DE68922118T2 - Schaltungsplatte. - Google Patents

Schaltungsplatte.

Info

Publication number
DE68922118T2
DE68922118T2 DE68922118T DE68922118T DE68922118T2 DE 68922118 T2 DE68922118 T2 DE 68922118T2 DE 68922118 T DE68922118 T DE 68922118T DE 68922118 T DE68922118 T DE 68922118T DE 68922118 T2 DE68922118 T2 DE 68922118T2
Authority
DE
Germany
Prior art keywords
circuit board
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68922118T
Other languages
English (en)
Other versions
DE68922118D1 (de
Inventor
Takaaki Yasumoto
Nobuo Iwase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1268788A external-priority patent/JPH01189191A/ja
Priority claimed from JP20860288A external-priority patent/JP2703276B2/ja
Priority claimed from JP27793188A external-priority patent/JP2664744B2/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE68922118D1 publication Critical patent/DE68922118D1/de
Publication of DE68922118T2 publication Critical patent/DE68922118T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE68922118T 1988-01-25 1989-01-24 Schaltungsplatte. Expired - Fee Related DE68922118T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1268788A JPH01189191A (ja) 1988-01-25 1988-01-25 回路基板
JP20860288A JP2703276B2 (ja) 1988-08-23 1988-08-23 窒化アルミニウム薄膜回路基板
JP27793188A JP2664744B2 (ja) 1988-11-02 1988-11-02 窒化アルミニウム薄膜回路基板

Publications (2)

Publication Number Publication Date
DE68922118D1 DE68922118D1 (de) 1995-05-18
DE68922118T2 true DE68922118T2 (de) 1995-10-12

Family

ID=27279943

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68922118T Expired - Fee Related DE68922118T2 (de) 1988-01-25 1989-01-24 Schaltungsplatte.

Country Status (3)

Country Link
US (1) US4963701A (de)
EP (1) EP0326077B1 (de)
DE (1) DE68922118T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041700A (en) * 1989-09-27 1991-08-20 Kabushiki Kaisha Toshiba Circuit board including an aluminum nitride substrate and a multilayered metal oxynitride structure
CA2031902A1 (en) * 1989-12-20 1991-06-21 Dorothy L. Lukco Coated reinforcements for high temperature compositions and composites made therefrom
US5273833A (en) * 1989-12-20 1993-12-28 The Standard Oil Company Coated reinforcements for high temperature composites and composites made therefrom
US5156912A (en) * 1989-12-20 1992-10-20 The Standard Oil Company Multi-layer coatings for reinforcements in high temperature composites
US5221639A (en) * 1991-10-20 1993-06-22 Motorola, Inc. Method of fabricating resistive conductive patterns on aluminum nitride substrates
US5474834A (en) * 1992-03-09 1995-12-12 Kyocera Corporation Superconducting circuit sub-assembly having an oxygen shielding barrier layer
JPH0798460A (ja) * 1992-10-21 1995-04-11 Seiko Instr Inc 半導体装置及び光弁装置
US5536908A (en) * 1993-01-05 1996-07-16 Schlumberger Technology Corporation Lead-free printed circuit assembly
JP3593707B2 (ja) * 1993-03-19 2004-11-24 住友電気工業株式会社 窒化アルミニウムセラミックスとその製造方法
US6696103B1 (en) 1993-03-19 2004-02-24 Sumitomo Electric Industries, Ltd. Aluminium nitride ceramics and method for preparing the same
US5496437A (en) * 1993-06-10 1996-03-05 Ceram Incorporated Reactive ion etching of lead zirconate titanate and ruthenium oxide thin films
JPH07109573A (ja) * 1993-10-12 1995-04-25 Semiconductor Energy Lab Co Ltd ガラス基板および加熱処理方法
JP3845925B2 (ja) * 1996-02-05 2006-11-15 住友電気工業株式会社 窒化アルミニウム基材を用いた半導体装置用部材及びその製造方法
US6821821B2 (en) * 1996-04-18 2004-11-23 Tessera, Inc. Methods for manufacturing resistors using a sacrificial layer
GB9710514D0 (en) * 1996-09-21 1997-07-16 Philips Electronics Nv Electronic devices and their manufacture
JP3457826B2 (ja) * 1997-01-31 2003-10-20 株式会社リコー 薄膜式抵抗体及びその製造方法、流量センサ、湿度センサ、ガスセンサ、温度センサ
US6084282A (en) * 1997-04-01 2000-07-04 Candescent Technologies Corporation Low-stress and low-sensitivity metal film
KR100244251B1 (ko) * 1997-06-19 2000-02-01 김영환 반도체 소자의 커패시터 제조 방법
EP0970932A1 (de) * 1998-07-10 2000-01-12 Sumitomo Electric Industries, Ltd. Keramisches Trägermaterial
JP2000114691A (ja) * 1998-10-07 2000-04-21 Matsushita Electric Ind Co Ltd 配線回路基板の製造方法
DE19850592C1 (de) * 1998-11-03 2000-10-12 Lpkf Laser & Electronics Ag Haftvermittlerschicht zur Erzeugung haftfester Leiterstrukturen auf Isoliermaterialien der Elektronik
US6331678B1 (en) * 1999-10-29 2001-12-18 Agilent Technologies, Inc. Reduction of blistering and delamination of high-temperature devices with metal film
US6515233B1 (en) * 2000-06-30 2003-02-04 Daniel P. Labzentis Method of producing flex circuit with selectively plated gold
US6787706B2 (en) * 2001-02-21 2004-09-07 Kyocera Corporation Ceramic circuit board
JP4030285B2 (ja) * 2001-10-10 2008-01-09 株式会社トクヤマ 基板及びその製造方法
JP4405247B2 (ja) 2003-11-28 2010-01-27 株式会社ワコム 座標入力装置のセンス部
JP4346541B2 (ja) * 2004-11-26 2009-10-21 日東電工株式会社 配線回路基板およびその製造方法
TWI322652B (en) * 2007-11-06 2010-03-21 Yu Hsueh Lin Structure and manufacturing method of circuit substrate board
US8217514B2 (en) * 2008-04-07 2012-07-10 Stats Chippac Ltd. Integrated circuit packaging system with warpage control system and method of manufacture thereof
US8621749B2 (en) 2010-03-12 2014-01-07 Taiwan Green Point Enterprises Co., Ltd Non-deleterious technique for creating continuous conductive circuits
US20120273261A1 (en) 2010-10-20 2012-11-01 Taiwan Green Point Enterprises Co., Ltd. Circuit substrate having a circuit pattern and method for making the same
US8952919B2 (en) 2011-02-25 2015-02-10 Taiwan Green Point Enterprises Co., Ltd. Capacitive touch sensitive housing and method for making the same
CN106328544A (zh) * 2016-08-24 2017-01-11 浙江德汇电子陶瓷有限公司 氮化物陶瓷覆铜板的图形化方法及氮化物陶瓷覆铜板
US11206734B1 (en) * 2020-06-08 2021-12-21 Roger Huang Electronic device and wiring structure thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904461A (en) * 1972-10-02 1975-09-09 Bendix Corp Method of manufacturing solderable thin film microcircuit with stabilized resistive films
JPS5598871A (en) * 1979-01-22 1980-07-28 Semiconductor Res Found Static induction transistor
EP0028802B1 (de) * 1979-11-05 1983-08-17 Hitachi, Ltd. Elektrisch isolierendes Substrat und Verfahren zur Herstellung eines solchen Substrats
JPS59123226A (ja) * 1982-12-28 1984-07-17 Fujitsu Ltd 半導体装置の製造装置
JPS6032343A (ja) * 1983-08-02 1985-02-19 Toshiba Corp パワ−半導体モジユ−ル基板
JPS61288401A (ja) * 1985-06-14 1986-12-18 株式会社村田製作所 薄膜抵抗体
JPS6273799A (ja) * 1985-09-27 1987-04-04 日本電気株式会社 多層セラミツク配線基板
US4783716A (en) * 1986-01-30 1988-11-08 Canon Kabushiki Kaisha Charging or discharging device
JPH0794355B2 (ja) * 1986-01-31 1995-10-11 住友電気工業株式会社 金属化面を有する窒化アルミニウム焼結体の製造方法
JPS62219693A (ja) * 1986-03-20 1987-09-26 富士通株式会社 薄膜多層セラミツク回路基板

Also Published As

Publication number Publication date
US4963701A (en) 1990-10-16
EP0326077B1 (de) 1995-04-12
DE68922118D1 (de) 1995-05-18
EP0326077A3 (de) 1991-01-02
EP0326077A2 (de) 1989-08-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee