JP5383611B2 - Ledパッケージ - Google Patents
Ledパッケージ Download PDFInfo
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- JP5383611B2 JP5383611B2 JP2010186505A JP2010186505A JP5383611B2 JP 5383611 B2 JP5383611 B2 JP 5383611B2 JP 2010186505 A JP2010186505 A JP 2010186505A JP 2010186505 A JP2010186505 A JP 2010186505A JP 5383611 B2 JP5383611 B2 JP 5383611B2
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- lead frame
- resin body
- led package
- led
- lead
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Description
先ず、本発明の第1の実施形態について説明する。
図1は、本実施形態に係るLEDパッケージを例示する斜視図であり、
図2(a)は、本実施形態に係るLEDパッケージを例示する断面図であり、(b)は、リードフレームを例示する平面図である。
本実施形態に係るLEDパッケージは、InGaAlP層を含むLEDチップを、エポキシ樹脂、アクリル樹脂又はウレタン樹脂からなる透明樹脂体によって封止したパッケージである。
図3は、本実施形態に係るLEDパッケージの製造方法を例示するフローチャート図であり、
図4(a)〜(d)、図5(a)〜(c)、図6(a)及び(b)は、本実施形態に係るLEDパッケージの製造方法を例示する工程断面図であり、
図7(a)は、本実施形態におけるリードフレームシートを例示する平面図であり、(b)は、このリードフレームシートの素子領域を例示する一部拡大平面図である。
本実施形態に係るLEDパッケージ1においては、LEDチップ14が、活性層として、インジウム、ガリウム、アルミニウム及びリンを含有する半導体層が設けられたチップであり、緑色から赤色までの波長領域の光を出射する。緑色から赤色までの波長領域の光は、紫外線及び青色の光と比較してエネルギーが低く、透明樹脂体17を形成する樹脂材料に与える損傷が少ない。このため、本実施形態に係るLEDパッケージ1は、透明樹脂体17の劣化が進行しにくく、耐久性が高い。従って、本実施形態に係るLEDパッケージ1は寿命が長く、信頼性が高く、幅広い用途に適用可能である。
本変形例は、リードフレームシートの形成方法の変形例である。
すなわち、本変形例においては、図4(a)に示すリードフレームシートの形成方法が、前述の第1の実施形態と異なっている。
図8(a)〜(h)は、本変形例におけるリードフレームシートの形成方法を例示する工程断面図である。
図9は、本実施形態に係るLEDパッケージを例示する斜視図であり、
図10は、本実施形態に係るLEDパッケージを例示する側面図である。
図11は、本実施形態に係るLEDパッケージを例示する斜視図であり、
図12は、本実施形態に係るLEDパッケージを例示する断面図である。
図13は、本実施形態に係るLEDパッケージを例示する斜視図であり、
図14は、本実施形態に係るLEDパッケージを例示する断面図である。
図15は、本実施形態に係るLEDパッケージを例示する斜視図であり、
図16(a)は本実施形態に係るLEDパッケージを例示する平面図であり、(b)はその側面図である。
図15並びに図16(a)及び(b)に示すように、本実施形態に係るLEDパッケージ5は、前述の第1の実施形態に係るLEDパッケージ1(図1参照)と比較して、リードフレームの形状が異なっていると共に、LEDチップのタイプが異なっている。
図16(a)及び(b)に示すように、本実施形態に係るLEDパッケージ5は、実装基板120に実装されて使用される。実装に際しては、実装基板120の実装面121における相互に離隔した2ヶ所の矩形の領域に、半田フィレット125及び126を形成する。次に、LEDパッケージ5を実装面121上に載置する。このとき、リードフレーム41の凸部41hの下面を半田フィレット125に当接させ、リードフレーム42の凸部42hの下面を半田フィレット126に当接させる。そして、+Z方向から見て、切込41iを除く凸部41hの外縁を半田フィレット125の外縁と一致させ、切込42iを除く凸部42hの外縁を半田フィレット126の外縁と一致させる。次に、熱処理を行い、半田フィレット125及び126を一旦溶融させた後、凝固させる。これにより、リードフレーム41が半田フィレット125を介して実装基板120に接合されると共に、リードフレーム42が半田フィレット126を介して実装基板120に接合される。この結果、LEDパッケージ5が実装基板120に実装される。
図17は、本実施形態に係るLEDパッケージを例示する斜視図である。
図17に示すように、本実施形態に係るLEDパッケージ6は、前述の第5の実施形態に係るLEDパッケージ5(図15参照)と比較して、LEDチップが搭載されたリードフレームの形状が異なっている。
図18は、本実施形態に係るLEDパッケージを例示する斜視図であり、
図19(a)は本実施形態に係るLEDパッケージを例示する平面図であり、(b)はその側面図である。
図18並びに図19(a)及び(b)に示すように、本実施形態に係るLEDパッケージ7は、前述の第5の実施形態に係るLEDパッケージ5(図15参照)と比較して、LEDチップが搭載されたリードフレームの形状が異なっている。
図20は、本実施形態に係るLEDパッケージを例示する斜視図であり、
図21は、本実施形態に係るLEDパッケージを例示する断面図である。
図22は、本実施形態に係るLEDパッケージを例示する斜視図である。
図22に示すように、本実施形態は、前述の第1の実施形態と第5の実施形態とを組み合わせた例である。すなわち、本実施形態に係るLEDパッケージ9においては、前述の第1の実施形態(図1参照)において説明したリードフレーム11及び12が設けられている。そして、このリードフレーム11上に、前述の第5の実施形態(図15参照)において説明した上下導通タイプのLEDチップ44が搭載されている。LEDチップ44の下面端子はダイマウント材43を介してリードフレーム11に接続されており、LEDチップ44の上面端子44aはワイヤ45を介してリードフレーム12に接続されている。
図23は、本実施形態に係るLEDパッケージを例示する断面図である。
図23に示すように、本実施形態に係るLEDパッケージ10においては、前述の第5の実施形態に係るLEDパッケージ5(図15参照)の構成に加えて、透明樹脂体17上にレンズ71が設けられている。レンズ71は、透明樹脂からなり、凸面が上方に向いた平凸レンズである。レンズ71は、例えば下金型101(図5参照)の底面に凹部を形成することにより透明樹脂体17と一体的に形成してもよく、透明樹脂板29(図6参照)を形成後に透明樹脂板29に取り付けて、その後、透明樹脂板29をダイシングしてもよく、透明樹脂板29をダイシングした後に透明樹脂体17に取り付けてもよい。本実施形態によれば、透明樹脂体17から出射した光をレンズ71によって直上方向(+Z方向)に集光させることができるため、配向性が向上する。本実施形態における上記以外の構成、製造方法及び作用効果は、前述の第5の実施形態と同様である。
Claims (9)
- 相互に離隔した第1及び第2のリードフレームと、
前記第1及び第2のリードフレームの上方に設けられ、少なくともインジウム、ガリウム及びアルミニウムを含有する半導体層を有し、一方の端子が前記第1のリードフレームに接続され、他方の端子が前記第2のリードフレームに接続されたLEDチップと、
前記第1及び第2のリードフレームのそれぞれの上面全体、下面の一部及び端面の一部を覆い、前記LEDチップを覆い、前記下面の残部及び前記端面の残部を露出させた透明な樹脂体と、
を備え、
前記第1のリードフレームにおける下面が前記樹脂体から露出した部分には、上下方向に貫通した第1の切込が形成されており、
前記第2のリードフレームにおける下面が前記樹脂体から露出した部分には、上下方向に貫通した第2の切込が形成されており、
前記樹脂体の外形がその外形をなし、
前記第1のリードフレームの下面及び前記第2のリードフレームの下面にはそれぞれ凸部が形成されており、
前記凸部の下面は前記樹脂体の下面において露出し、前記凸部の側面は前記樹脂体によって覆われ、
前記第1の切込は、前記第1のリードフレームに形成された前記凸部内に進入しており、前記第1のリードフレームの前記凸部の下面の形状はコ字形状であり、
前記第2の切込は、前記第2のリードフレームに形成された前記凸部内に進入しており、前記第2のリードフレームの前記凸部の下面の形状はコ字形状であり、
前記第1のリードフレーム及び前記第2のリードフレームは、それぞれ、
端面が前記樹脂体によって覆われたベース部と、
前記ベース部から相互に異なる方向に延出し、その下面が前記樹脂体によって覆われ、その先端面が前記樹脂体の側面に露出した複数本の吊ピンと、
を有し、
前記第1のリードフレームの前記複数本の吊ピンのうちの2本は、前記第1のリードフレームの前記ベース部における前記第2のリードフレームの反対側の端面から延出しており、
前記第1の切込は、前記第1のリードフレームの前記2本の吊ピンの間に位置しており、
前記第2のリードフレームの前記複数本の吊ピンのうちの2本は、前記第2のリードフレームの前記ベース部における前記第1のリードフレームの反対側の端面から延出しており、
前記第2の切込は、前記第2のリードフレームの前記2本の吊ピンの間に位置していることを特徴とするLEDパッケージ。 - 前記樹脂体は、エポキシ樹脂、アクリル樹脂及びウレタン樹脂からなる群から選択された1種以上の樹脂により形成されていることを特徴とする請求項1記載のLEDパッケージ。
- 前記第1のリードフレームの上面には凹部が形成されており、前記LEDチップは前記凹部の内部に搭載されていることを特徴とする請求項1または2に記載のLEDパッケージ。
- 前記凸部は、前記第1及び第2のリードフレームにおける相互に対向する端縁から離隔した領域に形成されていることを特徴とする請求項1〜3のいずれか1つに記載のLEDパッケージ。
- 前記LEDチップは前記第1のリードフレームに搭載されており、
前記一方の端子は前記LEDチップの下面に設けられており、前記他方の端子は前記LEDチップの上面に設けられており、
導電性材料からなり、前記LEDチップを前記第1のリードフレームに固着させると共に、前記一方の端子を前記第1のリードフレームに接続するダイマウント材と、
前記他方の端子を前記第2のリードフレームに接続するワイヤと、
をさらに備えたことを特徴とする請求項1〜4のいずれか1つに記載のLEDパッケージ。 - 前記第1のリードフレームの上面と前記他方の端子から前記ワイヤが引き出される方向とのなす角度は、前記第2のリードフレームの上面と前記第2のリードフレームから前記ワイヤが引き出される方向とのなす角度よりも小さいことを特徴とする請求項5記載のLEDパッケージ。
- 前記樹脂体上に設けられたレンズをさらに備えたことを特徴とする請求項1〜6のいずれか1つに記載のLEDパッケージ。
- 前記第1のリードフレーム及び前記第2のリードフレームのうちの少なくとも一方は、
端面が前記樹脂体によって覆われたベース部と、
前記ベース部から相互に異なる方向に延出し、その下面が前記樹脂体によって覆われ、その先端面が前記樹脂体の側面に露出した複数本の吊ピンと、
を有することを特徴とする請求項1〜7のいずれか1つに記載のLEDパッケージ。 - 上方から見て、前記樹脂体の形状は矩形であり、
前記第1のリードフレーム及び前記第2のリードフレームのうちの少なくとも一方は、
端面が前記樹脂体によって覆われたベース部と、
前記ベース部から延出し、その下面が前記樹脂体によって覆われ、その先端面が前記樹脂体の3つの側面に露出した複数本の吊ピンと、
を有することを特徴とする請求項1〜7のいずれか1つに記載のLEDパッケージ。
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JP2012114286A (ja) * | 2010-11-25 | 2012-06-14 | Toshiba Corp | Ledパッケージ |
JP2012234955A (ja) * | 2011-04-28 | 2012-11-29 | Toshiba Corp | Ledパッケージ及びその製造方法 |
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US20110186902A1 (en) | 2011-08-04 |
CN102142513B (zh) | 2014-07-16 |
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CN102142513A (zh) | 2011-08-03 |
US8637892B2 (en) | 2014-01-28 |
TWI446596B (zh) | 2014-07-21 |
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