SE7901535L - Halvledaranordning - Google Patents

Halvledaranordning

Info

Publication number
SE7901535L
SE7901535L SE7901535A SE7901535A SE7901535L SE 7901535 L SE7901535 L SE 7901535L SE 7901535 A SE7901535 A SE 7901535A SE 7901535 A SE7901535 A SE 7901535A SE 7901535 L SE7901535 L SE 7901535L
Authority
SE
Sweden
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
SE7901535A
Other languages
English (en)
Other versions
SE429802B (sv
Inventor
G Eriksson
A Nilarp
Original Assignee
Asea Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Ab filed Critical Asea Ab
Priority to SE7901535A priority Critical patent/SE429802B/sv
Priority to US06/121,155 priority patent/US4370671A/en
Priority to BR8000967A priority patent/BR8000967A/pt
Priority to JP1893880A priority patent/JPS55113354A/ja
Priority to DE19803006023 priority patent/DE3006023A1/de
Priority to CA000346045A priority patent/CA1149084A/en
Priority to GB8005777A priority patent/GB2046992B/en
Publication of SE7901535L publication Critical patent/SE7901535L/sv
Publication of SE429802B publication Critical patent/SE429802B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/926—Elongated lead extending axially through another elongated lead

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
SE7901535A 1979-02-21 1979-02-21 Halvledaranordning innefattande en tetande ringformad kropp av en sulfonpolymer eller av polyfenylensulfid SE429802B (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SE7901535A SE429802B (sv) 1979-02-21 1979-02-21 Halvledaranordning innefattande en tetande ringformad kropp av en sulfonpolymer eller av polyfenylensulfid
US06/121,155 US4370671A (en) 1979-02-21 1980-02-13 Semiconductor device
BR8000967A BR8000967A (pt) 1979-02-21 1980-02-15 Dispositivo semicondutor
JP1893880A JPS55113354A (en) 1979-02-21 1980-02-18 Semiconductor device
DE19803006023 DE3006023A1 (de) 1979-02-21 1980-02-18 Halbleiteranordnung
CA000346045A CA1149084A (en) 1979-02-21 1980-02-20 Semiconductor device enclosure
GB8005777A GB2046992B (en) 1979-02-21 1980-02-20 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7901535A SE429802B (sv) 1979-02-21 1979-02-21 Halvledaranordning innefattande en tetande ringformad kropp av en sulfonpolymer eller av polyfenylensulfid

Publications (2)

Publication Number Publication Date
SE7901535L true SE7901535L (sv) 1980-08-22
SE429802B SE429802B (sv) 1983-09-26

Family

ID=20337353

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7901535A SE429802B (sv) 1979-02-21 1979-02-21 Halvledaranordning innefattande en tetande ringformad kropp av en sulfonpolymer eller av polyfenylensulfid

Country Status (7)

Country Link
US (1) US4370671A (sv)
JP (1) JPS55113354A (sv)
BR (1) BR8000967A (sv)
CA (1) CA1149084A (sv)
DE (1) DE3006023A1 (sv)
GB (1) GB2046992B (sv)
SE (1) SE429802B (sv)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143849A (en) * 1981-03-02 1982-09-06 Toshiba Corp Flat semiconductor element
DE3308661A1 (de) * 1983-03-11 1984-09-20 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterelement
JPS6060172U (ja) * 1983-09-13 1985-04-26 本田技研工業株式会社 整流器付トランス装置
DE3421672A1 (de) * 1984-06-09 1985-12-12 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Wechsellastbestaendiges, schaltbares halbleiterbauelement
GB2162366B (en) * 1984-07-24 1987-09-30 Westinghouse Brake & Signal Semiconductor device contact arrangements
JPS62269322A (ja) * 1986-05-17 1987-11-21 Toshiba Corp 電力用半導体装置
JPH0760893B2 (ja) * 1989-11-06 1995-06-28 三菱電機株式会社 半導体装置およびその製造方法
CN105934821B (zh) * 2014-01-21 2018-11-23 Abb瑞士股份有限公司 功率半导体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH506184A (de) * 1967-11-29 1971-04-15 Ckd Praha Halbleiterbauelement
US3772248A (en) * 1972-10-30 1973-11-13 Minnesota Mining & Mfg Polyether/polyarylsulfones
DE2630320A1 (de) * 1976-07-06 1978-01-12 Licentia Gmbh Scheibenfoermige halbleiterzelle mit einem ringfoermigen gehaeuse
US4093958A (en) * 1976-12-09 1978-06-06 Motorola, Inc. Semiconductor device assembly with improved fatigue resistance
US4278784A (en) * 1980-02-06 1981-07-14 Western Electric Company, Inc. Encapsulated electronic devices and encapsulating compositions

Also Published As

Publication number Publication date
GB2046992A (en) 1980-11-19
DE3006023A1 (de) 1980-09-04
US4370671A (en) 1983-01-25
GB2046992B (en) 1983-05-18
CA1149084A (en) 1983-06-28
SE429802B (sv) 1983-09-26
BR8000967A (pt) 1980-10-29
JPS55113354A (en) 1980-09-01

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