JPS5839042A - Semiconductor heater - Google Patents

Abstract

PURPOSE:To reduce the size of a semiconductor heater and to simplify an energizing circuit to a semiconductor heater by switching energization to a semiconductor heating elements having positive temperature resistance coefficient in plural stages, thereby freely switching the quantity of heat. CONSTITUTION:All of an electrode plate 7, a radiation fin 8 and terminal board 9 are formed of aluminum, and a semiconductor heating elements 6 are conductively mounted. Intermediate terminal boards 10, 11 isolated from the space 12 to switch the quantity of heat are formed of aluminum. The elements 6, 6 are divided into sections A, C and B, D, and are energized and heated via external and intermediate terminal boards 9, 11. When closed by a switch 14, all of them are energized to strong heating, and when opened, only the sections A, B are energized to obtain weak heating.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention makes it possible to freely switch the amount of heat generated by switching the energization to a semiconductor heat generating element having a positive temperature resistance coefficient in multiple stages, thereby making the semiconductor heater device compact and reducing the size of the semiconductor heater device. The purpose is to simplify the current supply circuit to the element.

A conventional semiconductor heater device has a configuration as shown in Fig. 2, in which 1 is a semiconductor heating element, 2 is an electrode plate, 3 is a radiation fin, and 4 is a terminal plate. The plate 4 is made of aluminum and 2 (-2), and conductively holds the semiconductor heating element 1 therebetween.

A predetermined amount of heat is obtained by connecting a plurality of semiconductor heater devices having such a configuration in parallel.

In this case, the parallel connection was made using lead wires from the terminals 6 of the terminal board 4. However, as the number of semiconductor heater devices increases, the number of lead wires drawn out from each semiconductor heater device increases, making the circuit complex, and it is also necessary to consider insulation measures between each semiconductor heater device6. As a result, a large amount of heat is required in the summer, which is particularly problematic when it comes to obtaining a high calorific value.

The present invention eliminates the above-mentioned conventional drawbacks, and one embodiment thereof will be described in detail below with reference to FIG. 1.

In FIG. 2, 6 is a semiconductor heating element having a positive temperature resistance coefficient, 7 is an electrode plate that is in conductive contact with both sides of the semiconductor heating element 60, and 8 is an electrode plate 7K on one side and an outer terminal plate 9 on the other side. The lightning fins 3, . . . are in contact with each other: These electrode plates 7. Heat dissipation fin8. Both terminal plates 9 are made of aluminum and conductively sandwich the semiconductor heating element 6 therebetween. 10.1
Reference numeral 1 denotes an intermediate terminal plate separated by a space 12 so that the amount of heat generated can be changed, and is made of aluminum. 12 is a space portion that prevents the semiconductor heating element 60 from coming into contact with it;
In addition, an insulating layer is formed to ensure the amount of heat generated. The semiconductor heating elements 6, 6 are respectively A part and C part,
-, B part and D part, and the A part and B part are energized and heated by the outer terminal board 9 and the middle terminal board 10, and the C part and D part are respectively heated by the outer terminal board 9 and the middle terminal board 11. Ru. 13 is a power supply; 14 is a switch for changing the amount of heat generated by the semiconductor heating element 6; when the circuit is closed, the outer terminal plate 9 and the inner terminal plate 10 and 11 are energized;

All parts B, C, and D are energized and generate elastic heat,
Also, although the circuit is opened, the middle terminal board 11 is not energized, so A
, it is possible to obtain a weak amount of heat by energizing only the B portion.

The divided semiconductor heating element 6 is integrally held between the outer terminal plate 9 and the inner terminal plate 10.11 via the radiation fins 8, so that it can be configured as - heating elements, and the amount of heat generated is as follows. Since the middle terminal section is divided, multiple stages of switching are possible, and the device can be made extremely compact.

As described above, the present invention divides a semiconductor heating element having a positive temperature resistance coefficient into a plurality of pieces, which are sandwiched between terminal plates via heat dissipation fins, and at least one of the terminal plates corresponds to the heating element. Since the terminal board is separated and connected to the power supply via a changeover switch, the amount of heat generated can be changed to various values, and even if multiple heating elements are incorporated into one semiconductor heater device, it is compact. It is a dog of industrial value that can be made into a small size and does not take up much space.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of the configuration of a semiconductor heater device according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram of the configuration of a conventional semiconductor heater device. 5,-. 6...Semiconductor heating element, 8...Radiation fin, 9...Outer terminal board, 1o, 11...
・Middle terminal board, 13...Power supply, 14...
switch.

Claims (1)

[Claims] A semiconductor heating element having a positive temperature resistance coefficient, which is sandwiched by a terminal plate via a radiation fin, is divided into a plurality of pieces, and at least one of the terminal plates is divided corresponding to this heating element, and the terminal plate is divided into a plurality of pieces. The board is a semiconductor heater device that is connected to the power source via a changeover switch.