IT1113297B - Sistema e procedimento per collaudare circuiti integrati - Google Patents

Sistema e procedimento per collaudare circuiti integrati

Info

Publication number
IT1113297B
IT1113297B IT47813/79A IT4781379A IT1113297B IT 1113297 B IT1113297 B IT 1113297B IT 47813/79 A IT47813/79 A IT 47813/79A IT 4781379 A IT4781379 A IT 4781379A IT 1113297 B IT1113297 B IT 1113297B
Authority
IT
Italy
Prior art keywords
procedure
integrated circuits
testing integrated
testing
circuits
Prior art date
Application number
IT47813/79A
Other languages
English (en)
Other versions
IT7947813A0 (it
Inventor
Lee R Reid
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/893,118 external-priority patent/US4195259A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of IT7947813A0 publication Critical patent/IT7947813A0/it
Application granted granted Critical
Publication of IT1113297B publication Critical patent/IT1113297B/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
IT47813/79A 1978-01-30 1979-01-29 Sistema e procedimento per collaudare circuiti integrati IT1113297B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87356478A 1978-01-30 1978-01-30
US05/893,118 US4195259A (en) 1978-04-04 1978-04-04 Multiprobe test system and method of using same

Publications (2)

Publication Number Publication Date
IT7947813A0 IT7947813A0 (it) 1979-01-29
IT1113297B true IT1113297B (it) 1986-01-20

Family

ID=27128303

Family Applications (1)

Application Number Title Priority Date Filing Date
IT47813/79A IT1113297B (it) 1978-01-30 1979-01-29 Sistema e procedimento per collaudare circuiti integrati

Country Status (5)

Country Link
JP (1) JPS54145482A (it)
DE (1) DE2903517A1 (it)
FR (1) FR2425148B1 (it)
GB (2) GB2014315B (it)
IT (1) IT1113297B (it)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0028719B1 (en) * 1979-11-05 1984-05-30 Texas Instruments Incorporated Probe assembly for testing integrated circuits
JPS58164236U (ja) * 1982-04-27 1983-11-01 日本電気ホームエレクトロニクス株式会社 半導体ウエ−ハ特性測定装置
IL79820A0 (en) * 1985-09-26 1986-11-30 Tektronix Inc Wafer probe head,and method of assembling same
US4758785A (en) * 1986-09-03 1988-07-19 Tektronix, Inc. Pressure control apparatus for use in an integrated circuit testing station
US4673839A (en) * 1986-09-08 1987-06-16 Tektronix, Inc. Piezoelectric pressure sensing apparatus for integrated circuit testing stations
US5012186A (en) * 1990-06-08 1991-04-30 Cascade Microtech, Inc. Electrical probe with contact force protection
EP0547251A1 (en) * 1991-12-14 1993-06-23 International Business Machines Corporation A method for testing a micro circuit
DE19952943C2 (de) * 1999-11-03 2003-07-03 Infineon Technologies Ag Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
WO2004083873A2 (en) 2003-03-14 2004-09-30 Applied Precision, Llc Adjusting device for the planarization of probe sets of a probe card
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
WO2005065258A2 (en) 2003-12-24 2005-07-21 Cascade Microtech, Inc. Active wafer probe
WO2006031646A2 (en) 2004-09-13 2006-03-23 Cascade Microtech, Inc. Double sided probing structures
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
CN107015137B (zh) * 2017-05-26 2023-12-08 深圳市赛伦北斗科技有限责任公司 一种电路板检测装置、系统及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1063381A (en) * 1963-01-18 1967-03-30 Wilmot Breeden Ltd Improvements in or relating to surface testing apparatus
US3446065A (en) * 1965-08-11 1969-05-27 Transistor Automation Corp Automatic probing apparatus
US3810017A (en) * 1972-05-15 1974-05-07 Teledyne Inc Precision probe for testing micro-electronic units
US3849728A (en) * 1973-08-21 1974-11-19 Wentworth Labor Inc Fixed point probe card and an assembly and repair fixture therefor
JPS5178692A (it) * 1974-12-29 1976-07-08 Sony Corp

Also Published As

Publication number Publication date
IT7947813A0 (it) 1979-01-29
GB2014315B (en) 1983-02-02
JPH039425B2 (it) 1991-02-08
DE2903517A1 (de) 1979-08-02
GB2094479B (en) 1983-03-16
FR2425148B1 (it) 1985-06-28
GB2014315A (en) 1979-08-22
JPS54145482A (en) 1979-11-13
GB2094479A (en) 1982-09-15
FR2425148A1 (it) 1979-11-30

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19950111