CN101499446B - 导线架料片、封装结构以及发光二极管封装结构 - Google Patents

导线架料片、封装结构以及发光二极管封装结构 Download PDF

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CN101499446B
CN101499446B CN2009100375622A CN200910037562A CN101499446B CN 101499446 B CN101499446 B CN 101499446B CN 2009100375622 A CN2009100375622 A CN 2009100375622A CN 200910037562 A CN200910037562 A CN 200910037562A CN 101499446 B CN101499446 B CN 101499446B
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林贞秀
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Lite On Electronics Guangzhou Co Ltd
Lite On Technology Changzhou Co Ltd
Lite On Technology Corp
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Lite On Technology Corp
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Abstract

本发明公开了一种封装结构，包含一座体、一第一导电支架及一第二导电支架，第二导电支架具有一导接面，座体模内射出成型包覆第一导电支架与第二导电支架，且座体形成有一使第一导电支架局部外露而可供设置发光晶粒的凹穴，第二导电支架的导接面实质与座体顶面切齐，藉由让金属导线一端打接在发光晶粒，另一端打接在第二导电支架的导接面，不仅可降低座体厚度、提升出光的均匀性，且座体不论在制程或材料成本上，也都比较简单、低廉。

Description

导线架料片、封装结构以及发光二极管封装结构
技术领域
本发明是有关于一种封装结构以及发光二极管封装结构，特别是指一种可供设置发光晶粒并且打线连接以制成发光二极管封装结构的封装结构以及该发光二极管封装结构。 
背景技术
参阅图1，为美国专利US6,066,861所揭露的一种发光二极管封装结构9，其发光晶粒91 是设置在一座体92的凹穴921内，而金属导线93系一端固定在发光芯片91，另一端则弯曲固定在伸入凹穴921的端子94上，虽然这样的设置方式可得到较佳的打线弧度，但为了让打线机能够伸入凹穴921进行打线，凹穴921必须有较大的空间可供打线机磁嘴伸入，而加大凹穴921的空间却容易增加座体92的厚度，进而增加整个发光二极管封装结构9的尺寸， 且凹穴921的空间加大也会增加封装胶体95的厚度，影响发光晶粒91出光的均匀性。 
参阅图2，为美国专利US7,129,638所揭露的一种发光二极管装置8，此案系将座体81以陶瓷材料制成并且布设导电线路，使金属导线82的另一端得以被拉至座体81的上表面打接固定，使得打线机在进行打线时可不受凹穴811空间的限制，但其缺点在于陶瓷材料并且堆栈线路之座体81的制程较繁复，且陶瓷材料成本也比较高。  
除此之外，在此亦将美国专利US6,417,019、US6,576,488一并列为本案之参考前案。 
发明内容
因此，本发明的目的，在于提供一种可供绝缘材料包覆并且设置发光晶粒以形成发光二极管的导线架料片。 
本发明的另一目的，在于提供一种前述导电支架与绝缘材料结合的封装结构，该封装结构不需因为打线需求而增加凹穴空间，且发光晶粒封装后，亦具有较佳的出光均匀性。 
本发明的再一目的，在于提供一种应用前述封装结构所制成的发光二极管封装结构。 
本发明的又一目的，在于提供一种制程较简单且材料成本较低廉的发光二极管封装结构。 
于是，本发明封装结构可供设置一发光晶粒并打接金属导线，该封装结构包含一座体、一第一导电支架及一第二导电支架。该座体顶面凹陷形成有一凹穴。该第一导电支架受该座体包覆并且具有一外露于该凹穴而可供设置该发光晶粒的晶粒设置区。该第二导电支架受该座体包覆，该第二导电支架具有一外露于该座体顶面而可供该金属导线一端固定的导接面。 
本发明发光二极管封装结构包含一座体、一第一导电支架、一发光晶粒、一第二导电支架、至少一金属导线以及一封装胶体。该座体顶面凹陷形成有一凹穴。该第一导电支架受该座体包覆并且具有一外露于该凹穴的晶粒设置区。该发光晶粒设置于该晶粒设置区。该第二导电支架受该座体包覆，该第二导电支架具有一高于该发光晶粒并且外露的导接面。该金属导线一端伸入该凹穴并且固定于该发光晶粒，另一端固定于该导接面。该封装胶体填充于该凹穴而封装该发光晶粒。 
本发明导线架料片包含复数相连接的导电支架料片，每一导电支架料片包括一料边以及连接该料边的一第一导电支架及一第二导电支架。该第一导电支架具有一可供设置一发光晶粒的晶粒设置区。该第二导电支架具有一高于本身其它部位并可供金属导线一端固定的导接面。本发明藉由使第二导电支架的局部外露出座体顶面以供金属导线打接，不仅可在不增加凹穴的空间下获得较佳的打线弧度，且亦可获得较薄的封装胶体，使发光晶粒能在短时间内与封装胶体的荧光粉体接触并且转换，以提升出光的均匀性，此外，本发明的座体不论在制程或材料成本上，也都比较简单、低廉。 
附图说明
下面将参照附图，并结合实施例对本发明进行详细的说明和描述： 
图1是美国专利US6,066,861所揭露之发光二极管装置的截面图； 
图2是美国专利US7,129,638所揭露之发光二极管装置的截面图； 
图3是依据本发明导线架料片一个较佳实施例的立体图； 
图4是依据本发明封装结构一个较佳实施例的立体图； 
图5是图4之该封装结构再设置发光晶粒并且打线、设置封装胶体的立体图； 
图6是图5再设置透光镜片的立体图； 
图7是依据本发明发光二极管封装结构一个较佳实施例的立体图；以及 
图8是图7的剖面图。 
具体实施方式
有关本发明之前述及其它技术内容、特点与功效，在以下配合参考图式之一个较佳实施例的详细说明中，将可清楚的呈现。 
参阅图3，本发明导线架料片的一个较佳实施例。 
导线架料片200包含复数个排列连接的导电支架料片2，每一导电支架料片2包括一料边20、一包含一第一导电支架21及一第二导电支架22之导电架组合，其中，导电架组合之第一导电支架21与第二导电支架22透过复数连接段23与料边20连接，并且两导电支架21、22相间隔，实际上，导线架料片200是一金属料片冲切而成，该等导电支架料片2是藉其料边20相连接而呈数组式排列连接，也可以说，环绕该导电架组合之该料边20用以提供固定组件的功能。第一导电支架21具有一晶粒设置区211，第二导电支架22具有一导接部221及一导接面222。在本实施例中，第二导电支架22的导接面222即为其导接部221的顶面，且第二导电支架22的导接部221系被局部往上弯折，使得导接面222之顶面的位置高于第一导电支架21以及第二导电支架22的其余部位。 
本发明封装结构包含一座体及一导电架组合。参阅图3、图4，在本实施例中，座体1是以模内射出成型方式结合在前述的导电支架料片2并且包覆该导电架组合，也就是该第一导电支架21及该第二导电支架22，然而在制造上，系导线架料片200整体冲切完成并且成型座体1于每一导电支架料片2之后，再一并进行固晶及打线的作业。 
座体1的材质可以是环氧树脂或硅胶，且座体1成型时，其顶面11凹陷形成有一使第一导电支架21的晶粒设置区211外露的凹穴12。当座体1包覆该导线架组合时，第二导电支架22的导接面222则外露，在本实施例中，座 体1顶面11的高度是视第二导电支架22被往上弯折之导接部221导接面222的高度而定，使得当座体1成型包覆于第二导电支架22时，第二导电支架22的导接面222实质与座体1的顶面11切齐或者高于座体1的顶面11而外露于座体1顶面11而可供金属导线31连接(见图5)，且第一导电支架21与第二导电支架22均局部外露于座体1外而可供连接外部电源。 
除此之外，在本实施例中，座体1顶面11位于凹穴12周围的区域系为粗糙表面111，该粗糙表面111可以是座体1顶面111形成多数凸粒而构成，至于粗糙表面111的作用稍后说明。 
更进一步的说，如图8所示，本发明发光二极管封装结构包含一座体、一导电架组合、一发光晶粒、至少一金属导线及一封装胶体，请参阅图8。 
参阅图4、图5，在本实施例中，座体1及导电架组合系为前述的封装结构，且当座体1结合于导电支架料片2后，便可将连接导电架组合之第一、第二导电支架21、22与料边20的连接段23切除，由于对应于座体1两侧的料边20仍有部分嵌入座体1内，使得座体1仍可维持于料边20上，换言之，该料边20提供固定座体1之功用，以利后续的制程。发光晶粒30可为发出UV(紫外光)～IR(红外光)的光波段，发光晶粒30设置于第一导电支架21的晶粒设置区211而位于凹穴12内，且此时，第二导电支架22的导接面222仍是高于发光晶粒30，在本实施例中，凹穴12是凹陷成矩形空间，且凹穴12的内壁面120实质呈直立状态，发光晶粒30亦呈矩形，当发光晶粒30设置在凹穴12内时，发光晶粒30的每一侧边缘至其所邻近的凹穴12内壁面120距离均小于0.6mm。 
接着，便可进行打线作业，使金属导线31一端伸入凹穴12内而固定在发光晶粒30的电极接点(图未示)上，另一端则固定于第二导电支架22的导接面222。而值得注意的是，由于供金属导线31连接的第二导电支架22导接部221系外露于座体1顶面11，且在高度位置上高于发光晶粒30，因此，当打线机在将金属导线31打接在第二导电支架22时，便较不会受到凹穴12的空间限制，因此，凹穴12便不必配合打线需求而加大空间，进而，便可让座体1的厚度维持在较低的尺寸，且金属导线31亦同样具有较佳的弯曲弧度，此外，由于座体1系塑料射出成型，因此，相较于美国案US7,129,638，不仅制程较简单，材料成本也比较低廉。 
当金属导线31被打接于发光晶粒30与第二导电支架22的导接面222之后，接着便可将封装胶体32填充于座体1的凹穴12内而封装发光晶粒30，该封装胶体32系混有荧光粉体，且再补充说明的是，由于座体1的凹穴12不必受限于打线作业而增加空间，因此，当封装胶体32填充于座体1的凹穴12内时，便可形成一包覆发光晶粒30的薄层，使发光晶粒30所发出的光线可在短时间内与封装胶体32内含的荧光粉体接触并且转换，以提升出光的均匀性。 
请参阅图6，再将光学镜片33设置于座体1顶面11，覆盖于封装胶体32上方并且涵盖凹穴12周围的顶面11，此处，本实施例在凹穴12周围的顶面11形成粗糙表面111系可加强光学镜片33与座体1的结合强度，避免光学镜片33轻易脱离座体1。 
接着，再将发光二极管封装结构300由料边20移出，便可形成一颗如图7所示独立的发光二极管封装结构300。而该发光二极管封装结构300系可供再排列成数组方式或面光源方式而做更进一步的应用。 
当然，本案的所冲切形成的导电支架料片2结构并不以本实施例所揭露的为限，其主要是在于使其中一导电支架的局部位置移出凹穴12内并且高于发光晶粒30的高度，以便同时可具有较佳的打线弧度以及不需增加凹穴12的空间。 
如上所述，本发明将座体以模内射出方式包覆导线架，并且使第二导电支架的局部外露出座体顶面以供金属导线打接，不仅可在不增加凹穴的空间下获得较佳的打线弧度，且亦可获得较薄的封装胶体，使发光晶粒能在短时间内与封装胶体的荧光粉体接触并且转换，以提升出光的均匀性，此外，本发明的座体相较于陶瓷座体不论在制程或材料成本上，也都比较简单、低廉，且模内成型的座体也较不会有如陶瓷座体容易漏光以及高热阻等问题，故确实能达成本发明之目的。 
惟以上所述者，仅为本发明之较佳实施例而已，当不能以此限定本发明实施之范围，即大凡依本发明申请专利范围及发明说明内容所作之简单的等效变化与修饰，皆仍属本发明专利涵盖之范围内。 

Claims (9)

1.一种封装结构，可供设置一发光晶粒并打接金属导线，该封装结构包含：
一座体，具有一顶面及一凹穴，该凹穴由该顶面凹陷形成；
一第一导电支架，受该座体包覆并且具有一外露于该凹穴而可供设置该发光晶粒的晶粒设置区；以及
一第二导电支架，受该座体包覆，该第二导电支架具有一位于该凹穴外并外露于该座体的该顶面且与该座体顶面切齐而可供该金属导线一端固定的导接面。
2.依据权利要求1所述的封装结构，其特征在于，该第二导电支架更具有一导接部，该导接面为该导接部之顶面，且该第二导电支架系被局部往上弯折而使该导接面高于该发光晶粒。
3.依据权利要求1或2所述的封装结构，其特征在于，该座体顶面位于该凹穴周围之区域为一粗糙表面。
4.一种发光二极管封装结构，包含：
一座体，具有一顶面及一凹穴，该凹穴由该顶面凹陷形成；
一第一导电支架，受该座体包覆并且具有一外露于该凹穴的晶粒设置区；
一发光晶粒，设置于该晶粒设置区；
一第二导电支架，受该座体包覆，该第二导电支架具有一高于该发光晶粒并位于该凹穴外且外露于该座体的该顶面而与该座体顶面切齐的导接面；
至少一金属导线，一端伸入该凹穴并且固定于该发光晶粒，另一端固定于该导接面；以及
一封装胶体，填充于该凹穴而封装该发光晶粒。
5.依据权利要求4所述的发光二极管封装结构，其特征在于，该第二导电支架更具有一导接部，该导接面为该导接部之顶面，且该第二导电支架系被局部往上弯折而使该导接面高于该发光晶粒。
6.依据权利要求4或5所述的发光二极管封装结构，其特征在于，该座体顶面位于该凹穴周围之区域为一粗糙表面，且该发光二极管的封装结构更包含设置于该座体顶面并且覆盖该封装胶体的光学镜片，且该光学镜片涵盖该粗糙表面之区域。
7.依据权利要求6所述的发光二极管封装结构，其特征在于，该粗糙表面系该座体顶面形成多数凸粒构成。
8.依据权利要求4或5所述的发光二极管封装结构，其特征在于，该凹穴具有一实质呈直立的内壁面，该发光晶粒边缘至该内壁面距离小于0.6毫米。
9.依据权利要求4或5所述的发光二极管封装结构，更包含设置于该座体顶面并且覆盖该封装胶体的光学镜片。
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