2002-02-11 | Via Tech Inc | Placement and routing for array device |
WO2000031871A1 (en) | 1998-11-25 | 2000-06-02 | Nanopower, Inc. | Improved flip-flops and other logic circuits and techniques for improving layouts of integrated circuits |
JP4437565B2 (ja) | 1998-11-26 | 2010-03-24 | 富士通マイクロエレクトロニクス株式会社 | 半導体集積回路装置、半導体集積回路装置の設計方法、及び、記録媒体 |
US6477695B1 (en) | 1998-12-09 | 2002-11-05 | Artisan Components, Inc. | Methods for designing standard cell transistor structures |
WO2000036466A1 (fr) | 1998-12-11 | 2000-06-22 | Hitachi, Ltd. | Dispositif a circuit integre a semiconducteurs et procede de fabrication |
KR100291384B1 (ko) | 1998-12-31 | 2001-07-12 | 윤종용 | 반도체장치의레이아웃방법 |
US6159839A (en) | 1999-02-11 | 2000-12-12 | Vanguard International Semiconductor Corporation | Method for fabricating borderless and self-aligned polysilicon and metal contact landing plugs for multilevel interconnections |
US6480032B1 (en) | 1999-03-04 | 2002-11-12 | Intel Corporation | Gate array architecture |
US6974978B1 (en) | 1999-03-04 | 2005-12-13 | Intel Corporation | Gate array architecture |
US6691297B1 (en) * | 1999-03-04 | 2004-02-10 | Matsushita Electric Industrial Co., Ltd. | Method for planning layout for LSI pattern, method for forming LSI pattern and method for generating mask data for LSI |
US6194912B1 (en) * | 1999-03-11 | 2001-02-27 | Easic Corporation | Integrated circuit device |
US6331733B1 (en) | 1999-08-10 | 2001-12-18 | Easic Corporation | Semiconductor device |
US6044007A (en) | 1999-03-24 | 2000-03-28 | Advanced Micro Devices, Inc. | Modification of mask layout data to improve writeability of OPC |
JP3986036B2 (ja) | 1999-04-16 | 2007-10-03 | 株式会社日立製作所 | 半導体集積回路装置 |
US6505328B1 (en) * | 1999-04-27 | 2003-01-07 | Magma Design Automation, Inc. | Method for storing multiple levels of design data in a common database |
US6507941B1 (en) | 1999-04-28 | 2003-01-14 | Magma Design Automation, Inc. | Subgrid detailed routing |
JP4565700B2 (ja) | 1999-05-12 | 2010-10-20 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US6492066B1 (en) | 1999-05-28 | 2002-12-10 | Advanced Micro Devices, Inc. | Characterization and synthesis of OPC structures by fourier space analysis and/or wavelet transform expansion |
US6425112B1 (en) | 1999-06-17 | 2002-07-23 | International Business Machines Corporation | Auto correction of error checked simulated printed images |
US6381730B1 (en) | 1999-07-09 | 2002-04-30 | Sequence Design, Inc. | Method and system for extraction of parasitic interconnect impedance including inductance |
US6525350B1 (en) * | 1999-07-16 | 2003-02-25 | Kawasaki Steel Corporation | Semiconductor integrated circuit basic cell semiconductor integrated circuit using the same |
JP2001056463A (ja) | 1999-08-20 | 2001-02-27 | Casio Comput Co Ltd | 液晶表示装置 |
JP2001068558A (ja) | 1999-08-30 | 2001-03-16 | Hitachi Ltd | 半導体集積回路装置 |
US6436805B1 (en) | 1999-09-01 | 2002-08-20 | Micron Technology, Inc. | Local interconnect structures and methods for making the same |
US6496965B1 (en) | 1999-09-20 | 2002-12-17 | Magma Design Automation, Inc. | Automated design of parallel drive standard cells |
TW423218B (en) | 1999-10-06 | 2001-02-21 | Ind Tech Res Inst | Charge-redistribution low-swing differential logic circuit |
US6194104B1 (en) * | 1999-10-12 | 2001-02-27 | Taiwan Semiconductor Manufacturing Company | Optical proximity correction (OPC) method for improving lithography process window |
US6737347B1 (en) | 1999-10-20 | 2004-05-18 | Texas Instruments Incorporated | Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device |
US6426269B1 (en) | 1999-10-21 | 2002-07-30 | International Business Machines Corporation | Dummy feature reduction using optical proximity effect correction |
US6255845B1 (en) | 1999-11-16 | 2001-07-03 | Advanced Micro Devices, Inc. | Efficient use of spare gates for post-silicon debug and enhancements |
US6570234B1 (en) | 1999-11-17 | 2003-05-27 | Aeroflex Utmc Microelectronic Systems, Inc. | Radiation resistant integrated circuit design |
JP4070998B2 (ja) | 1999-11-18 | 2008-04-02 | ピー・デイ・エフ ソリユーシヨンズ インコーポレイテツド | テスト・ダイ |
JP2001144603A (ja) | 1999-11-18 | 2001-05-25 | Oki Micro Design Co Ltd | レベルシフタ回路およびそれを含むデータ出力回路 |
JP2001168707A (ja) | 1999-12-03 | 2001-06-22 | Sony Corp | 論理回路およびそれを用いた全加算器 |
US6421820B1 (en) | 1999-12-13 | 2002-07-16 | Infineon Technologies Ag | Semiconductor device fabrication using a photomask with assist features |
US6303252B1 (en) | 1999-12-27 | 2001-10-16 | United Microelectronics Corp. | Reticle having assist feature between semi-dense lines |
US6295224B1 (en) | 1999-12-30 | 2001-09-25 | Stmicroelectronics, Inc. | Circuit and method of fabricating a memory cell for a static random access memory |
KR100346832B1 (ko) | 2000-01-12 | 2002-08-03 | 삼성전자 주식회사 | 스태틱 랜덤 억세스 메모리 소자 및 그 제조 방법 |
US6737199B1 (en) | 2000-01-31 | 2004-05-18 | Taiwan Semiconductor Manufacturing Company | Using new pattern fracturing rules for optical proximity correction mask-making to improve critical dimension uniformity |
US6408427B1 (en) | 2000-02-22 | 2002-06-18 | The Regents Of The University Of California | Wire width planning and performance optimization for VLSI interconnects |
US6756811B2 (en) | 2000-03-10 | 2004-06-29 | Easic Corporation | Customizable and programmable cell array |
US6331790B1 (en) | 2000-03-10 | 2001-12-18 | Easic Corporation | Customizable and programmable cell array |
US6399972B1 (en) | 2000-03-13 | 2002-06-04 | Oki Electric Industry Co., Ltd. | Cell based integrated circuit and unit cell architecture therefor |
US6536028B1 (en) | 2000-03-14 | 2003-03-18 | Ammocore Technologies, Inc. | Standard block architecture for integrated circuit design |
JP2001272228A (ja) | 2000-03-24 | 2001-10-05 | Railway Technical Res Inst | 相対変位量計測システム及び相対変位量計測方法 |
US6356112B1 (en) | 2000-03-28 | 2002-03-12 | Translogic Technology, Inc. | Exclusive or/nor circuit |
US6553544B2 (en) | 2000-04-04 | 2003-04-22 | Matsushita Electric Industrial Co., Ltd. | Method for design of partial circuit |
JP2001306641A (ja) | 2000-04-27 | 2001-11-02 | Victor Co Of Japan Ltd | 半導体集積回路の自動配置配線方法 |
US6416907B1 (en) | 2000-04-27 | 2002-07-09 | Micron Technology, Inc. | Method for designing photolithographic reticle layout, reticle, and photolithographic process |
US6583041B1 (en) | 2000-05-01 | 2003-06-24 | Advanced Micro Devices, Inc. | Microdevice fabrication method using regular arrays of lines and spaces |
TW512424B (en) | 2000-05-01 | 2002-12-01 | Asml Masktools Bv | Hybrid phase-shift mask |
JP4885365B2 (ja) | 2000-05-16 | 2012-02-29 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US6509952B1 (en) * | 2000-05-23 | 2003-01-21 | Silicon Valley Group, Inc. | Method and system for selective linewidth optimization during a lithographic process |
US6610607B1 (en) | 2000-05-25 | 2003-08-26 | International Business Machines Corporation | Method to define and tailor process limited lithographic features using a modified hard mask process |
US6445065B1 (en) | 2000-06-06 | 2002-09-03 | In-Chip Systems, Inc. | Routing driven, metal programmable integrated circuit architecture with multiple types of core cells |
US6617621B1 (en) | 2000-06-06 | 2003-09-09 | Virage Logic Corporation | Gate array architecture using elevated metal levels for customization |
US6425113B1 (en) | 2000-06-13 | 2002-07-23 | Leigh C. Anderson | Integrated verification and manufacturability tool |
US6889370B1 (en) * | 2000-06-20 | 2005-05-03 | Unisys Corporation | Method and apparatus for selecting and aligning cells using a placement tool |
JP2002026296A (ja) | 2000-06-22 | 2002-01-25 | Internatl Business Mach Corp <Ibm> | 半導体集積回路装置 |
JP2002009160A (ja) | 2000-06-26 | 2002-01-11 | Nec Microsystems Ltd | 半導体集積回路の自動レイアウト方法、この方法で製造した半導体集積回路及びこの方法を記録した記録媒体 |
US7225423B2 (en) | 2000-06-30 | 2007-05-29 | Zenasis Technologies, Inc. | Method for automated design of integrated circuits with targeted quality objectives using dynamically generated building blocks |
US6733929B2 (en) | 2000-07-05 | 2004-05-11 | Numerical Technologies, Inc. | Phase shift masking for complex patterns with proximity adjustments |
US6978436B2 (en) | 2000-07-05 | 2005-12-20 | Synopsys, Inc. | Design data format and hierarchy management for phase processing |
US6787271B2 (en) | 2000-07-05 | 2004-09-07 | Numerical Technologies, Inc. | Design and layout of phase shifting photolithographic masks |
US6516459B1 (en) * | 2000-07-10 | 2003-02-04 | Mentor Graphics Corporation | Integrated circuit design correction using fragment correspondence |
JP4794030B2 (ja) | 2000-07-10 | 2011-10-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US6632741B1 (en) | 2000-07-19 | 2003-10-14 | International Business Machines Corporation | Self-trimming method on looped patterns |
US6574786B1 (en) | 2000-07-21 | 2003-06-03 | Aeroflex UTMC Microelectronics Systems, Inc. | Gate array cell generator using cadence relative object design |
US20050136340A1 (en) | 2000-07-21 | 2005-06-23 | Asml Netherlands B.V. | Lithographic apparatus and methods, patterning structure and method for making a patterning structure, device manufacturing method, and device manufactured thereby |
US6523162B1 (en) | 2000-08-02 | 2003-02-18 | Numerical Technologies, Inc. | General purpose shape-based layout processing scheme for IC layout modifications |
JP4357101B2 (ja) | 2000-08-23 | 2009-11-04 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
JP4764987B2 (ja) | 2000-09-05 | 2011-09-07 | 富士電機株式会社 | 超接合半導体素子 |
AU2001290937A1 (en) | 2000-09-13 | 2002-04-02 | Massachusetts Institute Of Technology | Method of design and fabrication of integrated circuits using regular arrays and gratings |
US6800883B2 (en) | 2000-09-21 | 2004-10-05 | Matsushita Electric Industrial Co., Ltd. | CMOS basic cell and method for fabricating semiconductor integrated circuit using the same |
US6453457B1 (en) | 2000-09-29 | 2002-09-17 | Numerical Technologies, Inc. | Selection of evaluation point locations based on proximity effects model amplitudes for correcting proximity effects in a fabrication layout |
US6557162B1 (en) | 2000-09-29 | 2003-04-29 | Numerical Technologies, Inc. | Method for high yield reticle formation |
US6625801B1 (en) | 2000-09-29 | 2003-09-23 | Numerical Technologies, Inc. | Dissection of printed edges from a fabrication layout for correcting proximity effects |
US6794677B2 (en) | 2000-10-02 | 2004-09-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor integrated circuit device and method for fabricating the same |
US6555450B2 (en) | 2000-10-04 | 2003-04-29 | Samsung Electronics Co., Ltd. | Contact forming method for semiconductor device |
US6566720B2 (en) | 2000-10-05 | 2003-05-20 | United Memories, Inc. | Base cell layout permitting rapid layout with minimum clock line capacitance on CMOS standard-cell and gate-array integrated circuits |
US6978437B1 (en) | 2000-10-10 | 2005-12-20 | Toppan Photomasks, Inc. | Photomask for eliminating antenna effects in an integrated circuit and integrated circuit manufacture with same |
KR20020034313A (ko) | 2000-10-31 | 2002-05-09 | 박종섭 | 에스램셀의 제조 방법 |
US6703170B1 (en) | 2000-12-13 | 2004-03-09 | Dupont Photomasks, Inc. | Method and apparatus for reducing loading effects on a semiconductor manufacturing component during an etch process |
JP2002184870A (ja) | 2000-12-18 | 2002-06-28 | Mitsubishi Electric Corp | スタティック型半導体記憶装置 |
KR100355036B1 (ko) | 2000-12-22 | 2002-10-05 | 삼성전자 주식회사 | 크로스 커플드 트랜지스터 쌍의 레이아웃 방법 |
US6992394B2 (en) * | 2000-12-28 | 2006-01-31 | Infineon Technologies Ag | Multi-level conductive lines with reduced pitch |
US6553559B2 (en) | 2001-01-05 | 2003-04-22 | International Business Machines Corporation | Method to determine optical proximity correction and assist feature rules which account for variations in mask dimensions |
US6578190B2 (en) | 2001-01-11 | 2003-06-10 | International Business Machines Corporation | Process window based optical proximity correction of lithographic images |
JP2002289703A (ja) | 2001-01-22 | 2002-10-04 | Nec Corp | 半導体記憶装置およびその製造方法 |
JP2002252161A (ja) | 2001-02-23 | 2002-09-06 | Hitachi Ltd | 半導体製造システム |
US6792591B2 (en) | 2001-02-28 | 2004-09-14 | Asml Masktools B.V. | Method of identifying an extreme interaction pitch region, methods of designing mask patterns and manufacturing masks, device manufacturing methods and computer programs |
JP4928675B2 (ja) | 2001-03-01 | 2012-05-09 | エルピーダメモリ株式会社 | 半導体装置 |
JP4736206B2 (ja) | 2001-03-05 | 2011-07-27 | 大日本印刷株式会社 | フォトマスクパタン欠陥検査方法および微細図形パタンの検出方法 |
KR100457839B1 (ko) | 2001-03-14 | 2004-11-18 | 에이에스엠엘 마스크툴즈 비.브이. | 규정된 래더바를 서브-해상도 어시스트피처로 활용하는광근접성교정방법 |
US6514849B1 (en) * | 2001-04-02 | 2003-02-04 | Advanced Micro Devices, Inc. | Method of forming smaller contact size using a spacer hard mask |
US6732334B2 (en) | 2001-04-02 | 2004-05-04 | Matsushita Electric Industrial Co., Ltd. | Analog MOS semiconductor device, manufacturing method therefor, manufacturing program therefor, and program device therefor |
US6574779B2 (en) | 2001-04-12 | 2003-06-03 | International Business Machines Corporation | Hierarchical layout method for integrated circuits |
US6505327B2 (en) * | 2001-04-13 | 2003-01-07 | Numerical Technologies, Inc. | Generating an instance-based representation of a design hierarchy |
US6524870B2 (en) | 2001-04-24 | 2003-02-25 | Pell, Iii Edwin A. | Method and apparatus for improving resolution of objects in a semiconductor wafer |
JP4187947B2 (ja) | 2001-04-26 | 2008-11-26 | 株式会社東芝 | パターン補正方法、パターン補正装置、およびパターン補正プログラムを記録した記録媒体 |
US6936908B2 (en) | 2001-05-03 | 2005-08-30 | Ixys Corporation | Forward and reverse blocking devices |
US6553562B2 (en) | 2001-05-04 | 2003-04-22 | Asml Masktools B.V. | Method and apparatus for generating masks utilized in conjunction with dipole illumination techniques |
US6590289B2 (en) | 2001-05-17 | 2003-07-08 | Lsi Logic Corporation | Hexadecagonal routing |
US6523156B2 (en) * | 2001-06-08 | 2003-02-18 | Library Technologies, Inc. | Apparatus and methods for wire load independent logic synthesis and timing closure with constant replacement delay cell libraries |
JP2002368135A (ja) | 2001-06-12 | 2002-12-20 | Hitachi Ltd | 半導体記憶装置 |
US6759282B2 (en) | 2001-06-12 | 2004-07-06 | International Business Machines Corporation | Method and structure for buried circuits and devices |
JP4746770B2 (ja) | 2001-06-19 | 2011-08-10 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US6609235B2 (en) | 2001-06-22 | 2003-08-19 | Bae Systems Information And Electronic Systems Integration, Inc. | Method for providing a fill pattern for an integrated circuit design |
US7079989B2 (en) | 2001-06-29 | 2006-07-18 | Shmuel Wimer | Arrangements for automatic re-legging of transistors |
US6835591B2 (en) | 2001-07-25 | 2004-12-28 | Nantero, Inc. | Methods of nanotube films and articles |
DE10137830A1 (de) | 2001-08-02 | 2003-02-27 | Infineon Technologies Ag | Verfahren zum Herstellen einer selbstjustierten Struktur auf einem Halbleiter-Wafer |
US6684382B2 (en) | 2001-08-31 | 2004-01-27 | Numerical Technologies, Inc. | Microloading effect correction |
DE10143723B4 (de) | 2001-08-31 | 2006-09-28 | Infineon Technologies Ag | Verfahren zur Optimierung eines Layouts für eine Maske zur Verwendung bei der Halbleiterherstellung |
US6633182B2 (en) | 2001-09-05 | 2003-10-14 | Carnegie Mellon University | Programmable gate array based on configurable metal interconnect vias |
JP4786836B2 (ja) | 2001-09-07 | 2011-10-05 | 富士通セミコンダクター株式会社 | 配線接続部設計方法及び半導体装置 |
JP2003092250A (ja) | 2001-09-18 | 2003-03-28 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP3989213B2 (ja) | 2001-09-25 | 2007-10-10 | シャープ株式会社 | パストランジスタ論理回路 |
JP3637299B2 (ja) | 2001-10-05 | 2005-04-13 | 松下電器産業株式会社 | 半導体記憶装置 |
US7175940B2 (en) * | 2001-10-09 | 2007-02-13 | Asml Masktools B.V. | Method of two dimensional feature model calibration and optimization |
JP2003124339A (ja) | 2001-10-11 | 2003-04-25 | Toshiba Corp | 半導体装置およびその製造方法 |
JP3526450B2 (ja) | 2001-10-29 | 2004-05-17 | 株式会社東芝 | 半導体集積回路およびスタンダードセル配置設計方法 |
JP2003142584A (ja) | 2001-11-05 | 2003-05-16 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置の設計方法 |
JP2003218238A (ja) | 2001-11-14 | 2003-07-31 | Mitsubishi Electric Corp | 半導体記憶装置 |
US6673638B1 (en) * | 2001-11-14 | 2004-01-06 | Kla-Tencor Corporation | Method and apparatus for the production of process sensitive lithographic features |
JP3789351B2 (ja) | 2001-11-30 | 2006-06-21 | 株式会社日立製作所 | 反射型液晶表示装置及びその製造方法 |
JP2003168640A (ja) | 2001-12-03 | 2003-06-13 | Hitachi Ltd | 半導体装置の製造方法 |
JP2003188361A (ja) | 2001-12-20 | 2003-07-04 | Mitsubishi Electric Corp | ゲートアレイ構造の半導体集積回路 |
JP3828419B2 (ja) | 2001-12-25 | 2006-10-04 | 株式会社東芝 | 半導体装置及びその製造方法 |
US6787469B2 (en) | 2001-12-28 | 2004-09-07 | Texas Instruments Incorporated | Double pattern and etch of poly with hard mask |
US7159197B2 (en) * | 2001-12-31 | 2007-01-02 | Synopsys, Inc. | Shape-based geometry engine to perform smoothing and other layout beautification operations |
US6817000B2 (en) | 2002-01-02 | 2004-11-09 | International Business Machines Corporation | Delay correlation analysis and representation for vital complaint VHDL models |
US7085701B2 (en) | 2002-01-02 | 2006-08-01 | International Business Machines Corporation | Size reduction techniques for vital compliant VHDL simulation models |
JP2003203993A (ja) | 2002-01-10 | 2003-07-18 | Mitsubishi Electric Corp | 半導体記憶装置及びその製造方法 |
US6749972B2 (en) | 2002-01-15 | 2004-06-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Optical proximity correction common process window maximization over varying feature pitch |
US6721926B2 (en) | 2002-01-25 | 2004-04-13 | Intel Corporation | Method and apparatus for improving digital circuit design |
