GB2014315A - Determining Probe Contact - Google Patents

Determining Probe Contact

Info

Publication number
GB2014315A
GB2014315A GB7903073A GB7903073A GB2014315A GB 2014315 A GB2014315 A GB 2014315A GB 7903073 A GB7903073 A GB 7903073A GB 7903073 A GB7903073 A GB 7903073A GB 2014315 A GB2014315 A GB 2014315A
Authority
GB
United Kingdom
Prior art keywords
probe
detector
data
attached
conductive arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7903073A
Other versions
GB2014315B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/893,118 external-priority patent/US4195259A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB2014315A publication Critical patent/GB2014315A/en
Application granted granted Critical
Publication of GB2014315B publication Critical patent/GB2014315B/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A probe for testing integrated circuit components includes a support body 12, and a conductive arm 18 supported and attached thereto in an angular fashion. A probe tip in the form of a needle 24 extends from and is attached to the conductive arm and has a downwardly positioned point for contact with a surface having integrated circuits thereon. A force sensitive material 28, e.g. piezoelectric, is attached to but electrically insulated from the conductive arm and has conductor leads 32 extending therefrom. The plane of the probe tip may be adjusted by screw 20. In addition, a multiprobe test system is disclosed for testing microcircuits which includes a printed circuit board having a plurality of data- detector probes attached for z-axis control and edge detection. A detector circuit having a plurality of channels receives signals delivered by the force sensitive material of each data- detector probe enabling the monitoring of planarization of the data-detector probe tips as well as controlling the over-travel of the probe tip into the surface having integrated circuits defined thereon. A method of using the multiprobe test system having a probe card with a plurality of data detector probes located thereon is also disclosed. <IMAGE>
GB7903073A 1978-01-30 1979-01-29 Determining probe contact Expired GB2014315B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87356478A 1978-01-30 1978-01-30
US05/893,118 US4195259A (en) 1978-04-04 1978-04-04 Multiprobe test system and method of using same

Publications (2)

Publication Number Publication Date
GB2014315A true GB2014315A (en) 1979-08-22
GB2014315B GB2014315B (en) 1983-02-02

Family

ID=27128303

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8127051A Expired GB2094479B (en) 1978-01-30 1979-01-29 Determining probe contact in testing integrated circuits
GB7903073A Expired GB2014315B (en) 1978-01-30 1979-01-29 Determining probe contact

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB8127051A Expired GB2094479B (en) 1978-01-30 1979-01-29 Determining probe contact in testing integrated circuits

Country Status (5)

Country Link
JP (1) JPS54145482A (en)
DE (1) DE2903517A1 (en)
FR (1) FR2425148B1 (en)
GB (2) GB2094479B (en)
IT (1) IT1113297B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0028719A1 (en) * 1979-11-05 1981-05-20 Texas Instruments Incorporated Probe assembly for testing integrated circuits
EP0460911A2 (en) * 1990-06-08 1991-12-11 Cascade Microtech, Inc. Electrical probe with contact force protection
EP1098200A2 (en) * 1999-11-03 2001-05-09 Infineon Technologies AG Adjusting device for the planarization of probe sets of a probe card
WO2004083873A2 (en) * 2003-03-14 2004-09-30 Applied Precision, Llc Adjusting device for the planarization of probe sets of a probe card
CN107015137A (en) * 2017-05-26 2017-08-04 深圳市赛伦北斗科技有限责任公司 A kind of circuit board detection device, system and method

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164236U (en) * 1982-04-27 1983-11-01 日本電気ホームエレクトロニクス株式会社 Semiconductor wafer characteristic measurement equipment
IL79820A0 (en) * 1985-09-26 1986-11-30 Tektronix Inc Wafer probe head,and method of assembling same
US4758785A (en) * 1986-09-03 1988-07-19 Tektronix, Inc. Pressure control apparatus for use in an integrated circuit testing station
US4673839A (en) * 1986-09-08 1987-06-16 Tektronix, Inc. Piezoelectric pressure sensing apparatus for integrated circuit testing stations
EP0547251A1 (en) * 1991-12-14 1993-06-23 International Business Machines Corporation A method for testing a micro circuit
DE20114544U1 (en) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. wafer probe
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
JP2007517231A (en) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド Active wafer probe
KR20070058522A (en) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 Double sided probing structures
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1063381A (en) * 1963-01-18 1967-03-30 Wilmot Breeden Ltd Improvements in or relating to surface testing apparatus
US3446065A (en) * 1965-08-11 1969-05-27 Transistor Automation Corp Automatic probing apparatus
US3810017A (en) * 1972-05-15 1974-05-07 Teledyne Inc Precision probe for testing micro-electronic units
US3849728A (en) * 1973-08-21 1974-11-19 Wentworth Labor Inc Fixed point probe card and an assembly and repair fixture therefor
JPS5178692A (en) * 1974-12-29 1976-07-08 Sony Corp

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0028719A1 (en) * 1979-11-05 1981-05-20 Texas Instruments Incorporated Probe assembly for testing integrated circuits
EP0460911A2 (en) * 1990-06-08 1991-12-11 Cascade Microtech, Inc. Electrical probe with contact force protection
EP0460911A3 (en) * 1990-06-08 1992-08-19 Cascade Microtech, Inc. Electrical probe with contact force protection
EP1098200A2 (en) * 1999-11-03 2001-05-09 Infineon Technologies AG Adjusting device for the planarization of probe sets of a probe card
EP1098200A3 (en) * 1999-11-03 2003-08-13 Infineon Technologies AG Adjusting device for the planarization of probe sets of a probe card
WO2004083873A2 (en) * 2003-03-14 2004-09-30 Applied Precision, Llc Adjusting device for the planarization of probe sets of a probe card
WO2004083873A3 (en) * 2003-03-14 2004-12-02 Applied Precision Llc Adjusting device for the planarization of probe sets of a probe card
US7633306B2 (en) 2003-03-14 2009-12-15 Rudolph Technologies, Inc. System and method of measuring probe float
US8089292B2 (en) 2003-03-14 2012-01-03 Rudolph Technologies, Inc. System and method of measuring probe float
CN107015137A (en) * 2017-05-26 2017-08-04 深圳市赛伦北斗科技有限责任公司 A kind of circuit board detection device, system and method
CN107015137B (en) * 2017-05-26 2023-12-08 深圳市赛伦北斗科技有限责任公司 Circuit board detection device, system and method

Also Published As

Publication number Publication date
FR2425148B1 (en) 1985-06-28
IT1113297B (en) 1986-01-20
GB2094479B (en) 1983-03-16
JPS54145482A (en) 1979-11-13
IT7947813A0 (en) 1979-01-29
JPH039425B2 (en) 1991-02-08
GB2094479A (en) 1982-09-15
GB2014315B (en) 1983-02-02
DE2903517A1 (en) 1979-08-02
FR2425148A1 (en) 1979-11-30

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Effective date: 19990128