CH497790A - Halbleiterelement - Google Patents

Halbleiterelement

Info

Publication number
CH497790A
CH497790A CH1693368A CH1693368A CH497790A CH 497790 A CH497790 A CH 497790A CH 1693368 A CH1693368 A CH 1693368A CH 1693368 A CH1693368 A CH 1693368A CH 497790 A CH497790 A CH 497790A
Authority
CH
Switzerland
Prior art keywords
semiconductor element
semiconductor
Prior art date
Application number
CH1693368A
Other languages
English (en)
Inventor
Nakata Josuke
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CH497790A publication Critical patent/CH497790A/de

Links

Classifications

    • H—ELECTRICITY
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    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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    • H01L23/3157—Partial encapsulation or coating
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
CH1693368A 1967-11-15 1968-11-13 Halbleiterelement CH497790A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7354167 1967-11-15
JP6813068 1968-09-20

Publications (1)

Publication Number Publication Date
CH497790A true CH497790A (de) 1970-10-15

Family

ID=26409361

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1693368A CH497790A (de) 1967-11-15 1968-11-13 Halbleiterelement

Country Status (5)

Country Link
CH (1) CH497790A (de)
DE (1) DE1808666B2 (de)
FR (1) FR1601563A (de)
GB (1) GB1219774A (de)
SE (1) SE352985B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5116264B2 (de) * 1971-10-01 1976-05-22
US4745455A (en) * 1986-05-16 1988-05-17 General Electric Company Silicon packages for power semiconductor devices
US4906511A (en) * 1987-02-12 1990-03-06 Kabushiki Kaisha Toshiba Aluminum nitride circuit board
DE3823348A1 (de) * 1988-07-09 1990-02-08 Semikron Elektronik Gmbh Hochleistungs-halbleiterbauelement

Also Published As

Publication number Publication date
DE1808666B2 (de) 1972-07-27
GB1219774A (en) 1971-01-20
FR1601563A (de) 1970-08-31
DE1808666A1 (de) 1970-06-25
SE352985B (de) 1973-01-15

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