CN100544007C - 影像感测器封装结构 - Google Patents
影像感测器封装结构 Download PDFInfo
- Publication number
- CN100544007C CN100544007C CNB2005101015058A CN200510101505A CN100544007C CN 100544007 C CN100544007 C CN 100544007C CN B2005101015058 A CNB2005101015058 A CN B2005101015058A CN 200510101505 A CN200510101505 A CN 200510101505A CN 100544007 C CN100544007 C CN 100544007C
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- China
- Prior art keywords
- matrix
- image sensor
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- encapsulation structure
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 45
- 239000011159 matrix material Substances 0.000 claims abstract description 30
- GQWNECFJGBQMBO-UHFFFAOYSA-N Molindone hydrochloride Chemical compound Cl.O=C1C=2C(CC)=C(C)NC=2CCC1CN1CCOCC1 GQWNECFJGBQMBO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 229920006351 engineering plastic Polymers 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 18
- 229920000297 Rayon Polymers 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 229920006380 polyphenylene oxide Polymers 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101015058A CN100544007C (zh) | 2005-11-16 | 2005-11-16 | 影像感测器封装结构 |
US11/525,446 US20070108561A1 (en) | 2005-11-16 | 2006-09-22 | Image sensor chip package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101015058A CN100544007C (zh) | 2005-11-16 | 2005-11-16 | 影像感测器封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1967852A CN1967852A (zh) | 2007-05-23 |
CN100544007C true CN100544007C (zh) | 2009-09-23 |
Family
ID=38039885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101015058A Active CN100544007C (zh) | 2005-11-16 | 2005-11-16 | 影像感测器封装结构 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070108561A1 (zh) |
CN (1) | CN100544007C (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7732914B1 (en) * | 2002-09-03 | 2010-06-08 | Mclellan Neil | Cavity-type integrated circuit package |
CN101320120A (zh) * | 2007-06-07 | 2008-12-10 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
US8138027B2 (en) | 2008-03-07 | 2012-03-20 | Stats Chippac, Ltd. | Optical semiconductor device having pre-molded leadframe with window and method therefor |
US8048708B2 (en) | 2008-06-25 | 2011-11-01 | Micron Technology, Inc. | Method and apparatus providing an imager module with a permanent carrier |
CN101499446B (zh) * | 2009-02-26 | 2013-10-16 | 光宝电子(广州)有限公司 | 导线架料片、封装结构以及发光二极管封装结构 |
CN101692441B (zh) * | 2009-04-16 | 2012-04-11 | 旭丽电子(广州)有限公司 | 一种印刷电路板封装结构 |
CN103166104A (zh) * | 2011-12-13 | 2013-06-19 | 鸿富锦精密工业(深圳)有限公司 | 芯片封装结构及其封装方法 |
KR101462770B1 (ko) | 2013-04-09 | 2014-11-20 | 삼성전기주식회사 | 인쇄회로기판과 그의 제조방법 및 그 인쇄회로기판을 포함하는 반도체 패키지 |
CN103347364A (zh) * | 2013-07-10 | 2013-10-09 | 南昌欧菲光电技术有限公司 | 相机模组封装结构 |
MY184608A (en) * | 2013-12-10 | 2021-04-07 | Carsem M Sdn Bhd | Pre-molded integrated circuit packages |
CN104016296B (zh) * | 2014-06-14 | 2016-04-06 | 山东华芯半导体有限公司 | 一种封装结构和该封装结构的封装方法 |
JP6262086B2 (ja) * | 2014-07-04 | 2018-01-17 | アルプス電気株式会社 | 圧力検出装置 |
TWI611544B (zh) * | 2015-01-16 | 2018-01-11 | 恆勁科技股份有限公司 | 電子封裝結構 |
CN105845635B (zh) | 2015-01-16 | 2018-12-07 | 恒劲科技股份有限公司 | 电子封装结构 |
US9786582B2 (en) * | 2016-01-29 | 2017-10-10 | Texas Instruments Incorporated | Planar leadframe substrate having a downset below within a die area |
CN105810705B (zh) * | 2016-04-12 | 2019-06-14 | 华天科技(昆山)电子有限公司 | 高像素影像传感芯片的封装结构及其制作方法 |
EP3534292A4 (en) * | 2017-11-09 | 2020-07-22 | Shenzhen Goodix Technology Co., Ltd. | OPTICAL MODULE AND PROCESSING METHOD THEREFOR AND TERMINAL DEVICE |
JP2019096778A (ja) * | 2017-11-24 | 2019-06-20 | 京セラ株式会社 | 蓋体および光学装置 |
DE102018122515B4 (de) * | 2018-09-14 | 2020-03-26 | Infineon Technologies Ag | Verfahren zum Herstellen eines Halbleiteroxid- oder Glas-basierten Verbindungskörpers mit Verdrahtungsstruktur |
FR3086459B1 (fr) * | 2018-09-25 | 2021-10-29 | St Microelectronics Grenoble 2 | Dispositif electronique comprenant une puce optique et procede de fabrication |
CN111003682A (zh) * | 2018-10-08 | 2020-04-14 | 凤凰先驱股份有限公司 | 电子封装件及其制法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2587060Y (zh) * | 2002-11-12 | 2003-11-19 | 胜开科技股份有限公司 | 影像感测器模组结构 |
CN2587061Y (zh) * | 2002-11-26 | 2003-11-19 | 胜开科技股份有限公司 | 高散热的影像感测器 |
CN1553512A (zh) * | 2003-06-03 | 2004-12-08 | 胜开科技股份有限公司 | 影像感测器模组及其制造方法 |
CN1664639A (zh) * | 2004-03-05 | 2005-09-07 | 鸿富锦精密工业(深圳)有限公司 | 数码相机模块 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW332348B (en) * | 1992-06-23 | 1998-05-21 | Sony Co Ltd | Manufacturing method for solid state motion picture device provides a highly accurate and low cost solid state motion picture device by use of empty package made of resin. |
US6686588B1 (en) * | 2001-01-16 | 2004-02-03 | Amkor Technology, Inc. | Optical module with lens integral holder |
TW521410B (en) * | 2001-11-15 | 2003-02-21 | Siliconware Precision Industries Co Ltd | Semiconductor package article |
US6480389B1 (en) * | 2002-01-04 | 2002-11-12 | Opto Tech Corporation | Heat dissipation structure for solid-state light emitting device package |
-
2005
- 2005-11-16 CN CNB2005101015058A patent/CN100544007C/zh active Active
-
2006
- 2006-09-22 US US11/525,446 patent/US20070108561A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2587060Y (zh) * | 2002-11-12 | 2003-11-19 | 胜开科技股份有限公司 | 影像感测器模组结构 |
CN2587061Y (zh) * | 2002-11-26 | 2003-11-19 | 胜开科技股份有限公司 | 高散热的影像感测器 |
CN1553512A (zh) * | 2003-06-03 | 2004-12-08 | 胜开科技股份有限公司 | 影像感测器模组及其制造方法 |
CN1664639A (zh) * | 2004-03-05 | 2005-09-07 | 鸿富锦精密工业(深圳)有限公司 | 数码相机模块 |
Also Published As
Publication number | Publication date |
---|---|
CN1967852A (zh) | 2007-05-23 |
US20070108561A1 (en) | 2007-05-17 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD. Free format text: FORMER OWNER: YANGXIN TECHNOLOGY CO., LTD. Effective date: 20121203 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121203 Address after: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee after: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee after: Hon Hai Precision Industry Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee before: Yangxin Technology Co., Ltd. |