CH506184A - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
CH506184A
CH506184A CH1686168A CH1686168A CH506184A CH 506184 A CH506184 A CH 506184A CH 1686168 A CH1686168 A CH 1686168A CH 1686168 A CH1686168 A CH 1686168A CH 506184 A CH506184 A CH 506184A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Application number
CH1686168A
Other languages
English (en)
Inventor
Bezouska Pruhonico Vlastimil
Pivrnec Dr Kloboucnicka Jan
Hrdlicka Zubateho Jiri
Krasa Ciklova Evzen
Smekal Jihlavska Zdenek
Original Assignee
Ckd Praha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Praha filed Critical Ckd Praha
Publication of CH506184A publication Critical patent/CH506184A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
CH1686168A 1967-11-29 1968-11-12 Halbleiterbauelement CH506184A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS845167 1967-11-29

Publications (1)

Publication Number Publication Date
CH506184A true CH506184A (de) 1971-04-15

Family

ID=5435025

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1686168A CH506184A (de) 1967-11-29 1968-11-12 Halbleiterbauelement

Country Status (6)

Country Link
US (1) US3518507A (de)
CH (1) CH506184A (de)
DE (2) DE1808691A1 (de)
FR (1) FR1595870A (de)
GB (1) GB1217964A (de)
NL (1) NL6817017A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3746947A (en) * 1969-03-15 1973-07-17 Mitsubishi Electric Corp Semiconductor device
DE2014289A1 (de) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
SE429802B (sv) * 1979-02-21 1983-09-26 Asea Ab Halvledaranordning innefattande en tetande ringformad kropp av en sulfonpolymer eller av polyfenylensulfid
JPS5635443A (en) 1979-08-31 1981-04-08 Toshiba Corp Semiconductor device
JP3259599B2 (ja) * 1995-06-20 2002-02-25 三菱電機株式会社 圧接型半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3313987A (en) * 1964-04-22 1967-04-11 Int Rectifier Corp Compression bonded semiconductor device
US3437887A (en) * 1966-06-03 1969-04-08 Westinghouse Electric Corp Flat package encapsulation of electrical devices

Also Published As

Publication number Publication date
US3518507A (en) 1970-06-30
FR1595870A (de) 1970-06-15
DE1808691A1 (de) 1969-06-19
NL6817017A (de) 1969-06-02
GB1217964A (en) 1971-01-06
DE6806745U (de) 1971-01-28

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Legal Events

Date Code Title Description
PL Patent ceased