US20120181068A1 - Circuit substrate and method of manufacturing same - Google Patents

Circuit substrate and method of manufacturing same Download PDF

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Publication number
US20120181068A1
US20120181068A1 US13/430,736 US201213430736A US2012181068A1 US 20120181068 A1 US20120181068 A1 US 20120181068A1 US 201213430736 A US201213430736 A US 201213430736A US 2012181068 A1 US2012181068 A1 US 2012181068A1
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US
United States
Prior art keywords
disposed
substrate
flexible
region
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US13/430,736
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English (en)
Inventor
Noboru Kato
Masahiro Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Assigned to MURATA MANUFACTURING CO., LTD. reassignment MURATA MANUFACTURING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KATO, NOBORU, OZAWA, MASAHIRO
Publication of US20120181068A1 publication Critical patent/US20120181068A1/en
Priority to US13/973,136 priority Critical patent/US8853549B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Definitions

  • the present invention relates to a circuit substrate and a method of manufacturing the same and, in particular, to a circuit substrate including a rigid region and a flexible region and a method of manufacturing the same.
  • the wiring substrate described in Japanese Unexamined Patent Application Publication No. 2006-339186 includes a flexible section and a rigid section disposed to be contiguous to the flexible section.
  • the flexible section includes a flexible substrate in which wiring patterns are stacked such that an insulative resin layer is disposed therebetween.
  • the rigid section includes a flexible substrate formed integrally with the flexible section. The wiring density of the wiring patterns in the rigid section is higher than that in the flexible section. Thus, the rigid section has a higher hardness than that of the flexible section.
  • the stray capacitance may increase, and the circuit characteristics may deviate from a desired value.
  • a redundant wiring pattern is disposed in the rigid section. The redundant wiring pattern faces other wiring patterns and forms unnecessary stray capacitance. As a result, the circuit characteristics in the wiring substrate described in Japanese Unexamined Patent Application Publication No. 2006-339186 deviate from a desired value.
  • Preferred embodiments of the present invention provide a circuit substrate and a method of manufacturing the circuit substrate, the circuit substrate having circuit characteristics in which the occurrence of deviations can be reduced and including a relatively hard region and a relatively soft region.
  • a circuit substrate includes a main body including a stack of a plurality of first insulator layers made of a flexible material, the main body including a rigid region and a flexible region, the flexible region being more easily deformable than the rigid region, a conductive layer disposed in the main body and forming circuitry, and a second insulator layer disposed so as to cover at least a portion of an area where the conductive layer is not disposed in the rigid region on at least one of the first insulator layers when seen in plan view from a stacking direction.
  • a method of manufacturing a circuit substrate includes a step of preparing a plurality of first insulator layers on which circuitry made of a conductive layer is formed, the plurality of first insulator layers being made of a flexible material, a step of forming a second insulator layer so as to cover at least a portion of an area where the conductive layer is not disposed on at least one of the first insulator layers when seen in plan view from a stacking direction, and a step of stacking and press-bonding the plurality of first insulator layers.
  • a circuit substrate that has circuit characteristics in which the occurrence of deviations can be reduced and that includes a relatively hard region and a relatively soft region is obtainable.
  • FIG. 1 is an external perspective view of a circuit substrate according to a preferred embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the circuit substrate illustrated in FIG. 1 .
  • FIGS. 3A and 3B are perspective views of a flexible sheet in the circuit substrate in its manufacturing process.
  • FIG. 4 is a cross-sectional configuration view of the circuit substrate illustrated in FIG. 2 taken along the line A-A.
  • FIG. 5 is an exploded perspective view of a circuit substrate according to a first variation of a preferred embodiment of the present invention.
  • FIG. 6 is an exploded perspective view of a circuit substrate according to a second variation of a preferred embodiment of the present invention.
  • FIG. 7 is a cross-sectional configuration view of a circuit substrate according to a third variation of a preferred embodiment of the present invention.
  • FIG. 1 is an external perspective view of a circuit substrate 10 according to a preferred embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the circuit substrate 10 illustrated in FIG. 1 .
  • FIGS. 3A and 3B are perspective views of a flexible sheet 26 a in the circuit substrate 10 in its manufacturing process.
  • FIG. 3A illustrates the back side of the flexible sheet 26 a
  • FIG. 3B illustrates the front side of the flexible sheet 26 a in a state where resist films 20 a and 24 a are not formed.
  • FIG. 4 is a cross-sectional configuration view of the circuit substrate 10 illustrated in FIG. 2 taken along the line A-A.
  • FIGS. 1 is an external perspective view of a circuit substrate 10 according to a preferred embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the circuit substrate 10 illustrated in FIG. 1 .
  • FIGS. 3A and 3B are perspective views of a flexible sheet 26 a in the circuit substrate 10 in its manufacturing process.
  • FIG. 3A illustrate
  • the stacking direction of the circuit substrate 10 is defined as the z-axis direction
  • the longitudinal direction of a line section 16 in the circuit substrate 10 is defined as the x-axis direction
  • the direction to which the x-axis direction and the z-axis direction are orthogonal is defined as the y-axis direction.
  • the front side of each of the circuit substrate 10 and the flexible sheets 26 indicates a surface positioned on the positive-direction side in the z-axis direction
  • the back side of each of the circuit substrate 10 and the flexible sheet 26 indicates a surface positioned on the negative-direction side in the z-axis direction.
  • the circuit substrate 10 includes a main body 11 including substrate sections 12 and 14 and the line section 16 .
  • the main body 11 includes a stack of a plurality of (for example, preferably four in FIG. 2 ) flexible sheets (insulator layers) 26 ( 26 a to 26 d ) made of a flexible material (e.g., thermoplastic resin, such as liquid crystal polymer or polyimide).
  • a flexible material e.g., thermoplastic resin, such as liquid crystal polymer or polyimide.
  • Each of the flexible sheets 26 preferably has a Young's modulus of approximately 2 GPa to 20 GPa, for example.
  • the substrate section 12 is substantially rectangular and includes, on the front side, an implementation surface on which a plurality of chip components 50 and an integrated circuit 52 are implemented.
  • the substrate section 14 has the shape of a substantially rectangle smaller than the substrate section 12 and includes, on the front side, an implementation surface on which a connector 54 is implemented.
  • the substrate sections 12 and 14 are not prone to deforming (bending) to allow the chip components 50 , integrated circuit 52 , and connector 54 to be stably implemented therein.
  • the substrate sections 12 and 14 are also referred to as rigid regions R 1 and R 2 , respectively.
  • the line section 16 connects the substrate sections 12 and 14 together.
  • the circuit substrate 10 is used in a state where the line section 16 is curved in a substantially U shape.
  • the line section 16 is easily deformable (bendable).
  • the line section 16 is also referred to as a flexible region F 1 .
  • the substrate section 12 (rigid region R 1 ) is described.
  • the substrate section 12 includes a stack of substrate-section sheets 27 a to 27 d of the flexible sheets 26 a to 26 d.
  • the substrate section 12 includes the resist film 20 a, reinforcing insulative films 20 b to 20 d, lands 28 , wiring conductors 30 ( 30 b, 30 c ), a ground conductor 37 , and via-hole conductors b 1 to b 3 and b 21 to b 26 .
  • reference numerals are provided to only representative ones of the lands 28 , the wiring conductors 30 , and the via-hole conductors b 1 to b 3 to prevent complication in the drawings.
  • Each of the substrate-section sheets 27 a to 27 d of the flexible sheets 26 a to 26 d corresponds to a first insulator layer according to a preferred embodiment of the present invention
  • each of the reinforcing insulative films 20 b to 20 d corresponds to a second insulator layer according to a preferred embodiment of the present invention. The same applies to variations described below.
  • the lands 28 are disposed in the main body 11 and, preferably are defined by a conductive layer disposed on the front side of the substrate-section sheet 27 a, as illustrated in FIG. 2 .
  • the chip components 50 and the integrated circuit 52 are implemented on the lands 28 preferably by soldering, for example, as illustrated in FIG. 1 .
  • the via-hole conductors b 1 penetrate through the substrate-section sheet 27 a along the z-axis direction.
  • the via-hole conductors b 1 are connected to the lands 28 .
  • the wiring conductors 30 b are disposed in the main body 11 and, preferably are a conductive layer disposed on the front side of the substrate-section sheet 27 b, as illustrated in FIG. 2 .
  • the via-hole conductors b 2 penetrate through the substrate-section sheet 27 b along the z-axis direction, as illustrated in FIG. 2 .
  • the via-hole conductors b 2 are connected to the via-hole conductors b 1 .
  • the via-hole conductors b 21 to b 23 penetrate through the substrate-section sheet 27 b along the z-axis direction.
  • the via-hole conductors b 21 to b 23 are connected to the wiring conductors 30 b.
  • the wiring conductors 30 c are disposed in the main body 11 and, preferably are a conductive layer disposed on the front side of the substrate-section sheet 27 c, as illustrated in FIG. 2 .
  • the via-hole conductors b 3 penetrate through the substrate-section sheet 27 c along the z-axis direction, as illustrated in FIG. 2 .
  • Each of the via-hole conductors b 3 is connected to one of the via-hole conductors b 2 .
  • the via-hole conductors b 24 to b 26 penetrate through the substrate-section sheet 27 c along the z-axis direction.
  • the via-hole conductors b 24 to b 26 are connected to the via-hole conductors b 21 to b 23 , respectively.
  • the ground conductor 37 is disposed in the main body 11 and, preferably is a single film electrode having the shape of a substantially rectangle arranged to cover the front side of the substrate-section sheet 27 d. As illustrated in FIG. 2 , not all of the substrate-section sheet 27 d is covered by the ground conductor 37 ; the ground conductor 37 is not disposed in the vicinity of the outer regions of the substrate-section sheet 27 d. The ground conductor 37 is grounded and thus maintained at a ground potential. The ground conductor 37 is connected to the via-hole conductors b 3 and b 24 to b 26 .
  • the substrate-section sheets 27 a to 27 d are stacked, and thus the wiring conductors 30 b and 30 c, the ground conductor 37 , and the via-hole conductors b 1 to b 3 and b 21 to b 26 are connected to each other and define circuitry.
  • the resist film 20 a is disposed so as to cover the front side of the substrate-section sheet 27 a and is an insulative film to protect the substrate-section sheet 27 a.
  • the resist film 20 a is not disposed on the lands 28 .
  • the resist film 20 a is a solder resist film to define an area in which solder is to be applied on the lands 28 .
  • the reinforcing insulative film 20 b is disposed in the main body 11 and, preferably is an insulative film that covers the portion where the wiring conductors 30 b and the via-hole conductors b 2 and b 21 to b 23 are not disposed on the front side of the substrate-section sheet 27 b (in the rigid region R 1 ) when seen in plan view from the z-axis direction, as illustrated in FIG. 2 .
  • the thickness of the reinforcing insulative film 20 b is equal to or less than the thickness of each of the wiring conductors 30 b. In the present preferred embodiment, the thickness of the reinforcing insulative film 20 b is equal to the thickness of the wiring conductor 30 b.
  • the reinforcing insulative film 20 b is made of a material that is harder than the material of the substrate-section sheet 27 b and can be produced by application of thermosetting resin (e.g., epoxy resin), for example.
  • the reinforcing insulative film 20 b preferably has a Young's modulus of approximately 12 GPa to 30 GPa, for example.
  • the reinforcing insulative film 20 c is disposed in the main body 11 and, preferably is an insulative film that covers the portion where the wiring conductors 30 c and the via-hole conductors b 3 and b 24 to b 26 are not disposed on the front side of the substrate-section sheet 27 c (in the rigid region R 1 ) when seen in plan view from the z-axis direction, as illustrated in FIGS. 2 and 4 .
  • the thickness of the reinforcing insulative film 20 c is equal to or less than the thickness of each of the wiring conductors 30 c, as illustrated in FIG. 4 .
  • the thickness of the reinforcing insulative film 20 c preferably is equal to the thickness of the wiring conductor 30 c.
  • the reinforcing insulative film 20 c is made of a material harder than the material of the substrate-section sheet 27 c and can be produced by application of thermosetting resin (e.g., epoxy resin), for example.
  • the reinforcing insulative film 20 c preferably has a Young's modulus of approximately 12 GPa to 30 GPa, for example.
  • the reinforcing insulative film 20 d is disposed in the main body 11 and, preferably is an insulative film that covers the portion where the ground conductor 37 is not disposed on the front side of the substrate-section sheet 27 d (in the rigid region R 1 ) when seen in plan view from the z-axis direction, as illustrated in FIG. 2 .
  • the thickness of the reinforcing insulative film 20 d is equal to or less than the thickness of the ground conductor 37 . In the present preferred embodiment, the thickness of the reinforcing insulative film 20 d is equal to the thickness of the ground conductor 37 .
  • the reinforcing insulative film 20 d preferably is made of a material that is harder than the material of the substrate-section sheet 27 d and can be produced by application of thermosetting resin (e.g., epoxy resin), for example.
  • the reinforcing insulative film 20 d preferably has a Young's modulus of approximately 12 GPa to 30 GPa, for example.
  • each of these reinforcing insulative films may be disposed in the entire portion where the ground conductor is not disposed on the substrate-section sheet in the substrate section 12 (rigid region R 1 ), as described above. Alternatively, they may be disposed in a portion of the portion where the ground conductor is not disposed. Alternatively, only one of the plurality of substrate-section sheets being stacked may be overlaid with the reinforcing insulative film.
  • the reinforcing insulative film may preferably be disposed on the substrate-section sheet in the vicinity of the border between the substrate section 12 (rigid region R 1 ) and the line section (flexible region F 1 ).
  • the reinforcing insulative film may preferably be disposed on the substrate-section sheet in a fixation portion fixed on a casing or mother board in the rigid region R 1 .
  • the reinforcing insulative film may preferably be disposed on the substrate-section sheet adjacent to the mounting side, or on each of the substrate-section sheets above and below the component incorporated, in the region that overlaps the component when the circuit substrate 10 is seen in plan view from the stacking direction.
  • the substrate section 14 (rigid region R 2 ) is described.
  • the substrate section 14 includes a stack of substrate-section sheets 29 a to 29 d of the flexible sheets 26 a to 26 d.
  • the substrate section 14 includes the resist film 24 a, reinforcing insulative films 24 b to 24 d, lands 35 , wiring conductors 36 ( 36 b, 36 c ), a ground conductor 40 , and via-hole conductors b 11 , b 12 , and b 31 to b 36 .
  • reference numerals are provided to only representative ones of the lands 35 , the wiring conductors 36 , and the via-hole conductors b 11 and b 12 to prevent complication in the drawings.
  • the lands 35 are disposed in the main body 11 and, preferably are conductive layers disposed on the front side of the substrate-section sheet 29 a, as illustrated in FIG. 2 .
  • the connector 54 is implemented on the lands 35 preferably by soldering, as illustrated in FIG. 1 , for example.
  • the via-hole conductors b 11 penetrate through the substrate-section sheet 29 a along the z-axis direction.
  • the via-hole conductors b 11 are connected to the lands 35 .
  • the wiring conductors 36 b are disposed in the main body 11 and, preferably are a conductive layer disposed on the front side of the substrate-section sheet 29 b, as illustrated in FIG. 2 .
  • the via-hole conductors b 12 penetrate through the substrate-section sheet 29 b along the z-axis direction, as illustrated in FIG. 2 .
  • the via-hole conductors b 12 are connected to the via-hole conductors b 11 .
  • the via-hole conductors b 31 to b 33 penetrate through the substrate-section sheet 29 b along the z-axis direction.
  • the via-hole conductors b 31 to b 33 are connected to the wiring conductors 36 b.
  • the wiring conductors 36 c are disposed in the main body 11 and, preferably are a conductive layer disposed on the front side of the substrate-section sheet 29 c, as illustrated in FIG. 2 .
  • the wiring conductors 36 c are connected to the via-hole conductors b 12 .
  • the via-hole conductors b 34 to b 36 penetrate through the substrate-section sheet 29 c along the z-axis direction.
  • the via-hole conductors b 34 to b 36 are connected to the via-hole conductors b 31 to b 33 , respectively.
  • the ground conductor 40 is disposed in the main body 11 and, preferably is a single film electrode having the shape of a substantially rectangle arranged so as to cover the front side of the substrate-section sheet 29 d. As illustrated in FIG. 2 , not all of the substrate-section sheet 29 d is covered by the ground conductor 40 ; the ground conductor 40 is not disposed in the vicinity of the outer regions of the substrate-section sheet 29 d. The ground conductor 40 is grounded and thus maintained at a ground potential. The ground conductor 40 is connected to the via-hole conductors b 34 to b 36 .
  • the substrate-section sheets 29 a to 29 d are stacked, and thus the wiring conductors 36 b and 36 c, the ground conductor 40 , and the via-hole conductors b 11 , b 12 , and b 31 to b 36 are connected to each other and define circuitry.
  • the resist film 24 a is disposed so as to cover the front side of the substrate-section sheet 29 a and is an insulative film to protect the substrate-section sheet 29 a.
  • the resist film 24 a is not disposed on the lands 35 .
  • the resist film 24 a is a solder resist to define an area in which solder is to be applied on the lands 35 .
  • the reinforcing insulative film 24 b is disposed in the main body 11 and, preferably is an insulative film that covers the portion where the wiring conductors 36 b and the via-hole conductors b 12 and b 31 to b 33 are not disposed on the front side of the substrate-section sheet 29 b (in the rigid region R 2 ) when seen in plan view from the z-axis direction, as illustrated in FIG. 2 .
  • the thickness of the reinforcing insulative film 24 b is equal to or less than the thickness of each of the wiring conductors 36 b. In the present preferred embodiment, the thickness of the reinforcing insulative film 24 b is equal to the thickness of the wiring conductor 36 b.
  • the reinforcing insulative film 24 b is preferably made of a material that is harder than the material of the substrate-section sheet 29 b and can be produced by application of thermosetting resin (e.g., epoxy resin), for example.
  • the reinforcing insulative film 24 b has a Young's modulus of approximately 12 GPa to 30 GPa, for example.
  • the reinforcing insulative film 24 c is disposed in the main body 11 and, preferably is an insulative film that covers the portion where the wiring conductors 36 c and the via-hole conductors b 34 to b 36 are not disposed on the front side of the substrate-section sheet 29 c (in the rigid region R 2 ) when seen in plan view from the z-axis direction, as illustrated in FIG. 2 .
  • the thickness of the reinforcing insulative film 24 c is equal to or less than the thickness of each of the wiring conductors 36 c. In the present preferred embodiment, the thickness of the reinforcing insulative film 24 c is preferably equal to the thickness of the wiring conductor 36 c.
  • the reinforcing insulative film 24 c is preferably made of a material that is harder than the material of the substrate-section sheet 29 c and can be produced by application of thermosetting resin (e.g., epoxy resin), for example.
  • the reinforcing insulative film 24 c has a Young's modulus of approximately 12 GPa to 30 GPa, for example.
  • the reinforcing insulative film 24 d is disposed in the main body 11 and, preferably is an insulative film that covers the portion where the ground conductor 40 is not disposed on the front side of the substrate-section sheet 29 d (in the rigid region R 2 ) when seen in plan view from the z-axis direction, as illustrated in FIG. 2 .
  • the thickness of the reinforcing insulative film 24 d is equal to or less than the thickness of the ground conductor 40 . In the present preferred embodiment, the thickness of the reinforcing insulative film 24 d is preferably equal or substantially equal to the thickness of the ground conductor 40 .
  • the reinforcing insulative film 24 d preferably is made of a material that is harder than the material of the substrate-section sheet 29 d and can be produced by application of thermosetting resin (e.g., epoxy resin), for example.
  • the reinforcing insulative film 24 d preferably has a Young's modulus of approximately 12 GPa to 30 GPa, for example.
  • the line section 16 (flexible region F 1 ) is described.
  • the line section 16 includes a stack of line-section sheets 31 a to 31 d of the flexible sheets 26 a to 26 d.
  • the line section 16 includes ground lines 32 ( 32 b, 32 d ), 33 ( 33 b, 33 d ), and 34 ( 34 b, 34 d ) and signal lines 42 c, 43 c, and 44 c.
  • Each of the signal lines 42 c, 43 c, and 44 c is disposed in the main body 11 and, preferably is disposed in the line section 16 and extends between the substrate sections 12 and 14 .
  • each of the signal lines 42 c, 43 c, and 44 c preferably is a linear conductive layer disposed on the front side of the line-section sheet 31 c.
  • a signal of a high frequency e.g., 800 MHz to 900 MHz
  • the signal lines 42 c, 43 c, and 44 c connect the wiring conductors 30 c and the wiring conductors 36 c. That is, the conductive layer including the wiring conductors 30 c and 36 c and the signal lines 42 c, 43 c, and 44 c extends across the border between the flexible region F 1 and each of the rigid regions R 1 and R 2 .
  • Each of the ground lines 32 b, 33 b, and 34 b is disposed in the main body 11 and, preferably is disposed in the line section 16 and positioned on the positive-direction side in the z-axis direction with respect to the signal lines 42 c, 43 c, and 44 c. As illustrated in FIG. 2 , each of the ground lines 32 b, 33 b, and 34 b is disposed on the front side of the line-section sheet 31 b and connects the wiring conductor 30 b and the wiring conductor 36 b.
  • the conductive layer including the wiring conductors 30 b and 36 b and the ground lines 32 b, 33 b, and 34 b extends across the border between the flexible region F 1 and each of the rigid regions R 1 and R 2 .
  • the wiring conductors 30 b are connected to the ground conductor 37 through the via-hole conductors b 21 to b 26 .
  • the wiring conductors 36 b are connected to the ground conductor 40 through the via-hole conductors b 31 to b 36 . Accordingly, each of the ground lines 32 b, 33 b, and 34 b is electrically connected to the ground conductor 37 .
  • Each of the ground lines 32 b, 33 b, and 34 b is electrically connected to the ground conductor 40 .
  • the ground lines 32 b, 33 b, and 34 b preferably have line widths that are wider than those of the signal lines 42 c, 43 c, and 44 c, respectively. Therefore when seen in plan view from the z-axis direction, the signal lines 42 c, 43 c, and 44 c do not protrude from the ground lines 32 b, 33 b, and 34 b, respectively, and overlap the ground lines 32 b, 33 b, and 34 b, respectively.
  • the ground lines 32 d, 33 d, and 34 d are disposed in the line section 16 and positioned on the negative-direction side in the z-axis direction with respect to the signal lines 42 c, 43 c, and 44 c. Specifically, as illustrated in FIG. 2 , each of the ground lines 32 d, 33 d, and 34 d is disposed on the front side of the line-section sheet 31 d and connects the ground conductor 37 and the ground conductor 40 . That is, the conductive layer including the ground conductors 37 and 40 and the ground lines 32 d, 33 d, and 34 d extends across the border between the flexible region F 1 and each of the rigid regions R 1 and R 2 .
  • the ground lines 32 d, 33 d, and 34 d preferably have line widths that are wider than those of the signal lines 42 c, 43 c, and 44 c, respectively. Therefore, when seen in plan view from the z-axis direction, the signal lines 42 c, 43 c, and 44 c do not protrude from the ground lines 32 d, 33 d, and 34 d, respectively, and overlap the ground lines 32 d, 33 d, and 34 d, respectively.
  • the ground lines 32 b, 33 b, and 34 b, the signal lines 42 c, 43 c, and 44 c, and the ground lines 32 d, 33 d, and 34 d overlap each other. Therefore, the ground line 32 b, the signal line 42 c, and the ground line 32 d define a strip line structure. Similarly, the ground line 33 b, the signal line 43 c, and the ground line 33 d define a strip line structure. The ground line 34 b, the signal line 44 c, and the ground line 34 d define a strip line structure. As a result, the impedance between the circuitry in the substrate section 12 and the circuitry in the substrate section 14 is matched. Thus, in the main body 11 , the circuitry in the substrate section 12 , the circuitry in the substrate section 14 , and the strip lines in the line section 16 define a single circuit having matched impedance.
  • circuit substrate 10 A non-limiting method of manufacturing the circuit substrate 10 according to another preferred embodiment of the present invention is described below with reference to the drawings.
  • the case where one circuit substrate 10 is produced is described as an example.
  • a plurality of circuit substrates 10 preferably are produced at one time by cutting a stack of large flexible sheets.
  • flexible sheets 26 made of thermoplastic resin, such as a liquid crystal polymer or polyimide, and having copper foil with a thickness of 5 ⁇ m to 50 ⁇ m formed over the front side thereof are prepared.
  • the thickness of each of the flexible sheets 26 is approximately 10 ⁇ m to 150 ⁇ m.
  • each of the locations where the via-hole conductors b 1 to b 3 , b 11 , b 12 , b 21 to b 26 , and b 31 to b 36 are to be formed in the flexible sheets 26 a to 26 c is radiated with a laser beam from the back side thereof, thus forming via holes therein.
  • the lands 28 and 35 illustrated in FIG. 3B are formed on the front side of the flexible sheet 26 a by a photolithography step. Specifically, a resist having the same shape as that of each of the lands 28 and 35 illustrated in FIG. 3B is printed on the copper foil of the flexible sheet 26 a. The copper foil in the portion that is not covered by the resists is removed by etching performed on the copper foil. After that, the resists are removed. In this way, the lands 28 and 35 illustrated in FIG. 3B are formed on the front side of the flexible sheet 26 a. Then the resist films 20 a and 24 a illustrated in FIGS. 1 and 2 are formed by application of resin on the front side of the flexible sheet 26 a.
  • the wiring conductors 30 b and 36 b and the ground lines 32 b, 33 b, and 34 b illustrated in FIG. 2 are formed on the front side of the flexible sheet 26 b by a photolithography step.
  • the wiring conductors 30 c and 36 c and the signal lines 42 c, 43 c, and 44 c illustrated in FIG. 2 are formed on the front side of the flexible sheet 26 c by a photolithography step.
  • the ground lines 32 d, 33 d, and 34 d and the ground conductors 37 and 40 illustrated in FIG. 2 are formed on the front side of the flexible sheet 26 d by a photolithography step.
  • the via holes in the flexible sheets 26 a to 26 c are filled with conductive paste including an alloy of tin and silver as the principal component, thus forming the via-hole conductors b 1 to b 3 , b 11 , b 12 , b 21 to b 26 , and b 31 to b 36 illustrated in FIGS. 2 and 3A .
  • the flexible sheets, 26 a to 26 d being made of a flexible material, and on which the circuitry is made are prepared.
  • the circuitry is made up of the wiring conductors 30 b, 30 c, 36 b, and 36 c, the ground conductors 37 and 40 , the via-hole conductors b 1 to b 3 , b 11 , b 12 , b 21 to b 26 , b 31 to b 36 , the ground lines 32 b, 33 b, 34 b, 32 d, 33 d, and 34 d, and the signal lines 42 c, 43 c, and 44 c.
  • the reinforcing insulative film 20 b is formed on the substrate-section sheet 27 b by application of resin so as to cover the portion in which the wiring conductors 30 b and the via-hole conductors b 2 and b 21 to b 23 are not disposed when seen in plan view from the z-axis direction.
  • the reinforcing insulative film 24 b is formed on the substrate-section sheet 29 b by application of resin so as to cover the portion in which the wiring conductors 36 b and the via-hole conductors b 12 and b 31 to b 33 are not disposed when seen in plan view from the z-axis direction.
  • the reinforcing insulative film 20 c is formed on the substrate-section sheet 27 c by application of resin so as to cover the portion in which the wiring conductors 30 c and the via-hole conductors b 3 and b 24 to b 26 are not disposed when seen in plan view from the z-axis direction.
  • the reinforcing insulative film 24 c is formed on the substrate-section sheet 29 c by application of resin so as to cover the portion in which the wiring conductors 36 c and the via-hole conductors b 34 to b 36 are not disposed when seen in plan view from the z-axis direction.
  • the reinforcing insulative film 20 d is formed on the substrate-section sheet 27 d by application of resin so as to cover the portion in which the ground conductor 37 is not disposed when seen in plan view from the z-axis direction.
  • the reinforcing insulative film 24 d is formed on the substrate-section sheet 29 d by application of resin so as to cover the portion in which the ground conductor 40 is not disposed when seen in plan view from the z-axis direction.
  • the application of resin is made by printing of liquid thermosetting epoxy resin by screen printing, gravure printing, or other process.
  • the thickness of each of the reinforcing insulative films 20 b to 20 d and 24 b to 24 d may preferably be about 5 ⁇ m to about 50 ⁇ m, for example.
  • the flexible sheets 26 a to 26 d are stacked in this order.
  • the flexible sheets 26 a to 26 d are press-bonded by the application of force from both sides in the z-axis direction and the application of heat. This causes the unhardened reinforcing insulative films 20 b to 20 d and 24 b to 24 d to be hardened and also join the flexible sheets 26 on both sides of the reinforcing insulative films 20 b to 20 d and 24 b to 24 d in the z-axis direction such that the reinforcing insulative films 20 b to 20 d and 24 b to 24 d are disposed therebetween.
  • the surfaces of the flexible sheets 26 flow and the flexible sheets 26 are coupled together.
  • the via-hole conductors b 1 to b 3 , b 11 , b 12 , b 21 to b 26 , and b 31 to b 36 , the wiring conductors 30 b, 30 c, 36 b, and 36 c, and the ground conductors 37 and 40 are electrically coupled to each other. In this way, the circuit substrate 10 illustrated in FIG. 1 is obtained.
  • the circuit substrate 10 can have circuit characteristics in which the occurrence of deviations can be reduced and can include relatively hard rigid regions R 1 and R 2 and relatively soft flexible region F 1 , as described below. More specifically, in the circuit substrate described in Japanese Unexamined Patent Application Publication No. 2006-339186, a redundant wiring pattern is disposed in the rigid portion. The redundant wiring pattern faces other wiring patterns and generates unnecessary stray capacitance. As a result, the circuit characteristics in the wiring substrate described in Japanese Unexamined Patent Application Publication No. 2006-339186 deviate from a desired value.
  • the reinforcing insulative films 20 b to 20 d and 24 b to 24 d are disposed in the rigid regions R 1 and R 2 .
  • the reinforcing insulative film 20 b is disposed on the substrate-section sheet 27 b (in rigid region R 1 ) so as to cover the portion where the wiring conductors 30 b and the via-hole conductors b 2 and b 21 to b 23 are not disposed.
  • the reinforcing insulative film 24 b is disposed on the substrate-section sheet 29 b (in the rigid region R 2 ) so as to cover the portion where the wiring conductors 36 b and the via-hole conductors b 12 and b 31 to b 33 are not disposed.
  • the reinforcing insulative film 20 c is disposed on the substrate-section sheet 27 b (in the rigid region R 1 ) so as to cover the portion where the wiring conductors 30 c and the via-hole conductors b 3 and b 24 to b 26 are not disposed.
  • the reinforcing insulative film 24 c is disposed on the substrate-section sheet 29 c (in the rigid region R 2 ) so as to cover the portion where the wiring conductors 36 c and the via-hole conductors b 34 to b 36 are not disposed.
  • the reinforcing insulative film 20 d is disposed on the substrate-section sheet 27 d (in the rigid region R 1 ) so as to cover the portion where the ground conductor 37 is not disposed.
  • the reinforcing insulative film 24 d is disposed on the substrate-section sheet 29 d (in the rigid region R 2 ) so as to cover the portion where the ground conductor 40 is not disposed.
  • the reinforcing insulative films 20 b to 20 d and 24 b to 24 d are added in the rigid regions R 1 and R 2 . Therefore, the rigid regions R 1 and R 2 are harder than the flexible region F 1 by the hardness corresponding to the reinforcing insulative films 20 b to 20 d and 24 b to 24 d. Thus, the existence of the reinforcing insulative films 20 b to 20 d and 24 b to 24 d makes the rigid regions R 1 and R 2 hard and eliminates the necessity to have an unnecessary conductive layer.
  • each of the reinforcing insulative films 20 b to 20 d and 24 b to 24 d is not a conductive layer but an insulator layer, no stray capacitance occurs between the reinforcing insulative film and other wiring patterns. Accordingly, the circuit substrate 10 can have circuit characteristics in which the occurrence of deviations can be reduced, and in particular, when it is used in high-frequency ranges, a high-frequency characteristic, such as impedance characteristic, is not prone to change.
  • the circuit substrate 10 can include the relatively hard rigid regions R 1 and R 2 and the relatively soft flexible region F 1 .
  • each of the reinforcing insulative films 20 b to 20 d and 24 b to 24 d is preferably harder than that of each of the flexible sheets 26 (that is, has a larger Young's modulus)
  • the rigid regions R 1 and R 2 are less prone to deformation.
  • the reinforcing insulative films 20 b to 20 d and 24 b to 24 d which are preferably made of thermosetting resin, are disposed in the rigid regions R 1 and R 2 . Therefore the occurrence of plastic deformation caused by large warping of the rigid regions R 1 and R 2 in the circuit substrate 10 can be more reduced than that in the case where the rigidity is increased by the use of a metal material.
  • the circuit substrate 10 can also reduce separation of the flexible sheets 26 , as described below. More specifically, the thickness of the reinforcing insulative film 20 b is not larger than and substantially the same as that of the wiring conductor 30 b. The thickness of the reinforcing insulative film 20 c is not larger than and substantially the same as that of the wiring conductor 30 c. The thickness of the reinforcing insulative film 20 d is not larger than and substantially the same as that of the ground conductor 37 . The thickness of the reinforcing insulative film 24 b is not larger than and substantially the same as that of the wiring conductor 36 b. The thickness of the reinforcing insulative film 24 c is not larger than and substantially the same as that of the wiring conductor 36 c.
  • the thickness of the reinforcing insulative film 24 d is not larger than and substantially the same as that of the ground conductor 40 . Accordingly, the existence of the reinforcing insulative films 20 b to 20 d and 24 b to 24 d can reduce differences in height occurring on the front sides of the flexible sheets 26 caused by the wiring conductors 30 b, 30 c, 36 b, and 36 c and the ground conductors 37 and 40 . Therefore, gaps are prevented from being formed between the flexible sheets 26 when the flexible sheets 26 are press-bonded. As a result, the flexible sheets 26 are firmly attached together and are not prone to being separated.
  • the reinforcing insulative films 20 b to 20 d and 24 b to 24 d accommodate differences in height caused by the thicknesses of the wiring conductors 30 b, 30 c, 36 b, and 36 c and the ground conductors 37 and 40 , the surface flatness in the circuit substrate 10 , which is a lamination of the flexible sheets 26 , can be improved.
  • FIG. 5 is an exploded perspective view of the circuit substrate 10 a according to the first variation.
  • the main body 11 includes semi-rigid regions SR 1 and SR 2 , in addition to the rigid regions R 1 and R 2 and the flexible region F 1 .
  • the semi-rigid region SR 1 is disposed between the rigid region R 1 and the flexible region F 1 .
  • the semi-rigid region SR 2 is disposed between the rigid region R 2 and the flexible region F 1 .
  • the rigid regions R 1 and R 2 are less deformable than the semi-rigid regions SR 1 and SR 2 .
  • the flexible region F 1 is more easily deformable than the semi-rigid regions SR 1 and SR 2 .
  • the semi-rigid regions SR 1 and SR 2 are configured such that both ends of the flexible region F 1 in the x-axis direction are hard. Specifically, to form the semi-rigid regions SR 1 and SR 2 , reinforcing insulative films 55 ( 55 b, 55 d ) and 57 ( 57 b, 57 d ) are disposed.
  • the reinforcing insulative films 55 b and 57 b are disposed so as to cover the portions where the ground lines 32 b, 33 b, and 34 b are not disposed in the semi-rigid regions SR 1 and SR 2 , respectively, on the line-section sheet 31 b when seen in plan view from the z-axis direction.
  • the reinforcing insulative films 55 d and 57 d are disposed so as to cover the portions where the ground lines 32 d, 33 d, and 34 d are not disposed in the semi-rigid regions SR 1 and SR 2 , respectively, on the line-section sheet 31 d when seen in plan view from the z-axis direction.
  • the above-described circuit substrate 10 a can reduce the occurrence of breakage in the main body 11 at the border between the flexible region F 1 and each of the rigid regions R 1 and R 2 . More specifically, when the semi-rigid regions SR 1 and SR 2 are not disposed between the rigid regions R 1 and R 2 and the flexible region F 1 , the hardness of the main body 11 significantly varies at the border between the flexible region F 1 and each of the rigid regions R 1 and R 2 . If the line section (flexible region F 1 ) is bent, stress concentrates on the border between the flexible region F 1 and each of the rigid regions R 1 and R 2 . As a result, the main body 11 may be curved and broken at the border between the flexible region F 1 and each of the rigid regions R 1 and R 2 .
  • the circuit substrate 10 a includes the semi-rigid regions SR 1 and SR 2 between the rigid regions R 1 and R 2 and the flexible region F 1 . Therefore, the hardness of the main body 11 varies in stages at the border between the flexible region F 1 and each of the rigid regions R 1 and R 2 . Therefore, if the line section 16 (flexible region F 1 ) is bent, stress is distributed to the semi-rigid regions SR 1 and SR 2 . As a result, the occurrence of breakage in the main body 11 at the border between the flexible region F 1 and each of the rigid regions R 1 and R 2 can be reduced.
  • FIG. 6 is an exploded perspective view of the circuit substrate 10 b according to the second variation.
  • a coil L is incorporated in the substrate section 12 (rigid region R 1 ).
  • the coil L includes spiral coil conductors 60 b and 60 c. Both ends of the coil L are connected to signal lines 64 b and 64 c.
  • the signal lines 64 b and 64 c extend in the line section 16 along the x-axis direction.
  • the signal lines 64 b and 64 c are connected to wiring conductors 62 b and 62 c electrically coupled to the lands 35 .
  • the circuit substrate 10 b functions as a transmit/receive circuit for high-frequency signals by using the coil L as an antenna.
  • the circuit substrate 10 b can reduce changes in the frequency characteristic of the coil L by providing the substrate section 12 with the reinforcing insulative films 20 b and 20 c and thereby making the substrate section 12 be the rigid region R 1 , which is not easily deformable.
  • FIG. 7 is a cross-sectional configuration view of the circuit substrate 10 c according to the third variation.
  • the flexible sheets 26 have the same shape when seen in plan view from the z-axis direction. That is, for the circuit substrates 10 , 10 a, and 10 b, the number of the flexible sheets 26 is the same at any location.
  • the number of the flexible sheets 26 in the flexible region F 1 is smaller than the number of the flexible sheets 26 in the rigid regions R 1 and R 2 .
  • the thickness in the flexible region F 1 is smaller and the flexible region F 1 is softer.
  • the flexible sheets 26 a and 26 d in the flexible region F 1 may be removed.
  • the flexible sheets 26 a and 26 d from which the portion in the flexible region F 1 has been removed may be press-bonded.
  • each of the rigid regions R 1 and R 2 indicates a region where electronic components, such as the chip components 50 , are implemented, a region where the coil L is disposed, and similar regions.
  • the flexible region F 1 indicates a region where, even if it is deformed, circuit characteristics are not easily changed and where the signal lines 42 c, 43 c, and 44 c and other elements are disposed.
  • preferred embodiments of the present invention are useful in a circuit substrate and a method of manufacturing the same.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
US13/430,736 2009-09-30 2012-03-27 Circuit substrate and method of manufacturing same Abandoned US20120181068A1 (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160014893A1 (en) * 2013-07-30 2016-01-14 Murata Manufacturing Co., Ltd. Multilayer board
US9560766B2 (en) 2013-02-14 2017-01-31 Murata Manufacturing Co., Ltd. Circuit board and method for producing same
US20170257944A1 (en) * 2014-08-29 2017-09-07 Nokia Technologies Oy Apparatus and associated methods for deformable electronics
US9832889B2 (en) 2013-02-14 2017-11-28 Murata Manufacturing Co., Ltd. Circuit board and method for producing same
US10187975B2 (en) 2016-04-20 2019-01-22 Murata Manufacturing Co., Ltd. Multilayer substrate and electronic device
KR20200067613A (ko) * 2018-12-04 2020-06-12 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
US11083083B2 (en) 2017-12-26 2021-08-03 Murata Manufacturing Co., Ltd. Inductor bridge and electronic device
US20210378104A1 (en) * 2019-02-11 2021-12-02 Olympus Winter & Ibe Gmbh Autoclavable electronics unit for an endoscope, method for producing an autoclavable electronics unit and endoscope
US20220320708A1 (en) * 2021-04-05 2022-10-06 Nidec Mobility Corporation Communication device
US20240014565A1 (en) * 2022-07-08 2024-01-11 Merry Electronics Co., Ltd. Antenna module

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6240007B2 (ja) * 2014-03-18 2017-11-29 日本メクトロン株式会社 フレキシブルプリント基板の製造方法およびフレキシブルプリント基板の製造に用いられる中間生成物
US10222036B2 (en) * 2015-08-27 2019-03-05 GE Lighting Solutions, LLC Method and system for a three-dimensional (3-D) flexible light emitting diode (LED) bar
CN105430887B (zh) * 2015-12-29 2018-06-29 广东欧珀移动通信有限公司 线路板及具有所述线路板的终端
CN105611726B (zh) * 2016-02-25 2018-12-11 广东欧珀移动通信有限公司 软硬结合板及移动终端
KR101877669B1 (ko) * 2017-03-20 2018-08-09 한전케이피에스 주식회사 연성 회로 기판 및 이를 포함하는 내시경 유닛
US10602608B2 (en) * 2017-08-22 2020-03-24 Taiyo Yuden Co., Ltd. Circuit board
JP6745770B2 (ja) 2017-08-22 2020-08-26 太陽誘電株式会社 回路基板
JP7297431B2 (ja) * 2018-12-11 2023-06-26 株式会社小糸製作所 回路基板及び車両用灯具
CN113109698B (zh) * 2021-04-13 2024-08-02 深圳市三维电路科技有限公司 一种多层软硬结合线路板的缺陷测试方法
JP7165374B1 (ja) * 2022-02-18 2022-11-04 エレファンテック株式会社 電子装置及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7903915B2 (en) * 2009-05-20 2011-03-08 Schlumberger Technology Corporation Cable with intermediate member disconnection sections
US8168893B2 (en) * 2008-01-25 2012-05-01 Ibiden, Co., Ltd. Multilayer wiring board with concave portion for accomodating electronic component
US8383948B2 (en) * 2009-09-18 2013-02-26 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
US8405999B2 (en) * 2008-03-10 2013-03-26 Ibiden Co., Ltd. Flexible wiring board and method of manufacturing same

Family Cites Families (570)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3364564A (en) 1965-06-28 1968-01-23 Gregory Ind Inc Method of producing welding studs dischargeable in end-to-end relationship
JPS5754964B2 (zh) 1974-05-08 1982-11-20
JPS6193701A (ja) 1984-10-13 1986-05-12 Toyota Motor Corp 自動車用アンテナ装置
JPS61284102A (ja) 1985-06-11 1986-12-15 Oki Electric Ind Co Ltd 携帯形無線機のアンテナ
JPS62127140U (zh) 1986-02-03 1987-08-12
JPH01212035A (ja) 1987-08-13 1989-08-25 Secom Co Ltd 電磁界ダイバ−シチ受信方式
WO1989007347A1 (en) 1988-02-04 1989-08-10 Uniscan Ltd. Magnetic field concentrator
JPH0744114B2 (ja) 1988-12-16 1995-05-15 株式会社村田製作所 積層チップコイル
JPH02164105A (ja) 1988-12-19 1990-06-25 Mitsubishi Electric Corp スパイラルアンテナ
US5253969A (en) 1989-03-10 1993-10-19 Sms Schloemann-Siemag Aktiengesellschaft Feeding system for strip material, particularly in treatment plants for metal strips
JPH03171385A (ja) 1989-11-30 1991-07-24 Sony Corp 情報カード
JP2662742B2 (ja) 1990-03-13 1997-10-15 株式会社村田製作所 バンドパスフィルタ
JP2763664B2 (ja) 1990-07-25 1998-06-11 日本碍子株式会社 分布定数回路用配線基板
JPH04150011A (ja) 1990-10-12 1992-05-22 Tdk Corp 複合電子部品
JPH04167500A (ja) 1990-10-30 1992-06-15 Omron Corp プリント基板管理システム
JP2539367Y2 (ja) 1991-01-30 1997-06-25 株式会社村田製作所 積層型電子部品
NL9100176A (nl) 1991-02-01 1992-03-02 Nedap Nv Antenne met transformator voor contactloze informatieoverdracht vanuit integrated circuit-kaart.
JP2558330Y2 (ja) 1991-02-06 1997-12-24 オムロン株式会社 電磁結合型電子機器
NL9100347A (nl) 1991-02-26 1992-03-02 Nedap Nv Geintegreerde transformator voor een contactloze identificatiekaart.
JPH04321190A (ja) 1991-04-22 1992-11-11 Mitsubishi Electric Corp 非接触型携帯記憶装置のアンテナ回路
JPH0745933Y2 (ja) 1991-06-07 1995-10-18 太陽誘電株式会社 積層セラミックインダクタンス素子
EP0522806B1 (en) 1991-07-08 1996-11-20 Nippon Telegraph And Telephone Corporation Retractable antenna system
JP2839782B2 (ja) 1992-02-14 1998-12-16 三菱電機株式会社 プリント化スロットアンテナ
JPH05327331A (ja) 1992-05-15 1993-12-10 Matsushita Electric Works Ltd プリントアンテナ
JP3186235B2 (ja) 1992-07-30 2001-07-11 株式会社村田製作所 共振器アンテナ
JPH0677729A (ja) 1992-08-25 1994-03-18 Mitsubishi Electric Corp アンテナ一体化マイクロ波回路
JP2592328Y2 (ja) 1992-09-09 1999-03-17 神鋼電機株式会社 アンテナ装置
JPH06177635A (ja) 1992-12-07 1994-06-24 Mitsubishi Electric Corp クロスダイポールアンテナ装置
JPH06260949A (ja) 1993-03-03 1994-09-16 Seiko Instr Inc 無線機器
JPH06326424A (ja) * 1993-05-17 1994-11-25 Sharp Corp 多層配線板
JPH07183836A (ja) 1993-12-22 1995-07-21 San'eisha Mfg Co Ltd 配電線搬送通信用結合フィルタ装置
US5491483A (en) 1994-01-05 1996-02-13 Texas Instruments Incorporated Single loop transponder system and method
JP3427527B2 (ja) 1994-12-26 2003-07-22 凸版印刷株式会社 生分解性積層体及び生分解性カード
US6096431A (en) 1994-07-25 2000-08-01 Toppan Printing Co., Ltd. Biodegradable cards
JP2999374B2 (ja) 1994-08-10 2000-01-17 太陽誘電株式会社 積層チップインダクタ
JP3141692B2 (ja) 1994-08-11 2001-03-05 松下電器産業株式会社 ミリ波用検波器
DE4431754C1 (de) 1994-09-06 1995-11-23 Siemens Ag Trägerelement
US5528222A (en) 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
JPH0887580A (ja) 1994-09-14 1996-04-02 Omron Corp データキャリア及びボールゲーム
JP3064840B2 (ja) 1994-12-22 2000-07-12 ソニー株式会社 Ｉｃカード
JP2837829B2 (ja) 1995-03-31 1998-12-16 松下電器産業株式会社 半導体装置の検査方法
JPH08279027A (ja) 1995-04-04 1996-10-22 Toshiba Corp 無線通信カード
US5955723A (en) 1995-05-03 1999-09-21 Siemens Aktiengesellschaft Contactless chip card
JPH08307126A (ja) 1995-05-09 1996-11-22 Kyocera Corp アンテナの収納構造
JP3637982B2 (ja) 1995-06-27 2005-04-13 株式会社荏原電産 インバータ駆動ポンプの制御システム
US5629241A (en) 1995-07-07 1997-05-13 Hughes Aircraft Company Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
JP3150575B2 (ja) 1995-07-18 2001-03-26 沖電気工業株式会社 タグ装置及びその製造方法
GB2305075A (en) 1995-09-05 1997-03-26 Ibm Radio Frequency Tag for Electronic Apparatus
DE19534229A1 (de) 1995-09-15 1997-03-20 Licentia Gmbh Transponderanordnung
JPH0993029A (ja) 1995-09-21 1997-04-04 Matsushita Electric Ind Co Ltd アンテナ装置
JP3882218B2 (ja) 1996-03-04 2007-02-14 ソニー株式会社 光ディスク
JP3471160B2 (ja) 1996-03-18 2003-11-25 株式会社東芝 モノリシックアンテナ
JPH09270623A (ja) 1996-03-29 1997-10-14 Murata Mfg Co Ltd アンテナ装置
JPH09284038A (ja) 1996-04-17 1997-10-31 Nhk Spring Co Ltd 非接触データキャリアのアンテナ装置
JPH09294374A (ja) 1996-04-26 1997-11-11 Hitachi Ltd 電源回路
JP3427663B2 (ja) 1996-06-18 2003-07-22 凸版印刷株式会社 非接触ｉｃカード
AUPO055296A0 (en) 1996-06-19 1996-07-11 Integrated Silicon Design Pty Ltd Enhanced range transponder system
US6104311A (en) 1996-08-26 2000-08-15 Addison Technologies Information storage and identification tag
JP3767030B2 (ja) 1996-09-09 2006-04-19 三菱電機株式会社 折畳式無線通信装置
AU4705097A (en) 1996-10-09 1998-05-05 Evc Rigid Film Gmbh Method and connection arrangement for producing a smart card
JPH10171954A (ja) 1996-12-05 1998-06-26 Hitachi Maxell Ltd 非接触式ｉｃカード
JP3279205B2 (ja) 1996-12-10 2002-04-30 株式会社村田製作所 表面実装型アンテナおよび通信機
JPH10193849A (ja) 1996-12-27 1998-07-28 Rohm Co Ltd 回路チップ搭載カードおよび回路チップモジュール
JPH10193851A (ja) 1997-01-08 1998-07-28 Denso Corp 非接触カード
DE19703029A1 (de) 1997-01-28 1998-07-30 Amatech Gmbh & Co Kg Übertragungsmodul für eine Transpondervorrichtung sowie Transpondervorrichtung und Verfahren zum Betrieb einer Transpondervorrichtung
JPH10242742A (ja) 1997-02-26 1998-09-11 Harada Ind Co Ltd 送受信アンテナ
EP0966775A4 (en) 1997-03-10 2004-09-22 Prec Dynamics Corp REACTIVE COUPLED ELEMENTS IN CIRCUITS ON FLEXIBLE SUBSTRATES
JPH10293828A (ja) 1997-04-18 1998-11-04 Omron Corp データキャリア、コイルモジュール、リーダライタ及び衣服データ取得方法
JP3900593B2 (ja) 1997-05-27 2007-04-04 凸版印刷株式会社 Ｉｃカードおよびｉｃモジュール
JPH11346114A (ja) 1997-06-11 1999-12-14 Matsushita Electric Ind Co Ltd アンテナ装置
JPH1125244A (ja) 1997-06-27 1999-01-29 Toshiba Chem Corp 非接触データキャリアパッケージ
JP3621560B2 (ja) 1997-07-24 2005-02-16 三菱電機株式会社 電磁誘導型データキャリアシステム
JPH1175329A (ja) 1997-08-29 1999-03-16 Hitachi Ltd 非接触ｉｃカードシステム
JPH1185937A (ja) 1997-09-02 1999-03-30 Nippon Lsi Card Kk 非接触式ｌｓｉカード及びその検査方法
JPH1188241A (ja) 1997-09-04 1999-03-30 Nippon Steel Corp データキャリアシステム
JPH11103209A (ja) 1997-09-26 1999-04-13 Fujitsu Ten Ltd 電波受信装置
JP3853930B2 (ja) 1997-09-26 2006-12-06 株式会社マースエンジニアリング 非接触データキャリアパッケージおよびその製造方法
JP3800765B2 (ja) 1997-11-14 2006-07-26 凸版印刷株式会社 複合ｉｃカード
JP3800766B2 (ja) 1997-11-14 2006-07-26 凸版印刷株式会社 複合ｉｃモジュールおよび複合ｉｃカード
JPH11149536A (ja) 1997-11-14 1999-06-02 Toppan Printing Co Ltd 複合ｉｃカード
EP1031939B1 (en) 1997-11-14 2005-09-14 Toppan Printing Co., Ltd. Composite ic card
JPH11175678A (ja) 1997-12-09 1999-07-02 Toppan Printing Co Ltd Ｉｃモジュールとそのモジュールを搭載したｉｃカード
JPH11220319A (ja) 1998-01-30 1999-08-10 Sharp Corp アンテナ装置
JPH11219420A (ja) 1998-02-03 1999-08-10 Tokin Corp Ｉｃカードモジュール、ｉｃカード及びそれらの製造方法
JP2001084463A (ja) 1999-09-14 2001-03-30 Miyake:Kk 共振回路
JPH11261325A (ja) 1998-03-10 1999-09-24 Shiro Sugimura コイル素子と、その製造方法
JP4260917B2 (ja) 1998-03-31 2009-04-30 株式会社東芝 ループアンテナ
EP0987789A4 (en) 1998-03-31 2004-09-22 Matsushita Electric Ind Co Ltd ANTENNA AND DIGITAL TELEVISION
US5936150A (en) 1998-04-13 1999-08-10 Rockwell Science Center, Llc Thin film resonant chemical sensor with resonant acoustic isolator
CN1267267A (zh) 1998-04-14 2000-09-20 德克萨斯黎伯迪纸板箱公司 用于压缩机和其它货物的容器
JP4030651B2 (ja) 1998-05-12 2008-01-09 三菱電機株式会社 携帯型電話機
JPH11328352A (ja) 1998-05-19 1999-11-30 Tokin Corp アンテナとｉｃチップとの接続構造、及びｉｃカード
US6107920A (en) 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6018299A (en) 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
JP2000021639A (ja) 1998-07-02 2000-01-21 Sharp Corp インダクター、これを用いた共振回路、整合回路、アンテナ回路及び発振回路
JP2000021128A (ja) 1998-07-03 2000-01-21 Nippon Steel Corp 円盤状記憶媒体及びその収納ケース
JP2000022421A (ja) 1998-07-03 2000-01-21 Murata Mfg Co Ltd チップアンテナ及びそれを搭載した無線機器
AUPP473898A0 (en) 1998-07-20 1998-08-13 Integrated Silicon Design Pty Ltd Metal screened electronic labelling system
EP0977145A3 (en) 1998-07-28 2002-11-06 Kabushiki Kaisha Toshiba Radio IC card
JP2000311226A (ja) 1998-07-28 2000-11-07 Toshiba Corp 無線ｉｃカード及びその製造方法並びに無線ｉｃカード読取り書込みシステム
JP3956172B2 (ja) 1998-07-31 2007-08-08 吉川アールエフシステム株式会社 データキャリア及びデータキャリア用アンテナ
JP2000059260A (ja) 1998-08-04 2000-02-25 Sony Corp 記憶装置
CA2338522C (en) 1998-08-14 2009-04-07 3M Innovative Properties Company Radio frequency identification systems applications
ES2198938T3 (es) 1998-08-14 2004-02-01 3M Innovative Properties Company Aplicacion para un sistema de identificacion de radiofrecuencia.
JP4411670B2 (ja) 1998-09-08 2010-02-10 凸版印刷株式会社 非接触ｉｃカードの製造方法
JP4508301B2 (ja) 1998-09-16 2010-07-21 大日本印刷株式会社 非接触ｉｃカード
JP3632466B2 (ja) 1998-10-23 2005-03-23 凸版印刷株式会社 非接触ｉｃカード用の検査装置および検査方法
JP2000137779A (ja) 1998-10-30 2000-05-16 Hitachi Maxell Ltd 非接触情報媒体とその製造方法
JP3924962B2 (ja) 1998-10-30 2007-06-06 株式会社デンソー 皿状物品用ｉｄタグ
JP2000137785A (ja) 1998-10-30 2000-05-16 Sony Corp 非接触型ｉｃカードの製造方法および非接触型ｉｃカード
US6837438B1 (en) 1998-10-30 2005-01-04 Hitachi Maxell, Ltd. Non-contact information medium and communication system utilizing the same
JP2000148948A (ja) 1998-11-05 2000-05-30 Sony Corp 非接触型ｉｃラベルおよびその製造方法
JP2000172812A (ja) 1998-12-08 2000-06-23 Hitachi Maxell Ltd 非接触情報媒体
FR2787640B1 (fr) 1998-12-22 2003-02-14 Gemplus Card Int Agencement d'une antenne dans un environnement metallique
JP3088404B2 (ja) 1999-01-14 2000-09-18 埼玉日本電気株式会社 移動無線端末および内蔵アンテナ
JP2000222540A (ja) 1999-02-03 2000-08-11 Hitachi Maxell Ltd 非接触型半導体タグ
JP2000228602A (ja) 1999-02-08 2000-08-15 Alps Electric Co Ltd 共振線路
JP2000243797A (ja) 1999-02-18 2000-09-08 Sanken Electric Co Ltd 半導体ウエハ及びその切断法並びに半導体ウエハ組立体及びその切断法
JP3967487B2 (ja) 1999-02-23 2007-08-29 株式会社東芝 Ｉｃカード
JP2000251049A (ja) 1999-03-03 2000-09-14 Konica Corp カード及びその製造方法
JP4106673B2 (ja) 1999-03-05 2008-06-25 株式会社エフ・イー・シー コイルユニットを使用するアンテナ装置、プリント回路基板
JP4349597B2 (ja) 1999-03-26 2009-10-21 大日本印刷株式会社 Ｉｃチップの製造方法及びそれを内蔵したメモリー媒体の製造方法
JP3751178B2 (ja) 1999-03-30 2006-03-01 日本碍子株式会社 送受信機
US6542050B1 (en) 1999-03-30 2003-04-01 Ngk Insulators, Ltd. Transmitter-receiver
JP2000286634A (ja) 1999-03-30 2000-10-13 Ngk Insulators Ltd アンテナ装置及びアンテナ装置の製造方法
JP3067764B1 (ja) 1999-03-31 2000-07-24 株式会社豊田自動織機製作所 移動体通信用結合器、移動体及び移動体の通信方法
JP2000321984A (ja) 1999-05-12 2000-11-24 Hitachi Ltd Ｒｆ−ｉｄタグ付きラベル
JP4286977B2 (ja) 1999-07-02 2009-07-01 大日本印刷株式会社 非接触型ｉｃカードとそのアンテナ特性調整方法
JP3557130B2 (ja) 1999-07-14 2004-08-25 新光電気工業株式会社 半導体装置の製造方法
JP2001043340A (ja) 1999-07-29 2001-02-16 Toppan Printing Co Ltd 複合ｉｃカード
JP2001066990A (ja) 1999-08-31 2001-03-16 Sumitomo Bakelite Co Ltd Ｉｃタグの保護フィルム及び保護方法
US6259369B1 (en) 1999-09-30 2001-07-10 Moore North America, Inc. Low cost long distance RFID reading
JP2001101369A (ja) 1999-10-01 2001-04-13 Matsushita Electric Ind Co Ltd Ｒｆタグ
JP3451373B2 (ja) 1999-11-24 2003-09-29 オムロン株式会社 電磁波読み取り可能なデータキャリアの製造方法
JP4186149B2 (ja) 1999-12-06 2008-11-26 株式会社エフ・イー・シー Ｉｃカード用の補助アンテナ
JP2001188890A (ja) 2000-01-05 2001-07-10 Omron Corp 非接触タグ
US7334734B2 (en) 2000-01-27 2008-02-26 Hitachi Maxwell, Ltd. Non-contact IC module
JP2001209767A (ja) 2000-01-27 2001-08-03 Hitachi Maxell Ltd 非接触ｉｃモジュールを備えた被アクセス体
