CN1885908B - 照相模组 - Google Patents
照相模组 Download PDFInfo
- Publication number
- CN1885908B CN1885908B CN2005100355546A CN200510035554A CN1885908B CN 1885908 B CN1885908 B CN 1885908B CN 2005100355546 A CN2005100355546 A CN 2005100355546A CN 200510035554 A CN200510035554 A CN 200510035554A CN 1885908 B CN1885908 B CN 1885908B
- Authority
- CN
- China
- Prior art keywords
- microscope base
- image sensor
- substrate
- sensing wafer
- image sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Microscoopes, Condenser (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (5)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005100355546A CN1885908B (zh) | 2005-06-24 | 2005-06-24 | 照相模组 |
US11/402,467 US7643081B2 (en) | 2005-06-24 | 2006-04-12 | Digital camera module with small sized image sensor chip package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005100355546A CN1885908B (zh) | 2005-06-24 | 2005-06-24 | 照相模组 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1885908A CN1885908A (zh) | 2006-12-27 |
CN1885908B true CN1885908B (zh) | 2010-04-28 |
Family
ID=37566834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005100355546A Expired - Fee Related CN1885908B (zh) | 2005-06-24 | 2005-06-24 | 照相模组 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7643081B2 (zh) |
CN (1) | CN1885908B (zh) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101181122B1 (ko) * | 2006-05-11 | 2012-09-14 | 엘지이노텍 주식회사 | 렌즈 하우징 일체형 카메라 모듈 |
CN101114039A (zh) * | 2006-07-28 | 2008-01-30 | 鸿富锦精密工业(深圳)有限公司 | 镜头模块 |
CN100483725C (zh) * | 2006-07-28 | 2009-04-29 | 鸿富锦精密工业(深圳)有限公司 | 影像感测器封装及其应用的数码相机模组 |
CN100483726C (zh) * | 2006-07-28 | 2009-04-29 | 鸿富锦精密工业(深圳)有限公司 | 影像感测器封装及其应用的数码相机模组 |
CN101132478A (zh) * | 2006-08-23 | 2008-02-27 | 鸿富锦精密工业(深圳)有限公司 | 影像感测器封装及其应用的数码相机模组 |
CN101281284A (zh) * | 2007-04-04 | 2008-10-08 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
CN101286520A (zh) * | 2007-04-10 | 2008-10-15 | 鸿富锦精密工业(深圳)有限公司 | 影像感测晶片封装结构及其封装方法 |
CN101285921A (zh) * | 2007-04-13 | 2008-10-15 | 鸿富锦精密工业(深圳)有限公司 | 成像模组 |
CN100561280C (zh) * | 2007-05-30 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | 相机模组及其制造方法 |
CN101359080B (zh) * | 2007-08-01 | 2011-02-02 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
CN101359081B (zh) * | 2007-08-03 | 2010-09-29 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
CN101436603B (zh) * | 2007-11-14 | 2010-11-10 | 鸿富锦精密工业(深圳)有限公司 | 成像模组 |
CN101620303B (zh) * | 2008-06-30 | 2011-06-08 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
TWI411863B (zh) * | 2008-07-11 | 2013-10-11 | Hon Hai Prec Ind Co Ltd | 相機模組 |
JP2009253427A (ja) | 2008-08-25 | 2009-10-29 | Cheng Uei Precision Industry Co Ltd | カメラモジュールとその製造方法 |
KR20110064156A (ko) * | 2009-12-07 | 2011-06-15 | 삼성전자주식회사 | 촬상 장치 및 그 제조방법 |
TWI425597B (zh) * | 2009-12-31 | 2014-02-01 | Kingpak Tech Inc | 具有黑色膠體之影像感測器封裝結構 |
KR101141011B1 (ko) | 2010-05-18 | 2012-05-02 | 삼성전기주식회사 | 카메라모듈 |
US10663714B2 (en) | 2010-10-28 | 2020-05-26 | Endochoice, Inc. | Optical system for an endoscope |
US10191189B2 (en) * | 2012-09-14 | 2019-01-29 | Konica Minolta, Inc. | Optical lens, optical lens unit, and imaging device |
CN107003495A (zh) * | 2014-11-27 | 2017-08-01 | 松下知识产权经营株式会社 | 成像设备 |
CN118102054A (zh) | 2016-01-25 | 2024-05-28 | Lg伊诺特有限公司 | 相机模块和光学设备 |
KR102492321B1 (ko) * | 2016-01-28 | 2023-01-26 | 엘지이노텍 주식회사 | 카메라 모듈 및 광학기기 |
KR102551233B1 (ko) * | 2016-01-25 | 2023-07-05 | 엘지이노텍 주식회사 | 카메라 모듈 및 광학기기 |
US10070028B2 (en) * | 2016-02-10 | 2018-09-04 | Microsoft Technology Licensing, Llc | Optical systems and methods of use |
CN107167893B (zh) * | 2016-03-08 | 2019-10-18 | 光宝电子(广州)有限公司 | 影像调焦结构 |
CN105979127A (zh) * | 2016-06-22 | 2016-09-28 | 河源市新天彩科技有限公司 | 一种防水式摄像头 |
US10338340B2 (en) * | 2017-08-23 | 2019-07-02 | Funder Electrical Global Co., Ltd. | Visual camera bearing structure capable of supporting barrel lens of a large area |
CN110649047A (zh) * | 2018-06-26 | 2020-01-03 | 三赢科技(深圳)有限公司 | 感光芯片封装结构及其形成方法 |
FR3086459B1 (fr) * | 2018-09-25 | 2021-10-29 | St Microelectronics Grenoble 2 | Dispositif electronique comprenant une puce optique et procede de fabrication |
CN111698392B (zh) * | 2019-03-12 | 2022-01-07 | 杭州海康威视数字技术股份有限公司 | 摄像机 |
WO2020243934A1 (zh) * | 2019-06-05 | 2020-12-10 | 深圳市汇顶科技股份有限公司 | 光学图像采集装置和电子设备 |
US11237338B2 (en) * | 2019-12-27 | 2022-02-01 | Lumentum Operations Llc | Optical element holder with a protruding feature to hold a chamfered optical element |
KR102269125B1 (ko) * | 2020-07-20 | 2021-06-25 | 엘지이노텍 주식회사 | 카메라 모듈 |
CN114268709A (zh) * | 2020-09-16 | 2022-04-01 | 手持产品公司 | 图像捕获装置的壳体 |
CN112698463A (zh) * | 2020-12-29 | 2021-04-23 | 豪威光电子科技(上海)有限公司 | 光学元件的封装结构及封装方法 |
TWI799943B (zh) * | 2021-08-12 | 2023-04-21 | 致伸科技股份有限公司 | 鏡頭模組與應用於其中之製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1433081A (zh) * | 2002-01-18 | 2003-07-30 | 胜开科技股份有限公司 | 影像感测器及其封装方法 |
CN2607703Y (zh) * | 2003-03-17 | 2004-03-24 | 鸿富锦精密工业(深圳)有限公司 | 数码相机 |
CN2657027Y (zh) * | 2003-10-13 | 2004-11-17 | 鸿富锦精密工业(深圳)有限公司 | 数码相机模组 |
CN2665733Y (zh) * | 2003-11-22 | 2004-12-22 | 鸿富锦精密工业(深圳)有限公司 | 数码相机镜头模组 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002062465A (ja) * | 2000-08-16 | 2002-02-28 | Sony Corp | 光学部品連結装置およびそれを用いた光学モジュール |
JP2003198897A (ja) * | 2001-12-27 | 2003-07-11 | Seiko Epson Corp | 光モジュール、回路基板及び電子機器 |
US20040113048A1 (en) * | 2002-12-16 | 2004-06-17 | Tu Hsiu Wen | Image sensor module |
US6934065B2 (en) | 2003-09-18 | 2005-08-23 | Micron Technology, Inc. | Microelectronic devices and methods for packaging microelectronic devices |
-
2005
- 2005-06-24 CN CN2005100355546A patent/CN1885908B/zh not_active Expired - Fee Related
-
2006
- 2006-04-12 US US11/402,467 patent/US7643081B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1433081A (zh) * | 2002-01-18 | 2003-07-30 | 胜开科技股份有限公司 | 影像感测器及其封装方法 |
CN2607703Y (zh) * | 2003-03-17 | 2004-03-24 | 鸿富锦精密工业(深圳)有限公司 | 数码相机 |
CN2657027Y (zh) * | 2003-10-13 | 2004-11-17 | 鸿富锦精密工业(深圳)有限公司 | 数码相机模组 |
CN2665733Y (zh) * | 2003-11-22 | 2004-12-22 | 鸿富锦精密工业(深圳)有限公司 | 数码相机镜头模组 |
Also Published As
Publication number | Publication date |
---|---|
US20060290802A1 (en) | 2006-12-28 |
CN1885908A (zh) | 2006-12-27 |
US7643081B2 (en) | 2010-01-05 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD. Free format text: FORMER OWNER: YANGXIN TECHNOLOGY CO., LTD. Effective date: 20121203 |
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TR01 | Transfer of patent right |
Effective date of registration: 20121203 Address after: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee after: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee after: Hon Hai Precision Industry Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee before: Yangxin Technology Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100428 Termination date: 20180624 |
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CF01 | Termination of patent right due to non-payment of annual fee |