IT1113297B - Sistema e procedimento per collaudare circuiti integrati - Google Patents
Sistema e procedimento per collaudare circuiti integratiInfo
- Publication number
- IT1113297B IT1113297B IT47813/79A IT4781379A IT1113297B IT 1113297 B IT1113297 B IT 1113297B IT 47813/79 A IT47813/79 A IT 47813/79A IT 4781379 A IT4781379 A IT 4781379A IT 1113297 B IT1113297 B IT 1113297B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- integrated circuits
- testing integrated
- testing
- circuits
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US87356478A | 1978-01-30 | 1978-01-30 | |
US05/893,118 US4195259A (en) | 1978-04-04 | 1978-04-04 | Multiprobe test system and method of using same |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7947813A0 IT7947813A0 (it) | 1979-01-29 |
IT1113297B true IT1113297B (it) | 1986-01-20 |
Family
ID=27128303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT47813/79A IT1113297B (it) | 1978-01-30 | 1979-01-29 | Sistema e procedimento per collaudare circuiti integrati |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS54145482A (it) |
DE (1) | DE2903517A1 (it) |
FR (1) | FR2425148B1 (it) |
GB (2) | GB2014315B (it) |
IT (1) | IT1113297B (it) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0028719B1 (en) * | 1979-11-05 | 1984-05-30 | Texas Instruments Incorporated | Probe assembly for testing integrated circuits |
JPS58164236U (ja) * | 1982-04-27 | 1983-11-01 | 日本電気ホームエレクトロニクス株式会社 | 半導体ウエ−ハ特性測定装置 |
IL79820A0 (en) * | 1985-09-26 | 1986-11-30 | Tektronix Inc | Wafer probe head,and method of assembling same |
US4758785A (en) * | 1986-09-03 | 1988-07-19 | Tektronix, Inc. | Pressure control apparatus for use in an integrated circuit testing station |
US4673839A (en) * | 1986-09-08 | 1987-06-16 | Tektronix, Inc. | Piezoelectric pressure sensing apparatus for integrated circuit testing stations |
US5012186A (en) * | 1990-06-08 | 1991-04-30 | Cascade Microtech, Inc. | Electrical probe with contact force protection |
EP0547251A1 (en) * | 1991-12-14 | 1993-06-23 | International Business Machines Corporation | A method for testing a micro circuit |
DE19952943C2 (de) * | 1999-11-03 | 2003-07-03 | Infineon Technologies Ag | Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte |
DE10143173A1 (de) | 2000-12-04 | 2002-06-06 | Cascade Microtech Inc | Wafersonde |
WO2004083873A2 (en) | 2003-03-14 | 2004-09-30 | Applied Precision, Llc | Adjusting device for the planarization of probe sets of a probe card |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
WO2005065258A2 (en) | 2003-12-24 | 2005-07-21 | Cascade Microtech, Inc. | Active wafer probe |
WO2006031646A2 (en) | 2004-09-13 | 2006-03-23 | Cascade Microtech, Inc. | Double sided probing structures |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
CN107015137B (zh) * | 2017-05-26 | 2023-12-08 | 深圳市赛伦北斗科技有限责任公司 | 一种电路板检测装置、系统及方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1063381A (en) * | 1963-01-18 | 1967-03-30 | Wilmot Breeden Ltd | Improvements in or relating to surface testing apparatus |
US3446065A (en) * | 1965-08-11 | 1969-05-27 | Transistor Automation Corp | Automatic probing apparatus |
US3810017A (en) * | 1972-05-15 | 1974-05-07 | Teledyne Inc | Precision probe for testing micro-electronic units |
US3849728A (en) * | 1973-08-21 | 1974-11-19 | Wentworth Labor Inc | Fixed point probe card and an assembly and repair fixture therefor |
JPS5178692A (it) * | 1974-12-29 | 1976-07-08 | Sony Corp |
-
1979
- 1979-01-29 IT IT47813/79A patent/IT1113297B/it active
- 1979-01-29 GB GB7903073A patent/GB2014315B/en not_active Expired
- 1979-01-29 GB GB8127051A patent/GB2094479B/en not_active Expired
- 1979-01-30 FR FR7902318A patent/FR2425148B1/fr not_active Expired
- 1979-01-30 DE DE19792903517 patent/DE2903517A1/de not_active Withdrawn
- 1979-01-30 JP JP961479A patent/JPS54145482A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
IT7947813A0 (it) | 1979-01-29 |
GB2014315B (en) | 1983-02-02 |
JPH039425B2 (it) | 1991-02-08 |
DE2903517A1 (de) | 1979-08-02 |
GB2094479B (en) | 1983-03-16 |
FR2425148B1 (it) | 1985-06-28 |
GB2014315A (en) | 1979-08-22 |
JPS54145482A (en) | 1979-11-13 |
GB2094479A (en) | 1982-09-15 |
FR2425148A1 (it) | 1979-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19950111 |