JP2004274087A - 半導体発光装置 - Google Patents
半導体発光装置 Download PDFInfo
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- JP2004274087A JP2004274087A JP2004182718A JP2004182718A JP2004274087A JP 2004274087 A JP2004274087 A JP 2004274087A JP 2004182718 A JP2004182718 A JP 2004182718A JP 2004182718 A JP2004182718 A JP 2004182718A JP 2004274087 A JP2004274087 A JP 2004274087A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
【解決手段】半導体発光素子(1)を被覆すると共に一方の端部から一対の配線導体(2、3)の他方の端部が導出された樹脂本体(6a)と、樹脂本体(6a)の他方の端部に一体に形成され且つ半導体発光素子(1)からの光を外部に放出する発光部(6b)とを半導体発光装置の樹脂封止体(6)に設ける。樹脂封止体(6)のうち発光部(6b)に蛍光体(7a)が選択的に混入され、半導体発光素子(1)の周囲に存在する蛍光体(7a)の分布が少ない。蛍光体(7a)は、半導体発光素子(1)から照射される光を吸収して他の異なる発光波長の光を放出する。半導体発光素子(1)より外側で樹脂封止体(6)の発光部(6b)側に蛍光体(7a)が樹脂封止体(6)内に配合されるため、蛍光体(7a)の総量を減少し、しかも樹脂封止体(6)の先端部に集中して蛍光体(7a)が分布し、半導体発光素子(1)が発熱しても蛍光体(7a)の温度上昇を招かない。
【選択図】図1
Description
また、本発明は、半導体発光素子の発熱による蛍光体の温度消光の恐れがない半導体発光装置を提供することを目的とする。
本発明は、半導体発光素子及びボンディングワイヤの損傷、断線、短絡又は変形を発生しない半導体発光装置を提供することを目的とする。
本発明は、蛍光体による発光波長変換機能を有しつつも信頼性が高く高効率で安価な半導体発光装置を提供することを目的とする。
1 使用する蛍光体の総量を減少することができる。
2 発光ダイオードチップの発熱による蛍光体の温度消光の恐れがない。
3 樹脂充填機のシリンジで発光ダイオードチップ及びボンディングワイヤを損傷し又は断線・短絡・変形の危険がない。
4 蛍光体による発光波長変換機能を有しつつも信頼性が高く高効率で安価な半導体発光装置を得ることができる。
Claims (2)
- 一対の配線導体と、該一対の配線導体の一方の端部に載置された半導体発光素子と、該半導体発光素子の一方の主面に形成された電極と前記一対の配線導体の少なくとも一方との間を電気的に接続するボンディングワイヤと、前記半導体発光素子、ボンディングワイヤ及び配線導体の一方の端部を被覆する光透過性の樹脂封止体とを備え、前記樹脂封止体は前記半導体発光素子を被覆すると共に一方の端部から前記一対の配線導体の他方の端部が導出された樹脂本体と、該樹脂本体の他方の端部に一体に形成され且つ前記半導体発光素子からの光を外部に放出する発光部とを備えた半導体発光装置において、
前記半導体発光素子から照射される光を吸収して他の異なる発光波長の光を放出する蛍光体が前記樹脂封止体内に混入され、
前記樹脂封止体のうち前記発光部に前記蛍光体が集中して混入されるが、前記半導体発光素子の周囲には前記蛍光体が少ない状態で前記樹脂封止体内に前記蛍光体が分布されることを特徴とする半導体発光装置。 - 前記樹脂封止体の樹脂本体は円筒状に形成され、前記発光部は半球状に形成された請求項1に記載の半導体発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004182718A JP2004274087A (ja) | 2004-06-21 | 2004-06-21 | 半導体発光装置 |
Applications Claiming Priority (1)
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JP2004182718A JP2004274087A (ja) | 2004-06-21 | 2004-06-21 | 半導体発光装置 |
Related Parent Applications (1)
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JP21103398A Division JP3584163B2 (ja) | 1998-07-27 | 1998-07-27 | 半導体発光装置の製造方法 |
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JP2004274087A true JP2004274087A (ja) | 2004-09-30 |
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JP2004182718A Pending JP2004274087A (ja) | 2004-06-21 | 2004-06-21 | 半導体発光装置 |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006121555A (ja) * | 2004-10-25 | 2006-05-11 | Ricoh Co Ltd | 照明装置、画像読取装置及び画像形成装置 |
JP2006128701A (ja) * | 2004-10-29 | 2006-05-18 | Ledengin Inc | ユニバーサル結合パッド及び接続構造を備えた高出力ledパッケージ |
JP2007095778A (ja) * | 2005-09-27 | 2007-04-12 | Sony Chemical & Information Device Corp | 機能素子パッケージ及びその製造方法 |
JP2007294956A (ja) * | 2006-04-26 | 2007-11-08 | Rohm & Haas Co | 改良された光抽出効率を有する発光装置およびその製造方法 |
JP2009158637A (ja) * | 2007-12-26 | 2009-07-16 | Kyocera Corp | 発光装置 |
US8246216B2 (en) | 2008-10-14 | 2012-08-21 | Ledengin, Inc. | Total internal reflection lens with pedestals for LED emitter |
US8324641B2 (en) | 2007-06-29 | 2012-12-04 | Ledengin, Inc. | Matrix material including an embedded dispersion of beads for a light-emitting device |
US8507300B2 (en) | 2008-12-24 | 2013-08-13 | Ledengin, Inc. | Light-emitting diode with light-conversion layer |
US8816369B2 (en) | 2004-10-29 | 2014-08-26 | Led Engin, Inc. | LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices |
US9897284B2 (en) | 2012-03-28 | 2018-02-20 | Ledengin, Inc. | LED-based MR16 replacement lamp |
US9929326B2 (en) | 2004-10-29 | 2018-03-27 | Ledengin, Inc. | LED package having mushroom-shaped lens with volume diffuser |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4915860U (ja) * | 1972-05-12 | 1974-02-09 | ||
JPS55112870U (ja) * | 1979-02-01 | 1980-08-08 | ||
JPS5737889A (en) * | 1980-08-18 | 1982-03-02 | Stanley Electric Co Ltd | Production of light emitting diode |
WO1998012757A1 (de) * | 1996-09-20 | 1998-03-26 | Siemens Aktiengesellschaft | Wellenlängenkonvertierende vergussmasse, deren verwendung und verfahren zu deren herstellung |
JP3048368U (ja) * | 1997-10-27 | 1998-05-06 | 興 陳 | 発光ダイオード |
JPH1187778A (ja) * | 1997-09-02 | 1999-03-30 | Toshiba Corp | 半導体発光素子、半導体発光装置およびその製造方法 |
JP2000211033A (ja) * | 1999-01-26 | 2000-08-02 | Ntt Data Cmet Kk | 光造形法 |
-
2004
- 2004-06-21 JP JP2004182718A patent/JP2004274087A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4915860U (ja) * | 1972-05-12 | 1974-02-09 | ||
JPS55112870U (ja) * | 1979-02-01 | 1980-08-08 | ||
JPS5737889A (en) * | 1980-08-18 | 1982-03-02 | Stanley Electric Co Ltd | Production of light emitting diode |
WO1998012757A1 (de) * | 1996-09-20 | 1998-03-26 | Siemens Aktiengesellschaft | Wellenlängenkonvertierende vergussmasse, deren verwendung und verfahren zu deren herstellung |
JPH1187778A (ja) * | 1997-09-02 | 1999-03-30 | Toshiba Corp | 半導体発光素子、半導体発光装置およびその製造方法 |
JP3048368U (ja) * | 1997-10-27 | 1998-05-06 | 興 陳 | 発光ダイオード |
JP2000211033A (ja) * | 1999-01-26 | 2000-08-02 | Ntt Data Cmet Kk | 光造形法 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006121555A (ja) * | 2004-10-25 | 2006-05-11 | Ricoh Co Ltd | 照明装置、画像読取装置及び画像形成装置 |
US8816369B2 (en) | 2004-10-29 | 2014-08-26 | Led Engin, Inc. | LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices |
JP2006128701A (ja) * | 2004-10-29 | 2006-05-18 | Ledengin Inc | ユニバーサル結合パッド及び接続構造を備えた高出力ledパッケージ |
US9929326B2 (en) | 2004-10-29 | 2018-03-27 | Ledengin, Inc. | LED package having mushroom-shaped lens with volume diffuser |
US9842973B2 (en) | 2004-10-29 | 2017-12-12 | Ledengin, Inc. | Method of manufacturing ceramic LED packages with higher heat dissipation |
US9653663B2 (en) | 2004-10-29 | 2017-05-16 | Ledengin, Inc. | Ceramic LED package |
JP2007095778A (ja) * | 2005-09-27 | 2007-04-12 | Sony Chemical & Information Device Corp | 機能素子パッケージ及びその製造方法 |
JP2007294956A (ja) * | 2006-04-26 | 2007-11-08 | Rohm & Haas Co | 改良された光抽出効率を有する発光装置およびその製造方法 |
US8324641B2 (en) | 2007-06-29 | 2012-12-04 | Ledengin, Inc. | Matrix material including an embedded dispersion of beads for a light-emitting device |
JP2009158637A (ja) * | 2007-12-26 | 2009-07-16 | Kyocera Corp | 発光装置 |
US8430537B2 (en) | 2008-10-14 | 2013-04-30 | Ledengin, Inc. | Total internal reflection lens for color mixing |
US8246216B2 (en) | 2008-10-14 | 2012-08-21 | Ledengin, Inc. | Total internal reflection lens with pedestals for LED emitter |
US8507300B2 (en) | 2008-12-24 | 2013-08-13 | Ledengin, Inc. | Light-emitting diode with light-conversion layer |
US9897284B2 (en) | 2012-03-28 | 2018-02-20 | Ledengin, Inc. | LED-based MR16 replacement lamp |
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