JP2005317661A - 半導体発光装置およびその製造方法 - Google Patents
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
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Abstract
【解決手段】 半導体発光装置は、LED素子2と、LED素子2が搭載されるリードフレーム10Aと、ワイヤ3を介してLED素子2と電気的に接続されるリードフレーム10Bと、LED素子2上およびリードフレーム1(10A,10B)上に形成された透明樹脂部4と、LED素子2の周囲を取り囲み、透明樹脂4よりも高い反射率を有する遮光樹脂部7とを備える。透明樹脂部4は、LED素子2上でレンズを形成するレンズ部分4Aと、リードフレーム1を保持する保持部分4Bとを有する。
【選択図】 図5
Description
Claims (8)
- 半導体発光素子と、
前記半導体発光素子が搭載される第1リードフレームと、
ワイヤを介して前記半導体発光素子と電気的に接続される第2リードフレームと、
前記半導体発光素子上および前記第1と第2リードフレーム上に形成された透光性樹脂部とを備え、
前記透光性樹脂部は、前記半導体発光素子上でレンズを形成するレンズ部分と、前記第1と第2リードフレームを保持する保持部分とを有する半導体発光装置。 - 前記レンズ部分の幅は前記保持部分の幅よりも小さい、請求項1に記載の半導体発光装置。
- 前記第1リードフレームの先端部と第2リードフレームの先端部とで凹部を形成し、
前記半導体発光素子は前記凹部の底面上に設けられ、
前記保持部分は前記凹部の少なくとも一部を受け入れる、請求項1または請求項2に記載の半導体発光装置。 - 前記半導体発光素子は、前記レンズ部分の光軸上に設けられる、請求項1から請求項3のいずれかに記載の半導体発光装置。
- 前記第1リードフレームにおける前記半導体発光素子が搭載された部分の裏面は、前記透光性樹脂部の外側に露出した、請求項1から請求項4のいずれかに記載の半導体発光装置。
- 前記半導体発光装置の周囲を取り囲み、前記透光性樹脂部よりも高い反射率を有する遮光性樹脂部が形成される、請求項1から請求項5のいずれかに記載の半導体発光装置。
- 前記透光性樹脂部に光を散乱する散乱材を混入させた、請求項1から請求項6のいずれかに記載の半導体発光装置。
- インサート成型により、第1と第2リードフレームを保持し、前記第1リードフレーム上に搭載された半導体発光素子上でレンズを形成する透光性樹脂部を形成する工程と、
前記半導体発光素子および前記レンズの周囲に金型を設け、該金型を用いて前記半導体素子の周囲を取り囲む遮光性樹脂部を形成する工程とを備えた半導体発光装置の製造方法。
Priority Applications (3)
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JP2004131774A JP2005317661A (ja) | 2004-04-27 | 2004-04-27 | 半導体発光装置およびその製造方法 |
US11/112,215 US7301176B2 (en) | 2004-04-27 | 2005-04-22 | Semiconductor light emitting device and fabrication method thereof |
CNB2005100669543A CN100383991C (zh) | 2004-04-27 | 2005-04-22 | 半导体发光器件及其制作方法 |
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JP2004131774A JP2005317661A (ja) | 2004-04-27 | 2004-04-27 | 半導体発光装置およびその製造方法 |
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JP2009101520A Division JP4638949B2 (ja) | 2009-04-20 | 2009-04-20 | 半導体発光装置およびその製造方法 |
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Cited By (15)
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JP2007281250A (ja) * | 2006-04-07 | 2007-10-25 | Toshiba Corp | 半導体発光装置 |
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JP2008270822A (ja) * | 2007-04-24 | 2008-11-06 | Samsung Electro Mech Co Ltd | 発光ダイオードパッケージ |
KR100877775B1 (ko) | 2007-07-19 | 2009-01-16 | 서울반도체 주식회사 | 반사면을 구비하는 리드단자를 채택한 발광 다이오드패키지 |
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JP2010165979A (ja) * | 2009-01-19 | 2010-07-29 | Rohm Co Ltd | Ledモジュールの製造方法およびledモジュール |
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Also Published As
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US20050236639A1 (en) | 2005-10-27 |
CN100383991C (zh) | 2008-04-23 |
US7301176B2 (en) | 2007-11-27 |
CN1691361A (zh) | 2005-11-02 |
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