US6662350B2 (en) | 2002-01-28 | 2003-12-09 | International Business Machines Corporation | FinFET layout generation |
US6820248B1 (en) | 2002-02-14 | 2004-11-16 | Xilinx, Inc. | Method and apparatus for routing interconnects to devices with dissimilar pitches |
US6877144B1 (en) | 2002-02-28 | 2005-04-05 | Dupont Photomasks, Inc. | System and method for generating a mask layout file to reduce power supply voltage fluctuations in an integrated circuit |
JP2003264231A (ja) | 2002-03-11 | 2003-09-19 | Mitsubishi Electric Corp | レイアウト設計方法および半導体装置 |
TWI252516B (en) | 2002-03-12 | 2006-04-01 | Toshiba Corp | Determination method of process parameter and method for determining at least one of process parameter and design rule |
US7386433B2 (en) | 2002-03-15 | 2008-06-10 | Synopsys, Inc. | Using a suggested solution to speed up a process for simulating and correcting an integrated circuit layout |
US6732338B2 (en) | 2002-03-20 | 2004-05-04 | International Business Machines Corporation | Method for comprehensively verifying design rule checking runsets |
US6765245B2 (en) | 2002-03-25 | 2004-07-20 | Bae Systems Information And Electronic Systems Integration Inc. | Gate array core cell for VLSI ASIC devices |
US6754121B2 (en) | 2002-03-29 | 2004-06-22 | Stmicroelectronics, Inc. | Sense amplifying circuit and method |
US6745372B2 (en) | 2002-04-05 | 2004-06-01 | Numerical Technologies, Inc. | Method and apparatus for facilitating process-compliant layout optimization |
US6789246B1 (en) | 2002-04-07 | 2004-09-07 | Barcelona Design, Inc. | Method and apparatus for automatic layout of circuit structures |
US7252909B2 (en) | 2002-04-18 | 2007-08-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method to reduce CD non-uniformity in IC manufacturing |
JP4190796B2 (ja) | 2002-04-24 | 2008-12-03 | Necエレクトロニクス株式会社 | 露光原版の作成方法 |
US6992925B2 (en) * | 2002-04-26 | 2006-01-31 | Kilopass Technologies, Inc. | High density semiconductor memory cell and memory array using a single transistor and having counter-doped poly and buried diffusion wordline |
US6826738B2 (en) | 2002-05-10 | 2004-11-30 | Pdf Solutions, Inc. | Optimization of die placement on wafers |
US6794914B2 (en) | 2002-05-24 | 2004-09-21 | Qualcomm Incorporated | Non-volatile multi-threshold CMOS latch with leakage control |
JP2004013920A (ja) | 2002-06-03 | 2004-01-15 | Mitsubishi Electric Corp | 半導体記憶装置 |
US6980211B2 (en) | 2002-06-04 | 2005-12-27 | Springsoft, Inc. | Automatic schematic diagram generation using topology information |
US7152215B2 (en) | 2002-06-07 | 2006-12-19 | Praesagus, Inc. | Dummy fill for integrated circuits |
US20030229875A1 (en) | 2002-06-07 | 2003-12-11 | Smith Taber H. | Use of models in integrated circuit fabrication |
US7712056B2 (en) | 2002-06-07 | 2010-05-04 | Cadence Design Systems, Inc. | Characterization and verification for integrated circuit designs |
US7774726B2 (en) | 2002-06-07 | 2010-08-10 | Cadence Design Systems, Inc. | Dummy fill for integrated circuits |
EP1532670A4 (en) * | 2002-06-07 | 2007-09-12 | Praesagus Inc | CHARACTERIZATION AND REDUCTION OF VARIATION FOR INTEGRATED CIRCUITS |
US7124386B2 (en) | 2002-06-07 | 2006-10-17 | Praesagus, Inc. | Dummy fill for integrated circuits |
US7363099B2 (en) | 2002-06-07 | 2008-04-22 | Cadence Design Systems, Inc. | Integrated circuit metrology |
JP3879063B2 (ja) | 2002-06-11 | 2007-02-07 | 富士通株式会社 | 半導体装置およびその製造方法 |
US6795953B2 (en) | 2002-06-11 | 2004-09-21 | Hpl Technologies, Inc. | Method for avoiding false failures attributable to dummy interconnects during defect analysis of an integrated circuit design |
JP2004022070A (ja) | 2002-06-17 | 2004-01-22 | Renesas Technology Corp | 半導体記憶装置 |
US7039882B2 (en) | 2002-06-17 | 2006-05-02 | Amar Pal Singh Rana | Technology dependent transformations for Silicon-On-Insulator in digital design synthesis |
JP4036688B2 (ja) | 2002-06-18 | 2008-01-23 | 松下電器産業株式会社 | 自動配置配線用スタンダードセルライブラリ及び半導体集積装置 |
JP4462528B2 (ja) | 2002-06-24 | 2010-05-12 | 株式会社日立製作所 | 半導体集積回路装置 |
EP1376676A3 (en) | 2002-06-24 | 2008-08-20 | Interuniversitair Microelektronica Centrum Vzw | Multibit non-volatile memory device and method |
US6687895B2 (en) * | 2002-07-03 | 2004-02-03 | Numerical Technologies Inc. | Method and apparatus for reducing optical proximity correction output file size |
US6998722B2 (en) | 2002-07-08 | 2006-02-14 | Viciciv Technology | Semiconductor latches and SRAM devices |
JP2004040042A (ja) | 2002-07-08 | 2004-02-05 | Fujitsu Ltd | 半導体記憶装置 |
US7063923B2 (en) | 2002-07-11 | 2006-06-20 | United Electronics Corp. | Optical proximity correction method |
US20040009409A1 (en) | 2002-07-11 | 2004-01-15 | Jiunn-Ren Hwang | Optical proximity correction method |
EP1579274A4 (en) | 2002-07-12 | 2006-06-07 | Cadence Design Systems Inc | METHOD AND SYSTEM FOR CONTROLLING MASKS ACCORDING TO THE CONTEXT |
JP4416384B2 (ja) | 2002-07-19 | 2010-02-17 | 株式会社ルネサステクノロジ | 半導体集積回路 |
KR100445638B1 (ko) | 2002-07-26 | 2004-08-25 | 삼성전자주식회사 | 전기적으로 분리된 영역들을 연결하는 상호 연결 구조 및그 제조방법 |
US7739624B2 (en) | 2002-07-29 | 2010-06-15 | Synopsys, Inc. | Methods and apparatuses to generate a shielding mesh for integrated circuit devices |
US7171645B2 (en) | 2002-08-06 | 2007-01-30 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device, method of generating pattern for semiconductor device, method of manufacturing semiconductor device and device of generating pattern used for semiconductor device |
KR100493025B1 (ko) | 2002-08-07 | 2005-06-07 | 삼성전자주식회사 | 반도체 메모리 장치의 제조 방법 |
US6789244B1 (en) | 2002-08-08 | 2004-09-07 | Xilinx, Inc. | Placement of clock objects under constraints |
US7143380B1 (en) | 2002-08-08 | 2006-11-28 | Xilinx, Inc. | Method for application of network flow techniques under constraints |
FR2843481B1 (fr) | 2002-08-08 | 2005-09-16 | Soisic | Memoire sur substrat du type silicium sur isolant |
US6785875B2 (en) * | 2002-08-15 | 2004-08-31 | Fulcrum Microsystems, Inc. | Methods and apparatus for facilitating physical synthesis of an integrated circuit design |
US6854100B1 (en) * | 2002-08-27 | 2005-02-08 | Taiwan Semiconductor Manufacturing Company | Methodology to characterize metal sheet resistance of copper damascene process |
JP3795846B2 (ja) | 2002-08-29 | 2006-07-12 | 富士通株式会社 | 半導体装置 |
US7345511B2 (en) | 2002-08-29 | 2008-03-18 | Technion Research & Development Foundation Ltd. | Logic circuit and method of logic circuit design |
US6734521B2 (en) | 2002-08-30 | 2004-05-11 | Texas Instruments Incorporated | Integrated circuit cells |
DE10241170A1 (de) | 2002-09-05 | 2004-03-18 | Infineon Technologies Ag | Hochdichter NROM-FINFET |
US20040049754A1 (en) | 2002-09-06 | 2004-03-11 | Sun Microsystems, Inc. | Method and apparatus for filling and connecting filler material in a layout |
TWI274969B (en) | 2002-09-11 | 2007-03-01 | Asml Masktools Bv | Method and computer program product of generating masks and mask generated thereby, device manufacturing method and device manufactured thereby, and method of printing pattern |
US6807663B2 (en) | 2002-09-23 | 2004-10-19 | Numerical Technologies, Inc. | Accelerated layout processing using OPC pre-processing |
US6928635B2 (en) | 2002-09-25 | 2005-08-09 | Numerical Technologies, Inc. | Selectively applying resolution enhancement techniques to improve performance and manufacturing cost of integrated circuits |
US7327597B1 (en) | 2002-10-02 | 2008-02-05 | Cisco Technology, Inc. | Static random access memory architecture |
JP4279782B2 (ja) | 2002-10-10 | 2009-06-17 | 富士通株式会社 | レイアウト方法及び装置並びにそのプログラム及び記録媒体 |
US7214579B2 (en) | 2002-10-24 | 2007-05-08 | Nxp Bv. | Self-aligned 2-bit “double poly CMP” flash memory cell |
US6994939B1 (en) * | 2002-10-29 | 2006-02-07 | Advanced Micro Devices, Inc. | Semiconductor manufacturing resolution enhancement system and method for simultaneously patterning different feature types |
US7053424B2 (en) | 2002-10-31 | 2006-05-30 | Yamaha Corporation | Semiconductor integrated circuit device and its manufacture using automatic layout |
US7219326B2 (en) | 2002-12-16 | 2007-05-15 | Intrinsity, Inc. | Physical realization of dynamic logic using parameterized tile partitioning |
JP3848248B2 (ja) | 2002-12-17 | 2006-11-22 | 株式会社東芝 | Sramセルおよびそれを用いたメモリ集積回路 |
US6953956B2 (en) | 2002-12-18 | 2005-10-11 | Easic Corporation | Semiconductor device having borderless logic array and flexible I/O |
US7093228B2 (en) | 2002-12-20 | 2006-08-15 | Lsi Logic Corporation | Method and system for classifying an integrated circuit for optical proximity correction |
EP1434264A3 (en) | 2002-12-27 | 2017-01-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method using the transfer technique |
JP4202120B2 (ja) | 2002-12-27 | 2008-12-24 | セイコーインスツル株式会社 | 集積回路の最適化設計装置 |
US6898770B2 (en) | 2003-01-09 | 2005-05-24 | Lsi Logic Corporation | Split and merge design flow concept for fast turnaround time of circuit layout design |
