GB1262891A - Thermoelectric device - Google Patents
Thermoelectric deviceInfo
- Publication number
- GB1262891A GB1262891A GB7296/69A GB729669A GB1262891A GB 1262891 A GB1262891 A GB 1262891A GB 7296/69 A GB7296/69 A GB 7296/69A GB 729669 A GB729669 A GB 729669A GB 1262891 A GB1262891 A GB 1262891A
- Authority
- GB
- United Kingdom
- Prior art keywords
- supports
- arms
- bonded
- curing
- thermoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract 2
- 239000007767 bonding agent Substances 0.000 abstract 1
- 230000000295 complement effect Effects 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
Landscapes
- Epoxy Resins (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
1,262,891. Thermoelectric devices. WESTINGHOUSE ELECTRIC CORP. 11 Feb., 1969 [14 Feb., 1968], No. 7296/69. Heading H1K. A thermoelectric body 14 is disposed between two electrically conductive supports 12, 16 and is subjected to a compressive force by means of an insulating material which exhibits the property of shrinking on curing. As shown the pressure-applying insulating means comprises a thermosetting epoxy resin annulus 18 bonded to the supports 12, 16 by a bonding agent 20, which also seals a hole through the annulus 18 after curing to hermetically enclose the body 14. The body 14 may be soldered to the supports 12, 16, which may be of Cu, or may be held in place solely by the compressive forces. The annulus 18 may be an integral body, or may comprise two or more sections bonded together. It may be replaced by a moulded mass of a cold curing epoxy resin which shrinks on curing, or by two bars (52), Fig. 6 (not shown), of the thermosetting material bonded to the supports (12<SP>1</SP>, 16<SP>1</SP>) and urging them together due to shrinkage occurring during curing. The supports, or conductive plates bonded thereto, may serve as bridges between adjacent modules, heat transfer fins and ducts being provided in contact with the supports or plates. In a further modification each module comprises two complementary thermoelectric bodies (14), Fig. 9 (not shown), separated by a finned conductive unit (62), with each body (14) in contact with a respective one of the supports (68, 70) each of which carries further cooling fins. The compressive forces are applied through pairs of arms (78, 80) integral with or bonded to respective supports (68, 70), with the two arms of each pair directed towards one another but not meeting. A moulded mass (82) of an epoxy resin which shrinks on curing is bonded to the adjacent ends of the two arms (78, 80), and when cured this causes the ends of the arms to be drawn closer together, thus urging the supports (68, 70) towards one another and compressing the thermoelectric bodies (14). Two separate pairs of arms may be provided for each unit (62) of a series arrangement, or alternatively the arms may be common to all units (62).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70550768A | 1968-02-14 | 1968-02-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1262891A true GB1262891A (en) | 1972-02-09 |
Family
ID=24833784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB7296/69A Expired GB1262891A (en) | 1968-02-14 | 1969-02-11 | Thermoelectric device |
Country Status (5)
Country | Link |
---|---|
US (1) | US3663307A (en) |
AT (1) | AT284231B (en) |
CH (1) | CH479964A (en) |
DE (1) | DE1904492A1 (en) |
GB (1) | GB1262891A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2121599A (en) * | 1980-11-10 | 1983-12-21 | Edwin James Freeburn | Cooling device |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4650919A (en) * | 1984-08-01 | 1987-03-17 | The United States Of America As Represented By The United States Department Of Energy | Thermoelectric generator and method for the fabrication thereof |
JP3533826B2 (en) * | 1996-05-29 | 2004-05-31 | アイシン精機株式会社 | Heat conversion device |
JP3241270B2 (en) * | 1996-06-25 | 2001-12-25 | 日本政策投資銀行 | Thermoelectric converter |
JPH10125962A (en) * | 1996-10-22 | 1998-05-15 | Nanba Kikujiro | Thermoelectric converter |
