FR2162275A1 - Encapsulated high power semiconductor - with improved heat dissipation - Google Patents

Encapsulated high power semiconductor - with improved heat dissipation

Info

Publication number
FR2162275A1
FR2162275A1 FR7144032A FR7144032A FR2162275A1 FR 2162275 A1 FR2162275 A1 FR 2162275A1 FR 7144032 A FR7144032 A FR 7144032A FR 7144032 A FR7144032 A FR 7144032A FR 2162275 A1 FR2162275 A1 FR 2162275A1
Authority
FR
France
Prior art keywords
elements
high power
electrodes
power semiconductor
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7144032A
Other languages
French (fr)
Other versions
FR2162275B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM
Original Assignee
Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM filed Critical Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM
Priority to FR7144032A priority Critical patent/FR2162275A1/en
Priority to IT3247572A priority patent/IT971532B/en
Priority to DE19722260217 priority patent/DE2260217A1/en
Publication of FR2162275A1 publication Critical patent/FR2162275A1/en
Application granted granted Critical
Publication of FR2162275B1 publication Critical patent/FR2162275B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

In a high power semiconductor of low thermal impedance comprising an interconnected assembly of a semiconductor element with a srs. of electrodes and elements for the electrical connection of these electrodes to the user circuit as well as elements for the thermal conduction, the conducting elements consist of at least two cylindrical metal pieces, called contacts, situated on either side of the semiconductor element, connected to at least two of the electrodes forming at least two of the connecting elements, and having the heat dissipators fixed thereon, while the contacts are assembled by encapsulation in a rigid plastic and in part comprise groved right cylinders which together with the encapsulating plastic ensure resistance of the semiconductor unit to mechanical shock.
FR7144032A 1971-12-08 1971-12-08 Encapsulated high power semiconductor - with improved heat dissipation Granted FR2162275A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR7144032A FR2162275A1 (en) 1971-12-08 1971-12-08 Encapsulated high power semiconductor - with improved heat dissipation
IT3247572A IT971532B (en) 1971-12-08 1972-12-05 IMPROVEMENTS TO SEMICONDUCTIVE DEVICES
DE19722260217 DE2260217A1 (en) 1971-12-08 1972-12-08 HIGH PERFORMANCE SEMICONDUCTOR DEVICE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7144032A FR2162275A1 (en) 1971-12-08 1971-12-08 Encapsulated high power semiconductor - with improved heat dissipation

Publications (2)

Publication Number Publication Date
FR2162275A1 true FR2162275A1 (en) 1973-07-20
FR2162275B1 FR2162275B1 (en) 1974-06-07

Family

ID=9087133

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7144032A Granted FR2162275A1 (en) 1971-12-08 1971-12-08 Encapsulated high power semiconductor - with improved heat dissipation

Country Status (3)

Country Link
DE (1) DE2260217A1 (en)
FR (1) FR2162275A1 (en)
IT (1) IT971532B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188637A (en) * 1976-07-06 1980-02-12 Licentia Patent-Verwaltungs-G.M.B.H. Disc-shaped semiconductor device having an annular housing of elastomer material

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56142645A (en) * 1980-04-07 1981-11-07 Hitachi Ltd Semiconductor device
JPS6060172U (en) * 1983-09-13 1985-04-26 本田技研工業株式会社 Transformer device with rectifier

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1486215A (en) * 1965-07-09 1967-06-23 Asea Ab Semiconductor device
FR1556831A (en) * 1967-03-23 1969-02-07

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1486215A (en) * 1965-07-09 1967-06-23 Asea Ab Semiconductor device
FR1556831A (en) * 1967-03-23 1969-02-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188637A (en) * 1976-07-06 1980-02-12 Licentia Patent-Verwaltungs-G.M.B.H. Disc-shaped semiconductor device having an annular housing of elastomer material

Also Published As

Publication number Publication date
FR2162275B1 (en) 1974-06-07
DE2260217A1 (en) 1973-06-14
IT971532B (en) 1974-05-10

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Legal Events

Date Code Title Description
ST Notification of lapse