JP4136684B2 (ja) | 2003-01-29 | 2008-08-20 | Necエレクトロニクス株式会社 | 半導体装置及びそのダミーパターンの配置方法 |
US6996790B2 (en) | 2003-01-30 | 2006-02-07 | Synopsys, Inc. | System and method for generating a two-dimensional yield map for a full layout |
JP2004241529A (ja) | 2003-02-05 | 2004-08-26 | Matsushita Electric Ind Co Ltd | 半導体回路装置及びその回路シミュレーション方法 |
US6884712B2 (en) | 2003-02-07 | 2005-04-26 | Chartered Semiconductor Manufacturing, Ltd. | Method of manufacturing semiconductor local interconnect and contact |
JP2004253730A (ja) | 2003-02-21 | 2004-09-09 | Renesas Technology Corp | 半導体集積回路装置およびその製造方法 |
US6777146B1 (en) | 2003-02-21 | 2004-08-17 | International Business Machines Corporation | Method of optical proximity correction with sub-resolution assists |
US7149999B2 (en) | 2003-02-25 | 2006-12-12 | The Regents Of The University Of California | Method for correcting a mask design layout |
DE602004022141D1 (de) | 2003-02-27 | 2009-09-03 | Univ Hong Kong | Mehrfachbelichtungsverfahren zur schaltungsleistungsverbesserung und maskenset |
JP4531340B2 (ja) | 2003-02-27 | 2010-08-25 | ルネサスエレクトロニクス株式会社 | マルチプレクサセルのレイアウト構造 |
JP4290457B2 (ja) | 2003-03-31 | 2009-07-08 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
JP3920804B2 (ja) | 2003-04-04 | 2007-05-30 | 松下電器産業株式会社 | 半導体記憶装置 |
US6931617B2 (en) | 2003-04-21 | 2005-08-16 | Synopsys, Inc. | Mask cost driven logic optimization and synthesis |
US7051306B2 (en) | 2003-05-07 | 2006-05-23 | Mosaid Technologies Corporation | Managing power on integrated circuits using power islands |
US7065731B2 (en) | 2003-05-07 | 2006-06-20 | Cadence Design Systems, Inc. | Removal of acute angles in a design layout |
US7093208B2 (en) | 2003-05-12 | 2006-08-15 | International Business Machines Corporation | Method for tuning a digital design for synthesized random logic circuit macros in a continuous design space with optional insertion of multiple threshold voltage devices |
JP2004342757A (ja) | 2003-05-14 | 2004-12-02 | Toshiba Corp | 半導体集積回路及びその設計方法 |
US7063920B2 (en) | 2003-05-16 | 2006-06-20 | Asml Holding, N.V. | Method for the generation of variable pitch nested lines and/or contact holes using fixed size pixels for direct-write lithographic systems |
JP4233381B2 (ja) | 2003-05-21 | 2009-03-04 | 株式会社ルネサステクノロジ | 半導体装置とその製造方法 |
US7770144B2 (en) | 2003-05-28 | 2010-08-03 | Eric Dellinger | Modular array defined by standard cell logic |
US7107551B1 (en) | 2003-05-30 | 2006-09-12 | Prolific, Inc. | Optimization of circuit designs using a continuous spectrum of library cells |
US7183611B2 (en) | 2003-06-03 | 2007-02-27 | Micron Technology, Inc. | SRAM constructions, and electronic systems comprising SRAM constructions |
US7400627B2 (en) | 2003-06-05 | 2008-07-15 | Brooktree Broadband Holding, Inc. | ATM header compression using hash tables |
US6992916B2 (en) | 2003-06-13 | 2006-01-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | SRAM cell design with high resistor CMOS gate structure for soft error rate improvement |
JP4245418B2 (ja) | 2003-06-25 | 2009-03-25 | 富士通マイクロエレクトロニクス株式会社 | 斜め方向配線を有する半導体集積回路装置及びそのレイアウト方法 |
US20050009312A1 (en) | 2003-06-26 | 2005-01-13 | International Business Machines Corporation | Gate length proximity corrected device |
US6900999B1 (en) | 2003-06-30 | 2005-05-31 | Integrated Device Technology, Inc. | Ternary content addressable memory (TCAM) cells with small footprint size and efficient layout aspect ratio |
KR100577610B1 (ko) | 2003-07-15 | 2006-05-10 | 삼성전자주식회사 | 반도체 장치, 반도체 장치의 제조 방법 및 에스램 장치,에스램 장치 제조 방법. |
US6993741B2 (en) * | 2003-07-15 | 2006-01-31 | International Business Machines Corporation | Generating mask patterns for alternating phase-shift mask lithography |
EP1519421A1 (en) | 2003-09-25 | 2005-03-30 | Interuniversitair Microelektronica Centrum Vzw | Multiple gate semiconductor device and method for forming same |
US6921982B2 (en) | 2003-07-21 | 2005-07-26 | International Business Machines Corporation | FET channel having a strained lattice structure along multiple surfaces |
EP1569273A3 (fr) | 2003-07-30 | 2005-09-14 | St Microelectronics S.A. | Lignes conductrices enterrées dans des zones d'isolement |
JP4398195B2 (ja) | 2003-08-08 | 2010-01-13 | パナソニック株式会社 | 半導体記憶装置 |
US6924560B2 (en) | 2003-08-08 | 2005-08-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Compact SRAM cell with FinFET |
JP4620942B2 (ja) | 2003-08-21 | 2011-01-26 | 川崎マイクロエレクトロニクス株式会社 | 半導体集積回路のレイアウト方法、そのレイアウト構造、およびフォトマスク |
TWI220268B (en) | 2003-09-17 | 2004-08-11 | Faraday Tech Corp | Method for programming a routing layout design through one via layer |
US6957402B2 (en) | 2003-09-24 | 2005-10-18 | Artisan Components, Inc. | Yield maximization in the manufacture of integrated circuits |
US7345909B2 (en) | 2003-09-24 | 2008-03-18 | Yen-Jen Chang | Low-power SRAM memory cell |
KR100516226B1 (ko) | 2003-09-25 | 2005-09-23 | 동부아남반도체 주식회사 | 에스램 테스트용 셀 및 에스램 셀 테스트 방법 |
JP2005114752A (ja) | 2003-10-02 | 2005-04-28 | Yamaha Corp | 演奏装置 |
JP4599048B2 (ja) | 2003-10-02 | 2010-12-15 | 川崎マイクロエレクトロニクス株式会社 | 半導体集積回路のレイアウト構造、半導体集積回路のレイアウト方法、およびフォトマスク |
JP4632287B2 (ja) | 2003-10-06 | 2011-02-16 | 株式会社日立製作所 | 半導体集積回路装置 |
US7155689B2 (en) | 2003-10-07 | 2006-12-26 | Magma Design Automation, Inc. | Design-manufacturing interface via a unified model |
FR2860920A1 (fr) | 2003-10-14 | 2005-04-15 | St Microelectronics Sa | Procede de realisation de connexions conductrices de circuits integres, et circuit integre mettant en oeuvre des telles connexions |
JP2005123524A (ja) | 2003-10-20 | 2005-05-12 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2005123537A (ja) | 2003-10-20 | 2005-05-12 | Sony Corp | 半導体装置及び製造方法 |
US6867073B1 (en) | 2003-10-21 | 2005-03-15 | Ziptronix, Inc. | Single mask via method and device |
JP4346410B2 (ja) | 2003-10-28 | 2009-10-21 | 東芝メモリシステムズ株式会社 | 半導体集積回路の配線設計方法及び半導体集積回路 |
US7329953B2 (en) | 2003-10-29 | 2008-02-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure for reducing leakage currents and high contact resistance for embedded memory and method for making same |
JP2005149265A (ja) | 2003-11-18 | 2005-06-09 | Olympus Corp | 演算処理システム及び演算処理装置 |
US7269803B2 (en) | 2003-12-18 | 2007-09-11 | Lsi Corporation | System and method for mapping logical components to physical locations in an integrated circuit design environment |
US7052972B2 (en) | 2003-12-19 | 2006-05-30 | Micron Technology, Inc. | Method for forming sublithographic features during the manufacture of a semiconductor device and a resulting in-process apparatus |
JP4585197B2 (ja) | 2003-12-22 | 2010-11-24 | ルネサスエレクトロニクス株式会社 | レイアウト設計方法およびフォトマスク |
KR100702552B1 (ko) | 2003-12-22 | 2007-04-04 | 인터내셔널 비지네스 머신즈 코포레이션 | 이중 게이트 FinFET 디자인을 위한 자동화 레이어생성 방법 및 장치 |
JP2005197345A (ja) | 2004-01-05 | 2005-07-21 | Hitachi Ltd | 半導体装置 |
JP2005203447A (ja) | 2004-01-13 | 2005-07-28 | Toshiba Corp | 半導体集積回路、半導体集積回路設計システム及び半導体集積回路設計方法 |
US7064068B2 (en) | 2004-01-23 | 2006-06-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method to improve planarity of electroplated copper |
KR100564612B1 (ko) | 2004-02-19 | 2006-03-28 | 삼성전자주식회사 | 하드 디스크 드라이브 |
US7523429B2 (en) | 2004-02-20 | 2009-04-21 | Takumi Technology Corporation | System for designing integrated circuits with enhanced manufacturability |
WO2005081066A1 (en) | 2004-02-24 | 2005-09-01 | The University Of Hong Kong | Rectangular contact lithography for circuit performance improvement |
US7084476B2 (en) | 2004-02-26 | 2006-08-01 | International Business Machines Corp. | Integrated circuit logic with self compensating block delays |
US7335966B2 (en) * | 2004-02-26 | 2008-02-26 | Triad Semiconductor, Inc. | Configurable integrated circuit capacitor array using via mask layers |
US7353492B2 (en) | 2004-02-26 | 2008-04-01 | International Business Machines Corporation | Method of IC fabrication, IC mask fabrication and program product therefor |
JP2005243928A (ja) | 2004-02-26 | 2005-09-08 | Fujitsu Ltd | トレンチアイソレーションで分離されたトランジスタ対を有する半導体装置 |
US7115343B2 (en) | 2004-03-10 | 2006-10-03 | International Business Machines Corporation | Pliant SRAF for improved performance and manufacturability |
JP4317777B2 (ja) | 2004-03-10 | 2009-08-19 | パナソニック株式会社 | 半導体集積回路 |
US7423298B2 (en) | 2004-03-17 | 2008-09-09 | Sharp Kabushiki Kaisha | Bidirectional photothyristor chip, optical lighting coupler, and solid state relay |
JP2005268610A (ja) | 2004-03-19 | 2005-09-29 | Matsushita Electric Ind Co Ltd | スタンダードセルの設計方法及び半導体集積回路 |
DE102004063926B4 (de) | 2004-03-24 | 2017-10-19 | Infineon Technologies Ag | Konfigurierbare Treiberzelle eines logischen Zellenfeldes |
US7126837B1 (en) | 2004-03-26 | 2006-10-24 | Netlogic Microsystems, Inc. | Interlocking memory/logic cell layout and method of manufacture |
WO2005096381A1 (en) | 2004-04-01 | 2005-10-13 | Soisic | Improved layout of a sram memory cell |
