USRE34254E - Surface mounted LED package - Google Patents

Surface mounted LED package Download PDF

Info

Publication number
USRE34254E
USRE34254E US07/714,226 US71422691A USRE34254E US RE34254 E USRE34254 E US RE34254E US 71422691 A US71422691 A US 71422691A US RE34254 E USRE34254 E US RE34254E
Authority
US
United States
Prior art keywords
passageway
housing
recited
led package
iaddend
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07/714,226
Inventor
Daniel Dragoon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dialight Corp
Original Assignee
Dialight Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/417,469 external-priority patent/US4935856A/en
Application filed by Dialight Corp filed Critical Dialight Corp
Priority to US07/714,226 priority Critical patent/USRE34254E/en
Application granted granted Critical
Publication of USRE34254E publication Critical patent/USRE34254E/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Definitions

  • This invention relates generally to structures for mounting visual indicators on printed circuit boards. It relates particularly to structures for mounting light-emitting diodes (“LEDs”) on printed circuit boards using surface mount technology.
  • LEDs light-emitting diodes
  • Printed circuit boards using surface mount technology have several advantages over prior printed circuit boards.
  • through holes for mounting devices to the board are completely eliminated. Instead, circuitry is packed close together, and the space usually required for through holes is utilized more efficiently. Accordingly, the boards can be smaller though carrying the same amount of circuitry, or more circuitry can be carried by the same sized board. Furthermore, the components mounted on the circuit boards can be smaller than those used on conventional printed circuit boards.
  • surface mount technology creates certain problems. Since the printed conductors and components must be located closer together than with other printed circuit boards, greater accuracy in the location of components and conductors on the boards is required. Furthermore, since wave soldering usually is not used, radiant heating in an oven or the like usually is used to heat the components and their leads so as to cause the preapplied solder paste to melt and attach the components to the board. The more demanding requirements of surface mount technology place greater demands on the structures and techniques for mounting components, visual indicators, etc. on the circuit boards.
  • circuit components on surface mount boards often is accomplished simply by cutting the electrical lead conductors of the devices bending the conductors to a proper shape, and then soldering them to the pads on to which the devices are to be mounted. This technique also has been used to mount LEDs on surface mount boards.
  • the leads usually provided for LEDs tend to be too pliable and narrow to balance the LED on the circuit board until it is soldered.
  • the conical dome shape of LEDs makes them incompatible with surface mount pick-and-place mechanisms.
  • LEDs designed for surface mounting are well suited for pick-and-place mechanisms, and they can successfully withstand solder temperatures.
  • these miniature devices offer poor optical performance; low light intensity levels, light bleeding when several LEDs are mounted in close proximity, and the unavailability of right-angle viewable devices.
  • a surface mounted LED package comprises an LED having a first surface, a second surface opposite to the first surface, two electrical contacts on the first surface, and a light emitting portion in the second surface; a housing mounted on the LED and having a generally rectangular parallelepipedal shape, a first passageway extending from a first surface of the housing part way through the housing, the first passageway being sized, shaped, and positioned to receive the second surface of the LED such that the light emitting portion of the second surface faces into the first passageway, and a second passageway extending from a second surface of the housing to a third surface of the housing and communicating with the first passageway; and a lens received in the second passageway and having a first radiating surface located outside the housing and an internal reflecting surface located inside the housing above the light emitting portion of the LED in position to reflect light from the light emitting portion of the LED toward the radiating surface.
  • FIG. 1 is an exploded perspective view of a surface mounted LED package according to the invention.
  • FIG. 2 is a front view of the surface mounted LED package shown in FIG. 1.
  • FIG. 3 is a cross sectional view on the line III--III in FIG. 2.
  • FIG. 4 is a perspective view of an array of three surface mounted LED packages of the type shown in FIG. 1 mounted on the edge of a printed circuit board.
  • FIG. 5 is a perspective view of a single housing containing a plurality of LEDs.
  • a surface mounted LED package 10 is shown in FIGS. 1-3. It comprises an LED 12, a housing 14, and a lens 16.
  • the LED 12 may be of any conventional kind--for instance, the kind sold under the designation BR1102W by Stanley. All that is important for present purposes is that it has a first surface 18, a second surface 20 opposite to the first surface 18, two electrical contacts 22 on the first surface 18, and a light emitting portion 24 in the second surface 20.
  • the housing 14 is mounted on the LED 12 by any appropriate means, such as by press fitting, by ultrasonic welding, or by gluing.
  • the housing 14 has a generally rectangular parallelepipedal shape, thereby being well adapted for precise positioning on a circuit board by the use of automated positioning equipment.
  • a first passageway 26 extends from a first surface 28 of the housing 14 part way through the housing 14. As best seen in FIG. 3, the first passageway 26 is sized, shaped, and positioned to receive the second surface 20 of the LED 12 such that the light emitting portion 24 of the second surface 20 faces into the first passageway 26.
  • a second passageway 30 extends from a second surface 32 of the housing 14 to a third surface 34 of the housing 14 and communicates with the first passageway 26.
  • the lens 16 is received in the second passageway 30. It has a radiating surface 36 located outside the housing 14, a light collecting surface located 38 above the light emitting portion 24 of the LED 12, and an internal reflecting surface 40 located inside the housing 14 in position to reflect light from the light collecting surface 38 toward the radiating surface 36.
  • the light collecting surface 38 can be flat, concave to maximize light entry, or convex to focus light in conjunction with the internal reflecting surface 40 and the radiating surface 36.
  • Other variations of the light collecting surface 38 and the internal reflecting surface 40 are possible.
  • the lens 16 is not limited to a generally round shape with a dome-shaped radiating surface 36. Lens barrel shapes following square, rectangular, or other polygons can be accommodated. Similarly, the radiating surface 36 can be designed as flat, fresnel, jewelled, or in other configurations depending on specific needs.
  • the lens 16 can be press fit or glued into the second passageway 30.
  • the lens 16 can be held in place by a flange 42 sandwiched between a wall 44 of the first passageway 26 and a stepped surface 46 of the LED 12.
  • Lens retention can also be accomplished by a mass of plastic material 48 filling the portion of the second passageway 30 not filled by the lens 16.
  • the mass of plastic material 48 is composed of an opaque reflecting material that supplements the function of the internal reflecting surface 40.
  • first passageway 26 and the second passageway 30 are preferably perpendicular to each other and the internal reflecting surface 40 is preferably disposed at 45° to both the first passageway 26 and the second passageway 30.
  • the housing 14 preferably has a slot 50 in its second (or front) surface 32 extending from its second surface 32 to its third (or rear) surface 34.
  • the first passageway 26 preferably communicates with the slot 50, and the slot 50 is preferably located at the center of the sides of the second surface 32 and the rear surface 34 joining the first surface 28.
  • FIG. 4 illustrates an array of three surface mounted LED packages 10 according to the invention mounted on a printed circuit board 44 near one of its edges.
  • FIG. 5 illustrates a single housing 54 containing a multiplicity of LEDs 12 and supplemental optics.
  • a package containing multiple LEDs collecting into a single radiating surface is also possible.

