JPH04115545A - Probe card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an IC chip for testing the electrical characteristics of an IC chip.
The present invention relates to a probe card for a wafer test device.

[Conventional technology]

Fig. 3 is a partially exploded perspective view showing the configuration of a conventional IC wafer test device, and Fig. 4 is a partially broken exploded view showing the state in which the probe card shown in Fig. 3 is in contact with an IC chip inside an IC wafer. The perspective view and FIG. 5 show a top view in the state of FIG. 4.

In the figure, (2) is a probe card, (3) is a probe card needle, (4) is an IC wafer, (5) is an IC chip, (6) is an electrode pad, (7) is a stage, and (8) is a temperature It is a sensor.

Next, the operation will be explained.

A conductive probe card needle (3), which is part of the structure of the IC probe card (2), is brought into contact with the stage (7) of the wafer test equipment, and the electricity of the IC chip (5) is detected through the probe card needle (3). Measure physical characteristics.

IC measurements include measurements that guarantee temperature, but the above measurements are
When temperature measurement is performed on the C chip (5), the temperature measurement is conventionally performed on the stage (
7) by means of a temperature sensor (8) integrated in the temperature sensor (8).

[Problem to be solved by the invention]

Conventional probe cards are configured as described above, so when performing temperature guaranteed measurements using IC wafer test equipment, the temperature inside the stage is being measured, making it difficult to accurately measure the temperature of the IC chip. There was a problem that it wasn't.

The present invention was made to solve the above-mentioned problems, and an object of the present invention is to obtain a probe card that can accurately measure the temperature of an IC chip.

[Means to solve the problem]

The probe card according to the present invention is composed of a probe card needle that is brought into contact with the electrode pads of the IC chip and a temperature sensor that is brought into contact with areas other than the electrode pads of the 1.0 chip in order to measure the electrical characteristics of the IC chip. be.

[Effect]

In the probe card according to the present invention, the built-in temperature sensor comes into contact with the IC chip and can accurately measure the temperature of the IC chip.

[Embodiment] Hereinafter, an embodiment of a probe card according to the present invention will be described with reference to the drawings.

FIG. 1 is a partially exploded perspective view showing a state when a probe card is brought into contact with an IC chip in an IC wafer, and FIG. 2 is a top view of the state shown in FIG. 1.

In the figure, (2) to (6) are the same as those shown in the conventional example of FIGS. 3 and 4, and therefore their explanation will be omitted. (
1) When testing the IC chip (5) with the probe card (2), a temperature sensor is configured on the probe card (2) so as to come into contact with an electrically insulated part on the surface of the IC chip (5). It is.

Next, the operation will be explained. When temperature assurance measurement is performed in the IC wafer test equipment, the temperature measurement is performed by a temperature sensor (1) configured on a probe card (2). At this time, the temperature sensor (1) is connected to the IC chip (5) to be measured.
) Since it is in contact with the surface, accurate temperature measurement is possible. Here, since the temperature sensor (1) is in contact with an electrically insulated part on the surface of the IC chip (5),
It has no effect on the electrical characteristics measurement in 5).

Further, the IC wafer test device composed of the probe card (2) is capable of measuring heat generation, etc. of the IC chip (5) itself at room temperature.

[Effects of the Invention] As described above, according to the present invention, there is an effect that temperature guaranteed measurement of an IC chip can be performed more accurately.

[Brief explanation of drawings]

FIG. 1 is a partially exploded perspective view showing the state when the probe card is brought into contact with an IC chip in an IC wafer according to an embodiment of the probe card according to the present invention, and FIG. 2 shows the state shown in FIG. 1. 3 is a partially exploded exploded perspective view showing part of the configuration of a conventional IC wafer test device, and FIG. 4 is a top view of the IC wafer test device.
FIG. 5 is a partially exploded perspective view showing a state in which the probe card of FIG. 3 is in contact with an IC chip in a C wafer, and FIG. 5 is a top view of the state shown in FIG. 4. In the figure, (1) is a temperature sensor, (2) is a probe card, (3) is a probe card needle, (4) is an IC wafer, (5) is an IC chip, and (6) is an electrode pad. In addition, the same symbols in each figure indicate the same or equivalent parts.

Claims (1)

[Claims] In an IC wafer test device that tests the electrical characteristics of an IC chip, a probe card that has many contacts to IC chip electrodes has a temperature sensor that measures the temperature of the IC chip itself. A probe card characterized by the built-in probe card.