JP4922555B2 - Led装置 - Google Patents
Led装置 Download PDFInfo
- Publication number
- JP4922555B2 JP4922555B2 JP2004277764A JP2004277764A JP4922555B2 JP 4922555 B2 JP4922555 B2 JP 4922555B2 JP 2004277764 A JP2004277764 A JP 2004277764A JP 2004277764 A JP2004277764 A JP 2004277764A JP 4922555 B2 JP4922555 B2 JP 4922555B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- led chip
- light
- led device
- cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 37
- 230000003287 optical effect Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 6
- 239000003086 colorant Substances 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 10
- 238000009826 distribution Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008033 biological extinction Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000005549 size reduction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
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- 238000004080 punching Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Description
広範囲の分野に活用できる。
2 リードフレーム
3 赤色LEDチップ
4 緑色LEDチップ
5 ボンディングワイヤ
6 透光性樹脂
7 内周面
8 キャビティ
9 外壁
10 レンズ
11 カップ
Claims (4)
- リードフレームが樹脂材料によりインサート成形された反射枠と、
前記反射枠に形成されたキャビティと、
前記キャビティ内に形成された、複数のLEDチップを夫々に独立して前記LEDチップの厚みよりも高く包囲し前記LEDチップが搭載される空間形状は略円柱形状である複数のカップとを有し、
前記カップの外壁は前記反射枠と同一樹脂材料によって前記反射枠と一体に形成され、前記キャビティ内は透光性樹脂が充填されていることを特徴とするLED装置。 - 前記樹脂材料は高反射率を有する白色樹脂であることを特徴とする請求項1に記載のLED装置。
- 前記LEDチップは、光源色が互いに異なる2種類以上のLEDチップの組み合わせであることを特徴とする請求項1又は2の何れか1項に記載のLED装置。
- 前記各LEDチップの上方には該LEDチップの光軸を実質的に一致させて凸形状のレンズが形成されていることを特徴とする請求項1〜3の何れか1項に記載のLED装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004277764A JP4922555B2 (ja) | 2004-09-24 | 2004-09-24 | Led装置 |
TW094132179A TWI387122B (zh) | 2004-09-24 | 2005-09-16 | 發光二極體裝置 |
US11/229,536 US8614451B2 (en) | 2004-09-24 | 2005-09-20 | Light emitting diode device |
CNB2005101053577A CN100570908C (zh) | 2004-09-24 | 2005-09-23 | Led器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004277764A JP4922555B2 (ja) | 2004-09-24 | 2004-09-24 | Led装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006093435A JP2006093435A (ja) | 2006-04-06 |
JP4922555B2 true JP4922555B2 (ja) | 2012-04-25 |
Family
ID=36098064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004277764A Expired - Lifetime JP4922555B2 (ja) | 2004-09-24 | 2004-09-24 | Led装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8614451B2 (ja) |
JP (1) | JP4922555B2 (ja) |
CN (1) | CN100570908C (ja) |
TW (1) | TWI387122B (ja) |
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US6885033B2 (en) * | 2003-03-10 | 2005-04-26 | Cree, Inc. | Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same |
US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
KR100663906B1 (ko) * | 2005-03-14 | 2007-01-02 | 서울반도체 주식회사 | 발광 장치 |
DE102006032416A1 (de) * | 2005-09-29 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement |
JP2007136720A (ja) * | 2005-11-15 | 2007-06-07 | Fuji Xerox Co Ltd | Ledアレイヘッド及び画像記録装置 |
KR100665365B1 (ko) * | 2006-01-05 | 2007-01-09 | 삼성전기주식회사 | 발광다이오드 패키지 제조 방법 |
KR100828891B1 (ko) | 2006-02-23 | 2008-05-09 | 엘지이노텍 주식회사 | Led 패키지 |
US9780268B2 (en) | 2006-04-04 | 2017-10-03 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
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DE10041686A1 (de) * | 2000-08-24 | 2002-03-14 | Osram Opto Semiconductors Gmbh | Bauelement mit einer Vielzahl von Lumineszenzdiodenchips |
JP4045781B2 (ja) * | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | 発光装置 |
TW513820B (en) * | 2001-12-26 | 2002-12-11 | United Epitaxy Co Ltd | Light emitting diode and its manufacturing method |
TW558844B (en) * | 2002-05-15 | 2003-10-21 | Opto Tech Corp | Light emitting diode capable of increasing light emitting brightness |
JP3707688B2 (ja) * | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
TW544953B (en) * | 2002-06-03 | 2003-08-01 | Opto Tech Corp | Light emitting diode capable of increasing the light emitting efficiency |
JP2004047748A (ja) * | 2002-07-12 | 2004-02-12 | Stanley Electric Co Ltd | 発光ダイオード |
JP3790199B2 (ja) * | 2002-08-29 | 2006-06-28 | 株式会社東芝 | 光半導体装置及び光半導体モジュール |
JP2004207369A (ja) | 2002-12-24 | 2004-07-22 | Stanley Electric Co Ltd | 表面実装型白色led |
US7281818B2 (en) * | 2003-12-11 | 2007-10-16 | Dialight Corporation | Light reflector device for light emitting diode (LED) array |
US7230280B2 (en) * | 2004-05-27 | 2007-06-12 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Collimating light from an LED device |
-
2004
- 2004-09-24 JP JP2004277764A patent/JP4922555B2/ja not_active Expired - Lifetime
-
2005
- 2005-09-16 TW TW094132179A patent/TWI387122B/zh not_active IP Right Cessation
- 2005-09-20 US US11/229,536 patent/US8614451B2/en not_active Expired - Fee Related
- 2005-09-23 CN CNB2005101053577A patent/CN100570908C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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US8614451B2 (en) | 2013-12-24 |
TW200618354A (en) | 2006-06-01 |
JP2006093435A (ja) | 2006-04-06 |
US20060065957A1 (en) | 2006-03-30 |
CN1753200A (zh) | 2006-03-29 |
TWI387122B (zh) | 2013-02-21 |
CN100570908C (zh) | 2009-12-16 |
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