JP2001240046A (ja) 2000-02-25 2001-09-04 Toppan Forms Co Ltd 容器及びその製造方法
JP4514880B2 (ja) 2000-02-28 2010-07-28 大日本印刷株式会社 書籍の配送、返品および在庫管理システム
JP2001257292A (ja) 2000-03-10 2001-09-21 Hitachi Maxell Ltd 半導体装置
JP2001256457A (ja) 2000-03-13 2001-09-21 Toshiba Corp 半導体装置及びその製造方法、ｉｃカード通信システム
JP2003529163A (ja) 2000-03-28 2003-09-30 ルカトロン アーゲー 共振周波数を調整する部材を有するｒｆｉｄラベル
JP4624537B2 (ja) 2000-04-04 2011-02-02 大日本印刷株式会社 非接触式データキャリア装置、収納体
JP4624536B2 (ja) 2000-04-04 2011-02-02 大日本印刷株式会社 非接触式データキャリア装置
JP2001291181A (ja) 2000-04-07 2001-10-19 Ricoh Elemex Corp センサ装置及びセンサシステム
JP2001319380A (ja) 2000-05-11 2001-11-16 Mitsubishi Materials Corp Ｒｆｉｄ付光ディスク
JP2001331976A (ja) 2000-05-17 2001-11-30 Casio Comput Co Ltd 光記録型記録媒体
JP4223174B2 (ja) 2000-05-19 2009-02-12 Ｄｘアンテナ株式会社 フィルムアンテナ
JP2001339226A (ja) 2000-05-26 2001-12-07 Nec Saitama Ltd アンテナ装置
JP2001344574A (ja) 2000-05-30 2001-12-14 Mitsubishi Materials Corp 質問器のアンテナ装置
JP2001352176A (ja) 2000-06-05 2001-12-21 Fuji Xerox Co Ltd 多層プリント配線基板および多層プリント配線基板製造方法
EP1290618A2 (en) 2000-06-06 2003-03-12 Battelle Memorial Institute Remote communication system
JP2001358527A (ja) 2000-06-12 2001-12-26 Matsushita Electric Ind Co Ltd アンテナ装置
JP2002157564A (ja) 2000-11-21 2002-05-31 Toyo Aluminium Kk Ｉｃカード用アンテナコイルとその製造方法
US6400323B2 (en) 2000-06-23 2002-06-04 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
JP2004503125A (ja) 2000-07-04 2004-01-29 クレディパス　カンパニー　リミテッド 受動トランスポンダ認識システム及びクレジットカード式トランスポンダ
JP4138211B2 (ja) 2000-07-06 2008-08-27 株式会社村田製作所 電子部品およびその製造方法、集合電子部品、電子部品の実装構造、ならびに電子装置
JP2002024776A (ja) 2000-07-07 2002-01-25 Nippon Signal Co Ltd:The Ｉｃカード用リーダライタ
JP2001076111A (ja) 2000-07-12 2001-03-23 Hitachi Kokusai Electric Inc 共振回路
JP2002032731A (ja) 2000-07-14 2002-01-31 Sony Corp 非接触式情報交換カード
US7088249B2 (en) 2000-07-19 2006-08-08 Hanex Co., Ltd. Housing structure for RFID tag, installation structure for RFID tag, and communication using such RFID tag
RU2163739C1 (ru) 2000-07-20 2001-02-27 Криштопов Александр Владимирович Антенна
JP2002042076A (ja) 2000-07-21 2002-02-08 Dainippon Printing Co Ltd 非接触型データキャリア及び非接触型データキャリアを有する冊子
JP2002042083A (ja) 2000-07-27 2002-02-08 Hitachi Maxell Ltd 非接触通信式情報担体
JP3075400U (ja) 2000-08-03 2001-02-16 昌栄印刷株式会社 非接触型ｉｃカード
US6466007B1 (en) 2000-08-14 2002-10-15 Teradyne, Inc. Test system for smart card and indentification devices and the like
JP2002063557A (ja) 2000-08-21 2002-02-28 Mitsubishi Materials Corp Ｒｆｉｄ用タグ
JP2002076750A (ja) 2000-08-24 2002-03-15 Murata Mfg Co Ltd アンテナ装置およびそれを備えた無線機
JP2002143826A (ja) 2000-08-30 2002-05-21 Denso Corp 廃棄物のリサイクルシステムおよび不法投棄検出システム
JP3481575B2 (ja) 2000-09-28 2003-12-22 寛児 川上 アンテナ
JP4615695B2 (ja) 2000-10-19 2011-01-19 三星エスディーエス株式会社 Ｉｃカード用のｉｃモジュールと、それを使用するｉｃカード
US6634564B2 (en) 2000-10-24 2003-10-21 Dai Nippon Printing Co., Ltd. Contact/noncontact type data carrier module
JP4628611B2 (ja) 2000-10-27 2011-02-09 三菱マテリアル株式会社 アンテナ
JP4432254B2 (ja) 2000-11-20 2010-03-17 株式会社村田製作所 表面実装型アンテナ構造およびそれを備えた通信機
JP2002185358A (ja) 2000-11-24 2002-06-28 Supersensor Pty Ltd 容器にｒｆトランスポンダを装着する方法
JP4641096B2 (ja) 2000-12-07 2011-03-02 大日本印刷株式会社 非接触式データキャリア装置とブースターアンテナ部用配線部材
JP2002183676A (ja) 2000-12-08 2002-06-28 Hitachi Ltd 情報読み取り装置
JP2002175920A (ja) 2000-12-08 2002-06-21 Murata Mfg Co Ltd 高周波用フィルタ素子
JP2002183690A (ja) 2000-12-11 2002-06-28 Hitachi Maxell Ltd 非接触ｉｃタグ装置
AU2002226093A1 (en) 2000-12-15 2002-06-24 Electrox Corp. Process for the manufacture of novel, inexpensive radio frequency identificationdevices
JP3788325B2 (ja) 2000-12-19 2006-06-21 株式会社村田製作所 積層型コイル部品及びその製造方法
TW531976B (en) 2001-01-11 2003-05-11 Hanex Co Ltd Communication apparatus and installing structure, manufacturing method and communication method
JP3621655B2 (ja) 2001-04-23 2005-02-16 株式会社ハネックス中央研究所 Ｒｆｉｄタグ構造及びその製造方法
JP2002280821A (ja) 2001-01-12 2002-09-27 Furukawa Electric Co Ltd:The アンテナ装置および端末機器
KR20020061103A (ko) 2001-01-12 2002-07-22 후루까와덴끼고오교 가부시끼가이샤 안테나 장치 및 이 안테나 장치가 부착된 단말기기
JP2002222398A (ja) 2001-01-25 2002-08-09 Jstm Kk 非接触データキャリア
JP2002232221A (ja) 2001-01-30 2002-08-16 Alps Electric Co Ltd 送受信ユニット
JPWO2002061675A1 (ja) 2001-01-31 2004-06-03 株式会社ルネサステクノロジ 非接触識別媒体
JP4662400B2 (ja) 2001-02-05 2011-03-30 大日本印刷株式会社 コイルオンチップ型の半導体モジュール付き物品
JP2002246828A (ja) 2001-02-15 2002-08-30 Mitsubishi Materials Corp トランスポンダのアンテナ
JP4396046B2 (ja) 2001-02-16 2010-01-13 株式会社デンソー Ｉｄタグ用リーダライタ
ATE499725T1 (de) 2001-03-02 2011-03-15 Nxp Bv Modul und elektronische vorrichtung
JP4712986B2 (ja) 2001-03-06 2011-06-29 大日本印刷株式会社 Ｒｆｉｄタグ付き液体容器
JP2002290130A (ja) 2001-03-28 2002-10-04 Aiwa Co Ltd 無線通信機器
JP3570386B2 (ja) 2001-03-30 2004-09-29 松下電器産業株式会社 無線機能内蔵携帯用情報端末
JP3772778B2 (ja) 2001-03-30 2006-05-10 三菱マテリアル株式会社 アンテナコイル及びそれを用いた識別タグ、リーダライタ装置、リーダ装置及びライタ装置
JP2002298109A (ja) 2001-03-30 2002-10-11 Toppan Forms Co Ltd 非接触型ｉｃメディアおよびその製造方法
JP2002308437A (ja) 2001-04-16 2002-10-23 Dainippon Printing Co Ltd Ｒｆｉｄタグを用いた検査システム
JP2002319812A (ja) 2001-04-20 2002-10-31 Oji Paper Co Ltd データキャリヤ貼着方法
JP4700831B2 (ja) 2001-04-23 2011-06-15 株式会社ハネックス Ｒｆｉｄタグの通信距離拡大方法
JP4265114B2 (ja) 2001-04-26 2009-05-20 三菱マテリアル株式会社 タグ用アンテナコイル
JP2002325013A (ja) 2001-04-26 2002-11-08 Mitsubishi Materials Corp アンテナコイル
JP2005236339A (ja) 2001-07-19 2005-09-02 Oji Paper Co Ltd Ｉｃチップ実装体
FI112550B (fi) 2001-05-31 2003-12-15 Rafsec Oy Älytarra ja älytarraraina
JP2002362613A (ja) 2001-06-07 2002-12-18 Toppan Printing Co Ltd 非接触ｉｃが積層された積層包装材及びこれを用いた包装容器、並びに包装容器の開封検出方法
JP2002366917A (ja) 2001-06-07 2002-12-20 Hitachi Ltd アンテナを内蔵するｉｃカード
JP4710174B2 (ja) 2001-06-13 2011-06-29 株式会社村田製作所 バランス型ｌｃフィルタ
JP2002373029A (ja) 2001-06-18 2002-12-26 Hitachi Ltd Ｉｃタグによるソフトウェアの不正コピーの防止方法
JP4882167B2 (ja) 2001-06-18 2012-02-22 大日本印刷株式会社 非接触ｉｃチップ付きカード一体型フォーム
JP4759854B2 (ja) 2001-06-19 2011-08-31 株式会社寺岡精工 Ｉｃタグの金属物への装着方法及びｉｃタグ内蔵マーカー
JP2003087008A (ja) 2001-07-02 2003-03-20 Ngk Insulators Ltd 積層型誘電体フィルタ
JP4058919B2 (ja) 2001-07-03 2008-03-12 日立化成工業株式会社 非接触式ｉｃラベル、非接触式ｉｃカード、非接触式ｉｃラベルまたは非接触式ｉｃカード用ｉｃモジュール
JP2003026177A (ja) 2001-07-12 2003-01-29 Toppan Printing Co Ltd 非接触方式ｉｃチップ付き包装体
JP2003030612A (ja) 2001-07-19 2003-01-31 Oji Paper Co Ltd Ｉｃチップ実装体
JP4670195B2 (ja) 2001-07-23 2011-04-13 凸版印刷株式会社 非接触式ｉｃカードを備えた携帯電話機用筐体
US7274285B2 (en) 2001-07-24 2007-09-25 Hewlett-Packard Development Company, L.P. System and method for improved object identification
DE60131270T2 (de) 2001-07-26 2008-08-21 Irdeto Access B.V. Zeitvaliderungssystem
JP3629448B2 (ja) 2001-07-27 2005-03-16 Ｔｄｋ株式会社 アンテナ装置及びそれを備えた電子機器
JP4731060B2 (ja) 2001-07-31 2011-07-20 トッパン・フォームズ株式会社 Ｒｆ−ｉｄの検査方法およびその検査システム
JP2003058840A (ja) 2001-08-14 2003-02-28 Hirano Design Sekkei:Kk Ｒｆｉｄ搭載コンピュータ記録媒体利用の情報保護管理プログラム
JP2003069335A (ja) 2001-08-28 2003-03-07 Hitachi Kokusai Electric Inc 補助アンテナ
JP2003067711A (ja) 2001-08-29 2003-03-07 Toppan Forms Co Ltd Ｉｃチップ実装体あるいはアンテナ部を備えた物品
JP2003078333A (ja) 2001-08-30 2003-03-14 Murata Mfg Co Ltd 無線通信機
JP2003078336A (ja) 2001-08-30 2003-03-14 Tokai Univ 積層スパイラルアンテナ
JP4843885B2 (ja) 2001-08-31 2011-12-21 凸版印刷株式会社 Ｉｃメモリチップ付不正防止ラベル
JP4514374B2 (ja) 2001-09-05 2010-07-28 トッパン・フォームズ株式会社 Ｒｆ−ｉｄの検査システム
JP4747467B2 (ja) 2001-09-07 2011-08-17 大日本印刷株式会社 非接触ｉｃタグ
JP2003085520A (ja) 2001-09-11 2003-03-20 Oji Paper Co Ltd Ｉｃカードの製造方法
JP2003087044A (ja) 2001-09-12 2003-03-20 Mitsubishi Materials Corp Ｒｆｉｄ用アンテナ及び該アンテナを備えたｒｆｉｄシステム
JP4698096B2 (ja) 2001-09-25 2011-06-08 トッパン・フォームズ株式会社 Ｒｆ−ｉｄの検査システム
JP2003099184A (ja) 2001-09-25 2003-04-04 Sharp Corp 情報処理システム、それに用いる情報処理装置および入力ペン
JP4845306B2 (ja) 2001-09-25 2011-12-28 トッパン・フォームズ株式会社 Ｒｆ−ｉｄの検査システム
JP2003110344A (ja) 2001-09-26 2003-04-11 Hitachi Metals Ltd 表面実装型アンテナおよびそれを搭載したアンテナ装置
KR20040037127A (ko) 2001-09-28 2004-05-04 미쓰비시 마테리알 가부시키가이샤 안테나 코일 및 그것을 이용한 ｒｆｉｄ 용 태그,트랜스폰더용 안테나
JP4196554B2 (ja) 2001-09-28 2008-12-17 三菱マテリアル株式会社 タグ用アンテナコイル及びそれを用いたｒｆｉｄ用タグ
JP2003132330A (ja) 2001-10-25 2003-05-09 Sato Corp Ｒｆｉｄラベルプリンタ
JP2003134007A (ja) 2001-10-30 2003-05-09 Auto Network Gijutsu Kenkyusho:Kk 車載機器間における信号送受信システム及び車載機器間における信号送受信方法
JP3984458B2 (ja) 2001-11-20 2007-10-03 大日本印刷株式会社 Ｉｃタグ付き包装体の製造方法
JP3908514B2 (ja) 2001-11-20 2007-04-25 大日本印刷株式会社 Ｉｃタグ付き包装体とｉｃタグ付き包装体の製造方法
US6812707B2 (en) 2001-11-27 2004-11-02 Mitsubishi Materials Corporation Detection element for objects and detection device using the same
JP3894540B2 (ja) 2001-11-30 2007-03-22 トッパン・フォームズ株式会社 導電接続部を有するインターポーザ
JP2003188338A (ja) 2001-12-13 2003-07-04 Sony Corp 回路基板装置及びその製造方法
JP3700777B2 (ja) 2001-12-17 2005-09-28 三菱マテリアル株式会社 Ｒｆｉｄ用タグの電極構造及び該電極を用いた共振周波数の調整方法
JP2003188620A (ja) 2001-12-19 2003-07-04 Murata Mfg Co Ltd モジュール一体型アンテナ
JP4028224B2 (ja) 2001-12-20 2007-12-26 大日本印刷株式会社 非接触通信機能を有する紙製ｉｃカード用基材
JP3895175B2 (ja) 2001-12-28 2007-03-22 Ｎｔｎ株式会社 誘電性樹脂統合アンテナ
JP2003209421A (ja) 2002-01-17 2003-07-25 Dainippon Printing Co Ltd 透明アンテナを有するｒｆｉｄタグ、及びその製造方法
JP3896965B2 (ja) 2002-01-17 2007-03-22 三菱マテリアル株式会社 リーダ／ライタ用アンテナ及び該アンテナを備えたリーダ／ライタ
JP3915092B2 (ja) 2002-01-21 2007-05-16 株式会社エフ・イー・シー Ｉｃカード用のブースタアンテナ
JP2003216919A (ja) 2002-01-23 2003-07-31 Toppan Forms Co Ltd Ｒｆ−ｉｄメディア
JP2003233780A (ja) 2002-02-06 2003-08-22 Mitsubishi Electric Corp データ通信装置
JP3998992B2 (ja) 2002-02-14 2007-10-31 大日本印刷株式会社 ウェブに実装されたｉｃチップへのアンテナパターン形成方法とｉｃタグ付き包装体
JP2003243918A (ja) 2002-02-18 2003-08-29 Dainippon Printing Co Ltd 非接触ｉｃタグ用アンテナと非接触ｉｃタグ
JP2003249813A (ja) 2002-02-25 2003-09-05 Tecdia Kk ループアンテナ付きｒｆｉｄ用タグ
US7119693B1 (en) 2002-03-13 2006-10-10 Celis Semiconductor Corp. Integrated circuit with enhanced coupling
JP2003288560A (ja) 2002-03-27 2003-10-10 Toppan Forms Co Ltd 帯電防止機能を有するインターポーザおよびインレットシート
US7129834B2 (en) 2002-03-28 2006-10-31 Kabushiki Kaisha Toshiba String wireless sensor and its manufacturing method
JP2003309418A (ja) 2002-04-17 2003-10-31 Alps Electric Co Ltd ダイポールアンテナ
JP2003308363A (ja) 2002-04-18 2003-10-31 Oki Electric Ind Co Ltd 製品及び関連情報管理方法
JP2003317060A (ja) 2002-04-22 2003-11-07 Dainippon Printing Co Ltd Ｉｃカード
US7135974B2 (en) 2002-04-22 2006-11-14 Symbol Technologies, Inc. Power source system for RF location/identification tags
JP2003317052A (ja) 2002-04-24 2003-11-07 Smart Card:Kk Ｉｃタグシステム
JP3879098B2 (ja) 2002-05-10 2007-02-07 株式会社エフ・イー・シー Ｉｃカード用のブースタアンテナ
JP3979178B2 (ja) 2002-05-14 2007-09-19 凸版印刷株式会社 非接触ｉｃ媒体用モジュール及び非接触ｉｃ媒体
US6753814B2 (en) 2002-06-27 2004-06-22 Harris Corporation Dipole arrangements using dielectric substrates of meta-materials
JP3863464B2 (ja) 2002-07-05 2006-12-27 株式会社ヨコオ フィルタ内蔵アンテナ
JP3803085B2 (ja) 2002-08-08 2006-08-02 株式会社日立製作所 無線ｉｃタグ
JP4100993B2 (ja) 2002-08-09 2008-06-11 キヤノン株式会社 電子機器
JP4107381B2 (ja) 2002-08-23 2008-06-25 横浜ゴム株式会社 空気入りタイヤ
JP2004088218A (ja) 2002-08-23 2004-03-18 Tokai Univ 平面アンテナ
JP4273724B2 (ja) 2002-08-29 2009-06-03 カシオ電子工業株式会社 消耗品不正使用防止システム
JP2004096566A (ja) 2002-09-02 2004-03-25 Toenec Corp 誘導通信装置
JP3925364B2 (ja) 2002-09-03 2007-06-06 株式会社豊田中央研究所 アンテナ及びダイバーシチ受信装置
JP3645239B2 (ja) 2002-09-06 2005-05-11 シャープ株式会社 ダイポールアンテナ、それを用いたタグ及び移動体識別システム
CN1809948A (zh) 2002-09-20 2006-07-26 美国快捷半导体有限公司 Rfid标签宽带宽的对数螺旋天线方法和系统
JP3975918B2 (ja) 2002-09-27 2007-09-12 ソニー株式会社 アンテナ装置
JP2004121412A (ja) 2002-09-30 2004-04-22 Toppan Printing Co Ltd 手術用ガーゼ及びその管理装置
JP2004126750A (ja) 2002-09-30 2004-04-22 Toppan Forms Co Ltd 情報書込／読出装置、アンテナ及びｒｆ−ｉｄメディア
JP3958667B2 (ja) 2002-10-16 2007-08-15 株式会社日立国際電気 リーダライタ用ループアンテナ、及びそれを備えた物品管理棚及び図書管理システム
JP2006507721A (ja) 2002-10-17 2006-03-02 アンビエント・コーポレイション 通信用電力線をセグメント化するためのフィルタ
JP4158483B2 (ja) 2002-10-22 2008-10-01 ソニー株式会社 Ｉｃモジュール
JP3941662B2 (ja) * 2002-10-30 2007-07-04 株式会社デンソー 多層配線基板の製造方法
JP3659956B2 (ja) 2002-11-11 2005-06-15 松下電器産業株式会社 圧力測定装置および圧力測定システム
JP3789424B2 (ja) 2002-11-20 2006-06-21 埼玉日本電気株式会社 携帯端末
JP2004213582A (ja) 2003-01-09 2004-07-29 Mitsubishi Materials Corp Ｒｆｉｄタグ及びリーダ／ライタ並びに該タグを備えたｒｆｉｄシステム
JP3735635B2 (ja) 2003-02-03 2006-01-18 松下電器産業株式会社 アンテナ装置とそれを用いた無線通信装置
JP2004234595A (ja) 2003-02-03 2004-08-19 Matsushita Electric Ind Co Ltd 情報記録媒体読取装置
EP1445821A1 (en) 2003-02-06 2004-08-11 Matsushita Electric Industrial Co., Ltd. Portable radio communication apparatus provided with a boom portion
US7225992B2 (en) 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
JP2004253858A (ja) 2003-02-18 2004-09-09 Minerva:Kk Ｉｃタグ用のブースタアンテナ装置
JP2004280390A (ja) 2003-03-14 2004-10-07 Toppan Forms Co Ltd Ｒｆ−ｉｄメディア及びｒｆ−ｉｄメディアの製造方法
JP4010263B2 (ja) 2003-03-14 2007-11-21 富士電機ホールディングス株式会社 アンテナ、及びデータ読取装置
JP4034676B2 (ja) 2003-03-20 2008-01-16 日立マクセル株式会社 非接触通信式情報担体
JP2004297249A (ja) 2003-03-26 2004-10-21 Matsushita Electric Ind Co Ltd 異相線間カプラーとその装着方法、及び、異相線間のカップリング方法
JP4097139B2 (ja) 2003-03-26 2008-06-11 Ｎｅｃトーキン株式会社 無線タグ
JP2004304370A (ja) 2003-03-28 2004-10-28 Sony Corp アンテナコイル及び通信機器
JP2004297681A (ja) 2003-03-28 2004-10-21 Toppan Forms Co Ltd 非接触型情報記録媒体
JP4208631B2 (ja) 2003-04-17 2009-01-14 日本ミクロン株式会社 半導体装置の製造方法
JP2004326380A (ja) 2003-04-24 2004-11-18 Dainippon Printing Co Ltd Ｒｆｉｄタグ
JP2004334268A (ja) 2003-04-30 2004-11-25 Dainippon Printing Co Ltd 紙片ｉｃタグと紙片ｉｃタグ付き書籍・雑誌、紙片ｉｃタグ付き書籍
JP2004336250A (ja) 2003-05-02 2004-11-25 Taiyo Yuden Co Ltd アンテナ整合回路、アンテナ整合回路を有する移動体通信装置、アンテナ整合回路を有する誘電体アンテナ
JP4080944B2 (ja) 2003-05-12 2008-04-23 株式会社ハネックス データキャリアの設置構造
JP2004343000A (ja) 2003-05-19 2004-12-02 Fujikura Ltd 半導体モジュールとそれを備えた非接触ｉｃタグ及び半導体モジュールの製造方法
JP2004362190A (ja) 2003-06-04 2004-12-24 Hitachi Ltd 半導体装置
JP4828088B2 (ja) 2003-06-05 2011-11-30 凸版印刷株式会社 Ｉｃタグ
JP2005005866A (ja) 2003-06-10 2005-01-06 Alps Electric Co Ltd アンテナ一体型モジュール
JP3596774B1 (ja) 2003-06-12 2004-12-02 松下電器産業株式会社 携帯無線機
JP4210559B2 (ja) 2003-06-23 2009-01-21 大日本印刷株式会社 Ｉｃタグ付シートおよびその製造方法
JP2005033461A (ja) 2003-07-11 2005-02-03 Mitsubishi Materials Corp Ｒｆｉｄシステム及び該システムにおけるアンテナの構造
JP2005050581A (ja) 2003-07-30 2005-02-24 Seiko Epson Corp 電源コード、電源コード検査装置及び電源コード検査方法
JP2005064799A (ja) 2003-08-11 2005-03-10 Toppan Printing Co Ltd 携帯型情報端末機器用ｒｆｉｄアンテナ
JP3982476B2 (ja) 2003-10-01 2007-09-26 ソニー株式会社 通信システム
JP4062233B2 (ja) 2003-10-20 2008-03-19 トヨタ自動車株式会社 ループアンテナ装置
JP4680489B2 (ja) 2003-10-21 2011-05-11 三菱電機株式会社 情報記録読取システム
JP2005134942A (ja) 2003-10-28 2005-05-26 Mitsubishi Materials Corp Ｒｆｉｄリーダ／ライタ及びアンテナの構造
JP3570430B1 (ja) 2003-10-29 2004-09-29 オムロン株式会社 ループコイルアンテナ
JP4402426B2 (ja) 2003-10-30 2010-01-20 大日本印刷株式会社 温度変化感知検出システム
JP4343655B2 (ja) 2003-11-12 2009-10-14 株式会社日立製作所 アンテナ
JP4451125B2 (ja) 2003-11-28 2010-04-14 シャープ株式会社 小型アンテナ
JP2005165839A (ja) 2003-12-04 2005-06-23 Nippon Signal Co Ltd:The リーダライタ、ｉｃタグ、物品管理装置、及び光ディスク装置
JP4177241B2 (ja) 2003-12-04 2008-11-05 株式会社日立情報制御ソリューションズ 無線ｉｃタグ用アンテナ、無線ｉｃタグ及び無線ｉｃタグ付き容器
US7494066B2 (en) 2003-12-19 2009-02-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP4916658B2 (ja) 2003-12-19 2012-04-18 株式会社半導体エネルギー研究所 半導体装置
US6999028B2 (en) 2003-12-23 2006-02-14 3M Innovative Properties Company Ultra high frequency radio frequency identification tag
JP4326936B2 (ja) 2003-12-24 2009-09-09 シャープ株式会社 無線タグ
JP4089680B2 (ja) 2003-12-25 2008-05-28 三菱マテリアル株式会社 アンテナ装置
KR101007529B1 (ko) 2003-12-25 2011-01-14 미쓰비시 마테리알 가부시키가이샤 안테나 장치 및 통신기기
JP2005210676A (ja) 2003-12-25 2005-08-04 Hitachi Ltd 無線用ｉｃタグ、無線用ｉｃタグの製造方法、及び、無線用ｉｃタグの製造装置
EP1548674A1 (en) 2003-12-25 2005-06-29 Hitachi, Ltd. Radio IC tag, method and apparatus for manufacturing the same
JP2005190417A (ja) 2003-12-26 2005-07-14 Taketani Shoji:Kk 固定物管理システム及びこのシステムに用いる個体識別子
JP4218519B2 (ja) 2003-12-26 2009-02-04 戸田工業株式会社 磁界アンテナ、それを用いて構成したワイヤレスシステムおよび通信システム
JP4174801B2 (ja) 2004-01-15 2008-11-05 株式会社エフ・イー・シー 識別タグのリーダライタ用アンテナ
FR2865329B1 (fr) 2004-01-19 2006-04-21 Pygmalyon Dispositif recepteur-emetteur passif alimente par une onde electromagnetique
JP2005210223A (ja) 2004-01-20 2005-08-04 Tdk Corp アンテナ装置
EP1706857A4 (en) 2004-01-22 2011-03-09 Mikoh Corp Modular High Frequency Identification Labeling Method
KR101270180B1 (ko) 2004-01-30 2013-05-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 검사장치 및 검사방법과, 반도체장치 제작방법
JP4271591B2 (ja) 2004-01-30 2009-06-03 双信電機株式会社 アンテナ装置
JP2005229474A (ja) 2004-02-16 2005-08-25 Olympus Corp 情報端末装置
JP4393228B2 (ja) 2004-02-27 2010-01-06 シャープ株式会社 小型アンテナ及びそれを備えた無線タグ
JP2005252853A (ja) 2004-03-05 2005-09-15 Fec Inc Ｒｆ−ｉｄ用アンテナ
JP2005277579A (ja) 2004-03-23 2005-10-06 Kyocera Corp 高周波モジュールおよびそれを用いた通信機器
CN1926721A (zh) 2004-03-24 2007-03-07 株式会社内田洋行 记录介质用ic标签粘贴片及记录介质
JP2005275870A (ja) 2004-03-25 2005-10-06 Matsushita Electric Ind Co Ltd 挿入型無線通信媒体装置および電子機器
JP2005284352A (ja) 2004-03-26 2005-10-13 Toshiba Corp 携帯可能電子装置
JP2005284455A (ja) 2004-03-29 2005-10-13 Fujita Denki Seisakusho:Kk Ｒｆｉｄシステム
JP4067510B2 (ja) 2004-03-31 2008-03-26 シャープ株式会社 テレビジョン受信装置
JP2005293537A (ja) 2004-04-05 2005-10-20 Fuji Xynetics Kk Ｉｃタグ付き段ボ−ル
US8139759B2 (en) 2004-04-16 2012-03-20 Panasonic Corporation Line state detecting apparatus and transmitting apparatus and receiving apparatus of balanced transmission system
JP2005311205A (ja) 2004-04-23 2005-11-04 Nec Corp 半導体装置
JP2005306696A (ja) 2004-04-26 2005-11-04 Matsushita Electric Ind Co Ltd 磁性フェライトおよびそれを用いたコモンモードノイズフィルタ並びにチップトランス
JP2005340759A (ja) 2004-04-27 2005-12-08 Sony Corp アンテナモジュール用磁芯部材、アンテナモジュールおよびこれを備えた携帯情報端末
JP2005322119A (ja) 2004-05-11 2005-11-17 Ic Brains Co Ltd Ｉｃタグ付き物品の不正持ち出し防止装置
JP2005321305A (ja) 2004-05-10 2005-11-17 Murata Mfg Co Ltd 電子部品測定治具
JP3867085B2 (ja) 2004-05-13 2007-01-10 東芝テック株式会社 無線通信装置、ｒｆタグリーダ／ライタおよびプリンタ
JP4191088B2 (ja) 2004-05-14 2008-12-03 株式会社デンソー 電子装置
JP2005333244A (ja) 2004-05-18 2005-12-02 Mitsubishi Electric Corp 携帯電話機
US7317396B2 (en) 2004-05-26 2008-01-08 Funai Electric Co., Ltd. Optical disc having RFID tag, optical disc apparatus, and system for preventing unauthorized copying
JP4551122B2 (ja) 2004-05-26 2010-09-22 株式会社岩田レーベル Ｒｆｉｄラベルの貼付装置
JP4360276B2 (ja) 2004-06-02 2009-11-11 船井電機株式会社 無線ｉｃタグを有する光ディスク及び光ディスク再生装置
JP2005345802A (ja) 2004-06-03 2005-12-15 Casio Comput Co Ltd 撮像装置、この撮像装置に用いられる交換ユニット、交換ユニット使用制御方法及びプログラム
JP4348282B2 (ja) 2004-06-11 2009-10-21 株式会社日立製作所 無線用ｉｃタグ、及び無線用ｉｃタグの製造方法
JP2005352858A (ja) 2004-06-11 2005-12-22 Hitachi Maxell Ltd 通信式記録担体
JP4530140B2 (ja) 2004-06-28 2010-08-25 Ｔｄｋ株式会社 軟磁性体及びそれを用いたアンテナ装置
JP4359198B2 (ja) 2004-06-30 2009-11-04 株式会社日立製作所 Ｉｃタグ実装基板の製造方法
JP4328682B2 (ja) 2004-07-13 2009-09-09 富士通株式会社 光記録媒体用の無線タグアンテナ構造および無線タグアンテナ付き光記録媒体の収納ケース
JP2006033312A (ja) 2004-07-15 2006-02-02 Matsushita Electric Ind Co Ltd アンテナ及びアンテナ取り付け方法
JP2004362602A (ja) 2004-07-26 2004-12-24 Hitachi Ltd Ｒｆｉｄタグ
JP2006039947A (ja) 2004-07-27 2006-02-09 Daido Steel Co Ltd 複合磁性シート
JP2006039902A (ja) 2004-07-27 2006-02-09 Ntn Corp Ｕｈｆ帯無線ｉｃタグ
