1376558 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種照相模組，特別係關於一種用於 如行動電话、PDA(Personal Digital Assistant)等小型便攜 式電子裝置之照相模紐。 【先前技術】 目前，行動電話向著多功能之趨勢發展，具有照相 功能之行動電話一經推出即倍受歡迎。應用於行動電話 之知相模組不僅要滿足輕薄短小之要求，其亦須具有較 好的照相性能。 請參閱第一圖所示之一習知照相模組，其包括一鏡 座11、一鏡頭12及一影像感測器13 ^該鏡座u係中空 筒狀，其内壁上設有内螺紋11〇。該鏡頭12包括一鏡筒 121’ 一非球面鏡片122，一紅外濾光鏡片123及一蓋體 124。該鏡筒121之外壁上設有與鏡座u之内螺紋11〇 相配合之外螺紋120,其内部收容固持有鏡片122及紅 外濾光鏡片123。蓋體124固定於鏡筒121 —端且靠近 鏡片122。該蓋體124上設有透光區.125，且該透光區 125與鏡片122之光學中心相對應。該鏡筒121由鏡座 11之一端置入鏡座11之内，並藉由外螺紋12〇與鏡座 11之内螺紋11〇螺鎖。影像感測器π包括基板131、凸 緣132、影像感測晶片133、複數引線丨34及一透光板 135。该基板131係印製電路板，其一面設置有複數第一 接點1311，另一面設置有複數第二接點1312。該凸緣 132呈框形狀並固定設置於基板ι31具有第一接點ΐ3ιι 1376558 面之周邊。影像感測晶片13 3設置於基板131與凸緣 132升^成之谷室内’並固設於基板I]〗上，其藉由引線 134與基板131之第一接點1311相電連接。該透光板135 黏設於凸緣132上以封閉影像感測晶片133及引線 134。該影像感測器13藉由透光板Π5黏著固定於鏡座 U之與鏡頭12相對一端，並藉由調整鏡筒121與鏡座 11間之螺合之深度，以控制鏡頭12之鏡片丨22與影像 感測器13之影像感測晶片133間之距離。 惟’該照相模組之影像感測器13之基板131須同時 谷裝第一接點1311及影像感測晶片13 3，且影像感測器 U3與基板131之凸緣132之内壁之間須提供足夠的空 間供打線器活動，以致於該影像感測器13之體積將遠大 於衫像感測晶片13 3本身之體積。如此，其無法滿足現 行電子產品輕薄短小之要求。另外，由於封閉該影像感 測晶片ί33之空間較大，其較易產生更多粉塵，而導致 影像感測晶片133更易受到污染，影響該照相模组之品 質。 【發明内容】 有鑑於此，提供一種體積較小、且生產良率較高之 照相模組十分必要。 一種照相模組，包括一鏡座、一鏡頭及一影像感測 器’其中，該鏡座呈中空筒狀；該鏡頭包括一鏡筒及至 少一鏡片，該鏡筒一端具有一鏡蓋，該鏡片固設於鏡筒 中，》玄衫像感測器包括一基板、一影像感測晶片、複數 引線、一黏膠及一蓋體，該基板具有一上表面，該上表 1376558 面上設置有複數上焊墊，該影像感測晶片固設於基板上 表面’其設有一感測區及複數晶片焊墊’該引線一端與 景> 像感測晶片之晶片焊塾相電連接’其另一端與基板之 上焊塾相電連接，該黏膠塗佈於影像感測晶片周邊且高 於引線，該蓋體係一透明板，其固設於黏膠上；該鏡頭 安裝設置於鏡座内，且其具鏡蓋一端露於鏡座外，該鏡 座固定於影像感測器上，且影像感測晶片位於鏡頭之光 路中。 相較習知技術，本發明所述之照相模組，其影像感 測晶片位於基板上，係處於一開放之空間，可供打線器 自由活動’因此該影像感測器之基板之面積可儘量縮小 至與S玄影像感測晶片面積幾近相同’因而，可大幅減小 «玄衫像感測器之體積’從而減小該照相模組之體積。且， 邊影像感測晶片之感測區藉由蓋體及黏膠完全封閉，該 封閉空間之表面積較小，產生粉塵較少，可減少粉塵對 影像感測晶片之污染，從而提高該照相模組之品質。 【實施方式】 請參閱第二圖所示，本發明之照相模組一較佳實施 例包括一鏡座20, 一安裝設置於鏡座2〇 一端之鏡頭3〇, 及一固疋於鏡座20另一端且位於鏡頭光路中之影像 感測器40。 該鏡座20大致呈中空筒狀，其具有一内壁（圖未 標），該内壁設有内螺紋201。 該鏡頭30包括一鏡筒3〇1，及至少一片固定於鏡筒 301内之鏡片302。該鏡筒301係一圓筒，其一端固設有 1376558 一鏡蓋303。該鏡筒301具有一外壁（圖未標），該外壁設 有與鏡座2 0之内螺紋2 01相對應之外螺紋3 1^該鏡 蓋303中部開有一通孔3031，該通孔3〇31與鏡片3〇2 共軸設計，以便被攝物反射之光線入射至鏡筒3〇1内之 鏡片302上。 該影像感測器40包括一基板401、一影像感測晶片 402、複數引線403、一黏膠404及一蓋體405。該基板 401係由塑膠、玻璃纖維、強化塑膠或陶瓷等材質所製 成。該基板401具有一上表面（圖未標）及一下表面（圖未 標）’該上表面設置有複數上焊墊4〇11，該下表面設置有 複數分別與上焊墊4011相對應且電連接之下焊墊 4012。該下焊墊4012用於該影像感測器與其他電路板相 電連接。该影像感測晶片402黏著固定於基板4〇 1之上 表面，且其頂面具有一感測區4〇2 i，該感測區4〇2丨周 圍设置有複數晶片焊墊4022。該複數引線403係由黃金 等導電性佳之材料製成，其一端與影像感測晶片4〇2之 晶片焊墊4022固定電連接，另一端則與基板4〇1之上焊 墊4011固定電連接。黏膠4〇4環繞覆蓋於影像感測晶片 23頂面周邊及引線4〇3上，且其覆蓋引線4〇3與晶片焊 塾4022及引線403與基板401之上焊替4011之連接處， 且其鬲於引線403之高度。可以理解，該黏膠4〇4亦可 僅塗佈於影像感測晶片402頂面周邊，且其覆蓋引線403 與晶片焊墊4022之連接處。蓋體4〇5係一透明透光板， 其藉由黏膠404固設於影像感測晶片4〇2上方且其底面 接觸引線403 ’從而將影像感測晶片402之感測區4021 1376558 封閉。 裝配時’於鏡座2G1塗佈—轉50,將該鏡座 套設於該影像感測器40上，並將其藉由黏膠％固定 於基板術之上表面，且基板彻之上焊塾4〇ιι被收容 於鏡座200。然後，將該鏡頭3〇之與鏡蓋3〇3相對之 -端放置於鏡座20内，並藉由鏡筒3〇1之外螺紋规 與鏡座20之内螺紋201之螺合調整鏡頭3〇之位置，使 影像感測晶片402位於鏡片302之焦平面上。最後，於 鏡頭30之鏡筒301露於鏡座2〇外之部分塗佈黏膠％， 以固定該鏡頭30之位置。 可以理解，本實施例中鏡錢一端可設置定位孔(圖 未不），基板401上相對應設置定位柱（圖未示），或者， 鏡座20 —端可設置定位柱（圖未示），基板4〇ι上相對應 設置定位孔（圖未示）’裝配該鏡座2〇於基板4〇1上時， 藉由定位柱與定位孔之配合將鏡座2〇插接於基板4〇ι 上，然後在鏡座20底部周圍塗佈黏膠5〇以完全封閉影 像感測器40。 心 請參閱第三圖所示，本發明照相模組另一較佳實施 例包括一鏡座22，一固定於鏡座22 —端之鏡頭32，及 一固定於鏡座22另一端且位於鏡頭32光路中之影像 測器42。 " 該鏡座22大致呈中空筒狀，其具有一内壁（圖未 標），該内壁設有内螺紋22卜該鏡座22 一端面223向外 延伸一凸緣222。 該鏡頭32包括一鏡筒321、至少—鏡片322、及一 1376558 鏡蓋323，其與前一實施例之鏡頭30之結構大體相同。 該影像感測器42包括一基板421、一影像感測晶片 ' 422、複數引線423、一黏膠424及一蓋體425，其與前 - 一實施例之影像感測器40之結構大體相同。 該鏡座22之内壁所圍成之圓筒之尺寸小於影像感 測器42之蓋體425之尺寸，且其凸緣222内壁所圍成之 圓筒之尺寸略大於影像感測器42之蓋體425之尺寸。 裝配時，於鏡座22之端面223塗佈一黏膠52，將 該鏡座22置於影像感測器42之蓋體425上，使該鏡座 22藉由黏膠52黏著於影像感測器42上。然後，將該鏡 頭32之與鏡蓋323相對之一端放置於鏡座22内，並藉 由鏡筒321之外螺紋3211與鏡座22之内螺紋221之螺 合調整鏡頭32之位置，使影像感測晶片422位於鏡片 322之焦平面上。最後，於鏡頭32之鏡筒321露於鏡座 22外之部分塗佈黏膠52，以固定該鏡頭32之位置。 可以理解，將鏡頭30、32裝設於鏡座20、22上時， 其間之旋轉螺合將會產生粉塵，且該旋轉越多則隨之產 生之粉塵亦越多。為避免產生之粉塵污染影像感測器 40、42，裝配時，可先將鏡頭30、32預裝於鏡座20、 ' 22内，然後，再將預裝有鏡頭30、32之鏡座20、22裝 配於影像感測器40、42上。此時，只需稍微調整鏡頭 30、32之位置，即可將影像感測晶片402、422定位於 鏡片302、322之焦平面上。這樣，可以減少粉塵對影像 感測器40、42之污染，提高該照相模組之品質。 所述照相模組之兩實施例中，其影像感測晶片 1376558 402、422位於基板4(H、421上，係處於一開放之空間， 可供打線器自由活動，因此該影像感測器40、42之基板 之面積可儘量縮小至與該影像感測晶片面積幾近相同， 因而，可大幅減小該影像感測器40、42之體積，從而減 小該照相模組之體積。且，封閉該影像感測晶片402、 422之感測區4021、4221之表面積較小，可減少粉塵產 生以減少粉塵對影像感測晶片402、422之污染，從而提 南該照相模組之品質。 綜上所述，本發明符合發明專利要件，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施例， 舉凡熟悉本案技藝之人士，在援依本案創作精神所作之 等效修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 圖1係一習知照相模組之剖視圖； 圖2係本發明照相模組一較佳實施例之剖視圖； 圖3係本發明照相模組另一較佳實施例之剖視圖。 【主要組件符號說明】 鏡座 20 内螺紋 201 鏡頭 30 鏡同 301 外螺紋 3011 鏡片 302 鏡蓋 303 通孔 3031 影像感測器 40 基板 401 上焊墊 4011 下焊墊 4012 影像感測晶片 402 感測區 4021 1376558 晶片焊墊 4022 引線 403 黏膠 404、50 蓋體 405 鏡座 22 内螺紋 221 凸緣 222 端面 223 鏡頭 32 鏡筒 321 外螺紋 3211 鏡片 322 鏡蓋 323 通孔 3231 影像感測器 42 基板 421 上焊墊 4211 下焊墊 4212 影像感測晶片 422 感測區 4221 晶片焊墊 4222 引線 423 黏膠 424 ' 52 蓋體 425BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a camera module, and more particularly to a camera module for use in a small portable electronic device such as a mobile phone or a PDA (Personal Digital Assistant). [Prior Art] At present, mobile phones are moving toward a multi-functional trend, and mobile phones with camera functions are popular as soon as they are launched. The phase-sensing module used in mobile phones not only has to meet the requirements of lightness and thinness, but also has better photographic performance. Please refer to the conventional camera module shown in FIG. 1 , which includes a lens holder 11 , a lens 12 and an image sensor 13 . The lens holder u is hollow cylindrical and has an internal thread 11 on the inner wall. Hey. The lens 12 includes a lens barrel 121', an aspherical lens 122, an infrared filter lens 123 and a cover 124. The outer wall of the lens barrel 121 is provided with a thread 120 which cooperates with the internal thread 11 of the lens holder u, and houses the lens 122 and the infrared filter lens 123 therein. The cover 124 is fixed to the end of the lens barrel 121 and adjacent to the lens 122. The cover body 124 is provided with a light transmitting area .125, and the light transmitting area 125 corresponds to the optical center of the lens 122. The lens barrel 121 is placed in the lens holder 11 by one end of the lens holder 11, and is screwed by the external thread 12'' and the internal thread 11 of the lens holder 11. The image sensor π includes a substrate 131, a flange 132, an image sensing wafer 133, a plurality of leads 34, and a light transmitting plate 135. The substrate 131 is a printed circuit board having a plurality of first contacts 1311 disposed on one side and a plurality of second contacts 1312 disposed on the other surface. The flange 132 has a frame shape and is fixedly disposed on the periphery of the surface of the substrate ι 31 having the first contact ΐ3ιι 1376558. The image sensing wafer 13 is disposed in the valley of the substrate 131 and the flange 132 and is fixed to the substrate I. The lead 134 is electrically connected to the first contact 1311 of the substrate 131. The light transmissive plate 135 is adhered to the flange 132 to enclose the image sensing wafer 133 and the leads 134. The image sensor 13 is adhered to the opposite end of the lens holder U from the lens holder U by the light-transmitting plate Π5, and the lens of the lens 12 is controlled by adjusting the depth of the screw between the lens barrel 121 and the lens holder 11. 22 is the distance between the image sensing wafer 133 and the image sensor 13. Only the substrate 131 of the image sensor 13 of the camera module must have the first contact 1311 and the image sensing wafer 13 at the same time, and the image sensor U3 and the inner wall of the flange 132 of the substrate 131 are required. Sufficient space is provided for the wire mover to be so that the volume of the image sensor 13 will be much larger than the volume of the shirt image sensing die 13 itself. As such, it cannot meet the requirements of light and thin current electronic products. In addition, since the space for closing the image sensing chip ί33 is large, it is more likely to generate more dust, which causes the image sensing chip 133 to be more susceptible to contamination, affecting the quality of the camera module. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a camera module that is small in size and has a high production yield. A camera module includes a lens holder, a lens and an image sensor. The lens holder has a hollow cylindrical shape. The lens includes a lens barrel and at least one lens. The lens barrel has a mirror cover at one end. The lens is fixed in the lens barrel, and the sensor includes a substrate, an image sensing chip, a plurality of leads, an adhesive, and a cover. The substrate has an upper surface, and the upper surface of the table 1376558 is disposed. a plurality of upper pads, the image sensing wafers are fixed on the upper surface of the substrate. The semiconductor sensing surface is provided with a sensing region and a plurality of wafer pads. The one end of the wire is electrically connected to the wafer of the wafer of the sensing wafer. One end is electrically connected to the soldering layer on the substrate, and the adhesive is applied to the periphery of the image sensing wafer and is higher than the lead. The cover system is a transparent plate, which is fixed on the adhesive; the lens is installed in the lens holder. And one end of the mirror cover is exposed outside the lens holder, the lens holder is fixed on the image sensor, and the image sensing chip is located in the optical path of the lens. Compared with the prior art, the camera module of the present invention has an image sensing chip on the substrate and is in an open space for the wire player to move freely. Therefore, the area of the substrate of the image sensor can be as large as possible. The size is reduced to be nearly the same as the area of the S-image sensing chip. Thus, the volume of the X-ray image sensor can be greatly reduced to reduce the volume of the camera module. Moreover, the sensing area of the edge image sensing chip is completely enclosed by the cover body and the adhesive, and the closed space has a small surface area, generates less dust, and reduces dust pollution on the image sensing chip, thereby improving the camera mode. The quality of the group. [Embodiment] Referring to the second embodiment, a preferred embodiment of the camera module of the present invention includes a lens holder 20, a lens 3A mounted on one end of the lens holder 2, and a lens fixed to the mirror. The other end of the holder 20 is located in the image sensor 40 in the lens path. The lens holder 20 has a substantially hollow cylindrical shape and has an inner wall (not shown), and the inner wall is provided with an internal thread 201. The lens 30 includes a lens barrel 3〇1 and at least one lens 302 fixed in the lens barrel 301. The lens barrel 301 is a cylinder having a mirror cover 303 fixed at one end thereof. The lens barrel 301 has an outer wall (not shown), and the outer wall is provided with a thread corresponding to the inner thread 210 of the lens holder 20, and a through hole 3031 is formed in the middle of the mirror cover 303. The through hole 3 is formed in the middle of the mirror cover 303. The crucible 31 is coaxially designed with the lens 3〇2 so that the light reflected by the subject is incident on the lens 302 in the lens barrel 3〇1. The image sensor 40 includes a substrate 401, an image sensing wafer 402, a plurality of leads 403, an adhesive 404, and a cover 405. The substrate 401 is made of a material such as plastic, glass fiber, reinforced plastic or ceramic. The substrate 401 has an upper surface (not labeled) and a lower surface (not shown). The upper surface is provided with a plurality of upper pads 4〇11, and the lower surface is provided with a plurality of upper pads corresponding to the upper pads 4011 and electrically The solder pad 4012 is connected. The lower pad 4012 is used to electrically connect the image sensor to other circuit boards. The image sensing wafer 402 is adhesively fixed on the upper surface of the substrate 4 〇 1 , and the top mask has a sensing area 4 〇 2 i. The sensing area 4 〇 2 设置 is provided with a plurality of wafer pads 4022. The plurality of leads 403 are made of a highly conductive material such as gold, and one end thereof is fixedly electrically connected to the wafer pad 4022 of the image sensing wafer 4〇2, and the other end is fixedly electrically connected to the pad 4011 on the substrate 4〇1. . The adhesive 4〇4 surrounds the top surface of the image sensing chip 23 and the lead 4〇3, and covers the connection between the lead 4〇3 and the wafer bonding 4022 and the lead 403 and the substrate 401 for soldering 4011. And it is at the height of the lead 403. It can be understood that the adhesive 4〇4 can also be applied only to the periphery of the top surface of the image sensing wafer 402, and it covers the junction of the lead 403 and the wafer pad 4022. The cover body 4〇5 is a transparent light-transmissive plate, which is fixed on the image sensing wafer 4〇2 by the adhesive 404 and the bottom surface thereof contacts the lead 403′ to close the sensing area 4021 1376558 of the image sensing wafer 402. . During assembly, 'coating the lens holder 2G1-turn 50, the lens holder is sleeved on the image sensor 40, and is fixed on the upper surface of the substrate by the adhesive%, and the substrate is over-welded.塾4〇ιι is contained in the mirror base 200. Then, the end of the lens 3 opposite to the mirror cover 3〇3 is placed in the lens holder 20, and the lens is adjusted by the screwing of the external thread of the lens barrel 3〇1 and the internal thread 201 of the lens holder 20. The image sensing wafer 402 is positioned on the focal plane of the lens 302. Finally, the portion of the lens barrel 301 of the lens 30 exposed to the outside of the lens holder 2 is coated with a % of adhesive to fix the position of the lens 30. It can be understood that, in this embodiment, one end of the mirror money can be provided with a positioning hole (not shown), and a positioning post (not shown) is disposed on the substrate 401, or a positioning post can be disposed at the end of the lens holder 20 (not shown). A positioning hole (not shown) is disposed on the substrate 4〇 corresponding to the mounting of the lens holder 2 on the substrate 4〇1, and the lens holder 2 is inserted into the substrate 4 by the cooperation of the positioning post and the positioning hole. 〇ι, then apply adhesive 5〇 around the bottom of the lens holder 20 to completely enclose the image sensor 40. Referring to the third figure, another preferred embodiment of the camera module of the present invention includes a lens holder 22, a lens 32 fixed to the end of the lens holder 22, and a lens holder 22 attached to the other end of the lens holder 22 and located at the lens. Image detector 42 in 32 light paths. The lens holder 22 has a substantially hollow cylindrical shape and has an inner wall (not shown). The inner wall is provided with an internal thread 22, and a flange 222 extends outwardly from an end surface 223 of the lens holder 22. The lens 32 includes a lens barrel 321, a lens 322, and a 1376558 mirror cover 323 which are substantially identical in construction to the lens 30 of the previous embodiment. The image sensor 42 includes a substrate 421, an image sensing chip '422, a plurality of leads 423, an adhesive 424, and a cover 425, which are substantially the same as the image sensor 40 of the previous embodiment. . The size of the cylinder surrounded by the inner wall of the lens holder 22 is smaller than the size of the cover 425 of the image sensor 42 , and the size of the cylinder surrounded by the inner wall of the flange 222 is slightly larger than the cover of the image sensor 42 . The size of the body 425. During assembly, an adhesive 52 is applied to the end surface 223 of the lens holder 22, and the lens holder 22 is placed on the cover 425 of the image sensor 42 so that the lens holder 22 is adhered to the image sensing by the adhesive 52. On the device 42. Then, one end of the lens 32 opposite to the mirror cover 323 is placed in the lens holder 22, and the position of the lens 32 is adjusted by the screwing of the external thread 3211 of the lens barrel 321 and the internal thread 221 of the lens holder 22 to make the image Sensing wafer 422 is located on the focal plane of lens 322. Finally, a portion of the lens barrel 321 of the lens 32 exposed outside the lens holder 22 is coated with an adhesive 52 to fix the position of the lens 32. It can be understood that when the lenses 30, 32 are mounted on the lens holders 20, 22, the rotation between them will generate dust, and the more the rotation, the more dust will be generated. In order to avoid dust pollution of the image sensors 40, 42, when assembling, the lenses 30, 32 can be pre-installed in the lens holder 20, '22, and then the lens holder 20 pre-loaded with the lenses 30, 32 22 is mounted on the image sensors 40, 42. At this point, the image sensing wafers 402, 422 can be positioned on the focal plane of the lenses 302, 322 by simply adjusting the position of the lenses 30, 32. Thus, the contamination of the image sensors 40, 42 by the dust can be reduced, and the quality of the camera module can be improved. In the two embodiments of the camera module, the image sensing wafers 1376558 402, 422 are located on the substrate 4 (H, 421, and are in an open space for the wire feeder to freely move, so the image sensor 40 The area of the substrate of 42 can be reduced as close as possible to the area of the image sensing chip, so that the volume of the image sensor 40, 42 can be greatly reduced, thereby reducing the volume of the camera module. The sensing areas 4021, 4221 of the image sensing wafers 402, 422 have a smaller surface area, which can reduce the dust generation to reduce the pollution of the dust on the image sensing wafers 402, 422, thereby improving the quality of the camera module. As described above, the present invention complies with the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and those who are familiar with the skill of the present invention are equivalent in the spirit of the creation of the case. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a conventional camera module; FIG. 2 is a cross-sectional view of a preferred embodiment of the camera module of the present invention; Figure 3 is a cross-sectional view of another preferred embodiment of the camera module of the present invention. [Main component symbol description] Mirror base 20 internal thread 201 lens 30 mirror same 301 external thread 3011 lens 302 mirror cover 303 through hole 3031 image sensor 40 Substrate 401 Upper pad 4011 Lower pad 4012 Image sensing wafer 402 Sensing area 4021 1376558 Wafer pad 4022 Lead 403 Adhesive 404, 50 Cover 405 Mirror base 22 Internal thread 221 Flange 222 End face 223 Lens 32 Lens barrel 321 external thread 3211 lens 322 mirror cover 323 through hole 3231 image sensor 42 substrate 421 upper pad 4211 lower pad 4212 image sensing wafer 422 sensing area 4221 wafer pad 4222 lead 423 adhesive 424 ' 52 cover 425