JP4538739B2 - α型サイアロン蛍光体とそれを用いた照明器具 - Google Patents
α型サイアロン蛍光体とそれを用いた照明器具 Download PDFInfo
- Publication number
- JP4538739B2 JP4538739B2 JP2005146917A JP2005146917A JP4538739B2 JP 4538739 B2 JP4538739 B2 JP 4538739B2 JP 2005146917 A JP2005146917 A JP 2005146917A JP 2005146917 A JP2005146917 A JP 2005146917A JP 4538739 B2 JP4538739 B2 JP 4538739B2
- Authority
- JP
- Japan
- Prior art keywords
- phosphor
- light
- wavelength
- sialon
- primary particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 57
- 239000011164 primary particle Substances 0.000 claims description 33
- 239000000843 powder Substances 0.000 claims description 25
- 230000005284 excitation Effects 0.000 claims description 17
- 229910052731 fluorine Inorganic materials 0.000 claims description 14
- 239000011737 fluorine Substances 0.000 claims description 14
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 12
- 229910052796 boron Inorganic materials 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 20
- 239000002245 particle Substances 0.000 description 18
- 239000002994 raw material Substances 0.000 description 16
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 13
- 229910052581 Si3N4 Inorganic materials 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 11
- 239000013078 crystal Substances 0.000 description 10
- 239000011575 calcium Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000011163 secondary particle Substances 0.000 description 8
- 239000006104 solid solution Substances 0.000 description 8
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000011812 mixed powder Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229910052791 calcium Inorganic materials 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 229910052582 BN Inorganic materials 0.000 description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 5
- -1 magnesium magnesium nitride Chemical class 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 229910052761 rare earth metal Inorganic materials 0.000 description 5
- 238000009877 rendering Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- 229910018509 Al—N Inorganic materials 0.000 description 3
- 229910018516 Al—O Inorganic materials 0.000 description 3
- 229910052693 Europium Inorganic materials 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 3
- 229910001634 calcium fluoride Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000000295 emission spectrum Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910007991 Si-N Inorganic materials 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 229910006294 Si—N Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910001940 europium oxide Inorganic materials 0.000 description 2
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 150000002222 fluorine compounds Chemical class 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 238000003991 Rietveld refinement Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910002795 Si–Al–O–N Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000012611 container material Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- UVQJRJGTRAHFPN-UHFFFAOYSA-N europium fluoro hypofluorite Chemical compound O(F)F.[Eu] UVQJRJGTRAHFPN-UHFFFAOYSA-N 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000002189 fluorescence spectrum Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011158 quantitative evaluation Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- LGERWORIZMAZTA-UHFFFAOYSA-N silicon zinc Chemical compound [Si].[Zn] LGERWORIZMAZTA-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
2. 蛍光体
3. ワイヤーボンド
4. 樹脂層
5. 容器
6、7. 導電性端子
Claims (4)
- 一般式:CaXEuY (Si,Al) 12 (O,N) 16 (但し、0.3<X+Y<1.5、0<Y<0.7)で示されるα型サイアロンからなる粉末状蛍光体であって、当該粉末を構成する一次粒子の平均アスペクト比が3以下であり、しかも前記一次粒子の80%(個数百分率)以上が直径3〜10μmであり、かつフッ素を5〜300ppm及びホウ素を10〜3000ppm含有することを特徴とする、蛍光体。
- 前記一般式中のXとYとが、0.01<Y/(X+Y)<0.3であり、100〜500nmの波長を持つ紫外線又は可視光を励起源として照射することにより550〜600nmの範囲の波長域にピークを持つ発光特性を示すことを特徴とする、請求項1記載の蛍光体。
- 発光光源と蛍光体から構成される照明器具において、少なくとも請求項1又は2記載の蛍光体を用いることを特徴とする、照明器具。
- 発光光源と蛍光体から構成される照明器具において、100〜500nmの波長を持つ紫外線又は可視光を励起源として照射することにより500〜550nmの範囲の波長にピークを持つ発光特性を有する蛍光体と、請求項2記載の蛍光体とを用いることを特徴とする、照明器具。
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005146917A JP4538739B2 (ja) | 2005-05-19 | 2005-05-19 | α型サイアロン蛍光体とそれを用いた照明器具 |
CN2011104607734A CN102585810A (zh) | 2005-02-28 | 2006-02-28 | 荧光体及其制造方法及使用了该荧光体的发光元件 |
CN2009102083385A CN101982891A (zh) | 2005-02-28 | 2006-02-28 | 荧光体及其制造方法及使用了该荧光体的发光元件 |
CN2009102083402A CN101712869B (zh) | 2005-02-28 | 2006-02-28 | 荧光体及其制造方法及使用了该荧光体的发光元件 |
CN200910208341A CN101712870A (zh) | 2005-02-28 | 2006-02-28 | 荧光体及其制造方法及使用了该荧光体的发光元件 |
CN200910208339A CN101712868A (zh) | 2005-02-28 | 2006-02-28 | 荧光体及其制造方法及使用了该荧光体的发光元件 |
EP06714867A EP1854864B1 (en) | 2005-02-28 | 2006-02-28 | Fluorescent substance and process for producing the same, and luminescent element using the same |
CN2006800062270A CN101128564B (zh) | 2005-02-28 | 2006-02-28 | 荧光体及其制造方法及使用了该荧光体的发光元件 |
US11/817,261 US8125139B2 (en) | 2005-02-28 | 2006-02-28 | Fluorescent substance and process for producing the same, and luminescent element using the same |
PCT/JP2006/303730 WO2006093135A1 (ja) | 2005-02-28 | 2006-02-28 | 蛍光体とその製造方法、及びそれを用いた発光素子 |
KR1020077017685A KR101115855B1 (ko) | 2005-02-28 | 2006-02-28 | 형광체와 그 제조 방법, 및 그것을 사용한 발광 소자 |
TW095106840A TWI411660B (zh) | 2005-02-28 | 2006-03-01 | A phosphor and a method for manufacturing the same, and a light-emitting element using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005146917A JP4538739B2 (ja) | 2005-05-19 | 2005-05-19 | α型サイアロン蛍光体とそれを用いた照明器具 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009261348A Division JP2010116564A (ja) | 2009-11-16 | 2009-11-16 | α型サイアロン蛍光体とそれを用いた照明器具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006321921A JP2006321921A (ja) | 2006-11-30 |
JP4538739B2 true JP4538739B2 (ja) | 2010-09-08 |
Family
ID=37541827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005146917A Active JP4538739B2 (ja) | 2005-02-28 | 2005-05-19 | α型サイアロン蛍光体とそれを用いた照明器具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4538739B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101109988B1 (ko) * | 2007-05-22 | 2012-03-14 | 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 | 형광체 및 그의 제조방법, 및 그것을 사용한 발광장치 |
JP5578597B2 (ja) | 2007-09-03 | 2014-08-27 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
JP5316414B2 (ja) * | 2007-10-10 | 2013-10-16 | 宇部興産株式会社 | β−サイアロン蛍光体粒子の製造方法 |
EP2314659B1 (en) | 2008-08-13 | 2014-07-23 | Ube Industries, Ltd. | Li-containing -sialon fluorescent substance and method for manufacturing same, illumination device, and image display device |
JP5641384B2 (ja) * | 2008-11-28 | 2014-12-17 | 独立行政法人物質・材料研究機構 | 表示装置用照明装置及び表示装置 |
EP2383324A4 (en) * | 2009-01-27 | 2012-08-15 | Denki Kagaku Kogyo Kk | SIALONPHOSPHOR, METHOD FOR ITS MANUFACTURE AND LIGHT-EMITTING DEVICE |
WO2011078239A1 (ja) * | 2009-12-22 | 2011-06-30 | 三菱化学株式会社 | 半導体発光装置用樹脂成形体用材料 |
SG191944A1 (en) * | 2011-01-14 | 2013-08-30 | Lightscape Materials Inc | Carbonitride and carbidonitride phosphors and lighting devices using the same |
DE102013100429B4 (de) | 2013-01-16 | 2023-12-07 | Osram Gmbh | Verfahren zur Herstellung eines pulverförmigen Precursormaterials und Verwendung eines mit dem Verfahren hergestellten pulverförmigen Precursormaterials |
JP6288343B2 (ja) * | 2013-04-26 | 2018-03-07 | 日亜化学工業株式会社 | 蛍光体及びそれを用いた発光装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002249769A (ja) * | 1996-09-20 | 2002-09-06 | Siemens Ag | 波長変換注型材料及びその製造方法並びに発光素子 |
JP2003124527A (ja) * | 2001-07-16 | 2003-04-25 | Patent Treuhand Ges Elektr Gluehlamp Mbh | 光源として少なくとも1つのledを備えた照明ユニット |
JP2003321675A (ja) * | 2002-04-26 | 2003-11-14 | Nichia Chem Ind Ltd | 窒化物蛍光体及びその製造方法 |
JP2004067837A (ja) * | 2002-08-06 | 2004-03-04 | Toyota Central Res & Dev Lab Inc | α−サイアロン蛍光体 |
WO2004097949A1 (en) * | 2003-04-25 | 2004-11-11 | Luxpia Co. Ltd. | White semiconductor light emitting device |
JP2005036038A (ja) * | 2003-07-16 | 2005-02-10 | Ube Ind Ltd | サイアロン系蛍光体およびその製造方法 |
-
2005
- 2005-05-19 JP JP2005146917A patent/JP4538739B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002249769A (ja) * | 1996-09-20 | 2002-09-06 | Siemens Ag | 波長変換注型材料及びその製造方法並びに発光素子 |
JP2003124527A (ja) * | 2001-07-16 | 2003-04-25 | Patent Treuhand Ges Elektr Gluehlamp Mbh | 光源として少なくとも1つのledを備えた照明ユニット |
JP2003321675A (ja) * | 2002-04-26 | 2003-11-14 | Nichia Chem Ind Ltd | 窒化物蛍光体及びその製造方法 |
JP2004067837A (ja) * | 2002-08-06 | 2004-03-04 | Toyota Central Res & Dev Lab Inc | α−サイアロン蛍光体 |
WO2004097949A1 (en) * | 2003-04-25 | 2004-11-11 | Luxpia Co. Ltd. | White semiconductor light emitting device |
JP2005036038A (ja) * | 2003-07-16 | 2005-02-10 | Ube Ind Ltd | サイアロン系蛍光体およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006321921A (ja) | 2006-11-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4538739B2 (ja) | α型サイアロン蛍光体とそれを用いた照明器具 | |
JP5122765B2 (ja) | 蛍光体の製造方法、蛍光体と照明器具 | |
TWI299055B (ja) | ||
TWI411660B (zh) | A phosphor and a method for manufacturing the same, and a light-emitting element using the same | |
JP4565141B2 (ja) | 蛍光体と発光器具 | |
JP5229878B2 (ja) | 蛍光体を用いた発光器具 | |
JP3837588B2 (ja) | 蛍光体と蛍光体を用いた発光器具 | |
JP5025474B2 (ja) | β型サイアロン蛍光体 | |
JP5234781B2 (ja) | 蛍光体とその製造方法および発光器具 | |
TWI357927B (en) | Fluorescent substance and manufacturing method the | |
JP5124101B2 (ja) | α型サイアロン蛍光体及びその製造方法、並びに照明器具 | |
JP5835469B2 (ja) | 酸窒化物蛍光体粉末 | |
JP4494306B2 (ja) | α型サイアロン粉末の製造方法 | |
JP2009096882A (ja) | 蛍光体とその製造方法 | |
JP5854051B2 (ja) | 酸窒化物蛍光体粉末及びその製造方法 | |
JPWO2016186057A1 (ja) | 蛍光体、その製造方法、照明器具および画像表示装置 | |
JP2007262417A (ja) | 蛍光体 | |
TWI808946B (zh) | 螢光體、發光裝置、照明裝置及影像顯示裝置 | |
JP3975451B2 (ja) | 蛍光体を用いた照明器具および画像表示装置 | |
JP2016216711A (ja) | 蛍光体、その製造方法、照明器具および画像表示装置 | |
JP4364189B2 (ja) | α型サイアロン、α型サイアロンからなる蛍光体とそれを用いた照明器具 | |
JP2007308593A (ja) | サイアロン蛍光体の製造方法、サイアロン蛍光体、照明器具 | |
JP5170640B2 (ja) | 蛍光体とその製造方法および発光器具 | |
JP2010116564A (ja) | α型サイアロン蛍光体とそれを用いた照明器具 | |
Woo et al. | An investigation on Eu3+ doped CaLa2ZnO5 novel red emitting phosphors for white light-emitting diodes |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071015 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090526 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090722 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090818 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091116 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20091116 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20091117 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20091214 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100413 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100510 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100601 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100609 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4538739 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130702 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |