JPS6060172U - 整流器付トランス装置 - Google Patents

整流器付トランス装置

Info

Publication number
JPS6060172U
JPS6060172U JP1983140867U JP14086783U JPS6060172U JP S6060172 U JPS6060172 U JP S6060172U JP 1983140867 U JP1983140867 U JP 1983140867U JP 14086783 U JP14086783 U JP 14086783U JP S6060172 U JPS6060172 U JP S6060172U
Authority
JP
Japan
Prior art keywords
rectifier
plates
sandwiched
outer periphery
silicone rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983140867U
Other languages
English (en)
Other versions
JPH0137836Y2 (ja
Inventor
元 辻井
Original Assignee
本田技研工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 本田技研工業株式会社 filed Critical 本田技研工業株式会社
Priority to JP1983140867U priority Critical patent/JPS6060172U/ja
Priority to DE19843405786 priority patent/DE3405786A1/de
Priority to GB08404393A priority patent/GB2146856B/en
Priority to FR8402869A priority patent/FR2551912B1/fr
Priority to CA000448373A priority patent/CA1208696A/en
Priority to US06590383 priority patent/US4571669B1/en
Publication of JPS6060172U publication Critical patent/JPS6060172U/ja
Application granted granted Critical
Publication of JPH0137836Y2 publication Critical patent/JPH0137836Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/30—Features relating to electrodes
    • B23K11/31—Electrode holders and actuating devices therefor
    • B23K11/314—Spot welding guns, e.g. mounted on robots
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/40—Structural association with built-in electric component, e.g. fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/40—Structural association with built-in electric component, e.g. fuse
    • H01F2027/408—Association with diode or rectifier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例の截断平面図、第２図は本案装置の１例
の一部を截除した側面図、第３図はその要部の一部を截
除した正面図、第４図はその一部截断乎面図、第５図は
その変形例の説明線図である。 １・・・−次コイル、２・・・二次コイル、３・・・ト
ランス本体、４・・・二次電極板、５・・・整流器、６
・・・端子板、７・・・ボルト、５　ａ９５　ａ・・・
保持板、５ｂ・・・シールリング、５ｃ・・・半導体層
、４ａｔ６ａ・・・メッキ層、８・・・シール部材。 第５図 ６− ノ １３　６ａ　　　　５ａ　　１３

Claims (1)

    【実用新案登録請求の範囲】
  1. 内部に一部コイル１と二次コイル２とを有するトランス
    本体３の前面に、該二次コイル２に連る二次電極板４と
    、その前面に整流器５を介して端子板６とを備えると共
    に両板４−９８をボルト７その他で互に結着させる式の
    ものにおいて、該整流器５を前後のモリブデンその他の
    保持板５ａ、５ａと、外周のシリコンゴムその他のシー
    ルリング’　　　５ａとを有するシリコンその他の半導
    体層５Ｃから成る半導体素子で構成してこれを両板４，
    ６の互に対向する内面に予め形成される金、銀その他の
    金属メッキ層４ａ、６ａ間に挾持させると共に、その外
    周にこれを囲繞するシリコンゴムその他のシール部材８
    を両板４，６間に挾持させて設けて成る整流器付トラン
    ス装置。
JP1983140867U 1983-09-13 1983-09-13 整流器付トランス装置 Granted JPS6060172U (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP1983140867U JPS6060172U (ja) 1983-09-13 1983-09-13 整流器付トランス装置
DE19843405786 DE3405786A1 (de) 1983-09-13 1984-02-17 Transformator mit gleichrichter
GB08404393A GB2146856B (en) 1983-09-13 1984-02-20 Transformer and rectifier arrangements
FR8402869A FR2551912B1 (fr) 1983-09-13 1984-02-24 Transformateur a redresseur
CA000448373A CA1208696A (en) 1983-09-13 1984-02-27 Transformer with rectifier
US06590383 US4571669B1 (en) 1983-09-13 1984-03-16 Transformer with rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983140867U JPS6060172U (ja) 1983-09-13 1983-09-13 整流器付トランス装置

Publications (2)

Publication Number Publication Date
JPS6060172U true JPS6060172U (ja) 1985-04-26
JPH0137836Y2 JPH0137836Y2 (ja) 1989-11-14

Family

ID=15278587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983140867U Granted JPS6060172U (ja) 1983-09-13 1983-09-13 整流器付トランス装置

Country Status (6)

Country Link
US (1) US4571669B1 (ja)
JP (1) JPS6060172U (ja)
CA (1) CA1208696A (ja)
DE (1) DE3405786A1 (ja)
FR (1) FR2551912B1 (ja)
GB (1) GB2146856B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014533077A (ja) * 2011-10-31 2014-12-08 フロニウス・インテルナツィオナール・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングＦｒｏｎｉｕｓ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｇｍｂｈ 電源およびそのような電源を冷却する方法
WO2023157657A1 (ja) * 2022-02-21 2023-08-24 パナソニックＩｐマネジメント株式会社 溶接トランス

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4682000A (en) * 1985-03-18 1987-07-21 Conrac Corporation Welding transformer and rectifier assembly
US4853762A (en) * 1986-03-27 1989-08-01 International Rectifier Corporation Semi-conductor modules
GB2189343B (en) * 1986-04-02 1990-11-14 Int Rectifier Co Ltd Semi-conductor modules
GB2227126B (en) * 1988-12-27 1993-10-06 Honda Motor Co Ltd Transformer apparatus with rectifiers
DE3900512A1 (de) * 1989-01-10 1990-07-19 Tucker Gmbh Bostik Halbleiterbauelement fuer ein schaltnetzteil
JPH0782952B2 (ja) * 1989-05-15 1995-09-06 本田技研工業株式会社 整流器付トランス装置
DE69115799T2 (de) * 1990-08-28 1996-07-11 Ibm Herstellung von Halbleiterpackungen
DE4103486A1 (de) * 1991-02-06 1992-08-20 Abb Patent Gmbh Anordnung zur kuehlung waermeerzeugender bauelemente
DE4108037C2 (de) * 1991-03-13 1996-05-15 Hess Eng Inc Einrichtung zum lösbaren Befestigen eines gekühlten Diodengleichrichters an einem Transformator
DE29705789U1 (de) 1997-04-02 1997-06-05 Expert Maschbau Transformator
DE102004030845A1 (de) * 2004-06-25 2006-01-12 Harms & Wende Gmbh U. Co Kg Schweißstromwandler
US20070132537A1 (en) * 2005-12-08 2007-06-14 General Electric Company Transformer and method of assembly
DE102007001233A1 (de) * 2007-01-08 2008-07-10 Robert Bosch Gmbh Windungselement für eine Spulenwicklung und Transformatoranordnung
DE102007001234A1 (de) 2007-01-08 2008-07-10 Robert Bosch Gmbh Halbleiterbaugruppe zum Anschluss an eine Transformatorwicklung und Transformatoranordnung
WO2008119083A1 (en) * 2007-03-28 2008-10-02 Cheryl Milone Requesting prior art from the public in exchange for a reward
US7991624B2 (en) * 2007-10-31 2011-08-02 Article One Partners Holdings Method and system for the requesting receipt and exchange of information
AT512064B1 (de) 2011-10-31 2015-11-15 Fronius Int Gmbh Hochstromtransformator, transformatorelement, kontaktplatte und sekundärwicklung sowie verfahren zur herstellung eines solchen hochstromtransformators
AT512069B1 (de) 2011-10-31 2016-01-15 Fronius Int Gmbh Widerstandsschweissvorrichtung
SI25571A (sl) * 2017-12-19 2019-06-28 Univerza v Mariboru Fakulteta za elektrotehniko, računalništvo in informatiko Izvedba transformatorja

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315783U (ja) * 1976-07-21 1978-02-09

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3237079A (en) * 1961-05-05 1966-02-22 Joseph A Mas Compact transformer and rectifier
DE1539645A1 (de) * 1965-05-28 1969-06-26 Asea Ab Halbleiteranordnung
NL136731C (ja) * 1965-06-23
US3771025A (en) * 1969-10-02 1973-11-06 Gen Electric Semiconductor device including low impedance connections
US3668506A (en) * 1971-04-16 1972-06-06 M & T Chemicals Inc Current and fluid conducting arrangements
FR2162275A1 (en) * 1971-12-08 1973-07-20 Sescosem Encapsulated high power semiconductor - with improved heat dissipation
DE2406693C3 (de) * 1974-02-13 1981-01-22 Benteler-Werke Ag Werk Neuhaus, 4790 Paderborn Vorrichtung zur Übertragung von Gleichstrom hoher Stromstärke und geringer Oberwelligkeit auf die rotierende Elektrodenscheibe beim Rollnaht-Widerstandsstumpfschweißen
JPS5197726A (ja) * 1975-02-22 1976-08-27
US4099201A (en) * 1977-04-11 1978-07-04 General Electric Company Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc
JPS5816616B2 (ja) * 1978-12-01 1983-04-01 株式会社日立製作所 半導体装置
SE429802B (sv) * 1979-02-21 1983-09-26 Asea Ab Halvledaranordning innefattande en tetande ringformad kropp av en sulfonpolymer eller av polyfenylensulfid
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315783U (ja) * 1976-07-21 1978-02-09

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014533077A (ja) * 2011-10-31 2014-12-08 フロニウス・インテルナツィオナール・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングＦｒｏｎｉｕｓ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｇｍｂｈ 電源およびそのような電源を冷却する方法
US9641093B2 (en) 2011-10-31 2017-05-02 Fronius International Gmbh Power source and method for cooling such a power source
WO2023157657A1 (ja) * 2022-02-21 2023-08-24 パナソニックＩｐマネジメント株式会社 溶接トランス

Also Published As

Publication number Publication date
FR2551912A1 (fr) 1985-03-15
JPH0137836Y2 (ja) 1989-11-14
US4571669B1 (en) 1996-08-27
US4571669A (en) 1986-02-18
DE3405786A1 (de) 1985-04-04
CA1208696A (en) 1986-07-29
GB2146856A (en) 1985-04-24
GB8404393D0 (en) 1984-03-28
GB2146856B (en) 1987-06-24
FR2551912B1 (fr) 1986-11-21

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