JPS54145482A - Ic test probe - Google Patents

Ic test probe

Info

Publication number
JPS54145482A
JPS54145482A JP961479A JP961479A JPS54145482A JP S54145482 A JPS54145482 A JP S54145482A JP 961479 A JP961479 A JP 961479A JP 961479 A JP961479 A JP 961479A JP S54145482 A JPS54145482 A JP S54145482A
Authority
JP
Japan
Prior art keywords
test probe
probe
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP961479A
Other languages
Japanese (ja)
Other versions
JPH039425B2 (en
Inventor
Aaru Riido Rii
Aaru Ratsutorifu Chiyaaruzu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/893,118 external-priority patent/US4195259A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPS54145482A publication Critical patent/JPS54145482A/en
Publication of JPH039425B2 publication Critical patent/JPH039425B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP961479A 1978-01-30 1979-01-30 Ic test probe Granted JPS54145482A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87356478A 1978-01-30 1978-01-30
US05/893,118 US4195259A (en) 1978-04-04 1978-04-04 Multiprobe test system and method of using same

Publications (2)

Publication Number Publication Date
JPS54145482A true JPS54145482A (en) 1979-11-13
JPH039425B2 JPH039425B2 (en) 1991-02-08

Family

ID=27128303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP961479A Granted JPS54145482A (en) 1978-01-30 1979-01-30 Ic test probe

Country Status (5)

Country Link
JP (1) JPS54145482A (en)
DE (1) DE2903517A1 (en)
FR (1) FR2425148B1 (en)
GB (2) GB2014315B (en)
IT (1) IT1113297B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164236U (en) * 1982-04-27 1983-11-01 日本電気ホームエレクトロニクス株式会社 Semiconductor wafer characteristic measurement equipment
JPS6367742A (en) * 1986-09-03 1988-03-26 テクトロニックス・インコーポレイテッド Pressure controller for integrated circuit testing station
JPS63184349A (en) * 1986-09-08 1988-07-29 テクトロニックス・インコーポレイテッド Pressure detector for integrated circuit testing station

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0028719B1 (en) * 1979-11-05 1984-05-30 Texas Instruments Incorporated Probe assembly for testing integrated circuits
IL79820A0 (en) * 1985-09-26 1986-11-30 Tektronix Inc Wafer probe head,and method of assembling same
US5012186A (en) * 1990-06-08 1991-04-30 Cascade Microtech, Inc. Electrical probe with contact force protection
EP0547251A1 (en) * 1991-12-14 1993-06-23 International Business Machines Corporation A method for testing a micro circuit
DE19952943C2 (en) * 1999-11-03 2003-07-03 Infineon Technologies Ag Needle card adjustment device for the planarization of needle sets of a needle card
DE20114544U1 (en) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. wafer probe
WO2004083873A2 (en) * 2003-03-14 2004-09-30 Applied Precision, Llc Adjusting device for the planarization of probe sets of a probe card
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
DE202004021093U1 (en) 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Differential probe for e.g. integrated circuit, has elongate probing units interconnected to respective active circuits that are interconnected to substrate by respective pair of flexible interconnects
WO2006031646A2 (en) 2004-09-13 2006-03-23 Cascade Microtech, Inc. Double sided probing structures
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
CN107015137B (en) * 2017-05-26 2023-12-08 深圳市赛伦北斗科技有限责任公司 Circuit board detection device, system and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5178692A (en) * 1974-12-29 1976-07-08 Sony Corp

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1063381A (en) * 1963-01-18 1967-03-30 Wilmot Breeden Ltd Improvements in or relating to surface testing apparatus
US3446065A (en) * 1965-08-11 1969-05-27 Transistor Automation Corp Automatic probing apparatus
US3810017A (en) * 1972-05-15 1974-05-07 Teledyne Inc Precision probe for testing micro-electronic units
US3849728A (en) * 1973-08-21 1974-11-19 Wentworth Labor Inc Fixed point probe card and an assembly and repair fixture therefor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5178692A (en) * 1974-12-29 1976-07-08 Sony Corp

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164236U (en) * 1982-04-27 1983-11-01 日本電気ホームエレクトロニクス株式会社 Semiconductor wafer characteristic measurement equipment
JPS6367742A (en) * 1986-09-03 1988-03-26 テクトロニックス・インコーポレイテッド Pressure controller for integrated circuit testing station
JPH0345540B2 (en) * 1986-09-03 1991-07-11 Tektronix Inc
JPS63184349A (en) * 1986-09-08 1988-07-29 テクトロニックス・インコーポレイテッド Pressure detector for integrated circuit testing station
JPH0345541B2 (en) * 1986-09-08 1991-07-11 Tektronix Inc

Also Published As

Publication number Publication date
GB2014315B (en) 1983-02-02
IT1113297B (en) 1986-01-20
DE2903517A1 (en) 1979-08-02
GB2014315A (en) 1979-08-22
FR2425148A1 (en) 1979-11-30
JPH039425B2 (en) 1991-02-08
GB2094479A (en) 1982-09-15
FR2425148B1 (en) 1985-06-28
GB2094479B (en) 1983-03-16
IT7947813A0 (en) 1979-01-29

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