US7449371B2 (en) | 2004-04-02 | 2008-11-11 | Triad Semiconductor | VIA configurable architecture for customization of analog circuitry in a semiconductor device |
US7653890B2 (en) | 2004-04-02 | 2010-01-26 | Cadence Design Systems, Inc. | Modeling resolution enhancement processes in integrated circuit fabrication |
US7404173B2 (en) | 2004-04-07 | 2008-07-22 | Aprio Technologies, Inc. | Intermediate layout for resolution enhancement in semiconductor fabrication |
US20050229130A1 (en) | 2004-04-07 | 2005-10-13 | Aprio Technologies, Inc. | Method and apparatus for selective, incremental, reconfigurable and reusable semiconductor manufacturing resolution-enhancements |
US7115920B2 (en) | 2004-04-12 | 2006-10-03 | International Business Machines Corporation | FinFET transistor and circuit |
CN100576725C (zh) | 2004-04-20 | 2009-12-30 | Nxp股份有限公司 | 提供差分输出信号的差分接收机和方法 |
EP1747520B1 (en) | 2004-05-07 | 2018-10-24 | Mentor Graphics Corporation | Integrated circuit layout design methodology with process variation bands |
US7194712B2 (en) | 2004-05-12 | 2007-03-20 | Synopsys, Inc. | Method and apparatus for identifying line-end features for lithography verification |
US7053668B2 (en) | 2004-05-25 | 2006-05-30 | Kabushiki Kaisha Toshiba | SOI sense amplifier with cross-coupled body terminal |
US6975133B1 (en) | 2004-05-27 | 2005-12-13 | International Business Machines Corporation | Logic circuits having linear and cellular gate transistors |
US7426710B2 (en) | 2004-05-27 | 2008-09-16 | Verisilicon Holdings, Co. Ltd. | Standard cell library having cell drive strengths selected according to delay |
US7257017B2 (en) | 2004-05-28 | 2007-08-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | SRAM cell for soft-error rate reduction and cell stability improvement |
KR100591158B1 (ko) | 2004-06-01 | 2006-06-19 | 동부일렉트로닉스 주식회사 | 반도체 소자의 게이트 전극의 제조 방법 |
US20070257277A1 (en) | 2004-06-04 | 2007-11-08 | Nec Corporation | Semiconductor Device and Method for Manufacturing the Same |
JP4834853B2 (ja) | 2004-06-10 | 2011-12-14 | シャープ株式会社 | 薄膜トランジスタ回路、薄膜トランジスタ回路の設計方法、薄膜トランジスタ回路の設計プログラム、設計プログラム記録媒体、及び表示装置 |
JP4248451B2 (ja) | 2004-06-11 | 2009-04-02 | パナソニック株式会社 | 半導体装置およびそのレイアウト設計方法 |
JP4778689B2 (ja) | 2004-06-16 | 2011-09-21 | パナソニック株式会社 | 標準セル、標準セルライブラリおよび半導体集積回路 |
US7327591B2 (en) | 2004-06-17 | 2008-02-05 | Texas Instruments Incorporated | Staggered memory cell array |
US7003068B2 (en) | 2004-06-21 | 2006-02-21 | Kenet, Inc. | Device for subtracting or adding a constant amount of charge in a charge-coupled device at high operating frequencies |
JP4405865B2 (ja) | 2004-06-24 | 2010-01-27 | 富士通マイクロエレクトロニクス株式会社 | 多層配線構造の製造方法及びfib装置 |
JP4175649B2 (ja) | 2004-07-22 | 2008-11-05 | 松下電器産業株式会社 | 半導体装置 |
AU2005269568A1 (en) | 2004-07-27 | 2006-02-09 | Easic Corporation | Structured integrated circuit device |
US7176508B2 (en) | 2004-07-27 | 2007-02-13 | International Business Machines Corporation | Temperature sensor for high power very large scale integration circuits |
JP2006049780A (ja) | 2004-08-09 | 2006-02-16 | Elpida Memory Inc | 半導体集積回路装置 |
US7093213B2 (en) | 2004-08-13 | 2006-08-15 | International Business Machines Corporation | Method for designing an integrated circuit defect monitor |
US7365432B2 (en) | 2004-08-23 | 2008-04-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory cell structure |
JP2006073696A (ja) | 2004-09-01 | 2006-03-16 | Matsushita Electric Ind Co Ltd | スタンダードセルを用いた半導体集積回路とその設計方法 |
US7632610B2 (en) | 2004-09-02 | 2009-12-15 | Intel Corporation | Sub-resolution assist features |
US7227183B2 (en) | 2004-09-17 | 2007-06-05 | International Business Machines Corporation | Polysilicon conductor width measurement for 3-dimensional FETs |
US20060063334A1 (en) | 2004-09-17 | 2006-03-23 | International Business Machines Corporation | Fin FET diode structures and methods for building |
US7185294B2 (en) * | 2004-09-23 | 2007-02-27 | Verisilicon Holdings, Co Ltd | Standard cell library having globally scalable transistor channel length |
DE102004047263B4 (de) | 2004-09-24 | 2010-04-22 | Qimonda Ag | Verfahren zum Erzeugen eines Abbildungsfehler vermeidenden Maskenlayouts für eine Maske |
US7337421B2 (en) * | 2004-09-30 | 2008-02-26 | Cadence Design Systems, Inc. | Method and system for managing design corrections for optical and process effects based on feature tolerances |
US7466607B2 (en) | 2004-09-30 | 2008-12-16 | Analog Devices, Inc. | Memory access system and method using de-coupled read and write circuits |
JP2006100718A (ja) | 2004-09-30 | 2006-04-13 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置の動作解析方法、これに用いられる解析装置およびこれを用いた最適化設計方法 |
JP2006114668A (ja) | 2004-10-14 | 2006-04-27 | Sony Corp | 半導体集積回路およびその製造方法 |
US7487475B1 (en) * | 2004-10-15 | 2009-02-03 | Cadence Design Systems, Inc. | Systems, methods, and apparatus to perform statistical static timing analysis |
JP2006119195A (ja) | 2004-10-19 | 2006-05-11 | Nec Electronics Corp | 配線のレイアウト方法 |
US7302651B2 (en) | 2004-10-29 | 2007-11-27 | International Business Machines Corporation | Technology migration for integrated circuits with radical design restrictions |
US7458045B2 (en) | 2004-10-29 | 2008-11-25 | Synopsys, Inc. | Silicon tolerance specification using shapes as design intent markers |
WO2006052738A2 (en) | 2004-11-04 | 2006-05-18 | Fabbrix, Inc. | A method and process for design of integrated circuits using regular geometry patterns to obtain geometrically consistent component features |
KR100587692B1 (ko) | 2004-11-05 | 2006-06-08 | 삼성전자주식회사 | 반도체 메모리 장치에서의 회로 배선 배치구조와 그에따른 배치방법 |
US7350183B2 (en) | 2004-11-05 | 2008-03-25 | International Business Machines Corporation | Method for improving optical proximity correction |
JP2006156778A (ja) | 2004-11-30 | 2006-06-15 | Matsushita Electric Ind Co Ltd | 半導体装置及びそのレイアウト設計方法 |
US7424696B2 (en) * | 2004-12-03 | 2008-09-09 | Lsi Corporation | Power mesh for multiple frequency operation of semiconductor products |
US7465973B2 (en) | 2004-12-03 | 2008-12-16 | International Business Machines Corporation | Integrated circuit having gates and active regions forming a regular grating |
JP2006165365A (ja) | 2004-12-09 | 2006-06-22 | Renesas Technology Corp | 半導体装置および半導体装置の製造方法 |
US7345330B2 (en) | 2004-12-09 | 2008-03-18 | Omnivision Technologies, Inc. | Local interconnect structure and method for a CMOS image sensor |
US7396732B2 (en) | 2004-12-17 | 2008-07-08 | Interuniversitair Microelektronica Centrum Vzw (Imec) | Formation of deep trench airgaps and related applications |
JP4357409B2 (ja) | 2004-12-17 | 2009-11-04 | 株式会社東芝 | 半導体集積回路装置及びその設計方法 |
JP2007043049A (ja) * | 2004-12-20 | 2007-02-15 | Matsushita Electric Ind Co Ltd | セル、スタンダードセル、スタンダードセル配置方法、スタンダードセルライブラリ、ならびに半導体集積回路 |
FR2879816B1 (fr) | 2004-12-20 | 2007-06-08 | Atmel Nantes Sa Sa | Circuit electronique comprenant au moins une premiere et une seconde paires differentielles dont les transistors partagent un meme caisson |
JP5392985B2 (ja) | 2004-12-28 | 2014-01-22 | スパンション エルエルシー | 半導体装置及びその動作制御方法 |
US7106620B2 (en) | 2004-12-30 | 2006-09-12 | International Business Machines Corporation | Memory cell having improved read stability |
US7509621B2 (en) | 2005-01-03 | 2009-03-24 | Synopsys, Inc. | Method and apparatus for placing assist features by identifying locations of constructive and destructive interference |
US7366997B1 (en) | 2005-01-11 | 2008-04-29 | Synplicity, Inc. | Methods and apparatuses for thermal analysis based circuit design |
JP2006196627A (ja) | 2005-01-12 | 2006-07-27 | Nec Electronics Corp | 半導体装置、及び半導体装置の設計プログラム |
DE102005002533B4 (de) | 2005-01-14 | 2007-09-13 | Infineon Technologies Ag | Verfahren zum Erzeugen eines Abbildungsfehler vermeidenden Maskenlayouts für eine Maske |
JP4455356B2 (ja) | 2005-01-28 | 2010-04-21 | Necエレクトロニクス株式会社 | 半導体装置 |
JP4602112B2 (ja) | 2005-02-17 | 2010-12-22 | 株式会社東芝 | 半導体集積回路の製造方法及び半導体集積回路 |
KR20060092408A (ko) | 2005-02-17 | 2006-08-23 | 삼성전자주식회사 | 고성능 배타적 오아 및 배타적 노아 회로 및 방법 |
JP5018475B2 (ja) | 2005-02-23 | 2012-09-05 | 富士通セミコンダクター株式会社 | 半導体回路装置及びその半導体回路装置の製造方法 |
US7287237B2 (en) | 2005-02-24 | 2007-10-23 | Icera Inc. | Aligned logic cell grid and interconnect routing architecture |
US7721246B2 (en) * | 2005-02-24 | 2010-05-18 | Synopsys, Inc. | Method and apparatus for quickly determining the effect of placing an assist feature at a location in a layout |
US7421678B2 (en) | 2005-02-24 | 2008-09-02 | Synopsys, Inc. | Assist feature placement using a process-sensitivity model |
US7200835B2 (en) | 2005-02-24 | 2007-04-03 | Texas Instruments Incorporated | Method of locating sub-resolution assist feature(s) |
US7266787B2 (en) | 2005-02-24 | 2007-09-04 | Icera, Inc. | Method for optimising transistor performance in integrated circuits |
US7188322B2 (en) | 2005-02-25 | 2007-03-06 | International Business Machines Corporation | Circuit layout methodology using a shape processing application |
TWI281317B (en) | 2005-03-07 | 2007-05-11 | Sunplus Technology Co Ltd | Self DC-bias high frequency logic gate, NAND gate, and NOR gate using the same |
US7304874B2 (en) | 2005-03-08 | 2007-12-04 | Lsi Corporation | Compact ternary and binary CAM bitcell architecture with no enclosed diffusion areas |
US7992122B1 (en) | 2005-03-25 | 2011-08-02 | Gg Technology, Inc. | Method of placing and routing for power optimization and timing closure |
US7563701B2 (en) | 2005-03-31 | 2009-07-21 | Intel Corporation | Self-aligned contacts for transistors |
US7882456B2 (en) | 2005-04-09 | 2011-02-01 | Cadence Design Systems, Inc. | Optical lithography correction process |
JP4634849B2 (ja) | 2005-04-12 | 2011-02-16 | 株式会社東芝 | 集積回路のパターンレイアウト、フォトマスク、半導体装置の製造方法、及びデータ作成方法 |
EP1712954B1 (en) | 2005-04-12 | 2010-05-19 | ASML MaskTools B.V. | A method and program product for performing double exposure lithography |
JP4921723B2 (ja) | 2005-04-18 | 2012-04-25 | 株式会社東芝 | 半導体装置の製造方法 |
TWI297101B (en) | 2005-04-20 | 2008-05-21 | Nanya Technology Corp | Phase shifting mask for equal line/space dense line patterns |
US7506300B2 (en) | 2005-04-29 | 2009-03-17 | Cadence Design Systems, Inc. | Apparatus and method for breaking up and merging polygons |
US7480891B2 (en) * | 2005-04-29 | 2009-01-20 | Cadence Design Systems, Inc. | Method and apparatus of model-based photomask synthesis |
US7441211B1 (en) | 2005-05-06 | 2008-10-21 | Blaze Dfm, Inc. | Gate-length biasing for digital circuit optimization |
US8044437B1 (en) | 2005-05-16 | 2011-10-25 | Lsi Logic Corporation | Integrated circuit cell architecture configurable for memory or logic elements |
JP4936418B2 (ja) | 2005-05-17 | 2012-05-23 | ルネサスエレクトロニクス株式会社 | 半導体装置とその製造方法、及び半導体装置の設計プログラム |
US7308669B2 (en) | 2005-05-18 | 2007-12-11 | International Business Machines Corporation | Use of redundant routes to increase the yield and reliability of a VLSI layout |
JP4912016B2 (ja) | 2005-05-23 | 2012-04-04 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
WO2006126125A1 (en) | 2005-05-26 | 2006-11-30 | Nxp B.V. | Electronic device |
US7411252B2 (en) | 2005-06-21 | 2008-08-12 | International Business Machines Corporation | Substrate backgate for trigate FET |
US7960791B2 (en) | 2005-06-24 | 2011-06-14 | International Business Machines Corporation | Dense pitch bulk FinFET process by selective EPI and etch |
US7492013B2 (en) | 2005-06-27 | 2009-02-17 | International Business Machines Corporation | Systems and arrangements to interconnect components of a semiconductor device |
WO2007002799A1 (en) | 2005-06-29 | 2007-01-04 | Lightspeed Logic, Inc. | Methods and systems for placement |
US8405216B2 (en) | 2005-06-29 | 2013-03-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interconnect structure for integrated circuits |
US7236396B2 (en) | 2005-06-30 | 2007-06-26 | Texas Instruments Incorporated | Area efficient implementation of small blocks in an SRAM array |
JP2007012855A (ja) | 2005-06-30 | 2007-01-18 | Matsushita Electric Ind Co Ltd | 半導体集積回路、標準セル、標準セルライブラリ、半導体集積回路の設計方法および半導体集積回路の設計装置 |
JP2007013060A (ja) * | 2005-07-04 | 2007-01-18 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JP2007018588A (ja) | 2005-07-06 | 2007-01-25 | Toshiba Corp | 半導体記憶装置および半導体記憶装置の駆動方法 |
US7235424B2 (en) | 2005-07-14 | 2007-06-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for enhanced CMP planarization using surrounded dummy design |
WO2007014053A2 (en) | 2005-07-22 | 2007-02-01 | Nanopower Technologies, Inc. | High sensitivity rfid tag integrated circuits |
DE112005003638B4 (de) | 2005-07-22 | 2018-10-25 | Fujitsu Semiconductor Ltd. | Verfahren zur Erstellung von Fotomaskenstrukturdaten und Verfahren zur Herstellung einer Halbleitervorrichtung |
US7404154B1 (en) | 2005-07-25 | 2008-07-22 | Lsi Corporation | Basic cell architecture for structured application-specific integrated circuits |
US7934172B2 (en) | 2005-08-08 | 2011-04-26 | Micronic Laser Systems Ab | SLM lithography: printing to below K1=.30 without previous OPC processing |
US7568174B2 (en) | 2005-08-19 | 2009-07-28 | Cadence Design Systems, Inc. | Method for checking printability of a lithography target |
JP2007093861A (ja) | 2005-09-28 | 2007-04-12 | Renesas Technology Corp | マスクパターン設計方法および半導体装置の製造方法 |
JP4761914B2 (ja) * | 2005-10-07 | 2011-08-31 | 川崎マイクロエレクトロニクス株式会社 | スタンダードセルライブラリ、半導体集積回路の設計方法、半導体集積回路パターンおよび半導体集積回路 |
US7749662B2 (en) | 2005-10-07 | 2010-07-06 | Globalfoundries Inc. | Process margin using discrete assist features |
US7485934B2 (en) | 2005-10-25 | 2009-02-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated semiconductor structure for SRAM cells |
JP4796817B2 (ja) | 2005-10-31 | 2011-10-19 | エルピーダメモリ株式会社 | 基本セル設計方法、レイアウト設計方法、設計装置およびプログラム |
US7397260B2 (en) | 2005-11-04 | 2008-07-08 | International Business Machines Corporation | Structure and method for monitoring stress-induced degradation of conductive interconnects |
US20070106971A1 (en) | 2005-11-04 | 2007-05-10 | Lizotech, Inc. | Apparatus for a routing system |
US7569309B2 (en) | 2005-11-09 | 2009-08-04 | Texas Instruments Incorporated | Gate critical dimension variation by use of ghost features |
US7527900B2 (en) | 2005-11-10 | 2009-05-05 | United Microelectronics Corp. | Reticle and optical proximity correction method |
US7934184B2 (en) | 2005-11-14 | 2011-04-26 | Takumi Technology Corporation | Integrated circuit design using modified cells |
JP2007141971A (ja) | 2005-11-15 | 2007-06-07 | Matsushita Electric Ind Co Ltd | 半導体集積回路の設計方法 |
JPWO2007063990A1 (ja) | 2005-12-02 | 2009-05-07 | 日本電気株式会社 | 半導体装置およびその製造方法 |
US7543262B2 (en) * | 2005-12-06 | 2009-06-02 | Cadence Design Systems, Inc. | Analog layout module generator and method |
US7569310B2 (en) | 2005-12-07 | 2009-08-04 | Intel Corporation | Sub-resolution assist features for photolithography with trim ends |
US7512017B2 (en) | 2005-12-21 | 2009-03-31 | Intel Corporation | Integration of planar and tri-gate devices on the same substrate |
JP4774294B2 (ja) | 2005-12-26 | 2011-09-14 | 富士通株式会社 | 集積回路レイアウト装置、その方法及びプログラム |
EP1804282A1 (en) | 2005-12-29 | 2007-07-04 | Interuniversitair Microelektronica Centrum vzw ( IMEC) | Methods for manufacturing dense integrated circuits |
US7640522B2 (en) | 2006-01-14 | 2009-12-29 | Tela Innovations, Inc. | Method and system for placing layout objects in a standard-cell layout |
US7614030B2 (en) | 2006-01-17 | 2009-11-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Scattering bar OPC application method for mask ESD prevention |
JP5091462B2 (ja) | 2006-01-19 | 2012-12-05 | パナソニック株式会社 | セルおよび半導体装置 |
JP4675249B2 (ja) | 2006-02-07 | 2011-04-20 | パナソニック株式会社 | 位置依存変動量計算方法並びに回路解析方法 |
US7480880B2 (en) * | 2006-02-21 | 2009-01-20 | International Business Machines Corporation | Method, system, and program product for computing a yield gradient from statistical timing |
US7469401B2 (en) | 2006-02-22 | 2008-12-23 | International Business Machines Corporation | Method for using partitioned masks to build a chip |
US8247846B2 (en) | 2006-03-09 | 2012-08-21 | Tela Innovations, Inc. | Oversized contacts and vias in semiconductor chip defined by linearly constrained topology |
US9035359B2 (en) | 2006-03-09 | 2015-05-19 | Tela Innovations, Inc. | Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods |
US7446352B2 (en) | 2006-03-09 | 2008-11-04 | Tela Innovations, Inc. | Dynamic array architecture |
US8839175B2 (en) | 2006-03-09 | 2014-09-16 | Tela Innovations, Inc. | Scalable meta-data objects |
US9009641B2 (en) | 2006-03-09 | 2015-04-14 | Tela Innovations, Inc. | Circuits with linear finfet structures |
US8225239B2 (en) | 2006-03-09 | 2012-07-17 | Tela Innovations, Inc. | Methods for defining and utilizing sub-resolution features in linear topology |
US8658542B2 (en) | 2006-03-09 | 2014-02-25 | Tela Innovations, Inc. | Coarse grid design methods and structures |
US9563733B2 (en) | 2009-05-06 | 2017-02-07 | Tela Innovations, Inc. | Cell circuit and layout with linear finfet structures |
US7763534B2 (en) | 2007-10-26 | 2010-07-27 | Tela Innovations, Inc. | Methods, structures and designs for self-aligning local interconnects used in integrated circuits |
US7943967B2 (en) * | 2006-03-09 | 2011-05-17 | Tela Innovations, Inc. | Semiconductor device and associated layouts including diffusion contact placement restriction based on relation to linear conductive segments |
US7932545B2 (en) * | 2006-03-09 | 2011-04-26 | Tela Innovations, Inc. | Semiconductor device and associated layouts including gate electrode level region having arrangement of six linear conductive segments with side-to-side spacing less than 360 nanometers |
US7908578B2 (en) * | 2007-08-02 | 2011-03-15 | Tela Innovations, Inc. | Methods for designing semiconductor device with dynamic array section |
US8225261B2 (en) | 2006-03-09 | 2012-07-17 | Tela Innovations, Inc. | Methods for defining contact grid in dynamic array architecture |
US8245180B2 (en) | 2006-03-09 | 2012-08-14 | Tela Innovations, Inc. | Methods for defining and using co-optimized nanopatterns for integrated circuit design and apparatus implementing same |
US7956421B2 (en) | 2008-03-13 | 2011-06-07 | Tela Innovations, Inc. | Cross-coupled transistor layouts in restricted gate level layout architecture |
JP2007265179A (ja) | 2006-03-29 | 2007-10-11 | Fujitsu Ltd | レイアウト検証方法、レイアウト検証装置 |
JP4882455B2 (ja) * | 2006-03-31 | 2012-02-22 | 富士通セミコンダクター株式会社 | 半導体集積回路のユニットセルおよびユニットセルを使用した配線方法および配線プログラム |
US7437691B2 (en) * | 2006-04-11 | 2008-10-14 | International Business Machines Corporation | VLSI artwork legalization for hierarchical designs with multiple grid constraints |
US7484197B2 (en) * | 2006-04-14 | 2009-01-27 | International Business Machines Corporation | Minimum layout perturbation-based artwork legalization with grid constraints for hierarchical designs |
US7509622B2 (en) | 2006-04-17 | 2009-03-24 | Synopsys, Inc. | Dummy filling technique for improved planarization of chip surface topography |
JP5579959B2 (ja) | 2006-04-18 | 2014-08-27 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置 |
US7407890B2 (en) | 2006-04-21 | 2008-08-05 | International Business Machines Corporation | Patterning sub-lithographic features with variable widths |
US7355906B2 (en) | 2006-05-24 | 2008-04-08 | International Business Machines Corporation | SRAM cell design to improve stability |
US7941776B2 (en) | 2006-05-26 | 2011-05-10 | Open-Silicon Inc. | Method of IC design optimization via creation of design-specific cells from post-layout patterns |
WO2007149004A1 (en) | 2006-06-13 | 2007-12-27 | Freescale Semiconductor, Inc. | Methods and apparatus for simulating distributed effects |
US7317339B1 (en) | 2006-06-16 | 2008-01-08 | Via Technologies, Inc. | N-domino register with accelerated non-discharge path |
US7459792B2 (en) | 2006-06-19 | 2008-12-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Via layout with via groups placed in interlocked arrangement |
US7992117B2 (en) | 2006-06-20 | 2011-08-02 | Adtran, Inc. | System and method for designing a common centroid layout for an integrated circuit |
JP2008004796A (ja) | 2006-06-23 | 2008-01-10 | Matsushita Electric Ind Co Ltd | 半導体装置および回路素子レイアウト方法 |
US7763932B2 (en) | 2006-06-29 | 2010-07-27 | International Business Machines Corporation | Multi-bit high-density memory device and architecture and method of fabricating multi-bit high-density memory devices |
US7444609B2 (en) * | 2006-06-29 | 2008-10-28 | International Business Machines Corporation | Method of optimizing customizable filler cells in an integrated circuit physical design process |
US7739627B2 (en) | 2006-07-05 | 2010-06-15 | Chew Marko P | System and method of maximizing integrated circuit manufacturing yield with context-dependent yield cells |
JP2008027940A (ja) | 2006-07-18 | 2008-02-07 | Matsushita Electric Ind Co Ltd | 半導体集積回路の設計方法および回路シミュレーション方法 |
DE102006037162B4 (de) | 2006-08-01 | 2008-08-21 | Qimonda Ag | Verfahren und Vorrichtung und deren Verwendung zur Prüfung des Layouts einer elektronischen Schaltung |
WO2008015111A2 (en) | 2006-08-04 | 2008-02-07 | Sagantec Israel Ltd | Method and system for adapting a circuit layout to a predefined grid |
US7966579B2 (en) | 2006-08-04 | 2011-06-21 | Infineon Technologies Ag | Methods of optical proximity correction |
US7873929B2 (en) | 2006-08-14 | 2011-01-18 | The Regents Of The University Of California | Method, apparatus and system for designing an integrated circuit including generating at least one auxiliary pattern for cell-based optical proximity correction |
US7886262B2 (en) * | 2006-08-15 | 2011-02-08 | Chew Marko P | System and method of maximizing integrated circuit manufacturing yield with fabrication process simulation driven layout optimization |
TW200811704A (en) | 2006-08-31 | 2008-03-01 | Univ Nat Yunlin Sci & Tech | Full adder of complementary type carry logic voltage compensator |
KR100773353B1 (ko) | 2006-09-26 | 2007-11-05 | 삼성전자주식회사 | 기판 플러그를 가지는 반도체 장치들 및 그의 형성방법들 |
US7434185B2 (en) | 2006-09-27 | 2008-10-07 | International Business Machines Corporation | Method and apparatus for parallel data preparation and processing of integrated circuit graphical design data |
JP4362785B2 (ja) | 2006-09-28 | 2009-11-11 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
US20080082952A1 (en) | 2006-09-29 | 2008-04-03 | Texas Instruments Incorporated | Method of inclusion of sub-resolution assist feature(s) |
JP4814044B2 (ja) | 2006-10-05 | 2011-11-09 | ルネサスエレクトロニクス株式会社 | パターン設計方法 |
JP2008103610A (ja) | 2006-10-20 | 2008-05-01 | Matsushita Electric Ind Co Ltd | 半導体集積回路の配線構造およびその設計方法と設計装置 |
US8230379B2 (en) | 2006-10-20 | 2012-07-24 | Kabushiki Kaisha Toshiba | Layout generating method for semiconductor integrated circuits |
US7624369B2 (en) | 2006-10-31 | 2009-11-24 | International Business Machines Corporation | Closed-loop design for manufacturability process |
US7802219B2 (en) | 2006-11-30 | 2010-09-21 | Cadence Design Systems, Inc. | Flat placement of cells on non-integer multiple height rows in a digital integrated circuit layout |
US7774739B2 (en) | 2006-11-30 | 2010-08-10 | Texas Instruments Incorporated | Methods for adjusting shifter width of an alternating phase shifter having variable width |
US8378407B2 (en) | 2006-12-07 | 2013-02-19 | Tower Semiconductor, Ltd. | Floating gate inverter type memory cell and array |
US8156450B2 (en) | 2006-12-18 | 2012-04-10 | Cadence Design Systems, Inc. | Method and system for mask optimization |
US7814447B2 (en) | 2006-12-29 | 2010-10-12 | Cadence Design Systems, Inc. | Supplant design rules in electronic designs |
US8178905B2 (en) | 2007-01-12 | 2012-05-15 | Panasonic Corporation | Layout structure of semiconductor device |
US7535751B2 (en) | 2007-02-12 | 2009-05-19 | Taiwan Semioconductor Manufacturing Co., Ltd. | Dual-port SRAM device |
JP5217180B2 (ja) | 2007-02-20 | 2013-06-19 | 富士通セミコンダクター株式会社 | 静電放電保護装置の製造方法 |
US8667443B2 (en) | 2007-03-05 | 2014-03-04 | Tela Innovations, Inc. | Integrated circuit cell library for multiple patterning |
US20080216207A1 (en) | 2007-03-09 | 2008-09-11 | Shen-Hai Tsai | Finger pressing massage glove |
KR100911187B1 (ko) | 2007-03-13 | 2009-08-06 | 주식회사 하이닉스반도체 | 래치 구조 및 그것을 포함하는 비트라인 센스앰프 구조 |
US7575973B2 (en) | 2007-03-27 | 2009-08-18 | Sandisk 3D Llc | Method of making three dimensional NAND memory |
US7543252B2 (en) | 2007-03-28 | 2009-06-02 | International Business Machines Corporation | Migration of integrated circuit layout for alternating phase shift masks |
US7791109B2 (en) | 2007-03-29 | 2010-09-07 | International Business Machines Corporation | Metal silicide alloy local interconnect |
US7757196B2 (en) | 2007-04-04 | 2010-07-13 | Cisco Technology, Inc. | Optimizing application specific integrated circuit pinouts for high density interconnect printed circuit boards |
US7723786B2 (en) | 2007-04-11 | 2010-05-25 | Ronald Kakoschke | Apparatus of memory array using FinFETs |
US7964267B1 (en) | 2007-04-13 | 2011-06-21 | Bae Systems Tensylon H.P.M., Inc. | Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape |
US7453125B1 (en) | 2007-04-24 | 2008-11-18 | Infineon Technologies Ag | Double mesh finfet |
US20080283910A1 (en) | 2007-05-15 | 2008-11-20 | Qimonda Ag | Integrated circuit and method of forming an integrated circuit |
JP4461154B2 (ja) | 2007-05-15 | 2010-05-12 | 株式会社東芝 | 半導体装置 |
US7911830B2 (en) | 2007-05-17 | 2011-03-22 | Integrated Magnetoelectronics | Scalable nonvolatile memory |
JP4445521B2 (ja) | 2007-06-15 | 2010-04-07 | 株式会社東芝 | 半導体装置 |
US7898040B2 (en) | 2007-06-18 | 2011-03-01 | Infineon Technologies Ag | Dual gate FinFET |
US7923337B2 (en) | 2007-06-20 | 2011-04-12 | International Business Machines Corporation | Fin field effect transistor devices with self-aligned source and drain regions |
US7759194B2 (en) * | 2008-07-25 | 2010-07-20 | Semiconductor Manufacturing International (Shanghai) Corporation | Electrically programmable device with embedded EEPROM and method for making thereof |
JP2009025914A (ja) * | 2007-07-17 | 2009-02-05 | Nec Electronics Corp | 半導体集積回路の設計方法及び設計プログラム |
US7700466B2 (en) | 2007-07-26 | 2010-04-20 | International Business Machines Corporation | Tunneling effect transistor with self-aligned gate |
US7625790B2 (en) | 2007-07-26 | 2009-12-01 | International Business Machines Corporation | FinFET with sublithographic fin width |
US20090057780A1 (en) | 2007-08-27 | 2009-03-05 | International Business Machines Corporation | Finfet structure including multiple semiconductor fin channel heights |
US8156451B2 (en) | 2007-09-14 | 2012-04-10 | Renesas Electronics Corporation | Method of manufacturing photomask |
KR100905157B1 (ko) | 2007-09-18 | 2009-06-29 | 주식회사 하이닉스반도체 | 반도체 소자의 미세 패턴 형성 방법 |
JP2009088085A (ja) | 2007-09-28 | 2009-04-23 | Tokyo Electron Ltd | 半導体装置の製造方法、半導体装置の製造装置、制御プログラム及びプログラム記憶媒体 |
US20090101940A1 (en) | 2007-10-19 | 2009-04-23 | Barrows Corey K | Dual gate fet structures for flexible gate array design methodologies |
US8042070B2 (en) | 2007-10-23 | 2011-10-18 | International Business Machines Corporation | Methods and system for analysis and management of parametric yield |
JP2009130238A (ja) | 2007-11-27 | 2009-06-11 | Fujitsu Microelectronics Ltd | 半導体装置 |
JP5193582B2 (ja) | 2007-12-12 | 2013-05-08 | 株式会社東芝 | 半導体装置の製造方法 |
EP2251901A4 (en) | 2007-12-14 | 2012-08-29 | Fujitsu Ltd | SEMICONDUCTOR DEVICE |
US7825437B2 (en) | 2007-12-28 | 2010-11-02 | Intel Corporation | Unity beta ratio tri-gate transistor static random access memory (SRAM) |
PL2235453T3 (pl) | 2007-12-31 | 2017-02-28 | Arçelik Anonim Sirketi | Urządzenie chłodzące |
US7957178B2 (en) | 2008-01-04 | 2011-06-07 | Texas Instruments Incorporated | Storage cell having buffer circuit for driving the bitline |
US7934173B2 (en) | 2008-01-14 | 2011-04-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reverse dummy insertion algorithm |
US7926001B2 (en) | 2008-01-16 | 2011-04-12 | Cadence Design Systems, Inc. | Uniformity for semiconductor patterning operations |
US7984395B2 (en) | 2008-01-17 | 2011-07-19 | Synopsys, Inc. | Hierarchical compression for metal one logic layer |
US8453094B2 (en) | 2008-01-31 | 2013-05-28 | Tela Innovations, Inc. | Enforcement of semiconductor structure regularity for localized transistors and interconnect |
US8866254B2 (en) | 2008-02-19 | 2014-10-21 | Micron Technology, Inc. | Devices including fin transistors robust to gate shorts and methods of making the same |
US7962878B2 (en) | 2008-02-26 | 2011-06-14 | Infineon Technologies Ag | Method of making an integrated circuit using pre-defined interconnect wiring |
US8423947B2 (en) | 2008-03-13 | 2013-04-16 | International Business Machines Corporation | Gridded glyph geometric objects (L3GO) design method |
US7939443B2 (en) | 2008-03-27 | 2011-05-10 | Tela Innovations, Inc. | Methods for multi-wire routing and apparatus implementing same |
US8173544B2 (en) | 2008-05-02 | 2012-05-08 | Texas Instruments Incorporated | Integrated circuit having interleaved gridded features, mask set and method for printing |
US7958465B2 (en) | 2008-05-08 | 2011-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dummy pattern design for reducing device performance drift |
US7917877B2 (en) | 2008-05-09 | 2011-03-29 | Cadence Design Systems, Inc. | System and method for circuit schematic generation |
EP2117045A1 (en) | 2008-05-09 | 2009-11-11 | Imec | Design Methodology for MuGFET ESD Protection Devices |
US7830025B2 (en) | 2008-05-19 | 2010-11-09 | United Microelectronics Corp. | Contact layout structure |
US7853915B2 (en) | 2008-06-24 | 2010-12-14 | Synopsys, Inc. | Interconnect-driven physical synthesis using persistent virtual routing |
KR101903975B1 (ko) | 2008-07-16 | 2018-10-04 | 텔라 이노베이션스, 인코포레이티드 | 동적 어레이 아키텍쳐에서의 셀 페이징과 배치를 위한 방법 및 그 구현 |
US8136072B2 (en) | 2008-11-03 | 2012-03-13 | Arm Limited | Standard cell placement |
US8363455B2 (en) | 2008-12-04 | 2013-01-29 | David Rennie | Eight transistor soft error robust storage cell |
MY163911A (en) | 2009-03-06 | 2017-11-15 | Shenzhen Standarad Patent & Trademark Agent Ltd | Leadless integrated circuit package having high density contacts |
US8116121B2 (en) | 2009-03-06 | 2012-02-14 | Kabushiki Kaisha Toshiba | Semiconductor device and manufacturing methods with using non-planar type of transistors |
US8184472B2 (en) | 2009-03-13 | 2012-05-22 | International Business Machines Corporation | Split-gate DRAM with lateral control-gate MuGFET |
US8004042B2 (en) | 2009-03-20 | 2011-08-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Static random access memory (SRAM) cell and method for forming same |
US8053299B2 (en) | 2009-04-17 | 2011-11-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of fabrication of a FinFET element |
US8076236B2 (en) | 2009-06-01 | 2011-12-13 | Globalfoundries Inc. | SRAM bit cell with self-aligned bidirectional local interconnects |
US8782586B2 (en) | 2009-07-16 | 2014-07-15 | Cadence Design Systems, Inc. | Method, system, and program product for routing an integrated circuit to be manufactured by doubled patterning |
US8294212B2 (en) | 2009-09-18 | 2012-10-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and apparatus for SRAM bit cell with low standby current, low supply voltage and high speed |
US8675397B2 (en) | 2010-06-25 | 2014-03-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cell structure for dual-port SRAM |
US8860107B2 (en) | 2010-06-03 | 2014-10-14 | International Business Machines Corporation | FinFET-compatible metal-insulator-metal capacitor |
US8839162B2 (en) | 2010-07-14 | 2014-09-16 | International Business Machines Corporation | Specifying circuit level connectivity during circuit design synthesis |
US8796759B2 (en) * | 2010-07-15 | 2014-08-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fin-like field effect transistor (FinFET) device and method of manufacturing same |
US9159627B2 (en) | 2010-11-12 | 2015-10-13 | Tela Innovations, Inc. | Methods for linewidth modification and apparatus implementing the same |
US8418111B2 (en) | 2010-11-24 | 2013-04-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for achieving multiple patterning technology compliant design layout |
US8402397B2 (en) | 2011-07-26 | 2013-03-19 | Mentor Graphics Corporation | Hotspot detection based on machine learning |
US8689164B2 (en) | 2011-10-18 | 2014-04-01 | National Taiwan University | Method of analytical placement with weighted-average wirelength model |
US9006841B2 (en) | 2011-12-30 | 2015-04-14 | Stmicroelectronics International N.V. | Dual port SRAM having reduced cell size and rectangular shape |
FR2996950B1 (fr) | 2012-10-11 | 2016-01-01 | Dolphin Integration Sa | Réseau de mémoire base sur des bascules |
JP2016517862A (ja) | 2013-04-25 | 2016-06-20 | ユーハン・コーポレイションYUHAN Corporation | 新規トリアゾロン誘導体またはその塩、およびそれを含む医薬組成物 |
-
2009
- 2009-07-02 KR KR1020177016186A patent/KR101903975B1/ko active IP Right Grant
- 2009-07-02 JP JP2011518789A patent/JP5599395B2/ja not_active Expired - Fee Related
- 2009-07-02 KR KR1020117003546A patent/KR101749351B1/ko active IP Right Grant
- 2009-07-02 WO PCT/US2009/049580 patent/WO2010008948A2/en active Application Filing
- 2009-07-02 SG SG10201608214SA patent/SG10201608214SA/en unknown
- 2009-07-02 MY MYPI2014002096A patent/MY167970A/en unknown
- 2009-07-02 KR KR1020167005477A patent/KR101739709B1/ko active IP Right Grant
- 2009-07-02 EP EP09798557.6A patent/EP2321748B1/en not_active Not-in-force
- 2009-07-02 SG SG2013054440A patent/SG192532A1/en unknown
- 2009-07-02 US US12/497,052 patent/US8214778B2/en not_active Expired - Fee Related
- 2009-07-02 MY MYPI20110142 patent/MY152456A/en unknown
- 2009-07-02 KR KR1020167020458A patent/KR101761530B1/ko active IP Right Grant
- 2009-07-16 TW TW098124107A patent/TWI402709B/zh not_active IP Right Cessation
-
2012
- 2012-07-02 US US13/540,529 patent/US8549455B2/en not_active Expired - Fee Related
-
2013
- 2013-09-27 US US14/040,590 patent/US8966424B2/en not_active Expired - Fee Related
-
2014
- 2014-06-02 JP JP2014114053A patent/JP5923135B2/ja not_active Expired - Fee Related
-
2015
- 2015-01-26 US US14/605,946 patent/US9424387B2/en not_active Expired - Fee Related
-
2016
- 2016-04-15 JP JP2016081684A patent/JP6412050B2/ja not_active Expired - Fee Related
- 2016-08-22 US US15/243,748 patent/US9910950B2/en not_active Expired - Fee Related
-
2017
- 2017-05-12 JP JP2017095825A patent/JP2017143307A/ja active Pending
-
2018
- 2018-03-06 US US15/913,819 patent/US20180196909A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7028285B2 (en) * | 2000-07-05 | 2006-04-11 | Synopsys, Inc. | Standard cell design incorporating phase information |
TW200813587A (en) * | 2006-07-19 | 2008-03-16 | Koninkl Philips Electronics Nv | Arrays of particle containing cells |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI402709B (zh) | 動態陣列結構內之元件相位調整與配置方法及其實施 | |
US9530795B2 (en) | Methods for cell boundary encroachment and semiconductor devices implementing the same | |
US10074640B2 (en) | Integrated circuit cell library for multiple patterning | |
AU2018200549B2 (en) | Circuits with linear finfet structures | |
US8759882B2 (en) | Semiconductor device with dynamic array sections defined and placed according to manufacturing assurance halos | |
US20170365621A1 (en) | Semiconductor Chip and Method for Manufacturing the Same | |
EP3327594A1 (en) | Methods for cell phasing and placement in dynamic array architecture and implementation of the same | |
US11182527B2 (en) | Cell placement site optimization |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |