KR20070058522A - 양측 프루빙 구조 - Google Patents
양측 프루빙 구조 Download PDFInfo
- Publication number
- KR20070058522A KR20070058522A KR1020077006806A KR20077006806A KR20070058522A KR 20070058522 A KR20070058522 A KR 20070058522A KR 1020077006806 A KR1020077006806 A KR 1020077006806A KR 20077006806 A KR20077006806 A KR 20077006806A KR 20070058522 A KR20070058522 A KR 20070058522A
- Authority
- KR
- South Korea
- Prior art keywords
- probe
- device under
- under test
- probing
- measurement
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
Abstract
Description
본 출원은 2004년 9월 13일에 출원된, 미국 가출원 번호 60/609,605의 우선권을 주장한다.
본 출원은 프루빙에 관한 것이다.
고속 집적회로 기반 시스템의 실제 성능을 특성화하는 것은 그 집적회로를 형성하는 웨이퍼의 전기 특성, 그 집적회로 자체의 특성, 그 집적회로가 설치된 패키지의 특성, 그 집적회로가 지지되는 회로기판 또는 지지부의 특성, 및 그 집적회로와 패키지, 및 패키지와 회로기판을 인터페이싱하는 상호연결 구조의 특성을 정확히 아는 것을 요구한다. 측정의 빈번한 목적인, 전기 특성은 이웃한 라인과의 크로스 커플링, 스펙트럼 분광, 전기 공명, 및 주변 유전체로의 방사로 인한 손실을 포함한다.
전통적인 측정 스테이션은 수평적 포지션으로 집적회로 기판 또는 패키지와 같은 피시험 디바이스를 지지하도록 구성된다. 이러한 배열은 단면 패키지로부터만 프루빙 디바이스에 직접적인 물리적 액세스를 제공한다. 회로 기판 또는 패키지의 양측을 동시에 액세스하는 것은 그러한 테스트 구조에서는 사용할 수 없다. 특별히 제조된 마운팅 카드가 종종 패키지를 홀딩할 뿐만 아니라 프루빙에 물리적 액세스를 위해 카드의 탑부에 모든 커넥션을 제공하기 위해 사용되었다. 패키지 마운팅 카드의 사용은 패키지 또는 다른 상호연결에 의하지 않은 측정 데이터에의 영향을 도입하였다. 이 효과는, 스스로, 반드시 판정되고, 그 데이터의 최종 분석에서 보상되거나 모델링되어야 한다. 이러한 효과를 어떻게 다루는가에 관계없이, 이것은 패키지의 전기 특성 결과의 정확도 및 효율성을 모두 저해한다.
GigaTest Labs는 인쇄회로기판의 반대 측을 프루빙하기 용이한 GTL 5050 프루브 스테이션을 제공한다. 측정 기판은 수평 지지부에 의해 수평 방향으로 지지된다. 이 프루브는 수평 지지부에 의해 지지되고, 측정 기판에 대하여 마주하는 관계로 배열된다. 그 다음, 프루브는 일 세트의 S 파라미터와 같은, 측정 파라미터를 판정하기 위해 측정 기판을 사용하여 측정된다. 또한, 이 측정 파라미터는 피시험 디바이스의 특성이 판정될 수 있도록, 케이블 및 프루브의 효과에 대해 우선적으로 측정하기 위해 사용된다. 그 다음, 클램프 중 하나는 이 회로 보드의 일측면을 테스트하기 적합한 포지션으로 스테이션의 수평 지지부에 클램핑된다. 그 다음, 클램핑된 프루브를 포함한 수평 지지부는 플립 오버된다. 그 다음, 다른 클램프는 그 회로 기판의 다른 측면을 테스트하기 적합한 포지션으로 스테이션의 수평 지지부의 새로운 윗면에 클램핑된다. 작동하는 동안, 테이블의 플리핑(flipping) 및 포지셔닝을 위해 필수적인 프루브의 상당한 이동은 측정에 에러를 도입하는 긴 케이블을 필요로 한다.
본 발명자는 사용가능한 양측 프루빙 솔루션을 고려하였고, 프루빙 효율을 증가시키고, 동시에 측정 정확도를 증가시키는 이점이 있고, 프루브 스테이션의 최소의 재구성을 통해, 양측 프루빙을 허용하는 프루빙 솔루션을 실현하였다. 먼저, 도 1을 참조하면, 최초 문제로써, 피시험 디바이스(30)는 수평 지지대(20)에 대하여 실질적으로 90도와 같은, 수직 방향인 홀더(10)에 의해 바림직하게 지지되어 있음이 판정된다. 피시험 디바이스(30)는, 예컨대, 포고-핀 컨택터, 그리드 볼 어레이 패키지 I/O 및 바이어스, 테스트 소켓, 비어 어레이, 인쇄회로기판, 및 오른각 보드를 보드 커넥터로 트래버싱하는 전송 라인의 쓰루 패쓰 등과 같은 임의의 적절한 디바이스를 포함할 수 있다. 또한, 차동 임피던스 테스트가 수행될 수 있다. 수직 방향의 피시험 디바이스(30)는 프루빙 시스템의 크기를 줄이고, 피시험 디바이스(30)의 양측을 보는 현미경(40)의 효과적인 사용을 허용한다.
측정 테스트를 수행하기 위해서, 프루빙 시스템은 측정 기판(60)을 위한 기판 지지부(50)를 포함한다. 이 측정 기판은 하나 이상의 프루브의 측정을 용이하게 하는 하나 이상의 측정 구조를 포함한다. 측정 기판은 수평 지지부(20)에 실질적으로 평행인 것이 바람직하다. 한 쌍의 프루브 포지셔너(70 및 80)는 그 끝부에 각각 컨택트부를 포함한 프루빙 엘리먼트(100 및 105)를 포함하는 것이 전형적이다. 그러므로, 프루빙 컨택트의 각 세트의 세타는 측정 기판의 표면과의 프루빙 컨택트를 배열하기 위해 프루빙 포지셔너의 세타 조절을 사용하여 조절된다. 이러한 방법으로, 모든 프루빙 컨택트가 측정 기판과 적절한 컨택트를 이룬다(그렇지 않으면, 하나 이상의 프루브 컨택트는 적절한 컨택트를 이루지 못할 것이다). 이 측정은 일반적으로 백터 네트워크 분석기를 사용한 백터 측정이다.
그 다음, 프루브 포지셔너(70 및 80)는 피시험 디바이스(30)의 각 측면에 인접한 위치의 수평 지지부(20) 상에 리포지셔닝된다. 원한다면, 스탠드(72)(또는 복수의 스탠드)가 사용될 수 있다. 몇몇 기존 프루브가 상이한 포지션으로 프루빙 컨택트의 재방향 설정을 허용할 수 있지만, 성공적인 프루빙을 위해 피시험 디바이스(30)를 가진 라인에 충분하게 프루빙 컨택트의 방향을 조절하기 위해는 상당한 시간이 소요된다. 또한, 한 방향에서 다른 방향으로 조절하는 것은 통상적으로 연속된 회전축을 따라야 하기 때문에, 적절한 프루빙 컨택트를 이루기 위해 피시험 디바이스(30)의 표면과의 프루빙 컨택트를 충분히 배열하는데 문제가 된다. 프루브 컨택트가 배열에서 약간 벗어나 있으면, 그 테스트는 기능하지 않거나, 올바르게 기능은 하지만 실제로는 부정확한 결과를 제공하게 된다. 또한, 사용자가 프루빙 컨택트를 피시험 디바이스상의 패드와 정확히 정렬하기 위해 동일한 패드 상에 복수의 복수의 터치 다운을 만들 필요가 있다면, 피시험 디바이스 상의 패드는 손상될 상당한 가능성이 있고, 그 결과 피시험 디바이스가 손상되거나, 그렇지 않으면 측정값이 부정확해진다.
이러한 프루브 배열 제한을 줄이기 위해, 본 발명자는 수평의 프루빙 방향에서 수직의 프루빙 방향으로 형성된 이동을 허용하는 구조를 포함하는 프루브를 실현하였다. 이러한 방법으로, 프루브 컨택트는 그 방향이 90도와 같은, 그들 사이에 소정의 각을 이룬다는 확신을 가지고 제1방향에서 제2방향으로 이동한다.
도 1은 수평 측정 기판 및 수직 피시험 디바이스를 도시한다.
도 2는 프루브 포지셔너를 도시한다.
도 3은 도2의 프루브 포지셔너를 다른 방향으로 도시한다.
도 4는 수평 측정 기판 및 수평 피시험 디바이스를 도시한다.
도 5는 수직 측정 기판 및 수직 피시험 디바이스를 도시한다.
도 6은 수직 측정 기판 및 수평 피시험 디바이스를 도시한다.
도 7은 가드 전위에 상호연결된 측면의 플레이트 어셈블리를 도시한다.
도 8은 가드 전위에 상호연결된 한 쌍의 플레이트 어셈블리를 도시한다.
도 9는 가드 전위에 (피시험 디바이스의 양측에) 상호연결된 수직 슬라이딩 플레이트 어셈블리를 도시한다.
도 10A-NN는 다른 실시예를 도시한다.
도 2를 참조하면, 프루브 포지셔너(70(80))는 컨택팅 엘리먼트를 가진 프루빙 엘리먼트(100)를 포함할 수 있다. 전형적으로, 프루빙 엘리먼트(100)는 그 끝부에 연결된 복수의 컨택팅 엘리먼트를 가진 동축 케이블을 포함한다. 이 프루빙 엘리먼트(100)는 프루브 지지부(102)에 의해 지지된다. 이 프루브 지지부(102)는 프루브 지지부(102)를 보호하기 위해 조여질 수 있는 핀과 같은 것으로, 지지부 피처(104)와 회전가능하게 연결될 수 있다(106). 이 상호연결(106)은 그 프루빙 컨택트의 위치에서, 그리고 그 피시험 디바이스와의 그 각의 컨택트에서 조절가능성을 제공한다.
지지부 피처(104)는 회전할 때, 프루빙 엘리먼트의 세타 방향을 조절하는 노 브(110)를 포함하는 세타 조절 구조(108)와 상호연결된다. 세타 조절 구조(108)는 플레이트(110)에 고정된다.
플레이트(110)는 그 내에 플레이트(110)가 피벗 블록(112)에 부착되도록, 피벗 블록(112) 내의 개구와 매칭하는 일 세트의 개구를 포함한다. 도 2에서, 이 프루빙 엘리먼트(100)는 수평 방향으로 방향지어 있다. 상이한 소정의 방향에 대해 프루빙 엘리먼트(100)를 조절하는 편리한 방법을 제공하기 위해, 피벗 블록(112)은 힌지(114)에 설치된다. 사용자가 프루빙 엘리먼트(100)의 방향을 변경하고자 할 때, 사용자는 피벗 블록(112)이 제2포지션으로 힌지(114)를 돌아 피벗하도록 허용하는 나사(116)를 제거할 수 있는데, 이때, 고정된 포지션에서 피벗 블록(112)을 고정하기 위해, 도 3에 도시된 바와 같이, 핀(116)이 교체된다. 핀(116)의 제거 및 피벗 블록(112)의 피벗의 결과는 90도와 같은, 소정의 각으로 프루빙 엘리먼트(100)의 방향을 변경하는 것이다. 또한, 다른 고정된 포지션의 이동이 프루브 스테이션의 상이한 부분의 방향 및 특정 어플리케이션에 따라 사용될 수 있다.
도 3에 도시된 바와 같이, 수직 방향으로 방향진 프루빙 엘리먼트(100)를 가짐으로써, 프루브는 수평 방향인 측정 기판에서 측정되기에 적합하다. 컨택팅 멤버는 측정 기판에 일정한 컨택트를 이루기 위해 적절하게 조절될 수 있다. 그 후, 프루브는 90도의 조절을 가진 힌지(114)를 사용하여 수평 방향으로 용이하게 변경될 수 있다. 피시험 디바이스(30)가 수직 방향이므로, 도 3에 도시된 바와 같은 프루브는, 회전 후, 테스트를 위해 적합한 포지션에 있게 된다. 이 프루브는 피시험 디바이스 부근의 프루빙 컨택트를 포지셔닝하기 위해, 필요하다면, 수평 지지 부(20)에서 이동될 수 있다. 측정 기판(60)과 피시험 디바이스(30) 사이의 각 관계로 알고 있는 90도의 조절을 가짐으로써, 프루빙 컨택트는 피시험 디바이스(30)를 테스트하기 위해 적절한 배열일 것이다. 이러한 방법으로, 프루빙 컨택스 세타 배열의 추가적인 배열은 전형적으로 필수적이지 않고, 피시험 디바이스(30) 상의 패드는 프루빙 컨택트의 적절한 배열을 이루려는 시도를 통해 잘 마모되지 않는다. 또한, 각각의 프루브 포지셔너는 상이한 방향으로 회전될 수 있으므로, 피시험 디바이스(30)의 각각의 측에 적절한 컨택트가 이루어질 수 있다.
또한, 피벗 블록(112)의 복수의 면은 그 내에 일 세트의 홀을 포함할 수 있으므로, 플레이트(11)는 원한다면, 피벗 블록(112)의 상이한 면에 고정될 수 있다. 이러한 방법으로, 피벗 블록(112)의 회전은 프루브의 상이한 방향으로 이루어질 수 있다.
힌지(114)는 다른 지지부(116)에 고정된다. 지지부(116)는 그 내에 형성된 한쌍의 마주한 그루브를 포함한다. 나사(122)를 풀므로써, 지지부(116)는 플레이트(124)를 자유롭게 슬라이딩 업다운할 수 있고, 나사(112)를 조임으로써 그 위치에 고정된다. 또한, 이 마주한 그루브(118 및 120)는 플레이트(116)가 플레이트(124)로부터 완전히 분리되게 하고, 플레이트(116)(및 부착된 프루빙 엘리먼트)는 900도, 180도, 270도로 회전될 수 있고, 상이한 방향으로 플레이트(124)와 계합한다. 이것은 측정 기판 및 피시험 디바이스를 배열하기 위해 프루브의 방향을 조절하는 다른 방법을 제공한다.
플레이트(124)는 각각 노브(132, 130, 및 128)를 사용하여 그 프루브를 이동 시키는 x-y-z 메카니즘에 고정된다. 이러한 방법으로, 프루브(100)의 x-y-z 방향의 미세조정이 피시험 디바이스를 프루빙하기 위해 사용자에 의해 수행될 수 있다.
도 4를 참조하면, 본 명세서에 서술된 프루브 포지셔너를 효과적으로 사용하게 하는 대안의 방향이 도시되어 있다. 이 측정 기판은 수평 방향으로 유지되고, 프루브는 측정된다. 그 다음, 프루브 포지셔너 중 하나는 측정을 위해 사용될 때 프루브의 동일한 방향인 피시험 디바이스의 윗면을 프루빙하기 위한 방향이고, 다른 프루빙 포지셔너의 프루빙 컨택트는 180도 회전되고, 그 다음 피시험 디바이스의 바닥면을 프루빙하기 위한 방향이 된다. 이러한 방법으로, 피시험 디바이스는 효과적으로 프루빙될 수 있다.
도 5를 참조하면, 본 명세서에 서술된 프루브 포지셔너를 효과적으로 사용하게 하는 대안의 방향이 도시되어 있다. 측정 기판(60')은 지지부(50')상에서 수직 방향으로 유지되고, 프루브가 측정된다. 그 다음, 하나의 프루브 포지셔너는 측정을 위해 사용될 때 프루브의 동일 방향인, 피시험 디바이스의 일 측면을 프루빙하기 위한 방향이 된다. 다른 프루빙 포지셔너의 프루빙 컨택트는 180도 회전되고, 그 다음 피시험 디바이스의 다른 측면을 프루빙하기 위한 방향이 된다. 이러한 방법으로 피시험 디바이스는 효과적으로 프루빙될 수 있다.
도 6을 참조하면, 본 명세서에 서술된 프루브 포지셔너를 효과적으로 사용하게 하는 대안의 방향이 도시되어 있다. 측정 기판(60")은 지지부(50")상에서 수직 방향으로 유지되고, 프루브가 측정된다. 그 다음, 하나의 프루브 포지셔너는 피시험 디바이스의 탑부를 프루빙하기 위한 방향이 된다. 다른 프루브 포지셔너의 프 루빙 컨택트는 회전되고, 그 다음 피시험 디바이스의 다른 측면을 프루빙하기 위한 방향이 된다. 이러한 방법으로 피시험 디바이스는 효과적으로 프루빙될 수 있다.
프루빙 포지셔너의 방향에 대해, 모두 서로에 대해, 프루빙 엘리먼트, 측정 기판, 및 피시험 디바이스를 포함한 프루브 포지셔너의 방향에 따라, 후속 프루빙을 위해 포지셔닝될 때 프루빙 엘리먼트의 방향이 변경될 수 있음이 이해될 것이다
전통적으로, 수직으로 방향진 구조의 양측을 동시에 테스트하기 위해 사용되는 이 측정방법은 원하는 결과를 얻기에 충분했었다. 그러나, 특히 낮은 노이즈 특성을 얻고자 하는 경우에 있어서, 몇몇 경우에, 노이즈 레벨이 높은 것으로 판단되어 왔다. 이러한 경우에, 수직으로 방향진 프루빙 디바이스 둘레에 보호 구조를 추가하는 것이 유리할 것이라고 판단되어 왔다. 이 보호 구조는 신호 경로에 전위를 트래킹하거나, 그렇지 않으면 비슷한 전위로 제공되는 도전 부재이다. 이러한 방법으로, 신호 경로로부터의 누출을 줄일 수 있다. 도 7을 참조하면, 수정된 수직 지지 구조는 신호 경로의 가드 전위로 제공되는 외부링(200)을 포함한다. 이 링의 외부는 다른 도전 부재로 절연되는 것이 바람직하다. 또한, 이 외부링은 피시험 디바이스의 하나 이상의 측면에 피시험 디바이스의 대부분을 둘러싸는 것이 바람직하다. 도 8을 참조하면, 피시험 디바이스의 일 또는 양 외부 표면에 대하여, 그 내에서 프루브가 피시험 디바이스를 테스트하는, 테스트 도전 플레이트 어셈블리(210)가 제공될 수 있고, 이 도전 플레이트의 각각은 신호 경로의 가드 전위에 연결될 수 있다. 예를 들어, 각각의 프루브에 인접한 도전 플레이트의 전위는 각각의 프루브의 신호 경로의 가드 대표자와 상호연결될 수 있다.
도 9를 참조하면, 변형된 구조는 그 내에서 프루브가 피시험 디바이스를 테스트하는 개구(240)를 형성하는 일 세트의 수직으로 방향진 상호연결된 슬라이딩가능한 플레이트(230)를 포함한다. 플레이트(230)는 피시험 디바이스의 일 또는 양측에 제공될 수 있고, 개구(240)는 피시험 디바이스의 다른 영역이 테스트될 수 있도록 이동할 수 있다. 이러한 방법으로, 피시험 디바이스는 가드 전위를 가진 중요한 영역을 가진다.
도 10A-NN를 참조하면, 다른 실시예들이 도시되어 있다.
앞서 명세서에 채용된 용어 및 표현은 설명을 위해 사용되었고, 이에 제한되지 않으며, 그러한 용어 및 표현을 사용한 것은, 도시되고 설명된 피처 또는 그 피처의 일부분의 동등물을 제외하려는 의도가 아니고, 본 발명의 범위는 오직 첨부된 청구항에 의해 정의되고 한정되어야 함을 알아야 한다.