JP2006042059A (ja) 2004-07-28 2006-02-09 Tdk Corp 無線通信装置及びそのインピ−ダンス調整方法
JP2006042097A (ja) 2004-07-29 2006-02-09 Kyocera Corp アンテナ配線基板
JP2006050200A (ja) 2004-08-04 2006-02-16 Matsushita Electric Ind Co Ltd リーダライタ
JP4653440B2 (ja) 2004-08-13 2011-03-16 富士通株式会社 Ｒｆｉｄタグおよびその製造方法
JP4482403B2 (ja) 2004-08-30 2010-06-16 日本発條株式会社 非接触情報媒体
JP4186895B2 (ja) 2004-09-01 2008-11-26 株式会社デンソーウェーブ 非接触通信装置用コイルアンテナおよびその製造方法
JP4125275B2 (ja) 2004-09-02 2008-07-30 日本電信電話株式会社 非接触ｉｃ媒体制御システム
JP2005129019A (ja) 2004-09-03 2005-05-19 Sony Chem Corp Ｉｃカード
JP2006080367A (ja) 2004-09-10 2006-03-23 Brother Ind Ltd インダクタンス素子、無線タグ回路素子、タグテープロール、及びインダクタンス素子の製造方法
US20060055531A1 (en) 2004-09-14 2006-03-16 Honeywell International, Inc. Combined RF tag and SAW sensor
JP2006092630A (ja) 2004-09-22 2006-04-06 Sony Corp 光ディスクおよびその製造方法
JP4600742B2 (ja) 2004-09-30 2010-12-15 ブラザー工業株式会社 印字ヘッド及びタグラベル作成装置
JP2006107296A (ja) 2004-10-08 2006-04-20 Dainippon Printing Co Ltd 非接触ｉｃタグおよび非接触ｉｃタグ用アンテナ
GB2419779A (en) 2004-10-29 2006-05-03 Hewlett Packard Development Co Document having conductive tracks for coupling to a memory tag and a reader
WO2006048663A1 (en) 2004-11-05 2006-05-11 Qinetiq Limited Detunable rf tags
WO2006049068A1 (ja) 2004-11-08 2006-05-11 Matsushita Electric Industrial Co., Ltd. アンテナ装置およびそれを用いた無線通信システム
JP4088797B2 (ja) 2004-11-18 2008-05-21 日本電気株式会社 Ｒｆｉｄタグ
JP2006148518A (ja) 2004-11-19 2006-06-08 Matsushita Electric Works Ltd 非接触ｉｃカードの調整装置および調整方法
JP2006151402A (ja) 2004-11-25 2006-06-15 Rengo Co Ltd 無線タグを備えた段ボール箱
US7545328B2 (en) 2004-12-08 2009-06-09 Electronics And Telecommunications Research Institute Antenna using inductively coupled feeding method, RFID tag using the same and antenna impedance matching method thereof
JP4281683B2 (ja) 2004-12-16 2009-06-17 株式会社デンソー Ｉｃタグの取付構造
JP4942998B2 (ja) 2004-12-24 2012-05-30 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の作製方法
WO2006068286A1 (en) 2004-12-24 2006-06-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP4541246B2 (ja) 2004-12-24 2010-09-08 トッパン・フォームズ株式会社 非接触ｉｃモジュール
JP4633457B2 (ja) * 2004-12-28 2011-02-16 エルナー株式会社 リジットフレキシブルプリント配線板の製造方法
JP4737505B2 (ja) 2005-01-14 2011-08-03 日立化成工業株式会社 Ｉｃタグインレット及びｉｃタグインレットの製造方法
US7714794B2 (en) 2005-01-19 2010-05-11 Behzad Tavassoli Hozouri RFID antenna
JP4711692B2 (ja) 2005-02-01 2011-06-29 富士通株式会社 メアンダラインアンテナ
JP2006232292A (ja) 2005-02-22 2006-09-07 Nippon Sheet Glass Co Ltd 電子タグ付き容器およびｒｆｉｄシステム
JP2006237674A (ja) 2005-02-22 2006-09-07 Suncall Corp パッチアンテナ及びｒｆｉｄインレット
JP2006238282A (ja) 2005-02-28 2006-09-07 Matsushita Electric Ind Co Ltd アンテナユニット、送受信装置、無線タグ読み取り装置、及び無線タグ読み取りシステム
JP4639857B2 (ja) 2005-03-07 2011-02-23 富士ゼロックス株式会社 Ｒｆｉｄタグが取り付けられた物品を収納する収納箱、その配置方法、通信方法、通信確認方法および包装構造。
EP2333561A3 (en) 2005-03-10 2014-06-11 Gen-Probe Incorporated System for performing multi-formatted assays
JP4330575B2 (ja) 2005-03-17 2009-09-16 富士通株式会社 タグアンテナ
JP4437965B2 (ja) 2005-03-22 2010-03-24 Ｎｅｃトーキン株式会社 無線タグ
JP4087859B2 (ja) 2005-03-25 2008-05-21 東芝テック株式会社 無線タグ
JP2006270681A (ja) 2005-03-25 2006-10-05 Sony Corp 携帯機器
JP2006287659A (ja) 2005-03-31 2006-10-19 Tdk Corp アンテナ装置
CN101142711B (zh) 2005-04-01 2012-07-04 富士通株式会社 适用于金属的rfid标签及其rfid标签部
JP4750450B2 (ja) 2005-04-05 2011-08-17 富士通株式会社 Ｒｆｉｄタグ
JP2006302219A (ja) 2005-04-25 2006-11-02 Fujita Denki Seisakusho:Kk Ｒｆｉｄタグ通信範囲設定装置
US8115681B2 (en) 2005-04-26 2012-02-14 Emw Co., Ltd. Ultra-wideband antenna having a band notch characteristic
JP4771115B2 (ja) 2005-04-27 2011-09-14 日立化成工業株式会社 Ｉｃタグ
JP4452865B2 (ja) 2005-04-28 2010-04-21 智三 太田 無線ｉｃタグ装置及びｒｆｉｄシステム
JP4529786B2 (ja) 2005-04-28 2010-08-25 株式会社日立製作所 信号処理回路、及びこれを用いた非接触ｉｃカード並びにタグ
US8111143B2 (en) 2005-04-29 2012-02-07 Hewlett-Packard Development Company, L.P. Assembly for monitoring an environment
JP4740645B2 (ja) 2005-05-17 2011-08-03 富士通株式会社 半導体装置の製造方法
US7688272B2 (en) 2005-05-30 2010-03-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2007013120A (ja) 2005-05-30 2007-01-18 Semiconductor Energy Lab Co Ltd 半導体装置
JP4452650B2 (ja) 2005-05-31 2010-04-21 新光電気工業株式会社 配線基板およびその製造方法
JP4255931B2 (ja) 2005-06-01 2009-04-22 日本電信電話株式会社 非接触ｉｃ媒体及び制御装置
JP2007007888A (ja) 2005-06-28 2007-01-18 Oji Paper Co Ltd 非接触ｉｃチップ実装体装着ダンボールおよびその製造方法
JP2007018067A (ja) 2005-07-05 2007-01-25 Kobayashi Kirokushi Co Ltd Ｒｆｉｄタグ、及びｒｆｉｄシステム
JP4286813B2 (ja) 2005-07-08 2009-07-01 富士通株式会社 アンテナ及びこれを搭載するｒｆｉｄ用タグ
JP2007028002A (ja) 2005-07-13 2007-02-01 Matsushita Electric Ind Co Ltd リーダライタのアンテナ、及び通信システム
JP2007040702A (ja) 2005-07-29 2007-02-15 Oki Electric Ind Co Ltd 半導体集積回路、無線タグ及びセンサ
WO2007013168A1 (ja) 2005-07-29 2007-02-01 Fujitsu Limited Ｒｆタグ及びｒｆタグを製造する方法
JP4720348B2 (ja) 2005-08-04 2011-07-13 パナソニック株式会社 Ｒｆ−ｉｄリーダーライター装置用アンテナ及びそれを用いたｒｆ−ｉｄリーダーライター装置並びにｒｆ−ｉｄシステム
JP4737716B2 (ja) 2005-08-11 2011-08-03 ブラザー工業株式会社 無線タグｉｃ回路保持体、タグテープロール、無線タグカートリッジ
JP4801951B2 (ja) 2005-08-18 2011-10-26 富士通フロンテック株式会社 Ｒｆｉｄタグ
JP2007065822A (ja) 2005-08-30 2007-03-15 Sofueru:Kk 無線ｉｃタグ、中間ｉｃタグ体、中間ｉｃタグ体セットおよび無線ｉｃタグの製造方法
JP2007068073A (ja) 2005-09-02 2007-03-15 Sony Corp 情報処理装置
DE102005042444B4 (de) 2005-09-06 2007-10-11 Ksw Microtec Ag Anordnung für eine RFID - Transponder - Antenne
JP4817771B2 (ja) * 2005-09-09 2011-11-16 株式会社フジクラ 多層プリント配線板の製造方法
JP4725261B2 (ja) 2005-09-12 2011-07-13 オムロン株式会社 Ｒｆｉｄタグの検査方法
JP4384102B2 (ja) 2005-09-13 2009-12-16 株式会社東芝 携帯無線機およびアンテナ装置
JP2007096655A (ja) 2005-09-28 2007-04-12 Oji Paper Co Ltd Ｒｆｉｄタグ用アンテナおよびｒｆｉｄタグ
JP4075919B2 (ja) 2005-09-29 2008-04-16 オムロン株式会社 アンテナユニットおよび非接触ｉｃタグ
JP4826195B2 (ja) 2005-09-30 2011-11-30 大日本印刷株式会社 Ｒｆｉｄタグ
JP2007116347A (ja) 2005-10-19 2007-05-10 Mitsubishi Materials Corp タグアンテナ及び携帯無線機
JP4774273B2 (ja) 2005-10-31 2011-09-14 株式会社サトー Ｒｆｉｄラベルおよびｒｆｉｄラベルの貼付方法
JP2007159083A (ja) 2005-11-09 2007-06-21 Alps Electric Co Ltd アンテナ整合回路
JP4803184B2 (ja) 2005-11-22 2011-10-26 株式会社村田製作所 コイルアンテナおよび携帯電子機器
JP4899446B2 (ja) 2005-11-24 2012-03-21 Ｔｄｋ株式会社 複合電子部品及びその製造方法
JP2007150642A (ja) 2005-11-28 2007-06-14 Hitachi Ulsi Systems Co Ltd 無線タグ用質問器、無線タグ用アンテナ、無線タグシステムおよび無線タグ選別装置
JP2007150868A (ja) 2005-11-29 2007-06-14 Renesas Technology Corp 電子装置およびその製造方法
US7573388B2 (en) 2005-12-08 2009-08-11 The Kennedy Group, Inc. RFID device with augmented grain
JP4560480B2 (ja) 2005-12-13 2010-10-13 Ｎｅｃトーキン株式会社 無線タグ
JP4815211B2 (ja) 2005-12-22 2011-11-16 株式会社サトー Ｒｆｉｄラベルおよびｒｆｉｄラベルの貼付方法
JP4848764B2 (ja) 2005-12-26 2011-12-28 大日本印刷株式会社 非接触式データキャリア装置
US7519328B2 (en) 2006-01-19 2009-04-14 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
JP4696923B2 (ja) 2006-01-19 2011-06-08 横河電機株式会社 アンテナとそれを用いた無線タグ装置および無線タグ通信装置
WO2007083575A1 (ja) 2006-01-19 2007-07-26 Murata Manufacturing Co., Ltd. 無線ｉｃデバイス
EP3367500B1 (en) 2006-01-19 2021-08-11 Murata Manufacturing Co., Ltd. Wireless ic device
US20090231106A1 (en) 2006-01-27 2009-09-17 Totoku Electric Co., Ltd. Tag Apparatus,Transceiver Apparatus, and Tag System
KR101061648B1 (ko) 2006-02-19 2011-09-01 니폰샤신인사츠가부시키가이샤 안테나 부착 하우징의 급전 구조
CN101390111B (zh) 2006-02-22 2012-01-11 东洋制罐株式会社 适应金属材料的rfid标签用基材
JP4524674B2 (ja) 2006-02-23 2010-08-18 ブラザー工業株式会社 無線タグ通信システムの質問器
JP4755921B2 (ja) 2006-02-24 2011-08-24 富士通株式会社 Ｒｆｉｄタグ
JP4026080B2 (ja) 2006-02-24 2007-12-26 オムロン株式会社 アンテナ、およびｒｆｉｄタグ
JP5055478B2 (ja) 2006-02-28 2012-10-24 凸版印刷株式会社 Ｉｃタグ
WO2007099602A1 (ja) 2006-02-28 2007-09-07 Matsushita Electric Industrial Co., Ltd. 携帯無線機器
JP3121577U (ja) 2006-03-02 2006-05-18 株式会社スマート 偏心磁性体コイルシステム
KR20080098412A (ko) 2006-03-06 2008-11-07 미쓰비시덴키 가부시키가이샤 Ｒｆｉｄ태그, ｒｆｉｄ태그의 제조 방법 및 ｒｆｉｄ태그의 설치 방법
JP2007241789A (ja) 2006-03-10 2007-09-20 Ic Brains Co Ltd 無線タグリーダ／ライタ、通信装置及び通信システム
JP3933191B1 (ja) 2006-03-13 2007-06-20 株式会社村田製作所 携帯電子機器
JP2007249620A (ja) 2006-03-16 2007-09-27 Nec Tokin Corp 無線タグ
JP2007287128A (ja) 2006-03-22 2007-11-01 Orient Sokki Computer Kk 非接触ｉｃ媒体
JP4735368B2 (ja) 2006-03-28 2011-07-27 富士通株式会社 平面アンテナ
JP4854362B2 (ja) 2006-03-30 2012-01-18 富士通株式会社 Ｒｆｉｄタグ及びその製造方法
JP4927625B2 (ja) 2006-03-31 2012-05-09 ニッタ株式会社 磁気シールドシート、非接触ｉｃカード通信改善方法および非接触ｉｃカード収容容器
JP2007279782A (ja) 2006-04-03 2007-10-25 Dainippon Printing Co Ltd Ｉｃチップ破壊防止構造を有する非接触ｉｃタグと非接触ｉｃタグ連接体、非接触ｉｃタグ連接体の製造方法
JP4998463B2 (ja) 2006-04-10 2012-08-15 株式会社村田製作所 無線ｉｃデバイス
BRPI0702888B1 (pt) 2006-04-14 2019-09-17 Murata Manufacturing Co., Ltd Antena
CN101346852B (zh) 2006-04-14 2012-12-26 株式会社村田制作所 无线ic器件
JP4853095B2 (ja) 2006-04-24 2012-01-11 大日本印刷株式会社 非接触データキャリア、非接触データキャリア用配線基板
ATE526648T1 (de) 2006-04-26 2011-10-15 Murata Manufacturing Co Artikel mit elektromagnetisch gekoppelten modulen
JP2007295395A (ja) 2006-04-26 2007-11-08 Fujitsu Ltd タグ用アンテナ及びそれを用いたタグ
JP4803253B2 (ja) 2006-04-26 2011-10-26 株式会社村田製作所 給電回路基板付き物品
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
JP2007305716A (ja) * 2006-05-10 2007-11-22 Fujikura Ltd フレキシブル部を有する多層プリント配線板の製造方法
US20080068132A1 (en) 2006-05-16 2008-03-20 Georges Kayanakis Contactless radiofrequency device featuring several antennas and related antenna selection circuit
US7589675B2 (en) 2006-05-19 2009-09-15 Industrial Technology Research Institute Broadband antenna
JP2007324865A (ja) 2006-05-31 2007-12-13 Sony Chemical & Information Device Corp アンテナ回路及びトランスポンダ
EP2023275B1 (en) 2006-06-01 2011-04-27 Murata Manufacturing Co. Ltd. Radio frequency ic device and composite component for radio frequency ic device