AU759584B2 (en) * | 1996-12-27 | 2003-04-17 | Thermovonics Co., Ltd. | Storage box apparatus |
US6282907B1 (en) * | 1999-12-09 | 2001-09-04 | International Business Machines Corporation | Thermoelectric cooling apparatus and method for maximizing energy transport |
US6297441B1 (en) * | 2000-03-24 | 2001-10-02 | Chris Macris | Thermoelectric device and method of manufacture |
US6539725B2 (en) * | 2001-02-09 | 2003-04-01 | Bsst Llc | Efficiency thermoelectrics utilizing thermal isolation |
US6672076B2 (en) | 2001-02-09 | 2004-01-06 | Bsst Llc | Efficiency thermoelectrics utilizing convective heat flow |
US7946120B2 (en) | 2001-02-09 | 2011-05-24 | Bsst, Llc | High capacity thermoelectric temperature control system |
US7942010B2 (en) | 2001-02-09 | 2011-05-17 | Bsst, Llc | Thermoelectric power generating systems utilizing segmented thermoelectric elements |
US6959555B2 (en) * | 2001-02-09 | 2005-11-01 | Bsst Llc | High power density thermoelectric systems |
US7273981B2 (en) * | 2001-02-09 | 2007-09-25 | Bsst, Llc. | Thermoelectric power generation systems |
US7231772B2 (en) * | 2001-02-09 | 2007-06-19 | Bsst Llc. | Compact, high-efficiency thermoelectric systems |
US7164077B2 (en) * | 2001-04-09 | 2007-01-16 | Research Triangle Institute | Thin-film thermoelectric cooling and heating devices for DNA genomic and proteomic chips, thermo-optical switching circuits, and IR tags |
US7426835B2 (en) * | 2001-08-07 | 2008-09-23 | Bsst, Llc | Thermoelectric personal environment appliance |
US8490412B2 (en) | 2001-08-07 | 2013-07-23 | Bsst, Llc | Thermoelectric personal environment appliance |
EP1433208A4 (en) * | 2001-10-05 | 2008-02-20 | Nextreme Thermal Solutions Inc | Phonon-blocking, electron-transmitting low-dimensional structures |
US6812395B2 (en) * | 2001-10-24 | 2004-11-02 | Bsst Llc | Thermoelectric heterostructure assemblies element |
EP1495498B1 (en) * | 2002-04-15 | 2013-04-10 | Nextreme Thermal Solutions, Inc. | Thermoelectric device utilizing double-sided peltier junctions |
US7638705B2 (en) * | 2003-12-11 | 2009-12-29 | Nextreme Thermal Solutions, Inc. | Thermoelectric generators for solar conversion and related systems and methods |
US8063298B2 (en) * | 2004-10-22 | 2011-11-22 | Nextreme Thermal Solutions, Inc. | Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields |
US7523617B2 (en) * | 2004-10-22 | 2009-04-28 | Nextreme Thermal Solutions, Inc. | Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics |
FR2878077B1 (en) * | 2004-11-18 | 2007-05-11 | St Microelectronics Sa | VERTICAL ELECTRONIC COMPONENT AUTOREFROIDI |
US20070028956A1 (en) * | 2005-04-12 | 2007-02-08 | Rama Venkatasubramanian | Methods of forming thermoelectric devices including superlattice structures of alternating layers with heterogeneous periods and related devices |
US7847179B2 (en) | 2005-06-06 | 2010-12-07 | Board Of Trustees Of Michigan State University | Thermoelectric compositions and process |
WO2007002337A2 (en) | 2005-06-22 | 2007-01-04 | Nextreme Thermal Solutions | Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures |
WO2007002342A2 (en) * | 2005-06-22 | 2007-01-04 | Nextreme Thermal Solutions | Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures |
JP2008547370A (en) * | 2005-06-28 | 2008-12-25 | ビーエスエスティー エルエルシー | Thermoelectric generator for fluctuating heat power |
US7679203B2 (en) * | 2006-03-03 | 2010-03-16 | Nextreme Thermal Solutions, Inc. | Methods of forming thermoelectric devices using islands of thermoelectric material and related structures |
US7870745B2 (en) | 2006-03-16 | 2011-01-18 | Bsst Llc | Thermoelectric device efficiency enhancement using dynamic feedback |
US7952015B2 (en) | 2006-03-30 | 2011-05-31 | Board Of Trustees Of Michigan State University | Pb-Te-compounds doped with tin-antimony-tellurides for thermoelectric generators or peltier arrangements |
US7788933B2 (en) * | 2006-08-02 | 2010-09-07 | Bsst Llc | Heat exchanger tube having integrated thermoelectric devices |
US20080289677A1 (en) * | 2007-05-25 | 2008-11-27 | Bsst Llc | Composite thermoelectric materials and method of manufacture |
WO2008148042A2 (en) | 2007-05-25 | 2008-12-04 | Bsst Llc | System and method for distributed thermoelectric heating and colling |
WO2009091747A2 (en) * | 2008-01-14 | 2009-07-23 | The Ohio State University Research Foundation | Thermoelectric figure of merit enhancement by modification of the electronic density of states |
US20090235969A1 (en) * | 2008-01-25 | 2009-09-24 | The Ohio State University Research Foundation | Ternary thermoelectric materials and methods of fabrication |
US20090269584A1 (en) * | 2008-04-24 | 2009-10-29 | Bsst, Llc | Thermoelectric materials combining increased power factor and reduced thermal conductivity |
CN102105757A (en) | 2008-06-03 | 2011-06-22 | Bsst有限责任公司 | Thermoelectric heat pump |
US20100024859A1 (en) * | 2008-07-29 | 2010-02-04 | Bsst, Llc. | Thermoelectric power generator for variable thermal power source |
US20100101239A1 (en) * | 2008-10-23 | 2010-04-29 | Lagrandeur John | Multi-mode hvac system with thermoelectric device |
US9466778B2 (en) * | 2009-04-02 | 2016-10-11 | Avl List Gmbh | Thermoelectric generator unit |
US20100258154A1 (en) * | 2009-04-13 | 2010-10-14 | The Ohio State University | Thermoelectric alloys with improved thermoelectric power factor |
US9601677B2 (en) * | 2010-03-15 | 2017-03-21 | Laird Durham, Inc. | Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces |
US8795545B2 (en) | 2011-04-01 | 2014-08-05 | Zt Plus | Thermoelectric materials having porosity |
US9006557B2 (en) | 2011-06-06 | 2015-04-14 | Gentherm Incorporated | Systems and methods for reducing current and increasing voltage in thermoelectric systems |
JP5908975B2 (en) | 2011-06-06 | 2016-04-26 | ジェンサーム インコーポレイテッドGentherm Incorporated | Cartridge-based thermoelectric system |
WO2014022428A2 (en) | 2012-08-01 | 2014-02-06 | Gentherm Incorporated | High efficiency thermoelectric generation |
CN108400410A (en) | 2013-01-30 | 2018-08-14 | 詹思姆公司 | Heat management system based on thermoelectricity |
US20200035898A1 (en) | 2018-07-30 | 2020-01-30 | Gentherm Incorporated | Thermoelectric device having circuitry that facilitates manufacture |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2942051A (en) * | 1958-03-11 | 1960-06-21 | Whirlpool Co | Refrigerating apparatus |
US2997514A (en) * | 1958-03-11 | 1961-08-22 | Whirlpool Co | Refrigerating apparatus |
DE1165050B (en) * | 1958-12-04 | 1964-03-12 | Siemens Elektrogeraete Gmbh | Cooling device with two electrothermal cooling devices |
US3006979A (en) * | 1959-04-09 | 1961-10-31 | Carrier Corp | Heat exchanger for thermoelectric apparatus |
US3110628A (en) * | 1960-03-02 | 1963-11-12 | Westinghouse Electric Corp | Thermoelectric assembly |
US3083248A (en) * | 1961-07-28 | 1963-03-26 | Gen Electric | Thermoelectric module |
US3296033A (en) * | 1961-10-04 | 1967-01-03 | Westinghouse Electric Corp | Semiconductor device |
US3225549A (en) * | 1962-04-18 | 1965-12-28 | Thore M Elfving | Thermoelectric cooling device |
NL277587A (en) * | 1962-04-24 | |||
US3167925A (en) * | 1963-03-14 | 1965-02-02 | Thore M Elfving | Thermoelectric cooling device |
US3412566A (en) * | 1965-06-21 | 1968-11-26 | Borg Warner | Thermoelectric apparatus |
-
1964
- 1964-08-17 DE DE19641904492 patent/DE1904492A1/en active Pending
-
1968
- 1968-02-14 US US705507A patent/US3663307A/en not_active Expired - Lifetime
-
1969
- 1969-02-11 GB GB7296/69A patent/GB1262891A/en not_active Expired
- 1969-02-11 CH CH208969A patent/CH479964A/en not_active IP Right Cessation
- 1969-02-13 AT AT145869A patent/AT284231B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2121599A (en) * | 1980-11-10 | 1983-12-21 | Edwin James Freeburn | Cooling device |
Also Published As
Publication number | Publication date |
---|---|
DE1904492A1 (en) | 1969-09-18 |
CH479964A (en) | 1969-10-15 |
US3663307A (en) | 1972-05-16 |
AT284231B (en) | 1970-09-10 |
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