Claims (1)
- 테스트 구성으로서,(a) 제1방향인 피시험 디바이스에 대한 홀더,(b) 제2방향인 측정 기판, 및(c) 상기 기판을 사용하여 측정할 수 있고, 상기 피시험 디바이스를 프루빙할 수 있는 프루브를 포함하는 것을 특징으로 하는 테스트 구성.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60960504P | 2004-09-13 | 2004-09-13 | |
US60/609,605 | 2004-09-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20070058522A true KR20070058522A (ko) | 2007-06-08 |
Family
ID=36060568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077006806A KR20070058522A (ko) | 2004-09-13 | 2005-09-08 | 양측 프루빙 구조 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7420381B2 (ko) |
EP (1) | EP1789812A2 (ko) |
JP (1) | JP2008512680A (ko) |
KR (1) | KR20070058522A (ko) |
DE (1) | DE202005021435U1 (ko) |
TW (1) | TW200619634A (ko) |
WO (1) | WO2006031646A2 (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007139712A (ja) * | 2005-11-22 | 2007-06-07 | Nhk Spring Co Ltd | プローブホルダおよびプローブユニット |
US20070296423A1 (en) * | 2006-05-25 | 2007-12-27 | Whitener Michael B | Double-sided wafer probe |
WO2010082094A2 (en) * | 2009-01-17 | 2010-07-22 | Doublecheck Semiconductors Pte. Ltd. | Method and apparatus for testing a semiconductor wafer |
US8836357B2 (en) * | 2011-04-23 | 2014-09-16 | Li-Cheng Richard Zai | Stackable probe system |
US20130015871A1 (en) * | 2011-07-11 | 2013-01-17 | Cascade Microtech, Inc. | Systems, devices, and methods for two-sided testing of electronic devices |
US9989583B2 (en) * | 2013-03-13 | 2018-06-05 | Xcerra Corporation | Cross-bar unit for a test apparatus for circuit boards, and test apparatus containing the former |
US9435855B2 (en) | 2013-11-19 | 2016-09-06 | Teradyne, Inc. | Interconnect for transmitting signals between a device and a tester |
US9594114B2 (en) | 2014-06-26 | 2017-03-14 | Teradyne, Inc. | Structure for transmitting signals in an application space between a device under test and test electronics |
US10459006B2 (en) | 2016-09-28 | 2019-10-29 | Formfactor Beaverton, Inc. | Probe systems and methods |
US9977052B2 (en) | 2016-10-04 | 2018-05-22 | Teradyne, Inc. | Test fixture |
CN110286307B (zh) * | 2018-03-19 | 2022-04-08 | 科磊股份有限公司 | 探针检测系统及用于检测半导体元件的方法 |
US10677815B2 (en) | 2018-06-08 | 2020-06-09 | Teradyne, Inc. | Test system having distributed resources |
CN110211522A (zh) * | 2019-06-29 | 2019-09-06 | 苏州精濑光电有限公司 | 一种显示面板的检测机构 |
US11363746B2 (en) | 2019-09-06 | 2022-06-14 | Teradyne, Inc. | EMI shielding for a signal trace |
CN110954007B (zh) * | 2019-11-27 | 2022-06-07 | 长江存储科技有限责任公司 | 晶圆检测系统及检测方法 |
US11862901B2 (en) | 2020-12-15 | 2024-01-02 | Teradyne, Inc. | Interposer |
CN117054951B (zh) * | 2023-10-13 | 2024-03-29 | 深圳市道格特科技有限公司 | 一种探针性能测试系统及其测试方法 |
Family Cites Families (1145)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US491783A (en) | 1893-02-14 | Bolster-plate | ||
US1337866A (en) | 1917-09-27 | 1920-04-20 | Griffiths Ethel Grace | System for protecting electric cables |
US2142625A (en) | 1932-07-06 | 1939-01-03 | Hollandsche Draad En Kabelfab | High tension cable |
US2376101A (en) | 1942-04-01 | 1945-05-15 | Ferris Instr Corp | Electrical energy transmission |
US2389668A (en) | 1943-03-04 | 1945-11-27 | Barnes Drill Co | Indexing mechanism for machine tables |
GB579665A (en) | 1943-10-28 | 1946-08-12 | Gen Electric | Improvements in and relating to impedance matching transformers |
US2545258A (en) | 1945-03-22 | 1951-03-13 | Marcel L Cailloux | Device for telecontrol of spatial movement |
US2762234A (en) | 1952-09-08 | 1956-09-11 | Dodd Roy Frank | Search-track radar control |
US2901696A (en) | 1953-11-25 | 1959-08-25 | Ingeniors N Magnetic Ab Fa | Arrangement for automatic and continuous measuring of the noise factor of an electric device |
US2921276A (en) | 1955-08-30 | 1960-01-12 | Cutler Hammer Inc | Microwave circuits |
US2947939A (en) | 1956-09-24 | 1960-08-02 | Libbey Owens Ford Glass Co | Testing electrically conductive articles |
US3111699A (en) | 1961-10-09 | 1963-11-26 | Joseph E Comeau | Wire brush for railroad switches |
US3193712A (en) | 1962-03-21 | 1965-07-06 | Clarence A Harris | High voltage cable |
US3230299A (en) | 1962-07-18 | 1966-01-18 | Gen Cable Corp | Electrical cable with chemically bonded rubber layers |
US3176091A (en) | 1962-11-07 | 1965-03-30 | Helmer C Hanson | Controlled multiple switching unit |
US3262593A (en) | 1963-07-10 | 1966-07-26 | Gen Mills Inc | Wall-mounted support structure |
GB1031068A (en) | 1963-09-23 | 1966-05-25 | George Vincent Grispo | Improvements in or relating to motion reduction mechanisms |
US3218584A (en) | 1964-01-02 | 1965-11-16 | Sanders Associates Inc | Strip line connection |
US3401126A (en) | 1965-06-18 | 1968-09-10 | Ibm | Method of rendering noble metal conductive composition non-wettable by solder |
US3429040A (en) | 1965-06-18 | 1969-02-25 | Ibm | Method of joining a component to a substrate |
US3445770A (en) | 1965-12-27 | 1969-05-20 | Philco Ford Corp | Microelectronic test probe with defect marker access |
US3484679A (en) | 1966-10-03 | 1969-12-16 | North American Rockwell | Electrical apparatus for changing the effective capacitance of a cable |
US3573617A (en) | 1967-10-27 | 1971-04-06 | Aai Corp | Method and apparatus for testing packaged integrated circuits |
GB1240866A (en) | 1968-08-22 | 1971-07-28 | Amf Inc | Control device |
US3609539A (en) | 1968-09-28 | 1971-09-28 | Ibm | Self-aligning kelvin probe |
US3541222A (en) | 1969-01-13 | 1970-11-17 | Bunker Ramo | Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making |
JPS497756B1 (ko) | 1969-01-24 | 1974-02-22 | ||
NL7003475A (ko) | 1969-03-28 | 1970-09-30 | ||
US3648169A (en) | 1969-05-26 | 1972-03-07 | Teledyne Inc | Probe and head assembly |
US3596228A (en) | 1969-05-29 | 1971-07-27 | Ibm | Fluid actuated contactor |
US3611199A (en) | 1969-09-30 | 1971-10-05 | Emerson Electric Co | Digital electromagnetic wave phase shifter comprising switchable reflectively terminated power-dividing means |
US3686624A (en) | 1969-12-15 | 1972-08-22 | Rca Corp | Coax line to strip line end launcher |
US3654585A (en) | 1970-03-11 | 1972-04-04 | Brooks Research And Mfg Inc | Coordinate conversion for the testing of printed circuit boards |
US3622915A (en) | 1970-03-16 | 1971-11-23 | Meca Electronics Inc | Electrical coupler |
US3740900A (en) | 1970-07-01 | 1973-06-26 | Signetics Corp | Vacuum chuck assembly for semiconductor manufacture |
US3700998A (en) | 1970-08-20 | 1972-10-24 | Computer Test Corp | Sample and hold circuit with switching isolation |
US3714572A (en) | 1970-08-21 | 1973-01-30 | Rca Corp | Alignment and test fixture apparatus |
US4009456A (en) | 1970-10-07 | 1977-02-22 | General Microwave Corporation | Variable microwave attenuator |
US3680037A (en) | 1970-11-05 | 1972-07-25 | Tech Wire Prod Inc | Electrical interconnector |
US3662318A (en) | 1970-12-23 | 1972-05-09 | Comp Generale Electricite | Transition device between coaxial and microstrip lines |
US3710251A (en) | 1971-04-07 | 1973-01-09 | Collins Radio Co | Microelectric heat exchanger pedestal |
US3705379A (en) | 1971-05-14 | 1972-12-05 | Amp Inc | Connector for interconnection of symmetrical and asymmetrical transmission lines |
US3766470A (en) | 1971-05-24 | 1973-10-16 | Unit Process Assemblies | Apparatus for testing the integrity of a thru-hole plating in circuit board workpieces or the like by measuring the effective thickness thereof |
US3725829A (en) | 1971-07-14 | 1973-04-03 | Itek Corp | Electrical connector |
GB1387587A (en) | 1971-07-22 | 1975-03-19 | Plessey Co Ltd | Electrical interconnectors and connector assemblies |
US3882597A (en) | 1971-12-17 | 1975-05-13 | Western Electric Co | Method for making a test probe for semiconductor devices |
US3810016A (en) | 1971-12-17 | 1974-05-07 | Western Electric Co | Test probe for semiconductor devices |
US3829076A (en) | 1972-06-08 | 1974-08-13 | H Sofy | Dial index machine |
US3858212A (en) | 1972-08-29 | 1974-12-31 | L Tompkins | Multi-purpose information gathering and distribution system |
US3952156A (en) | 1972-09-07 | 1976-04-20 | Xerox Corporation | Signal processing system |
CA970849A (en) | 1972-09-18 | 1975-07-08 | Malcolm P. Macmartin | Low leakage isolating transformer for electromedical apparatus |
JPS5219046Y2 (ko) | 1972-12-11 | 1977-04-30 | ||
US3806801A (en) | 1972-12-26 | 1974-04-23 | Ibm | Probe contactor having buckling beam probes |
US3839672A (en) | 1973-02-05 | 1974-10-01 | Belden Corp | Method and apparatus for measuring the effectiveness of the shield in a coaxial cable |
US3867698A (en) | 1973-03-01 | 1975-02-18 | Western Electric Co | Test probe for integrated circuit chips |
US3803709A (en) | 1973-03-01 | 1974-04-16 | Western Electric Co | Test probe for integrated circuit chips |
US3833852A (en) | 1973-08-16 | 1974-09-03 | Owens Illinois Inc | Inspection head mounting apparatus |
JPS5337077Y2 (ko) | 1973-08-18 | 1978-09-08 | ||
US3849728A (en) | 1973-08-21 | 1974-11-19 | Wentworth Labor Inc | Fixed point probe card and an assembly and repair fixture therefor |
US3930809A (en) | 1973-08-21 | 1976-01-06 | Wentworth Laboratories, Inc. | Assembly fixture for fixed point probe card |
US4001685A (en) | 1974-03-04 | 1977-01-04 | Electroglas, Inc. | Micro-circuit test probe |
US3936743A (en) | 1974-03-05 | 1976-02-03 | Electroglas, Inc. | High speed precision chuck assembly |
US3971610A (en) | 1974-05-10 | 1976-07-27 | Technical Wire Products, Inc. | Conductive elastomeric contacts and connectors |
JPS5352354Y2 (ko) | 1974-05-23 | 1978-12-14 | ||
US3976959A (en) | 1974-07-22 | 1976-08-24 | Gaspari Russell A | Planar balun |
US3970934A (en) | 1974-08-12 | 1976-07-20 | Akin Aksu | Printed circuit board testing means |
JPS5750068Y2 (ko) | 1974-10-31 | 1982-11-02 | ||
JPS5166893U (ko) | 1974-11-22 | 1976-05-26 | ||
CH607045A5 (en) | 1974-12-05 | 1978-11-30 | Ernst Hedinger | Diode test appts. with oscillator |
US4038599A (en) | 1974-12-30 | 1977-07-26 | International Business Machines Corporation | High density wafer contacting and test system |
US4123706A (en) | 1975-03-03 | 1978-10-31 | Electroglas, Inc. | Probe construction |
US4038894A (en) | 1975-07-18 | 1977-08-02 | Springfield Tool And Die, Inc. | Piercing apparatus |
JPS567439Y2 (ko) | 1975-09-20 | 1981-02-18 | ||
SE407115B (sv) | 1975-10-06 | 1979-03-12 | Kabi Ab | Forfarande och metelektroder for studium av enzymatiska och andra biokemiska reaktioner |
US4035723A (en) | 1975-10-16 | 1977-07-12 | Xynetics, Inc. | Probe arm |
US3992073A (en) | 1975-11-24 | 1976-11-16 | Technical Wire Products, Inc. | Multi-conductor probe |
US4116523A (en) | 1976-01-23 | 1978-09-26 | James M. Foster | High frequency probe |
US4049252A (en) | 1976-02-04 | 1977-09-20 | Bell Theodore F | Index table |
US4008900A (en) | 1976-03-15 | 1977-02-22 | John Freedom | Indexing chuck |
US4063195A (en) | 1976-03-26 | 1977-12-13 | Hughes Aircraft Company | Parametric frequency converter |
US4099120A (en) | 1976-04-19 | 1978-07-04 | Akin Aksu | Probe head for testing printed circuit boards |
US4027935A (en) | 1976-06-21 | 1977-06-07 | International Business Machines Corporation | Contact for an electrical contactor assembly |
US4074201A (en) | 1976-07-26 | 1978-02-14 | Gte Sylvania Incorporated | Signal analyzer with noise estimation and signal to noise readout |
US4115735A (en) | 1976-10-14 | 1978-09-19 | Faultfinders, Inc. | Test fixture employing plural platens for advancing some or all of the probes of the test fixture |
US4093988A (en) | 1976-11-08 | 1978-06-06 | General Electric Company | High speed frequency response measurement |
US4124787A (en) | 1977-03-11 | 1978-11-07 | Atari, Inc. | Joystick controller mechanism operating one or plural switches sequentially or simultaneously |
US4151465A (en) | 1977-05-16 | 1979-04-24 | Lenz Seymour S | Variable flexure test probe for microelectronic circuits |
US4161692A (en) | 1977-07-18 | 1979-07-17 | Cerprobe Corporation | Probe device for integrated circuit wafers |
US4312117A (en) | 1977-09-01 | 1982-01-26 | Raytheon Company | Integrated test and assembly device |
US4184729A (en) | 1977-10-13 | 1980-01-22 | Bunker Ramo Corporation | Flexible connector cable |
US4135131A (en) | 1977-10-14 | 1979-01-16 | The United States Of America As Represented By The Secretary Of The Army | Microwave time delay spectroscopic methods and apparatus for remote interrogation of biological targets |
US4184133A (en) | 1977-11-28 | 1980-01-15 | Rockwell International Corporation | Assembly of microwave integrated circuits having a structurally continuous ground plane |
US4216467A (en) | 1977-12-22 | 1980-08-05 | Westinghouse Electric Corp. | Hand controller |
IT1113297B (it) | 1978-01-30 | 1986-01-20 | Texas Instruments Inc | Sistema e procedimento per collaudare circuiti integrati |
US4232398A (en) | 1978-02-09 | 1980-11-04 | Motorola, Inc. | Radio receiver alignment indicator |
US4177421A (en) | 1978-02-27 | 1979-12-04 | Xerox Corporation | Capacitive transducer |
WO1980000101A1 (en) | 1978-06-21 | 1980-01-24 | Cerprobe Corp | Probe and interface device for integrated circuit wafers |
US4302146A (en) | 1978-08-23 | 1981-11-24 | Westinghouse Electric Corp. | Probe positioner |
FR2437741A1 (fr) * | 1978-09-26 | 1980-04-25 | Ibm France | Dispositif pour accroitre la cadence d'un train d'impulsions |
US4225819A (en) | 1978-10-12 | 1980-09-30 | Bell Telephone Laboratories, Incorporated | Circuit board contact contamination probe |
US4306235A (en) | 1978-11-02 | 1981-12-15 | Cbc Corporation | Multiple frequency microwave antenna |
DE2849119A1 (de) | 1978-11-13 | 1980-05-14 | Siemens Ag | Verfahren und schaltungsanordnung zur daempfungsmessung, insbesondere zur ermittlung der daempfungs- und/oder gruppenlaufzeitverzerrung eines messobjektes |
US4251772A (en) | 1978-12-26 | 1981-02-17 | Pacific Western Systems Inc. | Probe head for an automatic semiconductive wafer prober |
JPS605462Y2 (ja) | 1978-12-27 | 1985-02-20 | 株式会社東芝 | 密閉形開閉装置の操作機構 |
US4383217A (en) | 1979-01-02 | 1983-05-10 | Shiell Thomas J | Collinear four-point probe head and mount for resistivity measurements |
US4280112A (en) | 1979-02-21 | 1981-07-21 | Eisenhart Robert L | Electrical coupler |
JPS55115383A (en) | 1979-02-27 | 1980-09-05 | Mitsubishi Electric Corp | Bias circuit for laser diode |
US4287473A (en) | 1979-05-25 | 1981-09-01 | The United States Of America As Represented By The United States Department Of Energy | Nondestructive method for detecting defects in photodetector and solar cell devices |
FI58719C (fi) | 1979-06-01 | 1981-04-10 | Instrumentarium Oy | Diagnostiseringsanordning foer broestkancer |
US4277741A (en) | 1979-06-25 | 1981-07-07 | General Motors Corporation | Microwave acoustic spectrometer |
SU843040A1 (ru) | 1979-08-06 | 1981-06-30 | Физико-Технический Институт Низкихтемператур Ah Украинской Ccp | Проходной режекторный фильтр |
US4327180A (en) | 1979-09-14 | 1982-04-27 | Board Of Governors, Wayne State Univ. | Method and apparatus for electromagnetic radiation of biological material |
US4284033A (en) | 1979-10-31 | 1981-08-18 | Rca Corporation | Means to orbit and rotate target wafers supported on planet member |
US4330783A (en) | 1979-11-23 | 1982-05-18 | Toia Michael J | Coaxially fed dipole antenna |
JPS6016996Y2 (ja) | 1979-12-10 | 1985-05-25 | 横河電機株式会社 | 入出力インタフエイス装置のアドレス選択装置 |
DE2951072C2 (de) | 1979-12-19 | 1985-02-21 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Übergang von einem koaxialen Bauelement auf eine auf einem Substrat angeordnete Mikrowellenschaltung |
SE441640B (sv) | 1980-01-03 | 1985-10-21 | Stiftelsen Inst Mikrovags | Forfarande och anordning for uppvermning medelst mikrovagsenergi |
JPS56134590A (en) | 1980-03-18 | 1981-10-21 | Sumitomo Chemical Co | Manufacture of highly nonstatic ammonium nitrate oil explosive |
US4284682A (en) | 1980-04-30 | 1981-08-18 | Nasa | Heat sealable, flame and abrasion resistant coated fabric |
US4340860A (en) | 1980-05-19 | 1982-07-20 | Trigon | Integrated circuit carrier package test probe |
US4357575A (en) | 1980-06-17 | 1982-11-02 | Dit-Mco International Corporation | Apparatus for use in testing printed circuit process boards having means for positioning such boards in proper juxtaposition with electrical contacting assemblies |
US4552033A (en) | 1980-07-08 | 1985-11-12 | Gebr. Marzhauser Wetzlar oHG | Drive system for a microscope stage or the like |
JPS6211243Y2 (ko) | 1980-09-17 | 1987-03-17 | ||
JPS5775480U (ko) | 1980-10-24 | 1982-05-10 | ||
US4346355A (en) | 1980-11-17 | 1982-08-24 | Raytheon Company | Radio frequency energy launcher |
US4376920A (en) | 1981-04-01 | 1983-03-15 | Smith Kenneth L | Shielded radio frequency transmission cable |
JPS6238032Y2 (ko) | 1981-04-06 | 1987-09-29 | ||
US4375631A (en) | 1981-04-09 | 1983-03-01 | Ampex Corporation | Joystick control |
DE3267983D1 (en) * | 1981-04-25 | 1986-01-30 | Toshiba Kk | Apparatus for measuring noise factor and available gain |
JPS57171805U (ko) | 1981-04-27 | 1982-10-29 | ||
US4425395A (en) | 1981-04-30 | 1984-01-10 | Fujikura Rubber Works, Ltd. | Base fabrics for polyurethane-coated fabrics, polyurethane-coated fabrics and processes for their production |
US4401945A (en) | 1981-04-30 | 1983-08-30 | The Valeron Corporation | Apparatus for detecting the position of a probe relative to a workpiece |
JPS5943091B2 (ja) * | 1981-06-03 | 1984-10-19 | 義栄 長谷川 | 固定プロ−ブ・ボ−ド |
US4888550A (en) | 1981-09-14 | 1989-12-19 | Texas Instruments Incorporated | Intelligent multiprobe tip |
EP0078339B1 (de) | 1981-10-30 | 1986-07-30 | Ibm Deutschland Gmbh | Tastkopfanordnung für Leiterzugüberprüfung mit mindestens einem, eine Vielzahl von federnden Kontakten aufweisenden Tastkopf |
US4453142A (en) | 1981-11-02 | 1984-06-05 | Motorola Inc. | Microstrip to waveguide transition |
US4480223A (en) | 1981-11-25 | 1984-10-30 | Seiichiro Aigo | Unitary probe assembly |
US4567436A (en) * | 1982-01-21 | 1986-01-28 | Linda Koch | Magnetic thickness gauge with adjustable probe |
DE3202461C1 (de) | 1982-01-27 | 1983-06-09 | Fa. Carl Zeiss, 7920 Heidenheim | Befestigung von Mikroskopobjektiven |
JPS58130602U (ja) | 1982-03-01 | 1983-09-03 | 西沢 哲也 | 前・後部に分解可能なヘア−ドライヤ− |
US4468629A (en) | 1982-05-27 | 1984-08-28 | Trw Inc. | NPN Operational amplifier |
US4528504A (en) | 1982-05-27 | 1985-07-09 | Harris Corporation | Pulsed linear integrated circuit tester |
US4502028A (en) * | 1982-06-15 | 1985-02-26 | Raytheon Company | Programmable two-port microwave network |
JPS584917A (ja) | 1982-06-23 | 1983-01-12 | 三洋電機株式会社 | アルミニウム電解コンデンサ駆動用電解液 |
US4527942A (en) | 1982-08-25 | 1985-07-09 | Intest Corporation | Electronic test head positioner for test systems |
US4705447A (en) | 1983-08-11 | 1987-11-10 | Intest Corporation | Electronic test head positioner for test systems |
US4551747A (en) | 1982-10-05 | 1985-11-05 | Mayo Foundation | Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation |
SU1392603A1 (ru) | 1982-11-19 | 1988-04-30 | Физико-технический институт низких температур АН УССР | Проходной режекторный фильтр |
US4487996A (en) | 1982-12-02 | 1984-12-11 | Electric Power Research Institute, Inc. | Shielded electrical cable |
GB2133649A (en) * | 1982-12-23 | 1984-07-25 | Philips Electronic Associated | Microwave oscillator |
US4558609A (en) | 1983-01-06 | 1985-12-17 | Wico Corporation | Joystick controller with interchangeable handles |
JPH0685044B2 (ja) | 1983-02-28 | 1994-10-26 | キヤノン株式会社 | 像再生出力装置 |
DE3308690A1 (de) | 1983-03-11 | 1984-09-13 | Deutsche Thomson-Brandt Gmbh, 7730 Villingen-Schwenningen | Verfahren zum abstimmen der schwingkreise eines nachrichtenempfangsgeraetes |
US4581679A (en) | 1983-05-31 | 1986-04-08 | Trw Inc. | Multi-element circuit construction |
JPS59226167A (ja) | 1983-06-04 | 1984-12-19 | Dainippon Screen Mfg Co Ltd | 基板表面処理装置 |
FR2547945B1 (fr) | 1983-06-21 | 1986-05-02 | Raffinage Cie Francaise | Nouvelle structure de cable electrique et ses applications |
US4553111A (en) | 1983-08-30 | 1985-11-12 | Burroughs Corporation | Printed circuit board maximizing areas for component utilization |
JPS6071425U (ja) | 1983-10-25 | 1985-05-20 | 株式会社アマダ | プレス機械における上部エプロンの取付構造 |
JPS6060042U (ja) | 1983-09-30 | 1985-04-26 | 日本電気ホームエレクトロニクス株式会社 | デイスククランプ装置 |
US4588950A (en) | 1983-11-15 | 1986-05-13 | Data Probe Corporation | Test system for VLSI digital circuit and method of testing |
JPS60136006U (ja) | 1984-02-20 | 1985-09-10 | 株式会社 潤工社 | フラツトケ−ブル |
US4646005A (en) | 1984-03-16 | 1987-02-24 | Motorola, Inc. | Signal probe |
US4722846A (en) * | 1984-04-18 | 1988-02-02 | Kikkoman Corporation | Novel variant and process for producing light colored soy sauce using such variant |
US4649339A (en) | 1984-04-25 | 1987-03-10 | Honeywell Inc. | Integrated circuit interface |
US4697143A (en) | 1984-04-30 | 1987-09-29 | Cascade Microtech, Inc. | Wafer probe |
US4653174A (en) | 1984-05-02 | 1987-03-31 | Gte Products Corporation | Method of making packaged IC chip |
JPS60235304A (ja) | 1984-05-08 | 1985-11-22 | 株式会社フジクラ | 直流電力ケ−ブル |
US4636722A (en) * | 1984-05-21 | 1987-01-13 | Probe-Rite, Inc. | High density probe-head with isolated and shielded transmission lines |
US4515133A (en) | 1984-05-31 | 1985-05-07 | Frank Roman | Fuel economizing device |
US4837507A (en) | 1984-06-08 | 1989-06-06 | American Telephone And Telegraph Company At&T Technologies, Inc. | High frequency in-circuit test fixture |
SU1195402A1 (ru) | 1984-06-11 | 1985-11-30 | Предприятие П/Я В-8117 | Разъемный коаксиально-микрополосковой переход |
DK291184D0 (da) | 1984-06-13 | 1984-06-13 | Boeegh Petersen Allan | Fremgangsmaade og indretning til test af kredsloebsplader |
US4755747A (en) | 1984-06-15 | 1988-07-05 | Canon Kabushiki Kaisha | Wafer prober and a probe card to be used therewith |
JPS6113583A (ja) | 1984-06-27 | 1986-01-21 | 日本電気株式会社 | 高周波コネクタ |
DE3426565A1 (de) | 1984-07-19 | 1986-01-23 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Kontaktfreie verbindung fuer planare leitungen |
DE3428087A1 (de) | 1984-07-30 | 1986-01-30 | Kraftwerk Union AG, 4330 Mülheim | Konzentrisches dreileiterkabel |
US4593243A (en) | 1984-08-29 | 1986-06-03 | Magnavox Government And Industrial Electronics Company | Coplanar and stripline probe card apparatus |
US4706050A (en) | 1984-09-22 | 1987-11-10 | Smiths Industries Public Limited Company | Microstrip devices |
US4652082A (en) | 1984-10-29 | 1987-03-24 | Amp Incorporated | Angled electro optic connector |
JPS61105411A (ja) * | 1984-10-29 | 1986-05-23 | Mitsutoyo Mfg Co Ltd | 多次元測定機の測定方法 |
NL8403755A (nl) | 1984-12-11 | 1986-07-01 | Philips Nv | Werkwijze voor de vervaardiging van een meerlaags gedrukte bedrading met doorverbonden sporen in verschillende lagen en meerlaags gedrukte bedrading vervaardigd volgens de werkwijze. |
US4713347A (en) | 1985-01-14 | 1987-12-15 | Sensor Diagnostics, Inc. | Measurement of ligand/anti-ligand interactions using bulk conductance |
US5266963A (en) | 1985-01-17 | 1993-11-30 | British Aerospace Public Limited Company | Integrated antenna/mixer for the microwave and millimetric wavebands |
JPS61164338A (ja) | 1985-01-17 | 1986-07-25 | Riken Denshi Kk | 多重演算型d/a変換器 |
US4651115A (en) | 1985-01-31 | 1987-03-17 | Rca Corporation | Waveguide-to-microstrip transition |
JPS61142802U (ko) | 1985-02-19 | 1986-09-03 | ||
US4744041A (en) | 1985-03-04 | 1988-05-10 | International Business Machines Corporation | Method for testing DC motors |
US4780670A (en) | 1985-03-04 | 1988-10-25 | Xerox Corporation | Active probe card for high resolution/low noise wafer level testing |
US4600907A (en) | 1985-03-07 | 1986-07-15 | Tektronix, Inc. | Coplanar microstrap waveguide interconnector and method of interconnection |
US4691163A (en) | 1985-03-19 | 1987-09-01 | Elscint Ltd. | Dual frequency surface probes |
US4755746A (en) | 1985-04-24 | 1988-07-05 | Prometrix Corporation | Apparatus and methods for semiconductor wafer testing |
US4626805A (en) | 1985-04-26 | 1986-12-02 | Tektronix, Inc. | Surface mountable microwave IC package |
US4684883A (en) | 1985-05-13 | 1987-08-04 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method of manufacturing high-quality semiconductor light-emitting devices |
JPH0671425B2 (ja) | 1985-06-05 | 1994-09-14 | サッポロビール株式会社 | ウリカ−ゼおよびその製造法 |
US4684884A (en) | 1985-07-02 | 1987-08-04 | Gte Communication Systems Corporation | Universal test circuit for integrated circuit packages |
FR2585513B1 (fr) | 1985-07-23 | 1987-10-09 | Thomson Csf | Dispositif de couplage entre un guide d'onde metallique, un guide d'onde dielectrique et un composant semi-conducteur, et melangeur utilisant ce dispositif de couplage |
EP0213825A3 (en) | 1985-08-22 | 1989-04-26 | Molecular Devices Corporation | Multiple chemically modulated capacitance |
GB2179458B (en) | 1985-08-23 | 1988-11-09 | Ferranti Plc | Microwave noise measuring apparatus |
DE3531893A1 (de) | 1985-09-06 | 1987-03-19 | Siemens Ag | Verfahren zur bestimmung der verteilung der dielektrizitaetskonstanten in einem untersuchungskoerper sowie messanordnung zur durchfuehrung des verfahrens |
US4746857A (en) * | 1985-09-13 | 1988-05-24 | Danippon Screen Mfg. Co. Ltd. | Probing apparatus for measuring electrical characteristics of semiconductor device formed on wafer |
US4749942A (en) | 1985-09-26 | 1988-06-07 | Tektronix, Inc. | Wafer probe head |
JPH0326643Y2 (ko) | 1985-09-30 | 1991-06-10 | ||
US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US6043563A (en) | 1997-05-06 | 2000-03-28 | Formfactor, Inc. | Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US6330164B1 (en) | 1985-10-18 | 2001-12-11 | Formfactor, Inc. | Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device |
US5829128A (en) | 1993-11-16 | 1998-11-03 | Formfactor, Inc. | Method of mounting resilient contact structures to semiconductor devices |
JPH06102313B2 (ja) | 1985-10-31 | 1994-12-14 | メドマン株式会社 | 自動調心嵌合ツ−ル |
US4696544A (en) | 1985-11-18 | 1987-09-29 | Olympus Corporation | Fiberscopic device for inspection of internal sections of construction, and method for using same |
SU1327023A1 (ru) | 1985-12-04 | 1987-07-30 | Горьковский политехнический институт им.А.А.Жданова | Способ измерени спектральной плотности интенсивности шума и коэффициента шума четырехполюсника |
JPS6298634U (ko) | 1985-12-12 | 1987-06-23 | ||
JPS62139000A (ja) | 1985-12-12 | 1987-06-22 | 日本電気株式会社 | 遠隔計測装置のフレ−ムidチエツク方式 |
US4853627A (en) | 1985-12-23 | 1989-08-01 | Triquint Semiconductor, Inc. | Wafer probes |
EP0230766A1 (en) | 1985-12-23 | 1987-08-05 | Tektronix, Inc. | Wafer probes |
US4727319A (en) | 1985-12-24 | 1988-02-23 | Hughes Aircraft Company | Apparatus for on-wafer testing of electrical circuits |
JPS62107937U (ko) | 1985-12-25 | 1987-07-10 | ||
EP0230348A2 (en) | 1986-01-07 | 1987-07-29 | Hewlett-Packard Company | Test probe |
US4793814A (en) | 1986-07-21 | 1988-12-27 | Rogers Corporation | Electrical circuit board interconnect |
DE3785681T2 (de) | 1986-01-24 | 1993-08-12 | Fuji Photo Film Co Ltd | Blattfilmkassette und vorrichtung zum beladen von blattfilmen. |
JPS62239050A (ja) | 1986-04-10 | 1987-10-19 | Kobe Steel Ltd | 渦流探傷装置 |
US4757255A (en) | 1986-03-03 | 1988-07-12 | National Semiconductor Corporation | Environmental box for automated wafer probing |
EP0241724B1 (en) | 1986-03-14 | 1993-01-20 | Sumitomo Electric Industries Limited | Optical connector and splicer |
US5361049A (en) | 1986-04-14 | 1994-11-01 | The United States Of America As Represented By The Secretary Of The Navy | Transition from double-ridge waveguide to suspended substrate |
JPS62179126U (ko) | 1986-04-30 | 1987-11-13 | ||
JPS62295374A (ja) | 1986-05-19 | 1987-12-22 | ユナイテッド・テクノロジ−ズ・コ−ポレイション | 電気コネクタ装置 |
US4766384A (en) | 1986-06-20 | 1988-08-23 | Schlumberger Technology Corp. | Well logging apparatus for determining dip, azimuth, and invaded zone conductivity |
US5095891A (en) | 1986-07-10 | 1992-03-17 | Siemens Aktiengesellschaft | Connecting cable for use with a pulse generator and a shock wave generator |
DE3625631A1 (de) | 1986-07-29 | 1988-02-04 | Gore W L & Co Gmbh | Elektromagnetische abschirmung |
US4739259A (en) | 1986-08-01 | 1988-04-19 | Tektronix, Inc. | Telescoping pin probe |
US4783625A (en) | 1986-08-21 | 1988-11-08 | Tektronix, Inc. | Wideband high impedance card mountable probe |
JP2609232B2 (ja) | 1986-09-04 | 1997-05-14 | 日本ヒューレット・パッカード株式会社 | フローテイング駆動回路 |
EP0259183A3 (en) | 1986-09-05 | 1989-06-28 | Lifetrac | Process for controlling the accuracy and precision of sensitivity assays |
EP0259163A3 (en) | 1986-09-05 | 1989-07-12 | Tektronix, Inc. | Semiconductor wafer probe |
US4673839A (en) | 1986-09-08 | 1987-06-16 | Tektronix, Inc. | Piezoelectric pressure sensing apparatus for integrated circuit testing stations |
US4904933A (en) | 1986-09-08 | 1990-02-27 | Tektronix, Inc. | Integrated circuit probe station |
FR2603954B1 (fr) | 1986-09-15 | 1988-12-16 | Olaer Ind Sa | Reservoir de pression a capteur de presence de liquide dans une chambre de gaz |
US4690472A (en) | 1986-09-26 | 1987-09-01 | E. I. Du Pont De Nemours And Company | High density flex connector system |
DE3637549A1 (de) | 1986-11-04 | 1988-05-11 | Hans Dr Med Rosenberger | Messgeraet zur pruefung der dielektrischen eigenschaften biologischer gewebe |
US4764723A (en) | 1986-11-10 | 1988-08-16 | Cascade Microtech, Inc. | Wafer probe |
FR2606887B1 (fr) | 1986-11-18 | 1989-01-13 | Thomson Semiconducteurs | Circuit de mesure des caracteristiques dynamiques d'un boitier pour circuit integre rapide, et procede de mesure de ces caracteristiques dynamiques |
US4754239A (en) | 1986-12-19 | 1988-06-28 | The United States Of America As Represented By The Secretary Of The Air Force | Waveguide to stripline transition assembly |
US4772846A (en) | 1986-12-29 | 1988-09-20 | Hughes Aircraft Company | Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy |
JPH0625332Y2 (ja) | 1987-01-06 | 1994-07-06 | ブラザー工業株式会社 | 印字装置 |
US4812754A (en) | 1987-01-07 | 1989-03-14 | Tracy Theodore A | Circuit board interfacing apparatus |
US4727637A (en) | 1987-01-20 | 1988-03-01 | The Boeing Company | Computer aided connector assembly method and apparatus |
US4918383A (en) | 1987-01-20 | 1990-04-17 | Huff Richard E | Membrane probe with automatic contact scrub action |
US4827211A (en) | 1987-01-30 | 1989-05-02 | Cascade Microtech, Inc. | Wafer probe |
JPH0611463Y2 (ja) | 1987-02-06 | 1994-03-23 | アンリツ株式会社 | 高周波プローブ |
US4711563A (en) | 1987-02-11 | 1987-12-08 | Lass Bennett D | Portable collapsible darkroom |
JPS63129640U (ko) | 1987-02-17 | 1988-08-24 | ||
US4864227A (en) | 1987-02-27 | 1989-09-05 | Canon Kabushiki Kaisha | Wafer prober |
US4734641A (en) | 1987-03-09 | 1988-03-29 | Tektronix, Inc. | Method for the thermal characterization of semiconductor packaging systems |
JPS63143814U (ko) | 1987-03-12 | 1988-09-21 | ||
JPS63152141U (ko) | 1987-03-26 | 1988-10-06 | ||
US5180976A (en) | 1987-04-17 | 1993-01-19 | Everett/Charles Contact Products, Inc. | Integrated circuit carrier having built-in circuit verification |
US5082627A (en) | 1987-05-01 | 1992-01-21 | Biotronic Systems Corporation | Three dimensional binding site array for interfering with an electrical field |
JPH0414360Y2 (ko) | 1987-05-29 | 1992-03-31 | ||
US4908570A (en) | 1987-06-01 | 1990-03-13 | Hughes Aircraft Company | Method of measuring FET noise parameters |
US4740764A (en) | 1987-06-03 | 1988-04-26 | Varian Associates, Inc. | Pressure sealed waveguide to coaxial line connection |
US4810981A (en) | 1987-06-04 | 1989-03-07 | General Microwave Corporation | Assembly of microwave components |
US4912399A (en) | 1987-06-09 | 1990-03-27 | Tektronix, Inc. | Multiple lead probe for integrated circuits in wafer form |
JPH07111987B2 (ja) | 1987-06-22 | 1995-11-29 | 東京エレクトロン株式会社 | プロ−ブ装置 |
US4894612A (en) | 1987-08-13 | 1990-01-16 | Hypres, Incorporated | Soft probe for providing high speed on-wafer connections to a circuit |
US4755874A (en) | 1987-08-31 | 1988-07-05 | Kla Instruments Corporation | Emission microscopy system |
US5084671A (en) | 1987-09-02 | 1992-01-28 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
US5198752A (en) | 1987-09-02 | 1993-03-30 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
JPH0660912B2 (ja) | 1987-09-07 | 1994-08-10 | 浜松ホトニクス株式会社 | 電圧検出装置 |
US4791363A (en) | 1987-09-28 | 1988-12-13 | Logan John K | Ceramic microstrip probe blade |
US4929893A (en) | 1987-10-06 | 1990-05-29 | Canon Kabushiki Kaisha | Wafer prober |
US4922912A (en) | 1987-10-21 | 1990-05-08 | Hideto Watanabe | MAP catheter |
US5062149A (en) | 1987-10-23 | 1991-10-29 | General Dynamics Corporation | Millimeter wave device and method of making |
JP2554669Y2 (ja) | 1987-11-10 | 1997-11-17 | 博 寺町 | 回転位置決め装置 |
US4859989A (en) | 1987-12-01 | 1989-08-22 | W. L. Gore & Associates, Inc. | Security system and signal carrying member thereof |
JPH01165968A (ja) | 1987-12-22 | 1989-06-29 | Mitsubishi Electric Corp | ウエハプロービング装置 |
US4851767A (en) | 1988-01-15 | 1989-07-25 | International Business Machines Corporation | Detachable high-speed opto-electronic sampling probe |
US4891584A (en) | 1988-03-21 | 1990-01-02 | Semitest, Inc. | Apparatus for making surface photovoltage measurements of a semiconductor |
JPH01209380A (ja) | 1988-02-16 | 1989-08-23 | Fujitsu Ltd | プローブカード |
JPH01214038A (ja) | 1988-02-22 | 1989-08-28 | Mitsubishi Electric Corp | プローブカード |
JPH06103333B2 (ja) | 1988-02-27 | 1994-12-14 | アンリツ株式会社 | 高周波特性測定装置 |
US4980637A (en) | 1988-03-01 | 1990-12-25 | Hewlett-Packard Company | Force delivery system for improved precision membrane probe |
JPH01133701U (ko) | 1988-03-07 | 1989-09-12 | ||
US4988062A (en) | 1988-03-10 | 1991-01-29 | London Robert A | Apparatus, system and method for organizing and maintaining a plurality of medical catheters and the like |
US4918373A (en) | 1988-03-18 | 1990-04-17 | Hughes Aircraft Company | R.F. phase noise test set using fiber optic delay line |
US4858160A (en) | 1988-03-18 | 1989-08-15 | Cascade Microtech, Inc. | System for setting reference reactance for vector corrected measurements |
US5021186A (en) | 1988-03-25 | 1991-06-04 | Nissan Chemical Industries, Ltd. | Chloroisocyanuric acid composition having storage stability |
US4839587A (en) | 1988-03-29 | 1989-06-13 | Digital Equipment Corporation | Test fixture for tab circuits and devices |
JPH01250870A (ja) * | 1988-03-31 | 1989-10-05 | Toshiba Corp | インサーキットテスト装置 |
US4835495A (en) | 1988-04-11 | 1989-05-30 | Hughes Aircraft Company | Diode device packaging arrangement |
US4871964A (en) | 1988-04-12 | 1989-10-03 | G. G. B. Industries, Inc. | Integrated circuit probing apparatus |
US5354695A (en) | 1992-04-08 | 1994-10-11 | Leedy Glenn J | Membrane dielectric isolation IC fabrication |
US5020219A (en) | 1988-05-16 | 1991-06-04 | Leedy Glenn J | Method of making a flexible tester surface for testing integrated circuits |
US5323035A (en) | 1992-10-13 | 1994-06-21 | Glenn Leedy | Interconnection structure for integrated circuits and method for making same |
US4983910A (en) | 1988-05-20 | 1991-01-08 | Stanford University | Millimeter-wave active probe |
US5003253A (en) | 1988-05-20 | 1991-03-26 | The Board Of Trustees Of The Leland Stanford Junior University | Millimeter-wave active probe system |
JP2634191B2 (ja) | 1988-05-24 | 1997-07-23 | 三菱電機株式会社 | プローブカード |
US4987100A (en) | 1988-05-26 | 1991-01-22 | International Business Machines Corporation | Flexible carrier for an electronic device |
US4831494A (en) | 1988-06-27 | 1989-05-16 | International Business Machines Corporation | Multilayer capacitor |
US5116180A (en) | 1988-07-18 | 1992-05-26 | Spar Aerospace Limited | Human-in-the-loop machine control loop |
US4991290A (en) | 1988-07-21 | 1991-02-12 | Microelectronics And Computer Technology | Flexible electrical interconnect and method of making |
JPH075078Y2 (ja) | 1988-09-29 | 1995-02-08 | シャープ株式会社 | メディアカートリッジを有する画像形成装置 |
US4926172A (en) | 1988-09-02 | 1990-05-15 | Dickey-John Corporation | Joystick controller |
EP0361779A1 (en) | 1988-09-26 | 1990-04-04 | Hewlett-Packard Company | Micro-strip architecture for membrane test probe |
US4906920A (en) | 1988-10-11 | 1990-03-06 | Hewlett-Packard Company | Self-leveling membrane probe |
US4893914A (en) | 1988-10-12 | 1990-01-16 | The Micromanipulator Company, Inc. | Test station |
JPH02191352A (ja) | 1988-10-24 | 1990-07-27 | Tokyo Electron Ltd | プローブ装置 |
US4998062A (en) | 1988-10-25 | 1991-03-05 | Tokyo Electron Limited | Probe device having micro-strip line structure |
JPH02124469A (ja) | 1988-11-01 | 1990-05-11 | Nec Kyushu Ltd | プローブカード |
CA1278106C (en) | 1988-11-02 | 1990-12-18 | Gordon Glen Rabjohn | Tunable microwave wafer probe |
US4849689A (en) | 1988-11-04 | 1989-07-18 | Cascade Microtech, Inc. | Microwave wafer probe having replaceable probe tip |
US4904935A (en) | 1988-11-14 | 1990-02-27 | Eaton Corporation | Electrical circuit board text fixture having movable platens |
US5142224A (en) | 1988-12-13 | 1992-08-25 | Comsat | Non-destructive semiconductor wafer probing system using laser pulses to generate and detect millimeter wave signals |
US4916398A (en) | 1988-12-21 | 1990-04-10 | Spectroscopy Imaging Systems Corp. | Efficient remote transmission line probe tuning for NMR apparatus |
US5129006A (en) | 1989-01-06 | 1992-07-07 | Hill Amel L | Electronic audio signal amplifier and loudspeaker system |
US4922128A (en) | 1989-01-13 | 1990-05-01 | Ibm Corporation | Boost clock circuit for driving redundant wordlines and sample wordlines |
US4916002A (en) | 1989-01-13 | 1990-04-10 | The Board Of Trustees Of The Leland Jr. University | Microcasting of microminiature tips |
DE8901113U1 (ko) | 1989-02-02 | 1990-03-01 | Felten & Guilleaume Energietechnik Ag, 5000 Koeln, De | |
US5232789A (en) | 1989-03-09 | 1993-08-03 | Mtu Motoren- Und Turbinen-Union Muenchen Gmbh | Structural component with a protective coating having a nickel or cobalt basis and method for making such a coating |
US5159752A (en) | 1989-03-22 | 1992-11-03 | Texas Instruments Incorporated | Scanning electron microscope based parametric testing method and apparatus |
JPH0712871Y2 (ja) | 1989-03-28 | 1995-03-29 | 北斗工機株式会社 | 穀類乾操装置 |
US5304924A (en) | 1989-03-29 | 1994-04-19 | Canon Kabushiki Kaisha | Edge detector |
JPH02135804U (ko) | 1989-04-18 | 1990-11-13 | ||
US5030907A (en) | 1989-05-19 | 1991-07-09 | Knights Technology, Inc. | CAD driven microprobe integrated circuit tester |
US4980638A (en) | 1989-05-26 | 1990-12-25 | Dermon John A | Microcircuit probe and method for manufacturing same |
US4965514A (en) | 1989-06-05 | 1990-10-23 | Tektronix, Inc. | Apparatus for probing a microwave circuit |
US5045781A (en) | 1989-06-08 | 1991-09-03 | Cascade Microtech, Inc. | High-frequency active probe having replaceable contact needles |
US4970386A (en) | 1989-06-22 | 1990-11-13 | Westinghouse Electric Corp. | Vertical FET high speed optical sensor |
US5134365A (en) | 1989-07-11 | 1992-07-28 | Nihon Denshizairyo Kabushiki Kaisha | Probe card in which contact pressure and relative position of each probe end are correctly maintained |
US4998063A (en) | 1989-07-31 | 1991-03-05 | Abb Power T & D Company, Inc. | Fiber optic coupled magneto-optic sensor having a concave reflective focusing surface |
US5041782A (en) | 1989-09-20 | 1991-08-20 | Design Technique International, Inc. | Microstrip probe |
US5166606A (en) | 1989-11-03 | 1992-11-24 | John H. Blanz Company, Inc. | High efficiency cryogenic test station |
US5160883A (en) | 1989-11-03 | 1992-11-03 | John H. Blanz Company, Inc. | Test station having vibrationally stabilized X, Y and Z movable integrated circuit receiving support |
US5097207A (en) | 1989-11-03 | 1992-03-17 | John H. Blanz Company, Inc. | Temperature stable cryogenic probe station |
US5267088A (en) | 1989-11-10 | 1993-11-30 | Asahi Kogaku Kogyo Kabushiki Kaisha | Code plate mounting device |
JPH03175367A (ja) | 1989-12-04 | 1991-07-30 | Sharp Corp | 半導体装置の直流特性測定用治具 |
US4975638A (en) | 1989-12-18 | 1990-12-04 | Wentworth Laboratories | Test probe assembly for testing integrated circuit devices |
US5145552A (en) | 1989-12-21 | 1992-09-08 | Canon Kabushiki Kaisha | Process for preparing electrical connecting member |
JP2759116B2 (ja) | 1989-12-25 | 1998-05-28 | 東京エレクトロン株式会社 | 熱処理方法および熱処理装置 |
US5089774A (en) | 1989-12-26 | 1992-02-18 | Sharp Kabushiki Kaisha | Apparatus and a method for checking a semiconductor |
JPH03209737A (ja) | 1990-01-11 | 1991-09-12 | Tokyo Electron Ltd | プローブ装置 |
US5066357A (en) | 1990-01-11 | 1991-11-19 | Hewlett-Packard Company | Method for making flexible circuit card with laser-contoured vias and machined capacitors |
US5298972A (en) | 1990-01-22 | 1994-03-29 | Hewlett-Packard Company | Method and apparatus for measuring polarization sensitivity of optical devices |
US5001423A (en) | 1990-01-24 | 1991-03-19 | International Business Machines Corporation | Dry interface thermal chuck temperature control system for semiconductor wafer testing |
JP2873598B2 (ja) | 1990-02-02 | 1999-03-24 | 東芝セラミックス株式会社 | 半導体ウエハ用真空チャック |
US5069628A (en) | 1990-03-13 | 1991-12-03 | Hughes Aircraft Company | Flexible electrical cable connector with double sided dots |
US5007163A (en) | 1990-04-18 | 1991-04-16 | International Business Machines Corporation | Non-destructure method of performing electrical burn-in testing of semiconductor chips |
US5408189A (en) | 1990-05-25 | 1995-04-18 | Everett Charles Technologies, Inc. | Test fixture alignment system for printed circuit boards |
US5012186A (en) | 1990-06-08 | 1991-04-30 | Cascade Microtech, Inc. | Electrical probe with contact force protection |
US5245292A (en) | 1990-06-12 | 1993-09-14 | Iniziative Marittime 1991, S.R.L. | Method and apparatus for sensing a fluid handling |
US5198753A (en) | 1990-06-29 | 1993-03-30 | Digital Equipment Corporation | Integrated circuit test fixture and method |
US5061823A (en) | 1990-07-13 | 1991-10-29 | W. L. Gore & Associates, Inc. | Crush-resistant coaxial transmission line |
US5187443A (en) | 1990-07-24 | 1993-02-16 | Bereskin Alexander B | Microwave test fixtures for determining the dielectric properties of a material |
US5128612A (en) | 1990-07-31 | 1992-07-07 | Texas Instruments Incorporated | Disposable high performance test head |
US5569591A (en) | 1990-08-03 | 1996-10-29 | University College Of Wales Aberystwyth | Analytical or monitoring apparatus and method |
KR0138754B1 (ko) | 1990-08-06 | 1998-06-15 | 이노우에 아키라 | 전기회로측정용 탐침의 접촉검지장치 및 이 접촉검지장치를 이용한 전기회로 측정장치 |
US5059898A (en) | 1990-08-09 | 1991-10-22 | Tektronix, Inc. | Wafer probe with transparent loading member |
US5363050A (en) | 1990-08-31 | 1994-11-08 | Guo Wendy W | Quantitative dielectric imaging system |
US5091732A (en) | 1990-09-07 | 1992-02-25 | The United States Of America As Represented By The Secretary Of The Navy | Lightweight deployable antenna system |
US6037785A (en) | 1990-09-20 | 2000-03-14 | Higgins; H. Dan | Probe card apparatus |
JPH04130639A (ja) | 1990-09-20 | 1992-05-01 | Fuji Electric Co Ltd | プローブカードの触針とウェーハとの接触検出方法および検出装置 |
US5521518A (en) | 1990-09-20 | 1996-05-28 | Higgins; H. Dan | Probe card apparatus |
US5589781A (en) | 1990-09-20 | 1996-12-31 | Higgins; H. Dan | Die carrier apparatus |
JP3196206B2 (ja) | 1990-09-25 | 2001-08-06 | 東芝ライテック株式会社 | 放電ランプ点灯装置 |
US5159267A (en) | 1990-09-28 | 1992-10-27 | Sematech, Inc. | Pneumatic energy fluxmeter |
GB9021448D0 (en) | 1990-10-03 | 1990-11-14 | Renishaw Plc | Capacitance sensing probe |
US5126286A (en) | 1990-10-05 | 1992-06-30 | Micron Technology, Inc. | Method of manufacturing edge connected semiconductor die |
JP2544015Y2 (ja) | 1990-10-15 | 1997-08-13 | 株式会社アドバンテスト | Ic試験装置 |
JPH04159043A (ja) | 1990-10-24 | 1992-06-02 | Hitachi Ltd | 真空チヤツク |
US5148103A (en) | 1990-10-31 | 1992-09-15 | Hughes Aircraft Company | Apparatus for testing integrated circuits |
US5207585A (en) | 1990-10-31 | 1993-05-04 | International Business Machines Corporation | Thin interface pellicle for dense arrays of electrical interconnects |
JP2588060B2 (ja) | 1990-11-30 | 1997-03-05 | 住友シチックス株式会社 | 半導体ウェーハの研磨用チャック |
US5061192A (en) | 1990-12-17 | 1991-10-29 | International Business Machines Corporation | High density connector |
US5138289A (en) | 1990-12-21 | 1992-08-11 | California Institute Of Technology | Noncontacting waveguide backshort |
JP3699349B2 (ja) | 1990-12-25 | 2005-09-28 | 日本碍子株式会社 | ウエハー吸着加熱装置 |
US5280156A (en) | 1990-12-25 | 1994-01-18 | Ngk Insulators, Ltd. | Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means |
US5107076A (en) | 1991-01-08 | 1992-04-21 | W. L. Gore & Associates, Inc. | Easy strip composite dielectric coaxial signal cable |
JPH04340248A (ja) | 1991-01-22 | 1992-11-26 | Tokyo Electron Yamanashi Kk | ウエハプローバ |
US5136237A (en) | 1991-01-29 | 1992-08-04 | Tektronix, Inc. | Double insulated floating high voltage test probe |
US5097101A (en) | 1991-02-05 | 1992-03-17 | Tektronix, Inc. | Method of forming a conductive contact bump on a flexible substrate and a flexible substrate |
US5233306A (en) | 1991-02-13 | 1993-08-03 | The Board Of Regents Of The University Of Wisconsin System | Method and apparatus for measuring the permittivity of materials |
US5172050A (en) | 1991-02-15 | 1992-12-15 | Motorola, Inc. | Micromachined semiconductor probe card |
US5133119A (en) | 1991-02-28 | 1992-07-28 | Hewlett-Packard Company | Shearing stress interconnection apparatus and method |
US6411377B1 (en) | 1991-04-02 | 2002-06-25 | Hitachi, Ltd. | Optical apparatus for defect and particle size inspection |
US5172051A (en) | 1991-04-24 | 1992-12-15 | Hewlett-Packard Company | Wide bandwidth passive probe |
US5317656A (en) | 1991-05-17 | 1994-05-31 | Texas Instruments Incorporated | Fiber optic network for multi-point emissivity-compensated semiconductor wafer pyrometry |
US5225037A (en) | 1991-06-04 | 1993-07-06 | Texas Instruments Incorporated | Method for fabrication of probe card for testing of semiconductor devices |
US5487999A (en) | 1991-06-04 | 1996-01-30 | Micron Technology, Inc. | Method for fabricating a penetration limited contact having a rough textured surface |
US5686317A (en) | 1991-06-04 | 1997-11-11 | Micron Technology, Inc. | Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die |
US5148131A (en) | 1991-06-11 | 1992-09-15 | Hughes Aircraft Company | Coaxial-to-waveguide transducer with improved matching |
US5101453A (en) | 1991-07-05 | 1992-03-31 | Cascade Microtech, Inc. | Fiber optic wafer probe |
US5233197A (en) | 1991-07-15 | 1993-08-03 | University Of Massachusetts Medical Center | High speed digital imaging microscope |
KR940001809B1 (ko) | 1991-07-18 | 1994-03-09 | 금성일렉트론 주식회사 | 반도체 칩의 테스터 |
US5229782A (en) | 1991-07-19 | 1993-07-20 | Conifer Corporation | Stacked dual dipole MMDS feed |
US5321352A (en) | 1991-08-01 | 1994-06-14 | Tokyo Electron Yamanashi Limited | Probe apparatus and method of alignment for the same |
US5177438A (en) | 1991-08-02 | 1993-01-05 | Motorola, Inc. | Low resistance probe for semiconductor |
US5321453A (en) | 1991-08-03 | 1994-06-14 | Tokyo Electron Limited | Probe apparatus for probing an object held above the probe card |
US5404111A (en) | 1991-08-03 | 1995-04-04 | Tokyo Electron Limited | Probe apparatus with a swinging holder for an object of examination |
US5126696A (en) | 1991-08-12 | 1992-06-30 | Trw Inc. | W-Band waveguide variable controlled oscillator |
US5420516A (en) | 1991-09-20 | 1995-05-30 | Audio Precision, Inc. | Method and apparatus for fast response and distortion measurement |
US5159264A (en) | 1991-10-02 | 1992-10-27 | Sematech, Inc. | Pneumatic energy fluxmeter |
US5214243A (en) | 1991-10-11 | 1993-05-25 | Endevco Corporation | High-temperature, low-noise coaxial cable assembly with high strength reinforcement braid |
JPH05113451A (ja) | 1991-10-22 | 1993-05-07 | Nippon Maikuronikusu:Kk | プローブボード |
US5334931A (en) | 1991-11-12 | 1994-08-02 | International Business Machines Corporation | Molded test probe assembly |
US5170930A (en) | 1991-11-14 | 1992-12-15 | Microelectronics And Computer Technology Corporation | Liquid metal paste for thermal and electrical connections |
US5537372A (en) | 1991-11-15 | 1996-07-16 | International Business Machines Corporation | High density data storage system with topographic contact sensor |
IL103674A0 (en) | 1991-11-19 | 1993-04-04 | Houston Advanced Res Center | Method and apparatus for molecule detection |
US5846708A (en) | 1991-11-19 | 1998-12-08 | Massachusetts Institiute Of Technology | Optical and electrical methods and apparatus for molecule detection |
US5414565A (en) | 1991-11-27 | 1995-05-09 | Sullivan; Mark T. | Tilting kinematic mount |
US5180977A (en) | 1991-12-02 | 1993-01-19 | Hoya Corporation Usa | Membrane probe contact bump compliancy system |
US5202648A (en) | 1991-12-09 | 1993-04-13 | The Boeing Company | Hermetic waveguide-to-microstrip transition module |
US5214374A (en) | 1991-12-12 | 1993-05-25 | Everett/Charles Contact Products, Inc. | Dual level test fixture |
US5335305A (en) | 1991-12-19 | 1994-08-02 | Optex Biomedical, Inc. | Optical sensor for fluid parameters |
US5686960A (en) | 1992-01-14 | 1997-11-11 | Michael Sussman | Image input device having optical deflection elements for capturing multiple sub-images |
US5274336A (en) | 1992-01-14 | 1993-12-28 | Hewlett-Packard Company | Capacitively-coupled test probe |
US5367165A (en) | 1992-01-17 | 1994-11-22 | Olympus Optical Co., Ltd. | Cantilever chip for scanning probe microscope |
US5374938A (en) | 1992-01-21 | 1994-12-20 | Sharp Kabushiki Kaisha | Waveguide to microstrip conversion means in a satellite broadcasting adaptor |
US5389885A (en) | 1992-01-27 | 1995-02-14 | Everett Charles Technologies, Inc. | Expandable diaphragm test modules and connectors |
US5584120A (en) | 1992-02-14 | 1996-12-17 | Research Organization For Circuit Knowledge | Method of manufacturing printed circuits |
US5202558A (en) | 1992-03-04 | 1993-04-13 | Barker Lynn M | Flexible fiber optic probe for high-pressure shock experiments |
US5376790A (en) | 1992-03-13 | 1994-12-27 | Park Scientific Instruments | Scanning probe microscope |
US5672816A (en) | 1992-03-13 | 1997-09-30 | Park Scientific Instruments | Large stage system for scanning probe microscopes and other instruments |
US5254939A (en) | 1992-03-20 | 1993-10-19 | Xandex, Inc. | Probe card system |
US5478748A (en) | 1992-04-01 | 1995-12-26 | Thomas Jefferson University | Protein assay using microwave energy |
DE4211362C2 (de) | 1992-04-04 | 1995-04-20 | Berthold Lab Prof Dr | Vorrichtung zur Bestimmung von Materialparametern durch Mikrowellenmessungen |
TW212252B (ko) | 1992-05-01 | 1993-09-01 | Martin Marietta Corp | |
USRE37130E1 (en) | 1992-05-08 | 2001-04-10 | David Fiori, Jr. | Signal conditioning apparatus |
US5281364A (en) * | 1992-05-22 | 1994-01-25 | Finch Limited | Liquid metal electrical contact compositions |
US5266889A (en) | 1992-05-29 | 1993-11-30 | Cascade Microtech, Inc. | Wafer probe station with integrated environment control enclosure |
US5479109A (en) | 1992-06-03 | 1995-12-26 | Trw Inc. | Testing device for integrated circuits on wafer |
US5275738A (en) * | 1992-06-10 | 1994-01-04 | Pall Corporation | Filter device for acids and process for filtering inorganic acids |
US6380751B2 (en) | 1992-06-11 | 2002-04-30 | Cascade Microtech, Inc. | Wafer probe station having environment control enclosure |
US5345170A (en) | 1992-06-11 | 1994-09-06 | Cascade Microtech, Inc. | Wafer probe station having integrated guarding, Kelvin connection and shielding systems |
JPH0634715A (ja) | 1992-07-17 | 1994-02-10 | Mitsubishi Electric Corp | 高周波帯プローブヘッド |
US5316435A (en) | 1992-07-29 | 1994-05-31 | Case Corporation | Three function control system |
US5360312A (en) | 1992-07-29 | 1994-11-01 | Case Corporation | Three function control mechanism |
FR2695508B1 (fr) | 1992-09-08 | 1994-10-21 | Filotex Sa | Câble à faible niveau de bruit. |
US5227730A (en) | 1992-09-14 | 1993-07-13 | Kdc Technology Corp. | Microwave needle dielectric sensors |
US5347204A (en) | 1992-10-06 | 1994-09-13 | Honeywell Inc. | Position dependent rate dampening in any active hand controller |
US6295729B1 (en) | 1992-10-19 | 2001-10-02 | International Business Machines Corporation | Angled flying lead wire bonding process |
US5371654A (en) | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
JPH06132709A (ja) | 1992-10-20 | 1994-05-13 | Fujitsu General Ltd | 導波管/ストリップ線路変換器 |
US5308250A (en) | 1992-10-30 | 1994-05-03 | Hewlett-Packard Company | Pressure contact for connecting a coaxial shield to a microstrip ground plane |
US5479108A (en) | 1992-11-25 | 1995-12-26 | David Cheng | Method and apparatus for handling wafers |
JPH06151532A (ja) | 1992-11-13 | 1994-05-31 | Tokyo Electron Yamanashi Kk | プローブ装置 |
US5684669A (en) | 1995-06-07 | 1997-11-04 | Applied Materials, Inc. | Method for dechucking a workpiece from an electrostatic chuck |
US5512835A (en) | 1992-12-22 | 1996-04-30 | Hughes Aircraft Company | Electrical probe and method for measuring gaps and other discontinuities in enclosures using electrical inductance for RF shielding assessment |
US5326412A (en) | 1992-12-22 | 1994-07-05 | Hughes Aircraft Company | Method for electrodepositing corrosion barrier on isolated circuitry |
US5355079A (en) | 1993-01-07 | 1994-10-11 | Wentworth Laboratories, Inc. | Probe assembly for testing integrated circuit devices |
US5422574A (en) | 1993-01-14 | 1995-06-06 | Probe Technology Corporation | Large scale protrusion membrane for semiconductor devices under test with very high pin counts |
JPH0792479B2 (ja) | 1993-03-18 | 1995-10-09 | 東京エレクトロン株式会社 | プローブ装置の平行度調整方法 |
JPH06295949A (ja) | 1993-04-09 | 1994-10-21 | Matsushita Electric Ind Co Ltd | 検査装置、検査方法及び半導体装置 |
US5539676A (en) | 1993-04-15 | 1996-07-23 | Tokyo Electron Limited | Method of identifying probe position and probing method in prober |
JPH06302656A (ja) | 1993-04-19 | 1994-10-28 | Toshiba Corp | 半導体素子特性評価装置及び該装置を用いる半導体素子特性評価方法 |
US5383787A (en) | 1993-04-27 | 1995-01-24 | Aptix Corporation | Integrated circuit package with direct access to internal signals |
US5395253A (en) | 1993-04-29 | 1995-03-07 | Hughes Aircraft Company | Membrane connector with stretch induced micro scrub |
US5914614A (en) | 1996-03-12 | 1999-06-22 | International Business Machines Corporation | High density cantilevered probe for electronic devices |
US5811982A (en) | 1995-11-27 | 1998-09-22 | International Business Machines Corporation | High density cantilevered probe for electronic devices |
US5810607A (en) | 1995-09-13 | 1998-09-22 | International Business Machines Corporation | Interconnector with contact pads having enhanced durability |
US6054651A (en) | 1996-06-21 | 2000-04-25 | International Business Machines Corporation | Foamed elastomers for wafer probing applications and interposer connectors |
US6722032B2 (en) | 1995-11-27 | 2004-04-20 | International Business Machines Corporation | Method of forming a structure for electronic devices contact locations |
US6329827B1 (en) | 1997-10-07 | 2001-12-11 | International Business Machines Corporation | High density cantilevered probe for electronic devices |
WO1998011445A1 (en) | 1996-09-13 | 1998-03-19 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips |
US5357211A (en) | 1993-05-03 | 1994-10-18 | Raytheon Company | Pin driver amplifier |
US5539323A (en) | 1993-05-07 | 1996-07-23 | Brooks Automation, Inc. | Sensor for articles such as wafers on end effector |
US5467021A (en) | 1993-05-24 | 1995-11-14 | Atn Microwave, Inc. | Calibration method and apparatus |
US5657394A (en) | 1993-06-04 | 1997-08-12 | Integrated Technology Corporation | Integrated circuit probe card inspection system |
US5373231A (en) | 1993-06-10 | 1994-12-13 | G. G. B. Industries, Inc. | Integrated circuit probing apparatus including a capacitor bypass structure |
US5412330A (en) | 1993-06-16 | 1995-05-02 | Tektronix, Inc. | Optical module for an optically based measurement system |
JPH0714898A (ja) | 1993-06-23 | 1995-01-17 | Mitsubishi Electric Corp | 半導体ウエハの試験解析装置および解析方法 |
US6728113B1 (en) | 1993-06-24 | 2004-04-27 | Polychip, Inc. | Method and apparatus for non-conductively interconnecting integrated circuits |
JP3346838B2 (ja) | 1993-06-29 | 2002-11-18 | 有限会社創造庵 | 回転運動機構 |
US5412866A (en) | 1993-07-01 | 1995-05-09 | Hughes Aircraft Company | Method of making a cast elastomer/membrane test probe assembly |
US5441690A (en) | 1993-07-06 | 1995-08-15 | International Business Machines Corporation | Process of making pinless connector |
JP3395264B2 (ja) | 1993-07-26 | 2003-04-07 | 東京応化工業株式会社 | 回転カップ式塗布装置 |
JP3442822B2 (ja) | 1993-07-28 | 2003-09-02 | アジレント・テクノロジー株式会社 | 測定用ケーブル及び測定システム |
US5451884A (en) | 1993-08-04 | 1995-09-19 | Transat Corp. | Electronic component temperature test system with flat ring revolving carriage |
US5792668A (en) | 1993-08-06 | 1998-08-11 | Solid State Farms, Inc. | Radio frequency spectral analysis for in-vitro or in-vivo environments |
US5494030A (en) | 1993-08-12 | 1996-02-27 | Trustees Of Dartmouth College | Apparatus and methodology for determining oxygen in biological systems |
US5594358A (en) | 1993-09-02 | 1997-01-14 | Matsushita Electric Industrial Co., Ltd. | Radio frequency probe and probe card including a signal needle and grounding needle coupled to a microstrip transmission line |
US5326428A (en) | 1993-09-03 | 1994-07-05 | Micron Semiconductor, Inc. | Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
DE9313420U1 (de) | 1993-09-06 | 1993-10-28 | Ge Elektronik Gmbh Magdeburg | Tastkopf |
US5600258A (en) | 1993-09-15 | 1997-02-04 | Intest Corporation | Method and apparatus for automated docking of a test head to a device handler |
US5500606A (en) | 1993-09-16 | 1996-03-19 | Compaq Computer Corporation | Completely wireless dual-access test fixture |
JP2710544B2 (ja) | 1993-09-30 | 1998-02-10 | インターナショナル・ビジネス・マシーンズ・コーポレイション | プローブ構造、プローブ構造の形成方法 |
JP3089150B2 (ja) | 1993-10-19 | 2000-09-18 | キヤノン株式会社 | 位置決めステージ装置 |
US5463324A (en) | 1993-10-26 | 1995-10-31 | Hewlett-Packard Company | Probe with contacts that interdigitate with and wedge between adjacent legs of an IC or the like |
US5467024A (en) | 1993-11-01 | 1995-11-14 | Motorola, Inc. | Integrated circuit test with programmable source for both AC and DC modes of operation |
US5878486A (en) | 1993-11-16 | 1999-03-09 | Formfactor, Inc. | Method of burning-in semiconductor devices |
US5772451A (en) | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
US6246247B1 (en) | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US5884398A (en) | 1993-11-16 | 1999-03-23 | Form Factor, Inc. | Mounting spring elements on semiconductor devices |
US6482013B2 (en) | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
US6029344A (en) | 1993-11-16 | 2000-02-29 | Formfactor, Inc. | Composite interconnection element for microelectronic components, and method of making same |
US5601740A (en) | 1993-11-16 | 1997-02-11 | Formfactor, Inc. | Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires |
US5983493A (en) | 1993-11-16 | 1999-11-16 | Formfactor, Inc. | Method of temporarily, then permanently, connecting to a semiconductor device |
US6064213A (en) | 1993-11-16 | 2000-05-16 | Formfactor, Inc. | Wafer-level burn-in and test |
US6836962B2 (en) | 1993-11-16 | 2005-01-04 | Formfactor, Inc. | Method and apparatus for shaping spring elements |
US6336269B1 (en) | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
US5912046A (en) | 1993-11-16 | 1999-06-15 | Form Factor, Inc. | Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component |
US6184053B1 (en) | 1993-11-16 | 2001-02-06 | Formfactor, Inc. | Method of making microelectronic spring contact elements |
US6023103A (en) | 1994-11-15 | 2000-02-08 | Formfactor, Inc. | Chip-scale carrier for semiconductor devices including mounted spring contacts |
US6624648B2 (en) | 1993-11-16 | 2003-09-23 | Formfactor, Inc. | Probe card assembly |
US7064566B2 (en) | 1993-11-16 | 2006-06-20 | Formfactor, Inc. | Probe card assembly and kit |
US6525555B1 (en) | 1993-11-16 | 2003-02-25 | Formfactor, Inc. | Wafer-level burn-in and test |
US6727580B1 (en) | 1993-11-16 | 2004-04-27 | Formfactor, Inc. | Microelectronic spring contact elements |
US6835898B2 (en) | 1993-11-16 | 2004-12-28 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US5806181A (en) | 1993-11-16 | 1998-09-15 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US6442831B1 (en) | 1993-11-16 | 2002-09-03 | Formfactor, Inc. | Method for shaping spring elements |
