CN101692441B - 一种印刷电路板封装结构 - Google Patents

一种印刷电路板封装结构 Download PDF

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CN101692441B
CN101692441B CN200910038769.1A CN200910038769A CN101692441B CN 101692441 B CN101692441 B CN 101692441B CN 200910038769 A CN200910038769 A CN 200910038769A CN 101692441 B CN101692441 B CN 101692441B
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substrate
printed circuit
circuit board
framework
electronic component
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CN101692441A (zh
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蔡佳锡
曾正德
陈子淦
林依婷
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Lite On Electronics Guangzhou Co Ltd
Lite On Technology Corp
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Silitek Electronic Guangzhou Co Ltd
Lite On Technology Corp
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Abstract

本发明一种印刷电路板封装结构，其包括基板和框架，所述框架设于基板上方，其与基板之间形成一收容空间，若干个电子元件安装于基板上，且分布于收容空间中。在本发明中，通过增设框架，使得基板中形成收容空间，用于收纳各种电子元件，框架的保护，使得电子元件可以很好地固定于基板上，也有效地避免了因安装或使用过程中的不慎而造成电子元件的松脱，同时，还可预防在两次回焊过程中，锡膏对电子元件的污染，并增加了承靠面积，制造工艺简单，节约了制作成本。本发明还提供了柔性电路板与软硬结合板作为基板的印刷电路板的封装方法，直接将电子元件固定于基板上，不仅降低了封装结构的厚度，且结构简单。