Abstract

The surface mounted LED package disclosed herein includes an LED having a first surface, a second surface opposite to the first surface, two electrical contacts on the first surface, and a light emitting portion in the second surface; a housing mounted on the LED and having a generally rectangular parallelepipedal shape, a first passageway extending from a first surface of the housing part way through the housing, the first passageway being sized, shaped, and positioned to receive the second surface of the LED such that the light emitting portion of the second surface faces into the first passageway, and a second passageway extending from a second surface of the housing to a third surface of the housing and communicating with the first passageway; and a lens received in the second passageway and having a first radiating surface located outside the housing and an internal reflecting surface located inside the housing above the light emitting portion of the LED in position to reflect light from the light emitting portion of the LED toward the radiating surface.

Description

FIELD OF THE INVENTION
This invention relates generally to structures for mounting visual indicators on printed circuit boards. It relates particularly to structures for mounting light-emitting diodes ("LEDs") on printed circuit boards using surface mount technology.
CROSS-REFERENCE TO RELATED APPLICATION
This application is related to commonly assigned application Ser. No. 07454,468, filed Dec. 21, 1989 concurrently herewith.
BACKGROUND OF THE INVENTION
Printed circuit boards using surface mount technology have several advantages over prior printed circuit boards. In surface mount circuit boards, through holes for mounting devices to the board are completely eliminated. Instead, circuitry is packed close together, and the space usually required for through holes is utilized more efficiently. Accordingly, the boards can be smaller though carrying the same amount of circuitry, or more circuitry can be carried by the same sized board. Furthermore, the components mounted on the circuit boards can be smaller than those used on conventional printed circuit boards.
However, surface mount technology creates certain problems. Since the printed conductors and components must be located closer together than with other printed circuit boards, greater accuracy in the location of components and conductors on the boards is required. Furthermore, since wave soldering usually is not used, radiant heating in an oven or the like usually is used to heat the components and their leads so as to cause the preapplied solder paste to melt and attach the components to the board. The more demanding requirements of surface mount technology place greater demands on the structures and techniques for mounting components, visual indicators, etc. on the circuit boards.
Often it is necessary to mount visual indicators such as LEDs on a printed circuit board with the light elevated above the surface of the board and/or with the LED near to one edge of the board. Each of these requirements creates special problems in the mounting of the LEDs.
The mounting of circuit components on surface mount boards often is accomplished simply by cutting the electrical lead conductors of the devices bending the conductors to a proper shape, and then soldering them to the pads on to which the devices are to be mounted. This technique also has been used to mount LEDs on surface mount boards. However, the leads usually provided for LEDs tend to be too pliable and narrow to balance the LED on the circuit board until it is soldered. Furthermore, the conical dome shape of LEDs makes them incompatible with surface mount pick-and-place mechanisms.
Perhaps the greatest deficiency of the above mounting technique lies in the fact that conventional LEDs are not capable of withstanding the heat associated with solder reflow processes. Through-hole LEDs are constructed by embedding a lead frame in a castable epoxy. Such encapsulants are not structurally sound at solder reflow temperatures. The glass transition temperature for casting epoxies is far lower than the temperature of the soldering furnace. As the epoxy softens, the lead frame is allowed to move, causing the ultimate breakage of the wire bond. Manufacturers that have attempted to use conventional LEDs in surface mount processes have experienced unacceptable failure rates.
Conversely, LEDs designed for surface mounting are well suited for pick-and-place mechanisms, and they can successfully withstand solder temperatures. However, lacking a focusing lens, these miniature devices offer poor optical performance; low light intensity levels, light bleeding when several LEDs are mounted in close proximity, and the unavailability of right-angle viewable devices.
OBJECTS OF THE INVENTION
Accordingly, it is an object of the present invention to provide a structure for mounting visual indicators, particularly LEDs, on printed circuit boards, particularly surface mount boards, with strength, accuracy, and variability in positioning while providing optical enhancements.
It is a further object of the invention to provide optical enhancements that increase light intensity, focus light to reduce light bleeding, and permit right-angle viewing.
It is still further object of the invention to provide such a structure in which a visual indicator can be mounted a substantial distance above the surface of the board and/or near one edge of the board so that it can be seen more easily and whenever required for any other reason.
It is a further object of the invention to provide such a structure with relatively broad conductive support surfaces for attachment to conductive pads on the boards with a high degree of accuracy and precision and with mechanical strength.
It is a still further object of the invention to provide such a structure which is well adapted for precise positioning on surface mount boards by use of automated positioning equipment.
It is another object of the invention to provide such a structure which is relatively compact and inexpensive to manufacture.
It is still a further object of the invention to provide such a structure which overcomes or ameliorates the drawbacks of the prior art discussed above.
SUMMARY OF THE INVENTION
With the foregoing in mind, a surface mounted LED package according to the invention comprises an LED having a first surface, a second surface opposite to the first surface, two electrical contacts on the first surface, and a light emitting portion in the second surface; a housing mounted on the LED and having a generally rectangular parallelepipedal shape, a first passageway extending from a first surface of the housing part way through the housing, the first passageway being sized, shaped, and positioned to receive the second surface of the LED such that the light emitting portion of the second surface faces into the first passageway, and a second passageway extending from a second surface of the housing to a third surface of the housing and communicating with the first passageway; and a lens received in the second passageway and having a first radiating surface located outside the housing and an internal reflecting surface located inside the housing above the light emitting portion of the LED in position to reflect light from the light emitting portion of the LED toward the radiating surface.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded perspective view of a surface mounted LED package according to the invention.
FIG. 2 is a front view of the surface mounted LED package shown in FIG. 1.
FIG. 3 is a cross sectional view on the line III--III in FIG. 2.
FIG. 4 is a perspective view of an array of three surface mounted LED packages of the type shown in FIG. 1 mounted on the edge of a printed circuit board.
FIG. 5 is a perspective view of a single housing containing a plurality of LEDs.
DETAILED DESCRIPTION OF THE PRESENTLY PREFERRED EMBODIMENT
A surface mounted LED package 10 is shown in FIGS. 1-3. It comprises an LED 12, a housing 14, and a lens 16.
The LED 12 may be of any conventional kind--for instance, the kind sold under the designation BR1102W by Stanley. All that is important for present purposes is that it has a first surface 18, a second surface 20 opposite to the first surface 18, two electrical contacts 22 on the first surface 18, and a light emitting portion 24 in the second surface 20.
The housing 14 is mounted on the LED 12 by any appropriate means, such as by press fitting, by ultrasonic welding, or by gluing. The housing 14 has a generally rectangular parallelepipedal shape, thereby being well adapted for precise positioning on a circuit board by the use of automated positioning equipment. A first passageway 26 extends from a first surface 28 of the housing 14 part way through the housing 14. As best seen in FIG. 3, the first passageway 26 is sized, shaped, and positioned to receive the second surface 20 of the LED 12 such that the light emitting portion 24 of the second surface 20 faces into the first passageway 26. A second passageway 30 extends from a second surface 32 of the housing 14 to a third surface 34 of the housing 14 and communicates with the first passageway 26.
As best seen in FIG. 3, the lens 16 is received in the second passageway 30. It has a radiating surface 36 located outside the housing 14, a light collecting surface located 38 above the light emitting portion 24 of the LED 12, and an internal reflecting surface 40 located inside the housing 14 in position to reflect light from the light collecting surface 38 toward the radiating surface 36.
The light collecting surface 38 can be flat, concave to maximize light entry, or convex to focus light in conjunction with the internal reflecting surface 40 and the radiating surface 36. Other variations of the light collecting surface 38 and the internal reflecting surface 40 (such as stepped reflectors, fresnel surfaces, conic sections, or polynomial surfaces) are possible.
Additionally, the lens 16 is not limited to a generally round shape with a dome-shaped radiating surface 36. Lens barrel shapes following square, rectangular, or other polygons can be accommodated. Similarly, the radiating surface 36 can be designed as flat, fresnel, jewelled, or in other configurations depending on specific needs.
The lens 16 can be press fit or glued into the second passageway 30. Alternatively, and as illustrated in FIG. 3, the lens 16 can be held in place by a flange 42 sandwiched between a wall 44 of the first passageway 26 and a stepped surface 46 of the LED 12. Lens retention can also be accomplished by a mass of plastic material 48 filling the portion of the second passageway 30 not filled by the lens 16. Preferably the mass of plastic material 48 is composed of an opaque reflecting material that supplements the function of the internal reflecting surface 40.
As best seen in FIG. 3, the first passageway 26 and the second passageway 30 are preferably perpendicular to each other and the internal reflecting surface 40 is preferably disposed at 45° to both the first passageway 26 and the second passageway 30.
As best seen in FIG. 1, the housing 14 preferably has a slot 50 in its second (or front) surface 32 extending from its second surface 32 to its third (or rear) surface 34. As best seen in FIG. 2, the first passageway 26 preferably communicates with the slot 50, and the slot 50 is preferably located at the center of the sides of the second surface 32 and the rear surface 34 joining the first surface 28.
FIG. 4 illustrates an array of three surface mounted LED packages 10 according to the invention mounted on a printed circuit board 44 near one of its edges.
FIG. 5 illustrates a single housing 54 containing a multiplicity of LEDs 12 and supplemental optics. A package containing multiple LEDs collecting into a single radiating surface is also possible.
Obviously, numerous modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that, within the scope of the appended claims, the invention may be practiced otherwise than as specifically described herein.

Claims (10)

What is claimed as new and desired to be secured by Letters Patent of the United States is:
1. A surface mounted LED package comprising:
(a) an LED having;
(i) a first surface;
(ii) a second surface opposite to said first surface;
(iii) two electrical contacts on said first surface; and
(iv) a light emitting portion in said second surface;
(b) a housing mounted on said LED, said housing having:
(i) a generally rectangular parallelepipedal shape;
(ii) a first passageway extending from a first surface of said housing part way through said housing, said first passageway being sized, shaped, and positioned to receive said second surface of said LED such that said light emitting portion of said second surface faces into said first passageway; and
(iii) a second passageway extending from a second surface of said housing to a third surface of said housing and communicating with said first passageway; and
(c) a lens received in said second passageway, said lens having:
(i) a radiating surface located outside said housing and
(ii) an internal reflecting surface located inside said housing above said light emitting portion of said LED in position to reflect light from said light emitting portion of said LED toward said radiating surface.
2. A surface mounted LED package as recited in claim 1 and further comprising an opaque reflecting material located in said second passageway adjacent said internal reflecting surface.
3. A surface mounted LED package as recited in claim 1 wherein:
(a) said first passageway and said second passageway are perpendicular to each other and
(b) said internal reflecting surface of said lens is disposed at 45° to both said first passageway and said second passageway. .[.4. A surface mounted LED package as recited in claim 1 wherein:
(a) said housing has a slot in its front surface extending from its second surface to its third surface and
(b) said first passageway communicates with said slot..]. .[.5. A surface mounted LED package as recited in claim 4 wherein said slot is located at the center of the edges of said second and third surfaces joining said
first surface..]. 6. A surface mounted LED package as recited in claim 1 wherein said first passageway guides and reflects light from said LED to a
light collecting surface of said lens. 7. A surface mounted LED package as recited in claim 6 wherein said second passageway has a cross section
sized and shaped to accept said lens. 8. A surface mounted LED package as recited in claim 1 wherein said second passageway has a cross section
sized and shaped to accept said lens. .Iadd.9. A surface mounted LED package as recited in claim 1 wherein:
(a) said housing has a slot in its first surface extending from its second surface to its third surface and
(b) said first passageway communicates with said slot. .Iaddend. .Iadd.10. A surface mounted LED package as recited in claim 9 wherein said slot is located at the center of the edges of said second and third surfaces
joining said first surface. .Iaddend. .Iadd.11. A surface mounted LED package comprising:
(a) an LED having:
(i) a first surface;
(ii) a second surface opposite to said first surface;
(iii) two electrical contacts; and
(iv) a light emitting portion;
(b) a housing mounted on said LED, said housing having:
(i) a first passageway extending from a first surface of said housing part way through said housing, said first passageway being sized, shaped, and positioned to receive said second surface of said LED such that said light emitting portion of said LED faces into said first passageway, and
(ii) a second passageway extending from a second surface of said housing at least part way through said housing and communicating with said first passageway; and
(c) a lens received in said second passageway, said lens having:
(i) a radiating surface and
(ii) an internal reflecting surface located inside said housing in position to reflect light from said light emitting portion of said LED toward said radiating surface. .Iaddend. .Iadd.12. A surface mounted LED package as recited in claim 11 and further comprising an opaque reflecting material located in said second passageway adjacent said internal reflecting surface. .Iaddend. .Iadd.13. A surface mounted LED package as recited in claim 11 wherein:
(a) said first passageway and said second passageway are perpendicular to each other and
(b) said internal reflecting surface of said lens is disposed at 45° to both said first passageway and said second passageway. .Iaddend. .Iadd.14. A surface mounted LED package as recited in claim 11 wherein:
(a) said housing has a slot in its first surface extending from its second surface to a third surface of said housing and
(b) said first passageway communicates with said slot. .Iaddend. .Iadd.15. A surface mounted LED package as recited in claim 14 wherein said slot is located at the center of the edges of said second and third surfaces joining said first surface. .Iaddend. .Iadd.16. A surface mounted LED package as recited in claim 11 wherein said first passageway guides and reflects light from said LED to a light collecting surface of said lens. .Iaddend. .Iadd.17. A surface mounted LED package as recited in claim 16 wherein said second passageway has a cross-section sized and shaped to
accept said lens. .Iaddend. .Iadd.18. A surface mounted LED package as recited in claim 11 wherein said second passageway has a cross-section sized and shaped to accept said lens. .Iaddend. .Iadd.19. A surface mounted LED package as recited in claim 11 wherein said two electrical contacts are located on said first surface of said LED. .Iaddend. .Iadd.20. A surface mounted LED package as recited in claim 11 wherein said housing is generally rectangular parallelepipedal in shape. .Iaddend. .Iadd.21. A surface mounted LED package as recited in claim 11 wherein said second passageway extends from said second surface of said housing to a third surface of said housing. .Iaddend. .Iadd.22. A surface mounted LED package as recited in claim 11 wherein said radiating surface of said lens is located outside said housing. .Iaddend. .Iadd.23. A surface mounted LED package as recited in claim 11 wherein said internal reflecting surface of said lens is located above said light emitting portion of said LED. .Iaddend. .Iadd.24. A surface mounted LED package comprising:
(a) an LED having:
(i) two electrical contacts and
(ii) a light emitting portion and
(b) a housing mounted on said LED, said housing having:
(i) a first surface;
(ii) a second surface that is not parallel to said first surface; and
(iii) a passageway extending through said housing from a first end at said first surface to a second end at said second surface, said passageway being sized, shaped, and positioned to receive said light emitting portion of said LED into said first end of said passageway and having a first internal reflecting surface that reflects light from said light emitting portion of said LED out through said second end of said passageway.
.Iaddend. .Iadd.25. A surface mounted LED package as recited in claim 24 wherein said passageway comprises:
(a) a first passageway segment extending from said first end of said passageway part way through said housing and
(b) a second passageway segment extending from said second end of said passageway at least part way through said housing and communicating with said first passageway segment. .Iaddend. .Iadd.26. A surface mounted LED package as recited in claim 25 wherein said first and second passageway segments are straight. .Iaddend. .Iadd.27. A surface mounted LED package as recited in claim 25 wherein said second passageway segment extends all the way through said housing. .Iaddend. .Iadd.28. A surface mounted LED package as recited in claim 25 wherein said first internal reflecting surface is located at the intersection of said first and second passageway segments. .Iaddend. .Iadd.29. A surface mounted LED package as recited in claim 24 and further comprising a lens received in said passageway in position to receive light from said light emitting portion of said LED, said lens having a radiating surface sized, shaped, and positioned to radiate light from said light emitting portion of said LED externally of said housing. .Iaddend. .Iadd.30. A surface mounted LED package as recited in claim 29 wherein said lens has a second internal reflecting surface located in said housing in position to reflect light from said light emitting portion of said LED toward said radiating surface of said lens. .Iaddend. .Iadd.31. A surface mounted LED package as recited in claim 29 wherein said radiating surface of said lens is located outside said housing. .Iaddend. .Iadd.32. A surface mounted LED package as recited in claim 29 wherein said radiating surface of said lens protrudes outwardly from said housing. .Iaddend.
US07/714,226 1989-10-05 1991-06-12 Surface mounted LED package Expired - Lifetime USRE34254E (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US07/714,226 USRE34254E (en) 1989-10-05 1991-06-12 Surface mounted LED package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/417,469 US4935856A (en) 1989-10-05 1989-10-05 Surface mounted LED package
US07/714,226 USRE34254E (en) 1989-10-05 1991-06-12 Surface mounted LED package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US07/417,469 Reissue US4935856A (en) 1989-10-05 1989-10-05 Surface mounted LED package

Publications (1)

Publication Number Publication Date
USRE34254E true USRE34254E (en) 1993-05-18

Family

ID=27023747

Family Applications (1)

Application Number Title Priority Date Filing Date
US07/714,226 Expired - Lifetime USRE34254E (en) 1989-10-05 1991-06-12 Surface mounted LED package

Country Status (1)

Country Link
US (1) USRE34254E (en)

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349504A (en) * 1993-07-12 1994-09-20 Dialight Corporation Multi-level lightpipe design for SMD LEDs
US5387901A (en) * 1992-12-10 1995-02-07 Compaq Computer Corporation Led indicating light assembly for a computer housing
US5504660A (en) * 1994-01-03 1996-04-02 Illinois Tool Works Inc. Lens retention structure
USD422520S (en) * 1997-07-17 2000-04-11 Lumex, Inc. Housing for a plurality of emitters for detectors
USD422929S (en) * 1997-07-17 2000-04-18 Lumex, Inc. Housing for a plurality of emitters for detectors
USD422928S (en) * 1997-07-17 2000-04-18 Lumex, Inc. Housing for a plurality of emitters for detectors
USD425809S (en) * 1997-06-17 2000-05-30 Lumex, Inc. Housing for emitters for infrared detectors
USD426167S (en) * 1997-06-17 2000-06-06 Lumex, Inc. Housing for emitters for infrared detectors
USD428820S (en) * 1997-06-17 2000-08-01 Lumex, Inc. Housing for emitters for infrared detectors
US20010045647A1 (en) * 1996-09-20 2001-11-29 Osram Opto Semiconductors Gmbh & Co., Ohg Method of producing a wavelength-converting casting composition
US20030099115A1 (en) * 2001-11-28 2003-05-29 Joachim Reill Led illumination system
US6598999B2 (en) * 2000-09-14 2003-07-29 International Business Machines Corporation Indicator system and combined lens for use therewith
US6623152B1 (en) * 1999-12-08 2003-09-23 Mentor Gmbh & Company Display element capable of being mounted on a printed circuit board
US20050094392A1 (en) * 2003-10-31 2005-05-05 Mooney Douglas J. Light reflector and barrier for light emitting diodes
US20050127385A1 (en) * 1996-06-26 2005-06-16 Osram Opto Semiconductors Gmbh & Co., Ohg, A Germany Corporation Light-radiating semiconductor component with a luminescence conversion element
US7005311B2 (en) 1993-09-30 2006-02-28 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7102215B2 (en) 1997-07-29 2006-09-05 Osram Gmbh Surface-mountable light-emitting diode structural element
US20080239722A1 (en) * 2007-04-02 2008-10-02 Ruud Lighting, Inc. Light-Directing LED Apparatus
US20090290360A1 (en) * 2008-05-23 2009-11-26 Ruud Lighting, Inc. Lens with tir for off-axial light distribution
EP2228596A1 (en) * 2009-03-11 2010-09-15 Japan Aviation Electronics Industry Limited Optical semiconductor device, socket, and optical semiconductor unit
US7841750B2 (en) 2008-08-01 2010-11-30 Ruud Lighting, Inc. Light-directing lensing member with improved angled light distribution
US20100302786A1 (en) * 2008-05-23 2010-12-02 Ruud Lighting, Inc. Lens with controlled backlight management
US7852015B1 (en) * 2006-10-11 2010-12-14 SemiLEDs Optoelectronics Co., Ltd. Solid state lighting system and maintenance method therein
USD697664S1 (en) 2012-05-07 2014-01-14 Cree, Inc. LED lens
US20140133141A1 (en) * 2012-11-15 2014-05-15 Illinois Tool Works Inc. Illumination device
USD718490S1 (en) 2013-03-15 2014-11-25 Cree, Inc. LED lens
US9082313B1 (en) * 2014-07-21 2015-07-14 McCarthy Music Corp. Interactive piano training system
US9255686B2 (en) 2009-05-29 2016-02-09 Cree, Inc. Multi-lens LED-array optic system
US9423096B2 (en) 2008-05-23 2016-08-23 Cree, Inc. LED lighting apparatus
US9523479B2 (en) 2014-01-03 2016-12-20 Cree, Inc. LED lens
US9541257B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for primarily-elongate light distribution
US9541258B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for wide lateral-angle distribution
US9836992B2 (en) 2013-08-22 2017-12-05 McCarthy Music Corp. Interactive piano training system
US10408429B2 (en) 2012-02-29 2019-09-10 Ideal Industries Lighting Llc Lens for preferential-side distribution
US10468566B2 (en) 2017-04-10 2019-11-05 Ideal Industries Lighting Llc Hybrid lens for controlled light distribution

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4471415A (en) * 1983-06-20 1984-09-11 Wilbrecht Electronics, Inc. Mounting bar for spacing indicator lights
US4555749A (en) * 1984-05-07 1985-11-26 General Instrument Corporation LED Circuit board indicator housing and tie-bar assembly
US4704669A (en) * 1985-09-13 1987-11-03 Universo S.A. Miniature lamp holder
US4727648A (en) * 1985-04-22 1988-03-01 Savage John Jun Circuit component mount and assembly
US4929866A (en) * 1987-11-17 1990-05-29 Mitsubishi Cable Industries, Ltd. Light emitting diode lamp

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4471415A (en) * 1983-06-20 1984-09-11 Wilbrecht Electronics, Inc. Mounting bar for spacing indicator lights
US4555749A (en) * 1984-05-07 1985-11-26 General Instrument Corporation LED Circuit board indicator housing and tie-bar assembly
US4727648A (en) * 1985-04-22 1988-03-01 Savage John Jun Circuit component mount and assembly
US4704669A (en) * 1985-09-13 1987-11-03 Universo S.A. Miniature lamp holder
US4929866A (en) * 1987-11-17 1990-05-29 Mitsubishi Cable Industries, Ltd. Light emitting diode lamp

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Cerled Advertising Flyer CSE Series, SMD Side Looker LED, Sep. 1990. *
Cerled Advertising Flyer--CSE Series, SMD--Side Looker LED, Sep. 1990.