US6741085B1 (en) | 1993-11-16 | 2004-05-25 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US5820014A (en) | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US5974662A (en) | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
US5669316A (en) | 1993-12-10 | 1997-09-23 | Sony Corporation | Turntable for rotating a wafer carrier |
US5642056A (en) | 1993-12-22 | 1997-06-24 | Tokyo Electron Limited | Probe apparatus for correcting the probe card posture before testing |
US6064217A (en) | 1993-12-23 | 2000-05-16 | Epi Technologies, Inc. | Fine pitch contact device employing a compliant conductive polymer bump |
US20020011859A1 (en) | 1993-12-23 | 2002-01-31 | Kenneth R. Smith | Method for forming conductive bumps for the purpose of contrructing a fine pitch test device |
US5475316A (en) | 1993-12-27 | 1995-12-12 | Hypervision, Inc. | Transportable image emission microscope |
US5510792A (en) | 1993-12-27 | 1996-04-23 | Tdk Corporation | Anechoic chamber and wave absorber |
JP3628344B2 (ja) | 1993-12-28 | 2005-03-09 | 株式会社リコー | 半導体検査装置 |
US5430813A (en) | 1993-12-30 | 1995-07-04 | The United States Of America As Represented By The Secretary Of The Navy | Mode-matched, combination taper fiber optic probe |
GB9401459D0 (en) | 1994-01-26 | 1994-03-23 | Secr Defence | Method and apparatus for measurement of unsteady gas temperatures |
US5583445A (en) | 1994-02-04 | 1996-12-10 | Hughes Aircraft Company | Opto-electronic membrane probe |
JP3565893B2 (ja) | 1994-02-04 | 2004-09-15 | アジレント・テクノロジーズ・インク | プローブ装置及び電気回路素子計測装置 |
US5642298A (en) | 1994-02-16 | 1997-06-24 | Ade Corporation | Wafer testing and self-calibration system |
US5611946A (en) | 1994-02-18 | 1997-03-18 | New Wave Research | Multi-wavelength laser system, probe station and laser cutter system using the same |
US5477011A (en) | 1994-03-03 | 1995-12-19 | W. L. Gore & Associates, Inc. | Low noise signal transmission cable |
US5565881A (en) | 1994-03-11 | 1996-10-15 | Motorola, Inc. | Balun apparatus including impedance transformer having transformation length |
JP3578232B2 (ja) | 1994-04-07 | 2004-10-20 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 電気接点形成方法、該電気接点を含むプローブ構造および装置 |
US5523694A (en) | 1994-04-08 | 1996-06-04 | Cole, Jr.; Edward I. | Integrated circuit failure analysis by low-energy charge-induced voltage alteration |
US5528158A (en) | 1994-04-11 | 1996-06-18 | Xandex, Inc. | Probe card changer system and method |
US5530372A (en) | 1994-04-15 | 1996-06-25 | Schlumberger Technologies, Inc. | Method of probing a net of an IC at an optimal probe-point |
IL109492A (en) | 1994-05-01 | 1999-06-20 | Sirotech Ltd | Method and apparatus for evaluating bacterial populations |
US5715819A (en) | 1994-05-26 | 1998-02-10 | The Carolinas Heart Institute | Microwave tomographic spectroscopy system and method |
JP2940401B2 (ja) | 1994-06-10 | 1999-08-25 | 住友電装株式会社 | コネクタ検査装置 |
US5511010A (en) | 1994-06-10 | 1996-04-23 | Texas Instruments Incorporated | Method and apparatus of eliminating interference in an undersettled electrical signal |
US5505150A (en) | 1994-06-14 | 1996-04-09 | L&P Property Management Company | Method and apparatus for facilitating loop take time adjustment in multi-needle quilting machine |
US5704355A (en) | 1994-07-01 | 1998-01-06 | Bridges; Jack E. | Non-invasive system for breast cancer detection |
US5829437A (en) | 1994-07-01 | 1998-11-03 | Interstitial, Inc. | Microwave method and system to detect and locate cancers in heterogenous tissues |
DE69532367T2 (de) | 1994-07-01 | 2004-10-21 | Interstitial Llc | Nachweis und Darstellung von Brustkrebs durch elektromagnetische Millimeterwellen |
US5561378A (en) | 1994-07-05 | 1996-10-01 | Motorola, Inc. | Circuit probe for measuring a differential circuit |
US5584608A (en) | 1994-07-05 | 1996-12-17 | Gillespie; Harvey D. | Anchored cable sling system |
US5506515A (en) | 1994-07-20 | 1996-04-09 | Cascade Microtech, Inc. | High-frequency probe tip assembly |
US5565788A (en) | 1994-07-20 | 1996-10-15 | Cascade Microtech, Inc. | Coaxial wafer probe with tip shielding |
JPH0835987A (ja) | 1994-07-21 | 1996-02-06 | Hitachi Denshi Ltd | プローブ |
US6337479B1 (en) | 1994-07-28 | 2002-01-08 | Victor B. Kley | Object inspection and/or modification system and method |
GB9417450D0 (en) | 1994-08-25 | 1994-10-19 | Symmetricom Inc | An antenna |
WO1996007924A1 (en) | 1994-09-09 | 1996-03-14 | Micromodule Systems | Membrane probing of circuits |
GB9418183D0 (en) | 1994-09-09 | 1994-10-26 | Chan Tsing Y A | Non-destructive method for determination of polar molecules on rigid and semi-rigid substrates |
US5488954A (en) | 1994-09-09 | 1996-02-06 | Georgia Tech Research Corp. | Ultrasonic transducer and method for using same |
AU3890095A (en) | 1994-09-19 | 1996-04-09 | Terry Lee Mauney | Plant growing system |
US5469324A (en) | 1994-10-07 | 1995-11-21 | Storage Technology Corporation | Integrated decoupling capacitive core for a printed circuit board and method of making same |
EP0707214A3 (en) | 1994-10-14 | 1997-04-16 | Hughes Aircraft Co | Multiport membrane probe to test complete semiconductor plates |
WO1996013728A1 (fr) | 1994-10-28 | 1996-05-09 | Nitto Denko Corporation | Structure de sonde |
KR100384265B1 (ko) | 1994-10-28 | 2003-08-14 | 클리크 앤드 소파 홀딩스 인코포레이티드 | 프로그램가능한고집적전자검사장치 |
US5481196A (en) | 1994-11-08 | 1996-01-02 | Nebraska Electronics, Inc. | Process and apparatus for microwave diagnostics and therapy |
US6727579B1 (en) | 1994-11-16 | 2004-04-27 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US5471185A (en) | 1994-12-06 | 1995-11-28 | Eaton Corporation | Electrical circuit protection devices comprising conductive liquid compositions |
MY112945A (en) | 1994-12-20 | 2001-10-31 | Ibm | Electronic devices comprising dielectric foamed polymers |
US5583733A (en) | 1994-12-21 | 1996-12-10 | Polaroid Corporation | Electrostatic discharge protection device |
JPH08179008A (ja) | 1994-12-22 | 1996-07-12 | Advantest Corp | テスト・ヘッド冷却装置 |
US5731920A (en) | 1994-12-22 | 1998-03-24 | Canon Kabushiki Kaisha | Converting adapter for interchangeable lens assembly |
US5792562A (en) | 1995-01-12 | 1998-08-11 | Applied Materials, Inc. | Electrostatic chuck with polymeric impregnation and method of making |
US5625299A (en) | 1995-02-03 | 1997-04-29 | Uhling; Thomas F. | Multiple lead analog voltage probe with high signal integrity over a wide band width |
US5550481A (en) | 1995-02-08 | 1996-08-27 | Semco Machine Corporation | Circuit board test fixture apparatus with cam rotably mounted in slidable cam block and method for making |
US5507652A (en) | 1995-02-17 | 1996-04-16 | Hewlett-Packard Company | Wedge connector for integrated circuits |
DE19605214A1 (de) | 1995-02-23 | 1996-08-29 | Bosch Gmbh Robert | Ultraschallantriebselement |
GB9503953D0 (en) | 1995-02-28 | 1995-04-19 | Plessey Semiconductors Ltd | An mcm-d probe tip |
EP0812434B1 (en) | 1995-03-01 | 2013-09-18 | President and Fellows of Harvard College | Microcontact printing on surfaces and derivative articles |
JPH08261898A (ja) | 1995-03-17 | 1996-10-11 | Nec Corp | 透過電子顕微鏡用試料及びその作製方法 |
US5678210A (en) | 1995-03-17 | 1997-10-14 | Hughes Electronics | Method and apparatus of coupling a transmitter to a waveguide in a remote ground terminal |
US5777485A (en) | 1995-03-20 | 1998-07-07 | Tokyo Electron Limited | Probe method and apparatus with improved probe contact |
AU5540596A (en) | 1995-04-03 | 1996-10-23 | Gary H. Baker | A flexible darkness adapting viewer |
US5532608A (en) | 1995-04-06 | 1996-07-02 | International Business Machines Corporation | Ceramic probe card and method for reducing leakage current |
US5561377A (en) * | 1995-04-14 | 1996-10-01 | Cascade Microtech, Inc. | System for evaluating probing networks |
US6232789B1 (en) | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
US5610529A (en) | 1995-04-28 | 1997-03-11 | Cascade Microtech, Inc. | Probe station having conductive coating added to thermal chuck insulator |
DE19517330C2 (de) | 1995-05-11 | 2002-06-13 | Helmuth Heigl | Handhabungsvorrichtung |
US5720098A (en) | 1995-05-12 | 1998-02-24 | Probe Technology | Method for making a probe preserving a uniform stress distribution under deflection |
US5621333A (en) | 1995-05-19 | 1997-04-15 | Microconnect, Inc. | Contact device for making connection to an electronic circuit device |
US5998864A (en) | 1995-05-26 | 1999-12-07 | Formfactor, Inc. | Stacking semiconductor devices, particularly memory chips |
US5804982A (en) | 1995-05-26 | 1998-09-08 | International Business Machines Corporation | Miniature probe positioning actuator |
US6685817B1 (en) | 1995-05-26 | 2004-02-03 | Formfactor, Inc. | Method and apparatus for controlling plating over a face of a substrate |
US6150186A (en) | 1995-05-26 | 2000-11-21 | Formfactor, Inc. | Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive |
US6090261A (en) | 1995-05-26 | 2000-07-18 | Formfactor, Inc. | Method and apparatus for controlling plating over a face of a substrate |
US6033935A (en) | 1997-06-30 | 2000-03-07 | Formfactor, Inc. | Sockets for "springed" semiconductor devices |
US6042712A (en) | 1995-05-26 | 2000-03-28 | Formfactor, Inc. | Apparatus for controlling plating over a face of a substrate |
JPH08330401A (ja) | 1995-06-02 | 1996-12-13 | Sony Corp | ウエハチャック |
US5728091A (en) | 1995-06-07 | 1998-03-17 | Cardiogenesis Corporation | Optical fiber for myocardial channel formation |
EP0776530A4 (en) | 1995-06-21 | 1998-06-10 | Motorola Inc | METHOD AND ANTENNA PRODUCING AN OMNIDIRECTIONAL RADIATION DIAGRAM |
DE19522774A1 (de) | 1995-06-27 | 1997-01-02 | Ifu Gmbh | Einrichtung zur spektroskopischen Untersuchung von Proben, die dem menschlichen Körper entnommen wurden |
US5659421A (en) | 1995-07-05 | 1997-08-19 | Neuromedical Systems, Inc. | Slide positioning and holding device |
US6002109A (en) | 1995-07-10 | 1999-12-14 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
US5676360A (en) | 1995-07-11 | 1997-10-14 | Boucher; John N. | Machine tool rotary table locking apparatus |
US5656942A (en) | 1995-07-21 | 1997-08-12 | Electroglas, Inc. | Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane |
JP3458586B2 (ja) | 1995-08-21 | 2003-10-20 | 松下電器産業株式会社 | マイクロ波ミキサー回路とダウンコンバータ |
US5621400A (en) | 1995-09-07 | 1997-04-15 | Corbi; Ronald W. | Ice detection method and apparatus for an aircraft |
DE19536837B4 (de) | 1995-10-02 | 2006-01-26 | Alstom | Vorrichtung und Verfahren zum Einspritzen von Brennstoffen in komprimierte gasförmige Medien |
US5841342A (en) | 1995-10-13 | 1998-11-24 | Com Dev Ltd. | Voltage controlled superconducting microwave switch and method of operation thereof |
US5807107A (en) | 1995-10-20 | 1998-09-15 | Barrier Supply | Dental infection control system |
US6006002A (en) | 1995-10-25 | 1999-12-21 | Olympus Optical Co., Ltd. | Rigid sleeve device fitted over a flexible insertion section of an endoscope for inspecting industrial equipment |
JPH09127432A (ja) | 1995-11-01 | 1997-05-16 | Olympus Optical Co Ltd | 工業用内視鏡 |
US5742174A (en) | 1995-11-03 | 1998-04-21 | Probe Technology | Membrane for holding a probe tip in proper location |
US5892539A (en) | 1995-11-08 | 1999-04-06 | Alpha Innotech Corporation | Portable emission microscope workstation for failure analysis |
US6483328B1 (en) | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
DE19542955C2 (de) | 1995-11-17 | 1999-02-18 | Schwind Gmbh & Co Kg Herbert | Endoskop |
US5953477A (en) | 1995-11-20 | 1999-09-14 | Visionex, Inc. | Method and apparatus for improved fiber optic light management |
JP2970505B2 (ja) | 1995-11-21 | 1999-11-02 | 日本電気株式会社 | 半導体デバイスの配線電流観測方法、検査方法および装置 |
JP3838381B2 (ja) | 1995-11-22 | 2006-10-25 | 株式会社アドバンテスト | プローブカード |
US5785538A (en) | 1995-11-27 | 1998-07-28 | International Business Machines Corporation | High density test probe with rigid surface structure |
US5910727A (en) | 1995-11-30 | 1999-06-08 | Tokyo Electron Limited | Electrical inspecting apparatus with ventilation system |
US5729150A (en) | 1995-12-01 | 1998-03-17 | Cascade Microtech, Inc. | Low-current probe card with reduced triboelectric current generating cables |
US5611008A (en) | 1996-01-26 | 1997-03-11 | Hughes Aircraft Company | Substrate system for optoelectronic/microwave circuits |
US5814847A (en) | 1996-02-02 | 1998-09-29 | National Semiconductor Corp. | General purpose assembly programmable multi-chip package substrate |
EP0882239B1 (en) | 1996-02-06 | 2009-06-03 | Telefonaktiebolaget LM Ericsson (publ) | Assembly and method for testing integrated circuit devices |
US5841288A (en) | 1996-02-12 | 1998-11-24 | Microwave Imaging System Technologies, Inc. | Two-dimensional microwave imaging apparatus and methods |
DE19605598C1 (de) | 1996-02-15 | 1996-10-31 | Singulus Technologies Gmbh | Vorrichtung zum Greifen und Halten von Substraten |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US6327034B1 (en) | 1999-09-20 | 2001-12-04 | Rex Hoover | Apparatus for aligning two objects |
US5628057A (en) | 1996-03-05 | 1997-05-06 | Motorola, Inc. | Multi-port radio frequency signal transformation network |
US5726211A (en) | 1996-03-21 | 1998-03-10 | International Business Machines Corporation | Process for making a foamed elastometric polymer |
US5804607A (en) | 1996-03-21 | 1998-09-08 | International Business Machines Corporation | Process for making a foamed elastomeric polymer |
JP2900877B2 (ja) | 1996-03-22 | 1999-06-02 | 日本電気株式会社 | 半導体デバイスの配線電流観測方法、配線系欠陥検査方法およびその装置 |
JP3457495B2 (ja) | 1996-03-29 | 2003-10-20 | 日本碍子株式会社 | 窒化アルミニウム焼結体、金属埋設品、電子機能材料および静電チャック |
US5869974A (en) | 1996-04-01 | 1999-02-09 | Micron Technology, Inc. | Micromachined probe card having compliant contact members for testing semiconductor wafers |
US5631571A (en) | 1996-04-03 | 1997-05-20 | The United States Of America As Represented By The Secretary Of The Air Force | Infrared receiver wafer level probe testing |
US5700844A (en) | 1996-04-09 | 1997-12-23 | International Business Machines Corporation | Process for making a foamed polymer |
JP3022312B2 (ja) | 1996-04-15 | 2000-03-21 | 日本電気株式会社 | プローブカードの製造方法 |
US6628980B2 (en) | 2000-03-24 | 2003-09-30 | Surgi-Vision, Inc. | Apparatus, systems, and methods for in vivo magnetic resonance imaging |
US5808874A (en) | 1996-05-02 | 1998-09-15 | Tessera, Inc. | Microelectronic connections with liquid conductive elements |
DE19618717C1 (de) | 1996-05-09 | 1998-01-15 | Multitest Elektronische Syst | Elektrische Verbindungseinrichtung |
US5818084A (en) | 1996-05-15 | 1998-10-06 | Siliconix Incorporated | Pseudo-Schottky diode |
US6046599A (en) | 1996-05-20 | 2000-04-04 | Microconnect, Inc. | Method and device for making connection |
KR100471341B1 (ko) | 1996-05-23 | 2005-07-21 | 제네시스 테크놀로지 가부시키가이샤 | 콘택트프로브및그것을구비한프로브장치 |
US5748506A (en) | 1996-05-28 | 1998-05-05 | Motorola, Inc. | Calibration technique for a network analyzer |
SE515851C2 (sv) | 1996-06-24 | 2001-10-15 | Bluetronics Ab | Metod för att kontrollera och montera elektroniska ytmonteringskomponenter |
US6268016B1 (en) | 1996-06-28 | 2001-07-31 | International Business Machines Corporation | Manufacturing computer systems with fine line circuitized substrates |
US5756908A (en) | 1996-07-15 | 1998-05-26 | Framatome Technologies, Inc. | Probe positioner |
US5879289A (en) | 1996-07-15 | 1999-03-09 | Universal Technologies International, Inc. | Hand-held portable endoscopic camera |
US6822443B1 (en) | 2000-09-11 | 2004-11-23 | Albany Instruments, Inc. | Sensors and probes for mapping electromagnetic fields |
US5793213A (en) | 1996-08-01 | 1998-08-11 | Motorola, Inc. | Method and apparatus for calibrating a network analyzer |
JPH1048256A (ja) | 1996-08-06 | 1998-02-20 | Nippon Maikuronikusu:Kk | 検査用ヘッド |
JP2962234B2 (ja) | 1996-08-07 | 1999-10-12 | 日本電気株式会社 | 半導体デバイスの寄生MIM構造箇所解析法及びSi半導体デバイスの寄生MIM構造箇所解析法 |
US5847569A (en) | 1996-08-08 | 1998-12-08 | The Board Of Trustees Of The Leland Stanford Junior University | Electrical contact probe for sampling high frequency electrical signals |
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6050829A (en) | 1996-08-28 | 2000-04-18 | Formfactor, Inc. | Making discrete power connections to a space transformer of a probe card assembly |
US5869326A (en) | 1996-09-09 | 1999-02-09 | Genetronics, Inc. | Electroporation employing user-configured pulsing scheme |
US6307161B1 (en) | 1996-09-10 | 2001-10-23 | Formfactor, Inc. | Partially-overcoated elongate contact structures |
DE19636890C1 (de) | 1996-09-11 | 1998-02-12 | Bosch Gmbh Robert | Übergang von einem Hohlleiter auf eine Streifenleitung |
WO1998011446A1 (en) | 1996-09-13 | 1998-03-19 | International Business Machines Corporation | Integrated compliant probe for wafer level test and burn-in |
US6181149B1 (en) | 1996-09-26 | 2001-01-30 | Delaware Capital Formation, Inc. | Grid array package test contactor |
JPH10116866A (ja) | 1996-10-09 | 1998-05-06 | Nikon Corp | 半導体装置及び、この半導体装置とプローブカードとの位置決め方法 |
US5999268A (en) | 1996-10-18 | 1999-12-07 | Tokyo Electron Limited | Apparatus for aligning a semiconductor wafer with an inspection contactor |
US5666063A (en) | 1996-10-23 | 1997-09-09 | Motorola, Inc. | Method and apparatus for testing an integrated circuit |
US5945836A (en) | 1996-10-29 | 1999-08-31 | Hewlett-Packard Company | Loaded-board, guided-probe test fixture |
US5883522A (en) | 1996-11-07 | 1999-03-16 | National Semiconductor Corporation | Apparatus and method for retaining a semiconductor wafer during testing |
US5896038A (en) | 1996-11-08 | 1999-04-20 | W. L. Gore & Associates, Inc. | Method of wafer level burn-in |
US6216704B1 (en) | 1997-08-13 | 2001-04-17 | Surx, Inc. | Noninvasive devices, methods, and systems for shrinking of tissues |
US6104201A (en) | 1996-11-08 | 2000-08-15 | International Business Machines Corporation | Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage |
US5876331A (en) | 1996-11-12 | 1999-03-02 | Johnson & Johnson Medical, Inc. | Endoscope with improved flexible insertion tube |
US6184845B1 (en) | 1996-11-27 | 2001-02-06 | Symmetricom, Inc. | Dielectric-loaded antenna |
JPH10165522A (ja) | 1996-12-09 | 1998-06-23 | Tokyo Iken Kk | 理学診療用光ファイバ装置および光ファイバ用アーム装置 |
US6603322B1 (en) | 1996-12-12 | 2003-08-05 | Ggb Industries, Inc. | Probe card for high speed testing |
JP3364401B2 (ja) | 1996-12-27 | 2003-01-08 | 東京エレクトロン株式会社 | プローブカードクランプ機構及びプローブ装置 |
US6307672B1 (en) | 1996-12-31 | 2001-10-23 | The United States Of America As Represented By The Department Of Energy | Microscope collision protection apparatus |
US5852232A (en) | 1997-01-02 | 1998-12-22 | Kla-Tencor Corporation | Acoustic sensor as proximity detector |
US5848500A (en) | 1997-01-07 | 1998-12-15 | Eastman Kodak Company | Light-tight enclosure and joint connectors for enclosure framework |
US6826422B1 (en) | 1997-01-13 | 2004-11-30 | Medispectra, Inc. | Spectral volume microprobe arrays |
US6429029B1 (en) | 1997-01-15 | 2002-08-06 | Formfactor, Inc. | Concurrent design and subsequent partitioning of product and test die |
US6690185B1 (en) | 1997-01-15 | 2004-02-10 | Formfactor, Inc. | Large contactor with multiple, aligned contactor units |
US6551844B1 (en) | 1997-01-15 | 2003-04-22 | Formfactor, Inc. | Test assembly including a test die for testing a semiconductor product die |
JPH10204102A (ja) | 1997-01-27 | 1998-08-04 | Mitsubishi Gas Chem Co Inc | 水溶性トリカルボキシ多糖類の製造方法 |
US5982166A (en) | 1997-01-27 | 1999-11-09 | Motorola, Inc. | Method for measuring a characteristic of a semiconductor wafer using cylindrical control |
US5923180A (en) | 1997-02-04 | 1999-07-13 | Hewlett-Packard Company | Compliant wafer prober docking adapter |
US5888075A (en) | 1997-02-10 | 1999-03-30 | Kabushiki Kaisha Nihon Micronics | Auxiliary apparatus for testing device |
US6019612A (en) | 1997-02-10 | 2000-02-01 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus for electrically connecting a device to be tested |
US6060891A (en) | 1997-02-11 | 2000-05-09 | Micron Technology, Inc. | Probe card for semiconductor wafers and method and system for testing wafers |
US6798224B1 (en) | 1997-02-11 | 2004-09-28 | Micron Technology, Inc. | Method for testing semiconductor wafers |
US6520778B1 (en) | 1997-02-18 | 2003-02-18 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
US5905421A (en) | 1997-02-18 | 1999-05-18 | Wiltron Company | Apparatus for measuring and/or injecting high frequency signals in integrated systems |
JP2934202B2 (ja) | 1997-03-06 | 1999-08-16 | 山一電機株式会社 | 配線基板における導電バンプの形成方法 |
US6064218A (en) | 1997-03-11 | 2000-05-16 | Primeyield Systems, Inc. | Peripherally leaded package test contactor |
US6127831A (en) | 1997-04-21 | 2000-10-03 | Motorola, Inc. | Method of testing a semiconductor device by automatically measuring probe tip parameters |
US6091236A (en) | 1997-04-28 | 2000-07-18 | Csi Technology, Inc. | System and method for measuring and analyzing electrical signals on the shaft of a machine |
US5883523A (en) | 1997-04-29 | 1999-03-16 | Credence Systems Corporation | Coherent switching power for an analog circuit tester |
WO1998052464A1 (en) | 1997-05-23 | 1998-11-26 | The Carolinas Heart Institute | Electromagnetical imaging and therapeutic (emit) systems |
US5926029A (en) | 1997-05-27 | 1999-07-20 | International Business Machines Corporation | Ultra fine probe contacts |
JPH10335395A (ja) | 1997-05-28 | 1998-12-18 | Advantest Corp | プローブカードの接触位置検出方法 |
US5981268A (en) | 1997-05-30 | 1999-11-09 | Board Of Trustees, Leland Stanford, Jr. University | Hybrid biosensors |
US6229327B1 (en) | 1997-05-30 | 2001-05-08 | Gregory G. Boll | Broadband impedance matching probe |
US5966645A (en) | 1997-06-03 | 1999-10-12 | Garmin Corporation | Transmitter with low-level modulation and minimal harmonic emissions |
US6034533A (en) | 1997-06-10 | 2000-03-07 | Tervo; Paul A. | Low-current pogo probe card |
SE507577C2 (sv) | 1997-06-11 | 1998-06-22 | Saab Marine Electronics | Hornantenn |
JPH114001A (ja) | 1997-06-11 | 1999-01-06 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
US6215196B1 (en) | 1997-06-30 | 2001-04-10 | Formfactor, Inc. | Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals |
JPH1123975A (ja) | 1997-07-01 | 1999-01-29 | Nikon Corp | 顕微鏡 |
US6002426A (en) | 1997-07-02 | 1999-12-14 | Cerprobe Corporation | Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits |
US6052653A (en) | 1997-07-11 | 2000-04-18 | Solid State Measurements, Inc. | Spreading resistance profiling system |
US5959461A (en) | 1997-07-14 | 1999-09-28 | Wentworth Laboratories, Inc. | Probe station adapter for backside emission inspection |
WO1999004273A1 (en) | 1997-07-15 | 1999-01-28 | Wentworth Laboratories, Inc. | Probe station with multiple adjustable probe supports |
US6828566B2 (en) | 1997-07-22 | 2004-12-07 | Hitachi Ltd | Method and apparatus for specimen fabrication |
US6215295B1 (en) | 1997-07-25 | 2001-04-10 | Smith, Iii Richard S. | Photonic field probe and calibration means thereof |
US6104206A (en) | 1997-08-05 | 2000-08-15 | Verkuil; Roger L. | Product wafer junction leakage measurement using corona and a kelvin probe |
US5998768A (en) | 1997-08-07 | 1999-12-07 | Massachusetts Institute Of Technology | Active thermal control of surfaces by steering heating beam in response to sensed thermal radiation |
US5970429A (en) | 1997-08-08 | 1999-10-19 | Lucent Technologies, Inc. | Method and apparatus for measuring electrical noise in devices |
US6292760B1 (en) | 1997-08-11 | 2001-09-18 | Texas Instruments Incorporated | Method and apparatus to measure non-coherent signals |
US6233613B1 (en) | 1997-08-18 | 2001-05-15 | 3Com Corporation | High impedance probe for monitoring fast ethernet LAN links |
US6573702B2 (en) | 1997-09-12 | 2003-06-03 | New Wave Research | Method and apparatus for cleaning electronic test contacts |
US5993611A (en) | 1997-09-24 | 1999-11-30 | Sarnoff Corporation | Capacitive denaturation of nucleic acid |
US6059982A (en) | 1997-09-30 | 2000-05-09 | International Business Machines Corporation | Micro probe assembly and method of fabrication |
US6071009A (en) | 1997-10-03 | 2000-06-06 | Micron Technology, Inc. | Semiconductor wirebond machine leadframe thermal map system |
US6278051B1 (en) | 1997-10-09 | 2001-08-21 | Vatell Corporation | Differential thermopile heat flux transducer |
US6013586A (en) | 1997-10-09 | 2000-01-11 | Dimension Polyant Sailcloth, Inc. | Tent material product and method of making tent material product |
US5949383A (en) | 1997-10-20 | 1999-09-07 | Ericsson Inc. | Compact antenna structures including baluns |
JPH11125646A (ja) | 1997-10-21 | 1999-05-11 | Mitsubishi Electric Corp | 垂直針型プローブカード、その製造方法およびその不良プローブ針の交換方法 |
US6049216A (en) | 1997-10-27 | 2000-04-11 | Industrial Technology Research Institute | Contact type prober automatic alignment |
JP3112873B2 (ja) | 1997-10-31 | 2000-11-27 | 日本電気株式会社 | 高周波プローブ |
JPH11142433A (ja) | 1997-11-10 | 1999-05-28 | Mitsubishi Electric Corp | 垂直針型プローブカード用のプローブ針とその製造方法 |
DE19822123C2 (de) | 1997-11-21 | 2003-02-06 | Meinhard Knoll | Verfahren und Vorrichtung zum Nachweis von Analyten |
JPH11163066A (ja) | 1997-11-29 | 1999-06-18 | Tokyo Electron Ltd | ウエハ試験装置 |
US6096567A (en) | 1997-12-01 | 2000-08-01 | Electroglas, Inc. | Method and apparatus for direct probe sensing |
US6118287A (en) | 1997-12-09 | 2000-09-12 | Boll; Gregory George | Probe tip structure |
US6100815A (en) | 1997-12-24 | 2000-08-08 | Electro Scientific Industries, Inc. | Compound switching matrix for probing and interconnecting devices under test to measurement equipment |
US5944093A (en) | 1997-12-30 | 1999-08-31 | Intel Corporation | Pickup chuck with an integral heat pipe |
US6415858B1 (en) | 1997-12-31 | 2002-07-09 | Temptronic Corporation | Temperature control system for a workpiece chuck |
US7083985B2 (en) | 1998-02-02 | 2006-08-01 | Hefti John J | Coplanar waveguide biosensor for detecting molecular or cellular events |
US6338968B1 (en) | 1998-02-02 | 2002-01-15 | Signature Bioscience, Inc. | Method and apparatus for detecting molecular binding events |
US6287776B1 (en) | 1998-02-02 | 2001-09-11 | Signature Bioscience, Inc. | Method for detecting and classifying nucleic acid hybridization |
US6287874B1 (en) | 1998-02-02 | 2001-09-11 | Signature Bioscience, Inc. | Methods for analyzing protein binding events |
US6395480B1 (en) | 1999-02-01 | 2002-05-28 | Signature Bioscience, Inc. | Computer program and database structure for detecting molecular binding events |
JP3862845B2 (ja) | 1998-02-05 | 2006-12-27 | セイコーインスツル株式会社 | 近接場用光プローブ |
US6807734B2 (en) | 1998-02-13 | 2004-10-26 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
US6181144B1 (en) | 1998-02-25 | 2001-01-30 | Micron Technology, Inc. | Semiconductor probe card having resistance measuring circuitry and method fabrication |
US6078183A (en) | 1998-03-03 | 2000-06-20 | Sandia Corporation | Thermally-induced voltage alteration for integrated circuit analysis |
US6054869A (en) | 1998-03-19 | 2000-04-25 | H+W Test Products, Inc. | Bi-level test fixture for testing printed circuit boards |
DE29805631U1 (de) | 1998-03-27 | 1998-06-25 | Ebinger Klaus | Magnetometer |
JPH11281675A (ja) | 1998-03-31 | 1999-10-15 | Hewlett Packard Japan Ltd | 信号測定用プローブ |
JP3553791B2 (ja) | 1998-04-03 | 2004-08-11 | 株式会社ルネサステクノロジ | 接続装置およびその製造方法、検査装置並びに半導体素子の製造方法 |
US6147502A (en) | 1998-04-10 | 2000-11-14 | Bechtel Bwxt Idaho, Llc | Method and apparatus for measuring butterfat and protein content using microwave absorption techniques |
US6181416B1 (en) | 1998-04-14 | 2001-01-30 | Optometrix, Inc. | Schlieren method for imaging semiconductor device properties |
US6720501B1 (en) | 1998-04-14 | 2004-04-13 | Formfactor, Inc. | PC board having clustered blind vias |
US6060888A (en) | 1998-04-24 | 2000-05-09 | Hewlett-Packard Company | Error correction method for reflection measurements of reciprocal devices in vector network analyzers |
DE69903935T2 (de) | 1998-05-01 | 2003-07-31 | Gore & Ass | Wiederholt positionierbare düseneinrichtung |
US6121836A (en) | 1998-05-08 | 2000-09-19 | Lucent Technologies | Differential amplifier |
US6091255A (en) | 1998-05-08 | 2000-07-18 | Advanced Micro Devices, Inc. | System and method for tasking processing modules based upon temperature |
US6078500A (en) | 1998-05-12 | 2000-06-20 | International Business Machines Inc. | Pluggable chip scale package |
US6257564B1 (en) | 1998-05-15 | 2001-07-10 | Applied Materials, Inc | Vacuum chuck having vacuum-nipples wafer support |
US6281691B1 (en) | 1998-06-09 | 2001-08-28 | Nec Corporation | Tip portion structure of high-frequency probe and method for fabrication probe tip portion composed by coaxial cable |
TW440699B (en) | 1998-06-09 | 2001-06-16 | Advantest Corp | Test apparatus for electronic parts |
US6251595B1 (en) | 1998-06-18 | 2001-06-26 | Agilent Technologies, Inc. | Methods and devices for carrying out chemical reactions |
US6307363B1 (en) | 1998-06-22 | 2001-10-23 | Bruce Michael Anderson | Ultrahigh-frequency high-impedance passive voltage probe |
US6194720B1 (en) | 1998-06-24 | 2001-02-27 | Micron Technology, Inc. | Preparation of transmission electron microscope samples |
US6166553A (en) | 1998-06-29 | 2000-12-26 | Xandex, Inc. | Prober-tester electrical interface for semiconductor test |
US7304486B2 (en) * | 1998-07-08 | 2007-12-04 | Capres A/S | Nano-drive for high resolution positioning and for positioning of a multi-point probe |
US6664628B2 (en) | 1998-07-13 | 2003-12-16 | Formfactor, Inc. | Electronic component overlapping dice of unsingulated semiconductor wafer |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6130536A (en) | 1998-07-14 | 2000-10-10 | Crown Cork & Seal Technologies Corporation | Preform test fixture and method of measuring a wall thickness |
US6259260B1 (en) | 1998-07-30 | 2001-07-10 | Intest Ip Corporation | Apparatus for coupling a test head and probe card in a wafer testing system |
EP1047947B1 (en) | 1998-08-21 | 2005-01-19 | Koninklijke Philips Electronics N.V. | Test device for testing a module for a data carrier intended for contactless communication |
US6744268B2 (en) | 1998-08-27 | 2004-06-01 | The Micromanipulator Company, Inc. | High resolution analytical probe station |
US6529844B1 (en) | 1998-09-02 | 2003-03-04 | Anritsu Company | Vector network measurement system |
US6040739A (en) | 1998-09-02 | 2000-03-21 | Trw Inc. | Waveguide to microstrip backshort with external spring compression |
US6937341B1 (en) | 1998-09-29 | 2005-08-30 | J. A. Woollam Co. Inc. | System and method enabling simultaneous investigation of sample with two beams of electromagnetic radiation |
GB2342148B (en) * | 1998-10-01 | 2000-12-20 | Nippon Kokan Kk | Method and apparatus for preventing snow from melting and for packing snow in artificial ski facility |
US6816840B1 (en) | 1998-10-07 | 2004-11-09 | Ncr Corporation | System and method of sending messages to a group of electronic price labels |
US6175228B1 (en) | 1998-10-30 | 2001-01-16 | Agilent Technologies | Electronic probe for measuring high impedance tri-state logic circuits |
JP2000137120A (ja) | 1998-11-02 | 2000-05-16 | Sony Corp | 光ファイバの固定具 |
US6236223B1 (en) | 1998-11-09 | 2001-05-22 | Intermec Ip Corp. | Method and apparatus for wireless radio frequency testing of RFID integrated circuits |
US6169410B1 (en) | 1998-11-09 | 2001-01-02 | Anritsu Company | Wafer probe with built in RF frequency conversion module |
US6441315B1 (en) | 1998-11-10 | 2002-08-27 | Formfactor, Inc. | Contact structures with blades having a wiping motion |
US6201453B1 (en) | 1998-11-19 | 2001-03-13 | Trw Inc. | H-plane hermetic sealed waveguide probe |
US6332270B2 (en) | 1998-11-23 | 2001-12-25 | International Business Machines Corporation | Method of making high density integral test probe |
US6476913B1 (en) | 1998-11-30 | 2002-11-05 | Hitachi, Ltd. | Inspection method, apparatus and system for circuit pattern |
US6255126B1 (en) | 1998-12-02 | 2001-07-03 | Formfactor, Inc. | Lithographic contact elements |
US6268015B1 (en) | 1998-12-02 | 2001-07-31 | Formfactor | Method of making and using lithographic contact springs |
US6672875B1 (en) | 1998-12-02 | 2004-01-06 | Formfactor, Inc. | Spring interconnect structures |
US6491968B1 (en) | 1998-12-02 | 2002-12-10 | Formfactor, Inc. | Methods for making spring interconnect structures |
US6887723B1 (en) | 1998-12-04 | 2005-05-03 | Formfactor, Inc. | Method for processing an integrated circuit including placing dice into a carrier and testing |
US6608494B1 (en) | 1998-12-04 | 2003-08-19 | Advanced Micro Devices, Inc. | Single point high resolution time resolved photoemission microscopy system and method |
US6991834B1 (en) * | 1998-12-23 | 2006-01-31 | Elsicon, Inc. | Materials for inducing alignment of liquid crystals and liquid crystal optical elements |
US6456099B1 (en) | 1998-12-31 | 2002-09-24 | Formfactor, Inc. | Special contact points for accessing internal circuitry of an integrated circuit |
US6232787B1 (en) | 1999-01-08 | 2001-05-15 | Schlumberger Technologies, Inc. | Microstructure defect detection |
US6388455B1 (en) | 1999-01-13 | 2002-05-14 | Qc Solutions, Inc. | Method and apparatus for simulating a surface photo-voltage in a substrate |
JP2000206146A (ja) | 1999-01-19 | 2000-07-28 | Mitsubishi Electric Corp | プロ―ブ針 |
US6583638B2 (en) | 1999-01-26 | 2003-06-24 | Trio-Tech International | Temperature-controlled semiconductor wafer chuck system |
US6300775B1 (en) | 1999-02-02 | 2001-10-09 | Com Dev Limited | Scattering parameter calibration system and method |
US6147851A (en) | 1999-02-05 | 2000-11-14 | Anderson; Karl F. | Method for guarding electrical regions having potential gradients |
GB9902765D0 (en) | 1999-02-08 | 1999-03-31 | Symmetricom Inc | An antenna |
US6206273B1 (en) | 1999-02-17 | 2001-03-27 | International Business Machines Corporation | Structures and processes to create a desired probetip contact geometry on a wafer test probe |
FR2790097B1 (fr) | 1999-02-18 | 2001-04-27 | St Microelectronics Sa | Procede d'etalonnage d'une sonde de circuit integre rf |
US6335625B1 (en) | 1999-02-22 | 2002-01-01 | Paul Bryant | Programmable active microwave ultrafine resonance spectrometer (PAMURS) method and systems |
US6208225B1 (en) | 1999-02-25 | 2001-03-27 | Formfactor, Inc. | Filter structures for integrated circuit interfaces |
US6448865B1 (en) | 1999-02-25 | 2002-09-10 | Formfactor, Inc. | Integrated circuit interconnect system |
US6218910B1 (en) | 1999-02-25 | 2001-04-17 | Formfactor, Inc. | High bandwidth passive integrated circuit tester probe card assembly |
US6539531B2 (en) | 1999-02-25 | 2003-03-25 | Formfactor, Inc. | Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes |
US6459343B1 (en) | 1999-02-25 | 2002-10-01 | Formfactor, Inc. | Integrated circuit interconnect system forming a multi-pole filter |
US6538538B2 (en) | 1999-02-25 | 2003-03-25 | Formfactor, Inc. | High frequency printed circuit board via |
US6499121B1 (en) | 1999-03-01 | 2002-12-24 | Formfactor, Inc. | Distributed interface for parallel testing of multiple devices using a single tester channel |
US6452411B1 (en) | 1999-03-01 | 2002-09-17 | Formfactor, Inc. | Efficient parallel testing of integrated circuit devices using a known good device to generate expected responses |
US6480978B1 (en) | 1999-03-01 | 2002-11-12 | Formfactor, Inc. | Parallel testing of integrated circuit devices using cross-DUT and within-DUT comparisons |
US6710798B1 (en) | 1999-03-09 | 2004-03-23 | Applied Precision Llc | Methods and apparatus for determining the relative positions of probe tips on a printed circuit board probe card |
US20010043073A1 (en) | 1999-03-09 | 2001-11-22 | Thomas T. Montoya | Prober interface plate |
US6211837B1 (en) | 1999-03-10 | 2001-04-03 | Raytheon Company | Dual-window high-power conical horn antenna |
FR2790842B1 (fr) | 1999-03-12 | 2001-04-20 | St Microelectronics Sa | Procede de fabrication d'un circuit de test sur une plaquette de silicium |
US6225816B1 (en) | 1999-04-08 | 2001-05-01 | Agilent Technologies, Inc. | Split resistor probe and method |
US6572608B1 (en) | 1999-04-08 | 2003-06-03 | Eric T. Lee | Directional laser probe |
US6400166B2 (en) | 1999-04-15 | 2002-06-04 | International Business Machines Corporation | Micro probe and method of fabricating same |
US6114865A (en) | 1999-04-21 | 2000-09-05 | Semiconductor Diagnostics, Inc. | Device for electrically contacting a floating semiconductor wafer having an insulating film |
US6456152B1 (en) | 1999-05-17 | 2002-09-24 | Hitachi, Ltd. | Charge pump with improved reliability |
JP2000329664A (ja) | 1999-05-18 | 2000-11-30 | Nkk Corp | 透過型電子顕微鏡の観察方法および保持治具 |
US6448788B1 (en) | 1999-05-26 | 2002-09-10 | Microwave Imaging System Technologies, Inc. | Fixed array microwave imaging apparatus and method |
US6917525B2 (en) | 2001-11-27 | 2005-07-12 | Nanonexus, Inc. | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
KR20020028159A (ko) | 1999-05-27 | 2002-04-16 | 나노넥서스, 인코포레이티드 | 전자 회로용 대량 병렬 인터페이스 |
US6812718B1 (en) | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US6211663B1 (en) | 1999-05-28 | 2001-04-03 | The Aerospace Corporation | Baseband time-domain waveform measurement method |
US6409724B1 (en) | 1999-05-28 | 2002-06-25 | Gyrus Medical Limited | Electrosurgical instrument |
US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
US7215131B1 (en) | 1999-06-07 | 2007-05-08 | Formfactor, Inc. | Segmented contactor |
US6445202B1 (en) | 1999-06-30 | 2002-09-03 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
US6320372B1 (en) | 1999-07-09 | 2001-11-20 | Electroglas, Inc. | Apparatus and method for testing a substrate having a plurality of terminals |
JP4104099B2 (ja) | 1999-07-09 | 2008-06-18 | 東京エレクトロン株式会社 | プローブカード搬送機構 |
US6580283B1 (en) | 1999-07-14 | 2003-06-17 | Aehr Test Systems | Wafer level burn-in and test methods |
US6340895B1 (en) | 1999-07-14 | 2002-01-22 | Aehr Test Systems, Inc. | Wafer-level burn-in and test cartridge |
US7013221B1 (en) | 1999-07-16 | 2006-03-14 | Rosetta Inpharmatics Llc | Iterative probe design and detailed expression profiling with flexible in-situ synthesis arrays |
WO2001007207A1 (en) | 1999-07-21 | 2001-02-01 | Cascade Microtech, Inc. | Membrane probing system |
JP4113640B2 (ja) | 1999-07-21 | 2008-07-09 | 株式会社フジクラ | 蓋又は扉開閉検出装置 |
US6407562B1 (en) | 1999-07-29 | 2002-06-18 | Agilent Technologies, Inc. | Probe tip terminating device providing an easily changeable feed-through termination |
US6780001B2 (en) | 1999-07-30 | 2004-08-24 | Formfactor, Inc. | Forming tool for forming a contoured microelectronic spring mold |
US6713374B2 (en) | 1999-07-30 | 2004-03-30 | Formfactor, Inc. | Interconnect assemblies and methods |
US6888362B2 (en) | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
KR20010021204A (ko) | 1999-08-06 | 2001-03-15 | 이데이 노부유끼 | 안테나장치 및 휴대무선기 |
JP2001053517A (ja) | 1999-08-06 | 2001-02-23 | Sony Corp | アンテナ装置及び携帯無線機 |
US6468098B1 (en) | 1999-08-17 | 2002-10-22 | Formfactor, Inc. | Electrical contactor especially wafer level contactor using fluid pressure |
US6275738B1 (en) | 1999-08-19 | 2001-08-14 | Kai Technologies, Inc. | Microwave devices for medical hyperthermia, thermotherapy and diagnosis |
US6809533B1 (en) | 1999-09-10 | 2004-10-26 | University Of Maryland, College Park | Quantitative imaging of dielectric permittivity and tunability |
CN1083975C (zh) | 1999-09-10 | 2002-05-01 | 北京航空工艺研究所 | 一种弧光传感等离子弧焊小孔行为的方法及其装置 |
US6545492B1 (en) * | 1999-09-20 | 2003-04-08 | Europaisches Laboratorium Fur Molekularbiologie (Embl) | Multiple local probe measuring device and method |
US6483327B1 (en) | 1999-09-30 | 2002-11-19 | Advanced Micro Devices, Inc. | Quadrant avalanche photodiode time-resolved detection |
US7009415B2 (en) | 1999-10-06 | 2006-03-07 | Tokyo Electron Limited | Probing method and probing apparatus |
US6352454B1 (en) | 1999-10-20 | 2002-03-05 | Xerox Corporation | Wear-resistant spring contacts |
JP2001124676A (ja) | 1999-10-25 | 2001-05-11 | Hitachi Ltd | 電子顕微鏡観察用試料支持部材 |
US6245692B1 (en) | 1999-11-23 | 2001-06-12 | Agere Systems Guardian Corp. | Method to selectively heat semiconductor wafers |
US6528993B1 (en) | 1999-11-29 | 2003-03-04 | Korea Advanced Institute Of Science & Technology | Magneto-optical microscope magnetometer |
US6724928B1 (en) | 1999-12-02 | 2004-04-20 | Advanced Micro Devices, Inc. | Real-time photoemission detection system |
US6633174B1 (en) | 1999-12-14 | 2003-10-14 | Kla-Tencor | Stepper type test structures and methods for inspection of semiconductor integrated circuits |
US6771806B1 (en) | 1999-12-14 | 2004-08-03 | Kla-Tencor | Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices |
JP2001174482A (ja) | 1999-12-21 | 2001-06-29 | Toshiba Corp | 電気的特性評価用接触針、プローブ構造体、プローブカード、および電気的特性評価用接触針の製造方法 |
US6827584B2 (en) | 1999-12-28 | 2004-12-07 | Formfactor, Inc. | Interconnect for microelectronic structures with enhanced spring characteristics |
US6459739B1 (en) | 1999-12-30 | 2002-10-01 | Tioga Technologies Inc. | Method and apparatus for RF common-mode noise rejection in a DSL receiver |
DE10000324A1 (de) | 2000-01-07 | 2001-07-19 | Roesler Hans Joachim | Analysegerät |
US6339338B1 (en) | 2000-01-18 | 2002-01-15 | Formfactor, Inc. | Apparatus for reducing power supply noise in an integrated circuit |
US6657455B2 (en) | 2000-01-18 | 2003-12-02 | Formfactor, Inc. | Predictive, adaptive power supply for an integrated circuit under test |
CA2399096C (en) | 2000-02-02 | 2011-10-11 | Raytheon Company | Microelectromechanical micro-relay with liquid metal contacts |
US6384614B1 (en) | 2000-02-05 | 2002-05-07 | Fluke Corporation | Single tip Kelvin probe |
EP1193233A1 (en) | 2000-02-07 | 2002-04-03 | Ibiden Co., Ltd. | Ceramic substrate for semiconductor production/inspection device |
NZ521229A (en) | 2000-02-25 | 2004-02-27 | Personal Chemistry I Uppsala | Microwave heating apparatus |
US6734687B1 (en) | 2000-02-25 | 2004-05-11 | Hitachi, Ltd. | Apparatus for detecting defect in device and method of detecting defect |
US6838890B2 (en) | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
JP3389914B2 (ja) | 2000-03-03 | 2003-03-24 | 日本電気株式会社 | 集積回路の電源電流値のサンプリング方法及び装置、及びその制御プログラムを記録した記憶媒体 |
US6927586B2 (en) | 2000-03-06 | 2005-08-09 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US6888236B2 (en) | 2000-03-07 | 2005-05-03 | Ibiden Co., Ltd. | Ceramic substrate for manufacture/inspection of semiconductor |
US6488405B1 (en) | 2000-03-08 | 2002-12-03 | Advanced Micro Devices, Inc. | Flip chip defect analysis using liquid crystal |
US6509751B1 (en) | 2000-03-17 | 2003-01-21 | Formfactor, Inc. | Planarizer for a semiconductor contactor |
US7037797B1 (en) | 2000-03-17 | 2006-05-02 | Mattson Technology, Inc. | Localized heating and cooling of substrates |
US6407542B1 (en) | 2000-03-23 | 2002-06-18 | Avaya Technology Corp. | Implementation of a multi-port modal decomposition system |
JP2001266317A (ja) | 2000-03-23 | 2001-09-28 | Toshiba Corp | 磁気記録ヘッド測定装置及び同装置に適用する測定方法 |
US6640432B1 (en) | 2000-04-12 | 2003-11-04 | Formfactor, Inc. | Method of fabricating shaped springs |
US6476630B1 (en) | 2000-04-13 | 2002-11-05 | Formfactor, Inc. | Method for testing signal paths between an integrated circuit wafer and a wafer tester |
US6677744B1 (en) | 2000-04-13 | 2004-01-13 | Formfactor, Inc. | System for measuring signal path resistance for an integrated circuit tester interconnect structure |
US6396298B1 (en) | 2000-04-14 | 2002-05-28 | The Aerospace Corporation | Active feedback pulsed measurement method |
US20020050828A1 (en) | 2000-04-14 | 2002-05-02 | General Dielectric, Inc. | Multi-feed microwave reflective resonant sensors |
US20020070745A1 (en) | 2000-04-27 | 2002-06-13 | Johnson James E. | Cooling system for burn-in unit |
JP4684461B2 (ja) | 2000-04-28 | 2011-05-18 | パナソニック株式会社 | 磁性素子の製造方法 |
US6711283B1 (en) | 2000-05-03 | 2004-03-23 | Aperio Technologies, Inc. | Fully automatic rapid microscope slide scanner |
US6396296B1 (en) * | 2000-05-15 | 2002-05-28 | Advanced Micro Devices, Inc. | Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station |
US20010044152A1 (en) | 2000-05-18 | 2001-11-22 | Gale Burnett | Dual beam, pulse propagation analyzer, medical profiler interferometer |
US6420722B2 (en) | 2000-05-22 | 2002-07-16 | Omniprobe, Inc. | Method for sample separation and lift-out with one cut |
US20050068054A1 (en) | 2000-05-23 | 2005-03-31 | Sammy Mok | Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies |
EP1296360A1 (en) | 2000-05-26 | 2003-03-26 | Ibiden Co., Ltd. | Semiconductor manufacturing and inspecting device |
US6549022B1 (en) | 2000-06-02 | 2003-04-15 | Sandia Corporation | Apparatus and method for analyzing functional failures in integrated circuits |
US6379130B1 (en) | 2000-06-09 | 2002-04-30 | Tecumseh Products Company | Motor cover retention |
JP2001358184A (ja) * | 2000-06-13 | 2001-12-26 | Mitsubishi Electric Corp | ウエハプローバ及びそれを用いた回路の測定方法 |
US6622103B1 (en) | 2000-06-20 | 2003-09-16 | Formfactor, Inc. | System for calibrating timing of an integrated circuit wafer tester |
JP2002005960A (ja) | 2000-06-21 | 2002-01-09 | Ando Electric Co Ltd | プローブカードおよびその製造方法 |
US6768110B2 (en) | 2000-06-21 | 2004-07-27 | Gatan, Inc. | Ion beam milling system and method for electron microscopy specimen preparation |
JP2002022775A (ja) | 2000-07-05 | 2002-01-23 | Ando Electric Co Ltd | 電気光学プローブおよび磁気光学プローブ |
US6603323B1 (en) | 2000-07-10 | 2003-08-05 | Formfactor, Inc. | Closed-grid bus architecture for wafer interconnect structure |
US6424141B1 (en) | 2000-07-13 | 2002-07-23 | The Micromanipulator Company, Inc. | Wafer probe station |
US6731128B2 (en) | 2000-07-13 | 2004-05-04 | International Business Machines Corporation | TFI probe I/O wrap test method |
US6906539B2 (en) | 2000-07-19 | 2005-06-14 | Texas Instruments Incorporated | High density, area array probe card apparatus |
JP2002039091A (ja) | 2000-07-21 | 2002-02-06 | Minebea Co Ltd | 送風機 |
JP4408538B2 (ja) | 2000-07-24 | 2010-02-03 | 株式会社日立製作所 | プローブ装置 |
DE10036127B4 (de) | 2000-07-25 | 2007-03-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zur Versorgungsspannungsentkopplung für HF-Verstärkerschaltungen |
IT1318734B1 (it) | 2000-08-04 | 2003-09-10 | Technoprobe S R L | Testa di misura a sonde verticali. |
DE10039928B4 (de) * | 2000-08-16 | 2004-07-15 | Infineon Technologies Ag | Vorrichtung zum automatisierten Testen, Kalibrieren und Charakterisieren von Testadaptern |
DE10040988A1 (de) | 2000-08-22 | 2002-03-21 | Evotec Biosystems Ag | Verfahren und Vorrichtung zum Messen chemischer und/oder biologischer Proben |
US6970005B2 (en) | 2000-08-24 | 2005-11-29 | Texas Instruments Incorporated | Multiple-chip probe and universal tester contact assemblage |
EP1316059A2 (de) | 2000-08-31 | 2003-06-04 | Siemens Aktiengesellschaft | Fingerprint-maus mit zeilensensor |
GB0021975D0 (en) | 2000-09-07 | 2000-10-25 | Optomed As | Filter optic probes |
US6920407B2 (en) | 2000-09-18 | 2005-07-19 | Agilent Technologies, Inc. | Method and apparatus for calibrating a multiport test system for measurement of a DUT |
JP3636052B2 (ja) * | 2000-09-25 | 2005-04-06 | サンスター技研株式会社 | 軟質容器の製造方法及び高粘調液充填体 |
US6418009B1 (en) | 2000-09-28 | 2002-07-09 | Nortel Networks Limited | Broadband multi-layer capacitor |
US6731804B1 (en) | 2000-09-28 | 2004-05-04 | The United States Of America As Represented By The Secretary Of The Army | Thermal luminescence liquid monitoring system and method |
US20030072549A1 (en) | 2000-10-26 | 2003-04-17 | The Trustees Of Princeton University | Method and apparatus for dielectric spectroscopy of biological solutions |
DE10151288B4 (de) | 2000-11-02 | 2004-10-07 | Eads Deutschland Gmbh | Struktur-antenne für Fluggeräte oder Flugzeuge |
US6586946B2 (en) | 2000-11-13 | 2003-07-01 | Signature Bioscience, Inc. | System and method for detecting and identifying molecular events in a test sample using a resonant test structure |
US6753699B2 (en) | 2000-11-13 | 2004-06-22 | Standard Microsystems Corporation | Integrated circuit and method of controlling output impedance |
US6582979B2 (en) | 2000-11-15 | 2003-06-24 | Skyworks Solutions, Inc. | Structure and method for fabrication of a leadless chip carrier with embedded antenna |
WO2002045283A2 (en) | 2000-11-29 | 2002-06-06 | Broadcom Corporation | Integrated direct conversion satellite tuner |
DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | Wafersonde |
US6927079B1 (en) | 2000-12-06 | 2005-08-09 | Lsi Logic Corporation | Method for probing a semiconductor wafer |
US6605951B1 (en) | 2000-12-11 | 2003-08-12 | Lsi Logic Corporation | Interconnector and method of connecting probes to a die for functional analysis |
US6794950B2 (en) | 2000-12-21 | 2004-09-21 | Paratek Microwave, Inc. | Waveguide to microstrip transition |
DE20021685U1 (de) | 2000-12-21 | 2001-03-15 | Rosenberger Hochfrequenztech | Hochfrequenz-Tastspitze |
JP4071629B2 (ja) | 2000-12-22 | 2008-04-02 | 東京エレクトロン株式会社 | プローブカートリッジアッセンブリ―並びに多プローブアッセンブリー |
US6541993B2 (en) | 2000-12-26 | 2003-04-01 | Ericsson, Inc. | Transistor device testing employing virtual device fixturing |
JP3543765B2 (ja) | 2000-12-28 | 2004-07-21 | Jsr株式会社 | ウエハ検査用プローブ装置 |
US6944380B1 (en) | 2001-01-16 | 2005-09-13 | Japan Science And Technology Agency | Optical fiber for transmitting ultraviolet ray, optical fiber probe, and method of manufacturing the optical fiber probe |
GB2371618B (en) * | 2001-01-30 | 2004-11-17 | Teraprobe Ltd | A probe, apparatus and method for examining a sample |
US6707548B2 (en) | 2001-02-08 | 2004-03-16 | Array Bioscience Corporation | Systems and methods for filter based spectrographic analysis |
JP2002243502A (ja) | 2001-02-09 | 2002-08-28 | Olympus Optical Co Ltd | エンコーダ装置 |
WO2002065127A2 (en) | 2001-02-12 | 2002-08-22 | Signature Bioscience, Inc. | A system and method for characterizing the permittivity of molecular events |
US7006046B2 (en) | 2001-02-15 | 2006-02-28 | Integral Technologies, Inc. | Low cost electronic probe devices manufactured from conductive loaded resin-based materials |
US6946864B2 (en) | 2001-02-19 | 2005-09-20 | Osram Gmbh | Method for measuring product parameters of components formed on a wafer and device for performing the method |
US6628503B2 (en) | 2001-03-13 | 2003-09-30 | Nikon Corporation | Gas cooled electrostatic pin chuck for vacuum applications |
GB0106245D0 (en) | 2001-03-14 | 2001-05-02 | Renishaw Plc | Calibration of an analogue probe |
JP4721247B2 (ja) | 2001-03-16 | 2011-07-13 | 東京エレクトロン株式会社 | プローブ方法及びプローブ装置 |
US6512482B1 (en) | 2001-03-20 | 2003-01-28 | Xilinx, Inc. | Method and apparatus using a semiconductor die integrated antenna structure |
US6611417B2 (en) | 2001-03-22 | 2003-08-26 | Winbond Electronics Corporation | Wafer chuck system |
US6910268B2 (en) | 2001-03-27 | 2005-06-28 | Formfactor, Inc. | Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via |
JP2002296508A (ja) | 2001-03-30 | 2002-10-09 | Nikon Corp | 顕微鏡システム |
US6856150B2 (en) | 2001-04-10 | 2005-02-15 | Formfactor, Inc. | Probe card with coplanar daughter card |
US6627980B2 (en) | 2001-04-12 | 2003-09-30 | Formfactor, Inc. | Stacked semiconductor device assembly with microelectronic spring contacts |
US6811406B2 (en) | 2001-04-12 | 2004-11-02 | Formfactor, Inc. | Microelectronic spring with additional protruding member |
JP2002311052A (ja) | 2001-04-13 | 2002-10-23 | Agilent Technologies Japan Ltd | ブレード状接続針 |
US6627461B2 (en) | 2001-04-18 | 2003-09-30 | Signature Bioscience, Inc. | Method and apparatus for detection of molecular events using temperature control of detection environment |
DE20106745U1 (de) | 2001-04-19 | 2002-08-29 | Bosch Gmbh Robert | Kleinbauender Kupplungsstecker, insbesondere für eine planare Breitband-Lamda-Sonde mit Verlierschutz für Einzeladerdichtungen |
US6549396B2 (en) | 2001-04-19 | 2003-04-15 | Gennum Corporation | Multiple terminal capacitor structure |
US6943563B2 (en) | 2001-05-02 | 2005-09-13 | Anritsu Company | Probe tone S-parameter measurements |
DE20220754U1 (de) | 2001-05-04 | 2004-04-01 | Cascade Microtech, Inc., Beaverton | Faser-optische Wafer-Sonde |
US6882239B2 (en) | 2001-05-08 | 2005-04-19 | Formfactor, Inc. | Electromagnetically coupled interconnect system |
JP2002343879A (ja) | 2001-05-15 | 2002-11-29 | Nec Corp | 半導体装置及びその製造方法 |
JP3979793B2 (ja) | 2001-05-29 | 2007-09-19 | 日立ソフトウエアエンジニアリング株式会社 | プローブ設計装置及びプローブ設計方法 |
EP1407254B1 (en) | 2001-05-31 | 2005-12-28 | IntelScan örbylgjutaekni ehf. | Apparatus and method for microwave determination of at least one physical parameter of a substance |
WO2002101816A1 (fr) | 2001-06-06 | 2002-12-19 | Ibiden Co., Ltd. | Dispositif d'etalonnage de tranche |
US6906506B1 (en) | 2001-06-08 | 2005-06-14 | The Regents Of The University Of Michigan | Method and apparatus for simultaneous measurement of electric field and temperature using an electrooptic semiconductor probe |
US6911826B2 (en) | 2001-06-12 | 2005-06-28 | General Electric Company | Pulsed eddy current sensor probes and inspection methods |
JP4610798B2 (ja) | 2001-06-19 | 2011-01-12 | エスアイアイ・ナノテクノロジー株式会社 | レーザ欠陥検出機能を備えた走査型電子顕微鏡とそのオートフォーカス方法 |
US6649402B2 (en) | 2001-06-22 | 2003-11-18 | Wisconsin Alumni Research Foundation | Microfabricated microbial growth assay method and apparatus |
CA2451404C (en) | 2001-07-06 | 2011-04-19 | Wisconsin Alumni Research Foundation | Space-time microwave imaging for cancer detection |
US6729019B2 (en) | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
CA2353024C (en) | 2001-07-12 | 2005-12-06 | Ibm Canada Limited-Ibm Canada Limitee | Anti-vibration and anti-tilt microscope stand |
GB0117715D0 (en) | 2001-07-19 | 2001-09-12 | Mrbp Res Ltd | Microwave biochemical analysis |
US6908364B2 (en) | 2001-08-02 | 2005-06-21 | Kulicke & Soffa Industries, Inc. | Method and apparatus for probe tip cleaning and shaping pad |
US6617866B1 (en) | 2001-08-02 | 2003-09-09 | Lsi Logic Corporation | Apparatus and method of protecting a probe card during a sort sequence |
US20030076585A1 (en) | 2001-08-07 | 2003-04-24 | Ledley Robert S. | Optical system for enhancing the image from a microscope's high power objective lens |
IL144806A (en) | 2001-08-08 | 2005-11-20 | Nova Measuring Instr Ltd | Method and apparatus for process control in semiconductor manufacturing |
WO2003016930A1 (fr) | 2001-08-10 | 2003-02-27 | Advantest Corporation | Module d'essai et testeur |
US20030032000A1 (en) | 2001-08-13 | 2003-02-13 | Signature Bioscience Inc. | Method for analyzing cellular events |
US20040147034A1 (en) | 2001-08-14 | 2004-07-29 | Gore Jay Prabhakar | Method and apparatus for measuring a substance in a biological sample |
US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
US6481939B1 (en) | 2001-08-24 | 2002-11-19 | Robb S. Gillespie | Tool tip conductivity contact sensor and method |
US6643597B1 (en) | 2001-08-24 | 2003-11-04 | Agilent Technologies, Inc. | Calibrating a test system using unknown standards |
US6678876B2 (en) | 2001-08-24 | 2004-01-13 | Formfactor, Inc. | Process and apparatus for finding paths through a routing space |
US6862727B2 (en) | 2001-08-24 | 2005-03-01 | Formfactor, Inc. | Process and apparatus for adjusting traces |
US6639461B1 (en) | 2001-08-30 | 2003-10-28 | Sierra Monolithics, Inc. | Ultra-wideband power amplifier module apparatus and method for optical and electronic communications |
US6549106B2 (en) | 2001-09-06 | 2003-04-15 | Cascade Microtech, Inc. | Waveguide with adjustable backshort |
US6764869B2 (en) | 2001-09-12 | 2004-07-20 | Formfactor, Inc. | Method of assembling and testing an electronics module |
US6714828B2 (en) | 2001-09-17 | 2004-03-30 | Formfactor, Inc. | Method and system for designing a probe card |
DE50213222D1 (de) | 2001-09-24 | 2009-03-05 | Jpk Instruments Ag | Vorrichtung und Verfahren für ein Rastersondenmikroskop |
US6636063B2 (en) | 2001-10-02 | 2003-10-21 | Texas Instruments Incorporated | Probe card with contact apparatus and method of manufacture |
US6882546B2 (en) | 2001-10-03 | 2005-04-19 | Formfactor, Inc. | Multiple die interconnect system |
US20030139662A1 (en) | 2001-10-16 | 2003-07-24 | Seidman Abraham Neil | Method and apparatus for detecting, identifying and performing operations on microstructures including, anthrax spores, brain cells, cancer cells, living tissue cells, and macro-objects including stereotactic neurosurgery instruments, weapons and explosives |
KR100442822B1 (ko) | 2001-10-23 | 2004-08-02 | 삼성전자주식회사 | 전단응력 측정을 이용한 생분자들간의 결합 여부 검출 방법 |
US6759311B2 (en) | 2001-10-31 | 2004-07-06 | Formfactor, Inc. | Fan out of interconnect elements attached to semiconductor wafer |
US7071714B2 (en) | 2001-11-02 | 2006-07-04 | Formfactor, Inc. | Method and system for compensating for thermally induced motion of probe cards |
US6817052B2 (en) | 2001-11-09 | 2004-11-16 | Formfactor, Inc. | Apparatuses and methods for cleaning test probes |
JP3976733B2 (ja) | 2001-11-13 | 2007-09-19 | 株式会社アドバンテスト | 波長分散測定システムおよび方法 |
WO2003047684A2 (en) | 2001-12-04 | 2003-06-12 | University Of Southern California | Method for intracellular modifications within living cells using pulsed electric fields |
US6816031B1 (en) | 2001-12-04 | 2004-11-09 | Formfactor, Inc. | Adjustable delay transmission line |
US6447339B1 (en) | 2001-12-12 | 2002-09-10 | Tektronix, Inc. | Adapter for a multi-channel signal probe |
JP4123408B2 (ja) | 2001-12-13 | 2008-07-23 | 東京エレクトロン株式会社 | プローブカード交換装置 |
US6870359B1 (en) | 2001-12-14 | 2005-03-22 | Le Croy Corporation | Self-calibrating electrical test probe |
US6794934B2 (en) | 2001-12-14 | 2004-09-21 | Iterra Communications, Llc | High gain wideband driver amplifier |
US6770955B1 (en) | 2001-12-15 | 2004-08-03 | Skyworks Solutions, Inc. | Shielded antenna in a semiconductor package |
US6759859B2 (en) | 2001-12-19 | 2004-07-06 | Chung-Shan Institute Of Science And Technology | Resilient and rugged multi-layered probe |
US6777319B2 (en) | 2001-12-19 | 2004-08-17 | Formfactor, Inc. | Microelectronic spring contact repair |
US20030119057A1 (en) | 2001-12-20 | 2003-06-26 | Board Of Regents | Forming and modifying dielectrically-engineered microparticles |
US6657601B2 (en) | 2001-12-21 | 2003-12-02 | Tdk Rf Solutions | Metrology antenna system utilizing two-port, sleeve dipole and non-radiating balancing network |
US6822463B1 (en) | 2001-12-21 | 2004-11-23 | Lecroy Corporation | Active differential test probe with a transmission line input structure |
US6479308B1 (en) | 2001-12-27 | 2002-11-12 | Formfactor, Inc. | Semiconductor fuse covering |
US6891385B2 (en) | 2001-12-27 | 2005-05-10 | Formfactor, Inc. | Probe card cooling assembly with direct cooling of active electronic components |
US7020363B2 (en) | 2001-12-28 | 2006-03-28 | Intel Corporation | Optical probe for wafer testing |
US6741092B2 (en) | 2001-12-28 | 2004-05-25 | Formfactor, Inc. | Method and system for detecting an arc condition |
US7186990B2 (en) | 2002-01-22 | 2007-03-06 | Microbiosystems, Limited Partnership | Method and apparatus for detecting and imaging the presence of biological materials |
US6911834B2 (en) | 2002-01-25 | 2005-06-28 | Texas Instruments Incorporated | Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probing |
JP2003222654A (ja) | 2002-01-30 | 2003-08-08 | Tokyo Electron Ltd | プローブ装置 |
US6907149B2 (en) | 2002-02-01 | 2005-06-14 | Kaiser Optical Systems, Inc. | Compact optical measurement probe |
US6771086B2 (en) | 2002-02-19 | 2004-08-03 | Lucas/Signatone Corporation | Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control |
KR100608521B1 (ko) | 2002-02-22 | 2006-08-03 | 마츠시타 덴끼 산교 가부시키가이샤 | 헬리컬 안테나 장치 및 그것을 구비한 무선통신장치 |
US6617862B1 (en) | 2002-02-27 | 2003-09-09 | Advanced Micro Devices, Inc. | Laser intrusive technique for locating specific integrated circuit current paths |
US6701265B2 (en) | 2002-03-05 | 2004-03-02 | Tektronix, Inc. | Calibration for vector network analyzer |
US6828767B2 (en) | 2002-03-20 | 2004-12-07 | Santronics, Inc. | Hand-held voltage detection probe |
US7015707B2 (en) | 2002-03-20 | 2006-03-21 | Gabe Cherian | Micro probe |
DE10213692B4 (de) | 2002-03-27 | 2013-05-23 | Weinmann Diagnostics Gmbh & Co. Kg | Verfahren zur Steuerung einer Vorrichtung und Vorrichtung zur Messung von Inhaltsstoffen im Blut |
US6806697B2 (en) | 2002-04-05 | 2004-10-19 | Agilent Technologies, Inc. | Apparatus and method for canceling DC errors and noise generated by ground shield current in a probe |