Description

一种印刷电路板封装结构
技术领域
本发明涉及一种印刷电路板的封装结构，尤指一种用于镜头模组印刷电路板的封装结构。
背景技术
镜头模组印刷电路板是常用的电子元件的承载基板，在一块印刷电路板上往往需要安装很多电子元件，传统的安装方法是在印刷电路板通过挖孔的方式形成局部的收容空间，以放置各种电子元件，但是，这种封装方式制程复杂，难度大，容易造成印刷电路板的破损，同时，由于电子元件的高度不一，安装于印刷电路板上，常出现部分电子元件高出印刷电路板，而致使使用过程中容易发生脱落的现象。
还有另外一种印刷电路板封装方式是将框架与基板通过胶粘的方式相互固定，在胶粘过程中，因加工精度有限，易发生两者相错的微小偏差，另外，框架与基板之间容易发生松动，甚至脱落的问题，影响了电子元件的使用；还有，在安装电子元件时，也常出现因多次焊接造成框架与基板之间胶粘剂的过热溢出的现象。
另外，当基板为比较薄、软及易变形的柔性电路板时，其封装方式为在柔性电路板上另设置一较硬质的基板，如软硬结合板或陶瓷。很显然，这种封装方法需要增加一基板，无法降低封装结构的厚度，且增加基板使得整个封装方法变得比较复杂。
因此，提供一种结构简单稳固、制造容易的印刷电路板封装结构以解决上述问题实为必要。
发明内容
本发明的目的在于提供一种结构简单稳固、制造容易的印刷电路板封装结构。
本发明提供了一种印刷电路板封装结构，其包括基板和框架，所述框架架设于基板上方，其与基板之间形成有一收容空间，若干个电子元件安装于基板上，且分布于收容空间或框架中；所述框架为四方形，所述框架的高度大于或等于电子元件的高度。
优选的是，所述框架与基板的外周边相对齐，亦可延伸至基板的四周或底部，为局部包覆基板侧边或延伸至底部包覆基板，并利用蚀刻电镀将基板和框架作电性连结。
本发明还提供了一种印刷电路板的封装方法，其包括以下几个步骤：
步骤1)将若干个电子元件通过表面贴装技术安装于基板上；
步骤2)利用崁入成型的方式在基板上方或侧边成型一框架，所述框架与基板的外周边相对齐，亦可延伸基板的四周或底部；
步骤3)在基板上通过蚀刻或电镀的方式成型导电孔。
本发明还提供了一种印刷电路板的封装方法，本方法用于当基板为柔性电路板或软硬结合板时对印刷电路板的封装，其包括以下几个步骤：
步骤1)在基板上形成一通孔；
步骤2)将基板及电子元件放置于模具中；
步骤3)通过嵌入成型技术将电子元件固定于柔性电路板或软硬结合板的通孔内，成型封装层。
与现有技术相比，在本发明具有以下几点优点：
1、在结构上：对所述基板的结构作了一定改良，通过增设框架，使得基板中形成用于安装电子元件的收容空间，降低了基板的厚度，减小了基板的大小，增加了承靠面积，增加组合强度，提高制程良率，节约了制作成本；另外，通过框架的保护，可将电子元件很好地包覆于基板的收容空间中，也有效避免了因安装或使用过程中的不慎而造成电子元件的松脱，同时，还可预防在两次回焊过程中，锡膏对电子元件的污染。当基板为柔性电路板或软硬结合板时，直接在基板上设置通孔，再进行封装成型，不仅使得整个结构变得简单，且有效地降低了封装结构的厚度。
2.在制造方法上：通过嵌入成型技术成型框架，不仅使得框架可与基板紧密地结合在一起，结合稳固，克服了现有技术中框架与基板之间因通过胶粘固定，而致使框架容易发生松动，甚至脱落的问题，避免了在安装电子元件时，多次焊接造成框架与基板之间胶粘剂的过热溢出的现象，而且，制程更为简单，也提升了良品率，从而提高了生产效率，降低了制造成本。
为使本发明更加容易理解，下面将结合附图进一步阐述本发明不同的具体实施例。
附图说明
图1为本发明印刷电路板封装结构的组装图；
图2A-2B为本发明封装方法实施例一的装配示意图；
图2C为本发明封装方法实施例二的装配示意图；
图3A-3C为本发明封装方法实施例四的装配示意图。
具体实施方式
参照图1及图2B所示，本发明提供了一种印刷电路板封装结构，包括可拆卸地固定在一起的基板1和框架2，所述基板1用于承载电子元件4，所述框架2架设于基板1上方，其与基板1之间形成有一收容空间3，所述电子元件4安装于基板1上，且分布于收容空间3或框架2内。
所述基板1上设有复数个焊点，用于供其与电子元件4电性连接，基板1与电子元件4之间可通过打线或球间阵列(ball gate array，BGA)中任一种方式电性连接在一起。在本实施例中，所述电子元件4通过复数个金线以打线的方式与基板1上的焊点电性连接。根据具体需求和基板的大小，选择安装的电子元件的大小和个数。所述基板1的形状不受限制，可为矩形、菱形、正方形或其他不规则的形状。所述基板1的材质可为印刷电路板(PCB，printedcircuit board)、柔性线路板(FPC)、软硬结合板(rigid flex)或陶瓷等。
所述电子元件4可为主动元件或被动元件的一种或多种，所述被动元件包括有各种电阻、电容、电感、变压模块、感测元件等，所述感测元件可为CCD、CMOS。
所述框架2由热塑性材料制成，其颜色为黑色，框架2为局部包覆基板1的侧边或延伸至基板1的底部，为局部包覆基板1侧边或延伸至底部包覆基板1，直接将电子元件4包覆起来。所述框架2为一四方形框架，并在框架2上成型复数个导电孔22，所述复数个导电孔22将基板1与框架2电性连接，所述导电孔22可通过蚀刻或电镀的方式形成，所述框架2与基板1的外周边相对齐，或延伸至基板1的四周或底部，架设在基板1上形成框架，包围在基板1的四周，与基板1之间形成一收容空间3，所述收容空间3呈四方形，其由所述框架2包围而成，用于收纳所述电子元件4，换言之，所述电子元件4安装于基板1中，并收纳于收容空间3中。所述框架2的高度大于或等于电子元件4的高度。这样，当电子元件4被安装在所述收容空间3中时，包裹于其四周的框架2可对电子元件4起到一定的保护作用。
参照图1，可选择的是，本发明印刷电路板的封装结构进一步包括封装层5，可由热塑性材料制成(如橡胶，)其填充于收容空间3内，将整个电子元件4包覆，以稳定电子元件。以下提供了几种印刷电路板的封装方法。参照图1及图2A-图2B所示。在第一实施例中，印刷电路板的封装方法包括以下几个步骤：
步骤1)将若干个电子元件4通过表面贴装技术安装于基板1上；
步骤2)通过嵌入成型技术在基板1上方成型一框架2，所述框架2与基板1的外周边相对齐，或延伸至基板1的四周或底部。
参见图2A，在步骤1)中，首先，提供一基板1，其上布置有电子线路，然后，通过表面贴装技术将电子元件4贴装于基板1上，通过电子线路可实现电子元件4之间的电性连接，并支持其相互间工作。
参见图2B，然后进入步骤2)，通过嵌入成型技术在基板1上方成型一框架2，所述框架2沿基板1的外周边竖直地向上延伸，所述框架2与基板1的外周边相对齐，在框架2与基板1之间形成收容空间3，若干个电子元件4则置放于收容空间3中，电子元件4的高度低于或高于框架2的高度，这样，通过框架2的保护，可将电子元件4很好地包覆于基板1的收容空间3中，也有效避免了因安装或使用过程中的不慎而造成电子元件4的松脱。优选的是，在成型框架2时，亦可将框架2沿基板1的外周延伸，并延伸至基板1的的四周或底部，为局部包覆基板1侧边或延伸至基板1底部包覆。
这样，通过嵌入成型技术成型框架2，不仅使得框架2可与基板1紧密地结合在一起，结合稳固，克服了现有技术中框架2与基板1之间因通过胶粘固定，而致使框架2容易发生松动，甚至脱落的问题，而且，制程更为简单，也提升了良品率，从而提高了生产效率，降低了制造成本。
在本发明的实施例二中，与本发明实施例一不同的是，将步骤1)与步骤2)之间的次序相互替换，同样可实现本发明，即先在基板上形成一框架2，框架2与基板1形成一收容空间3(参见图2C)，所述框架2的特征于本发明实施例一的相同，再将电子元件4通过表面粘帖技术安装于基板1上。
可供选择的是，无论在实施例一还是在实施例二中，由于框架2对电子元件4封装不完全，亦可以选择对电子元件4进行再封装，形成封装层5(参见图1)，当然，此步骤也可以省略。对电子元件4的封装技术已经很成熟，在本发明中就不赘述。
在本发明的实施例三中参照图1，在上述本发明的实施例中，还可进一步包括步骤3)在框架2的侧面通过蚀刻或电镀的方式成型复数个与基板1电性连接的导电孔22。
在本发明中，所述基板的结构作了一定改良，通过增设框架，使得基板中形成收容空间，用于收纳各种电子元件，而不需要在基板中通过挖孔的方式放置电子元件，制造工艺相对简单；并且，也降低了基板的厚度，节约了制作成本；另外，通过框架的保护，可将电子元件很好地包覆于基板的收容空间中，也有效避免了因安装或使用过程中的不慎而造成电子元件的松脱，同时，还可预防在两次回焊过程中，锡膏对电子元件的污染，并增加了承靠面积。并且在成型框架时，利用框架直接对电子元件进行封装，在利用局部蚀刻电镀的方式作电性链接，节省制作时间于成本。
参照图3A-3C，本发明公开的封装方法的第四实施例，该方法用于基板为柔性电路板或软硬结合板时对印刷电路板的封装，其包括以下几个步骤：
步骤1)在基板11上形成一通孔12；
步骤2)将基板11及电子元件14放置于模具中；
步骤3)通过嵌入成型术将电子元件14固定于基板11的通孔12内，成型封装层15。
其中，步骤1)中首先提供一基板11，并在基板11上采用凿刻打孔的方法开设一通孔12。所述通孔12的的直径大于电子元件14的直径，足够电子元件14放置于通孔内，并留有一定的空隙，方便下一步对电子元件14的封装。
在步骤2)中，需要将基板11与电子元件14一起放置与模具(图未示)中，并且电子元件14放置于通孔12内，电子元件14的高度高于基板11的高度，基板11完全包围于所述电子元件14的外周。不需要再增加一硬质板将电子元件14放置于其上，，避免了焊接过程中锡膏对基板11的污染，且降低了封装结构的厚度，使得封装结构的厚度即为电子元件14的厚度。
在步骤3)中，通过嵌入成型技术将电子元件14包裹起来，固定于通孔12内，成型封装层15。之后，再根据需要再进行打线，将电子元件14和基板11连接。
本发明所述的用于柔性电路板作为基板的印刷电路板的封装方法，直接将电子元件14与基板固定，取代了传统的增加硬质板的步骤，使得封装过程更加简化，同时又节省了原料，并且降低了封装结构的厚度。
惟以上所述者，仅为本发明的较佳实施例而已，当不能以此限定本发明实施的范围，即大凡依本发明权利要求及发明说明书所记载的内容所作出简单的等效变化与修饰，皆仍属本发明权利要求所涵盖范围之内。

Claims (9)

1.一种印刷电路板封装结构，其特征在于包括基板和框架，所述框架架设于基板上方，其与基板之间形成有一收容空间，若干个电子元件安装于基板上，且分布于收容空间中或框架內，所述框架与基板的外周边相对齐，亦可延伸至基板的四周或底部，为局部包覆基板侧边或延伸至底部包覆基板；还包括封装层，所述封装层填充于收容空间内，将电子元件包裹。
2.根据权利要求1所述的印刷电路板封装结构，其特征在于：所述框架和基板的连接为利用蚀刻电镀作电性连结。
3.根据权利要求1所述的印刷电路板封装结构，其特征在于：所述框架的高度大于或等于电子元件的高度。
4.根据权利要求1所述的印刷电路板封装结构，其特征在于：所述基板的材质为印刷电路板、柔性线路板、软硬结合板或陶瓷。
5.根据权利要求2所述的印刷电路板封装结构，其特征在于：所述框架由热塑性材料制成。
6.一种印刷电路板的封装方法，其包括以下几个步骤：
步骤1)将若干个电子元件通过表面贴装技术安装于基板上；
步骤2)利用崁入成型的方式在基板上方或侧边成型一框架，所述框架延伸基板的四周或底部；
步骤3)在基板上通过蚀刻或电镀的方式成型导电孔；
步骤4)对电子元件进行再封装，形成封装层。
7.根据权利要求6所述的印刷电路板的封装方法，其特征在于，所述步骤1)与步骤2)可替换。
8.一种印刷电路板的封装方法，其包括以下几个步骤：
步骤1)在基板上形成一通孔；
步骤2)将基板及电子元件放置于模具中；
步骤3)通过嵌入成型技术将电子元件固定于基板的通孔内，成型封装层。
9.根据权利要求8所述的印刷电路板的封装方法，其特征在于：所述基板为柔性电路板或软硬结合板。
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