Cited By (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387901A (en) * 1992-12-10 1995-02-07 Compaq Computer Corporation Led indicating light assembly for a computer housing
US5349504A (en) * 1993-07-12 1994-09-20 Dialight Corporation Multi-level lightpipe design for SMD LEDs
US7005311B2 (en) 1993-09-30 2006-02-28 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7288831B2 (en) 1993-09-30 2007-10-30 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US20060284287A1 (en) * 1993-09-30 2006-12-21 Guenther Waitl Two-pole smt miniature housing for semiconductor components and method for the manufacture thereof
US7102212B2 (en) 1993-09-30 2006-09-05 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US5504660A (en) * 1994-01-03 1996-04-02 Illinois Tool Works Inc. Lens retention structure
US20080149958A1 (en) * 1996-06-26 2008-06-26 Ulrike Reeh Light-Radiating Semiconductor Component with a Luminescence Conversion Element
US7126162B2 (en) 1996-06-26 2006-10-24 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element
US9196800B2 (en) 1996-06-26 2015-11-24 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element
US7345317B2 (en) 1996-06-26 2008-03-18 Osram Gmbh Light-radiating semiconductor component with a luminescene conversion element
US7151283B2 (en) 1996-06-26 2006-12-19 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element
US7629621B2 (en) 1996-06-26 2009-12-08 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element
US7078732B1 (en) 1996-06-26 2006-07-18 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element
US20050231953A1 (en) * 1996-06-26 2005-10-20 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element
US20050127385A1 (en) * 1996-06-26 2005-06-16 Osram Opto Semiconductors Gmbh & Co., Ohg, A Germany Corporation Light-radiating semiconductor component with a luminescence conversion element
US20050161694A1 (en) * 1996-06-26 2005-07-28 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element
US20010045647A1 (en) * 1996-09-20 2001-11-29 Osram Opto Semiconductors Gmbh & Co., Ohg Method of producing a wavelength-converting casting composition
US7235189B2 (en) 1996-09-20 2007-06-26 Osram Gmbh Method of producing a wavelength-converting casting composition
US20100176344A1 (en) * 1996-09-20 2010-07-15 Hoehn Klaus Wavelength-converting casting composition and light-emitting semiconductor component
US20070216281A1 (en) * 1996-09-20 2007-09-20 Klaus Hohn Wavelength-converting casting composition and light-emitting semiconductor component
US7709852B2 (en) 1996-09-20 2010-05-04 Osram Gmbh Wavelength-converting casting composition and light-emitting semiconductor component
US7276736B2 (en) 1996-09-20 2007-10-02 Osram Gmbh Wavelength-converting casting composition and white light-emitting semiconductor component
US8071996B2 (en) 1996-09-20 2011-12-06 Osram Gmbh Wavelength-converting casting composition and light-emitting semiconductor component
USD426167S (en) * 1997-06-17 2000-06-06 Lumex, Inc. Housing for emitters for infrared detectors
USD425809S (en) * 1997-06-17 2000-05-30 Lumex, Inc. Housing for emitters for infrared detectors
USD428820S (en) * 1997-06-17 2000-08-01 Lumex, Inc. Housing for emitters for infrared detectors
USD422928S (en) * 1997-07-17 2000-04-18 Lumex, Inc. Housing for a plurality of emitters for detectors
USD422520S (en) * 1997-07-17 2000-04-11 Lumex, Inc. Housing for a plurality of emitters for detectors
USD422929S (en) * 1997-07-17 2000-04-18 Lumex, Inc. Housing for a plurality of emitters for detectors
US7102215B2 (en) 1997-07-29 2006-09-05 Osram Gmbh Surface-mountable light-emitting diode structural element
US20070126098A1 (en) * 1997-07-29 2007-06-07 Karlheinz Arndt Surface-mountable light-emitting diode structural element
US7508002B2 (en) 1997-07-29 2009-03-24 Osram Gmbh Surface-mountable light-emitting diode structural element
US7183632B2 (en) 1997-07-29 2007-02-27 Osram Gmbh Surface-mountable light-emitting diode structural element
US20060197103A1 (en) * 1997-07-29 2006-09-07 Karlheinz Arndt Surface-mountable light-emitting diode structural element
US6623152B1 (en) * 1999-12-08 2003-09-23 Mentor Gmbh & Company Display element capable of being mounted on a printed circuit board
US6598999B2 (en) * 2000-09-14 2003-07-29 International Business Machines Corporation Indicator system and combined lens for use therewith
US6837605B2 (en) * 2001-11-28 2005-01-04 Osram Opto Semiconductors Gmbh Led illumination system
US20030099115A1 (en) * 2001-11-28 2003-05-29 Joachim Reill Led illumination system
US20050094392A1 (en) * 2003-10-31 2005-05-05 Mooney Douglas J. Light reflector and barrier for light emitting diodes
US7086754B2 (en) * 2003-10-31 2006-08-08 Brocade Communications Systems, Inc. Light reflector and barrier for light emitting diodes
US7852015B1 (en) * 2006-10-11 2010-12-14 SemiLEDs Optoelectronics Co., Ltd. Solid state lighting system and maintenance method therein
US7618163B2 (en) 2007-04-02 2009-11-17 Ruud Lighting, Inc. Light-directing LED apparatus
US20080239722A1 (en) * 2007-04-02 2008-10-02 Ruud Lighting, Inc. Light-Directing LED Apparatus
US9476570B2 (en) 2008-05-23 2016-10-25 Cree, Inc. Lens with controlled backlight management
US8348475B2 (en) 2008-05-23 2013-01-08 Ruud Lighting, Inc. Lens with controlled backlight management
US8388193B2 (en) 2008-05-23 2013-03-05 Ruud Lighting, Inc. Lens with TIR for off-axial light distribution
US20090290360A1 (en) * 2008-05-23 2009-11-26 Ruud Lighting, Inc. Lens with tir for off-axial light distribution
US9657918B2 (en) 2008-05-23 2017-05-23 Cree, Inc. Light fixture with wide-angle light distribution
US20100302786A1 (en) * 2008-05-23 2010-12-02 Ruud Lighting, Inc. Lens with controlled backlight management
US9423096B2 (en) 2008-05-23 2016-08-23 Cree, Inc. LED lighting apparatus
US7841750B2 (en) 2008-08-01 2010-11-30 Ruud Lighting, Inc. Light-directing lensing member with improved angled light distribution
EP2228596A1 (en) * 2009-03-11 2010-09-15 Japan Aviation Electronics Industry Limited Optical semiconductor device, socket, and optical semiconductor unit
US9152755B2 (en) 2009-03-11 2015-10-06 Japan Aviation Electronics Industry, Limited Optical semiconductor device, socket, and optical semiconductor unit
US20100230709A1 (en) * 2009-03-11 2010-09-16 Japan Aviation Electronics Industry, Limited Optical semiconductor device, socket, and optical semiconductor unit
US9689552B2 (en) 2009-05-29 2017-06-27 Cree, Inc. Multi-lens LED-array optic system
US9255686B2 (en) 2009-05-29 2016-02-09 Cree, Inc. Multi-lens LED-array optic system
US9541257B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for primarily-elongate light distribution
US9541258B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for wide lateral-angle distribution
US10408429B2 (en) 2012-02-29 2019-09-10 Ideal Industries Lighting Llc Lens for preferential-side distribution
USD708387S1 (en) 2012-05-07 2014-07-01 Cree, Inc. LED lens
USD697664S1 (en) 2012-05-07 2014-01-14 Cree, Inc. LED lens
US8876330B2 (en) * 2012-11-15 2014-11-04 Illinois Tool Works Inc. Illumination device
US20140133141A1 (en) * 2012-11-15 2014-05-15 Illinois Tool Works Inc. Illumination device
USD718490S1 (en) 2013-03-15 2014-11-25 Cree, Inc. LED lens
US9836992B2 (en) 2013-08-22 2017-12-05 McCarthy Music Corp. Interactive piano training system
US9523479B2 (en) 2014-01-03 2016-12-20 Cree, Inc. LED lens
US9082313B1 (en) * 2014-07-21 2015-07-14 McCarthy Music Corp. Interactive piano training system
US9092994B1 (en) 2014-07-21 2015-07-28 McCarthy Music Corp. Interactive piano training system
US10468566B2 (en) 2017-04-10 2019-11-05 Ideal Industries Lighting Llc Hybrid lens for controlled light distribution

Similar Documents

Publication Publication Date Title
USRE34254E (en) Surface mounted LED package
US4935856A (en) Surface mounted LED package
US4959761A (en) Surface mounted led package
EP1959505B1 (en) LED module with lens and its manufacturing
EP1766287B1 (en) High power led electro-optic assembly
US6095666A (en) Light source
US5226723A (en) Light emitting diode display
US6733156B2 (en) Light-emitting diode illuminated light-emitting
US20050133939A1 (en) Semiconductor light emitting device
JPH1187780A (en) Light emitting device
US20050263784A1 (en) Collimating light from an LED device
KR20010114154A (en) Led illumination system and manufacturing method thereof
JP2011520289A (en) Surface-mount circuit board indicator
KR20060104432A (en) Slim type flash device with high brightness
US20110110101A1 (en) Led unit
US7102178B2 (en) Small format optoelectronic package
JP2000089694A (en) Dot matrix display device
US5845982A (en) Visible laser diode module
JPH1117229A (en) Reflective light emitting diode and method for mounting the same
JP2007116078A (en) Housing of light emitting element
CN220710838U (en) Laser module structure
CN217279201U (en) Liquid crystal display module
JPH10208515A (en) Lighting fixture for vehicle
JP3688988B2 (en) Chip LED
JP2008003168A (en) Optical module

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

FPAY Fee payment

Year of fee payment: 12