KR950000216A - 광촉매 복합체 및 그의 제조 방법 - Google Patents

광촉매 복합체 및 그의 제조 방법 Download PDF

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KR950000216A
KR950000216A KR1019940014865A KR19940014865A KR950000216A KR 950000216 A KR950000216 A KR 950000216A KR 1019940014865 A KR1019940014865 A KR 1019940014865A KR 19940014865 A KR19940014865 A KR 19940014865A KR 950000216 A KR950000216 A KR 950000216A
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particles
photocatalyst
photocatalyst particles
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사다오 무라사와
하지메 무라까미
야스로 후꾸이
미쓰루 와따나베
아끼라 후지시마
가즈히또 하시모또
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아끼라 후지시마
원본미기재
가즈히또 하시모또
이시하라 상교 가부시끼가이샤
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Abstract

비닐 에스테르 및/또는 비닐 에테르와 플루오로올레핀의 공중합체를 함유하는 플루오르화 중합체, 또는 규소 기재 중합체 또는 시멘트와 같은 분해성이 적은 접착제를 사용하여, 산화 티타늄과 같은 광촉매 입자가 접착된 기질을 함유함을 특징으로 하는 광촉매 복합체를 제공한다. 또한, 광촉매 복합체 및 광촉매 복합체를 함유하는 코팅 조성물의 제조 방법을 제공한다.

Description

광촉매 복합체 및 그의 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 실시예의 샘플 A 및 C와 비교예의 샘플 E에 흑색광을 조사시킴에 의한 광촉매 복합체 중의 접착제의 단위 면적당 중량 손실의 변화를 나타낸 도면.

Claims (23)

  1. 분해성이 적은 접착제를 사용하여 입자가 접착된 기질을 함유함을 특징으로 하는 광촉매 복합체.
  2. 분해성이 적은 접착제를 사용하여 광촉매 입자 및 흡착제를 함유하는 기질을 함유하는 특징으로 하는 광촉매 복합체.
  3. 제1항에 있어서, 기실상에 광촉매 입자를 함유하지 않는 접착제를 함유하는 제1층이 제공되어 있으며, 이 제1층상에 분해성이 적은 접착제 및 광촉매 입자를 함유하는 제2층이 제공됨을 특징으로 하는 광촉매 복합체.
  4. 제3항에 있어서, 제1층의 접착제가 분해성이 적은 접차제임을 특징으로 하는 광촉매 복합체.
  5. 제3항에 있어서, 제1층이 분해성이 적은 접착제 및 무기 입자로 구성됨을 특징으로 하는 광촉매 복합체.
  6. 제1항에 있어서, 광촉매 입자의 양이 광촉매 입자 및 분해성이 적은 접착제의 총량을 기준으로 5-98부피%범위임을 특징으로 하는 광촉매 복합체.
  7. 제1항에 있어서, 분해성이 적은 접착제가 플루오로화 중합체 및 실리콘 기체 중합체로 구성된 군 중에서 선택된 1이상의 중합체 임을 특징으로 하는 광촉매 복합체.
  8. 제7항에 있어서, 플루오르화 중합체가 주로 비닐 에테르 및/또는 비닐 에스테르와 플루오로올레핀의 공중합체를 함유함을 특징으로 하는 광촉매 복합체.
  9. 제1항에 있어서, 분해성이 적은 접착제가 무기 접착제임을 특징으로 하는 광촉매 복합체.
  10. 제9항에 있어서, 무기 접착제가 시멘트임을 특징으로 하는 광촉매 복합체.
  11. 제1항에 있어서, 광촉매 입자가 산화 티타늄임을 특징으로 하는 광촉매 복합체.
  12. 제1항에 있어서, 광촉매 입자가 광촉매 입자의 내부 및/또는 그의 표면상에 제2성분으로서 V,Fe,Co,Ni,Cu,Zn,Ru,Rh,Pd,Ag,Pt 및 Au의 금속 및 금속 화합물로 구성된 군 중에서 선택된 1이상의 함유함을 특징으로 하는 광촉매 복합체.
  13. 광촉매 입자 및 분해성이 적은 접착제를 기질상에 배치시킨 후, 접착제를 응고시켜 이 접착제를 사용하여 기질상에 광촉매 입자를 접착시키는 단계를 함유함을 특징으로 하는 광촉매 복합체의 제조방법.
  14. 제13항에 있어서, 광촉매 입자 및 분해성이 적은 접착제의 배치가 용매 중의 광촉매 입자 및 분해성이 적은 접착제의 분산액으로 구성된 코팅 조성물을 기질상에 코팅 또는 분무시킴으로써 수행됨을 특징으로 하는 광촉매 복합체의 제조방법.
  15. 접착제로 기질을 코팅시키고, 이 접착제를 기질상에서 응고시켜 기질상에 광촉매 입자가 없는 접착제의 제1층을 제공한 후, 제1층상에 분해성이 적은 접착제 및 광촉매 입자를 배치시킨 후, 제1층상에서 접착제 및 광촉매 복합체를 응고시킴으로써 제1층 상에 분해성이 적은 접착제와 광촉매 입자를 함유하는 제2층을 제공하는 단계를 함유함을 특징으로 하는 광촉매 복합체의 제조 방법.
  16. 용매 중의 광촉매 입자 및 분해성이 적은 접착제의 분산액을 함유함을 특징으로 하는 코팅 조성물.
  17. 제16항에 있어서, 광촉매 입자의 양이 광촉매 입자 및 분해성이 적은 접착제의 총량의 기준으로 5-98부피%임을 특징으로 하는 코팅 조성물.
  18. 제16항에 있어서, 광촉매 입자의 양이 광촉매 입자 및 분해성이 적은 접착제의 총량을 기준으로 20-98부피%임을 특징으로 하는 코팅 조성물.
  19. 제16항에 있어서, 분해성이 적은 접착제가 플루오르화 중합체 및 실리콘 기재 중합체로 구성된 군 중에서 선택된 1이상의 중합체임을 특징으로 하는 코팅 조성물.
  20. 용매 중의 광촉매 입자, 분해성이 적은 접착제 및 커플링제의 분산액을 함유함을 특징으로 하는 코팅 조성물.
  21. 제20항에 있어서, 광촉매 입자의 양이 광촉매 입자 및 분해성이 적은 접착제의 총량을 기준으로 5-98부피%임을 특징으로 하는 코팅 조성물.
  22. 제20항에 있어서, 광촉매 입자의 양이 광촉매 입자 및 분해성이 적은 적찹제의 총량을 기준으로 20-98부피%임을 특징으로 하는 코팅 조성물.
  23. 제20항에 있어서, 분해성이 적은 접착제가 플루오르화 중합체 및 실리콘 기재 중합체로 구성된 군 중에서 선택된 1이상의 중합체임을 특징으로 하는 코팅 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
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CN1101591A (zh) 1995-04-19
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ATE234679T1 (de) 2003-04-15
TW279175B (ko) 1996-06-21
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US6498000B2 (en) 2002-12-24
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