CN1567608A - 波长变换填料及含有这种填料的光学元件 - Google Patents
波长变换填料及含有这种填料的光学元件 Download PDFInfo
- Publication number
- CN1567608A CN1567608A CNA2004100367021A CN200410036702A CN1567608A CN 1567608 A CN1567608 A CN 1567608A CN A2004100367021 A CNA2004100367021 A CN A2004100367021A CN 200410036702 A CN200410036702 A CN 200410036702A CN 1567608 A CN1567608 A CN 1567608A
- Authority
- CN
- China
- Prior art keywords
- light
- filler
- luminous
- colorant
- wavelength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 88
- 239000000203 mixture Substances 0.000 title abstract description 8
- 238000005266 casting Methods 0.000 title abstract 4
- 239000002245 particle Substances 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 8
- 150000004645 aluminates Chemical class 0.000 claims abstract description 4
- 239000000945 filler Substances 0.000 claims description 62
- 239000003086 colorant Substances 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 35
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 230000005855 radiation Effects 0.000 claims description 14
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 12
- 230000003595 spectral effect Effects 0.000 claims description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 239000002223 garnet Substances 0.000 claims description 5
- 229910052706 scandium Inorganic materials 0.000 claims description 5
- 229910052727 yttrium Inorganic materials 0.000 claims description 5
- 241000286819 Malo Species 0.000 claims description 4
- 230000005670 electromagnetic radiation Effects 0.000 claims description 4
- 101100476480 Mus musculus S100a8 gene Proteins 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 2
- 229910052765 Lutetium Inorganic materials 0.000 claims description 2
- 229910000204 garnet group Inorganic materials 0.000 claims description 2
- 239000000049 pigment Substances 0.000 abstract description 20
- 229920005989 resin Polymers 0.000 abstract description 17
- 239000011347 resin Substances 0.000 abstract description 17
- 239000004593 Epoxy Substances 0.000 abstract description 14
- 239000000126 substance Substances 0.000 abstract 5
- 229910052605 nesosilicate Inorganic materials 0.000 abstract 1
- 150000004762 orthosilicates Chemical class 0.000 abstract 1
- 239000008187 granular material Substances 0.000 description 16
- 238000000295 emission spectrum Methods 0.000 description 14
- 238000004382 potting Methods 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 238000001228 spectrum Methods 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- 238000005401 electroluminescence Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 229910052761 rare earth metal Inorganic materials 0.000 description 4
- 150000002910 rare earth metals Chemical class 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 241001062009 Indigofera Species 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 2
- AIWJWZUKKADPIK-UHFFFAOYSA-N 4-methoxyhexa-1,5-dien-3-ol Chemical compound COC(C(C=C)O)C=C AIWJWZUKKADPIK-UHFFFAOYSA-N 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000005213 imbibition Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
- C09K11/7716—Chalcogenides
- C09K11/7718—Chalcogenides with alkaline earth metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
- C09K11/7721—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7743—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing terbium
- C09K11/7744—Chalcogenides
- C09K11/7746—Chalcogenides with alkaline earth metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7743—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing terbium
- C09K11/7749—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7767—Chalcogenides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7767—Chalcogenides
- C09K11/7769—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Led Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
一种掺有发光材料的波长变换填料(5),它被应用于具有一个发紫外光、蓝光或绿光的LED芯片(1)的电致发光元件中,其特征在于:所述的发光材料包含有无机发光色料粉末(6),该无机发光色料由一个组构成,该组包含粒度≤20μm且d50-值≤5μm的用稀土掺杂的石榴石、用稀土掺杂的硫镓酸盐、用稀土掺杂的铝酸盐和/及用稀土掺杂的原硅酸盐。本发明还涉及含有上述波长变换填料的发光光学元件。
Description
本申请是申请号为97191656.X、申请日为1997.9.221、发明名称为“波长变换填料、它的应用及其制造方法”的分案申请。
技术领域
本发明涉及一种掺有发光材料的波长变换填料,它被应用于具有一个发紫外光、蓝光或绿光的LED芯片的电致发光元件中。本发明还涉及含有这种填料的光学元件。
背景技术
这样一种元件例如已由公开文献DE 3804 293公知。其中描述了一种具有电致发光二极管或激光二极管,它们借助一种由塑料组成的掺有荧光光波变换有机色料的部件使由二极管发出的发射光谱移到较长的波长上。由该装置发出的光由此具有不同于发光二极管发光的颜色。根据添加到塑料中的色料类型,可以生产出具有同一种发光二极管类型的发光二极管装置,它们可发出不同颜色的光。
在发光二极管的许多可能的应用领域,如在机动车仪表盘中的显示元件、飞机及汽车中的照明及全色柔光LED显示器方面,对发光二极管装置提出了强烈的要求,希望能由它们产生出混色光,尤其是白光。
但是,至今公知的开始部分所述类型的具有有机发光材料的填料在温度及温度-湿度应力下表现出色点的偏移,即由电致发光元件发出光的颜色的偏移。
在JP-07 176 794-A中描述了一种发白光的平面光源,其中在一透明板的前侧设置了两个发蓝光的二极管,其光线穿过透明板发出。透明板在其两个彼此对置的主平面之一上涂有荧光物质,当它受二极管的蓝光激发时发出光束,由荧光物质发出的光具有不同于二极管发出的蓝光的波长。在该公知的元件中特别困难的是,用一种方式及方法来施加荧光物质,以使得该光源能发出均匀的白色。此外,大规模生产的生产能力有问题,因为荧光层的很小层厚波动、例如是由于透明板表面不平整度引起的,将导致发出光的白色调的变化。
发明内容
本发明的任务在于,开发一种开始部分所述类型的填料,借助它可制造出能发出均匀混合色光的电致发光元件,并可实现以技术上有代表性的成本及普遍可再现的元件特性进行大规模生产。它所发出的光在温度及温度-湿度应力下应能保持色稳定。此外还将给出制造这种填料的方法。
该任务将通过具有如下特征的填料来解决,即:
一种掺有发光材料的波长变换填料,它被应用于具有一个发紫外光、蓝光或绿光的LED芯片的电致发光元件中,其特征在于:所述的发光材料包含有无机发光色料粉末,该无机发光色料由一个组构成,该组包含粒度≤20μm且d50-值≤5μm的用稀土掺杂的石榴石、和/或用稀土掺杂的硫镓酸盐、和/或用稀土掺杂的铝酸盐、和/或用稀土掺杂的原硅酸盐。
优选地,所述的无机发光色料粉末包含有由通式为A3B5X12:M的磷光体族构成的发光色料,其中A代表Y、Gd和/或Lu,B代表Al和/或Ga,X代表O,M代表Ce3+、Tb3+、Eu3+、Cr3+、Nd3+或Er3+,而且所述发光色料的粒度≤20μm且d50-值≤5μm。
在进一步的改进方案中,采用CaGa2S4:Ce3+、SrGa2S4:Ce3+、MAlO3:Ce3+、MAlO3:Ce3+、和/或M2SiO5:Ce3+作为发光色料粉末,其中M代表Y、Sc、La。
有利地,所述发光色料是球形的或鳞片状的。
优选地,所述发光色料的d50-值在1到2μm之间。
有益的是,使用出自于用Ce掺杂的石榴石组中的颗粒作为发光色料。可以使用YAG:Ce颗粒作为发光色料。
根据本发明的发光光学元件,它具有所述的波长变换填料,以及具有半导体主体,该半导体主体在所述光学元件工作时发出电磁辐射,其特征在于:所述半导体主体具有一个半导体层序列,该层序列适合于在所述半导体元件工作时从紫外光、蓝光或绿光频谱区域中发出电磁辐射;所述发光色料把来自于所述频谱区域中的辐射变换成具有更大波长的辐射,使得该半导体元件发出混合的辐射、尤其是混合色的光,该混合的辐射或光由所述具有更大波长的辐射和所述紫外光、蓝光或绿光频谱区域中的辐射组成。
优选地,所述的填料至少包封了所述半导体主体的一部分。
根据上述发光光学元件的一种改进方案,由所述半导体主体发出的辐射在420-460nm的波长时具有发光强度最大值。
有利的是,所述半导体主体被布置在不透光的基壳的槽中,而且所述的槽至少部分地被填充了所述的填料。
优选地,在所述的发光材料中包含有不同类型的发光颗粒类型,这些颗粒类型在不同的波长时发光。
作为触变剂,例如可使用高温蒸馏的硅酸。该触变剂用于浓缩环氧填充树脂,以减小发光色料颗粒的沉积。对于填充树脂的处理,将继续调整其流动性及浸润特性。
作为矿物扩散剂,为了优化元件的发光图象,最好使用CaF2。
作为处理助剂,如乙二醇醚(Glykolether)能适用。它能改善环氧填充树脂及发光色料颗粒的相容性并由此稳定发光色料颗粒-环氧填充树脂扩散体。为此目的也可使用基于硅的外表面改型。
疏水剂、如流体硅蜡同样用于修改色料表面,尤其是改善无机色料表面与有机树脂的相容性及浸润性。
随着媒介质、如烷氧基硅氧烷(Alkoxysiloxan)在填料固化状态下改善色料及环氧树脂之间的附着。由此可达到,例如在温度波动时,环氧树脂及色料之间的界面不会被撕裂。在环氧树脂及色料之间的间隙将会导致元件中的光损耗。
环氧填充树脂最好包含一种反应环氧乙烷三环,该树脂最好具有:单功能和/或多功能的环氧填充树脂体系(≥80Gew%,例如Bisphenol-A-Diglycidylether),一种稀释剂(≤10Gew%,例如aromatischer Monoglycidylether),一种多功能乙醇(≤5Gew%),一种硅基除气剂(≤1Gew%),及一种去色剂,用于调整色值(≤1Gew%)。
在该填料的一种特别有利的进一步构型中,发光色料为球状或鳞片状。有利的是这种色料聚成块的倾向非常小。H2O的含量低于2%。
在制造及加工具有无机发光色料颗粒的环氧填充树脂成分时通常除浸润的问题外还有沉积问题。尤其是d50≤5μm的发光色料颗粒极其倾向于结块。在上述的填料的组成成分的情况下,发光色料能有利地以上面给出的粒度基本上不结块并均匀地散布在环氧填充树脂中。这种散布即使在填料较长期的存放的情况下也是稳定的。实际上不会出现浸润和/或沉积的问题。
特别有利的是使用出自于用Ce掺杂的石榴石(Granate)组中的颗粒作为发光材料、尤其是使用YAG:Ce颗粒作为发光材料。有利的掺杂材料浓度例如为1%,及有利的发光材料浓度例如为12%。此外,优选的高纯度发光色料颗粒最好具有的铁含量≤5ppm。较高的铁含量将引起元件中较大的光损耗。发光色料颗粒有很强的研磨性。因此,填料的Fe含量在制造时会显著地增加。最好在填料中的铁含量<20ppm。
无机发光材料YAG:Ce首先具有特殊的优点,即在此情况下它涉及具有计算指数约为1,84的不分离色料。由此除了波长转换的散布性能外还有散射效能,这可导致蓝色二极管光与黄色转换光的良好混合。
此外特别有利的是,在使用无机发光色料时环氧树脂中的发光材料浓度不会象使用有机色料时那样受到溶解度的限制。
为了进一步避免结块,发光色料最好设有一个硅涂层。
在一种制造根据本发明的填料的优选方法中,发光色料颗粒在与环氧填充树脂混合前在≥200℃的温度下进行例如约10小时的热处理。由此同样可减小其结块的倾向。
换一种方式或附加地,发光色料颗粒在与环氧填充树脂混合前在一种高沸点的乙醇中淘洗并且然后被干燥。另一种减少结块的可能性在于,发光色料颗粒在与环氧填充树脂混合前被添加一种疏水的硅蜡。特别有利的是,磷的表面稳定性通过在存在乙二醇醚(Glykolethern)的情况下通过加热色料、例如在T>60℃时加热16小时来实现。
为了避免由于研磨引起的发光色料散布时的干扰杂质,反应容器、搅拌及扩散装置和轧制机内玻璃、金刚砂、碳化物及氮化物材料及特珠硬化的钢材。不结块的发光材料的散布可以用超声波法或通过使用筛及玻璃陶瓷烧结来得到。
一种用于制造发白光的光电元件的特别有利的无机发光材料是磷光体YAG:Ce(Y3Al5O12:Ce3+)。它能以特别简单的方式与在传统的LED技术中应用的透明环氧填充树脂相混合。此外可考虑作为发光材料的是另外用稀土元素掺杂石榴石,如:Y3Ga5O12:Ce3+,Y(Al,Ga)5O12:Ce3+及Y(Al,Ga)5O12Tb3+。此外,用稀土元素掺杂的硫镓酸盐(Thiogallate),如CaGa2S4:Ce3+及SrGa2S4:Ce3+特别适用于产生混合色光。对此同样可以考虑使用:用稀土元素掺杂的铝酸盐,如YalO3:Ce3+,YGaO3:Ce3+,Y(Al,Ga)O3:Ce3+及用稀土元素掺杂的原硅酸盐M2SiO5:Ce3+(M:Sc、Y、Sc)如Y2SiO5:Ce3+,对于镱的化合物原则上可用钪或镧来代替镱。
根据本发明的填料最好应用于光发射半导体主体,尤其是具有由GaxIn1-xN或GaxAl1-xN组成的有源半导体层或层列的半导体主体,它在工作时发射在紫外光、蓝光和/或绿光光谱范围中的光波。在填料中的发光色料颗粒将出自该光谱区域中的一部分光转换成具有较长波长的克,以使得该半导体元件发射混合光,尤其是由此种转换光与出自于紫外、蓝和/或绿光光谱中的光组成的混合色光。这就是譬如,发光发光色料颗粒选择地吸收了由半导体主体发出的光谱的一部分并在较长波长区域中再发射出来。最好由半导体主体发出的光在波长λ≤520nm时具有相对强度最大值,及由发光发光色料颗粒选择性吸收光谱的波长区域位于该强度最大值以外。
同样,也可有利地用多种不同类型的发射不同波长的发光发光色料颗粒散布在填料中。这最好是通过在不同的施主晶格中的不同掺杂来达到。由此便可有利地实现:产生出多种多样的由半导体元件发出光的混合色及色温。特别感兴趣的是它用于全色柔光LED。
在根据本发明的填料的一个有利应用方面,发光半导体主体(例如一个LED芯片)至少部分地被填料包围。该填料在这里最好同时作为元件封装件(外壳)来使用。根据该实施形式的半导体元件的优点实质上在于:对于它的制造可以使用制造传统发光二极管(例如辐射型发光二极管)所使用的传统生产线。对于元件的封装只需使用填料来简单地替代在传统发光二极管中为此所使用的透明塑料。
使用根据本发明的填料可以通过简单的方式可以制造单色光源、尤其是具有发射单一蓝光的半导体主体的发光二极管,发射混合光、尤其是白光的光源。为了使用譬如发蓝光的半导体主体来产生白光,将借助于无机发光色料颗粒使由半导体主体发出光的一部分由蓝色光谱区域转换到作为蓝色的补色的黄色光谱区域。
在此情况下,通过对发光材料、其颗粒粒度及其浓度的合适选择使白光的色温或色点变化。此外也可以使用发光材料混合物,由此能有利地、非常精确地调节发出光线的所需色调。
尤其有利地是该填料应用于一种发光半导体主体,由它发出的光谱在420nm及460nm的波长上,尤其在430nm(例如基于GaxAl1-xN的半导体主体)或450nm(例如基于GaxIn1-xN的半导体主体)时具有强度的最大值。利用这种半导体元件能有利地产生出C.I.E.色板中所有的颜色及混合色。但是也可以用另外的电致发光材料、例如聚合物材料来取代由电致发光半导体材料作的发光半导体主体。
该填料特别适合于一种发光半导体元件(例如发光二极管),其中发光半导体主体被放置在一个外壳的槽中,该外壳可以与一个引线框预制在一起,及该槽中将注有填料。这样一种半导体元件可以用传统的生产线大批量地制造。对此仅需在将半导体主体安装到外壳中后用填料充填槽。
可以使用根据本发明的填料这样有利地制造发白光的半导体元件,即,选择发光材料,以使得由半导体主体发出的蓝光转换成互补的波长区域、尤其是蓝光及黄光,或加色三色组如蓝、绿及红。这样产生的白光的色调(CIE色板中的色点)可以通过鉴于混合物及浓度的发光材料的选择来改变。
为了使由电致发光半导体主体发出的光与由发光材料转换的光均匀混合并由此改善由元件发出的光的色均匀度,在根据本发明的填料的一个有利构型中附加了一种发蓝光的色料,它将削弱由半导体主体发出的光线的所谓方向特性。对于方向特性理解为,由半导体主体发出的光具有一个优先的发光方向。
根据本发明的具有发蓝光的电致发光半导体主体的发白光的半导体元件可以这样特别有利地实现:在作为填料使用的环氧树脂中混合无机的发光材料YAG:Ce(Y3Al5O12:Ce3+)。由该半导体主体发出的蓝光的一部分将被无机发光材料Y3Al5O12:Ce3+转换到黄光光谱区域,由此移动到为蓝色补色的波长区域。在此情况下可通过色料浓度的合适选择来改变白光的色调(CIE色板中的色点)。
对填料可添加附加的发光颗粒,即所谓扩散剂。由此能使半导体元件的色效果及发光性能有利地进一步优化。
利用根据本发明填料也可有利地使由电致发光半导体主体发出的除可见光以外的紫外光转换成可见光。由此使该半导体主体发出光的亮度明显地增强。
根据本发明的发白光的半导体元件,尤其是其中使用了YAG:Ce光转换色料的半导体元件的特殊优点在于:这种发光材料在蓝光激励下,在吸收和发射光谱之间起到移动100nm的光谱移动作用。这导致对由发光材料发射出的光的再吸收实质性地减小并由此导致增强的光输出量。此外,YAG:Ce有利地具有高的热稳定性及光化学(例如UV-)稳定性(实质地高于有机发光材料),由此可制造用于室外和/或高温区域的发白光的二极管。
YAG:Ce鉴于其再吸收性、光输出量、热及光化学的稳定性及可加工性,至今被看作最适合的发光材料。但也可考虑使用另外Ce掺杂的磷光体、尤其是Ce掺杂的石榴石类。
原光的波长转换将通过施主晶格中有源过渡金属中心的晶体场分离来确定。通过用Gd和/或Lu代替Y3Al5O12施主晶格中的Y及用Ga代替Al,可使发射波长以不同的方式移动,此外也可通过掺杂类型来移动。通过用Eu3+和/或Cr3+代替Ce3+中心可以产生相应的波长移动。用Nd3+及Er3+的相应掺杂由于较大的离子半径及由此较小的晶体场分离,甚至可以实现发射IR(红外线)的元件。
附图说明
由以下结合附图1至8对两个实施例的描述将会得出本发明的其它特征、优点及目的。
附图为:
图1是具有根据本发明的填料的第一半导体元件的概要剖面图;
图2是具有根据本发明的填料的第二半导体元件的概要剖面图;
图3是具有根据本发明的填料的第三半导体元件的概要剖面图;
图4是具有根据本发明的填料的第四半导体元件的概要剖面图;
图5是具有根据本发明的填料的第五半导体元件的概要剖面图;
图6是一个具有基于GaN层列的发蓝光的半导体主体的发射光谱的概图;
图7是具有根据本发明的填料的、发白光的两个半导体元件的发射光谱的概图;及
图8是由另外发白光的半导体元件发射的光谱的概图。
在不同的附图中相同的或相同功能的部分均以相同的标号表示。
具体实施方式
在图1的发光半导体元件中,半导体主体1借助导电连接部分、例如金属焊剂或粘剂用其背面触点11固定在第一电端子2上。其正面触点12借助一根连接导线14与第二电端子3相连接。
半导体主体1的自由上表面及电端子2和3的部分区域直接地被固化的波长转换填料5封装。它最好具有:环氧填充树脂80-90%Gew%(重量百分比),发光色料(YAG:Ce)≤15Gew%,二乙烯乙二醇-甲醚(Diethylenglycolmono methylether)≤2Gew%,Tegopreg6875-45≤2Gew%,Aerosil 200≤5Gew%。
在图2中表示的根据本发明半导体元件的实施例5与图1中实施例的区别在于:半导体主体1及电端子2和3的部分区域不是被波长转换填料而是被一透明的封块15封装。该透明封块15对由半导体主体1发出的光束不起波长改变作用,它例如由发光二极管技术中传统使用的环氧树脂、硅树脂或丙烯酸盐树脂、或由另外合适的透明材料如无机玻璃组成。
在该透明封块15上加上一个层4,它由一种波长转换填料作成,并如图2中所示,它覆盖着封块15的整个外表面。同样可考虑,层4仅覆盖该外表面的部分区域。层4例如由一种掺有发光发光色料颗粒6的透明环氧树脂组成。这里对于发白光半导体元件适用的发光材料最好是YAG:Ce。
在图3中表示的具有根据本发明填料的、特别优选的元件中,第一及第二电端子2、3被埋放在带有槽的透明亦或预制好的基壳8中。“预制好”应理解为,在半导体主体装在端子2上以前,基壳8就已经例如借助注塑构成在端子2、3上。基壳8例如由一种透明的塑料组成,及槽就其形状言构成半导体工作时发射光束的反射器(必要时在槽内壁上采用合适的涂层)。这样的基壳8特别适用于可在印刷电路板上安装的发光二极管。它在装半导体主体前例如借助注塑被形成在带有电端子2、3的导体带(引线框架)上。
槽中充填填料5,它们组成成分相应于以上结合图1所描述的材料。
图4中表示一种所谓辐射二极管。其中电发光半导体主体1借助焊接或粘接被固定在构成反射器的第一电端子2的部分上。这种外壳的形状是发光二极管技术中公知的,故无需赘述。
半导体主体1的自由上表面直接地由带有发光发光色料颗粒6的填料5覆盖,后者又被另一透明封块10包围。
因完整起见,这里应注意到,在图4的结构形式中,当然可类似图1所示的元件利用带有发光发光色料颗粒6的固化填料5组成的单一封块。
在图5的实施例中直接地将一个层4(可以用与上述相同的材料)包围在半导体主体1上。这部分以及电端子2、3的部分区域将由另一透明封块10封装,后者对透过层4的光束不起任何波长改变作用,并例如由在发光二极管技术中所使用的透明环氧树脂或玻璃来制作。
这种设有层4的半导体主体1在无封块的情况下,也当然可以有利地使用由发光二极管技术中全部公知的外壳结构形成(例如,SMD外壳、辐射状外壳(请参见图4))。
在上述所有元件中,为了优化发光的彩色效果及为了发光性能的适配,填料5、需要时,透明封块15和/或需要时,另外的透明封块10具有散射光的颗粒,最好是所谓的扩散剂。这种扩散剂例如为矿物填充材料,尤其是CaF2、TiO2、SiO2、CaCO3或BaSO4或是有机染料。这些材料可用简单方式掺和在环氧树脂中。
在图6、7及8中表示一个发蓝光的半导体主体的发射光谱(图6)(在λ~430nm时为最大发光强度)及借助这样的半导体主体制造的发白光的半导体元件的发射光谱(图7及8)。在其横座标上各表示单位为nm的波长,及在纵坐标上各表示相对电致发光(EL)强度。
由图6中所示的半导体主体发出的光线仅有一部分被转换到长波的波长区域,由此形成作为混合色的白光。图7中的虚线表示一个半导体元件的发射光谱,其光线由两个互补的波长区域(蓝及黄)组成并由此发出总的白光。这里发射光谱在约400及约430nm(蓝光)之间的波长及在约550及约580nm(黄光)之间的波长上各具有一个最大值,实线31代表一个半导体元件的发射光谱,其颜色白色是由三个波长区域(由蓝、绿及红组成的三色混合组)混合组成。这里其发射光谱例如在约430nm(蓝)、约500nm(绿)及约615nm的波长时各具有一个最大值。
图8表示一个发白光的半导体元件的发射光谱,该半导体元件设有一个发出图6所示发射光谱的半导体主体,并在其中使用了发光材料YAG:Ce。在由该半导体主体发出的图6所示的光线中仅有一部分转换成长波波长区域,由此形成混合色白光。图8中不同类型的虚线30至33表示根据本发明的半导体元件的发射光谱,在其中填料5的环氧树脂具有不同的YAG:Ce浓度。每个发射光谱在λ=420nm及λ=430nm之间、即蓝色光谱区域中,和在λ=520nm及λ=545nm之间、即绿色光谱区域中各具有一个强度最大值,其中具有长波最大值的发射频带大部分位于黄色频谱区域中,图8中所示附图表明,在根据本发明的半导体元件中可以用简单方式通过改变环氧树脂中发光材料浓度来改变白光的CIE色点。
借助上述元件对本发明的说明当然不能看作是对本发明的限制。作为半导体主体,例如发光二极管芯片或激光二极管芯片也可理解为聚合物LED,它发射相应的光线频谱。
Claims (12)
1.一种掺有发光材料的波长变换填料(5),它被应用于具有一个发紫外光、蓝光或绿光的LED芯片(1)的电致发光元件中,其特征在于:所述的发光材料包含有无机发光色料粉末(6),该无机发光色料由一个组构成,该组包含粒度≤20μm且d50-值≤5μm的用稀土掺杂的石榴石、和/或用稀土掺杂的硫镓酸盐、和/或用稀土掺杂的铝酸盐和/或用稀土掺杂的原硅酸盐。
2.根据权利要求1的填料,其特征在于:所述的无机发光色料粉末包含有由通式为A3B5X12:M的磷光体族构成的发光色料,其中A代表Y、Gd和/或Lu,B代表Al和/或Ga,X代表O,M代表Ce3+、Tb3+、Eu3+、Cr3+、Nd3+或Er3+,
而且所述发光色料的粒度≤20μm且d50-值≤5μm。
3.根据权利要求2的填料,其特征在于:采用CaGa2S4:Ce3+、SrGa2S4:Ce3+、MAlO3:Ce3+、MAlO3:Ce3+、和/或M2SiO5:Ce3+作为发光色料粉末(6),其中M代表Y、Sc、La。
4.根据权利要求1-3中任一项的填料,其特征在于:所述发光色料(6)是球形的或鳞片状的。
5.根据权利要求1-4中任一项的填料,其特征在于:所述发光色料(6)的d50-值在1到2μm之间。
6.根据权利要求1至5中任一项的填料,其特征在于:使用出自于用Ce掺杂的石榴石组中的颗粒作为发光色料。
7.根据权利要求6的填料,其特征在于:使用YAG:Ce颗粒作为发光色料。
8.一种发光光学元件,具有如权利要求1-7之一所述的波长变换填料,以及具有半导体主体(1),该半导体主体在所述光学元件工作时发出电磁辐射,其特征在于:
所述半导体主体(1)具有一个半导体层序列(7),该层序列适合于在所述半导体元件工作时从紫外光、蓝光和/或绿光频谱区域中发出电磁辐射,
所述发光色料把来自于所述频谱区域中的辐射变换成具有更大波长的辐射,使得该半导体元件发出混合的辐射、尤其是混合色的光,该混合的辐射或光由所述具有更大波长的辐射和所述紫外光、蓝光和/或绿光频谱区域中的辐射组成。
9.根据权利要求8的发光光学元件,其特征在于:所述的填料至少包封了所述半导体主体(1)的一部分。
10.根据权利要求8或9的发光光学元件,其特征在于:由所述半导体主体(1)发出的辐射在420-460nm的波长时具有发光强度最大值。
11.根据权利要求8-10中任一项的发光光学元件,其特征在于:所述半导体主体(1)被布置在不透光的基壳(8)的槽(9)中,而且所述的槽至少部分地被填充了所述的填料(5)。
12.根据权利要求8-11中任一项的发光半导体元件,其特征在于:在所述的发光材料中包含有不同类型的发光颗粒类型,这些颗粒类型在不同的波长时发光。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19638667.5 | 1996-09-20 | ||
DE19638667A DE19638667C2 (de) | 1996-09-20 | 1996-09-20 | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN97191656.XA Division CN1156029C (zh) | 1996-09-20 | 1997-09-22 | 波长变换填料及其应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1567608A true CN1567608A (zh) | 2005-01-19 |
CN100367521C CN100367521C (zh) | 2008-02-06 |
Family
ID=7806400
Family Applications (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100944827A Expired - Lifetime CN101081909B (zh) | 1996-09-20 | 1997-09-22 | 填料、它的应用及其制造方法 |
CNB2004100367021A Expired - Lifetime CN100367521C (zh) | 1996-09-20 | 1997-09-22 | 波长变换填料及含有这种填料的光学元件 |
CNB2004100367036A Expired - Lifetime CN100492682C (zh) | 1996-09-20 | 1997-09-22 | 具有半导体主体的发光光学元件 |
CN97191656.XA Expired - Lifetime CN1156029C (zh) | 1996-09-20 | 1997-09-22 | 波长变换填料及其应用 |
CNB2004100367017A Expired - Lifetime CN100492681C (zh) | 1996-09-20 | 1997-09-22 | 波长变换填料及其制造方法和含有这种填料的光学元件 |
CNA2006100944831A Pending CN101081910A (zh) | 1996-09-20 | 1997-09-22 | 填料、它的应用及其制造方法 |
CNB2004100367040A Expired - Lifetime CN100492683C (zh) | 1996-09-20 | 1997-09-22 | 光学半导体器件 |
CNB2003101163991A Expired - Lifetime CN1273537C (zh) | 1996-09-20 | 1997-09-22 | 填料、它的应用及其制造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100944827A Expired - Lifetime CN101081909B (zh) | 1996-09-20 | 1997-09-22 | 填料、它的应用及其制造方法 |
Family Applications After (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100367036A Expired - Lifetime CN100492682C (zh) | 1996-09-20 | 1997-09-22 | 具有半导体主体的发光光学元件 |
CN97191656.XA Expired - Lifetime CN1156029C (zh) | 1996-09-20 | 1997-09-22 | 波长变换填料及其应用 |
CNB2004100367017A Expired - Lifetime CN100492681C (zh) | 1996-09-20 | 1997-09-22 | 波长变换填料及其制造方法和含有这种填料的光学元件 |
CNA2006100944831A Pending CN101081910A (zh) | 1996-09-20 | 1997-09-22 | 填料、它的应用及其制造方法 |
CNB2004100367040A Expired - Lifetime CN100492683C (zh) | 1996-09-20 | 1997-09-22 | 光学半导体器件 |
CNB2003101163991A Expired - Lifetime CN1273537C (zh) | 1996-09-20 | 1997-09-22 | 填料、它的应用及其制造方法 |
Country Status (8)
Country | Link |
---|---|
US (9) | US6066861A (zh) |
EP (2) | EP0862794B1 (zh) |
JP (10) | JP3364229B2 (zh) |
KR (8) | KR100933586B1 (zh) |
CN (8) | CN101081909B (zh) |
BR (1) | BR9706787A (zh) |
DE (6) | DE19638667C2 (zh) |
WO (1) | WO1998012757A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101263420B (zh) * | 2005-01-26 | 2010-07-21 | 讯宝科技公司 | 用于投影二维、彩色图像的彩色图像投影系统 |
CN110857389A (zh) * | 2018-08-23 | 2020-03-03 | 有研稀土新材料股份有限公司 | 一种近红外荧光粉以及含该荧光粉的发光装置 |
Families Citing this family (893)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
KR100643442B1 (ko) * | 1996-06-26 | 2006-11-10 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | 발광 변환 소자를 포함하는 발광 반도체 소자 |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
US6613247B1 (en) * | 1996-09-20 | 2003-09-02 | Osram Opto Semiconductors Gmbh | Wavelength-converting casting composition and white light-emitting semiconductor component |
JP3378465B2 (ja) * | 1997-05-16 | 2003-02-17 | 株式会社東芝 | 発光装置 |
US6623670B2 (en) | 1997-07-07 | 2003-09-23 | Asahi Rubber Inc. | Method of molding a transparent coating member for light-emitting diodes |
US6319425B1 (en) * | 1997-07-07 | 2001-11-20 | Asahi Rubber Inc. | Transparent coating member for light-emitting diodes and a fluorescent color light source |
AU747260B2 (en) | 1997-07-25 | 2002-05-09 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
JP2001518692A (ja) * | 1997-07-29 | 2001-10-16 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト | 光電素子 |
US7038398B1 (en) * | 1997-08-26 | 2006-05-02 | Color Kinetics, Incorporated | Kinetic illumination system and methods |
US7014336B1 (en) * | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
US7161313B2 (en) | 1997-08-26 | 2007-01-09 | Color Kinetics Incorporated | Light emitting diode based products |
US20030133292A1 (en) | 1999-11-18 | 2003-07-17 | Mueller George G. | Methods and apparatus for generating and modulating white light illumination conditions |
US6806659B1 (en) * | 1997-08-26 | 2004-10-19 | Color Kinetics, Incorporated | Multicolored LED lighting method and apparatus |
US6580097B1 (en) * | 1998-02-06 | 2003-06-17 | General Electric Company | Light emitting device with phosphor composition |
US6294800B1 (en) | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
US6255670B1 (en) * | 1998-02-06 | 2001-07-03 | General Electric Company | Phosphors for light generation from light emitting semiconductors |
US6252254B1 (en) * | 1998-02-06 | 2001-06-26 | General Electric Company | Light emitting device with phosphor composition |
JP3541709B2 (ja) * | 1998-02-17 | 2004-07-14 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
EP1089335A4 (en) * | 1998-05-20 | 2002-02-06 | Rohm Co Ltd | SEMICONDUCTOR DEVICE |
DE19829197C2 (de) | 1998-06-30 | 2002-06-20 | Siemens Ag | Strahlungsaussendendes und/oder -empfangendes Bauelement |
WO2000002261A1 (de) | 1998-06-30 | 2000-01-13 | Osram Opto Semiconductors Gmbh & Co. Ohg | Lichtquelle zur erzeugung sichtbaren lichts |
US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
WO2000019546A1 (en) † | 1998-09-28 | 2000-04-06 | Koninklijke Philips Electronics N.V. | Lighting system |
US6429583B1 (en) * | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
JP2000208822A (ja) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | 半導体発光装置 |
JP3770014B2 (ja) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | 窒化物半導体素子 |
US6351069B1 (en) | 1999-02-18 | 2002-02-26 | Lumileds Lighting, U.S., Llc | Red-deficiency-compensating phosphor LED |
US6680569B2 (en) | 1999-02-18 | 2004-01-20 | Lumileds Lighting U.S. Llc | Red-deficiency compensating phosphor light emitting device |
EP1168539B1 (en) | 1999-03-04 | 2009-12-16 | Nichia Corporation | Nitride semiconductor laser device |
DE19918370B4 (de) | 1999-04-22 | 2006-06-08 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit Linse |
JP3458823B2 (ja) * | 1999-05-11 | 2003-10-20 | 日亜化学工業株式会社 | 面発光装置 |
KR100661945B1 (ko) * | 1999-06-14 | 2006-12-28 | 후-쿠 후앙 | 광 입사에 의해 활성화되는 에너지 레벨 전이에 기초하는 전자기파 방사 장치 및 방법 |
DE20023590U1 (de) * | 1999-07-23 | 2005-02-24 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Leuchtstoff für Lichtquellen und zugehörige Lichtquelle |
DE19934126A1 (de) * | 1999-07-23 | 2001-01-25 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Leuchtstoff für Lichtquellen und zugehörige Lichtquelle |
DE19951790A1 (de) * | 1999-10-27 | 2001-05-03 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Leuchtstoff für Lichtquellen und zugehörige Lichtquelle |
US7132786B1 (en) | 1999-07-23 | 2006-11-07 | Osram Gmbh | Luminescent array, wavelength-converting sealing material and light source |
US6686691B1 (en) * | 1999-09-27 | 2004-02-03 | Lumileds Lighting, U.S., Llc | Tri-color, white light LED lamps |
US6696703B2 (en) * | 1999-09-27 | 2004-02-24 | Lumileds Lighting U.S., Llc | Thin film phosphor-converted light emitting diode device |
AU7617800A (en) | 1999-09-27 | 2001-04-30 | Lumileds Lighting U.S., Llc | A light emitting diode device that produces white light by performing complete phosphor conversion |
DE19947044B9 (de) * | 1999-09-30 | 2007-09-13 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben |
JP2001111109A (ja) * | 1999-10-07 | 2001-04-20 | Sharp Corp | 窒化ガリウム系化合物半導体発光素子 |
DE19952712A1 (de) * | 1999-11-02 | 2001-05-10 | Osram Opto Semiconductors Gmbh | Laserdiodenvorrichtung |
DE19952932C1 (de) * | 1999-11-03 | 2001-05-03 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit breitbandiger Anregung |
US20020176259A1 (en) * | 1999-11-18 | 2002-11-28 | Ducharme Alfred D. | Systems and methods for converting illumination |
EP2975912B1 (en) * | 1999-11-18 | 2022-04-27 | Signify North America Corporation | System for generating and modulating illumination conditions |
US7202506B1 (en) | 1999-11-19 | 2007-04-10 | Cree, Inc. | Multi element, multi color solid state LED/laser |
JP3895086B2 (ja) * | 1999-12-08 | 2007-03-22 | ローム株式会社 | チップ型半導体発光装置 |
JP2001177153A (ja) * | 1999-12-17 | 2001-06-29 | Sharp Corp | 発光装置 |
JP2001177145A (ja) * | 1999-12-21 | 2001-06-29 | Toshiba Electronic Engineering Corp | 半導体発光素子およびその製造方法 |
DE19964252A1 (de) * | 1999-12-30 | 2002-06-06 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares Bauelement für eine LED-Weißlichtquelle |
DE19963805B4 (de) * | 1999-12-30 | 2005-01-27 | Osram Opto Semiconductors Gmbh | Weißlichtquelle auf der Basis nichtlinear-optischer Prozesse |
TWI273722B (en) * | 2000-01-27 | 2007-02-11 | Gen Electric | Organic light emitting device and method for mounting |
US7101626B1 (en) | 2000-02-23 | 2006-09-05 | Osram Gmbh | Photo-luminescence layer in the optical spectral region and in adjacent spectral regions |
DE10010638A1 (de) * | 2000-03-03 | 2001-09-13 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines lichtabstrahlenden Halbleiterkörpers mit Lumineszenzkonversionselement |
JP4406490B2 (ja) * | 2000-03-14 | 2010-01-27 | 株式会社朝日ラバー | 発光ダイオード |
US6409938B1 (en) | 2000-03-27 | 2002-06-25 | The General Electric Company | Aluminum fluoride flux synthesis method for producing cerium doped YAG |
US6538371B1 (en) | 2000-03-27 | 2003-03-25 | The General Electric Company | White light illumination system with improved color output |
US6522065B1 (en) | 2000-03-27 | 2003-02-18 | General Electric Company | Single phosphor for creating white light with high luminosity and high CRI in a UV led device |
US6603258B1 (en) * | 2000-04-24 | 2003-08-05 | Lumileds Lighting, U.S. Llc | Light emitting diode device that emits white light |
DE10020465A1 (de) | 2000-04-26 | 2001-11-08 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement |
US6604971B1 (en) | 2000-05-02 | 2003-08-12 | General Electric Company | Fabrication of LED lamps by controlled deposition of a suspension media |
EP1153792A1 (de) * | 2000-05-09 | 2001-11-14 | SIDLER GMBH & CO | Leuchtenanordnung mit mehreren LED's |
US6466135B1 (en) | 2000-05-15 | 2002-10-15 | General Electric Company | Phosphors for down converting ultraviolet light of LEDs to blue-green light |
US6501100B1 (en) * | 2000-05-15 | 2002-12-31 | General Electric Company | White light emitting phosphor blend for LED devices |
US6555958B1 (en) | 2000-05-15 | 2003-04-29 | General Electric Company | Phosphor for down converting ultraviolet light of LEDs to blue-green light |
US6621211B1 (en) | 2000-05-15 | 2003-09-16 | General Electric Company | White light emitting phosphor blends for LED devices |
GB0012377D0 (en) * | 2000-05-22 | 2000-07-12 | Isis Innovation | Oxide based phosphors |
DE10026435A1 (de) | 2000-05-29 | 2002-04-18 | Osram Opto Semiconductors Gmbh | Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED |
JP4695819B2 (ja) * | 2000-05-29 | 2011-06-08 | パテント−トロイハント−ゲゼルシヤフト フユール エレクトリツシエ グリユーラムペン ミツト ベシユレンクテル ハフツング | Ledをベースとする白色発光照明ユニット |
DE10027206A1 (de) * | 2000-05-31 | 2001-12-13 | Osram Opto Semiconductors Gmbh | Alterungsstabile Epoxidharzsysteme, daraus hergestellte Formstoffe und Bauelemente und deren Verwendung |
JP2002190622A (ja) * | 2000-12-22 | 2002-07-05 | Sanken Electric Co Ltd | 発光ダイオード用透光性蛍光カバー |
EP1228540B1 (en) | 2000-06-29 | 2010-09-29 | Koninklijke Philips Electronics N.V. | Optoelectric element |
DE10032453A1 (de) * | 2000-07-04 | 2002-01-24 | Vishay Semiconductor Gmbh | Strahlung emittierendes Bauelement |
DE10036940A1 (de) | 2000-07-28 | 2002-02-07 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lumineszenz-Konversions-LED |
JP2002050797A (ja) * | 2000-07-31 | 2002-02-15 | Toshiba Corp | 半導体励起蛍光体発光装置およびその製造方法 |
US6747406B1 (en) * | 2000-08-07 | 2004-06-08 | General Electric Company | LED cross-linkable phospor coating |
US7129638B2 (en) * | 2000-08-09 | 2006-10-31 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Light emitting devices with a phosphor coating having evenly dispersed phosphor particles and constant thickness |
US6635363B1 (en) * | 2000-08-21 | 2003-10-21 | General Electric Company | Phosphor coating with self-adjusting distance from LED chip |
JP2002076434A (ja) * | 2000-08-28 | 2002-03-15 | Toyoda Gosei Co Ltd | 発光装置 |
EP1187226B1 (en) * | 2000-09-01 | 2012-12-26 | Citizen Electronics Co., Ltd. | Surface-mount type light emitting diode and method of manufacturing same |
US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
JP2002141556A (ja) | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
JP3609709B2 (ja) * | 2000-09-29 | 2005-01-12 | 株式会社シチズン電子 | 発光ダイオード |
US6998281B2 (en) * | 2000-10-12 | 2006-02-14 | General Electric Company | Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics |
US6650044B1 (en) | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
JP2002133925A (ja) * | 2000-10-25 | 2002-05-10 | Sanken Electric Co Ltd | 蛍光カバー及び半導体発光装置 |
JP2002141559A (ja) * | 2000-10-31 | 2002-05-17 | Sanken Electric Co Ltd | 発光半導体チップ組立体及び発光半導体リードフレーム |
AT4889U1 (de) * | 2000-11-07 | 2001-12-27 | Binder Co Ag | Diodenlichtquelle für eine zeilenkamera |
US6518600B1 (en) | 2000-11-17 | 2003-02-11 | General Electric Company | Dual encapsulation for an LED |
JP3614776B2 (ja) | 2000-12-19 | 2005-01-26 | シャープ株式会社 | チップ部品型ledとその製造方法 |
AT410266B (de) | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
JP4545956B2 (ja) * | 2001-01-12 | 2010-09-15 | ローム株式会社 | 半導体装置、およびその製造方法 |
DE10101554A1 (de) * | 2001-01-15 | 2002-08-01 | Osram Opto Semiconductors Gmbh | Lumineszenzdiode |
MY131962A (en) * | 2001-01-24 | 2007-09-28 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
JP2002232013A (ja) * | 2001-02-02 | 2002-08-16 | Rohm Co Ltd | 半導体発光素子 |
US6541800B2 (en) * | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
DE10109349B4 (de) * | 2001-02-27 | 2012-04-19 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement |
JP2002261333A (ja) * | 2001-03-05 | 2002-09-13 | Toyoda Gosei Co Ltd | 発光装置 |
JP2002270365A (ja) * | 2001-03-12 | 2002-09-20 | Nippon Hoso Kyokai <Nhk> | El素子 |
DE10112542B9 (de) * | 2001-03-15 | 2013-01-03 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes optisches Bauelement |
JP2002299698A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Electric Ind Ltd | 発光装置 |
JP4101468B2 (ja) * | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
US6685852B2 (en) | 2001-04-27 | 2004-02-03 | General Electric Company | Phosphor blends for generating white light from near-UV/blue light-emitting devices |
US6686676B2 (en) * | 2001-04-30 | 2004-02-03 | General Electric Company | UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same |
JP2002344029A (ja) * | 2001-05-17 | 2002-11-29 | Rohm Co Ltd | 発光ダイオードの色調調整方法 |
US6616862B2 (en) * | 2001-05-21 | 2003-09-09 | General Electric Company | Yellow light-emitting halophosphate phosphors and light sources incorporating the same |
US6989412B2 (en) | 2001-06-06 | 2006-01-24 | Henkel Corporation | Epoxy molding compounds containing phosphor and process for preparing such compositions |
US6576488B2 (en) * | 2001-06-11 | 2003-06-10 | Lumileds Lighting U.S., Llc | Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor |
US6642652B2 (en) | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
JP4114331B2 (ja) * | 2001-06-15 | 2008-07-09 | 豊田合成株式会社 | 発光装置 |
JP2002374007A (ja) * | 2001-06-15 | 2002-12-26 | Toyoda Gosei Co Ltd | 発光装置 |
DE10131698A1 (de) * | 2001-06-29 | 2003-01-30 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung |
JP2003037295A (ja) * | 2001-07-05 | 2003-02-07 | Taiwan Lite On Electronics Inc | 発光ダイオードと発光ダイオードの製造方法 |
DE10133352A1 (de) | 2001-07-16 | 2003-02-06 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
JP2003027057A (ja) * | 2001-07-17 | 2003-01-29 | Hitachi Ltd | 光源およびそれを用いた画像表示装置 |
DE10137641A1 (de) * | 2001-08-03 | 2003-02-20 | Osram Opto Semiconductors Gmbh | Hybrid-LED |
TW511303B (en) * | 2001-08-21 | 2002-11-21 | Wen-Jr He | A light mixing layer and method |
US6737681B2 (en) * | 2001-08-22 | 2004-05-18 | Nichia Corporation | Light emitting device with fluorescent member excited by semiconductor light emitting element |
US7728345B2 (en) * | 2001-08-24 | 2010-06-01 | Cao Group, Inc. | Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame |
DE10142009B4 (de) * | 2001-08-28 | 2010-04-22 | Osram Opto Semiconductors Gmbh | LED - Lichtquelle mit einem Konversionsmittel und mit einer UV-absorbierenden Schicht |
KR20080087049A (ko) | 2001-09-03 | 2008-09-29 | 마츠시타 덴끼 산교 가부시키가이샤 | 형광체 층, 반도체발광장치, 반도체발광소자의 제조방법 |
US7331681B2 (en) * | 2001-09-07 | 2008-02-19 | Litepanels Llc | Lighting apparatus with adjustable lenses or filters |
US7604361B2 (en) | 2001-09-07 | 2009-10-20 | Litepanels Llc | Versatile lighting apparatus and associated kit |
US6749310B2 (en) * | 2001-09-07 | 2004-06-15 | Contrast Lighting Services, Inc. | Wide area lighting effects system |
DE10146719A1 (de) | 2001-09-20 | 2003-04-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
DE10147040A1 (de) | 2001-09-25 | 2003-04-24 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
DE20115914U1 (de) | 2001-09-27 | 2003-02-13 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH, 81543 München | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
JP3948650B2 (ja) | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
WO2003034508A1 (en) * | 2001-10-12 | 2003-04-24 | Nichia Corporation | Light emitting device and method for manufacture thereof |
JP4043752B2 (ja) * | 2001-10-19 | 2008-02-06 | 星和電機株式会社 | 発光ダイオードランプとこれを用いた照明器具 |
JP2003133595A (ja) * | 2001-10-24 | 2003-05-09 | Seiwa Electric Mfg Co Ltd | 発光ダイオードランプ、これに用いられる赤色蛍光体及びこれに用いられるフィルタ |
US7858403B2 (en) | 2001-10-31 | 2010-12-28 | Cree, Inc. | Methods and systems for fabricating broad spectrum light emitting devices |
DE10153259A1 (de) | 2001-10-31 | 2003-05-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
JP2003147351A (ja) * | 2001-11-09 | 2003-05-21 | Taiwan Lite On Electronics Inc | 白色光光源の製作方法 |
US6734465B1 (en) * | 2001-11-19 | 2004-05-11 | Nanocrystals Technology Lp | Nanocrystalline based phosphors and photonic structures for solid state lighting |
DE10241989A1 (de) * | 2001-11-30 | 2003-06-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
JP3972670B2 (ja) * | 2002-02-06 | 2007-09-05 | 豊田合成株式会社 | 発光装置 |
US7374322B2 (en) * | 2002-02-06 | 2008-05-20 | Steen Ronald L | Center high mounted stop lamp including leds and tir lens |
US6881983B2 (en) * | 2002-02-25 | 2005-04-19 | Kopin Corporation | Efficient light emitting diodes and lasers |
EP1433831B1 (en) | 2002-03-22 | 2018-06-06 | Nichia Corporation | Nitride phosphor and method for preparation thereof, and light emitting device |
DE10213294B4 (de) * | 2002-03-25 | 2015-05-13 | Osram Gmbh | Verwendung eines UV-beständigen Polymers in der Optoelektronik sowie im Außenanwendungsbereich, UV-beständiges Polymer sowie optisches Bauelement |
TW558065U (en) * | 2002-03-28 | 2003-10-11 | Solidlite Corp | Purplish pink light emitting diode |
DE10214119A1 (de) * | 2002-03-28 | 2003-10-23 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US20030189215A1 (en) | 2002-04-09 | 2003-10-09 | Jong-Lam Lee | Method of fabricating vertical structure leds |
US8294172B2 (en) * | 2002-04-09 | 2012-10-23 | Lg Electronics Inc. | Method of fabricating vertical devices using a metal support film |
DE20206047U1 (de) | 2002-04-18 | 2002-09-05 | Zweibrüder Stahlwarenkontor GmbH, 42697 Solingen | Licht emittierende Diode und Lampe |
US6911079B2 (en) * | 2002-04-19 | 2005-06-28 | Kopin Corporation | Method for reducing the resistivity of p-type II-VI and III-V semiconductors |
DE50309259D1 (de) * | 2002-05-06 | 2008-04-10 | Osram Opto Semiconductors Gmbh | Wellenlängenkonvertierende reaktionsharzmasse und leuchtdiodenbauelement |
TWI226357B (en) | 2002-05-06 | 2005-01-11 | Osram Opto Semiconductors Gmbh | Wavelength-converting reaction-resin, its production method, light-radiating optical component and light-radiating semiconductor-body |
DE10221857A1 (de) * | 2002-05-16 | 2003-11-27 | Osram Opto Semiconductors Gmbh | Verfahren zum Befestigen eines Halbleiterchips in einem Kunststoffgehäusekörper, optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
US20040012027A1 (en) * | 2002-06-13 | 2004-01-22 | Cree Lighting Company | Saturated phosphor solid state emitter |
WO2003107444A2 (en) | 2002-06-17 | 2003-12-24 | Kopin Corporation | Light-emitting diode device geometry |
US6734091B2 (en) | 2002-06-28 | 2004-05-11 | Kopin Corporation | Electrode for p-type gallium nitride-based semiconductors |
US7002180B2 (en) * | 2002-06-28 | 2006-02-21 | Kopin Corporation | Bonding pad for gallium nitride-based light-emitting device |
KR100567546B1 (ko) * | 2002-06-24 | 2006-04-05 | 서울반도체 주식회사 | 핑크색 발광 다이오드 및 그 제조 방법 |
DE10228634A1 (de) * | 2002-06-26 | 2004-01-22 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbare Miniatur-Lumineszenz-und/oder Photo-Diode und Verfahren zu deren Herstellung |
US6841802B2 (en) | 2002-06-26 | 2005-01-11 | Oriol, Inc. | Thin film light emitting diode |
US6955985B2 (en) | 2002-06-28 | 2005-10-18 | Kopin Corporation | Domain epitaxy for thin film growth |
US6809471B2 (en) * | 2002-06-28 | 2004-10-26 | General Electric Company | Phosphors containing oxides of alkaline-earth and Group-IIIB metals and light sources incorporating the same |
KR101030068B1 (ko) | 2002-07-08 | 2011-04-19 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자의 제조방법 및 질화물 반도체 소자 |
US7928455B2 (en) * | 2002-07-15 | 2011-04-19 | Epistar Corporation | Semiconductor light-emitting device and method for forming the same |
WO2004010472A2 (en) * | 2002-07-19 | 2004-01-29 | Microsemi Corporation | Process for fabricating, and light emitting device resulting from, a homogenously mixed powder/pelletized compound |
EP2290715B1 (en) | 2002-08-01 | 2019-01-23 | Nichia Corporation | Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same |
KR20040017926A (ko) * | 2002-08-22 | 2004-03-02 | 웬-치 호 | 광-혼합 층 및 광-혼합 방법 |
US10340424B2 (en) * | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
JP2004128273A (ja) * | 2002-10-03 | 2004-04-22 | Sharp Corp | 発光素子 |
JP2004132772A (ja) * | 2002-10-09 | 2004-04-30 | Casio Comput Co Ltd | 照明装置およびそれを用いた電子機器 |
US7554258B2 (en) | 2002-10-22 | 2009-06-30 | Osram Opto Semiconductors Gmbh | Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body |
WO2004040661A2 (de) * | 2002-10-30 | 2004-05-13 | Osram Opto Semiconductors Gmbh | Verfahren zum herstellen einer leuchtdioden-lichtquelle mit lumineszenz-konversionselement |
CN100508221C (zh) * | 2002-10-30 | 2009-07-01 | 奥斯兰姆奥普托半导体有限责任公司 | 用于混合色的发光二极管光源的生产方法 |
DE10250911B4 (de) * | 2002-10-31 | 2009-08-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Umhüllung und/oder zumindest eines Teiles eines Gehäuses eines optoelektronischen Bauelements |
JP2004158635A (ja) * | 2002-11-06 | 2004-06-03 | Stanley Electric Co Ltd | 表面実装型チップled及びその製造方法 |
US7982008B2 (en) * | 2002-11-27 | 2011-07-19 | David Bar-Or | Treatment of diseases and conditions mediated by increased phosphorylation |
DE10258193B4 (de) | 2002-12-12 | 2014-04-10 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von Leuchtdioden-Lichtquellen mit Lumineszenz-Konversionselement |
US7042150B2 (en) * | 2002-12-20 | 2006-05-09 | Showa Denko K.K. | Light-emitting device, method of fabricating the device, and LED lamp using the device |
WO2004059750A1 (ja) | 2002-12-25 | 2004-07-15 | Japan Science And Technology Agency | 発光素子装置、受光素子装置、光学装置、フッ化物結晶、フッ化物結晶の製造方法、およびルツボ |
DE10261908B4 (de) * | 2002-12-27 | 2010-12-30 | Osa Opto Light Gmbh | Verfahren zur Herstellung eines konversionslichtemittierenden Elementes auf der Basis von Halbleiterlichtquellen |
DE10261672B4 (de) * | 2002-12-31 | 2005-11-24 | Osram Opto Semiconductors Gmbh | LED-Chip mit Konversionsstoff, optoelektronisches Bauelement mit einem derartigen LED-Chip und Verfahren zum Herstellen eines derartigen LED-Chips |
JP3910144B2 (ja) * | 2003-01-06 | 2007-04-25 | シャープ株式会社 | 半導体発光装置およびその製造方法 |
US7550777B2 (en) | 2003-01-10 | 2009-06-23 | Toyoda Gosei, Co., Ltd. | Light emitting device including adhesion layer |
US20040137656A1 (en) * | 2003-01-15 | 2004-07-15 | Gurbir Singh | Low thermal resistance light emitting diode package and a method of making the same |
TWI351566B (en) * | 2003-01-15 | 2011-11-01 | Semiconductor Energy Lab | Liquid crystal display device |
US20040142098A1 (en) * | 2003-01-21 | 2004-07-22 | Eastman Kodak Company | Using compacted organic materials in making white light emitting oleds |
JP3717480B2 (ja) * | 2003-01-27 | 2005-11-16 | ローム株式会社 | 半導体発光装置 |
US6982523B2 (en) * | 2003-01-28 | 2006-01-03 | Kabushiki Kaisha Fine Rubber Kenkyuusho | Red light emitting phosphor, its production and light emitting device |
TWI237546B (en) | 2003-01-30 | 2005-08-01 | Osram Opto Semiconductors Gmbh | Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component |
US20040151829A1 (en) * | 2003-01-31 | 2004-08-05 | Eastman Kodak Company | Optimizing OLED emission |
US7074346B2 (en) * | 2003-02-06 | 2006-07-11 | Ube Industries, Ltd. | Sialon-based oxynitride phosphor, process for its production, and use thereof |
US7042020B2 (en) | 2003-02-14 | 2006-05-09 | Cree, Inc. | Light emitting device incorporating a luminescent material |
US7423296B2 (en) | 2003-02-26 | 2008-09-09 | Avago Technologies Ecbu Ip Pte Ltd | Apparatus for producing a spectrally-shifted light output from a light emitting device utilizing thin-film luminescent layers |
EP2262006A3 (en) * | 2003-02-26 | 2012-03-21 | Cree, Inc. | Composite white light source and method for fabricating |
CN1791682B (zh) | 2003-02-26 | 2013-05-22 | 凯利达基因组股份有限公司 | 通过杂交进行的随机阵列dna分析 |
JP2004260111A (ja) * | 2003-02-27 | 2004-09-16 | Sharp Corp | 半導体発光素子およびその半導体発光素子を用いた半導体発光装置 |
JP4131178B2 (ja) * | 2003-02-28 | 2008-08-13 | 豊田合成株式会社 | 発光装置 |
DE10308866A1 (de) | 2003-02-28 | 2004-09-09 | Osram Opto Semiconductors Gmbh | Beleuchtungsmodul und Verfahren zu dessen Herstellung |
DE10308890A1 (de) * | 2003-02-28 | 2004-09-09 | Opto Tech Corporation | Gehäusestruktur für eine Lichtemissionsdiode und Verfahren zu dessen Herstellung |
US6806658B2 (en) * | 2003-03-07 | 2004-10-19 | Agilent Technologies, Inc. | Method for making an LED |
US6885033B2 (en) * | 2003-03-10 | 2005-04-26 | Cree, Inc. | Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same |
WO2004082032A2 (de) * | 2003-03-13 | 2004-09-23 | Osram Opto Semiconductors Gmbh | Lumineszenzkonversions-leuchtdiode mit nachleuchteffekt und deren verwendung |
DE10314524A1 (de) | 2003-03-31 | 2004-10-28 | Osram Opto Semiconductors Gmbh | Scheinwerfer und Scheinwerferelement |
US20040252488A1 (en) * | 2003-04-01 | 2004-12-16 | Innovalight | Light-emitting ceiling tile |
US7279832B2 (en) * | 2003-04-01 | 2007-10-09 | Innovalight, Inc. | Phosphor materials and illumination devices made therefrom |
DE10315133A1 (de) * | 2003-04-03 | 2004-10-14 | Hella Kg Hueck & Co. | Beleuchtungseinheit für Kraftfahrzeuge |
DE10316769A1 (de) * | 2003-04-10 | 2004-10-28 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Leuchtstoffbassierte LED und zugehöriger Leuchtstoff |
US7368179B2 (en) * | 2003-04-21 | 2008-05-06 | Sarnoff Corporation | Methods and devices using high efficiency alkaline earth metal thiogallate-based phosphors |
US7125501B2 (en) * | 2003-04-21 | 2006-10-24 | Sarnoff Corporation | High efficiency alkaline earth metal thiogallate-based phosphors |
EP2264798B1 (en) * | 2003-04-30 | 2020-10-14 | Cree, Inc. | High powered light emitter packages with compact optics |
US7005679B2 (en) * | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
US7528421B2 (en) | 2003-05-05 | 2009-05-05 | Lamina Lighting, Inc. | Surface mountable light emitting diode assemblies packaged for high temperature operation |
US7777235B2 (en) | 2003-05-05 | 2010-08-17 | Lighting Science Group Corporation | Light emitting diodes with improved light collimation |
US7633093B2 (en) | 2003-05-05 | 2009-12-15 | Lighting Science Group Corporation | Method of making optical light engines with elevated LEDs and resulting product |
US7157745B2 (en) | 2004-04-09 | 2007-01-02 | Blonder Greg E | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
US6982045B2 (en) * | 2003-05-17 | 2006-01-03 | Phosphortech Corporation | Light emitting device having silicate fluorescent phosphor |
DE10323857A1 (de) | 2003-05-26 | 2005-01-27 | Osram Opto Semiconductors Gmbh | Gehäuse für ein Laserdiodenbauelement, Laserdiodenbauelement und Verfahren zum Herstellen eines Laserdiodenbauelements |
US7122841B2 (en) | 2003-06-04 | 2006-10-17 | Kopin Corporation | Bonding pad for gallium nitride-based light-emitting devices |
US6803607B1 (en) * | 2003-06-13 | 2004-10-12 | Cotco Holdings Limited | Surface mountable light emitting device |
JP4138586B2 (ja) * | 2003-06-13 | 2008-08-27 | スタンレー電気株式会社 | 光源用ledランプおよびこれを用いた車両用前照灯 |
CN100511732C (zh) * | 2003-06-18 | 2009-07-08 | 丰田合成株式会社 | 发光器件 |
US7521667B2 (en) | 2003-06-23 | 2009-04-21 | Advanced Optical Technologies, Llc | Intelligent solid state lighting |
US7145125B2 (en) | 2003-06-23 | 2006-12-05 | Advanced Optical Technologies, Llc | Integrating chamber cone light using LED sources |
US7075225B2 (en) | 2003-06-27 | 2006-07-11 | Tajul Arosh Baroky | White light emitting device |
US7462983B2 (en) * | 2003-06-27 | 2008-12-09 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | White light emitting device |
US7088038B2 (en) * | 2003-07-02 | 2006-08-08 | Gelcore Llc | Green phosphor for general illumination applications |
US8999736B2 (en) * | 2003-07-04 | 2015-04-07 | Epistar Corporation | Optoelectronic system |
DE10361661A1 (de) * | 2003-07-14 | 2005-03-17 | Osram Opto Semiconductors Gmbh | Licht emittierendes Bauelement mit einem Lumineszenz-Konversionselement |
US7391153B2 (en) | 2003-07-17 | 2008-06-24 | Toyoda Gosei Co., Ltd. | Light emitting device provided with a submount assembly for improved thermal dissipation |
DE10335077A1 (de) * | 2003-07-31 | 2005-03-03 | Osram Opto Semiconductors Gmbh | LED-Modul |
US6987353B2 (en) * | 2003-08-02 | 2006-01-17 | Phosphortech Corporation | Light emitting device having sulfoselenide fluorescent phosphor |
US7109648B2 (en) * | 2003-08-02 | 2006-09-19 | Phosphortech Inc. | Light emitting device having thio-selenide fluorescent phosphor |
US7112921B2 (en) * | 2003-08-02 | 2006-09-26 | Phosphortech Inc. | Light emitting device having selenium-based fluorescent phosphor |
US7026755B2 (en) * | 2003-08-07 | 2006-04-11 | General Electric Company | Deep red phosphor for general illumination applications |
JP2005064233A (ja) * | 2003-08-12 | 2005-03-10 | Stanley Electric Co Ltd | 波長変換型led |
TWI233697B (en) * | 2003-08-28 | 2005-06-01 | Genesis Photonics Inc | AlInGaN light-emitting diode with wide spectrum and solid-state white light device |
EP1659335A4 (en) * | 2003-08-28 | 2010-05-05 | Mitsubishi Chem Corp | LIGHT DISPENSER AND PHOSPHORUS |
US7183587B2 (en) * | 2003-09-09 | 2007-02-27 | Cree, Inc. | Solid metal block mounting substrates for semiconductor light emitting devices |
US7029935B2 (en) * | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
JP2005091675A (ja) * | 2003-09-17 | 2005-04-07 | Pentax Corp | 発光装置 |
TW200512949A (en) * | 2003-09-17 | 2005-04-01 | Nanya Plastics Corp | A method to provide emission of white color light by the principle of secondary excitation and its product |
JP4140042B2 (ja) * | 2003-09-17 | 2008-08-27 | スタンレー電気株式会社 | 蛍光体を用いたled光源装置及びled光源装置を用いた車両前照灯 |
US7915085B2 (en) | 2003-09-18 | 2011-03-29 | Cree, Inc. | Molded chip fabrication method |
JP4378242B2 (ja) * | 2003-09-25 | 2009-12-02 | 株式会社小糸製作所 | 車両用灯具 |
JP4402425B2 (ja) * | 2003-10-24 | 2010-01-20 | スタンレー電気株式会社 | 車両前照灯 |
EP1702971A4 (en) | 2003-10-30 | 2008-09-10 | Japan Science & Tech Agency | ELECTROLUMINESCENT MATERIAL AND ELECTROLUMINESCENT ELEMENT COMPRISING SUCH A MATERIAL |
US7276782B2 (en) * | 2003-10-31 | 2007-10-02 | Harvatek Corporation | Package structure for semiconductor |
DE10351397A1 (de) * | 2003-10-31 | 2005-06-16 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenchip |
DE10351349A1 (de) | 2003-10-31 | 2005-06-16 | Osram Opto Semiconductors Gmbh | Verfahren zum Hestellen eines Lumineszenzdiodenchips |
KR100537560B1 (ko) * | 2003-11-25 | 2005-12-19 | 주식회사 메디아나전자 | 2단계 큐어 공정을 포함하는 백색 발광 다이오드 소자의제조방법 |
JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
JP2005167092A (ja) * | 2003-12-04 | 2005-06-23 | Nitto Denko Corp | 光半導体装置の製造方法 |
WO2005056269A2 (de) * | 2003-12-09 | 2005-06-23 | G.L.I. Global Light Industries Gmbh | Verfahren zur herstellung lichtemittierender halbleiterdioden auf einer platine und leuchteinheiten mit integrierter platine |
US20050127833A1 (en) * | 2003-12-10 | 2005-06-16 | Tieszen Dwayne A. | White light LED and method to adjust the color output of same |
US7102152B2 (en) * | 2004-10-14 | 2006-09-05 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Device and method for emitting output light using quantum dots and non-quantum fluorescent material |
US7667766B2 (en) * | 2003-12-18 | 2010-02-23 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Adjustable spectrum flash lighting for image acquisition |
US7318651B2 (en) * | 2003-12-18 | 2008-01-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Flash module with quantum dot light conversion |
KR100610249B1 (ko) * | 2003-12-23 | 2006-08-09 | 럭스피아 주식회사 | 황색 발광 형광체 및 그것을 채용한 백색 반도체 발광장치 |
JP2005191420A (ja) * | 2003-12-26 | 2005-07-14 | Stanley Electric Co Ltd | 波長変換層を有する半導体発光装置およびその製造方法 |
TW200522387A (en) * | 2003-12-26 | 2005-07-01 | Ind Tech Res Inst | High-power LED planarization encapsulation structure |
US20050146270A1 (en) * | 2003-12-29 | 2005-07-07 | Ying-Ming Ho | Stacked light emitting diode |
TWI275189B (en) | 2003-12-30 | 2007-03-01 | Osram Opto Semiconductors Gmbh | Radiation-emitting and/or radiation-receiving semiconductor component and method for producing such component |
JP2005197329A (ja) * | 2004-01-05 | 2005-07-21 | Stanley Electric Co Ltd | 表面実装型半導体装置及びそのリードフレーム構造 |
US7183588B2 (en) * | 2004-01-08 | 2007-02-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emission device |
JP2005209795A (ja) * | 2004-01-21 | 2005-08-04 | Koito Mfg Co Ltd | 発光モジュール及び灯具 |
EP1709694B1 (de) | 2004-01-26 | 2017-03-15 | OSRAM Opto Semiconductors GmbH | Dünnfilm-led mit einer stromaufweitungsstruktur |
DE102004004779B4 (de) * | 2004-01-30 | 2015-09-03 | Osram Opto Semiconductors Gmbh | Leuchtdioden-Beleuchtungsmodul mit optischer Einrichtung zur Strahlformung |
DE102004004778B4 (de) * | 2004-01-30 | 2010-02-25 | Osram Opto Semiconductors Gmbh | Leuchtdioden-Beleuchtungsmodul und strahlungsformende optische Einrichtung für ein Leuchtdioden-Beleuchtungsmodul |
US20050179042A1 (en) * | 2004-02-13 | 2005-08-18 | Kopin Corporation | Monolithic integration and enhanced light extraction in gallium nitride-based light-emitting devices |
US20050179046A1 (en) * | 2004-02-13 | 2005-08-18 | Kopin Corporation | P-type electrodes in gallium nitride-based light-emitting devices |
KR101228428B1 (ko) | 2004-02-20 | 2013-01-31 | 오스람 옵토 세미컨덕터스 게엠베하 | 광전 소자, 다수의 광전 소자를 구비한 장치 및 광전 소자를 제조하기 위한 방법 |
JP4572312B2 (ja) * | 2004-02-23 | 2010-11-04 | スタンレー電気株式会社 | Led及びその製造方法 |
JP2005243973A (ja) | 2004-02-26 | 2005-09-08 | Kyocera Corp | 発光装置および照明装置 |
JP2005286312A (ja) * | 2004-03-02 | 2005-10-13 | Fujikura Ltd | 発光デバイス及び照明装置 |
TWI229465B (en) | 2004-03-02 | 2005-03-11 | Genesis Photonics Inc | Single chip white light component |
JPWO2005086239A1 (ja) * | 2004-03-05 | 2008-01-24 | コニカミノルタホールディングス株式会社 | 白色発光ダイオード(led)及び白色ledの製造方法 |
US7239080B2 (en) * | 2004-03-11 | 2007-07-03 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd | LED display with overlay |
US20050199784A1 (en) * | 2004-03-11 | 2005-09-15 | Rizal Jaffar | Light to PWM converter |
DE102004013680A1 (de) | 2004-03-18 | 2005-10-20 | Siemens Ag | Lichtquelle für Bilderzeugungseinheit |
JP4504056B2 (ja) * | 2004-03-22 | 2010-07-14 | スタンレー電気株式会社 | 半導体発光装置の製造方法 |
DE102004014207A1 (de) * | 2004-03-23 | 2005-10-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil mit mehrteiligem Gehäusekörper |
US20050211991A1 (en) * | 2004-03-26 | 2005-09-29 | Kyocera Corporation | Light-emitting apparatus and illuminating apparatus |
JP2005285925A (ja) * | 2004-03-29 | 2005-10-13 | Stanley Electric Co Ltd | Led |
US7586127B2 (en) * | 2004-03-29 | 2009-09-08 | Stanley Electric Co., Ltd. | Light emitting diode |
US7327078B2 (en) * | 2004-03-30 | 2008-02-05 | Lumination Llc | LED illumination device with layered phosphor pattern |
US7517728B2 (en) * | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
JP4229447B2 (ja) * | 2004-03-31 | 2009-02-25 | スタンレー電気株式会社 | 半導体発光装置及び製造方法 |
US7868343B2 (en) * | 2004-04-06 | 2011-01-11 | Cree, Inc. | Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same |
KR100605212B1 (ko) * | 2004-04-07 | 2006-07-31 | 엘지이노텍 주식회사 | 형광체 및 이를 이용한 백색 발광다이오드 |
KR100605211B1 (ko) | 2004-04-07 | 2006-07-31 | 엘지이노텍 주식회사 | 형광체 및 이를 이용한 백색 발광다이오드 |
JP4471356B2 (ja) * | 2004-04-23 | 2010-06-02 | スタンレー電気株式会社 | 半導体発光装置 |
JP2005317661A (ja) * | 2004-04-27 | 2005-11-10 | Sharp Corp | 半導体発光装置およびその製造方法 |
EP1753035A4 (en) * | 2004-04-28 | 2011-12-21 | Panasonic Corp | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME |
DE102004021233A1 (de) | 2004-04-30 | 2005-12-01 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung |
BRPI0510707B1 (pt) * | 2004-05-05 | 2018-09-25 | Rensselaer Polytech Inst | aparelho emissor de luz |
US7837348B2 (en) | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
KR100655894B1 (ko) | 2004-05-06 | 2006-12-08 | 서울옵토디바이스주식회사 | 색온도 및 연색성이 우수한 파장변환 발광장치 |
US11158768B2 (en) | 2004-05-07 | 2021-10-26 | Bruce H. Baretz | Vacuum light emitting diode |
JP4632690B2 (ja) * | 2004-05-11 | 2011-02-16 | スタンレー電気株式会社 | 半導体発光装置とその製造方法 |
KR100658700B1 (ko) | 2004-05-13 | 2006-12-15 | 서울옵토디바이스주식회사 | Rgb 발광소자와 형광체를 조합한 발광장치 |
US20050264194A1 (en) * | 2004-05-25 | 2005-12-01 | Ng Kee Y | Mold compound with fluorescent material and a light-emitting device made therefrom |
US8975646B2 (en) | 2004-05-31 | 2015-03-10 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and housing base for such a component |
DE102004040468B4 (de) | 2004-05-31 | 2022-02-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauelement und Gehäuse-Grundkörper für ein derartiges Bauelement |
US8308980B2 (en) | 2004-06-10 | 2012-11-13 | Seoul Semiconductor Co., Ltd. | Light emitting device |
KR100665299B1 (ko) | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광물질 |
KR100665298B1 (ko) | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광장치 |
CN100403558C (zh) * | 2004-06-11 | 2008-07-16 | 浙江古越龙山电子科技发展有限公司 | 白偏蓝贴片式发光二极管及其制造方法 |
JP4583076B2 (ja) * | 2004-06-11 | 2010-11-17 | スタンレー電気株式会社 | 発光素子 |
CN100401536C (zh) * | 2004-06-18 | 2008-07-09 | 江苏稳润光电有限公司 | 白光发光二极管的制造方法 |
JP4632697B2 (ja) * | 2004-06-18 | 2011-02-16 | スタンレー電気株式会社 | 半導体発光素子及びその製造方法 |
JP4762892B2 (ja) * | 2004-06-18 | 2011-08-31 | 独立行政法人物質・材料研究機構 | α型サイアロン及びその製造方法 |
JP2004274087A (ja) * | 2004-06-21 | 2004-09-30 | Sanken Electric Co Ltd | 半導体発光装置 |
KR20060000313A (ko) * | 2004-06-28 | 2006-01-06 | 루미마이크로 주식회사 | 대입경 형광 분말을 포함하는 색변환 발광 장치 그의 제조방법 및 그에 사용되는 수지 조성물 |
DE102004031391B4 (de) * | 2004-06-29 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Elektronisches Bauteil mit Gehäuse zum ESD-Schutz |
DE102004045947A1 (de) * | 2004-06-30 | 2006-01-19 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung |
JP2008504698A (ja) | 2004-06-30 | 2008-02-14 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 発光ダイオード装置、光学式記録装置および少なくとも1つの発光ダイオードをパルス状に作動させる方法 |
DE102004044179B4 (de) * | 2004-06-30 | 2010-04-22 | Osram Opto Semiconductors Gmbh | Verfahren zur Montage von Halbleiterchips |
DE102004031689A1 (de) * | 2004-06-30 | 2006-02-16 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung |
KR20060000977A (ko) * | 2004-06-30 | 2006-01-06 | 엘지.필립스 엘시디 주식회사 | 액정표시장치의 백라이트 유닛 |
DE102004052245A1 (de) * | 2004-06-30 | 2006-02-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip und strahlungsemittierendes Halbleiterbauelement mit einem derartigen Halbleiterchip |
WO2006004187A1 (ja) * | 2004-07-05 | 2006-01-12 | Kri, Inc. | 有機無機複合体 |
JP2008506011A (ja) * | 2004-07-06 | 2008-02-28 | サーノフ コーポレーション | 効率的な緑色発光蛍光体、及び赤色発光蛍光体との組合せ |
US20060006366A1 (en) * | 2004-07-06 | 2006-01-12 | Vladimir Abramov | Wave length shifting compositions for white emitting diode systems |
US20060006793A1 (en) * | 2004-07-12 | 2006-01-12 | Baroky Tajul A | Deep ultraviolet used to produce white light |
WO2006006582A1 (ja) | 2004-07-13 | 2006-01-19 | Fujikura Ltd. | 蛍光体及びその蛍光体を用いた電球色光を発する電球色光発光ダイオードランプ |
DE102004042561A1 (de) | 2004-07-20 | 2006-02-16 | Osram Opto Semiconductors Gmbh | Optisches Element |
DE102004036157B4 (de) | 2004-07-26 | 2023-03-16 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Leuchtmodul |
JP4599111B2 (ja) * | 2004-07-30 | 2010-12-15 | スタンレー電気株式会社 | 灯具光源用ledランプ |
WO2006012838A2 (de) | 2004-07-30 | 2006-02-09 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung von halbleiterchips in dünnfilmtechnik und halbleiterchip in dünnfilmtechnik |
US8728937B2 (en) | 2004-07-30 | 2014-05-20 | Osram Opto Semiconductors Gmbh | Method for producing semiconductor chips using thin film technology |
JP4858867B2 (ja) * | 2004-08-09 | 2012-01-18 | スタンレー電気株式会社 | Led及びその製造方法 |
US7750352B2 (en) * | 2004-08-10 | 2010-07-06 | Pinion Technologies, Inc. | Light strips for lighting and backlighting applications |
JP4547569B2 (ja) * | 2004-08-31 | 2010-09-22 | スタンレー電気株式会社 | 表面実装型led |
WO2006025403A1 (ja) * | 2004-08-31 | 2006-03-09 | Fujifilm Corporation | 分散型エレクトロルミネッセンス素子 |
KR101217659B1 (ko) * | 2004-09-03 | 2013-01-02 | 스탠리 일렉트릭 컴퍼니, 리미티드 | El소자 |
WO2006031753A2 (en) * | 2004-09-10 | 2006-03-23 | Color Kinetics Incorporated | Lighting zone control methods and apparatus |
US7217583B2 (en) * | 2004-09-21 | 2007-05-15 | Cree, Inc. | Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension |
CN101044222B (zh) | 2004-09-22 | 2012-06-06 | 独立行政法人物质·材料研究机构 | 荧光体及其制造方法和发光器具 |
DE102004045950A1 (de) | 2004-09-22 | 2006-03-30 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
JP5086641B2 (ja) | 2004-09-22 | 2012-11-28 | 株式会社東芝 | 発光装置とそれを用いたバックライトおよび液晶表示装置 |
JP4922555B2 (ja) * | 2004-09-24 | 2012-04-25 | スタンレー電気株式会社 | Led装置 |
DE102004047061B4 (de) | 2004-09-28 | 2018-07-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
JP4756841B2 (ja) * | 2004-09-29 | 2011-08-24 | スタンレー電気株式会社 | 半導体発光装置の製造方法 |
DE102004047324A1 (de) | 2004-09-29 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung |
DE102004047727B4 (de) | 2004-09-30 | 2018-01-18 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenchip mit einer Konverterschicht und Verfahren zur Herstellung eines Lumineszenzdiodenchips mit einer Konverterschicht |
DE102004050371A1 (de) | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer drahtlosen Kontaktierung |
DE102004060358A1 (de) * | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von Lumineszenzdiodenchips und Lumineszenzdiodenchip |
DE102004047640A1 (de) | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Gehäuse für ein optoelektronisches Bauelement |
DE102005046420B4 (de) * | 2004-10-04 | 2019-07-11 | Stanley Electric Co. Ltd. | Verfahren zur Herstellung einer Licht emittierenden Halbleitervorrichtung |
US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
US8816369B2 (en) * | 2004-10-29 | 2014-08-26 | Led Engin, Inc. | LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices |
US8134292B2 (en) * | 2004-10-29 | 2012-03-13 | Ledengin, Inc. | Light emitting device with a thermal insulating and refractive index matching material |
US9929326B2 (en) | 2004-10-29 | 2018-03-27 | Ledengin, Inc. | LED package having mushroom-shaped lens with volume diffuser |
US8324641B2 (en) * | 2007-06-29 | 2012-12-04 | Ledengin, Inc. | Matrix material including an embedded dispersion of beads for a light-emitting device |
DE102004056252A1 (de) | 2004-10-29 | 2006-05-04 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung, Kfz-Scheinwerfer und Verfahren zur Herstellung einer Beleuchtungseinrichtung |
JP4627177B2 (ja) * | 2004-11-10 | 2011-02-09 | スタンレー電気株式会社 | Ledの製造方法 |
JP2006140281A (ja) * | 2004-11-11 | 2006-06-01 | Stanley Electric Co Ltd | パワーled及びその製造方法 |
EP1815532B1 (en) | 2004-11-18 | 2008-06-18 | Philips Intellectual Property & Standards GmbH | Light emitting device with conversion structure |
EP1825535B1 (en) * | 2004-12-06 | 2009-11-11 | Philips Intellectual Property & Standards GmbH | Organic electroluminescent light source |
KR20070089845A (ko) * | 2004-12-06 | 2007-09-03 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 유기 전계발광 광원 |
DE102004060890A1 (de) | 2004-12-17 | 2006-06-29 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Kfz-Scheinwerferelement |
DE102004062989A1 (de) | 2004-12-22 | 2006-07-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Beleuchtungseinrichtung mit mindestens einer Leuchtdiode und Fahrzeugscheinwerfer |
SG161205A1 (en) * | 2004-12-22 | 2010-05-27 | Seoul Semiconductor Co Ltd | Light emitting device |
US7322732B2 (en) | 2004-12-23 | 2008-01-29 | Cree, Inc. | Light emitting diode arrays for direct backlighting of liquid crystal displays |
US20060138941A1 (en) * | 2004-12-27 | 2006-06-29 | Osram Opto Semiconductors Gmbh | Electrolumenscent organic light emitting device and production method thereof |
JP2006190888A (ja) * | 2005-01-07 | 2006-07-20 | Stanley Electric Co Ltd | 表面実装型led |
US7564180B2 (en) * | 2005-01-10 | 2009-07-21 | Cree, Inc. | Light emission device and method utilizing multiple emitters and multiple phosphors |
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US9793247B2 (en) * | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US8125137B2 (en) * | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US8110547B2 (en) * | 2005-01-12 | 2012-02-07 | Emisphere Technologies, Inc. | Compositions for buccal delivery of parathyroid hormone |
US7304694B2 (en) * | 2005-01-12 | 2007-12-04 | Cree, Inc. | Solid colloidal dispersions for backlighting of liquid crystal displays |
TWI352437B (en) * | 2007-08-27 | 2011-11-11 | Epistar Corp | Optoelectronic semiconductor device |
DE102006002275A1 (de) | 2005-01-19 | 2006-07-20 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung |
DE102005012953B9 (de) * | 2005-01-26 | 2013-04-25 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement |
US7521856B2 (en) * | 2005-01-26 | 2009-04-21 | Osram Opto Semiconductors Gmbh | OLED device |
JP4756261B2 (ja) | 2005-01-27 | 2011-08-24 | 独立行政法人物質・材料研究機構 | 蛍光体とその製造方法および発光器具 |
KR20060088228A (ko) * | 2005-02-01 | 2006-08-04 | 어드밴스드 옵토일렉트로닉 테크놀로지 인코포레이티드 | 나노미터 형광 물질을 이용하여 다수 파장의 빛을 방출할수 있는 발광 장치, 발광 소자 및 그의 제조 방법 |
US7358542B2 (en) * | 2005-02-02 | 2008-04-15 | Lumination Llc | Red emitting phosphor materials for use in LED and LCD applications |
US7497973B2 (en) * | 2005-02-02 | 2009-03-03 | Lumination Llc | Red line emitting phosphor materials for use in LED applications |
US20070114562A1 (en) * | 2005-11-22 | 2007-05-24 | Gelcore, Llc | Red and yellow phosphor-converted LEDs for signal applications |
US7648649B2 (en) * | 2005-02-02 | 2010-01-19 | Lumination Llc | Red line emitting phosphors for use in led applications |
DE102005004931B4 (de) * | 2005-02-03 | 2008-02-21 | Albis Plastic Gmbh | Beleuchtungsvorrichtung |
US7522211B2 (en) * | 2005-02-10 | 2009-04-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Studio light |
JP2006222288A (ja) * | 2005-02-10 | 2006-08-24 | Toshiba Corp | 白色led及びその製造方法 |
JP4733402B2 (ja) * | 2005-02-14 | 2011-07-27 | 株式会社Kri | 調光光学要素 |
DE102005041065A1 (de) | 2005-02-16 | 2006-08-24 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Beleuchtungseinrichtung |
US7405433B2 (en) | 2005-02-22 | 2008-07-29 | Avago Technologies Ecbu Ip Pte Ltd | Semiconductor light emitting device |
JP4538739B2 (ja) * | 2005-05-19 | 2010-09-08 | 電気化学工業株式会社 | α型サイアロン蛍光体とそれを用いた照明器具 |
DE102005009066A1 (de) | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optischen und eines strahlungsemittierenden Bauelementes und optisches sowie strahlungsemittierendes Bauelement |
KR101115855B1 (ko) | 2005-02-28 | 2012-03-08 | 덴끼 가가꾸 고교 가부시키가이샤 | 형광체와 그 제조 방법, 및 그것을 사용한 발광 소자 |
DE102005019375A1 (de) | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | LED-Array |
WO2006093015A1 (ja) * | 2005-02-28 | 2006-09-08 | Mitsubishi Chemical Corporation | 蛍光体及びその製造方法並びにその応用 |
US8748923B2 (en) * | 2005-03-14 | 2014-06-10 | Philips Lumileds Lighting Company Llc | Wavelength-converted semiconductor light emitting device |
US7341878B2 (en) * | 2005-03-14 | 2008-03-11 | Philips Lumileds Lighting Company, Llc | Wavelength-converted semiconductor light emitting device |
US20060222024A1 (en) * | 2005-03-15 | 2006-10-05 | Gray Allen L | Mode-locked semiconductor lasers with quantum-confined active region |
US7274045B2 (en) * | 2005-03-17 | 2007-09-25 | Lumination Llc | Borate phosphor materials for use in lighting applications |
JP4788944B2 (ja) * | 2005-03-18 | 2011-10-05 | 株式会社フジクラ | 粉末状蛍光体とその製造方法、発光デバイス及び照明装置 |
JP2006261540A (ja) * | 2005-03-18 | 2006-09-28 | Stanley Electric Co Ltd | 発光デバイス |
TWI249867B (en) | 2005-03-24 | 2006-02-21 | Lighthouse Technology Co Ltd | Light-emitting diode package, cold cathode fluorescence lamp and photoluminescence material thereof |
US7276183B2 (en) * | 2005-03-25 | 2007-10-02 | Sarnoff Corporation | Metal silicate-silica-based polymorphous phosphors and lighting devices |
JP4751972B2 (ja) * | 2005-03-29 | 2011-08-17 | 独立行政法人科学技術振興機構 | 電界発光素子の駆動方法 |
US20060221022A1 (en) * | 2005-04-01 | 2006-10-05 | Roger Hajjar | Laser vector scanner systems with display screens having optical fluorescent materials |
US7733310B2 (en) * | 2005-04-01 | 2010-06-08 | Prysm, Inc. | Display screens having optical fluorescent materials |
US7474286B2 (en) * | 2005-04-01 | 2009-01-06 | Spudnik, Inc. | Laser displays using UV-excitable phosphors emitting visible colored light |
US7791561B2 (en) * | 2005-04-01 | 2010-09-07 | Prysm, Inc. | Display systems having screens with optical fluorescent materials |
JP2006314082A (ja) * | 2005-04-04 | 2006-11-16 | Nippon Sheet Glass Co Ltd | 発光ユニット、該発光ユニットを用いた照明装置及び画像読取装置 |
US20060226772A1 (en) * | 2005-04-06 | 2006-10-12 | Tan Kheng L | Increased light output light emitting device using multiple phosphors |
US20060227825A1 (en) * | 2005-04-07 | 2006-10-12 | Nl-Nanosemiconductor Gmbh | Mode-locked quantum dot laser with controllable gain properties by multiple stacking |
US20060231847A1 (en) * | 2005-04-15 | 2006-10-19 | Taiwan Oasis Technology Co., Ltd. | Multiple-wavelength light emitting diode and its light emitting chip structure |
US7994702B2 (en) | 2005-04-27 | 2011-08-09 | Prysm, Inc. | Scanning beams displays based on light-emitting screens having phosphors |
US8000005B2 (en) | 2006-03-31 | 2011-08-16 | Prysm, Inc. | Multilayered fluorescent screens for scanning beam display systems |
US8089425B2 (en) * | 2006-03-03 | 2012-01-03 | Prysm, Inc. | Optical designs for scanning beam display systems using fluorescent screens |
TW200638558A (en) * | 2005-04-29 | 2006-11-01 | Teknowledge Dev Corp | White light emitting diode device |
CN101175835B (zh) | 2005-05-24 | 2012-10-10 | 三菱化学株式会社 | 荧光体及其应用 |
CN100399591C (zh) * | 2005-05-24 | 2008-07-02 | 陈建伟 | 自适应360度体发光白光发光二极管 |
DE102005025416A1 (de) | 2005-06-02 | 2006-12-14 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenchip mit einer Kontaktstruktur |
US8718437B2 (en) | 2006-03-07 | 2014-05-06 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
US9297092B2 (en) | 2005-06-05 | 2016-03-29 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
US8669572B2 (en) * | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
EP2075288B1 (en) | 2005-06-14 | 2014-09-03 | Denki Kagaku Kogyo Kabushiki Kaisha | Resin composition and sheet containing phosphor, and light emitting element using such composition and sheet |
WO2007002234A1 (en) * | 2005-06-23 | 2007-01-04 | Rensselaer Polytechnic Institute | Package design for producing white light with short-wavelength leds and down-conversion materials |
DE102005030324B4 (de) * | 2005-06-29 | 2013-04-04 | Lextar Electronics Corp. | Lichtemittierende Dioden-Baugruppenanordnung, Kaltkathoden-Fluoreszenzlampe und photolumineszentes Material davon |
DE102005031523B4 (de) * | 2005-06-30 | 2015-11-05 | Schott Ag | Halbleiterlichtquelle mit Lichtkonversionsmedium aus Glaskeramik |
US8883039B2 (en) | 2005-07-01 | 2014-11-11 | National Institute For Materials Science | Fluorophor and method for production thereof and illuminator |
DE102005030761A1 (de) * | 2005-07-01 | 2007-01-04 | Carl Zeiss Jena Gmbh | Beleuchtungseinrichtung für Mikroskope |
US7825580B2 (en) | 2005-07-01 | 2010-11-02 | National Institute For Materials Science | Fluorophor and method for production thereof and illuminator |
KR100665216B1 (ko) | 2005-07-04 | 2007-01-09 | 삼성전기주식회사 | 개선된 측벽 반사 구조를 갖는 측면형 발광다이오드 |
DE102005034166A1 (de) | 2005-07-21 | 2007-02-01 | Osram Opto Semiconductors Gmbh | Gehäuse für ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement, elektromagnetische Strahlung emittierendes Bauelement und Verfahren zum Herstellen eines Gehäuses oder eines Bauelements |
DE102005034793B3 (de) * | 2005-07-21 | 2007-04-19 | G.L.I. Global Light Industries Gmbh | Lichtemittierende Halbleiterdiode hoher Lichtleistung |
DE102005035722B9 (de) | 2005-07-29 | 2021-11-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
KR20080049011A (ko) * | 2005-08-05 | 2008-06-03 | 마쯔시다덴기산교 가부시키가이샤 | 반도체 발광장치 |
US8277687B2 (en) | 2005-08-10 | 2012-10-02 | Mitsubishi Chemical Corporation | Phosphor and light-emitting device using same |
US7329907B2 (en) | 2005-08-12 | 2008-02-12 | Avago Technologies, Ecbu Ip Pte Ltd | Phosphor-converted LED devices having improved light distribution uniformity |
KR100691273B1 (ko) * | 2005-08-23 | 2007-03-12 | 삼성전기주식회사 | 복합 형광체 분말, 이를 이용한 발광 장치 및 복합 형광체분말의 제조 방법 |
DE102005040558A1 (de) * | 2005-08-26 | 2007-03-01 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines Lumineszenzdiodenchips und Lumineszenzdiodenchip |
DE102005041064B4 (de) * | 2005-08-30 | 2023-01-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
DE102005046450A1 (de) | 2005-09-28 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip, Verfahren zu dessen Herstellung und optoelektronisches Bauteil |
JP2007096079A (ja) * | 2005-09-29 | 2007-04-12 | Stanley Electric Co Ltd | 半導体発光装置 |
DE102006032416A1 (de) * | 2005-09-29 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement |
DE102006032428A1 (de) * | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelements |
DE102005049685A1 (de) | 2005-10-14 | 2007-04-19 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Multifunktions-Kfz-Scheinwerfermodul insbesondere für den Frontbereich eines Fahrzeugs |
US7952108B2 (en) * | 2005-10-18 | 2011-05-31 | Finisar Corporation | Reducing thermal expansion effects in semiconductor packages |
KR100665262B1 (ko) * | 2005-10-20 | 2007-01-09 | 삼성전기주식회사 | 발광다이오드 패키지 |
EP1783482A1 (de) * | 2005-11-04 | 2007-05-09 | Siemens Aktiengesellschaft | Verfahren zum Strahlen und ein Strahlmaterial |
KR101258397B1 (ko) | 2005-11-11 | 2013-04-30 | 서울반도체 주식회사 | 구리 알칼리토 실리케이트 혼성 결정 형광체 |
KR100691440B1 (ko) * | 2005-11-15 | 2007-03-09 | 삼성전기주식회사 | Led 패키지 |
US20070114561A1 (en) * | 2005-11-22 | 2007-05-24 | Comanzo Holly A | High efficiency phosphor for use in LEDs |
US7564070B2 (en) * | 2005-11-23 | 2009-07-21 | Visteon Global Technologies, Inc. | Light emitting diode device having a shield and/or filter |
US20070125984A1 (en) * | 2005-12-01 | 2007-06-07 | Sarnoff Corporation | Phosphors protected against moisture and LED lighting devices |
US8906262B2 (en) * | 2005-12-02 | 2014-12-09 | Lightscape Materials, Inc. | Metal silicate halide phosphors and LED lighting devices using the same |
JP2009518833A (ja) | 2005-12-07 | 2009-05-07 | インノルメ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 広帯域スペクトル発光を有するレーザ光源 |
US7561607B2 (en) * | 2005-12-07 | 2009-07-14 | Innolume Gmbh | Laser source with broadband spectrum emission |
US7835408B2 (en) * | 2005-12-07 | 2010-11-16 | Innolume Gmbh | Optical transmission system |
KR101055772B1 (ko) | 2005-12-15 | 2011-08-11 | 서울반도체 주식회사 | 발광장치 |
JP2007165811A (ja) | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | 発光装置 |
DE102006033893B4 (de) | 2005-12-16 | 2017-02-23 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung |
JP5614766B2 (ja) | 2005-12-21 | 2014-10-29 | クリー インコーポレイテッドCree Inc. | 照明装置 |
EP2372224A3 (en) * | 2005-12-21 | 2012-08-01 | Cree, Inc. | Lighting Device and Lighting Method |
KR20090009772A (ko) | 2005-12-22 | 2009-01-23 | 크리 엘이디 라이팅 솔루션즈, 인크. | 조명 장치 |
US7772604B2 (en) | 2006-01-05 | 2010-08-10 | Illumitex | Separate optical device for directing light from an LED |
KR100723247B1 (ko) * | 2006-01-10 | 2007-05-29 | 삼성전기주식회사 | 칩코팅형 led 패키지 및 그 제조방법 |
JP2007188976A (ja) * | 2006-01-11 | 2007-07-26 | Shinko Electric Ind Co Ltd | 発光装置の製造方法 |
US8264138B2 (en) * | 2006-01-20 | 2012-09-11 | Cree, Inc. | Shifting spectral content in solid state light emitters by spatially separating lumiphor films |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
US8441179B2 (en) | 2006-01-20 | 2013-05-14 | Cree, Inc. | Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources |
CN1807548B (zh) * | 2006-01-27 | 2010-09-08 | 罗维鸿 | 多棱面大粒度分散萤光粉及使用它的白光二极管 |
TWI317756B (en) * | 2006-02-07 | 2009-12-01 | Coretronic Corp | Phosphor, fluorescent gel, and light emitting diode device |
US7884816B2 (en) * | 2006-02-15 | 2011-02-08 | Prysm, Inc. | Correcting pyramidal error of polygon scanner in scanning beam display systems |
US8451195B2 (en) | 2006-02-15 | 2013-05-28 | Prysm, Inc. | Servo-assisted scanning beam display systems using fluorescent screens |
JP4820184B2 (ja) * | 2006-02-20 | 2011-11-24 | シチズン電子株式会社 | 発光装置とその製造方法 |
US7737634B2 (en) | 2006-03-06 | 2010-06-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | LED devices having improved containment for liquid encapsulant |
US9874674B2 (en) | 2006-03-07 | 2018-01-23 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
US8849087B2 (en) * | 2006-03-07 | 2014-09-30 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
EP2041478B1 (en) | 2006-03-07 | 2014-08-06 | QD Vision, Inc. | An article including semiconductor nanocrystals |
DE102006011453A1 (de) * | 2006-03-13 | 2007-09-20 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Hochbeständiges Kunststoffbauteil, das zur Lumineszent geeignet ist |
KR100746749B1 (ko) | 2006-03-15 | 2007-08-09 | (주)케이디티 | 광 여기 시트 |
US7808004B2 (en) * | 2006-03-17 | 2010-10-05 | Edison Opto Corporation | Light emitting diode package structure and method of manufacturing the same |
US7675145B2 (en) * | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
JP5025636B2 (ja) * | 2006-03-28 | 2012-09-12 | 京セラ株式会社 | 発光装置 |
DE112007000773B4 (de) * | 2006-03-29 | 2013-04-25 | Kyocera Corp. | Licht emittierende Vorrichtung |
KR100875443B1 (ko) | 2006-03-31 | 2008-12-23 | 서울반도체 주식회사 | 발광 장치 |
KR101274044B1 (ko) * | 2006-03-31 | 2013-06-12 | 서울반도체 주식회사 | 발광 소자 및 이를 포함한 led 백라이트 |
US8969908B2 (en) * | 2006-04-04 | 2015-03-03 | Cree, Inc. | Uniform emission LED package |
EP2052589A4 (en) * | 2006-04-18 | 2012-09-19 | Cree Inc | LIGHTING DEVICE AND METHOD |
US8513875B2 (en) * | 2006-04-18 | 2013-08-20 | Cree, Inc. | Lighting device and lighting method |
US9084328B2 (en) | 2006-12-01 | 2015-07-14 | Cree, Inc. | Lighting device and lighting method |
US7821194B2 (en) * | 2006-04-18 | 2010-10-26 | Cree, Inc. | Solid state lighting devices including light mixtures |
BRPI0710461A2 (pt) | 2006-04-20 | 2011-08-16 | Cree Led Lighting Solutions | dispositivo de iluminação e método de iluminação |
US8748915B2 (en) * | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US7635915B2 (en) * | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
CA2645353A1 (en) | 2006-05-02 | 2007-11-15 | Superbulbs, Inc. | Plastic led bulb |
AU2007248756A1 (en) | 2006-05-02 | 2007-11-15 | Carol Lenk | Method of light dispersion and preferential scattering of certain wavelengths of light for light-emitting diodes and bulbs constructed therefrom |
US7722220B2 (en) | 2006-05-05 | 2010-05-25 | Cree Led Lighting Solutions, Inc. | Lighting device |
KR101026307B1 (ko) | 2006-05-05 | 2011-03-31 | 프리즘, 인코포레이티드 | 디스플레이 시스템 및 장치용 형광체 조성물 및 다른 형광 물질 |
TWI357435B (en) * | 2006-05-12 | 2012-02-01 | Lextar Electronics Corp | Light emitting diode and wavelength converting mat |
EP2027602A4 (en) * | 2006-05-23 | 2012-11-28 | Cree Inc | LIGHTING DEVICE AND METHOD OF MAKING |
WO2007139781A2 (en) * | 2006-05-23 | 2007-12-06 | Cree Led Lighting Solutions, Inc. | Lighting device |
US8596819B2 (en) * | 2006-05-31 | 2013-12-03 | Cree, Inc. | Lighting device and method of lighting |
JP2007324475A (ja) * | 2006-06-02 | 2007-12-13 | Sharp Corp | 波長変換部材および発光装置 |
US7541596B2 (en) * | 2006-07-05 | 2009-06-02 | Omnivision Technologies, Inc. | Method and apparatus for increasing light absorption in an image sensor using energy conversion layer |
US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
US7943952B2 (en) * | 2006-07-31 | 2011-05-17 | Cree, Inc. | Method of uniform phosphor chip coating and LED package fabricated using method |
US20080029720A1 (en) | 2006-08-03 | 2008-02-07 | Intematix Corporation | LED lighting arrangement including light emitting phosphor |
US8367945B2 (en) * | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
KR101258227B1 (ko) | 2006-08-29 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
US7703942B2 (en) * | 2006-08-31 | 2010-04-27 | Rensselaer Polytechnic Institute | High-efficient light engines using light emitting diodes |
US8425271B2 (en) | 2006-09-01 | 2013-04-23 | Cree, Inc. | Phosphor position in light emitting diodes |
US7910938B2 (en) | 2006-09-01 | 2011-03-22 | Cree, Inc. | Encapsulant profile for light emitting diodes |
US20100224890A1 (en) * | 2006-09-18 | 2010-09-09 | Cree, Inc. | Light emitting diode chip with electrical insulation element |
US20080068295A1 (en) * | 2006-09-19 | 2008-03-20 | Hajjar Roger A | Compensation for Spatial Variation in Displayed Image in Scanning Beam Display Systems Using Light-Emitting Screens |
DE102007020782A1 (de) | 2006-09-27 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
WO2008038924A1 (en) * | 2006-09-28 | 2008-04-03 | Seoul Opto Device Co., Ltd. | Ultraviolet light emitting diode package |
KR100757803B1 (ko) | 2006-09-29 | 2007-09-11 | 서울옵토디바이스주식회사 | 자외선 발광다이오드 어셈블리 |
DE102006046678A1 (de) | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zum Herstellen eines Gehäuses für ein optoelektronisches Bauelement |
DE102006051746A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer Lumineszenzkonversionsschicht |
KR20090084830A (ko) | 2006-09-29 | 2009-08-05 | 오스람 옵토 세미컨덕터스 게엠베하 | 광 도파로 및 광학 장치 |
DE102006046199A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
EP2070123A2 (en) | 2006-10-02 | 2009-06-17 | Illumitex, Inc. | Led system and method |
KR101497104B1 (ko) * | 2006-10-03 | 2015-02-27 | 라이트스케이프 머티어리얼스, 인코포레이티드 | 금속 실리케이트 할라이드 형광체 및 이를 이용한 led 조명 디바이스 |
US9018619B2 (en) | 2006-10-09 | 2015-04-28 | Cree, Inc. | Quantum wells for light conversion |
US8475683B2 (en) | 2006-10-20 | 2013-07-02 | Intematix Corporation | Yellow-green to yellow-emitting phosphors based on halogenated-aluminates |
US8133461B2 (en) * | 2006-10-20 | 2012-03-13 | Intematix Corporation | Nano-YAG:Ce phosphor compositions and their methods of preparation |
US9120975B2 (en) | 2006-10-20 | 2015-09-01 | Intematix Corporation | Yellow-green to yellow-emitting phosphors based on terbium-containing aluminates |
US8529791B2 (en) | 2006-10-20 | 2013-09-10 | Intematix Corporation | Green-emitting, garnet-based phosphors in general and backlighting applications |
EP1914809A1 (en) | 2006-10-20 | 2008-04-23 | Tridonic Optoelectronics GmbH | Cover for optoelectronic components |
US7659549B2 (en) * | 2006-10-23 | 2010-02-09 | Chang Gung University | Method for obtaining a better color rendering with a photoluminescence plate |
DE102006051756A1 (de) | 2006-11-02 | 2008-05-08 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Lichtquelle |
US8029155B2 (en) * | 2006-11-07 | 2011-10-04 | Cree, Inc. | Lighting device and lighting method |
US10295147B2 (en) * | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
US7889421B2 (en) | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
EP1925874B8 (en) | 2006-11-24 | 2014-09-10 | OSRAM GmbH | LED color-mixing lighting system |
US9441793B2 (en) | 2006-12-01 | 2016-09-13 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
US7918581B2 (en) | 2006-12-07 | 2011-04-05 | Cree, Inc. | Lighting device and lighting method |
JP4910192B2 (ja) * | 2006-12-12 | 2012-04-04 | 独立行政法人科学技術振興機構 | 酸化物電界発光素子 |
US8013506B2 (en) * | 2006-12-12 | 2011-09-06 | Prysm, Inc. | Organic compounds for adjusting phosphor chromaticity |
US9178121B2 (en) | 2006-12-15 | 2015-11-03 | Cree, Inc. | Reflective mounting substrates for light emitting diodes |
US20090110933A1 (en) * | 2007-10-30 | 2009-04-30 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Systems and devices related to nitric oxide releasing materials |
US8221690B2 (en) * | 2007-10-30 | 2012-07-17 | The Invention Science Fund I, Llc | Systems and devices that utilize photolyzable nitric oxide donors |
US20110190604A1 (en) * | 2006-12-22 | 2011-08-04 | Hyde Roderick A | Nitric oxide sensors and systems |
US20090112197A1 (en) | 2007-10-30 | 2009-04-30 | Searete Llc | Devices configured to facilitate release of nitric oxide |
US8642093B2 (en) * | 2007-10-30 | 2014-02-04 | The Invention Science Fund I, Llc | Methods and systems for use of photolyzable nitric oxide donors |
US7862598B2 (en) * | 2007-10-30 | 2011-01-04 | The Invention Science Fund I, Llc | Devices and systems that deliver nitric oxide |
JP5168152B2 (ja) * | 2006-12-28 | 2013-03-21 | 日亜化学工業株式会社 | 発光装置 |
JP5380774B2 (ja) | 2006-12-28 | 2014-01-08 | 日亜化学工業株式会社 | 表面実装型側面発光装置及びその製造方法 |
KR100946015B1 (ko) * | 2007-01-02 | 2010-03-09 | 삼성전기주식회사 | 백색 발광장치 및 이를 이용한 lcd 백라이트용 광원모듈 |
US8836212B2 (en) | 2007-01-11 | 2014-09-16 | Qd Vision, Inc. | Light emissive printed article printed with quantum dot ink |
DE102007003785A1 (de) | 2007-01-19 | 2008-07-24 | Merck Patent Gmbh | Emitter-converter-chip |
US7968900B2 (en) * | 2007-01-19 | 2011-06-28 | Cree, Inc. | High performance LED package |
US9159888B2 (en) | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US9024349B2 (en) | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US8232564B2 (en) * | 2007-01-22 | 2012-07-31 | Cree, Inc. | Wafer level phosphor coating technique for warm light emitting diodes |
US20090085053A1 (en) * | 2007-01-25 | 2009-04-02 | Hsing Chen | Light emitting diode package with large viewing angle |
US20080179618A1 (en) * | 2007-01-26 | 2008-07-31 | Ching-Tai Cheng | Ceramic led package |
DE102007010244A1 (de) * | 2007-02-02 | 2008-08-07 | Osram Opto Semiconductors Gmbh | Anordnung und Verfahren zur Erzeugung von Mischlicht |
JP4335263B2 (ja) * | 2007-02-07 | 2009-09-30 | ソニー株式会社 | 半導体装置および半導体装置の製造方法 |
US8212262B2 (en) | 2007-02-09 | 2012-07-03 | Cree, Inc. | Transparent LED chip |
US9711703B2 (en) * | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US9944031B2 (en) * | 2007-02-13 | 2018-04-17 | 3M Innovative Properties Company | Molded optical articles and methods of making same |
EP2111651A4 (en) * | 2007-02-13 | 2011-08-17 | 3M Innovative Properties Co | LED DEVICES HAVING ASSOCIATED LENSES AND METHODS OF MANUFACTURE |
KR100900620B1 (ko) * | 2007-02-20 | 2009-06-02 | 삼성전기주식회사 | 백색 발광 장치 |
US20080197369A1 (en) * | 2007-02-20 | 2008-08-21 | Cree, Inc. | Double flip semiconductor device and method for fabrication |
US8506114B2 (en) * | 2007-02-22 | 2013-08-13 | Cree, Inc. | Lighting devices, methods of lighting, light filters and methods of filtering light |
JP5013905B2 (ja) | 2007-02-28 | 2012-08-29 | スタンレー電気株式会社 | 半導体発光装置 |
RU2468838C2 (ru) * | 2007-03-09 | 2012-12-10 | Конинклейке Филипс Электроникс Н.В. | Осветительная система для энергетической стимуляции |
KR100818518B1 (ko) * | 2007-03-14 | 2008-03-31 | 삼성전기주식회사 | Led 패키지 |
CN101682709B (zh) * | 2007-03-20 | 2013-11-06 | Prysm公司 | 将广告或其它应用数据传送到显示系统并进行显示 |
DE102007016228A1 (de) | 2007-04-04 | 2008-10-09 | Litec Lll Gmbh | Verfahren zur Herstellung von Leuchtstoffen basierend auf Orthosilikaten für pcLEDs |
DE102007016229A1 (de) | 2007-04-04 | 2008-10-09 | Litec Lll Gmbh | Verfahren zur Herstellung von Leuchtstoffen basierend auf Orthosilikaten für pcLEDs |
US7697183B2 (en) * | 2007-04-06 | 2010-04-13 | Prysm, Inc. | Post-objective scanning beam systems |
US8169454B1 (en) | 2007-04-06 | 2012-05-01 | Prysm, Inc. | Patterning a surface using pre-objective and post-objective raster scanning systems |
US20080258130A1 (en) * | 2007-04-23 | 2008-10-23 | Bergmann Michael J | Beveled LED Chip with Transparent Substrate |
DE102007019775A1 (de) | 2007-04-26 | 2008-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
DE102007019776A1 (de) | 2007-04-26 | 2008-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente |
EP1987762A1 (de) * | 2007-05-03 | 2008-11-05 | F.Hoffmann-La Roche Ag | Oximeter |
WO2008137977A1 (en) | 2007-05-08 | 2008-11-13 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
KR101485206B1 (ko) * | 2007-05-08 | 2015-01-27 | 크리, 인코포레이티드 | 조명 장치 및 조명 방법 |
BRPI0811561A2 (pt) | 2007-05-08 | 2015-06-16 | Cree Led Lighting Solutions | Dispositivo de iluminação e método de iluminação |
KR20100017668A (ko) | 2007-05-08 | 2010-02-16 | 크리 엘이디 라이팅 솔루션즈, 인크. | 조명 장치 및 조명 방법 |
US7781779B2 (en) * | 2007-05-08 | 2010-08-24 | Luminus Devices, Inc. | Light emitting devices including wavelength converting material |
CN101688644B (zh) | 2007-05-08 | 2011-06-15 | 科锐Led照明科技公司 | 照明装置及照明方法 |
CN101688979B (zh) | 2007-05-17 | 2011-02-09 | Prysm公司 | 用于扫描光束显示系统的具有发光带的多层屏幕 |
KR101109988B1 (ko) | 2007-05-22 | 2012-03-14 | 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 | 형광체 및 그의 제조방법, 및 그것을 사용한 발광장치 |
DE102007025092A1 (de) | 2007-05-30 | 2008-12-04 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenchip |
US20100163920A1 (en) * | 2007-06-14 | 2010-07-01 | Rohm Co., Ltd. | Semiconductor light emitting device |
US7942556B2 (en) * | 2007-06-18 | 2011-05-17 | Xicato, Inc. | Solid state illumination device |
DE102007028120A1 (de) | 2007-06-19 | 2008-12-24 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Chlorosilikat-Leuchtstoffs und damit hergestellter Leuchtstoff |
KR101672553B1 (ko) | 2007-06-25 | 2016-11-03 | 큐디 비젼, 인크. | 조성물 및 나노물질의 침착을 포함하는 방법 |
US7878657B2 (en) * | 2007-06-27 | 2011-02-01 | Prysm, Inc. | Servo feedback control based on invisible scanning servo beam in scanning beam display systems with light-emitting screens |
US8556430B2 (en) | 2007-06-27 | 2013-10-15 | Prysm, Inc. | Servo feedback control based on designated scanning servo beam in scanning beam display systems with light-emitting screens |
TWI365546B (en) * | 2007-06-29 | 2012-06-01 | Ind Tech Res Inst | Light emitting diode device and fabrication method thereof |
US20090001372A1 (en) * | 2007-06-29 | 2009-01-01 | Lumination Llc | Efficient cooling of lasers, LEDs and photonics devices |
DE102007030129A1 (de) | 2007-06-29 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente und optoelektronisches Bauelement |
US10505083B2 (en) * | 2007-07-11 | 2019-12-10 | Cree, Inc. | Coating method utilizing phosphor containment structure and devices fabricated using same |
US9401461B2 (en) | 2007-07-11 | 2016-07-26 | Cree, Inc. | LED chip design for white conversion |
US20090016066A1 (en) * | 2007-07-12 | 2009-01-15 | Chen Pi Hsiang | Package Structure for a High-Luminance Light Source |
TWI404228B (zh) | 2007-07-12 | 2013-08-01 | Epistar Corp | 半導體發光裝置與其製造方法 |
TWI347687B (en) * | 2007-07-13 | 2011-08-21 | Lite On Technology Corp | Light-emitting device with open-loop control |
TWI429731B (zh) * | 2007-07-16 | 2014-03-11 | Lumination Llc | 由4價錳離子活化之發紅光錯合氟化磷光體 |
US8791631B2 (en) * | 2007-07-19 | 2014-07-29 | Quarkstar Llc | Light emitting device |
JPWO2009011205A1 (ja) | 2007-07-19 | 2010-09-16 | シャープ株式会社 | 発光装置 |
WO2009014707A2 (en) | 2007-07-23 | 2009-01-29 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
TWI384052B (zh) * | 2007-07-25 | 2013-02-01 | Univ Nat Chiao Tung | 新穎螢光體與其製造方法 |
DE102007036226A1 (de) * | 2007-08-02 | 2009-02-05 | Perkinelmer Elcos Gmbh | Anbringungsstruktur für LEDs, LED-Baugruppe, LED-Baugruppensockel, Verfahren zum Ausbilden einer Anbringungsstruktur |
TWI342628B (en) * | 2007-08-02 | 2011-05-21 | Lextar Electronics Corp | Light emitting diode package, direct type back light module and side type backlight module |
US20090039375A1 (en) * | 2007-08-07 | 2009-02-12 | Cree, Inc. | Semiconductor light emitting devices with separated wavelength conversion materials and methods of forming the same |
US7863635B2 (en) * | 2007-08-07 | 2011-01-04 | Cree, Inc. | Semiconductor light emitting devices with applied wavelength conversion materials |
CN101784636B (zh) | 2007-08-22 | 2013-06-12 | 首尔半导体株式会社 | 非化学计量四方铜碱土硅酸盐磷光体及其制备方法 |
US8128249B2 (en) | 2007-08-28 | 2012-03-06 | Qd Vision, Inc. | Apparatus for selectively backlighting a material |
KR101055769B1 (ko) | 2007-08-28 | 2011-08-11 | 서울반도체 주식회사 | 비화학양론적 정방정계 알칼리 토류 실리케이트 형광체를채택한 발광 장치 |
JP5578597B2 (ja) | 2007-09-03 | 2014-08-27 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
US20090065792A1 (en) * | 2007-09-07 | 2009-03-12 | 3M Innovative Properties Company | Method of making an led device having a dome lens |
DE102007058723A1 (de) | 2007-09-10 | 2009-03-12 | Osram Opto Semiconductors Gmbh | Lichtemittierende Struktur |
US20090068496A1 (en) * | 2007-09-10 | 2009-03-12 | Liann-Be Chang | Led structure |
US20150147240A1 (en) * | 2007-09-10 | 2015-05-28 | Liann-Be Chang | Led Lamp Having Photocatalyst Agents |
DE102007043183A1 (de) * | 2007-09-11 | 2009-04-09 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines solchen |
DE102007049005A1 (de) | 2007-09-11 | 2009-03-12 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
DE202007019100U1 (de) | 2007-09-12 | 2010-09-02 | Lumitech Produktion Und Entwicklung Gmbh | LED-Modul, LED-Leuchtmittel und LED-Leuchte für die energieeffiziente Wiedergabe von weißem Licht |
DE102007043903A1 (de) | 2007-09-14 | 2009-03-26 | Osram Gesellschaft mit beschränkter Haftung | Leucht-Vorrichtung |
CN101388161A (zh) * | 2007-09-14 | 2009-03-18 | 科锐香港有限公司 | Led表面安装装置和并入有此装置的led显示器 |
DE102007050876A1 (de) | 2007-09-26 | 2009-04-09 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
DE102007057710B4 (de) * | 2007-09-28 | 2024-03-14 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierendes Bauelement mit Konversionselement |
DE102008012316B4 (de) | 2007-09-28 | 2023-02-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlichtquelle mit einer Primärstrahlungsquelle und einem Lumineszenzkonversionselement |
DE102007046519A1 (de) | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Dünnfilm-LED mit einer Spiegelschicht und Verfahren zu deren Herstellung |
DE102007049799A1 (de) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
DE102007046611A1 (de) | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Lichtquelle mit Konversionselement und Lichtwellenleiter, Verfahren zur Herstellung der Lichtquelle und deren Verwendung |
TWI481068B (zh) * | 2007-10-10 | 2015-04-11 | 克里公司 | 照明裝置及其製造方法 |
US9086213B2 (en) | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
US7984999B2 (en) | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
US8415695B2 (en) * | 2007-10-24 | 2013-04-09 | Switch Bulb Company, Inc. | Diffuser for LED light sources |
US8349262B2 (en) * | 2007-10-30 | 2013-01-08 | The Invention Science Fund I, Llc | Nitric oxide permeable housings |
US10080823B2 (en) | 2007-10-30 | 2018-09-25 | Gearbox Llc | Substrates for nitric oxide releasing devices |
US8877508B2 (en) * | 2007-10-30 | 2014-11-04 | The Invention Science Fund I, Llc | Devices and systems that deliver nitric oxide |
US20090112193A1 (en) * | 2007-10-30 | 2009-04-30 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Systems and devices that utilize photolyzable nitric oxide donors |
US7897399B2 (en) | 2007-10-30 | 2011-03-01 | The Invention Science Fund I, Llc | Nitric oxide sensors and systems |
US20090112055A1 (en) * | 2007-10-30 | 2009-04-30 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Sleeves configured to facilitate release of nitric oxide |
US8980332B2 (en) | 2007-10-30 | 2015-03-17 | The Invention Science Fund I, Llc | Methods and systems for use of photolyzable nitric oxide donors |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
USD615504S1 (en) | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
US8866169B2 (en) * | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
US8018139B2 (en) * | 2007-11-05 | 2011-09-13 | Enertron, Inc. | Light source and method of controlling light spectrum of an LED light engine |
US8119028B2 (en) * | 2007-11-14 | 2012-02-21 | Cree, Inc. | Cerium and europium doped single crystal phosphors |
US8462269B2 (en) * | 2007-11-16 | 2013-06-11 | Mediatek Inc. | Devices and methods for extracting a synchronization signal from a video signal |
DE102007056562A1 (de) | 2007-11-23 | 2009-05-28 | Oerlikon Textile Gmbh & Co. Kg | Vorrichtung zur optischen Detektion von Verunreinigungen in längsbewegtem Garn |
DE102007057669A1 (de) | 2007-11-30 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Mischfarbige Strahlung emittierendes Halbleiterbauelement |
DE102007057812A1 (de) * | 2007-11-30 | 2009-06-25 | Schott Ag | Lichtemittierende Vorrichtung und Verfahren zu deren Herstellung sowie Lichtkonverter und dessen Verwendung |
US8283686B2 (en) * | 2007-12-11 | 2012-10-09 | Koninklijke Philips Electronics N.V. | Side emitting device with hybrid top reflector |
US8471281B2 (en) * | 2007-12-11 | 2013-06-25 | Koninklijke Philips Electronics N.V. | Side emitting device with hybrid top reflector |
TWI390008B (zh) * | 2007-12-12 | 2013-03-21 | Solar cells and their light-emitting conversion layer | |
US8167674B2 (en) * | 2007-12-14 | 2012-05-01 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US9041285B2 (en) | 2007-12-14 | 2015-05-26 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
USD633631S1 (en) | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
US9431589B2 (en) * | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
USD634863S1 (en) | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
US8878219B2 (en) | 2008-01-11 | 2014-11-04 | Cree, Inc. | Flip-chip phosphor coating method and devices fabricated utilizing method |
US20090309114A1 (en) | 2008-01-16 | 2009-12-17 | Luminus Devices, Inc. | Wavelength converting light-emitting devices and methods of making the same |
DE102008006988A1 (de) | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102008006990A1 (de) * | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Hintergrundbeleuchtungseinheit für eine Hintergrundbeleuchtung eines Bildschirms und Bildschirmeinheit des Bildschirms |
DE102008012407A1 (de) | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
KR100937963B1 (ko) * | 2008-02-05 | 2010-01-21 | 삼성에스디아이 주식회사 | 디스플레이 장치용 형광체 조성물 |
US7829358B2 (en) | 2008-02-08 | 2010-11-09 | Illumitex, Inc. | System and method for emitter layer shaping |
DE102008026841A1 (de) * | 2008-02-22 | 2009-08-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
DE202008005509U1 (de) * | 2008-02-26 | 2009-07-09 | Ledon Lighting Jennersdorf Gmbh | LED-Modul mit anwendungsspezifischer Farbeinstellung |
KR100950418B1 (ko) * | 2008-02-29 | 2010-03-29 | 부경대학교 산학협력단 | 백색 엘이디용 가넷계 결정 형광체 및 이의 제조방법 |
DE102008011866B4 (de) | 2008-02-29 | 2018-05-03 | Osram Opto Semiconductors Gmbh | Lichtquellenanordnung mit einer Halbleiterlichtquelle |
JP5416975B2 (ja) * | 2008-03-11 | 2014-02-12 | ローム株式会社 | 半導体発光装置 |
US8637883B2 (en) | 2008-03-19 | 2014-01-28 | Cree, Inc. | Low index spacer layer in LED devices |
DE102008019667A1 (de) | 2008-04-18 | 2009-10-22 | Ledon Lighting Jennersdorf Gmbh | LED-Modul mit einer Plattform mit einer Zentralausnehmung |
DE102008020882A1 (de) * | 2008-04-25 | 2009-10-29 | Ledon Lighting Jennersdorf Gmbh | Lichtemittierende Vorrichtung und Verfahren zur Bereitstellung einer lichtemittierenden Vorrichtung mit vordefinierten optischen Eigenschaften des emittierten Lichts |
DE102009018603B9 (de) | 2008-04-25 | 2021-01-14 | Samsung Electronics Co., Ltd. | Leuchtvorrichtung und Herstellungsverfahren derselben |
DE102008021436A1 (de) | 2008-04-29 | 2010-05-20 | Schott Ag | Optik-Konverter-System für (W)LEDs |
DE202008005987U1 (de) * | 2008-04-30 | 2009-09-03 | Ledon Lighting Jennersdorf Gmbh | LED-Modul mit kalottenförmiger Farbkonversionsschicht |
DE102008021658A1 (de) | 2008-04-30 | 2009-11-05 | Ledon Lighting Jennersdorf Gmbh | Lichtemittierende Vorrichtung mit Volumenstrukturierung |
WO2009151515A1 (en) | 2008-05-06 | 2009-12-17 | Qd Vision, Inc. | Solid state lighting devices including quantum confined semiconductor nanoparticles |
US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
WO2009137053A1 (en) | 2008-05-06 | 2009-11-12 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
DE102008022795B4 (de) | 2008-05-08 | 2020-01-09 | Osram Opto Semiconductors Gmbh | Kfz-Scheinwerfer |
TWI362769B (en) | 2008-05-09 | 2012-04-21 | Univ Nat Chiao Tung | Light emitting device and fabrication method therefor |
US8049230B2 (en) * | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
US8242525B2 (en) * | 2008-05-20 | 2012-08-14 | Lightscape Materials, Inc. | Silicate-based phosphors and LED lighting devices using the same |
DE202008018269U1 (de) | 2008-05-29 | 2012-06-26 | Lumitech Produktion Und Entwicklung Gmbh | LED Modul für die Allgemeinbeleuchtung |
DE102008025756B4 (de) * | 2008-05-29 | 2023-02-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiteranordnung |
DE102008025864A1 (de) | 2008-05-29 | 2009-12-03 | Lumitech Produktion Und Entwicklung Gmbh | LED Modul für die Allgemeinbeleuchtung |
US7868340B2 (en) | 2008-05-30 | 2011-01-11 | Bridgelux, Inc. | Method and apparatus for generating white light from solid state light emitting devices |
JP5152502B2 (ja) * | 2008-06-09 | 2013-02-27 | スタンレー電気株式会社 | 灯具 |
TWI384649B (zh) * | 2008-06-18 | 2013-02-01 | Harvatek Corp | Light emitting diode chip encapsulation structure with embedded electrostatic protection function and its making method |
KR101495071B1 (ko) * | 2008-06-24 | 2015-02-25 | 삼성전자 주식회사 | 서브 마운트 및 이를 이용한 발광 장치, 상기 서브마운트의 제조 방법 및 이를 이용한 발광 장치의 제조 방법 |
US8240875B2 (en) | 2008-06-25 | 2012-08-14 | Cree, Inc. | Solid state linear array modules for general illumination |
CN101619136B (zh) * | 2008-06-30 | 2011-11-23 | 柏腾科技股份有限公司 | 用于转换光谱的有机薄膜及发光二极管芯片封装模块 |
WO2010002221A2 (ko) | 2008-07-03 | 2010-01-07 | 삼성엘이디 주식회사 | 파장변환형 발광다이오드 칩 및 이를 구비한 발광장치 |
DE102008033394B4 (de) | 2008-07-16 | 2018-01-25 | Osram Oled Gmbh | Bauteil mit einem ersten und einem zweiten Substrat |
DE102008034708A1 (de) | 2008-07-25 | 2010-02-04 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
US7869112B2 (en) * | 2008-07-25 | 2011-01-11 | Prysm, Inc. | Beam scanning based on two-dimensional polygon scanner for display and other applications |
JP4890514B2 (ja) * | 2008-08-07 | 2012-03-07 | 星和電機株式会社 | 蛍光体及び発光ダイオード |
CN100565000C (zh) * | 2008-08-11 | 2009-12-02 | 山东华光光电子有限公司 | 利用yag透明陶瓷制备白光led的方法 |
US8152586B2 (en) | 2008-08-11 | 2012-04-10 | Shat-R-Shield, Inc. | Shatterproof light tube having after-glow |
WO2010021676A1 (en) | 2008-08-18 | 2010-02-25 | Superbulbs, Inc. | Anti-reflective coatings for light bulbs |
WO2010025876A1 (de) * | 2008-09-04 | 2010-03-11 | Bayer Materialscience Ag | Lichtemittierende vorrichtung und verfahren zu deren herstellung |
EP2161763A1 (de) * | 2008-09-04 | 2010-03-10 | Bayer MaterialScience AG | Konversionsfolie und ein Verfahren zu deren Herstellung |
DE102008048653A1 (de) * | 2008-09-24 | 2010-04-08 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
DE102008049188A1 (de) | 2008-09-26 | 2010-04-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Modul mit einem Trägersubstrat und einer Mehrzahl von strahlungsemittierenden Halbleiterbauelementen und Verfahren zu dessen Herstellung |
DE102008049069B8 (de) | 2008-09-26 | 2020-10-15 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Modul mit einem Trägersubstrat, zumindest einem strahlungsemittierenden Halbleiterbauelement und mindestens einem elektrischen Bauelement und Verfahren zu dessen Herstellung |
US7955875B2 (en) * | 2008-09-26 | 2011-06-07 | Cree, Inc. | Forming light emitting devices including custom wavelength conversion structures |
US8075165B2 (en) * | 2008-10-14 | 2011-12-13 | Ledengin, Inc. | Total internal reflection lens and mechanical retention and locating device |
US20100097779A1 (en) | 2008-10-21 | 2010-04-22 | Mitutoyo Corporation | High intensity pulsed light source configurations |
US8096676B2 (en) * | 2008-10-21 | 2012-01-17 | Mitutoyo Corporation | High intensity pulsed light source configurations |
DE102008052751A1 (de) * | 2008-10-22 | 2010-04-29 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines Lumineszenzkonversionselements, Lumineszenzkonversionselement und optoelektronisches Bauteil |
US9425172B2 (en) * | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US20100109025A1 (en) * | 2008-11-05 | 2010-05-06 | Koninklijke Philips Electronics N.V. | Over the mold phosphor lens for an led |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
DE102008057720A1 (de) * | 2008-11-17 | 2010-05-20 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
US8220971B2 (en) | 2008-11-21 | 2012-07-17 | Xicato, Inc. | Light emitting diode module with three part color matching |
JP5641384B2 (ja) | 2008-11-28 | 2014-12-17 | 独立行政法人物質・材料研究機構 | 表示装置用照明装置及び表示装置 |
US8456082B2 (en) * | 2008-12-01 | 2013-06-04 | Ifire Ip Corporation | Surface-emission light source with uniform illumination |
EP2371044B1 (en) * | 2008-12-03 | 2019-08-28 | Innolume GmbH | Semiconductor laser with low relative intensity noise of individual longitudinal modes and optical transmission system incorporating the laser |
TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
US8507300B2 (en) * | 2008-12-24 | 2013-08-13 | Ledengin, Inc. | Light-emitting diode with light-conversion layer |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
CN101499446B (zh) * | 2009-02-26 | 2013-10-16 | 光宝电子(广州)有限公司 | 导线架料片、封装结构以及发光二极管封装结构 |
JP5126127B2 (ja) * | 2009-03-17 | 2013-01-23 | 豊田合成株式会社 | 発光装置の製造方法 |
DE102009022682A1 (de) | 2009-05-26 | 2010-12-02 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Leuchtdiode |
US8921876B2 (en) * | 2009-06-02 | 2014-12-30 | Cree, Inc. | Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements |
US8426871B2 (en) * | 2009-06-19 | 2013-04-23 | Honeywell International Inc. | Phosphor converting IR LEDs |
KR101055762B1 (ko) | 2009-09-01 | 2011-08-11 | 서울반도체 주식회사 | 옥시오소실리케이트 발광체를 갖는 발광 물질을 채택한 발광 장치 |
DE102009030205A1 (de) | 2009-06-24 | 2010-12-30 | Litec-Lp Gmbh | Leuchtstoffe mit Eu(II)-dotierten silikatischen Luminophore |
US8415692B2 (en) * | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
JP5517037B2 (ja) | 2009-08-06 | 2014-06-11 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
KR101869923B1 (ko) | 2009-08-14 | 2018-07-20 | 삼성전자주식회사 | 조명 장치, 조명 장치용 광학 요소, 및 방법 |
DE102009037732A1 (de) * | 2009-08-17 | 2011-02-24 | Osram Gesellschaft mit beschränkter Haftung | Konversions-LED mit hoher Effizienz |
US8598809B2 (en) * | 2009-08-19 | 2013-12-03 | Cree, Inc. | White light color changing solid state lighting and methods |
US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
DE102009039982A1 (de) | 2009-09-03 | 2011-03-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements |
CN102630288B (zh) | 2009-09-25 | 2015-09-09 | 科锐公司 | 具有低眩光和高亮度级均匀性的照明设备 |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
DE102009048401A1 (de) | 2009-10-06 | 2011-04-07 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil |
KR101034054B1 (ko) * | 2009-10-22 | 2011-05-12 | 엘지이노텍 주식회사 | 발광소자 패키지 및 그 제조방법 |
US9435493B2 (en) | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
RU2511030C2 (ru) * | 2009-12-04 | 2014-04-10 | Анатолий Васильевич Вишняков | Композиционный люминесцирующий материал для твердотельных источников белого света |
US8466611B2 (en) | 2009-12-14 | 2013-06-18 | Cree, Inc. | Lighting device with shaped remote phosphor |
DE102009058796A1 (de) | 2009-12-18 | 2011-06-22 | OSRAM Opto Semiconductors GmbH, 93055 | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
WO2011079900A1 (de) | 2009-12-30 | 2011-07-07 | Merck Patent Gmbh | Vergussmasse als diffusionsbarriere für wassermoleküle |
JP5383611B2 (ja) * | 2010-01-29 | 2014-01-08 | 株式会社東芝 | Ledパッケージ |
DE102010018260A1 (de) * | 2010-01-29 | 2011-08-04 | OSRAM Opto Semiconductors GmbH, 93055 | Beleuchtungsvorrichtung |
TW201128808A (en) * | 2010-02-03 | 2011-08-16 | Advanced Optoelectronic Tech | Package of semiconductor light emitting device |
US9631782B2 (en) * | 2010-02-04 | 2017-04-25 | Xicato, Inc. | LED-based rectangular illumination device |
US9468070B2 (en) | 2010-02-16 | 2016-10-11 | Cree Inc. | Color control of light emitting devices and applications thereof |
WO2011102185A1 (ja) * | 2010-02-17 | 2011-08-25 | シャープ株式会社 | 光源ユニット、照明装置、表示装置、テレビ受信装置 |
SG183402A1 (en) | 2010-02-19 | 2012-09-27 | Toray Industries | Phosphor-containing cured silicone, process for production of same, phosphor-containing silicone composition, precursor of the composition, sheet-shaped moldings, led package, light -emitting device, and process for production of led-mounted substrate |
DE102010009456A1 (de) | 2010-02-26 | 2011-09-01 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement mit einem Halbleiterchip und einem Konversionselement und Verfahren zu dessen Herstellung |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
US8104908B2 (en) | 2010-03-04 | 2012-01-31 | Xicato, Inc. | Efficient LED-based illumination module with high color rendering index |
EP2548235B1 (en) * | 2010-03-16 | 2019-05-08 | Signify Holding B.V. | Lighting apparatus |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
MY169600A (en) | 2010-05-24 | 2019-04-22 | Dominant Opto Tech Sdn Bhd | Led lighting device with uniform color mixing |
US8684559B2 (en) | 2010-06-04 | 2014-04-01 | Cree, Inc. | Solid state light source emitting warm light with high CRI |
DE102011106209A1 (de) | 2010-06-07 | 2011-12-08 | Tek Beng Low | Led lighting device with high colour re-producibility |
US8142050B2 (en) | 2010-06-24 | 2012-03-27 | Mitutoyo Corporation | Phosphor wheel configuration for high intensity point source |
US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
DE102010034923A1 (de) | 2010-08-20 | 2012-02-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Schichtverbunds aus einer Lumineszenzkonversionsschicht und einer Streuschicht |
DE102010034913B4 (de) | 2010-08-20 | 2023-03-30 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlung emittierendes Bauelement und Verfahren zur Herstellung des Strahlung emittierenden Bauelements |
US20120051045A1 (en) | 2010-08-27 | 2012-03-01 | Xicato, Inc. | Led Based Illumination Module Color Matched To An Arbitrary Light Source |
KR20120024104A (ko) * | 2010-09-06 | 2012-03-14 | 서울옵토디바이스주식회사 | 발광 소자 |
US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
CN103155024B (zh) | 2010-10-05 | 2016-09-14 | 英特曼帝克司公司 | 具光致发光波长转换的固态发光装置及标牌 |
US8604678B2 (en) | 2010-10-05 | 2013-12-10 | Intematix Corporation | Wavelength conversion component with a diffusing layer |
US8614539B2 (en) | 2010-10-05 | 2013-12-24 | Intematix Corporation | Wavelength conversion component with scattering particles |
US8610341B2 (en) | 2010-10-05 | 2013-12-17 | Intematix Corporation | Wavelength conversion component |
US8957585B2 (en) | 2010-10-05 | 2015-02-17 | Intermatix Corporation | Solid-state light emitting devices with photoluminescence wavelength conversion |
US9546765B2 (en) | 2010-10-05 | 2017-01-17 | Intematix Corporation | Diffuser component having scattering particles |
JP5468517B2 (ja) | 2010-10-19 | 2014-04-09 | パナソニック株式会社 | 半導体発光デバイス |
US20120097985A1 (en) * | 2010-10-21 | 2012-04-26 | Wen-Huang Liu | Light Emitting Diode (LED) Package And Method Of Fabrication |
KR20120050282A (ko) * | 2010-11-10 | 2012-05-18 | 삼성엘이디 주식회사 | 발광 소자 패키지 및 그 제조 방법 |
DE102010051286A1 (de) * | 2010-11-12 | 2012-05-16 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
US8556469B2 (en) | 2010-12-06 | 2013-10-15 | Cree, Inc. | High efficiency total internal reflection optic for solid state lighting luminaires |
US9117979B2 (en) * | 2010-12-13 | 2015-08-25 | Toray Industries, Inc. | Phosphor sheet, LED and light emitting device using the same and method for manufacturing LED |
KR101101712B1 (ko) * | 2010-12-13 | 2012-01-05 | 한국세라믹기술원 | 고굴절률 발광소자용 패키지의 제조방법 |
DE102010055265A1 (de) | 2010-12-20 | 2012-06-21 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
DE102010063760B4 (de) | 2010-12-21 | 2022-12-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement |
US8772817B2 (en) | 2010-12-22 | 2014-07-08 | Cree, Inc. | Electronic device submounts including substrates with thermally conductive vias |
US8317347B2 (en) | 2010-12-22 | 2012-11-27 | Mitutoyo Corporation | High intensity point source system for high spectral stability |
US8493569B2 (en) | 2010-12-27 | 2013-07-23 | Mitutoyo Corporation | Optical encoder readhead configuration with phosphor layer |
DE102011013369A1 (de) | 2010-12-30 | 2012-07-05 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen einer Mehrzahl von Halbleiterbauelementen |
DE102011009369A1 (de) * | 2011-01-25 | 2012-07-26 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
US9166126B2 (en) | 2011-01-31 | 2015-10-20 | Cree, Inc. | Conformally coated light emitting devices and methods for providing the same |
US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
US20130329448A1 (en) * | 2011-03-01 | 2013-12-12 | Osram Gmbh | Lighting apparatus with phosphor element |
JPWO2012131792A1 (ja) | 2011-03-31 | 2014-07-24 | パナソニック株式会社 | 半導体発光装置 |
CN102766906B (zh) * | 2011-05-05 | 2016-06-29 | 中国科学院福建物质结构研究所 | 一类铒离子激活3微米波段镓酸盐激光晶体及其制备方法 |
DE102011100710A1 (de) | 2011-05-06 | 2012-11-08 | Osram Opto Semiconductors Gmbh | Konversionselement für Leuchtdioden und Herstellungsverfahren |
DE102011102590A1 (de) | 2011-05-27 | 2012-11-29 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von Leuchtdioden-Bauelementen |
US8747697B2 (en) * | 2011-06-07 | 2014-06-10 | Cree, Inc. | Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same |
JP5863291B2 (ja) * | 2011-06-28 | 2016-02-16 | 株式会社小糸製作所 | 平面発光モジュール |
DE102011079721A1 (de) | 2011-07-25 | 2013-01-31 | Osram Gesellschaft mit beschränkter Haftung | Led-lichtquelle |
KR101871501B1 (ko) | 2011-07-29 | 2018-06-27 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 이를 구비한 조명 시스템 |
JP2013030380A (ja) * | 2011-07-29 | 2013-02-07 | Sharp Corp | 発光装置 |
US9290618B2 (en) | 2011-08-05 | 2016-03-22 | Sabic Global Technologies B.V. | Polycarbonate compositions having enhanced optical properties, methods of making and articles comprising the polycarbonate compositions |
US9772270B2 (en) | 2011-08-16 | 2017-09-26 | Elwha Llc | Devices and methods for recording information on a subject's body |
DE102011113777A1 (de) | 2011-09-19 | 2013-03-21 | Osram Opto Semiconductors Gmbh | Wellenlängenkonversionselement und Licht emittierendes Halbleiterbauelement mit Wellenlängenkonversionselement |
RU2639980C2 (ru) * | 2011-10-19 | 2017-12-25 | Филипс Лайтинг Холдинг Б.В. | Осветительное устройство с круговым распределением света |
DE102011116752A1 (de) * | 2011-10-24 | 2013-04-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Streumittel |
US8962117B2 (en) | 2011-10-27 | 2015-02-24 | Sabic Global Technologies B.V. | Process for producing bisphenol A with reduced sulfur content, polycarbonate made from the bisphenol A, and containers formed from the polycarbonate |
CN104115290B (zh) | 2011-11-23 | 2017-04-05 | 夸克星有限责任公司 | 提供光的不对称传播的发光装置 |
US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
DE102011056810B4 (de) | 2011-12-21 | 2022-01-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauelement |
DE102012000217A1 (de) | 2012-01-07 | 2013-07-11 | Michael Licht | Vis led |
US20130187540A1 (en) | 2012-01-24 | 2013-07-25 | Michael A. Tischler | Discrete phosphor chips for light-emitting devices and related methods |
US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US8896010B2 (en) | 2012-01-24 | 2014-11-25 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
KR101957700B1 (ko) | 2012-02-01 | 2019-03-14 | 삼성전자주식회사 | 발광 장치 |
DE102012201448B4 (de) * | 2012-02-01 | 2015-10-22 | Osram Gmbh | Verfahren zum Herstellen einer mit Leuchtstoff versetzten Platte |
CN104205376B (zh) | 2012-02-03 | 2018-04-27 | 沙特基础全球技术有限公司 | 发光二极管器件及用于生产其的包括转换材料化学的方法 |
EP2814071A4 (en) * | 2012-02-08 | 2015-01-07 | Panasonic Corp | LUMINESCENT DEVICE |
WO2013118072A2 (en) | 2012-02-10 | 2013-08-15 | Koninklijke Philips N.V. | Wavelength converted light emitting device |
DE102012202928A1 (de) * | 2012-02-27 | 2013-08-29 | Osram Gmbh | Lichtquelle mit led-chip und leuchtstoffschicht |
WO2013130606A2 (en) * | 2012-02-29 | 2013-09-06 | Sabic Innovative Plastics Ip B.V. | Polycarbonate made from low sulfur bisphenol a and containing converions material chemistry, and articles made therefrom |
WO2013130610A1 (en) | 2012-02-29 | 2013-09-06 | Sabic Innovative Plastics Ip B.V. | Polycarbonate compositions containing conversions material chemistry and having enhanced optical properties, methods of making and articles comprising the same |
KR20140148417A (ko) * | 2012-03-27 | 2014-12-31 | 스미또모 베이크라이트 가부시키가이샤 | 광 반사용 수지 조성물, 광 반도체 소자 탑재용 기판 및 광 반도체 장치 |
US9897284B2 (en) | 2012-03-28 | 2018-02-20 | Ledengin, Inc. | LED-based MR16 replacement lamp |
US9346949B2 (en) | 2013-02-12 | 2016-05-24 | Sabic Global Technologies B.V. | High reflectance polycarbonate |
DE102012103159A1 (de) | 2012-04-12 | 2013-10-17 | Osram Opto Semiconductors Gmbh | Strahlung emittierendes Bauelement, transparentes Material und Füllstoffpartikel sowie deren Herstellungsverfahren |
CN103375708B (zh) * | 2012-04-26 | 2015-10-28 | 展晶科技(深圳)有限公司 | 发光二极管灯源装置 |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
DE102012104363A1 (de) | 2012-05-21 | 2013-11-21 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
US9929325B2 (en) | 2012-06-05 | 2018-03-27 | Samsung Electronics Co., Ltd. | Lighting device including quantum dots |
CN104169637B (zh) | 2012-06-21 | 2015-09-16 | 松下知识产权经营株式会社 | 发光装置以及投影装置 |
US9685585B2 (en) | 2012-06-25 | 2017-06-20 | Cree, Inc. | Quantum dot narrow-band downconverters for high efficiency LEDs |
JP2014041993A (ja) | 2012-07-24 | 2014-03-06 | Toyoda Gosei Co Ltd | 発光装置及びその製造方法 |
DE102012106812A1 (de) | 2012-07-26 | 2014-01-30 | Osram Opto Semiconductors Gmbh | Verfahren zum Vergießen von optoelektronischen Bauelementen |
DE102012108828A1 (de) | 2012-09-19 | 2014-03-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement, optisches Element und deren Herstellungsverfahren |
DE102012109083A1 (de) * | 2012-09-26 | 2014-03-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
DE102012109754A1 (de) * | 2012-10-12 | 2014-04-17 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements |
EP2910622B1 (en) | 2012-10-16 | 2017-06-21 | Denka Company Limited | Phosphor, light emitting device and lighting apparatus |
WO2014066784A1 (en) | 2012-10-25 | 2014-05-01 | Sabic Innovative Plastics Ip B.V. | Light emitting diode devices, method of manufacture, uses thereof |
TW201418414A (zh) * | 2012-11-12 | 2014-05-16 | Genesis Photonics Inc | 波長轉換物質、波長轉換膠體以及發光裝置 |
EP2733190B1 (en) | 2012-11-16 | 2020-01-01 | LG Innotek Co., Ltd. | Phosphor composition and light emitting device package having the same |
US20140185269A1 (en) | 2012-12-28 | 2014-07-03 | Intermatix Corporation | Solid-state lamps utilizing photoluminescence wavelength conversion components |
KR20140111876A (ko) | 2013-03-12 | 2014-09-22 | 삼성디스플레이 주식회사 | 표시 장치 |
WO2014151263A1 (en) | 2013-03-15 | 2014-09-25 | Intematix Corporation | Photoluminescence wavelength conversion components |
KR20140113046A (ko) | 2013-03-15 | 2014-09-24 | 삼성디스플레이 주식회사 | 표시 장치 |
WO2014145644A2 (en) * | 2013-03-15 | 2014-09-18 | Spanard Jan-Marie | Methods of tuning light emitting devices and tuned light emitting devices |
DE102013006308A1 (de) * | 2013-04-12 | 2014-10-16 | Thiesen Hardware- Und Software-Design Gmbh | LED-Leuchte mit einer lichtemittierenden Diode |
DE102013207460A1 (de) * | 2013-04-24 | 2014-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
WO2014186548A1 (en) | 2013-05-16 | 2014-11-20 | Sabic Innovative Plastics Ip B.V. | Branched polycarbonate compositions having conversion material chemistry and articles thereof |
FR3006546B1 (fr) * | 2013-05-28 | 2019-03-29 | Sgame | Module de diode electroluminescente lumiere blanche |
CN105408408B (zh) | 2013-05-29 | 2018-05-04 | 沙特基础全球技术有限公司 | 颜色稳定的热塑性组合物 |
US9772086B2 (en) | 2013-05-29 | 2017-09-26 | Sabic Innovative Plastics Ip B.V. | Illuminating devices with color stable thermoplastic light transmitting articles |
CN104241262B (zh) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | 发光装置以及显示装置 |
DE102013107862A1 (de) * | 2013-07-23 | 2015-01-29 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung zumindest eines oberflächenmontierbaren optoelektronischen Halbleiterbauteils |
CN103467936B (zh) * | 2013-09-12 | 2016-01-20 | 苏州金海薄膜科技发展有限公司 | 一种可吸收并转化紫外光及短波蓝光的pet薄膜及其制备方法 |
JP6209949B2 (ja) * | 2013-11-13 | 2017-10-11 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
US9382472B2 (en) * | 2013-12-18 | 2016-07-05 | Rohm And Haas Electronic Materials Llc | Transformative wavelength conversion medium |
JP2015144261A (ja) * | 2013-12-26 | 2015-08-06 | インテマティックス・コーポレーションIntematix Corporation | フォトルミネセンス波長変換を用いる固体発光デバイス |
US9343443B2 (en) | 2014-02-05 | 2016-05-17 | Cooledge Lighting, Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
WO2015147096A1 (ja) * | 2014-03-26 | 2015-10-01 | リンテック株式会社 | シート状封止材、封止シートおよび電子デバイス封止体 |
JP2015192096A (ja) * | 2014-03-28 | 2015-11-02 | 豊田合成株式会社 | 発光装置 |
CZ307024B6 (cs) * | 2014-05-05 | 2017-11-22 | Crytur, Spol.S R.O. | Světelný zdroj |
KR20150129232A (ko) | 2014-05-09 | 2015-11-19 | 삼성디스플레이 주식회사 | 백라이트 유닛 및 이를 포함하는 표시 장치 |
DE102014108188A1 (de) | 2014-06-11 | 2015-12-17 | Osram Gmbh | Optoelektronisches Halbleiterbauteil |
DE102014117423A1 (de) * | 2014-11-27 | 2016-06-02 | Seaborough IP IV BV | Lichtemittierende Remote-Phosphor-Vorrichtung |
KR102530385B1 (ko) * | 2015-03-24 | 2023-05-09 | 코닌클리케 필립스 엔.브이. | 청색 색소를 갖는 청색 방출 인광체 변환 led |
CN106328008B (zh) * | 2015-06-30 | 2019-03-22 | 光宝光电(常州)有限公司 | 胶体填充至壳体的制法、发光二极管的数字显示器及制法 |
JP6141948B2 (ja) * | 2015-11-30 | 2017-06-07 | 大電株式会社 | 紫外線発光蛍光体、発光素子、及び発光装置 |
KR20180101493A (ko) | 2016-01-14 | 2018-09-12 | 바스프 에스이 | 강성 2,2'-비페녹시 가교를 갖는 페릴렌 비스이미드 |
JP6951847B2 (ja) * | 2016-03-18 | 2021-10-20 | 日東電工株式会社 | 光学部材、ならびに、該光学部材を用いたバックライトユニットおよび液晶表示装置 |
CN205944139U (zh) | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | 紫外线发光二极管封装件以及包含此的发光二极管模块 |
DE102017202956A1 (de) * | 2016-07-11 | 2018-01-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Verfahren und aushärtbare Masse zum Vergießen elektronischer Bauteile oder Bauteilgruppen |
KR101731762B1 (ko) * | 2016-07-27 | 2017-04-28 | 오충봉 | 발광체 분말을 이용한 확산판 제조기술 |
DE102016113969A1 (de) * | 2016-07-28 | 2018-02-01 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip, Verfahren zur Herstellung einer Vielzahl strahlungsemittierender Halbleiterchips, strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelements |
TWI721005B (zh) * | 2016-08-17 | 2021-03-11 | 晶元光電股份有限公司 | 發光裝置以及其製造方法 |
DE102016115907A1 (de) | 2016-08-26 | 2018-03-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102016117519A1 (de) | 2016-09-16 | 2018-03-22 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Siloxans, Verfahren zur Herstellung eines Polysiloxans, Verfahren zum Vergießen von optoelektronischen Bauelementen |
US11441036B2 (en) | 2016-10-06 | 2022-09-13 | Basf Se | 2-phenylphenoxy-substituted perylene bisimide compounds and their use |
DE102016011999A1 (de) | 2016-10-06 | 2018-04-12 | Michael Licht | Uv-led |
WO2018094220A1 (en) | 2016-11-18 | 2018-05-24 | Gr Energy Services Management, Lp | Mobile ball launcher with free-fall ball release and method of making same |
DE102017117441A1 (de) * | 2017-08-01 | 2019-02-07 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements |
JP2019046989A (ja) * | 2017-09-04 | 2019-03-22 | スタンレー電気株式会社 | 半導体発光装置及び半導体発光装置の製造方法 |
US10957825B2 (en) | 2017-09-25 | 2021-03-23 | Lg Innotek Co., Ltd. | Lighting module and lighting apparatus having thereof |
WO2019121602A1 (en) | 2017-12-19 | 2019-06-27 | Basf Se | Cyanoaryl substituted benz(othi)oxanthene compounds |
KR20200132946A (ko) | 2018-03-20 | 2020-11-25 | 바스프 에스이 | 황색 광 방출 장치 |
EP3547378B1 (en) * | 2018-03-26 | 2022-01-05 | Nichia Corporation | Light emitting module |
JP6923814B2 (ja) | 2018-03-26 | 2021-08-25 | 日亜化学工業株式会社 | 発光モジュール |
JP7089175B2 (ja) * | 2018-06-20 | 2022-06-22 | 日亜化学工業株式会社 | セラミックス複合体、それを用いた発光装置及びセラミックス複合体の製造方法 |
WO2019243286A1 (en) | 2018-06-22 | 2019-12-26 | Basf Se | Photostable cyano-substituted boron-dipyrromethene dye as green emitter for display and illumination applications |
US20200161506A1 (en) * | 2018-11-21 | 2020-05-21 | Osram Opto Semiconductors Gmbh | Method for Producing a Ceramic Converter Element, Ceramic Converter Element, and Optoelectronic Component |
US10756243B1 (en) * | 2019-03-04 | 2020-08-25 | Chung Yuan Christian University | Light-emitting diode package structure and method for manufacturing the same |
US11313671B2 (en) | 2019-05-28 | 2022-04-26 | Mitutoyo Corporation | Chromatic confocal range sensing system with enhanced spectrum light source configuration |
DE102019212944A1 (de) * | 2019-08-28 | 2021-03-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterbauelement, vorrichtung mit einem halbleiterbauelement und verfahren zur herstellung von halbleiterbauelementen |
RU195810U1 (ru) * | 2019-09-27 | 2020-02-05 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" (ТУСУР) | Светоизлучающий диод |
US11426476B2 (en) * | 2019-12-12 | 2022-08-30 | United States Of America As Represented By The Secretary Of The Navy | Internal ultraviolet LED antifouling |
US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
DE102021105905B4 (de) | 2020-05-29 | 2024-08-01 | GM Global Technology Operations LLC | Durch quantenpunkt-material verbesserte led-beleuchtung |
US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
Family Cites Families (220)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2096693A (en) | 1937-04-03 | 1937-10-19 | Hygrade Sylvania Corp | Luminescent coating for electric lamps |
US2192869A (en) | 1937-10-27 | 1940-03-05 | Pearce John Harold George | Manufacture of fluorescent discharge tubes |
US2927279A (en) | 1954-06-14 | 1960-03-01 | Cgs Lab Inc | Variable frequency oscillator system |
US3316109A (en) | 1963-03-11 | 1967-04-25 | Westinghouse Electric Corp | Coating composition |
US3312851A (en) | 1963-04-26 | 1967-04-04 | Westinghouse Electric Corp | Electroluminescent lamp structure having the phosphor particles dispersed in a modified cyanoethylated polyvinyl alcohol resin |
US3440471A (en) | 1966-03-16 | 1969-04-22 | Gen Telephone & Elect | Electroluminescent cell matrix material of improved stability |
GB1208308A (en) | 1966-10-27 | 1970-10-14 | Matsushita Electric Ind Co Ltd | Electroluminescent display devices |
US3453604A (en) | 1966-11-15 | 1969-07-01 | Bell Telephone Labor Inc | Optical memory device employing multiphoton-excited fluorescing material to reduce exposure crosstalk |
NL152702B (nl) | 1966-12-31 | 1977-03-15 | Philips Nv | Werkwijze voor het vervaardigen van een kathodestraalbuis, alsmede een kathodestraalbuis, vervaardigd door toepassing van deze werkwijze. |
US3519474A (en) | 1967-02-02 | 1970-07-07 | Corning Glass Works | Light-diffusing surfaces for glass-ceramic articles |
US3565815A (en) | 1967-12-28 | 1971-02-23 | Ind Mfg Co Inc | Phosphor containing plastic polystyrene |
US3529200A (en) | 1968-03-28 | 1970-09-15 | Gen Electric | Light-emitting phosphor-diode combination |
US3510732A (en) | 1968-04-22 | 1970-05-05 | Gen Electric | Solid state lamp having a lens with rhodamine or fluorescent material dispersed therein |
NL6811326A (zh) | 1968-08-09 | 1970-02-11 | ||
NL6814348A (zh) | 1968-10-07 | 1970-04-09 | ||
US3822215A (en) | 1969-04-16 | 1974-07-02 | Bell Telephone Labor Inc | Phosphor rare earth oxychloride compositions |
US3659136A (en) | 1969-04-16 | 1972-04-25 | Bell Telephone Labor Inc | Gallium arsenide junction diode-activated up-converting phosphor |
US3621340A (en) | 1969-04-16 | 1971-11-16 | Bell Telephone Labor Inc | Gallium arsenide diode with up-converting phosphor coating |
US3593055A (en) | 1969-04-16 | 1971-07-13 | Bell Telephone Labor Inc | Electro-luminescent device |
SE364160B (zh) | 1969-05-26 | 1974-02-11 | Western Electric Co | |
US3699478A (en) | 1969-05-26 | 1972-10-17 | Bell Telephone Labor Inc | Display system |
US3573568A (en) | 1969-06-18 | 1971-04-06 | Gen Electric | Light emitting semiconductor chips mounted in a slotted substrate forming a display apparatus |
US3602758A (en) | 1969-06-20 | 1971-08-31 | Westinghouse Electric Corp | Phosphor blend lamps which reduce the proportions of the costlier phosphors |
CA932474A (en) | 1969-12-12 | 1973-08-21 | Kressel Henry | Electroluminescent device |
US3654463A (en) | 1970-01-19 | 1972-04-04 | Bell Telephone Labor Inc | Phosphorescent devices |
US3691482A (en) | 1970-01-19 | 1972-09-12 | Bell Telephone Labor Inc | Display system |
US3669478A (en) | 1970-05-04 | 1972-06-13 | Gen Electric | Machine and process for semiconductor device assembly |
US3787684A (en) | 1970-12-30 | 1974-01-22 | S Isenberg | Beta activated ultraviolet radiation source surrounded by a visible light producing fluorescent agent |
US3742277A (en) | 1971-03-18 | 1973-06-26 | Gte Laboratories Inc | Flying spot scanner having screen of strontium thiogallte coactivatedby trivalent cerium and divalent lead |
US3742833A (en) | 1971-06-14 | 1973-07-03 | J Sewell | System for optically encoding an item and verifying same |
BE786323A (fr) | 1971-07-16 | 1973-01-15 | Eastman Kodak Co | Ecran renforcateur et produit radiographique le |
DE7128442U (de) | 1971-07-23 | 1971-12-30 | Siemens Ag | Hermetisch abgeschlossenes gehaeuse fuer halbleiterbauelemente |
JPS48100083A (zh) | 1972-02-24 | 1973-12-18 | ||
JPS48102585A (zh) | 1972-04-04 | 1973-12-22 | ||
JPS491221A (zh) | 1972-04-17 | 1974-01-08 | ||
JPS4924355A (zh) * | 1972-06-27 | 1974-03-04 | ||
US3932881A (en) | 1972-09-05 | 1976-01-13 | Nippon Electric Co., Inc. | Electroluminescent device including dichroic and infrared reflecting components |
US3774086A (en) | 1972-09-25 | 1973-11-20 | Gen Electric | Solid state lamp having visible-emitting phosphor at edge of infrated-emitting element |
US3942185A (en) | 1972-12-13 | 1976-03-02 | U.S. Philips Corporation | Polychromatic electroluminescent device |
GB1455291A (en) | 1973-02-05 | 1976-11-10 | Rca Corp | Amplifier which consumes a substantially constant current |
US3780357A (en) | 1973-02-16 | 1973-12-18 | Hewlett Packard Co | Electroluminescent semiconductor display apparatus and method of fabricating the same |
JPS49112577A (zh) | 1973-02-23 | 1974-10-26 | ||
US3819974A (en) | 1973-03-12 | 1974-06-25 | D Stevenson | Gallium nitride metal-semiconductor junction light emitting diode |
JPS5043913A (zh) | 1973-08-20 | 1975-04-21 | ||
FR2262407B1 (zh) | 1974-02-22 | 1977-09-16 | Radiotechnique Compelec | |
US4034257A (en) | 1975-06-05 | 1977-07-05 | General Electric Company | Mercury vapor lamp utilizing a combination of phosphor materials |
JPS5245181A (en) | 1975-10-07 | 1977-04-09 | Matsushita Electric Works Ltd | Chain |
JPS52135663A (en) | 1976-05-10 | 1977-11-12 | Hitachi Ltd | Manufacture for brown tube |
NL181063C (nl) | 1976-05-13 | 1987-06-01 | Philips Nv | Luminescerend scherm; lagedrukkwikdampontladingslamp; werkwijze voor de bereiding van een luminescerend materiaal. |
US4075532A (en) | 1976-06-14 | 1978-02-21 | General Electric Company | Cool-white fluorescent lamp with phosphor having modified spectral energy distribution to improve luminosity thereof |
DE2629641C3 (de) | 1976-07-01 | 1979-03-08 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V., 8000 Muenchen | Vorrichtung zur Umwandlung von Lichtenergie in Wärmeenergie |
DE2737269A1 (de) | 1976-08-19 | 1978-02-23 | Bbc Brown Boveri & Cie | Informationsanzeigeplatte mit elektrolumineszierenden elementen sowie verfahren zur herstellung derselben |
GB1589964A (en) | 1976-09-03 | 1981-05-20 | Johnson Matthey Co Ltd | Luminescent materials |
DE2642465C3 (de) * | 1976-09-21 | 1981-01-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung einer VerguBmasse |
NL7707008A (nl) | 1977-06-24 | 1978-12-28 | Philips Nv | Luminescentiescherm. |
FR2400817A1 (fr) | 1977-08-19 | 1979-03-16 | Radiotechnique Compelec | Dispositifs electroluminescents pour affichage au soleil |
JPS5441660A (en) | 1977-09-09 | 1979-04-03 | Matsushita Electric Works Ltd | Timer |
US4203792A (en) | 1977-11-17 | 1980-05-20 | Bell Telephone Laboratories, Incorporated | Method for the fabrication of devices including polymeric materials |
JPS5489984A (en) * | 1977-12-27 | 1979-07-17 | Toshiba Corp | Fluorescent substance treating method |
US4173495A (en) | 1978-05-03 | 1979-11-06 | Owens-Illinois, Inc. | Solar collector structures containing thin film polysiloxane, and solar cells |
NL7806828A (nl) | 1978-06-26 | 1979-12-28 | Philips Nv | Luminescentiescherm. |
FR2436505A1 (fr) | 1978-09-12 | 1980-04-11 | Radiotechnique Compelec | Dispositif optoelectronique a emetteur et recepteur couples |
US4431941A (en) | 1979-06-11 | 1984-02-14 | Gte Products Corporation | Fluorescent lamp having double phosphor layer |
IT1132065B (it) * | 1979-06-15 | 1986-06-25 | Gte Prod Corp | Fosforo alluminato emettitore di raggi ultravioletti e lampade fluorescenti per l'abbronzatura artificiale utilizzanti tale fosforo |
JPS5632582A (en) * | 1979-08-23 | 1981-04-02 | Chugoku Toryo Kk | Method for increasing intensity of light emission of fluorescent material |
US4262206A (en) | 1980-01-11 | 1981-04-14 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Fluorescent radiation converter |
DE3016103A1 (de) | 1980-04-25 | 1981-10-29 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung transparenter geissharze |
US4495514A (en) | 1981-03-02 | 1985-01-22 | Eastman Kodak Company | Transparent electrode light emitting diode and method of manufacture |
DE3117571A1 (de) | 1981-05-04 | 1982-11-18 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Lumineszenz-halbleiterbauelement |
US4599537A (en) * | 1982-04-30 | 1986-07-08 | Shigeaki Yamashita | IR light emitting apparatus with visible detection means |
NL8203543A (nl) | 1982-09-13 | 1984-04-02 | Oce Nederland Bv | Kopieerapparaat. |
US5184114A (en) | 1982-11-04 | 1993-02-02 | Integrated Systems Engineering, Inc. | Solid state color display system and light emitting diode pixels therefor |
US4479886A (en) * | 1983-08-08 | 1984-10-30 | Gte Products Corporation | Method of making cerium activated yttrium aluminate phosphor |
US4550256A (en) | 1983-10-17 | 1985-10-29 | At&T Bell Laboratories | Visual display system utilizing high luminosity single crystal garnet material |
JPS60101175A (ja) | 1983-11-05 | 1985-06-05 | Sony Corp | 投射型テレビ用緑色螢光体 |
US4684592A (en) | 1984-04-06 | 1987-08-04 | Fuji Photo Film Co., Ltd. | Stimulable phosphor sheet |
US4710674A (en) | 1984-05-07 | 1987-12-01 | Gte Laboratories Incorporated | Phosphor particle, fluorescent lamp, and manufacturing method |
US4825124A (en) | 1984-05-07 | 1989-04-25 | Gte Laboratories Incorporated | Phosphor particle, fluorescent lamp, and manufacturing method |
JPS6110827A (ja) | 1984-06-27 | 1986-01-18 | Matsushita Electronics Corp | 陰極線管螢光体膜の形成方法 |
IT1183061B (it) | 1984-07-31 | 1987-10-05 | Zambon Spa | Composti dotati di attivita'antiallergica |
US4665003A (en) | 1984-07-31 | 1987-05-12 | Fuji Photo Film Co., Ltd. | Stimulable phosphor sheet and method of conveying the same |
JPS61220250A (ja) | 1985-03-26 | 1986-09-30 | Sony Corp | 陰極線管 |
NL8502025A (nl) | 1985-07-15 | 1987-02-02 | Philips Nv | Lagedrukkwikdampontladingslamp. |
US4818983A (en) | 1985-08-20 | 1989-04-04 | Hamamatsu Photonics Kabushiki Kaisha | Optical image generator having a spatial light modulator and a display device |
US4818434A (en) | 1985-11-15 | 1989-04-04 | Quantex Corporation | Thermoluminescent material including fusible salt |
US5166456A (en) | 1985-12-16 | 1992-11-24 | Kasei Optonix, Ltd. | Luminescent phosphor composition |
NL8600023A (nl) * | 1986-01-08 | 1987-08-03 | Philips Nv | Lagedrukkwikdampontladingslamp. |
US4734619A (en) | 1986-07-07 | 1988-03-29 | Karel Havel | Display device with variable color background |
US4894583A (en) | 1986-07-14 | 1990-01-16 | American Telephone And Telegraph Company, At&T Bell Laboratories | Display devices with yttrium orthosilicate phosphors |
JPS6323987A (ja) * | 1986-07-17 | 1988-02-01 | Toshiba Corp | 電場発光蛍光体 |
DE3633251A1 (de) | 1986-09-30 | 1988-03-31 | Siemens Ag | Optoelektronisches koppelelement |
US4875750A (en) | 1987-02-25 | 1989-10-24 | Siemens Aktiengesellschaft | Optoelectronic coupling element and method for its manufacture |
JPS63280467A (ja) | 1987-05-12 | 1988-11-17 | Toshiba Corp | 光半導体素子 |
JPS6471053A (en) * | 1987-09-10 | 1989-03-16 | Matsushita Electronics Corp | Fluorescent high-pressure mercury lamp |
DE3736970C3 (de) * | 1987-10-30 | 1996-08-01 | Stockhausen Chem Fab Gmbh | Wasserfreie Hautreinigungsmittel und ihre Verwendung |
US4843280A (en) | 1988-01-15 | 1989-06-27 | Siemens Corporate Research & Support, Inc. | A modular surface mount component for an electrical device or led's |
DE3804293A1 (de) * | 1988-02-12 | 1989-08-24 | Philips Patentverwaltung | Anordnung mit einer elektrolumineszenz- oder laserdiode |
US5132045A (en) | 1988-03-16 | 1992-07-21 | Mitsubishi Rayon Co., Ltd. | Acrylic phosphor paste compositions and phosphor coatings obtained therefrom |
JP2705183B2 (ja) * | 1988-07-30 | 1998-01-26 | ソニー株式会社 | イットリウム・アルミニウム・ガーネット微粒子およびイットリウム・アルミニウム・ガーネット系蛍光体微粒子の製造方法 |
KR920010085B1 (ko) | 1988-07-30 | 1992-11-14 | 소니 가부시기가이샤 | 이트륨 · 알루미늄 · 가넷미립자의 제조방법 |
JPH0749506B2 (ja) * | 1988-08-10 | 1995-05-31 | 日立化成工業株式会社 | 難燃性エポキシ樹脂組成物 |
JPH0291980A (ja) | 1988-09-29 | 1990-03-30 | Toshiba Lighting & Technol Corp | 固体発光素子 |
GB8823691D0 (en) | 1988-10-08 | 1988-11-16 | Emi Plc Thorn | Aquarium lighting |
DE3902001C2 (de) * | 1989-01-24 | 1995-08-31 | Tacan Corp | Verwendung eines Fluoreszenz-Materials |
US5137940A (en) | 1989-02-09 | 1992-08-11 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin compositions |
US5126214A (en) | 1989-03-15 | 1992-06-30 | Idemitsu Kosan Co., Ltd. | Electroluminescent element |
IT1229159B (it) | 1989-04-07 | 1991-07-22 | Minnesota Mining & Mfg | Metodo per registrare e riprodurre l'immagine di una radiazione, pannello e fosfori per la memorizzazione dell'immagine di una radiazione. |
EP0400176B1 (de) | 1989-05-31 | 2000-07-26 | Osram Opto Semiconductors GmbH & Co. OHG | Verfahren zum Montieren eines oberflächenmontierbaren Opto-Bauelements |
DE58908841D1 (de) | 1989-05-31 | 1995-02-09 | Siemens Ag | Oberflächenmontierbares Opto-Bauelement. |
DE58907120D1 (de) | 1989-06-01 | 1994-04-07 | Weidmueller Interface | Bezeichnungsträger für elektrische Leiter. |
JP2536628B2 (ja) | 1989-08-02 | 1996-09-18 | 信越化学工業株式会社 | 半導体素子保護用組成物 |
US5624602A (en) | 1989-09-25 | 1997-04-29 | Osram Sylvania Inc. | Method of improving the maintenance of a fluorescent lamp containing terbium-activated cerium magnesium aluminate phosphor |
US4935856A (en) | 1989-10-05 | 1990-06-19 | Dialight Corporation | Surface mounted LED package |
USRE34254E (en) | 1989-10-05 | 1993-05-18 | Dialight Corporation | Surface mounted LED package |
US5120214A (en) | 1989-11-13 | 1992-06-09 | Control Techtronics, Inc. | Acoustical burner control system and method |
JPH03160714A (ja) * | 1989-11-20 | 1991-07-10 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US5019746A (en) | 1989-12-04 | 1991-05-28 | Hewlett-Packard Company | Prefabricated wire leadframe for optoelectronic devices |
EP0454907A1 (en) | 1990-05-03 | 1991-11-06 | Agfa-Gevaert N.V. | Reproduction of x-ray images with photostimulable phosphor |
KR930006932B1 (ko) | 1990-05-11 | 1993-07-24 | 삼성전관 주식회사 | 녹색발광 형광체 및 그것을 사용한 브라운관 |
JP2506223B2 (ja) | 1990-06-28 | 1996-06-12 | トリニティ工業株式会社 | 自動塗装装置 |
JPH0463162A (ja) | 1990-06-29 | 1992-02-28 | Suzuki Motor Corp | 塗装装置 |
DE9013615U1 (de) * | 1990-09-28 | 1990-12-06 | AEG Niederspannungstechnik GmbH & Co KG, 24534 Neumünster | Elektrolumineszenz- oder Laserdiode |
JP2796187B2 (ja) * | 1990-10-01 | 1998-09-10 | 日東電工株式会社 | 光半導体装置 |
JP2784255B2 (ja) | 1990-10-02 | 1998-08-06 | 日亜化学工業株式会社 | 蛍光体及びそれを用いた放電ランプ |
JPH04280664A (ja) | 1990-10-18 | 1992-10-06 | Texas Instr Inc <Ti> | 半導体装置用リードフレーム |
FR2668464B1 (fr) | 1990-10-25 | 1993-01-08 | Commissariat Energie Atomique | Silicates mixtes d'yttrium et de lanthanide et laser utilisant des monocristaux de ces silicates. |
JPH04186679A (ja) | 1990-11-16 | 1992-07-03 | Daido Steel Co Ltd | 発光ダイオード |
JPH04234481A (ja) * | 1990-12-28 | 1992-08-24 | Matsushita Electron Corp | 蛍光高圧水銀灯 |
US5202777A (en) | 1991-05-31 | 1993-04-13 | Hughes Aircraft Company | Liquid crystal light value in combination with cathode ray tube containing a far-red emitting phosphor |
FR2677659B1 (fr) | 1991-06-14 | 1994-09-30 | Hoechst France | Composition fluide luminescente polymerisable et son application. |
JPH0563068A (ja) | 1991-08-30 | 1993-03-12 | Shin Etsu Handotai Co Ltd | ウエーハバスケツト |
MY110582A (en) | 1991-09-03 | 1998-08-29 | Kasei Optonix | Rare earth oxysulfide phosphor and hight resolution cathode ray tube employing it. |
JP2666228B2 (ja) * | 1991-10-30 | 1997-10-22 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子 |
JPH05152609A (ja) * | 1991-11-25 | 1993-06-18 | Nichia Chem Ind Ltd | 発光ダイオード |
US5208462A (en) | 1991-12-19 | 1993-05-04 | Allied-Signal Inc. | Wide bandwidth solid state optical source |
JPH05251717A (ja) | 1992-03-04 | 1993-09-28 | Hitachi Ltd | 半導体パッケージおよび半導体モジュール |
JPH0637202A (ja) | 1992-07-20 | 1994-02-10 | Mitsubishi Electric Corp | マイクロ波ic用パッケージ |
JPH0623195U (ja) | 1992-07-29 | 1994-03-25 | シンロイヒ株式会社 | El発光素子 |
US5602418A (en) | 1992-08-07 | 1997-02-11 | Asahi Kasei Kogyo Kabushiki Kaisha | Nitride based semiconductor device and manufacture thereof |
JPH0669546A (ja) | 1992-08-21 | 1994-03-11 | Asahi Chem Ind Co Ltd | 発光ダイオード |
JPH0677537A (ja) * | 1992-08-24 | 1994-03-18 | Asahi Chem Ind Co Ltd | 発光ダイオード |
EP0596548B1 (en) | 1992-09-23 | 1998-12-16 | Koninklijke Philips Electronics N.V. | Low-pressure mercury discharge lamp |
US5578839A (en) | 1992-11-20 | 1996-11-26 | Nichia Chemical Industries, Ltd. | Light-emitting gallium nitride-based compound semiconductor device |
US5382856A (en) | 1992-12-09 | 1995-01-17 | General Electric Co. | Generator rotor collector terminal stud hydrogen seal |
US5382452A (en) | 1992-12-18 | 1995-01-17 | E. I. Du Pont De Nemours And Company | Luminescent materials prepared by coating luminescent compositions onto substrate particles |
US5643674A (en) | 1992-12-18 | 1997-07-01 | E. I. Du Pont De Nemours And Company | Luminescent materials prepared by coating luminescent compositions onto substrate particles |
JP2894921B2 (ja) | 1993-04-30 | 1999-05-24 | シャープ株式会社 | 半導体装置およびその製造方法 |
US5379186A (en) | 1993-07-06 | 1995-01-03 | Motorola, Inc. | Encapsulated electronic component having a heat diffusing layer |
JPH0799345A (ja) * | 1993-09-28 | 1995-04-11 | Nichia Chem Ind Ltd | 発光ダイオード |
BE1007825A5 (fr) | 1993-12-15 | 1995-10-31 | Niezen Michel | Dispositif lumineux. |
JPH07176794A (ja) * | 1993-12-17 | 1995-07-14 | Nichia Chem Ind Ltd | 面状光源 |
JPH07193281A (ja) * | 1993-12-27 | 1995-07-28 | Mitsubishi Materials Corp | 指向性の少ない赤外可視変換発光ダイオード |
JP3425465B2 (ja) | 1994-03-03 | 2003-07-14 | 化成オプトニクス株式会社 | 緑色発光蛍光体及びそれを用いた陰極線管 |
US5656832A (en) | 1994-03-09 | 1997-08-12 | Kabushiki Kaisha Toshiba | Semiconductor heterojunction device with ALN buffer layer of 3nm-10nm average film thickness |
US5432358A (en) | 1994-03-24 | 1995-07-11 | Motorola, Inc. | Integrated electro-optical package |
JPH07263147A (ja) | 1994-03-24 | 1995-10-13 | Fuji Electric Co Ltd | 薄膜発光素子 |
JPH07273366A (ja) | 1994-03-28 | 1995-10-20 | Pioneer Electron Corp | Iii族窒化物発光素子の製造方法 |
JP3261853B2 (ja) * | 1994-03-29 | 2002-03-04 | 凸版印刷株式会社 | 反射型液晶表示装置 |
JP2596709B2 (ja) * | 1994-04-06 | 1997-04-02 | 都築 省吾 | 半導体レーザ素子を用いた照明用光源装置 |
NL9400766A (nl) * | 1994-05-09 | 1995-12-01 | Euratec Bv | Werkwijze voor het inkapselen van een geintegreerde halfgeleiderschakeling. |
US5665793A (en) | 1994-06-09 | 1997-09-09 | Anders; Irving | Phosphorescent highway paint composition |
JP3116727B2 (ja) | 1994-06-17 | 2000-12-11 | 日亜化学工業株式会社 | 面状光源 |
CN1071355C (zh) | 1994-06-24 | 2001-09-19 | 因奥斯-艾瑞利克斯英国有限公司 | 苯乙烯系聚合物与丙烯酸系聚合物共混物的泡沫塑料制品 |
EP0691798A3 (en) | 1994-07-05 | 1996-07-17 | Ford Motor Co | Fluorescent electroluminescent lamp |
JPH0832112A (ja) | 1994-07-20 | 1996-02-02 | Toyoda Gosei Co Ltd | 3族窒化物半導体発光素子 |
KR100291911B1 (ko) | 1994-07-26 | 2001-09-17 | 김순택 | 반도체발광소자를이용한표시소자 |
JPH0864860A (ja) * | 1994-08-17 | 1996-03-08 | Mitsubishi Materials Corp | 色純度の高い赤外可視変換青色発光ダイオード |
DE4432035A1 (de) | 1994-09-09 | 1996-03-14 | Philips Patentverwaltung | Beschichtungsverfahren für Lumineszenzpulver, Luminenzenzpulver und beschichteter Gegenstand |
US5543657A (en) | 1994-10-07 | 1996-08-06 | International Business Machines Corporation | Single layer leadframe design with groundplane capability |
JPH08119631A (ja) | 1994-10-21 | 1996-05-14 | Shin Etsu Chem Co Ltd | 球状希土類元素酸化物およびその前駆体の製造方法 |
JPH08170077A (ja) * | 1994-12-19 | 1996-07-02 | Hitachi Ltd | 蛍光体、その製造方法、発光スクリーン及びそれを用いた陰極線管 |
JP3260995B2 (ja) | 1994-12-28 | 2002-02-25 | ワイケイケイ株式会社 | 蓄光性合成樹脂材料及びその製造方法並びに成形品 |
ATE182917T1 (de) * | 1995-01-25 | 1999-08-15 | Northern Engraving Corp | Fluoreszierende tinte und fluoreszierende anzeigevorrichtung |
JPH08231681A (ja) * | 1995-02-28 | 1996-09-10 | Asahi Chem Ind Co Ltd | 接着性付与剤 |
US5670798A (en) | 1995-03-29 | 1997-09-23 | North Carolina State University | Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same |
US5685071A (en) * | 1995-06-05 | 1997-11-11 | Hughes Electronics | Method of constructing a sealed chip-on-board electronic module |
US5601751A (en) * | 1995-06-08 | 1997-02-11 | Micron Display Technology, Inc. | Manufacturing process for high-purity phosphors having utility in field emission displays |
US5798537A (en) * | 1995-08-31 | 1998-08-25 | Kabushiki Kaisha Toshiba | Blue light-emitting device |
JP3931355B2 (ja) | 1995-09-06 | 2007-06-13 | 日亜化学工業株式会社 | 面状光源 |
US6140040A (en) * | 1995-10-06 | 2000-10-31 | Advanced Minerals Corporation | Method of mechanically separating microparticles suspended in fluids using particulate media |
US5788881A (en) * | 1995-10-25 | 1998-08-04 | Micron Technology, Inc. | Visible light-emitting phosphor composition having an enhanced luminescent efficiency over a broad range of voltages |
US5635110A (en) | 1995-10-25 | 1997-06-03 | Micron Display Technology, Inc. | Specialized phosphors prepared by a multi-stage grinding and firing sequence |
JPH09125056A (ja) * | 1995-11-02 | 1997-05-13 | Hitachi Chem Co Ltd | 表面処理された蛍光体及びその製造法 |
JP3267250B2 (ja) | 1995-12-06 | 2002-03-18 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
US6117294A (en) * | 1996-01-19 | 2000-09-12 | Micron Technology, Inc. | Black matrix material and methods related thereto |
JP2927229B2 (ja) | 1996-01-23 | 1999-07-28 | ヤマハ株式会社 | メドレー演奏装置 |
DE29724381U1 (de) | 1996-03-15 | 2001-02-22 | Asahi Kogaku Kogyo K.K., Tokio/Tokyo | Datenaufbelichtungseinheit für eine Kamera |
US6600175B1 (en) * | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
DE19625622A1 (de) | 1996-06-26 | 1998-01-02 | Siemens Ag | Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
KR100643442B1 (ko) | 1996-06-26 | 2006-11-10 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | 발광 변환 소자를 포함하는 발광 반도체 소자 |
US6608332B2 (en) | 1996-07-29 | 2003-08-19 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device and display |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
JP2927279B2 (ja) * | 1996-07-29 | 1999-07-28 | 日亜化学工業株式会社 | 発光ダイオード |
JP3338616B2 (ja) * | 1996-09-05 | 2002-10-28 | 富士通株式会社 | 蛍光体層の形成方法及び蛍光体ペースト |
JPH1092549A (ja) | 1996-09-13 | 1998-04-10 | Ngk Insulators Ltd | 限流アークホーン |
US6613247B1 (en) * | 1996-09-20 | 2003-09-02 | Osram Opto Semiconductors Gmbh | Wavelength-converting casting composition and white light-emitting semiconductor component |
US5772916A (en) * | 1996-10-15 | 1998-06-30 | Liberty Technologies, Inc. | Phosphor screen, method of producing the same, and method for preparing a phosphor powder for producing a phosphor screen |
DE19645035C1 (de) * | 1996-10-31 | 1998-04-30 | Siemens Ag | Mehrfarbiges Licht abstrahlende Bildanzeigevorrichtung |
JP3522990B2 (ja) * | 1996-11-13 | 2004-04-26 | 信越化学工業株式会社 | イットリア球状微粒子の製造方法 |
WO1998037165A1 (en) * | 1997-02-24 | 1998-08-27 | Superior Micropowders Llc | Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
US5813752A (en) * | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue LED-phosphor device with short wave pass, long wave pass band pass and peroit filters |
US5813753A (en) * | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
US5847507A (en) | 1997-07-14 | 1998-12-08 | Hewlett-Packard Company | Fluorescent dye added to epoxy of light emitting diode lens |
US6501091B1 (en) * | 1998-04-01 | 2002-12-31 | Massachusetts Institute Of Technology | Quantum dot white and colored light emitting diodes |
US6085971A (en) * | 1998-07-10 | 2000-07-11 | Walter Tews | Luminescent meta-borate substances |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
JP4110236B2 (ja) | 1998-12-28 | 2008-07-02 | 富士フイルム株式会社 | Ccd撮像デバイス及びその駆動方法、並びにフイルムスキャナー |
US6295750B1 (en) * | 1999-07-06 | 2001-10-02 | Beckett Publications, Inc. | System for displaying cards |
US6455213B1 (en) * | 2000-01-04 | 2002-09-24 | Lg Electronics, Inc. | Method for manufacturing phosphor layer for image display apparatus |
US6483234B1 (en) | 2000-08-30 | 2002-11-19 | Koninklijke Philips Electronics N.V. | Single-component arctic bright calcium halophosphate phosphor |
TWI226357B (en) * | 2002-05-06 | 2005-01-11 | Osram Opto Semiconductors Gmbh | Wavelength-converting reaction-resin, its production method, light-radiating optical component and light-radiating semiconductor-body |
US6692659B2 (en) * | 2002-05-31 | 2004-02-17 | General Electric Company | Phosporescent polycarbonate, concentrate and molded articles |
US20040046938A1 (en) * | 2002-09-05 | 2004-03-11 | Gary Gero | Automatic and manual lens focusing system with visual matching for motion picture camera |
JP4234482B2 (ja) | 2003-04-10 | 2009-03-04 | 株式会社日立製作所 | 動的dns登録方法、ドメイン名解決方法、代理サーバ、及びアドレス変換装置 |
JP4175265B2 (ja) | 2004-02-04 | 2008-11-05 | トヨタ自動車株式会社 | 内燃機関の補機部品取付構造 |
JP4820539B2 (ja) | 2004-06-25 | 2011-11-24 | 京セラミタ株式会社 | スチルベン誘導体、その製造方法、および電子写真感光体 |
JP4639866B2 (ja) | 2005-03-10 | 2011-02-23 | 富士ゼロックス株式会社 | トナー補給装置 |
JP4717684B2 (ja) | 2006-03-30 | 2011-07-06 | 富士通テレコムネットワークス株式会社 | コンデンサ充電装置 |
JP4142070B2 (ja) | 2006-06-23 | 2008-08-27 | 信越ポリマー株式会社 | キャリアテープの製造方法 |
-
1996
- 1996-09-20 DE DE19638667A patent/DE19638667C2/de not_active Expired - Lifetime
-
1997
- 1997-09-22 CN CN2006100944827A patent/CN101081909B/zh not_active Expired - Lifetime
- 1997-09-22 JP JP51419098A patent/JP3364229B2/ja not_active Expired - Lifetime
- 1997-09-22 CN CNB2004100367021A patent/CN100367521C/zh not_active Expired - Lifetime
- 1997-09-22 CN CNB2004100367036A patent/CN100492682C/zh not_active Expired - Lifetime
- 1997-09-22 KR KR1020087022131A patent/KR100933586B1/ko not_active IP Right Cessation
- 1997-09-22 DE DE29724849U patent/DE29724849U1/de not_active Expired - Lifetime
- 1997-09-22 CN CN97191656.XA patent/CN1156029C/zh not_active Expired - Lifetime
- 1997-09-22 CN CNB2004100367017A patent/CN100492681C/zh not_active Expired - Lifetime
- 1997-09-22 CN CNA2006100944831A patent/CN101081910A/zh active Pending
- 1997-09-22 EP EP97909167A patent/EP0862794B1/de not_active Expired - Lifetime
- 1997-09-22 CN CNB2004100367040A patent/CN100492683C/zh not_active Expired - Lifetime
- 1997-09-22 DE DE59708820T patent/DE59708820D1/de not_active Expired - Lifetime
- 1997-09-22 EP EP02007512A patent/EP1221724B1/de not_active Revoked
- 1997-09-22 WO PCT/DE1997/002139 patent/WO1998012757A1/de not_active Application Discontinuation
- 1997-09-22 CN CNB2003101163991A patent/CN1273537C/zh not_active Expired - Lifetime
- 1997-09-22 KR KR1020067016224A patent/KR101301650B1/ko not_active IP Right Cessation
- 1997-09-22 DE DE29724284U patent/DE29724284U1/de not_active Expired - Lifetime
- 1997-09-22 KR KR1020087022130A patent/KR100908170B1/ko not_active IP Right Cessation
- 1997-09-22 KR KR1019980703765A patent/KR100816596B1/ko not_active IP Right Cessation
- 1997-09-22 KR KR1020077013838A patent/KR100908172B1/ko not_active IP Right Cessation
- 1997-09-22 DE DE59713056T patent/DE59713056D1/de not_active Expired - Lifetime
- 1997-09-22 KR KR1020077013840A patent/KR100908171B1/ko not_active IP Right Cessation
- 1997-09-22 DE DE29724382U patent/DE29724382U1/de not_active Expired - Lifetime
- 1997-09-22 KR KR1020057013736A patent/KR100808752B1/ko not_active IP Right Cessation
- 1997-09-22 KR KR1020057013737A patent/KR100875010B1/ko not_active IP Right Cessation
- 1997-09-22 BR BR9706787A patent/BR9706787A/pt not_active IP Right Cessation
-
1998
- 1998-05-20 US US09/082,205 patent/US6066861A/en not_active Expired - Lifetime
-
2000
- 2000-02-24 JP JP2000048025A patent/JP4001703B2/ja not_active Expired - Lifetime
- 2000-03-28 US US09/536,564 patent/US6277301B1/en not_active Expired - Lifetime
- 2000-08-29 US US09/650,932 patent/US6245259B1/en not_active Expired - Lifetime
- 2000-12-06 US US09/731,406 patent/US7235189B2/en not_active Expired - Fee Related
-
2001
- 2001-04-25 US US09/843,080 patent/US6592780B2/en not_active Expired - Lifetime
- 2001-12-04 JP JP2001369805A patent/JP2002208733A/ja active Pending
- 2001-12-04 JP JP2001369803A patent/JP3866092B2/ja not_active Expired - Lifetime
- 2001-12-04 JP JP2001369802A patent/JP3866091B2/ja not_active Expired - Lifetime
- 2001-12-04 JP JP2001369806A patent/JP3824917B2/ja not_active Expired - Lifetime
- 2001-12-04 JP JP2001369804A patent/JP4233252B2/ja not_active Expired - Lifetime
-
2003
- 2003-07-10 US US10/616,783 patent/US7276736B2/en not_active Expired - Fee Related
- 2003-07-21 US US10/623,819 patent/US20040016908A1/en not_active Abandoned
-
2007
- 2007-05-21 US US11/751,291 patent/US7709852B2/en not_active Expired - Fee Related
- 2007-12-20 JP JP2007328490A patent/JP2008103756A/ja active Pending
-
2008
- 2008-12-26 JP JP2008334452A patent/JP2009071336A/ja active Pending
-
2010
- 2010-03-25 US US12/731,450 patent/US8071996B2/en not_active Expired - Fee Related
-
2012
- 2012-08-27 JP JP2012186932A patent/JP2012238909A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101263420B (zh) * | 2005-01-26 | 2010-07-21 | 讯宝科技公司 | 用于投影二维、彩色图像的彩色图像投影系统 |
CN110857389A (zh) * | 2018-08-23 | 2020-03-03 | 有研稀土新材料股份有限公司 | 一种近红外荧光粉以及含该荧光粉的发光装置 |
CN110857389B (zh) * | 2018-08-23 | 2022-08-19 | 有研稀土新材料股份有限公司 | 一种近红外荧光粉以及含该荧光粉的发光装置 |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1156029C (zh) | 波长变换填料及其应用 | |
US6613247B1 (en) | Wavelength-converting casting composition and white light-emitting semiconductor component | |
CN100352885C (zh) | 波长变化的反应性树脂材料和发光二极管元件 | |
US7045956B2 (en) | Light emitting diode with wavelength conversion | |
CN1180052C (zh) | 发光二极管用波长变换白光发光材料 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: OSRAM AG Free format text: FORMER OWNER: SIEMENS AG Effective date: 20111222 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111222 Address after: Munich, Germany Patentee after: Patra Patent Treuhand Address before: Munich, Germany Patentee before: Siemens AG |
|
CX01 | Expiry of patent term |
Granted publication date: 20080206 |
|
CX01 | Expiry of patent term |