US6737920B2 (en) | 2002-05-03 | 2004-05-18 | Atheros Communications, Inc. | Variable gain amplifier |
DE10220343B4 (de) | 2002-05-07 | 2007-04-05 | Atg Test Systems Gmbh & Co. Kg Reicholzheim | Vorrichtung und Verfahren zum Prüfen von Leiterplatten und Prüfsonde |
US6911835B2 (en) | 2002-05-08 | 2005-06-28 | Formfactor, Inc. | High performance probe system |
US6798225B2 (en) | 2002-05-08 | 2004-09-28 | Formfactor, Inc. | Tester channel to multiple IC terminals |
US6784674B2 (en) | 2002-05-08 | 2004-08-31 | Formfactor, Inc. | Test signal distribution system for IC tester |
US6909300B2 (en) | 2002-05-09 | 2005-06-21 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for fabricating microelectronic fabrication electrical test apparatus electrical probe tip having pointed tips |
US7259043B2 (en) | 2002-05-14 | 2007-08-21 | Texas Instruments Incorporated | Circular test pads on scribe street area |
WO2003098255A1 (en) | 2002-05-16 | 2003-11-27 | Koninklijke Philips Electronics N.V. | Method for calibrating and de-embedding, set of devices for de-embedding and vector network analyzer |
WO2003098168A1 (en) | 2002-05-16 | 2003-11-27 | Vega Grieshaber Kg | Planar antenna and antenna system |
US6587327B1 (en) | 2002-05-17 | 2003-07-01 | Daniel Devoe | Integrated broadband ceramic capacitor array |
KR100435765B1 (ko) | 2002-05-21 | 2004-06-10 | 현대자동차주식회사 | 프레스 장치의 피어싱용 패드 구조 |
AU2003233659A1 (en) | 2002-05-23 | 2003-12-12 | Cascade Microtech, Inc. | Probe for testing a device under test |
US20030234659A1 (en) | 2002-06-20 | 2003-12-25 | Promos Technologies | Electrical isolation between pins sharing the same tester channel |
US7343185B2 (en) | 2002-06-21 | 2008-03-11 | Nir Diagnostics Inc. | Measurement of body compounds |
KR100470970B1 (ko) | 2002-07-05 | 2005-03-10 | 삼성전자주식회사 | 반도체 검사장치용 프로브카드의 니들고정장치 및 방법 |
US6856129B2 (en) | 2002-07-09 | 2005-02-15 | Intel Corporation | Current probe device having an integrated amplifier |
US6812691B2 (en) | 2002-07-12 | 2004-11-02 | Formfactor, Inc. | Compensation for test signal degradation due to DUT fault |
JP4335497B2 (ja) | 2002-07-12 | 2009-09-30 | エスアイアイ・ナノテクノロジー株式会社 | イオンビーム装置およびイオンビーム加工方法 |
US6937045B2 (en) | 2002-07-18 | 2005-08-30 | Aries Electronics, Inc. | Shielded integrated circuit probe |
US6913476B2 (en) | 2002-08-06 | 2005-07-05 | Micron Technology, Inc. | Temporary, conformable contacts for microelectronic components |
US6788093B2 (en) | 2002-08-07 | 2004-09-07 | International Business Machines Corporation | Methodology and apparatus using real-time optical signal for wafer-level device dielectrical reliability studies |
JP4357813B2 (ja) | 2002-08-23 | 2009-11-04 | 東京エレクトロン株式会社 | プローブ装置及びプローブ方法 |
US6924653B2 (en) | 2002-08-26 | 2005-08-02 | Micron Technology, Inc. | Selectively configurable microelectronic probes |
JP3574444B2 (ja) | 2002-08-27 | 2004-10-06 | 沖電気工業株式会社 | プローブの接触抵抗測定方法及び半導体デバイスの試験方法 |
KR100892196B1 (ko) | 2002-08-27 | 2009-04-07 | 제이에스알 가부시끼가이샤 | 이방 도전성 시트 및 임피던스 측정용 프로브 |
US6902416B2 (en) | 2002-08-29 | 2005-06-07 | 3M Innovative Properties Company | High density probe device |
BR0215864A (pt) | 2002-09-10 | 2005-07-05 | Fractus Sa | Dispositivo de antena e antena para dispositivo portátil |
JP2004132971A (ja) | 2002-09-17 | 2004-04-30 | Iwasaki Correspond Industry Co Ltd | プローブカード |
US6784679B2 (en) | 2002-09-30 | 2004-08-31 | Teradyne, Inc. | Differential coaxial contact array for high-density, high-speed signals |
US6881072B2 (en) | 2002-10-01 | 2005-04-19 | International Business Machines Corporation | Membrane probe with anchored elements |
US7046025B2 (en) | 2002-10-02 | 2006-05-16 | Suss Microtec Testsystems Gmbh | Test apparatus for testing substrates at low temperatures |
US6768328B2 (en) | 2002-10-09 | 2004-07-27 | Agilent Technologies, Inc. | Single point probe structure and method |
US6927598B2 (en) | 2002-10-15 | 2005-08-09 | General Electric Company | Test probe for electrical devices having low or no wedge depression |
JP4659328B2 (ja) | 2002-10-21 | 2011-03-30 | 東京エレクトロン株式会社 | 被検査体を温度制御するプローブ装置 |
US7026832B2 (en) | 2002-10-28 | 2006-04-11 | Dainippon Screen Mfg. Co., Ltd. | Probe mark reading device and probe mark reading method |
JP2004152916A (ja) | 2002-10-29 | 2004-05-27 | Nec Corp | 半導体デバイス検査装置及び検査方法 |
US6864694B2 (en) | 2002-10-31 | 2005-03-08 | Agilent Technologies, Inc. | Voltage probe |
JP2004205487A (ja) | 2002-11-01 | 2004-07-22 | Tokyo Electron Ltd | プローブカードの固定機構 |
US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
US6853198B2 (en) | 2002-11-14 | 2005-02-08 | Agilent Technologies, Inc. | Method and apparatus for performing multiport through-reflect-line calibration and measurement |
US7019895B2 (en) | 2002-11-15 | 2006-03-28 | Dmetrix, Inc. | Microscope stage providing improved optical performance |
US20040100276A1 (en) | 2002-11-25 | 2004-05-27 | Myron Fanton | Method and apparatus for calibration of a vector network analyzer |
EP1726268B1 (en) | 2002-11-27 | 2008-06-25 | Medical Device Innovations Limited | Coaxial tissue ablation probe and method of making a balun therefor |
US7084650B2 (en) | 2002-12-16 | 2006-08-01 | Formfactor, Inc. | Apparatus and method for limiting over travel in a probe card assembly |
US6727716B1 (en) | 2002-12-16 | 2004-04-27 | Newport Fab, Llc | Probe card and probe needle for high frequency testing |
TW594899B (en) | 2002-12-18 | 2004-06-21 | Star Techn Inc | Detection card for semiconductor measurement |
US6741129B1 (en) | 2002-12-19 | 2004-05-25 | Texas Instruments Incorporated | Differential amplifier slew rate boosting scheme |
AU2003283175A1 (en) | 2002-12-19 | 2004-07-14 | Unaxis Balzers Ag | Method for generating electromagnetic field distributions |
JP2004199796A (ja) | 2002-12-19 | 2004-07-15 | Shinka Jitsugyo Kk | 薄膜磁気ヘッドの特性測定用プローブピンの接続方法及び薄膜磁気ヘッドの特性測定方法 |
US6753679B1 (en) | 2002-12-23 | 2004-06-22 | Nortel Networks Limited | Test point monitor using embedded passive resistance |
JP4133777B2 (ja) | 2003-01-06 | 2008-08-13 | 日本電子株式会社 | 核磁気共鳴プローブ |
KR100702003B1 (ko) | 2003-01-18 | 2007-03-30 | 삼성전자주식회사 | 프로브 카드 |
US6856126B2 (en) | 2003-01-21 | 2005-02-15 | Agilent Technologies, Inc. | Differential voltage probe |
AU2003298245A1 (en) | 2003-01-21 | 2004-08-13 | Evotec Technologies Gmbh | Method for analyzing the luminescence of chemical and/or biological samples |
JP3827159B2 (ja) | 2003-01-23 | 2006-09-27 | 株式会社ヨコオ | 車載用アンテナ装置 |
US6937020B2 (en) | 2003-02-04 | 2005-08-30 | The University Of Kansas | Solid-state nuclear magnetic resonance probe |
US7107170B2 (en) | 2003-02-18 | 2006-09-12 | Agilent Technologies, Inc. | Multiport network analyzer calibration employing reciprocity of a device |
JP2004265942A (ja) | 2003-02-20 | 2004-09-24 | Okutekku:Kk | プローブピンのゼロ点検出方法及びプローブ装置 |
US6970001B2 (en) | 2003-02-20 | 2005-11-29 | Hewlett-Packard Development Company, L.P. | Variable impedance test probe |
US6987483B2 (en) | 2003-02-21 | 2006-01-17 | Kyocera Wireless Corp. | Effectively balanced dipole microstrip antenna |
FR2851823B1 (fr) | 2003-02-27 | 2005-09-02 | Ecole Superieure Electricite | Procede et systeme pour mesurer un debit d'absorption specifique das |
US6838885B2 (en) | 2003-03-05 | 2005-01-04 | Murata Manufacturing Co., Ltd. | Method of correcting measurement error and electronic component characteristic measurement apparatus |
US6778140B1 (en) | 2003-03-06 | 2004-08-17 | D-Link Corporation | Atch horn antenna of dual frequency |
US6902941B2 (en) | 2003-03-11 | 2005-06-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Probing of device elements |
US6946859B2 (en) | 2003-03-12 | 2005-09-20 | Celerity Research, Inc. | Probe structures using clamped substrates with compliant interconnectors |
US6914427B2 (en) | 2003-03-14 | 2005-07-05 | The Boeing Company | Eddy current probe having sensing elements defined by first and second elongated coils and an associated inspection method |
US6943571B2 (en) | 2003-03-18 | 2005-09-13 | International Business Machines Corporation | Reduction of positional errors in a four point probe resistance measurement |
US6940283B2 (en) | 2003-03-20 | 2005-09-06 | Snap-On Incorporated | Detecting field from different ignition coils using adjustable probe |
US6948391B2 (en) | 2003-03-21 | 2005-09-27 | Nuclear Filter Technology | Probe with integral vent, sampling port and filter element |
US7130756B2 (en) | 2003-03-28 | 2006-10-31 | Suss Microtec Test System Gmbh | Calibration method for carrying out multiport measurements on semiconductor wafers |
GB2399948B (en) | 2003-03-28 | 2006-06-21 | Sarantel Ltd | A dielectrically-loaded antenna |
US7022976B1 (en) | 2003-04-02 | 2006-04-04 | Advanced Micro Devices, Inc. | Dynamically adjustable probe tips |
US6823276B2 (en) | 2003-04-04 | 2004-11-23 | Agilent Technologies, Inc. | System and method for determining measurement errors of a testing device |
US20040201388A1 (en) * | 2003-04-08 | 2004-10-14 | Barr Andrew Harvey | Support for an electronic probe and related methods |
US7342402B2 (en) | 2003-04-10 | 2008-03-11 | Formfactor, Inc. | Method of probing a device using captured image of probe structure in which probe tips comprise alignment features |
US7002133B2 (en) | 2003-04-11 | 2006-02-21 | Hewlett-Packard Development Company, L.P. | Detecting one or more photons from their interactions with probe photons in a matter system |
KR20040089244A (ko) | 2003-04-11 | 2004-10-21 | 주식회사 유림하이테크산업 | 프로브 카드의 니들 어셈블리 |
US7023225B2 (en) | 2003-04-16 | 2006-04-04 | Lsi Logic Corporation | Wafer-mounted micro-probing platform |
TWI220163B (en) | 2003-04-24 | 2004-08-11 | Ind Tech Res Inst | Manufacturing method of high-conductivity nanometer thin-film probe card |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
US6882160B2 (en) | 2003-06-12 | 2005-04-19 | Anritsu Company | Methods and computer program products for full N-port vector network analyzer calibrations |
US6900652B2 (en) | 2003-06-13 | 2005-05-31 | Solid State Measurements, Inc. | Flexible membrane probe and method of use thereof |
KR100523139B1 (ko) | 2003-06-23 | 2005-10-20 | 주식회사 하이닉스반도체 | 웨이퍼 테스트시 사용되는 프로빙 패드의 수를 감소시키기위한 반도체 장치 및 그의 테스팅 방법 |
US6956388B2 (en) | 2003-06-24 | 2005-10-18 | Agilent Technologies, Inc. | Multiple two axis floating probe assembly using split probe block |
US6870381B2 (en) | 2003-06-27 | 2005-03-22 | Formfactor, Inc. | Insulative covering of probe tips |
US6911814B2 (en) | 2003-07-01 | 2005-06-28 | Formfactor, Inc. | Apparatus and method for electromechanical testing and validation of probe cards |
US7015708B2 (en) | 2003-07-11 | 2006-03-21 | Gore Enterprise Holdings, Inc. | Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts |
US20050229053A1 (en) | 2003-07-25 | 2005-10-13 | Logicvision, Inc., 101 Metro Drive, 3Rd Floor, San Jose, Ca, 95110 | Circuit and method for low frequency testing of high frequency signal waveforms |
US20050026276A1 (en) | 2003-07-29 | 2005-02-03 | Northrop Grumman Corporation | Remote detection and analysis of chemical and biological aerosols |
US7068049B2 (en) | 2003-08-05 | 2006-06-27 | Agilent Technologies, Inc. | Method and apparatus for measuring a device under test using an improved through-reflect-line measurement calibration |
US7015703B2 (en) | 2003-08-12 | 2006-03-21 | Scientific Systems Research Limited | Radio frequency Langmuir probe |
US7025628B2 (en) | 2003-08-13 | 2006-04-11 | Agilent Technologies, Inc. | Electronic probe extender |
US6912468B2 (en) | 2003-08-14 | 2005-06-28 | Westerngeco, L.L.C. | Method and apparatus for contemporaneous utilization of a higher order probe in pre-stack and post-stack seismic domains |
US6924655B2 (en) | 2003-09-03 | 2005-08-02 | Micron Technology, Inc. | Probe card for use with microelectronic components, and methods for making same |
US7088189B2 (en) | 2003-09-09 | 2006-08-08 | Synergy Microwave Corporation | Integrated low noise microwave wideband push-push VCO |
JP3812559B2 (ja) | 2003-09-18 | 2006-08-23 | Tdk株式会社 | 渦電流プローブ |
US7286013B2 (en) | 2003-09-18 | 2007-10-23 | Avago Technologies Wireless Ip (Singapore) Pte Ltd | Coupled-inductance differential amplifier |
JP2007506981A (ja) | 2003-09-23 | 2007-03-22 | ザイベックス コーポレーション | Fibで調製した試料を把持する素子を使用した顕微鏡検査のための方法、システム、および装置 |
US6946860B2 (en) | 2003-10-08 | 2005-09-20 | Chipmos Technologies (Bermuda) Ltd. | Modularized probe head |
US7009452B2 (en) | 2003-10-16 | 2006-03-07 | Solarflare Communications, Inc. | Method and apparatus for increasing the linearity and bandwidth of an amplifier |
US7250626B2 (en) | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
US7981362B2 (en) | 2003-11-04 | 2011-07-19 | Meso Scale Technologies, Llc | Modular assay plates, reader systems and methods for test measurements |
US7020506B2 (en) | 2003-11-06 | 2006-03-28 | Orsense Ltd. | Method and system for non-invasive determination of blood-related parameters |
US6897668B1 (en) * | 2003-11-28 | 2005-05-24 | Premtek International Inc. | Double-faced detecting devices for an electronic substrate |
US7034553B2 (en) | 2003-12-05 | 2006-04-25 | Prodont, Inc. | Direct resistance measurement corrosion probe |
DE10361903A1 (de) | 2003-12-22 | 2005-07-28 | Carl Zeiss Jena Gmbh | Verfahren zur spektroskopischen Analyse einer biologischen oder chemischen Substanz |
KR100751600B1 (ko) | 2003-12-24 | 2007-08-22 | 몰렉스 인코포레이티드 | 변형 임피던스를 구비한 전송 라인 |
US7187188B2 (en) | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
WO2005065258A2 (en) | 2003-12-24 | 2005-07-21 | Cascade Microtech, Inc. | Active wafer probe |
US6933725B2 (en) | 2004-01-16 | 2005-08-23 | Bruker Biospin Corporation | NMR probe circuit for generating close frequency resonances |
US7254425B2 (en) | 2004-01-23 | 2007-08-07 | Abbott Laboratories | Method for detecting artifacts in data |
US6933713B2 (en) | 2004-01-26 | 2005-08-23 | Agilent Technologies, Inc. | High bandwidth oscilloscope probe with replaceable cable |
US6940264B2 (en) | 2004-01-29 | 2005-09-06 | The United States Of America As Represented By The Secretary Of The Navy | Near field probe |
TWI232938B (en) * | 2004-02-11 | 2005-05-21 | Star Techn Inc | Probe card |
US7319335B2 (en) * | 2004-02-12 | 2008-01-15 | Applied Materials, Inc. | Configurable prober for TFT LCD array testing |
US7009188B2 (en) | 2004-05-04 | 2006-03-07 | Micron Technology, Inc. | Lift-out probe having an extension tip, methods of making and using, and analytical instruments employing same |
US7015709B2 (en) | 2004-05-12 | 2006-03-21 | Delphi Technologies, Inc. | Ultra-broadband differential voltage probes |
US7023231B2 (en) | 2004-05-14 | 2006-04-04 | Solid State Measurements, Inc. | Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof |
US7019541B2 (en) | 2004-05-14 | 2006-03-28 | Crown Products, Inc. | Electric conductivity water probe |
JP2005331298A (ja) * | 2004-05-18 | 2005-12-02 | Mitsubishi Electric Corp | 高周波回路の特性測定方法及び校正用パターンならびに校正用治具 |
US7015690B2 (en) | 2004-05-27 | 2006-03-21 | General Electric Company | Omnidirectional eddy current probe and inspection system |
US7148716B2 (en) * | 2004-06-10 | 2006-12-12 | Texas Instruments Incorporated | System and method for the probing of a wafer |
TWI252925B (en) | 2004-07-05 | 2006-04-11 | Yulim Hitech Inc | Probe card for testing a semiconductor device |
JP4022608B2 (ja) * | 2004-07-30 | 2007-12-19 | 独立行政法人 日本原子力研究開発機構 | 分留法を用いるフッ化物揮発法による再処理方法 |
US7188037B2 (en) | 2004-08-20 | 2007-03-06 | Microcraft | Method and apparatus for testing circuit boards |
US20060052075A1 (en) | 2004-09-07 | 2006-03-09 | Rajeshwar Galivanche | Testing integrated circuits using high bandwidth wireless technology |
US7001785B1 (en) | 2004-12-06 | 2006-02-21 | Veeco Instruments, Inc. | Capacitance probe for thin dielectric film characterization |
US7030328B1 (en) | 2004-12-22 | 2006-04-18 | Agilent Technologies, Inc. | Liquid metal switch employing micro-electromechanical system (MEMS) structures for actuation |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
JP2006237378A (ja) * | 2005-02-25 | 2006-09-07 | Elpida Memory Inc | ウェハプローバおよびウェハ検査方法 |
US7005879B1 (en) | 2005-03-01 | 2006-02-28 | International Business Machines Corporation | Device for probe card power bus noise reduction |
JP2006258667A (ja) * | 2005-03-17 | 2006-09-28 | Nec Electronics Corp | パッケージ基板のrfインピーダンス測定装置 |
US7279920B2 (en) | 2005-04-06 | 2007-10-09 | Texas Instruments Incoporated | Expeditious and low cost testing of RFID ICs |
JP4611788B2 (ja) | 2005-04-12 | 2011-01-12 | サンテック株式会社 | 光偏向プローブ及び光偏向プローブ装置 |
US7096133B1 (en) | 2005-05-17 | 2006-08-22 | National Semiconductor Corporation | Method of establishing benchmark for figure of merit indicative of amplifier flicker noise |
US7733287B2 (en) | 2005-07-29 | 2010-06-08 | Sony Corporation | Systems and methods for high frequency parallel transmissions |
US7327153B2 (en) | 2005-11-02 | 2008-02-05 | Texas Instruments Incorporated | Analog built-in self-test module |
DE102005053146A1 (de) | 2005-11-04 | 2007-05-10 | Suss Microtec Test Systems Gmbh | Messspitze zur Hochfrequenzmessung |
US20070145989A1 (en) | 2005-12-27 | 2007-06-28 | Hua Zhu | Probe card with improved transient power delivery |
WO2007145728A2 (en) | 2006-06-12 | 2007-12-21 | Cascade Microtech, Inc. | A test structure and probe for differential signals |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
-
2005
- 2005-09-08 JP JP2007531363A patent/JP2008512680A/ja active Pending
- 2005-09-08 DE DE202005021435U patent/DE202005021435U1/de not_active Expired - Lifetime
- 2005-09-08 US US11/222,275 patent/US7420381B2/en not_active Expired - Fee Related
- 2005-09-08 KR KR1020077006806A patent/KR20070058522A/ko not_active Application Discontinuation
- 2005-09-08 WO PCT/US2005/032159 patent/WO2006031646A2/en active Application Filing
- 2005-09-08 EP EP05794853A patent/EP1789812A2/en not_active Withdrawn
- 2005-09-13 TW TW094131391A patent/TW200619634A/zh unknown
-
2008
- 2008-07-03 US US12/217,359 patent/US8013623B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200619634A (en) | 2006-06-16 |
WO2006031646A2 (en) | 2006-03-23 |
US20080265925A1 (en) | 2008-10-30 |
US7420381B2 (en) | 2008-09-02 |
US20060043962A1 (en) | 2006-03-02 |
US8013623B2 (en) | 2011-09-06 |
JP2008512680A (ja) | 2008-04-24 |
EP1789812A2 (en) | 2007-05-30 |
WO2006031646A3 (en) | 2006-07-20 |
DE202005021435U1 (de) | 2008-02-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20070058522A (ko) | 양측 프루빙 구조 | |
US6476626B2 (en) | Probe contact system having planarity adjustment mechanism | |
US9291644B2 (en) | Contactless measuring system for contactless decoupling of a signal running on a signal waveguide | |
US7538566B2 (en) | Electrical test system including coaxial cables | |
US6970006B2 (en) | Apparatus for the automated testing, calibration and characterization of test adapters | |
KR20040051937A (ko) | 집적회로 패키지를 테스트하기 위한 테스트 보드 및 이를이용한 테스터 보정방법 | |
JP2014219406A (ja) | ポゴピン接続に機械的安定を提供する試験ソケット | |
KR100428782B1 (ko) | 포고 핀 탄성 측정장치 | |
US5942766A (en) | Article and method for in-process testing of RF products | |
KR102223445B1 (ko) | 테스트 소켓 | |
KR100638330B1 (ko) | 도체장치 검사용 어댑터 | |
US5550466A (en) | Hinged conduit for routing cables in an electronic circuit tester | |
US20090212790A1 (en) | Method of estimating channel bandwidth from a time domain reflectometer (tdr) measurement | |
US6710590B1 (en) | Test head Hifix for semiconductor device testing apparatus | |
KR20120005941A (ko) | 회로 기판 검사용 프로브 유닛 및 회로 기판 검사 장치 | |
US9347982B1 (en) | Circuit board probe fixture | |
EP1041389B1 (en) | System and method for characterising a test fixture | |
US11774491B1 (en) | System and method for testing a semiconductor chip | |
KR101552440B1 (ko) | 프로브 시스템 및 이를 위한 캘리브레이션 키트 | |
TWI833331B (zh) | 測試半導體晶片的晶片插座、系統及方法 | |
US11899058B2 (en) | Automated test equipment for testing one or more devices-under-test and method for operating an automated test equipment | |
KR101397370B1 (ko) | Tiu 보드 검사 장치 | |
TW202409586A (zh) | 自動試驗裝置及其介面裝置 | |
JP2024014519A (ja) | 自動試験装置およびそのインタフェース装置 | |
JPH01235345A (ja) | 半導体検査装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |