CN100401536C - 白光发光二极管的制造方法 - Google Patents

白光发光二极管的制造方法 Download PDF

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CN100401536C
CN100401536C CNB2004100410106A CN200410041010A CN100401536C CN 100401536 C CN100401536 C CN 100401536C CN B2004100410106 A CNB2004100410106 A CN B2004100410106A CN 200410041010 A CN200410041010 A CN 200410041010A CN 100401536 C CN100401536 C CN 100401536C
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CN1710724A (zh
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郭玉国
胡建宏
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Jiangsu Wenrun Optoelectronic Co Ltd
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Abstract

本发明公开了一种白色发光二极管的制造方法，包括利用氮化物发光二极管芯片作为激发光源，装架后焊接金丝，再将环氧树脂涂覆并固化在芯片和金丝上，形成球冠形，将环氧树脂和与芯片发射光匹配成白光的荧光粉的混和物涂覆并固化在球冠形环氧树脂上，形成一荧光层，最后用透明树脂进行常规的封装成光罩，所述荧光层的混和物是由透明环氧树脂、荧光粉和扩散粉组成，透明环氧树脂、荧光粉和扩散粉的重量配比为：0.5～1.2∶0.02～0.1∶0.01～0.03，本发明由于增加了影响光形和光斑的扩散粉，可使白光的纯度得到加强，同时通过调节混和物的配比，可以调节白光的色温。

Description

白光发光二极管的制造方法
技术领域
本发明涉及一种发光二极管的制造方法，尤其涉及制造白色发光二极管的方法。
背景技术
已公开的专利，专利号为：02100345.9申请日：2002年01月11日，发明名称是：“高亮度氮化物白光发光二极管及其制备方法”，该专利公开了一种白光发光二极管的制备方法，利用氮化物发光二极管芯片作为激发光源，装架后焊接金丝，再将透明树脂涂覆并固化在芯片和金丝上，形成球冠形，将透明树脂和与芯片发射光匹配成白光的荧光粉的混和物涂覆并固化在球冠形透明树脂上，最后用透明树脂进行常规的封装即成。这种白光二极管的制备方法，对白光的均匀性和亮度有一定的改善，但其存在的缺陷是：该方法制造的白光二极管中，荧光粉与透明树脂的混和物的性质决定了该白光二极管所发出的白光在使用一定的时间后，就会产生偏色现象，且无法根据需要调节白光的各种色温。
发明内容
本发明为克服现有技术的不足，提供了一种无偏色、可调色温的白光发光二极管的制造方法。
本发明采用的技术方案是：包括利用氮化物发光二极管芯片作为激发光源，装架后焊接金丝，再将环氧树脂涂覆并固化在芯片和金丝上，形成球冠形，将环氧树脂和与芯片发射光匹配成白光的荧光粉的混和物涂覆并固化在球冠形环氧树脂上，形成一荧光层，最后用透明树脂进行常规的封装成光罩：所述荧光层的混和物是由透明环氧树脂、荧光粉和扩散粉组成；
所述透明环氧树脂、荧光粉和扩散粉的重量配比为：0.5~1.2∶0.02~0.1∶0.01~0.03。
本发明采用上述方案后，由于增加了影响光形和光斑的扩散粉，可使白光的纯度得到加强，同时通过调节混和物的配比，可以调节白光的色温。
下面结合附图和实施例对本发明作进一步详细说明：
附图说明
图1是本发明的结构示意图。
实施例1
如图1，利用氮化物蓝光二极管芯片1作为激发光源，装架后焊接金丝2，与引线5连接，再将粘度较高的环氧树脂3涂覆并固化在芯片1和金丝2上，形成球冠形。将透明环氧树脂、荧光粉和扩散粉的重量配比为：0.5∶0.02∶0.01进行混和，将混和物涂覆并固化在球冠形环氧树脂3上，形成一荧光层4。环氧树脂采用高粘度的透明环氧树脂，荧光粉采用抗衰减大于5万小时的荧光粉，扩散粉的透光性应大于95％，折射率为2.5。在常规的固化处理时，固化的温度为130℃，固化的时间是半小时。最后用透明树脂进行常规的封装成光罩6。
实施例2
如图1，利用氮化物蓝光二极管芯片1作为激发光源，装架后焊接金丝2，与引线5连接，再将粘度较高的环氧树脂3涂覆并固化在芯片1和金丝2上，形成球冠形。将透明环氧树脂、荧光粉和扩散粉的重量配比为：0.9∶0.06∶0.02进行混和，将混和物涂覆并固化在球冠形环氧树脂3上，形成一荧光层4。环氧树脂采用高粘度的透明环氧树脂，荧光粉采用抗衰减大于5万小时的荧光粉，扩散粉的透光性应大于95％，折射率为2.5。在常规的固化处理时，固化的温度为130℃，固化的时间是半小时。最后用透明树脂进行常规的封装成光罩6。
实施例3
如图1，利用氮化物蓝光二极管芯片1作为激发光源，装架后焊接金丝2，与引线5连接，再将粘度较高的环氧树脂3涂覆并固化在芯片1和金丝2上，形成球冠形。将透明环氧树脂、荧光粉和扩散粉的重量配比为：1.1∶0.1∶0.03。进行混和，将混和物涂覆并固化在球冠形环氧树脂3上，形成一荧光层4。环氧树脂采用高粘度的透明环氧树脂，荧光粉采用抗衰减大于5万小时的荧光粉，扩散粉的透光性应大于95％，折射率为2.5。在常规的固化处理时，固化的温度为130℃，固化的时间是半小时。最后用透明树脂进行常规的封装成光罩6。

Claims (1)

1.一种白光发光二极管的制造方法，包括利用氮化物发光二极管芯片(1)作为激发光源，装架后焊接金丝(2)，再将环氧树脂(3)涂覆并固化在芯片(1)和金丝(2)上，形成球冠形，将环氧树脂(3)和与芯片(1)发射光匹配成白光的荧光粉的混和物涂覆并固化在球冠形环氧树脂(3)上，形成一荧光层(4)，最后用透明树脂进行常规的封装成光罩(6)，荧光层(4)的混和物是由透明环氧树脂、荧光粉和扩散粉组成，其特征是：所述透明环氧树脂、荧光粉和扩散粉的重量配比为：0.5～1.2∶0.02～0.1∶0.01～0.03；所述固化的温度为130℃，固化的时间是半小时。
CNB2004100410106A 2004-06-18 2004-06-18 白光发光二极管的制造方法 Active CN100401536C (zh)

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CN1992357A (zh) * 2005-12-30 2007-07-04 深圳市蓝科电子有限公司 一种低衰减白光二极管制造方法
CN100411210C (zh) * 2006-03-03 2008-08-13 中山大学 一种白光led的封装方法
CN100497476C (zh) * 2006-07-12 2009-06-10 李学霖 白光led用有机荧光树脂
US7842960B2 (en) * 2006-09-06 2010-11-30 Lumination Llc Light emitting packages and methods of making same
CN101320775B (zh) * 2008-07-21 2012-05-23 晶能光电（江西）有限公司 Led封装过程中的固化方法
CN101684933B (zh) * 2008-09-28 2013-08-28 红蝶科技(深圳)有限公司 一种白光发光二极管封装结构及其封装方法
CN101740679B (zh) * 2008-11-17 2012-06-06 国立中央大学 发光二极管的荧光粉封装方法
CN102270732B (zh) * 2010-06-03 2015-06-10 展晶科技(深圳)有限公司 荧光层结构及其形成方法以及发光二极管封装结构
CN101937964A (zh) * 2010-08-24 2011-01-05 深圳市洲明科技股份有限公司 Led封装结构及封装方法
CN102800795A (zh) * 2012-08-17 2012-11-28 南通脉锐光电科技有限公司 基于荧光树脂的白光led发光装置
CN103913799A (zh) * 2014-04-09 2014-07-09 常州巨猫电子科技有限公司 一种led导光柱及其应用
CN104017526B (zh) * 2014-05-29 2016-04-27 绍兴光彩显示技术有限公司 一种白光贴片数码管荧光粉点胶胶水及其使用方法
WO2019091107A1 (zh) 2017-11-07 2019-05-16 青岛海信电器股份有限公司 量子点led及其制备方法以及显示装置
CN108110120B (zh) * 2017-12-08 2020-05-12 海信视像科技股份有限公司 量子点led以及显示装置

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