JP4300980B2 - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
- Publication number
- JP4300980B2 JP4300980B2 JP2003374139A JP2003374139A JP4300980B2 JP 4300980 B2 JP4300980 B2 JP 4300980B2 JP 2003374139 A JP2003374139 A JP 2003374139A JP 2003374139 A JP2003374139 A JP 2003374139A JP 4300980 B2 JP4300980 B2 JP 4300980B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- resin layer
- semiconductor light
- phosphor
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Description
樹脂に蛍光体12a、拡散材や紫外線照射により硬化する硬化剤等を混入させペースト材料を製造する。
流動性を有する樹脂11に蛍光体12と拡散材13を混合する。蛍光体12の濃度は、例えば、予め定められた第1の樹脂層5aの側部の厚みと表面部の厚みとの差から計算された、蛍光体12の量の差に対応する濃度とすることができるが、実際の測定値を保存したデータベースから最適値に近似するものを選択することも可能である。
基板2を、凹部20の開口部3が上方に向くように配置して、凹部20内の底面6上に半導体発光装置4をダイボンディングし、ワイヤ17を用いて、半導体発光装置4の電極と、表面7の電極15を導通接続する。
基板2を、凹部20の開口部3が上方に向くように配置し、凹部20内に上方から液状充填剤を滴下する。液状充填剤の量は、表面が基板2の表面7と同じレベルになる量に設定している。半導体発光装置4の第1の樹脂層の表面が凹部20から突出する場合には、第1の樹脂層の表面には液状充填剤は塗布されず、基板2の表面7より底面6側に配置される場合には、第1の樹脂層の表面にも液状充填剤が塗布される。いずれの場合でも、第1の樹脂層の側面には必ず液状充填剤が塗布されることになる。
基板2を、加熱用ラック(図示せず)のスロットに挿入して多段に配置し、恒温槽に入れて所定時間加熱し、第2の樹脂層5bを硬化させる。
基板2を成形用金型にセットし、エポキシ樹脂等の透光性樹脂により、レンズ14、脚部18および保護部19を成形する。
2 基板
3 開口部
4 半導体発光装置
5a 第1の樹脂層
5b 第2の樹脂層
6 底面
7 表面
8 電極
9 サブマウント素子
10 半導体発光素子
11 樹脂
12,12a 蛍光体
13 拡散材
14 レンズ
15 電極
16 電極
17 ワイヤ
18 脚部
19 保護部
20 凹部
Claims (2)
- サブマウント素子上に半導体発光素子を搭載し、この半導体発光素子を蛍光体を含んだ第1の樹脂層で覆って形成した半導体発光装置と、この半導体発光装置を、凹部内の底面に搭載した基材とを備えた発光ダイオードにおいて、
前記凹部内の前記第1の樹脂層は、サブマウント素子上に形成され、前記第1の樹脂層の表面を除く側面は、発光素子の表面側に出射される光と同様の色度となるように調整するための蛍光体を含む第2の樹脂層で覆われていることを特徴とする発光ダイオード。 - 前記基材、前記第1の樹脂層および第2の樹脂層の表面には、透光性樹脂からなるレンズが形成されていることを特徴とする請求項1に記載の発光ダイオード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003374139A JP4300980B2 (ja) | 2003-11-04 | 2003-11-04 | 発光ダイオード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003374139A JP4300980B2 (ja) | 2003-11-04 | 2003-11-04 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005142194A JP2005142194A (ja) | 2005-06-02 |
JP4300980B2 true JP4300980B2 (ja) | 2009-07-22 |
Family
ID=34685947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003374139A Expired - Fee Related JP4300980B2 (ja) | 2003-11-04 | 2003-11-04 | 発光ダイオード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4300980B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9598557B2 (en) | 2011-10-21 | 2017-03-21 | Rohm And Haas Company | Stable aqueous hybrid binder |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100600404B1 (ko) | 2005-06-22 | 2006-07-18 | 엘지전자 주식회사 | 측면형 발광 다이오드 패키지 및 그 제조방법 |
JP2007095807A (ja) | 2005-09-27 | 2007-04-12 | Sanyo Electric Co Ltd | 発光装置及びその製造方法 |
-
2003
- 2003-11-04 JP JP2003374139A patent/JP4300980B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9598557B2 (en) | 2011-10-21 | 2017-03-21 | Rohm And Haas Company | Stable aqueous hybrid binder |
Also Published As
Publication number | Publication date |
---|---|
JP2005142194A (ja) | 2005-06-02 |
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