JPH039425B2 - - Google Patents
Info
- Publication number
- JPH039425B2 JPH039425B2 JP54009614A JP961479A JPH039425B2 JP H039425 B2 JPH039425 B2 JP H039425B2 JP 54009614 A JP54009614 A JP 54009614A JP 961479 A JP961479 A JP 961479A JP H039425 B2 JPH039425 B2 JP H039425B2
- Authority
- JP
- Japan
- Prior art keywords
- probes
- semiconductor wafer
- probe
- integrated circuit
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 claims description 208
- 239000004065 semiconductor Substances 0.000 claims description 104
- 238000012360 testing method Methods 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 7
- 238000012544 monitoring process Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 238000010998 test method Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 230000005489 elastic deformation Effects 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 40
- 239000000463 material Substances 0.000 description 28
- 238000007689 inspection Methods 0.000 description 12
- 239000011888 foil Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87356478A | 1978-01-30 | 1978-01-30 | |
| US05/893,118 US4195259A (en) | 1978-04-04 | 1978-04-04 | Multiprobe test system and method of using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54145482A JPS54145482A (en) | 1979-11-13 |
| JPH039425B2 true JPH039425B2 (it) | 1991-02-08 |
Family
ID=27128303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP961479A Granted JPS54145482A (en) | 1978-01-30 | 1979-01-30 | Ic test probe |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS54145482A (it) |
| DE (1) | DE2903517A1 (it) |
| FR (1) | FR2425148B1 (it) |
| GB (2) | GB2094479B (it) |
| IT (1) | IT1113297B (it) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0028719B1 (en) * | 1979-11-05 | 1984-05-30 | Texas Instruments Incorporated | Probe assembly for testing integrated circuits |
| JPS58164236U (ja) * | 1982-04-27 | 1983-11-01 | 日本電気ホームエレクトロニクス株式会社 | 半導体ウエ−ハ特性測定装置 |
| IL79820A0 (en) * | 1985-09-26 | 1986-11-30 | Tektronix Inc | Wafer probe head,and method of assembling same |
| US4758785A (en) * | 1986-09-03 | 1988-07-19 | Tektronix, Inc. | Pressure control apparatus for use in an integrated circuit testing station |
| US4673839A (en) * | 1986-09-08 | 1987-06-16 | Tektronix, Inc. | Piezoelectric pressure sensing apparatus for integrated circuit testing stations |
| US5012186A (en) * | 1990-06-08 | 1991-04-30 | Cascade Microtech, Inc. | Electrical probe with contact force protection |
| EP0547251A1 (en) * | 1991-12-14 | 1993-06-23 | International Business Machines Corporation | A method for testing a micro circuit |
| DE19952943C2 (de) * | 1999-11-03 | 2003-07-03 | Infineon Technologies Ag | Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte |
| DE10143173A1 (de) | 2000-12-04 | 2002-06-06 | Cascade Microtech Inc | Wafersonde |
| US7633306B2 (en) | 2003-03-14 | 2009-12-15 | Rudolph Technologies, Inc. | System and method of measuring probe float |
| US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
| DE112004002554T5 (de) | 2003-12-24 | 2006-11-23 | Cascade Microtech, Inc., Beaverton | Active wafer probe |
| JP2008512680A (ja) | 2004-09-13 | 2008-04-24 | カスケード マイクロテック インコーポレイテッド | 両面プロービング構造体 |
| US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
| US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
| US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
| US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
| US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
| US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
| CN107015137B (zh) * | 2017-05-26 | 2023-12-08 | 深圳市赛伦北斗科技有限责任公司 | 一种电路板检测装置、系统及方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5178692A (it) * | 1974-12-29 | 1976-07-08 | Sony Corp |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1063381A (en) * | 1963-01-18 | 1967-03-30 | Wilmot Breeden Ltd | Improvements in or relating to surface testing apparatus |
| US3446065A (en) * | 1965-08-11 | 1969-05-27 | Transistor Automation Corp | Automatic probing apparatus |
| US3810017A (en) * | 1972-05-15 | 1974-05-07 | Teledyne Inc | Precision probe for testing micro-electronic units |
| US3849728A (en) * | 1973-08-21 | 1974-11-19 | Wentworth Labor Inc | Fixed point probe card and an assembly and repair fixture therefor |
-
1979
- 1979-01-29 GB GB8127051A patent/GB2094479B/en not_active Expired
- 1979-01-29 IT IT47813/79A patent/IT1113297B/it active
- 1979-01-29 GB GB7903073A patent/GB2014315B/en not_active Expired
- 1979-01-30 DE DE19792903517 patent/DE2903517A1/de not_active Withdrawn
- 1979-01-30 FR FR7902318A patent/FR2425148B1/fr not_active Expired
- 1979-01-30 JP JP961479A patent/JPS54145482A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5178692A (it) * | 1974-12-29 | 1976-07-08 | Sony Corp |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54145482A (en) | 1979-11-13 |
| GB2014315B (en) | 1983-02-02 |
| GB2094479A (en) | 1982-09-15 |
| FR2425148A1 (it) | 1979-11-30 |
| IT7947813A0 (it) | 1979-01-29 |
| GB2094479B (en) | 1983-03-16 |
| GB2014315A (en) | 1979-08-22 |
| DE2903517A1 (de) | 1979-08-02 |
| FR2425148B1 (it) | 1985-06-28 |
| IT1113297B (it) | 1986-01-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH039425B2 (it) | ||
| US4195259A (en) | Multiprobe test system and method of using same | |
| US7956627B2 (en) | Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device | |
| JPS6330585B2 (it) | ||
| JP3502874B2 (ja) | 接続装置およびその製造方法 | |
| JPH07321170A (ja) | Ｉｃ回路試験用プローブ集成体 | |
| JPH05243344A (ja) | バンプ接点付薄膜プローブ緩衝システム | |
| WO2005003793A1 (ja) | プローブカード及びプローブシートまたはプローブカードを用いた半導体検査装置および半導体装置の製造方法 | |
| KR20070053696A (ko) | 멤브레인 서스펜디드 프로브를 구비한 프로브 헤드 | |
| JPH10111315A (ja) | プローブカードおよびこれを用いた試験装置 | |
| JP2799973B2 (ja) | 垂直作動式プローブカード | |
| KR960015985B1 (ko) | 칩 테스트 방법 및 테스트 시스템 | |
| WO1999048147A1 (fr) | Procede pour fabriquer un dispositif semiconducteur | |
| WO2001096885A1 (en) | Connector apparatus | |
| JPH077052A (ja) | 電気特性測定用プローブ | |
| JPH10132855A (ja) | Ｉｃ検査用プローブカード | |
| KR20200063009A (ko) | 프로브 카드 | |
| JPH0562310B2 (it) | ||
| JP4679059B2 (ja) | パワー半導体素子の試験装置およびこれを用いた試験方法 | |
| JP2004029035A (ja) | 接続装置 | |
| JPH0541417A (ja) | プローブカード | |
| JP2665171B2 (ja) | プローブカード及びその使用方法 | |
| JPS6276733A (ja) | ウエハプロ−ブヘツド | |
| KR830000281B1 (ko) | 푸로브 접점을 결정하기 위한 방법 | |
| JP3249865B2 (ja) | 半導体集積回路装置の製造方法 |