JP4627177B2 - Ledの製造方法 - Google Patents
Ledの製造方法 Download PDFInfo
- Publication number
- JP4627177B2 JP4627177B2 JP2004326276A JP2004326276A JP4627177B2 JP 4627177 B2 JP4627177 B2 JP 4627177B2 JP 2004326276 A JP2004326276 A JP 2004326276A JP 2004326276 A JP2004326276 A JP 2004326276A JP 4627177 B2 JP4627177 B2 JP 4627177B2
- Authority
- JP
- Japan
- Prior art keywords
- cup
- led chip
- led
- resin
- fluorescent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0055—Moulds or cores; Details thereof or accessories therefor with incorporated overflow cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/0026—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
- B29L2011/0016—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Description
2a、2b 導体パターン
3 基板
4 第一のカップ
5 底面
6 第二のカップ
7 ダイボンディングパッド
8 ワイヤボンディングパッド
9 導電性接着剤
10 LEDチップ
11 ボンディングワイヤ
12 蛍光樹脂
13 ノズル
14 レンズ
15 樹脂封止
Claims (5)
- 凹形状のカップが所定の間隔で複数個設けられ、互いに隣接する前記カップが空間連通領域を介して空間的に連通され、前記空間連通領域と前記カップとが底面により繋がっている多数個取り基板を準備する工程と、
前記カップ内にLEDチップを実装する工程と、
前記基板上の前記カップの外に設けられたワイヤボンディングパッドと前記LEDチップをボンディングワイヤを介して電気的に接続する工程と、
1個所以上の前記空間連通領域を注入口として、蛍光物質を混入させた透光性樹脂を注入して、自然流動により前記カップ及び空間連通領域に充填後、加熱硬化して前記カップ内に実装されたLEDチップを埋設させる工程と、を含むことを特徴とするLEDの製造方法。 - 前記カップ内に実装されたLEDチップを前記蛍光物質を混入させた透光性樹脂で埋設させる工程の後、
前記基板上に透光性樹脂により所定の形状に樹脂封止を行う工程を含むことを特徴とする請求項1に記載のLEDの製造方法。 - 前記空間連通領域は、該空間連通領域を前記基板に平行な面で切ったときの断面が略円形であることを特徴とする請求項1又は2の何れか1項に記載のLEDの製造方法。
- 前記樹脂封止は、前記LEDチップの放射方向に該各LEDチップの光軸を略中心とする凸形状のレンズが形成されていることを特徴とする請求項1〜3の何れか1項に記載のLEDの製造方法。
- 前記蛍光物質を混入させた透光性樹脂の注入において、液体定量吐出装置を使用することを特徴とする請求項1〜4の何れか1項に記載のLEDの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004326276A JP4627177B2 (ja) | 2004-11-10 | 2004-11-10 | Ledの製造方法 |
KR1020050100687A KR101217660B1 (ko) | 2004-11-10 | 2005-10-25 | Led의 제조방법 |
CNB2005101172311A CN100474644C (zh) | 2004-11-10 | 2005-10-31 | Led的制造方法 |
DE102005053217A DE102005053217A1 (de) | 2004-11-10 | 2005-11-08 | Verfahren zum Herstellen einer LED-Vorrichtung |
US11/269,667 US7300326B2 (en) | 2004-11-10 | 2005-11-09 | LED device and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004326276A JP4627177B2 (ja) | 2004-11-10 | 2004-11-10 | Ledの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006140197A JP2006140197A (ja) | 2006-06-01 |
JP4627177B2 true JP4627177B2 (ja) | 2011-02-09 |
Family
ID=36385557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004326276A Expired - Fee Related JP4627177B2 (ja) | 2004-11-10 | 2004-11-10 | Ledの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7300326B2 (ja) |
JP (1) | JP4627177B2 (ja) |
KR (1) | KR101217660B1 (ja) |
CN (1) | CN100474644C (ja) |
DE (1) | DE102005053217A1 (ja) |
Families Citing this family (23)
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EP1693904B1 (en) * | 2005-02-18 | 2020-03-25 | Nichia Corporation | Light emitting device provided with lens for controlling light distribution characteristic |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
US7763478B2 (en) | 2006-08-21 | 2010-07-27 | Cree, Inc. | Methods of forming semiconductor light emitting device packages by liquid injection molding |
JP5157357B2 (ja) * | 2007-10-10 | 2013-03-06 | 日亜化学工業株式会社 | 発光装置用パッケージの集合構造体およびその製造方法、ならびに発光装置の製造方法 |
JP5340583B2 (ja) * | 2007-11-26 | 2013-11-13 | スタンレー電気株式会社 | 半導体発光装置 |
KR100986211B1 (ko) | 2008-01-04 | 2010-10-07 | 주식회사 이츠웰 | 금속기판과 금속기판의 제조방법 및 그 기판을 이용한표면실장형 엘이디 패키지 |
CN101567365B (zh) * | 2008-04-24 | 2011-03-30 | 宏齐科技股份有限公司 | 具有高效率散热基板的发光芯片封装结构及其封装方法 |
CN101752468B (zh) * | 2008-12-17 | 2011-05-25 | 四川柏狮光电技术有限公司 | Led荧光粉悬浮制造工艺 |
JP5406540B2 (ja) * | 2009-01-23 | 2014-02-05 | 株式会社小糸製作所 | 光源モジュール、車輌用灯具及び光源モジュールの製造方法 |
CN101900264A (zh) * | 2010-03-11 | 2010-12-01 | 陕西科技大学 | 一种高散热型大功率led一体化封装灯具 |
JP5582048B2 (ja) | 2011-01-28 | 2014-09-03 | 日亜化学工業株式会社 | 発光装置 |
KR20120133264A (ko) * | 2011-05-31 | 2012-12-10 | 삼성전자주식회사 | 발광소자 렌즈, 이를 포함하는 발광소자 모듈 및 이를 이용한 발광소자 모듈의 제조방법 |
CN102446671B (zh) * | 2011-12-20 | 2014-08-27 | 安徽华东光电技术研究所 | 电真空器件的灌封工艺 |
CN103943768A (zh) * | 2013-01-22 | 2014-07-23 | 立诚光电股份有限公司 | 发光二极管装置及散热基板的制造方法 |
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KR102145920B1 (ko) * | 2014-06-05 | 2020-08-19 | 엘지이노텍 주식회사 | 발광소자 패키지 |
KR102285432B1 (ko) | 2014-11-18 | 2021-08-04 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 패키지 |
USD758977S1 (en) * | 2015-06-05 | 2016-06-14 | Kingbright Electronics Co. Ltd. | LED component |
USD845252S1 (en) * | 2017-02-24 | 2019-04-09 | Citizen Electronics Co., Ltd. | Switch |
USD810035S1 (en) * | 2017-03-10 | 2018-02-13 | Kingbright Electronics Co. Ltd. | LED component |
CN116031350A (zh) * | 2017-04-28 | 2023-04-28 | 日亚化学工业株式会社 | 发光装置 |
DE102018104382A1 (de) * | 2018-02-27 | 2019-08-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement und herstellungsverfahren |
CN110391326A (zh) * | 2018-04-17 | 2019-10-29 | 展晶科技(深圳)有限公司 | 侧面发光型发光二极管封装结构 |
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2004
- 2004-11-10 JP JP2004326276A patent/JP4627177B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-25 KR KR1020050100687A patent/KR101217660B1/ko active IP Right Grant
- 2005-10-31 CN CNB2005101172311A patent/CN100474644C/zh not_active Expired - Fee Related
- 2005-11-08 DE DE102005053217A patent/DE102005053217A1/de not_active Ceased
- 2005-11-09 US US11/269,667 patent/US7300326B2/en not_active Expired - Fee Related
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JPH0397277A (ja) * | 1989-08-29 | 1991-04-23 | Hewlett Packard Co <Hp> | ランプ |
JP2981370B2 (ja) * | 1993-07-16 | 1999-11-22 | シャープ株式会社 | Midチップ型発光素子 |
JPH0845972A (ja) * | 1994-05-24 | 1996-02-16 | Sharp Corp | 半導体デバイスの製造方法 |
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Also Published As
Publication number | Publication date |
---|---|
CN1773738A (zh) | 2006-05-17 |
JP2006140197A (ja) | 2006-06-01 |
CN100474644C (zh) | 2009-04-01 |
DE102005053217A1 (de) | 2006-06-14 |
US7300326B2 (en) | 2007-11-27 |
KR20060049335A (ko) | 2006-05-18 |
KR101217660B1 (ko) | 2013-01-02 |
US20060103302A1 (en) | 2006-05-18 |
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