CN101467209B (zh) 2006-06-30 2012-03-21 株式会社村田制作所 光盘
JP4957724B2 (ja) 2006-07-11 2012-06-20 株式会社村田製作所 アンテナ及び無線ｉｃデバイス
JP2008033716A (ja) 2006-07-31 2008-02-14 Sankyo Kk コイン型ｒｆｉｄタグ
KR100797172B1 (ko) 2006-08-08 2008-01-23 삼성전자주식회사 정합회로가 일체로 형성된 루프 안테나
JP4836899B2 (ja) 2006-09-05 2011-12-14 パナソニック株式会社 磁性体ストライプ状配列シート、ｒｆｉｄ磁性シート、電磁遮蔽シートおよびそれらの製造方法
US7981528B2 (en) 2006-09-05 2011-07-19 Panasonic Corporation Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same
JP4770655B2 (ja) 2006-09-12 2011-09-14 株式会社村田製作所 無線ｉｃデバイス
US8120462B2 (en) 2006-09-25 2012-02-21 Sensomatic Electronics, LLC Method and system for standing wave detection for radio frequency identification marker readers
JP2008083867A (ja) 2006-09-26 2008-04-10 Matsushita Electric Works Ltd メモリカード用ソケット
JP2008092131A (ja) 2006-09-29 2008-04-17 Tdk Corp アンテナ素子及び携帯情報端末
JP2008098993A (ja) 2006-10-12 2008-04-24 Dx Antenna Co Ltd アンテナ装置
JP4913529B2 (ja) 2006-10-13 2012-04-11 トッパン・フォームズ株式会社 Ｒｆｉｄメディア
JP2008107947A (ja) 2006-10-24 2008-05-08 Toppan Printing Co Ltd Ｒｆｉｄタグ
JP2008118359A (ja) 2006-11-02 2008-05-22 Nec Corp 携帯無線機
US7605761B2 (en) 2006-11-30 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Antenna and semiconductor device having the same
DE102006057369A1 (de) 2006-12-04 2008-06-05 Airbus Deutschland Gmbh RFID-Etikett, sowie dessen Verwendung und ein damit gekennzeichnetes Objekt
JP2008167190A (ja) 2006-12-28 2008-07-17 Philtech Inc 基体シート
WO2008081699A1 (ja) 2006-12-28 2008-07-10 Philtech Inc. 基体シート
JP2008182438A (ja) 2007-01-24 2008-08-07 Nec Tokin Corp 無線タグ
US7886315B2 (en) 2007-01-30 2011-02-08 Sony Corporation Optical disc case, optical disc tray, card member, and manufacturing method
JP2008207875A (ja) 2007-01-30 2008-09-11 Sony Corp 光ディスクケース、光ディスクトレイ、カード部材、および製造方法
JP2008197714A (ja) 2007-02-08 2008-08-28 Dainippon Printing Co Ltd 非接触データキャリア装置及び非接触データキャリア用補助アンテナ
JP4872713B2 (ja) 2007-02-27 2012-02-08 大日本印刷株式会社 非接触式データキャリア装置
JP5061657B2 (ja) 2007-03-05 2012-10-31 大日本印刷株式会社 非接触式データキャリア装置
JP2008226099A (ja) 2007-03-15 2008-09-25 Dainippon Printing Co Ltd 非接触式データキャリア装置
JP4865614B2 (ja) 2007-03-27 2012-02-01 マグネックス・コーポレーション 範囲が改良されたｒｆｉｄチップとアンテナ
JP4867753B2 (ja) 2007-03-30 2012-02-01 Ｔｄｋ株式会社 アンテナ装置及びこれを用いた無線通信機器
EP2133827B1 (en) 2007-04-06 2012-04-25 Murata Manufacturing Co. Ltd. Radio ic device
JP5170087B2 (ja) 2007-04-13 2013-03-27 株式会社村田製作所 携帯電子機器
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
DE112008000065B4 (de) 2007-05-10 2011-07-07 Murata Manufacturing Co., Ltd., Kyoto-fu Drahtloses IC-Bauelement
JP4666102B2 (ja) 2007-05-11 2011-04-06 株式会社村田製作所 無線ｉｃデバイス
JP4770792B2 (ja) 2007-05-18 2011-09-14 パナソニック電工株式会社 アンテナ装置
JP4867787B2 (ja) 2007-05-22 2012-02-01 Ｔｄｋ株式会社 アンテナ装置
JP4885093B2 (ja) 2007-06-11 2012-02-29 株式会社タムラ製作所 ブースターアンテナコイル
EP2343779B1 (en) 2007-07-04 2018-05-09 Murata Manufacturing Co., Ltd. Wireless ic device and component for wireless ic device
JP2009017284A (ja) 2007-07-05 2009-01-22 Panasonic Corp アンテナ装置
JP4466795B2 (ja) 2007-07-09 2010-05-26 株式会社村田製作所 無線ｉｃデバイス
CN104540317B (zh) 2007-07-17 2018-11-02 株式会社村田制作所 印制布线基板
JP5167709B2 (ja) 2007-07-17 2013-03-21 株式会社村田製作所 無線ｉｃデバイス、その検査システム及び該検査システムを用いた無線ｉｃデバイスの製造方法
CN102915462B (zh) 2007-07-18 2017-03-01 株式会社村田制作所 无线ic器件
US20090021352A1 (en) 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. Radio frequency ic device and electronic apparatus
JP4867830B2 (ja) 2007-07-18 2012-02-01 株式会社村田製作所 無線ｉｃデバイス
EP2086052B1 (en) 2007-07-18 2012-05-02 Murata Manufacturing Co. Ltd. Wireless ic device
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
JP5173298B2 (ja) * 2007-07-25 2013-04-03 キヤノン株式会社 プリント配線板およびそれを用いた電子機器
JP2009037413A (ja) 2007-08-01 2009-02-19 Murata Mfg Co Ltd 無線ｉｃデバイス
JP4702336B2 (ja) 2007-08-10 2011-06-15 株式会社デンソーウェーブ 携帯型ｒｆｉｄタグ読取器
JP4885092B2 (ja) 2007-09-06 2012-02-29 株式会社タムラ製作所 ブースターアンテナコイル
US8717244B2 (en) 2007-10-11 2014-05-06 3M Innovative Properties Company RFID tag with a modified dipole antenna
JP2009110144A (ja) 2007-10-29 2009-05-21 Oji Paper Co Ltd コイン型ｒｆｉｄタグ
TW200919327A (en) 2007-10-29 2009-05-01 China Steel Corp Three-dimensional wireless identification label adhered onto metal
JP5155642B2 (ja) 2007-11-28 2013-03-06 ルネサスエレクトロニクス株式会社 Ｉｄタグ
JP2009135166A (ja) 2007-11-29 2009-06-18 Nikon Corp 露光方法及び装置、露光ユニット、並びにデバイス製造方法
EP2096709B1 (en) 2007-12-20 2012-04-25 Murata Manufacturing Co., Ltd. Radio ic device
JP2009181246A (ja) 2008-01-29 2009-08-13 Toppan Forms Co Ltd Ｒｆｉｄ検査システム
JP2009182630A (ja) 2008-01-30 2009-08-13 Dainippon Printing Co Ltd ブースタアンテナ基板、ブースタアンテナ基板シート及び非接触式データキャリア装置
EP2251934B1 (en) 2008-03-03 2018-05-02 Murata Manufacturing Co. Ltd. Wireless ic device and wireless communication system
JP4518211B2 (ja) 2008-03-03 2010-08-04 株式会社村田製作所 複合アンテナ
WO2009119548A1 (ja) 2008-03-26 2009-10-01 株式会社村田製作所 無線ｉｃデバイス
EP2264831B1 (en) 2008-04-14 2020-05-27 Murata Manufacturing Co. Ltd. Radio ic device, electronic device, and method for adjusting resonance frequency of radio ic device
JP2009260758A (ja) 2008-04-18 2009-11-05 Murata Mfg Co Ltd 無線ｉｃデバイス
US9130407B2 (en) 2008-05-13 2015-09-08 Qualcomm Incorporated Signaling charging in wireless power environment
JP4927781B2 (ja) 2008-05-15 2012-05-09 株式会社東海理化電機製作所 携帯機
JP4609604B2 (ja) 2008-05-21 2011-01-12 株式会社村田製作所 無線ｉｃデバイス
JP5078022B2 (ja) 2008-05-22 2012-11-21 Ｎｅｃトーキン株式会社 無線タグおよび無線タグの使用方法
JP4557186B2 (ja) 2008-06-25 2010-10-06 株式会社村田製作所 無線ｉｃデバイスとその製造方法
JP2010015342A (ja) 2008-07-03 2010-01-21 Dainippon Printing Co Ltd アンテナシート、インレットおよびｉｃタグ
JP2010050844A (ja) 2008-08-22 2010-03-04 Sony Corp ループアンテナ及び通信装置
JP5319313B2 (ja) 2008-08-29 2013-10-16 峰光電子株式会社 ループアンテナ
JP4618459B2 (ja) 2008-09-05 2011-01-26 オムロン株式会社 Ｒｆｉｄタグ、ｒｆｉｄタグセット及びｒｆｉｄシステム
JP3148168U (ja) 2008-10-21 2009-02-05 株式会社村田製作所 無線ｉｃデバイス
WO2010050361A1 (ja) 2008-10-29 2010-05-06 株式会社村田製作所 無線ｉｃデバイス
JP5041075B2 (ja) 2009-01-09 2012-10-03 株式会社村田製作所 無線ｉｃデバイスおよび無線ｉｃモジュール
JP5287289B2 (ja) 2009-01-26 2013-09-11 株式会社村田製作所 アンテナ装置
WO2010104179A1 (ja) 2009-03-13 2010-09-16 株式会社村田製作所 信号処理回路及びアンテナ装置
JP5510450B2 (ja) 2009-04-14 2014-06-04 株式会社村田製作所 無線ｉｃデバイス
JP4883136B2 (ja) 2009-05-15 2012-02-22 株式会社村田製作所 コイルアンテナ
JP2011015395A (ja) 2009-06-03 2011-01-20 Nippon Information System:Kk Ｒｆｉｄタグ付き布およびｒｆｉｄタグ付き布管理システム
JP5304580B2 (ja) 2009-10-02 2013-10-02 株式会社村田製作所 無線ｉｃデバイス
JP2010051012A (ja) 2009-11-06 2010-03-04 Tdk Corp アンテナ、及び無線ｉｃメモリ
JP5640992B2 (ja) 2009-11-20 2014-12-17 日立金属株式会社 アンテナ
JP5521686B2 (ja) 2010-03-25 2014-06-18 株式会社村田製作所 アンテナ装置及び無線通信デバイス
JP5558960B2 (ja) 2010-07-30 2014-07-23 トッパン・フォームズ株式会社 Ｒｆ−ｉｄメディア検査装置
JP4894960B2 (ja) 2011-03-15 2012-03-14 株式会社村田製作所 電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8168893B2 (en) * 2008-01-25 2012-05-01 Ibiden, Co., Ltd. Multilayer wiring board with concave portion for accomodating electronic component
US8405999B2 (en) * 2008-03-10 2013-03-26 Ibiden Co., Ltd. Flexible wiring board and method of manufacturing same
US7903915B2 (en) * 2009-05-20 2011-03-08 Schlumberger Technology Corporation Cable with intermediate member disconnection sections
US8383948B2 (en) * 2009-09-18 2013-02-26 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9560766B2 (en) 2013-02-14 2017-01-31 Murata Manufacturing Co., Ltd. Circuit board and method for producing same
US9832889B2 (en) 2013-02-14 2017-11-28 Murata Manufacturing Co., Ltd. Circuit board and method for producing same
US9485860B2 (en) * 2013-07-30 2016-11-01 Murata Manufacturing Co., Ltd. Multilayer board
US20160014893A1 (en) * 2013-07-30 2016-01-14 Murata Manufacturing Co., Ltd. Multilayer board
US20170257944A1 (en) * 2014-08-29 2017-09-07 Nokia Technologies Oy Apparatus and associated methods for deformable electronics
CN107148808A (zh) * 2014-08-29 2017-09-08 诺基亚技术有限公司 用于可变形电子器件的装置及相关联的方法
US10321563B2 (en) * 2014-08-29 2019-06-11 Nokia Technologies Oy Apparatus and associated methods for deformable electronics
US10187975B2 (en) 2016-04-20 2019-01-22 Murata Manufacturing Co., Ltd. Multilayer substrate and electronic device
US11083083B2 (en) 2017-12-26 2021-08-03 Murata Manufacturing Co., Ltd. Inductor bridge and electronic device
KR20200067613A (ko) * 2018-12-04 2020-06-12 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
US11122694B2 (en) * 2018-12-04 2021-09-14 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and package having the same
KR102426308B1 (ko) * 2018-12-04 2022-07-28 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
US20210378104A1 (en) * 2019-02-11 2021-12-02 Olympus Winter & Ibe Gmbh Autoclavable electronics unit for an endoscope, method for producing an autoclavable electronics unit and endoscope
US20220320708A1 (en) * 2021-04-05 2022-10-06 Nidec Mobility Corporation Communication device
US20240014565A1 (en) * 2022-07-08 2024-01-11 Merry Electronics Co., Ltd. Antenna module
US12057647B2 (en) * 2022-07-08 2024-08-06 Merry Electronics Co., Ltd. Antenna module

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CN102577646B (zh) 2015-03-04
WO2011040393A1 (ja) 2011-04-07
JP5201270B2 (ja) 2013-06-05
CN102577646A (zh) 2012-07-11
JPWO2011040393A1 (ja) 2013-02-28
US8853549B2 (en) 2014-10-07
JP3183322U (ja) 2013-05-16

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