DE69007409T2 - Leiterplatte aus Aluminiumnitrid. - Google Patents
Leiterplatte aus Aluminiumnitrid.Info
- Publication number
- DE69007409T2 DE69007409T2 DE69007409T DE69007409T DE69007409T2 DE 69007409 T2 DE69007409 T2 DE 69007409T2 DE 69007409 T DE69007409 T DE 69007409T DE 69007409 T DE69007409 T DE 69007409T DE 69007409 T2 DE69007409 T2 DE 69007409T2
- Authority
- DE
- Germany
- Prior art keywords
- aluminum nitride
- pcb made
- pcb
- nitride
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24908089 | 1989-09-27 | ||
JP24245190A JP2831827B2 (ja) | 1989-09-27 | 1990-09-14 | 回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69007409D1 DE69007409D1 (de) | 1994-04-21 |
DE69007409T2 true DE69007409T2 (de) | 1994-07-28 |
Family
ID=26535758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69007409T Expired - Lifetime DE69007409T2 (de) | 1989-09-27 | 1990-09-27 | Leiterplatte aus Aluminiumnitrid. |
Country Status (3)
Country | Link |
---|---|
US (1) | US5041700A (de) |
EP (1) | EP0421680B1 (de) |
DE (1) | DE69007409T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0494585A (ja) * | 1990-08-10 | 1992-03-26 | Cmk Corp | プリント配線板 |
US5500301A (en) * | 1991-03-07 | 1996-03-19 | Kabushiki Kaisha Kobe Seiko Sho | A1 alloy films and melting A1 alloy sputtering targets for depositing A1 alloy films |
US5155661A (en) * | 1991-05-15 | 1992-10-13 | Hewlett-Packard Company | Aluminum nitride multi-chip module |
US5221639A (en) * | 1991-10-20 | 1993-06-22 | Motorola, Inc. | Method of fabricating resistive conductive patterns on aluminum nitride substrates |
JPH05218229A (ja) * | 1992-01-28 | 1993-08-27 | Toshiba Corp | セラミック回路基板 |
US5315069A (en) * | 1992-10-02 | 1994-05-24 | Compaq Computer Corp. | Electromagnetic radiation reduction technique using grounded conductive traces circumscribing internal planes of printed circuit boards |
JP3314616B2 (ja) * | 1995-10-05 | 2002-08-12 | 株式会社デンソー | 大出力用半導体レーザ素子 |
US6586683B2 (en) | 2001-04-27 | 2003-07-01 | International Business Machines Corporation | Printed circuit board with mixed metallurgy pads and method of fabrication |
US7476289B2 (en) * | 2006-06-29 | 2009-01-13 | Applied Materials, Inc. | Vacuum elastomer bonding apparatus and method |
US8023269B2 (en) * | 2008-08-15 | 2011-09-20 | Siemens Energy, Inc. | Wireless telemetry electronic circuit board for high temperature environments |
CN101692441B (zh) * | 2009-04-16 | 2012-04-11 | 旭丽电子(广州)有限公司 | 一种印刷电路板封装结构 |
JP6870767B2 (ja) * | 2019-09-02 | 2021-05-12 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、及び、絶縁回路基板 |
CN112851406B (zh) * | 2021-01-21 | 2022-07-15 | 清华大学 | 一种在氮化铝陶瓷表面敷镍或敷镍合金的方法 |
CN113161297B (zh) * | 2021-03-08 | 2022-07-22 | 潮州三环(集团)股份有限公司 | 一种陶瓷封装基座 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3587481T2 (de) * | 1984-02-27 | 1993-12-16 | Toshiba Kawasaki Kk | Schaltungssubstrat mit hoher Wärmeleitfähigkeit. |
US4695517A (en) * | 1985-05-31 | 1987-09-22 | Ngk Spark Plug Co., Ltd. | Composite layer aluminum nitride base sintered body |
JPS62197379A (ja) * | 1986-02-20 | 1987-09-01 | 株式会社東芝 | 窒化アルミニウム基板 |
US4770953A (en) * | 1986-02-20 | 1988-09-13 | Kabushiki Kaisha Toshiba | Aluminum nitride sintered body having conductive metallized layer |
JPS62207789A (ja) * | 1986-03-08 | 1987-09-12 | 日本特殊陶業株式会社 | 窒化アルミニウム製基材の表面構造及びその製造法 |
US4906511A (en) * | 1987-02-12 | 1990-03-06 | Kabushiki Kaisha Toshiba | Aluminum nitride circuit board |
JP2544398B2 (ja) * | 1987-08-27 | 1996-10-16 | 富士通株式会社 | A1nセラミックスのメタライズ方法 |
DE68922118T2 (de) * | 1988-01-25 | 1995-10-12 | Toshiba Kawasaki Kk | Schaltungsplatte. |
US4908348A (en) * | 1988-02-08 | 1990-03-13 | Eastman Kodak Company | Barrier layer arrangement for conductive layers on silicon substrates |
-
1990
- 1990-09-27 DE DE69007409T patent/DE69007409T2/de not_active Expired - Lifetime
- 1990-09-27 US US07/588,928 patent/US5041700A/en not_active Expired - Lifetime
- 1990-09-27 EP EP90310622A patent/EP0421680B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0421680A1 (de) | 1991-04-10 |
US5041700A (en) | 1991-08-20 |
EP0421680B1 (de) | 1994-03-16 |
DE69007409D1 (de) | 1994-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |