KR920005275A - 진공처리장치 및 그 운전방법 - Google Patents
진공처리장치 및 그 운전방법 Download PDFInfo
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- KR920005275A KR920005275A KR1019910014984A KR910014984A KR920005275A KR 920005275 A KR920005275 A KR 920005275A KR 1019910014984 A KR1019910014984 A KR 1019910014984A KR 910014984 A KR910014984 A KR 910014984A KR 920005275 A KR920005275 A KR 920005275A
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- vacuum processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/35—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads providing current or voltage to the thermal head
- B41J2/355—Control circuits for heating-element selection
- B41J2/36—Print density control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/35—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads providing current or voltage to the thermal head
- B41J2/355—Control circuits for heating-element selection
- B41J2/36—Print density control
- B41J2/365—Print density control by compensation for variation in temperature
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 진공처리장치의 일실시예인 드라이에칭 장치를 나타낸 평면도.
제2도는 제1도를 1-1에서 본 종단면도.
Claims (13)
- 피처리기판을 진공하에서 처리한 후, 내부의 드라이클리닝 처리가 행해지는 진공처리실을 갖는 진공처리장치에 있어서, 상기 피처리기판을 수용하는 제1의 수납수단과 함께 더미기판을 수용하는 제2의 수납수단을 대기분위기속에 설치하고,상기 제1의 수납수단과 상기 진공처리실과의 사이에서 상기 피처리기판을 반송함과 동시에 상기 제2의 수납수단과 상기 진공처리실과의 사이에서 상기 더미기판을 반송하는 반송수단과, 상기 진공처리실의 드라이클리닝시에 상기 더미기판을 상기 제2의 수납수단과, 상기 진공처리실과의 사이에서 반송하도록 상기 반송수단을 제어하는 제어수단을 구비한 진공처리장치.
- 제1항에 있어서, 상기 반송수단은 대기 설치된 제1의 반송수단과 진공내에 설치된 제2의 반송수단으로 이루어지는 진공처리장치.
- 제1항에 있어서, 상기 진공처리실은 복수 설치되어 이루어지는 진공처리장치.
- 제1항에 있어서, 상기 제어수단은, 상기 진공처리실의 드라이클리닝 시기를 판단하는 수단을 갖는 진공처리장치.
- 제4항에 있어서, 상기 드라이클리닝시기의 판단은 상기 진공처리실을 거쳐 투과하는 플라즈마광의 발광강도를 계측하는 센서를 사용하여 행하여지는 진공처리장치.
- 제4항에 있어서, 상기 드라이클리닝시기의 판단은 상기 진공처리실내에서 상기 피처리 기판을 처리하는 회수를 계수하는 수단을 사용하여 행하여지는 진공처리장치.
- 피처리기판을 진공하에서 처리한 후, 내부의 드라이클리닝 처리가 행해지는 진공처리실을 갖는 진공처리장치의 운전방법에 있어서, 상기 피처리기판을 수용하는 제1의 수납수단과 함께 더미기판을 수용하는 제2의 수납수단을 대기분위기속에 설치하는 공정과, 상기 제1의 수납수단과 상기 진공처리실과의 사이에서 피처리기판을 반송하고, 상기 피처리기판을 진공처리하는 공정과, 상기 진공처리실의 드라이클리닝시에, 상기 제2의 수납수단과 상기 진공처리실과의 사이에서 상기 더미기판을 반송하는 공정을 갖는 진공처리장치의 운전방법.
- 제7항에 있어서, 상기 진공처리실은 복수이고, 상기 더미웨이퍼를 각각의 상기 진공처리실에 배치하여 드라이클리닝하는 진공처리장치의 운전방법.
- 제7항에 있어서, 상기 진공처리실은 복수이고, 상기 더미웨이퍼를 상기 복수의 진공처리실중 1개 또는 복수에 설치하고 드라이클리닝함과 동시에, 나머지의 상기 진공처리실에서는 웨이퍼를 처리하는 진공처리장치의 운전방법.
- 제7항에 있어서, 상기 드라이클리닝은 상기 진공처리실을 거쳐 투과하는 플라즈마광의 발광강도를 계측하고, 상기 진공처리실의 드라이클리닝 시기를 판단하여 행하여지는 진공처리장치의 운전방법.
- 제7항에 있어서, 상기 드라이클리닝은 상기 진공처리실내에서 상기 피처리기판을 처리하는 회수를 계수하고, 상기 진공처리실의 드라이클리닝 시기를 판단하여 행하여 지는 진공처리장치의 운전방법.
- 피처리 기판을 진공하에서, 처리한 후, 내부의 드라이클리닝처리가 행해지는 진공처리실을 복수개 갖는 진공처리장치의 운전방법에 있어서, 상기 피처리기판을 수요한 제1의 수납수단과 함께 더미기판을 수용한 제2의 수납수단을 대기분위기 속에 설치하는 공정과, 상기 제1의 수납수단과, 상기 진공처리실과의 사이에서 상기 피처리기판을 반송하고, 상기 피처리기판을 진공처리하는 공정과, 상기 제1의 수납수단내의 상기 피처리기판의 진공처리 도중 또는 종류후에 , 상기 제2의 수납수단으로부터 상기 진공처리실에 상기 더미기판을 반입하여 상기 진공처리실을 드라이클리닝 처리하는 공정과, 상기 드라이클리닝처리 종료후에, 사용이 끝난 상기 더미기판을 상기 제2의 수납수단의 원래의 수납위치로 돌리는 공정을 갖는 진공처리장치의 운전방법.
- 제12항에 있어서, 상기 드라이클리닝은 상기 각각의 진공처리실의 드라이클리닝 시기를 검출하여 행하여지는 진공처리장치의 운전방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1019980046756A KR100212874B1 (en) | 1990-08-29 | 1998-11-02 | Transferring system and vacuum treating apparatus thereby |
KR1019980046757A KR100212819B1 (en) | 1990-08-29 | 1998-11-02 | Transferring system and vacuum treating apparatus and method thereby |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2225321A JP2644912B2 (ja) | 1990-08-29 | 1990-08-29 | 真空処理装置及びその運転方法 |
JP90-225321 | 1990-08-29 |
Publications (2)
Publication Number | Publication Date |
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KR920005275A true KR920005275A (ko) | 1992-03-28 |
KR0184682B1 KR0184682B1 (ko) | 1999-04-15 |
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Application Number | Title | Priority Date | Filing Date |
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KR1019910014984A KR0184682B1 (ko) | 1990-08-29 | 1991-08-29 | 진공처리장치 및 그 운전방법 |
Country Status (5)
Country | Link |
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US (47) | US5314509A (ko) |
EP (5) | EP1076354B1 (ko) |
JP (1) | JP2644912B2 (ko) |
KR (1) | KR0184682B1 (ko) |
DE (5) | DE69128861T3 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100234060B1 (ko) * | 1996-12-04 | 1999-12-15 | 구자홍 | 음극선관용 스프링 구조 |
Families Citing this family (153)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
US5685684A (en) * | 1990-11-26 | 1997-11-11 | Hitachi, Ltd. | Vacuum processing system |
US5630434A (en) * | 1991-11-05 | 1997-05-20 | Gray; Donald J. | Filter regeneration system |
US5240507A (en) * | 1991-11-05 | 1993-08-31 | Gray Donald J | Cleaning method and system |
US5702535A (en) * | 1991-11-05 | 1997-12-30 | Gebhard-Gray Associates | Dry cleaning and degreasing system |
US5534072A (en) * | 1992-06-24 | 1996-07-09 | Anelva Corporation | Integrated module multi-chamber CVD processing system and its method for processing subtrates |
US5746008A (en) * | 1992-07-29 | 1998-05-05 | Shinko Electric Co., Ltd. | Electronic substrate processing system using portable closed containers |
EP1448029A3 (en) * | 1992-08-14 | 2010-01-27 | Hamamatsu Photonics K.K. | Apparatus and method for producing gaseous ions by use of x-rays, and various apparatuses and structures using them |
WO1994014191A1 (fr) * | 1992-12-14 | 1994-06-23 | Ebara Corporation | Dispositif de transfert de galette |
JPH0712458A (ja) * | 1993-06-23 | 1995-01-17 | Murata Mfg Co Ltd | 部品乾燥機 |
US6090706A (en) * | 1993-06-28 | 2000-07-18 | Applied Materials, Inc. | Preconditioning process for treating deposition chamber prior to deposition of tungsten silicide coating on active substrates therein |
JP3158264B2 (ja) * | 1993-08-11 | 2001-04-23 | 東京エレクトロン株式会社 | ガス処理装置 |
US5565034A (en) * | 1993-10-29 | 1996-10-15 | Tokyo Electron Limited | Apparatus for processing substrates having a film formed on a surface of the substrate |
JP2900788B2 (ja) * | 1994-03-22 | 1999-06-02 | 信越半導体株式会社 | 枚葉式ウェーハ処理装置 |
US6712577B2 (en) * | 1994-04-28 | 2004-03-30 | Semitool, Inc. | Automated semiconductor processing system |
JPH0817894A (ja) * | 1994-06-27 | 1996-01-19 | Dainippon Screen Mfg Co Ltd | 基板表面処理装置 |
FR2733036B1 (fr) * | 1995-04-14 | 1997-07-04 | Unir | Dispositif de protection anti-contamination rapprochee |
US6363164B1 (en) | 1996-05-13 | 2002-03-26 | Cummins-Allison Corp. | Automated document processing system using full image scanning |
US6283130B1 (en) * | 1995-05-30 | 2001-09-04 | Anelva Corporation | Plasma cleaning method and placement area protector used in the method |
US6672819B1 (en) | 1995-07-19 | 2004-01-06 | Hitachi, Ltd. | Vacuum processing apparatus and semiconductor manufacturing line using the same |
JPH0936198A (ja) | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
KR100244041B1 (ko) * | 1995-08-05 | 2000-02-01 | 엔도 마코토 | 기판처리장치 |
US6481956B1 (en) * | 1995-10-27 | 2002-11-19 | Brooks Automation Inc. | Method of transferring substrates with two different substrate holding end effectors |
WO1997034742A1 (fr) * | 1996-03-18 | 1997-09-25 | Komatsu Ltd. | Dispositif de commande d'un systeme de transport de pieces |
US5779799A (en) * | 1996-06-21 | 1998-07-14 | Micron Technology, Inc. | Substrate coating apparatus |
JPH1022358A (ja) * | 1996-06-28 | 1998-01-23 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US5713138A (en) * | 1996-08-23 | 1998-02-03 | Research, Incorporated | Coating dryer system |
US6714832B1 (en) | 1996-09-11 | 2004-03-30 | Hitachi, Ltd. | Operating method of vacuum processing system and vacuum processing system |
US6009890A (en) * | 1997-01-21 | 2000-01-04 | Tokyo Electron Limited | Substrate transporting and processing system |
IT1290911B1 (it) * | 1997-02-03 | 1998-12-14 | Siv Soc Italiana Vetro | Procedimento e dispositivo per l'alimentazione di impianti da vuoto atti al deposito di rivestimenti superficiali su substrati. |
US6138695A (en) * | 1997-03-07 | 2000-10-31 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
US5922136A (en) * | 1997-03-28 | 1999-07-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Post-CMP cleaner apparatus and method |
US6059507A (en) * | 1997-04-21 | 2000-05-09 | Brooks Automation, Inc. | Substrate processing apparatus with small batch load lock |
JP3850952B2 (ja) * | 1997-05-15 | 2006-11-29 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
JP3850951B2 (ja) * | 1997-05-15 | 2006-11-29 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
JP3737604B2 (ja) * | 1997-06-03 | 2006-01-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US5882413A (en) * | 1997-07-11 | 1999-03-16 | Brooks Automation, Inc. | Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer |
US6139245A (en) * | 1997-07-11 | 2000-10-31 | Brooks Automation Inc. | Robot arm relocation system |
KR19990010200A (ko) * | 1997-07-15 | 1999-02-05 | 윤종용 | 감압식 건조 장치를 이용하는 반도체장치 건조방법 |
US6034000A (en) * | 1997-07-28 | 2000-03-07 | Applied Materials, Inc. | Multiple loadlock system |
US5974689A (en) * | 1997-09-23 | 1999-11-02 | Gary W. Farrell | Chemical drying and cleaning system |
DE19756830A1 (de) * | 1997-12-19 | 1999-07-01 | Wacker Chemie Gmbh | Vakuumtechnisches Trocknen von Halbleiterbruch |
US6026589A (en) * | 1998-02-02 | 2000-02-22 | Silicon Valley Group, Thermal Systems Llc | Wafer carrier and semiconductor apparatus for processing a semiconductor substrate |
WO1999052141A1 (fr) * | 1998-04-02 | 1999-10-14 | Nikon Corporation | Procede et dispositif de traitements de plaquettes, et procede et appareil d'exposition |
KR100265287B1 (ko) * | 1998-04-21 | 2000-10-02 | 윤종용 | 반도체소자 제조용 식각설비의 멀티챔버 시스템 |
US6079927A (en) * | 1998-04-22 | 2000-06-27 | Varian Semiconductor Equipment Associates, Inc. | Automated wafer buffer for use with wafer processing equipment |
US6246473B1 (en) | 1998-04-23 | 2001-06-12 | Sandia Corporation | Method and apparatus for monitoring plasma processing operations |
NL1009171C2 (nl) * | 1998-05-14 | 1999-12-10 | Asm Int | Waferrek voorzien van een gasverdeelinrichting. |
KR20010043705A (ko) * | 1998-05-18 | 2001-05-25 | 조셉 제이. 스위니 | 워크 스테이션간에 웨이퍼당 이송을 위한 웨이퍼 버퍼스테이션과 방법 |
US6151796A (en) * | 1998-06-04 | 2000-11-28 | Kem-Tec Japan Co., Ltd. | Substrate drying device, drying method and substrate dried by the same |
US6217272B1 (en) | 1998-10-01 | 2001-04-17 | Applied Science And Technology, Inc. | In-line sputter deposition system |
JP2000306978A (ja) * | 1999-02-15 | 2000-11-02 | Kokusai Electric Co Ltd | 基板処理装置、基板搬送装置、および基板処理方法 |
JP3959200B2 (ja) * | 1999-03-19 | 2007-08-15 | 株式会社東芝 | 半導体装置の製造装置 |
US6251195B1 (en) * | 1999-07-12 | 2001-06-26 | Fsi International, Inc. | Method for transferring a microelectronic device to and from a processing chamber |
KR100537921B1 (ko) * | 1999-08-24 | 2005-12-21 | 니시카와고무고교가부시키가이샤 | 리테이너가 없는 웨더스트립 |
JP2001093791A (ja) * | 1999-09-20 | 2001-04-06 | Hitachi Ltd | 真空処理装置の運転方法及びウエハの処理方法 |
JP2001127044A (ja) | 1999-10-29 | 2001-05-11 | Hitachi Ltd | 真空処理装置および真空処理システム |
US6364592B1 (en) * | 1999-12-01 | 2002-04-02 | Brooks Automation, Inc. | Small footprint carrier front end loader |
US6949143B1 (en) * | 1999-12-15 | 2005-09-27 | Applied Materials, Inc. | Dual substrate loadlock process equipment |
JP2001308003A (ja) * | 2000-02-15 | 2001-11-02 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
US6698991B1 (en) * | 2000-03-02 | 2004-03-02 | Applied Materials, Inc. | Fabrication system with extensible equipment sets |
JP2002043229A (ja) * | 2000-07-25 | 2002-02-08 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
US6821912B2 (en) | 2000-07-27 | 2004-11-23 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
US6530733B2 (en) | 2000-07-27 | 2003-03-11 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
US6682288B2 (en) | 2000-07-27 | 2004-01-27 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
US6745783B2 (en) * | 2000-08-01 | 2004-06-08 | Tokyo Electron Limited | Cleaning processing method and cleaning processing apparatus |
KR20070037517A (ko) * | 2000-09-15 | 2007-04-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 처리 장비용 더블 이중 슬롯 로드록 |
AU2002230793A1 (en) * | 2000-10-31 | 2002-05-15 | Applied Materials, Inc. | Method and apparatus for cleaning a deposition chamber |
KR100408604B1 (ko) * | 2000-12-07 | 2003-12-06 | 주식회사제4기한국 | 대기압 플라즈마를 이용한 정밀세정과 표면개질방법 및 그장치 |
GB2370411B (en) * | 2000-12-20 | 2003-08-13 | Hanmi Co Ltd | Handler system for cutting a semiconductor package device |
US6852242B2 (en) * | 2001-02-23 | 2005-02-08 | Zhi-Wen Sun | Cleaning of multicompositional etchant residues |
US6635144B2 (en) | 2001-04-11 | 2003-10-21 | Applied Materials, Inc | Apparatus and method for detecting an end point of chamber cleaning in semiconductor equipment |
JP4731755B2 (ja) * | 2001-07-26 | 2011-07-27 | 東京エレクトロン株式会社 | 移載装置の制御方法および熱処理方法並びに熱処理装置 |
US6817823B2 (en) * | 2001-09-11 | 2004-11-16 | Marian Corporation | Method, device and system for semiconductor wafer transfer |
US20030053892A1 (en) * | 2001-09-17 | 2003-03-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Loadport equipped with automatic height adjustment means and method for operating |
US7316966B2 (en) * | 2001-09-21 | 2008-01-08 | Applied Materials, Inc. | Method for transferring substrates in a load lock chamber |
US7260704B2 (en) * | 2001-11-30 | 2007-08-21 | Intel Corporation | Method and apparatus for reinforcing a prefetch chain |
JP4025069B2 (ja) * | 2001-12-28 | 2007-12-19 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
US6899507B2 (en) * | 2002-02-08 | 2005-05-31 | Asm Japan K.K. | Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections |
JP3887570B2 (ja) * | 2002-02-18 | 2007-02-28 | 協和化工株式会社 | 高速乾燥装置 |
JP3862596B2 (ja) * | 2002-05-01 | 2006-12-27 | 東京エレクトロン株式会社 | 基板処理方法 |
EP1506570A1 (en) * | 2002-05-21 | 2005-02-16 | ASM America, Inc. | Reduced cross-contamination between chambers in a semiconductor processing tool |
JP2004071611A (ja) * | 2002-08-01 | 2004-03-04 | Matsushita Electric Ind Co Ltd | 電子部品装着装置および電子部品装着方法 |
JP4219799B2 (ja) * | 2003-02-26 | 2009-02-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3674864B2 (ja) * | 2003-03-25 | 2005-07-27 | 忠素 玉井 | 真空処理装置 |
US20060156627A1 (en) * | 2003-06-27 | 2006-07-20 | Ultracell Corporation | Fuel processor for use with portable fuel cells |
KR100500169B1 (ko) * | 2003-07-02 | 2005-07-07 | 주식회사 디엠에스 | 도킹형 기판 이송 및 처리 시스템과, 그를 이용한 이송 및 처리 방법 |
US7313262B2 (en) * | 2003-08-06 | 2007-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for visualization of process chamber conditions |
US7276210B2 (en) * | 2003-08-20 | 2007-10-02 | Petroleo Brasileiro S.A. -Petrobras | Stripping apparatus and process |
JP2005101584A (ja) * | 2003-08-28 | 2005-04-14 | Suss Microtec Test Systems Gmbh | 基板を検査する装置 |
US7207766B2 (en) * | 2003-10-20 | 2007-04-24 | Applied Materials, Inc. | Load lock chamber for large area substrate processing system |
JP2005167083A (ja) * | 2003-12-04 | 2005-06-23 | Daifuku Co Ltd | ガラス基板用の搬送設備 |
JP4435610B2 (ja) * | 2004-03-23 | 2010-03-24 | パナソニック株式会社 | ダミー基板 |
JP4128973B2 (ja) * | 2004-03-30 | 2008-07-30 | 株式会社日立ハイテクノロジーズ | 真空処理装置及び真空処理方法 |
US7497414B2 (en) * | 2004-06-14 | 2009-03-03 | Applied Materials, Inc. | Curved slit valve door with flexible coupling |
EP1621284A1 (de) * | 2004-07-15 | 2006-02-01 | Maschinenfabrik Berthold Hermle Aktiengesellschaft | Werkstückwechsler für Bearbeitungsmaschinen |
ATE388787T1 (de) * | 2004-07-15 | 2008-03-15 | Hermle Berthold Maschf Ag | Bearbeitungsmaschine mit werkstückwechsler |
US8000837B2 (en) | 2004-10-05 | 2011-08-16 | J&L Group International, Llc | Programmable load forming system, components thereof, and methods of use |
US7771563B2 (en) | 2004-11-18 | 2010-08-10 | Sumitomo Precision Products Co., Ltd. | Systems and methods for achieving isothermal batch processing of substrates used for the production of micro-electro-mechanical-systems |
JP3960332B2 (ja) * | 2004-11-29 | 2007-08-15 | セイコーエプソン株式会社 | 減圧乾燥装置 |
JP2006179528A (ja) * | 2004-12-20 | 2006-07-06 | Tokyo Electron Ltd | 基板処理装置の検査方法及び検査プログラム |
US20070006936A1 (en) * | 2005-07-07 | 2007-01-11 | Applied Materials, Inc. | Load lock chamber with substrate temperature regulation |
KR101255718B1 (ko) * | 2005-11-07 | 2013-04-17 | 주성엔지니어링(주) | 기판처리시스템 및 이를 이용한 기판처리방법 |
US8125610B2 (en) | 2005-12-02 | 2012-02-28 | ASML Metherlands B.V. | Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus |
US7845891B2 (en) * | 2006-01-13 | 2010-12-07 | Applied Materials, Inc. | Decoupled chamber body |
US7665951B2 (en) * | 2006-06-02 | 2010-02-23 | Applied Materials, Inc. | Multiple slot load lock chamber and method of operation |
US7845618B2 (en) | 2006-06-28 | 2010-12-07 | Applied Materials, Inc. | Valve door with ball coupling |
US20080003377A1 (en) * | 2006-06-30 | 2008-01-03 | The Board Of Regents Of The Nevada System Of Higher Ed. On Behalf Of The Unlv | Transparent vacuum system |
JP2008027937A (ja) * | 2006-07-18 | 2008-02-07 | Hitachi High-Technologies Corp | 真空処理装置 |
US8124907B2 (en) * | 2006-08-04 | 2012-02-28 | Applied Materials, Inc. | Load lock chamber with decoupled slit valve door seal compartment |
US7740437B2 (en) | 2006-09-22 | 2010-06-22 | Asm International N.V. | Processing system with increased cassette storage capacity |
US20080206022A1 (en) * | 2007-02-27 | 2008-08-28 | Smith John M | Mult-axis robot arms in substrate vacuum processing tool |
US20080206036A1 (en) * | 2007-02-27 | 2008-08-28 | Smith John M | Magnetic media processing tool with storage bays and multi-axis robot arms |
US7585142B2 (en) * | 2007-03-16 | 2009-09-08 | Asm America, Inc. | Substrate handling chamber with movable substrate carrier loading platform |
JP5065167B2 (ja) * | 2007-09-20 | 2012-10-31 | 東京エレクトロン株式会社 | 基板の処理方法及び基板の処理システム |
US8118946B2 (en) | 2007-11-30 | 2012-02-21 | Wesley George Lau | Cleaning process residues from substrate processing chamber components |
EP2313873A1 (en) * | 2008-07-11 | 2011-04-27 | MEI, Inc. | Automated document handling system |
DE102009018700B4 (de) * | 2008-09-01 | 2020-02-13 | Singulus Technologies Ag | Beschichtungsanlage und Verfahren zum Beschichten |
WO2010041562A1 (ja) * | 2008-10-07 | 2010-04-15 | 川崎重工業株式会社 | 基板搬送ロボットおよびシステム |
US7972961B2 (en) * | 2008-10-09 | 2011-07-05 | Asm Japan K.K. | Purge step-controlled sequence of processing semiconductor wafers |
JP5139253B2 (ja) * | 2008-12-18 | 2013-02-06 | 東京エレクトロン株式会社 | 真空処理装置及び真空搬送装置 |
US8216380B2 (en) | 2009-01-08 | 2012-07-10 | Asm America, Inc. | Gap maintenance for opening to process chamber |
US8287648B2 (en) | 2009-02-09 | 2012-10-16 | Asm America, Inc. | Method and apparatus for minimizing contamination in semiconductor processing chamber |
US8749053B2 (en) | 2009-06-23 | 2014-06-10 | Intevac, Inc. | Plasma grid implant system for use in solar cell fabrications |
JP2011009362A (ja) * | 2009-06-24 | 2011-01-13 | Tokyo Electron Ltd | インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体 |
JP5060517B2 (ja) * | 2009-06-24 | 2012-10-31 | 東京エレクトロン株式会社 | インプリントシステム |
JP5423227B2 (ja) | 2009-08-11 | 2014-02-19 | 富士ゼロックス株式会社 | 画像形成装置及びプログラム |
DE112010003863T5 (de) * | 2009-09-30 | 2013-01-03 | Cummins Inc. | Vorgehensweisen zur Erhöhung der Regenerationsfähigkeit einer Nachbehandlung |
CN102834905B (zh) * | 2010-02-09 | 2016-05-11 | 因特瓦克公司 | 太阳能电池制造中使用的可调阴影掩模组件 |
US20120288355A1 (en) * | 2011-05-11 | 2012-11-15 | Ming-Teng Hsieh | Method for storing wafers |
US10096461B2 (en) | 2011-06-23 | 2018-10-09 | Brooks Automation Germany, GmbH | Semiconductor cleaner systems and methods |
US8728587B2 (en) * | 2011-06-24 | 2014-05-20 | Varian Semiconductor Equipment Associates, Inc. | Closed loop process control of plasma processed materials |
MY175007A (en) | 2011-11-08 | 2020-06-02 | Intevac Inc | Substrate processing system and method |
CN103930984B (zh) * | 2011-11-23 | 2016-09-21 | 日本电产三协株式会社 | 工件搬运系统 |
JP5516610B2 (ja) * | 2012-01-19 | 2014-06-11 | 株式会社安川電機 | ロボット、ロボットハンドおよびロボットハンドの保持位置調整方法 |
DE102012100929A1 (de) * | 2012-02-06 | 2013-08-08 | Roth & Rau Ag | Substratbearbeitungsanlage |
TW201344836A (zh) * | 2012-04-26 | 2013-11-01 | Applied Materials Inc | 降低粒子生成的蒸汽乾燥裝置模組 |
TWI570745B (zh) | 2012-12-19 | 2017-02-11 | 因特瓦克公司 | 用於電漿離子植入之柵極 |
WO2014143846A1 (en) * | 2013-03-15 | 2014-09-18 | Applied Materials, Inc | Multi-position batch load lock apparatus and systems and methods including same |
JP6105436B2 (ja) * | 2013-08-09 | 2017-03-29 | 東京エレクトロン株式会社 | 基板処理システム |
CN103611702B (zh) * | 2013-09-07 | 2016-03-30 | 国家电网公司 | 一种可拆式超声波清洗装置的使用方法 |
CN103611703B (zh) * | 2013-09-07 | 2016-03-30 | 国家电网公司 | 一种组合式超声波清洗装置的使用方法 |
WO2015057959A1 (en) * | 2013-10-18 | 2015-04-23 | Brooks Automation, Inc. | Processing apparatus |
CN104752152B (zh) * | 2013-12-29 | 2018-07-06 | 北京北方华创微电子装备有限公司 | 一种沟槽刻蚀方法及刻蚀装置 |
KR101575129B1 (ko) * | 2014-01-13 | 2015-12-08 | 피에스케이 주식회사 | 기판 이송 장치 및 방법, 그리고 기판 처리 장치 |
CN103817470B (zh) * | 2014-02-13 | 2016-08-17 | 潍柴重机股份有限公司 | 一种油底壳螺塞支座焊机 |
WO2018197008A1 (en) * | 2017-04-28 | 2018-11-01 | Applied Materials, Inc. | Method for cleaning a vacuum system used in the manufacture of oled devices, method for vacuum deposition on a substrate to manufacture oled devices, and apparatus for vacuum deposition on a substrate to manufacture oled devices |
CN107102536B (zh) * | 2017-05-12 | 2020-08-21 | 芜湖乐佳自动化机械有限公司 | 一种变电柜防尘自动控制系统 |
US10872804B2 (en) | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
US10872803B2 (en) | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
US11121014B2 (en) | 2018-06-05 | 2021-09-14 | Asm Ip Holding B.V. | Dummy wafer storage cassette |
US11183409B2 (en) * | 2018-08-28 | 2021-11-23 | Taiwan Semiconductor Manufacturing Company Ltd. | System for a semiconductor fabrication facility and method for operating the same |
CN113035749A (zh) * | 2021-03-02 | 2021-06-25 | 北京北方华创微电子装备有限公司 | 半导体工艺腔室的清洗控制方法及半导体工艺腔室 |
Family Cites Families (156)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US536897A (en) * | 1895-04-02 | Reversing-gear for steam-engines | ||
US904153A (en) * | 1907-09-27 | 1908-11-17 | Ludwig Scheib Sr | Central-buffer claw-coupling. |
US3652444A (en) * | 1969-10-24 | 1972-03-28 | Ibm | Continuous vacuum process apparatus |
US3981791A (en) * | 1975-03-10 | 1976-09-21 | Signetics Corporation | Vacuum sputtering apparatus |
US4138306A (en) * | 1976-08-31 | 1979-02-06 | Tokyo Shibaura Electric Co., Ltd. | Apparatus for the treatment of semiconductors |
US4226897A (en) * | 1977-12-05 | 1980-10-07 | Plasma Physics Corporation | Method of forming semiconducting materials and barriers |
US4313815A (en) * | 1978-04-07 | 1982-02-02 | Varian Associates, Inc. | Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor |
DE2940064A1 (de) * | 1979-10-03 | 1981-04-16 | Leybold-Heraeus GmbH, 5000 Köln | Vakuumaufdampfanlage mir einer ventilkammer, einer bedampfungskammer und einer verdampferkammer |
JPS5681533U (ko) * | 1979-11-27 | 1981-07-01 | ||
US4311427A (en) * | 1979-12-21 | 1982-01-19 | Varian Associates, Inc. | Wafer transfer system |
US4313783A (en) * | 1980-05-19 | 1982-02-02 | Branson International Plasma Corporation | Computer controlled system for processing semiconductor wafers |
FR2486006A1 (fr) | 1980-07-07 | 1982-01-08 | Jeumont Schneider | Boucle induisant un courant dans les deux rails d'une voie ferree |
JPS5729577A (en) * | 1980-07-30 | 1982-02-17 | Anelva Corp | Automatic continuous sputtering apparatus |
JPS5893321A (ja) | 1981-11-30 | 1983-06-03 | Semiconductor Energy Lab Co Ltd | 半導体装置製造装置 |
JPS5895636A (ja) | 1981-11-30 | 1983-06-07 | イビデン株式会社 | 耐熱弾性シ−ト状物とその製造方法 |
JPS5892921A (ja) | 1981-11-30 | 1983-06-02 | Fujitsu Ltd | 赤外線検知装置の組立方法 |
US4457661A (en) * | 1981-12-07 | 1984-07-03 | Applied Materials, Inc. | Wafer loading apparatus |
JPS58108641A (ja) | 1981-12-21 | 1983-06-28 | Hitachi Ltd | ウエハ自動交換装置 |
US4634331A (en) * | 1982-05-24 | 1987-01-06 | Varian Associates, Inc. | Wafer transfer system |
US4449885A (en) * | 1982-05-24 | 1984-05-22 | Varian Associates, Inc. | Wafer transfer system |
JPS58220917A (ja) | 1982-06-18 | 1983-12-22 | ジヨ−ジ・ブラウン | 液体冷却装置に使用するサ−モスタツト |
JPS5994435A (ja) | 1982-11-20 | 1984-05-31 | Tokuda Seisakusho Ltd | 真空処理装置 |
US4576698A (en) * | 1983-06-30 | 1986-03-18 | International Business Machines Corporation | Plasma etch cleaning in low pressure chemical vapor deposition systems |
JPS6037129A (ja) * | 1983-08-10 | 1985-02-26 | Hitachi Ltd | 半導体製造装置 |
JPS6052575A (ja) | 1983-09-01 | 1985-03-25 | Nitto Electric Ind Co Ltd | フイルム類の連続真空処理装置 |
JPS6052574A (ja) | 1983-09-02 | 1985-03-25 | Hitachi Ltd | 連続スパツタ装置 |
JPH06105742B2 (ja) * | 1983-11-28 | 1994-12-21 | 株式会社日立製作所 | 真空処理方法及び装置 |
US5259881A (en) * | 1991-05-17 | 1993-11-09 | Materials Research Corporation | Wafer processing cluster tool batch preheating and degassing apparatus |
JPS60203265A (ja) * | 1984-03-28 | 1985-10-14 | ダイセル化学工業株式会社 | 抗血液凝固性高分子材料 |
US4534314A (en) * | 1984-05-10 | 1985-08-13 | Varian Associates, Inc. | Load lock pumping mechanism |
JPS60246635A (ja) * | 1984-05-22 | 1985-12-06 | Anelva Corp | 自動基板処理装置 |
JPS61105853A (ja) * | 1984-10-30 | 1986-05-23 | Anelva Corp | オ−トロ−ダ− |
US4562240A (en) | 1984-12-20 | 1985-12-31 | Ashland Oil, Inc. | Bicyclic amide acetal/polyol/polyisocyanate polymers |
EP0189279B1 (en) * | 1985-01-22 | 1991-10-09 | Applied Materials, Inc. | Semiconductor processing system |
JPS61173445A (ja) | 1985-01-28 | 1986-08-05 | Tokyo Erekutoron Kk | ウエハの真空処理装置 |
JPS61250185A (ja) * | 1985-04-25 | 1986-11-07 | Anelva Corp | 真空処理装置のクリ−ニング方法 |
JPS628801A (ja) | 1985-07-06 | 1987-01-16 | Toyo Tire & Rubber Co Ltd | 重荷重ラジアルタイヤ |
US4649629A (en) * | 1985-07-29 | 1987-03-17 | Thomson Components - Mostek Corp. | Method of late programming a read only memory |
JPS6244571A (ja) * | 1985-08-20 | 1987-02-26 | Toshiba Mach Co Ltd | イオン注入装置 |
JPS6250463A (ja) * | 1985-08-30 | 1987-03-05 | Hitachi Ltd | 連続スパツタ装置 |
JPS6289881A (ja) * | 1985-10-16 | 1987-04-24 | Hitachi Ltd | スパツタ装置 |
US5298393A (en) * | 1985-11-21 | 1994-03-29 | Teijin Limited | Monoclonal antibody for human acid-glutathione S-transferase and process for preparation thereof |
JPS62132321A (ja) | 1985-12-04 | 1987-06-15 | Anelva Corp | ドライエツチング装置 |
JPH0613751B2 (ja) * | 1986-03-07 | 1994-02-23 | 株式会社日立製作所 | 連続スパッタ装置 |
JPS62216315A (ja) | 1986-03-18 | 1987-09-22 | Toshiba Mach Co Ltd | 半導体処理装置 |
US4915564A (en) * | 1986-04-04 | 1990-04-10 | Materials Research Corporation | Method and apparatus for handling and processing wafer-like materials |
US4909695A (en) * | 1986-04-04 | 1990-03-20 | Materials Research Corporation | Method and apparatus for handling and processing wafer-like materials |
US4705951A (en) * | 1986-04-17 | 1987-11-10 | Varian Associates, Inc. | Wafer processing system |
US6103055A (en) * | 1986-04-18 | 2000-08-15 | Applied Materials, Inc. | System for processing substrates |
CA1331163C (en) * | 1986-04-18 | 1994-08-02 | Applied Materials, Inc. | Multiple-processing and contamination-free plasma etching system |
WO1987006561A1 (en) | 1986-04-28 | 1987-11-05 | Varian Associates, Inc. | Modular semiconductor wafer transport and processing system |
US4917556A (en) * | 1986-04-28 | 1990-04-17 | Varian Associates, Inc. | Modular wafer transport and processing system |
US4836733A (en) * | 1986-04-28 | 1989-06-06 | Varian Associates, Inc. | Wafer transfer system |
US4670126A (en) * | 1986-04-28 | 1987-06-02 | Varian Associates, Inc. | Sputter module for modular wafer processing system |
US4715764A (en) * | 1986-04-28 | 1987-12-29 | Varian Associates, Inc. | Gate valve for wafer processing system |
US4924890A (en) * | 1986-05-16 | 1990-05-15 | Eastman Kodak Company | Method and apparatus for cleaning semiconductor wafers |
WO1987007309A1 (en) * | 1986-05-19 | 1987-12-03 | Novellus Systems, Inc. | Deposition apparatus with automatic cleaning means and method of use |
US4866507A (en) | 1986-05-19 | 1989-09-12 | International Business Machines Corporation | Module for packaging semiconductor integrated circuit chips on a base substrate |
JPS636582A (ja) * | 1986-06-26 | 1988-01-12 | Mita Ind Co Ltd | 現像装置 |
JPS6357734A (ja) | 1986-08-28 | 1988-03-12 | Mitsubishi Heavy Ind Ltd | 繊維強化金属およびその製造法 |
US4904153A (en) * | 1986-11-20 | 1990-02-27 | Shimizu Construction Co., Ltd. | Transporting robot for semiconductor wafers |
JPS63131123A (ja) | 1986-11-20 | 1988-06-03 | Fujitsu Ltd | 光学式読取装置 |
JPS63133521A (ja) | 1986-11-25 | 1988-06-06 | Kokusai Electric Co Ltd | 半導体基板の熱処理装置 |
JPH0660397B2 (ja) * | 1986-12-15 | 1994-08-10 | 日本真空技術株式会社 | 真空槽内における基板交換装置 |
US5292393A (en) * | 1986-12-19 | 1994-03-08 | Applied Materials, Inc. | Multichamber integrated process system |
US4951601A (en) * | 1986-12-19 | 1990-08-28 | Applied Materials, Inc. | Multi-chamber integrated process system |
US5215619A (en) * | 1986-12-19 | 1993-06-01 | Applied Materials, Inc. | Magnetic field-enhanced plasma etch reactor |
JPS63127125U (ko) * | 1987-02-12 | 1988-08-19 | ||
JPS63244619A (ja) * | 1987-03-30 | 1988-10-12 | Sumitomo Metal Ind Ltd | プラズマ装置 |
US5169407A (en) * | 1987-03-31 | 1992-12-08 | Kabushiki Kaisha Toshiba | Method of determining end of cleaning of semiconductor manufacturing apparatus |
JPH0691952B2 (ja) * | 1987-04-17 | 1994-11-16 | 株式会社日立製作所 | 真空装置 |
JPS646582A (en) * | 1987-06-30 | 1989-01-11 | Tokyo Gas Co Ltd | Shutoff valve unit with nozzle |
JP2513588B2 (ja) * | 1987-07-01 | 1996-07-03 | 本田技研工業株式会社 | 内燃エンジンの燃料供給制御装置 |
JPS6411320A (en) * | 1987-07-06 | 1989-01-13 | Toshiba Corp | Photo-cvd device |
US4835453A (en) * | 1987-07-07 | 1989-05-30 | U.S. Philips Corp. | Battery-powered device |
JPH0636582Y2 (ja) | 1987-07-10 | 1994-09-21 | 株式会社日立製作所 | エッチング装置 |
US4836905A (en) * | 1987-07-16 | 1989-06-06 | Texas Instruments Incorporated | Processing apparatus |
JPS6431970A (en) * | 1987-07-28 | 1989-02-02 | Tokuda Seisakusho | Vacuum treatment equipment |
JPS6431971A (en) * | 1987-07-28 | 1989-02-02 | Tokuda Seisakusho | Vacuum treatment device |
JPS6436042A (en) | 1987-07-31 | 1989-02-07 | Kokusai Electric Co Ltd | Method and device for wafer handling in semiconductor manufacturing apparatus |
DE3827343A1 (de) * | 1988-08-12 | 1990-02-15 | Leybold Ag | Vorrichtung nach dem karussel-prinzip zum beschichten von substraten |
JPH0217636Y2 (ko) | 1987-08-27 | 1990-05-17 | ||
US4851101A (en) * | 1987-09-18 | 1989-07-25 | Varian Associates, Inc. | Sputter module for modular wafer processing machine |
US4903937A (en) * | 1987-09-24 | 1990-02-27 | Varian Associates, Inc. | Isolation valve for vacuum and non-vacuum application |
JP2868767B2 (ja) | 1987-11-04 | 1999-03-10 | 富士電機株式会社 | 半導体ウエハ処理装置 |
JPH0652721B2 (ja) * | 1987-11-20 | 1994-07-06 | 富士電機株式会社 | 半導体ウエハ処理装置 |
JP2610918B2 (ja) | 1987-12-25 | 1997-05-14 | 東京エレクトロン株式会社 | 被処理体の処理方法及び処理装置 |
US5225036A (en) * | 1988-03-28 | 1993-07-06 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor device |
JP2628335B2 (ja) * | 1988-03-31 | 1997-07-09 | テル・バリアン株式会社 | マルチチャンバ型cvd装置 |
JPH01258438A (ja) | 1988-04-08 | 1989-10-16 | Fujitsu Ltd | 物品情報管理方式 |
JPH0610357B2 (ja) * | 1988-05-25 | 1994-02-09 | 株式会社日立製作所 | プラズマ処理装置 |
JP2615860B2 (ja) * | 1988-06-09 | 1997-06-04 | 富士電機株式会社 | 半導体ウエハ処理装置 |
JPH01316957A (ja) | 1988-06-15 | 1989-12-21 | Nec Corp | 枚葉式処理装置 |
JPH07118208B2 (ja) | 1988-06-28 | 1995-12-18 | 株式会社小糸製作所 | 自動車用前照灯 |
US4857160A (en) * | 1988-07-25 | 1989-08-15 | Oerlikon-Buhrle U.S.A. Inc. | High vacuum processing system and method |
US4914556A (en) | 1988-07-26 | 1990-04-03 | Morpheus Lights, Inc. | Spectral filter module |
JPH0226229U (ko) * | 1988-08-05 | 1990-02-21 | ||
JPH0744315Y2 (ja) * | 1988-08-16 | 1995-10-11 | シンガー日鋼株式会社 | ミシンの後側ベルトガード |
JPH0252449A (ja) | 1988-08-16 | 1990-02-22 | Teru Barian Kk | 基板のロード・アンロード方法 |
JPH0265252A (ja) * | 1988-08-31 | 1990-03-05 | Nec Kyushu Ltd | 半導体製造装置 |
JP2545591B2 (ja) * | 1988-09-30 | 1996-10-23 | 国際電気株式会社 | ウェーハ処理装置 |
JP2690971B2 (ja) * | 1988-10-14 | 1997-12-17 | 東京エレクトロン株式会社 | 処理方法 |
US5536128A (en) | 1988-10-21 | 1996-07-16 | Hitachi, Ltd. | Method and apparatus for carrying a variety of products |
US4923584A (en) | 1988-10-31 | 1990-05-08 | Eaton Corporation | Sealing apparatus for a vacuum processing system |
EP0367423A3 (en) * | 1988-10-31 | 1991-01-09 | Eaton Corporation | Vacuum deposition system |
JPH02224242A (ja) | 1988-11-21 | 1990-09-06 | Oki Electric Ind Co Ltd | 半導体基板処理装置 |
JPH02178946A (ja) | 1988-12-29 | 1990-07-11 | Tokyo Electron Ltd | 半導体製造装置 |
JPH07105357B2 (ja) * | 1989-01-28 | 1995-11-13 | 国際電気株式会社 | 縦型cvd拡散装置に於けるウェーハ移載方法及び装置 |
DE3903607A1 (de) * | 1989-02-08 | 1990-08-09 | Leybold Ag | Vorrichtung zum reinigen, pruefen und einordnen von werkstuecken |
US5014217A (en) * | 1989-02-09 | 1991-05-07 | S C Technology, Inc. | Apparatus and method for automatically identifying chemical species within a plasma reactor environment |
JP2853143B2 (ja) | 1989-02-25 | 1999-02-03 | ソニー株式会社 | 半導体装置の製造方法 |
JP2528962B2 (ja) * | 1989-02-27 | 1996-08-28 | 株式会社日立製作所 | 試料処理方法及び装置 |
JPH0793348B2 (ja) | 1989-05-19 | 1995-10-09 | アプライド マテリアルズ インコーポレーテッド | 多重チャンバ真空式処理装置及び多重チャンバ真空式半導体ウェーハ処理装置 |
US5186718A (en) | 1989-05-19 | 1993-02-16 | Applied Materials, Inc. | Staged-vacuum wafer processing system and method |
EP0809283A3 (en) * | 1989-08-28 | 1998-02-25 | Hitachi, Ltd. | Method of treating wafers |
JP2862956B2 (ja) * | 1990-05-28 | 1999-03-03 | 大日本スクリーン製造株式会社 | 基板搬送装置 |
JPH0482841A (ja) | 1990-07-23 | 1992-03-16 | Arakawa Chem Ind Co Ltd | 低分子量芳香族炭化水素化合物の水素化方法 |
JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
US5436848A (en) | 1990-09-03 | 1995-07-25 | Dainippon Screen Mfg. Co., Ltd. | Method of and device for transporting semiconductor substrate in semiconductor processing system |
US5685684A (en) * | 1990-11-26 | 1997-11-11 | Hitachi, Ltd. | Vacuum processing system |
JP2595132B2 (ja) * | 1990-11-26 | 1997-03-26 | 株式会社日立製作所 | 真空処理装置 |
US5286296A (en) * | 1991-01-10 | 1994-02-15 | Sony Corporation | Multi-chamber wafer process equipment having plural, physically communicating transfer means |
JPH05275511A (ja) * | 1991-03-01 | 1993-10-22 | Tokyo Electron Ltd | 被処理体の移載システム及び処理装置 |
JP2579851B2 (ja) | 1991-06-21 | 1997-02-12 | 太陽化学株式会社 | 食品用日持ち向上剤 |
JP2751975B2 (ja) * | 1991-12-20 | 1998-05-18 | 株式会社日立製作所 | 半導体処理装置のロードロック室 |
US5766360A (en) * | 1992-03-27 | 1998-06-16 | Kabushiki Kaisha Toshiba | Substrate processing apparatus and substrate processing method |
US5351415A (en) * | 1992-05-18 | 1994-10-04 | Convey, Inc. | Method and apparatus for maintaining clean articles |
US5252178A (en) * | 1992-06-24 | 1993-10-12 | Texas Instruments Incorporated | Multi-zone plasma processing method and apparatus |
JPH0636582A (ja) * | 1992-07-21 | 1994-02-10 | Oki Micro Design Miyazaki:Kk | 読み出し回路 |
JP3139155B2 (ja) * | 1992-07-29 | 2001-02-26 | 東京エレクトロン株式会社 | 真空処理装置 |
US5382541A (en) * | 1992-08-26 | 1995-01-17 | Harris Corporation | Method for forming recessed oxide isolation containing deep and shallow trenches |
CH686445A5 (de) * | 1992-10-06 | 1996-03-29 | Balzers Hochvakuum | Kammer und Kammerkombination fuer eine Vakuumanlage und Verfahren zum Durchreichen mindestens eines Werkstueckes. |
US6022458A (en) * | 1992-12-07 | 2000-02-08 | Canon Kabushiki Kaisha | Method of production of a semiconductor substrate |
KR970011065B1 (ko) * | 1992-12-21 | 1997-07-05 | 다이닛뽕 스크린 세이조오 가부시키가이샤 | 기판처리장치와 기판처리장치에 있어서 기판교환장치 및 기판교환방법 |
US5295777A (en) * | 1992-12-23 | 1994-03-22 | Materials Research Corporation | Wafer transport module with rotatable and horizontally extendable wafer holder |
JP3218488B2 (ja) * | 1993-03-16 | 2001-10-15 | 東京エレクトロン株式会社 | 処理装置 |
KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
US5647945A (en) * | 1993-08-25 | 1997-07-15 | Tokyo Electron Limited | Vacuum processing apparatus |
US5616208A (en) * | 1993-09-17 | 1997-04-01 | Tokyo Electron Limited | Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
US5452166A (en) * | 1993-10-01 | 1995-09-19 | Applied Magnetics Corporation | Thin film magnetic recording head for minimizing undershoots and a method for manufacturing the same |
ES2115837T3 (es) | 1993-10-21 | 1998-07-01 | Asea Brown Boveri | Parrilla para una instalacion de combustion. |
US5934856A (en) * | 1994-05-23 | 1999-08-10 | Tokyo Electron Limited | Multi-chamber treatment system |
JP3471916B2 (ja) | 1994-09-28 | 2003-12-02 | サッポロホールディングス株式会社 | 組換えβ−アミラーゼ |
US5504347A (en) * | 1994-10-17 | 1996-04-02 | Texas Instruments Incorporated | Lateral resonant tunneling device having gate electrode aligned with tunneling barriers |
TW297919B (ko) * | 1995-03-06 | 1997-02-11 | Motorola Inc | |
JP2861885B2 (ja) | 1995-09-19 | 1999-02-24 | ヤマハ株式会社 | 効果付与アダプタ |
DE19546826C1 (de) * | 1995-12-15 | 1997-04-03 | Fraunhofer Ges Forschung | Verfahren und Einrichtung zur Vorbehandlung von Substraten |
US5746565A (en) * | 1996-01-22 | 1998-05-05 | Integrated Solutions, Inc. | Robotic wafer handler |
US5944940A (en) * | 1996-07-09 | 1999-08-31 | Gamma Precision Technology, Inc. | Wafer transfer system and method of using the same |
US6152070A (en) * | 1996-11-18 | 2000-11-28 | Applied Materials, Inc. | Tandem process chamber |
JPH11135600A (ja) * | 1997-08-25 | 1999-05-21 | Shibaura Mechatronics Corp | ロボット装置および処理装置 |
US6235634B1 (en) * | 1997-10-08 | 2001-05-22 | Applied Komatsu Technology, Inc. | Modular substrate processing system |
US5970908A (en) * | 1997-12-13 | 1999-10-26 | Compuvac Systems, Inc. | Apparatus and improved polymerization gun for coating objects by vacuum deposit |
KR100257903B1 (ko) * | 1997-12-30 | 2000-08-01 | 윤종용 | 인시튜 모니터링가능한 플라즈마 식각장치, 그 인시튜 모니터링방법, 플라즈마 식각챔버내의 잔류물 제거를 위한 인시튜 세정방법 |
US6059567A (en) * | 1998-02-10 | 2000-05-09 | Silicon Valley Group, Inc. | Semiconductor thermal processor with recirculating heater exhaust cooling system |
US6277235B1 (en) * | 1998-08-11 | 2001-08-21 | Novellus Systems, Inc. | In situ plasma clean gas injection |
-
1990
- 1990-08-29 JP JP2225321A patent/JP2644912B2/ja not_active Expired - Lifetime
-
1991
- 1991-08-19 DE DE69128861T patent/DE69128861T3/de not_active Expired - Fee Related
- 1991-08-19 DE DE69133567T patent/DE69133567T2/de not_active Expired - Lifetime
- 1991-08-19 EP EP00121402A patent/EP1076354B1/en not_active Expired - Lifetime
- 1991-08-19 EP EP00121401A patent/EP1079418B1/en not_active Expired - Lifetime
- 1991-08-19 EP EP98106162A patent/EP0856875B1/en not_active Expired - Lifetime
- 1991-08-19 DE DE69133254T patent/DE69133254T2/de not_active Expired - Fee Related
- 1991-08-19 DE DE69133564T patent/DE69133564T2/de not_active Expired - Lifetime
- 1991-08-19 EP EP97111628A patent/EP0805481B1/en not_active Expired - Lifetime
- 1991-08-19 EP EP91307625A patent/EP0475604B2/en not_active Expired - Lifetime
- 1991-08-19 DE DE69133535T patent/DE69133535T2/de not_active Expired - Lifetime
- 1991-08-29 KR KR1019910014984A patent/KR0184682B1/ko not_active IP Right Cessation
- 1991-08-29 US US07/751,951 patent/US5314509A/en not_active Expired - Lifetime
-
1993
- 1993-07-26 US US08/096,256 patent/US5349762A/en not_active Expired - Lifetime
-
1994
- 1994-09-09 US US08/302,443 patent/US5457896A/en not_active Expired - Lifetime
-
1995
- 1995-05-17 US US08/443,039 patent/US5553396A/en not_active Expired - Lifetime
-
1996
- 1996-01-30 US US08/593,870 patent/US5661913A/en not_active Expired - Lifetime
-
1997
- 1997-06-26 US US08/882,731 patent/US5784799A/en not_active Expired - Lifetime
-
1998
- 1998-04-16 US US09/061,062 patent/US5950330A/en not_active Expired - Lifetime
- 1998-10-23 US US09/177,495 patent/US6012235A/en not_active Expired - Lifetime
-
1999
- 1999-01-15 US US09/231,451 patent/US6055740A/en not_active Expired - Fee Related
- 1999-09-03 US US09/389,461 patent/US6112431A/en not_active Expired - Fee Related
- 1999-09-07 US US09/390,681 patent/US6070341A/en not_active Ceased
- 1999-09-07 US US09/390,684 patent/US6044576A/en not_active Expired - Fee Related
- 1999-12-16 US US09/461,432 patent/US6330755B1/en not_active Ceased
- 1999-12-16 US US09/461,433 patent/US6108929A/en not_active Expired - Fee Related
-
2000
- 2000-04-19 US US09/552,572 patent/US6301801B1/en not_active Expired - Fee Related
- 2000-07-12 US US09/614,770 patent/US6263588B1/en not_active Ceased
- 2000-07-12 US US09/614,764 patent/US6330756B1/en not_active Ceased
- 2000-11-29 US US09/725,257 patent/US6314658B2/en not_active Ceased
-
2001
- 2001-01-22 US US09/765,379 patent/US6301802B1/en not_active Expired - Fee Related
- 2001-01-23 US US09/766,976 patent/US6467186B2/en not_active Expired - Fee Related
- 2001-01-23 US US09/766,597 patent/US6625899B2/en not_active Expired - Fee Related
- 2001-01-23 US US09/766,975 patent/US6655044B2/en not_active Expired - Fee Related
- 2001-01-23 US US09/766,587 patent/US6487793B2/en not_active Expired - Fee Related
- 2001-01-24 US US09/767,834 patent/US6332280B2/en not_active Expired - Fee Related
- 2001-01-24 US US09/767,837 patent/US6470596B2/en not_active Expired - Fee Related
- 2001-02-12 US US09/780,427 patent/US6463676B1/en not_active Expired - Fee Related
- 2001-02-12 US US09/780,394 patent/US6460270B2/en not_active Expired - Fee Related
- 2001-02-12 US US09/780,444 patent/US6588121B2/en not_active Expired - Fee Related
- 2001-02-13 US US09/781,295 patent/US6662465B2/en not_active Expired - Fee Related
- 2001-02-13 US US09/781,297 patent/US6473989B2/en not_active Expired - Fee Related
- 2001-02-13 US US09/781,298 patent/US6484414B2/en not_active Expired - Fee Related
- 2001-02-13 US US09/781,317 patent/US6457253B2/en not_active Expired - Fee Related
- 2001-02-13 US US09/781,452 patent/US6634116B2/en not_active Expired - Fee Related
- 2001-02-13 US US09/781,270 patent/US6446353B2/en not_active Expired - Fee Related
- 2001-02-13 US US09/781,296 patent/US6505415B2/en not_active Expired - Fee Related
- 2001-02-13 US US09/781,293 patent/US6499229B2/en not_active Expired - Fee Related
- 2001-02-14 US US09/782,192 patent/US6467187B2/en not_active Expired - Fee Related
- 2001-02-14 US US09/782,193 patent/US6484415B2/en not_active Expired - Fee Related
- 2001-02-14 US US09/782,194 patent/US6463678B2/en not_active Expired - Fee Related
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- 2001-02-14 US US09/782,197 patent/US6490810B2/en not_active Expired - Fee Related
- 2001-02-14 US US09/782,195 patent/US6487794B2/en not_active Expired - Fee Related
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2003
- 2003-10-14 US US10/683,067 patent/US6886272B2/en not_active Expired - Fee Related
- 2003-10-14 US US10/682,901 patent/US6880264B2/en not_active Expired - Fee Related
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2004
- 2004-03-10 US US10/796,207 patent/US6904699B2/en not_active Expired - Fee Related
- 2004-03-10 US US10/796,195 patent/US6968630B2/en not_active Expired - Fee Related
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2005
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100234060B1 (ko) * | 1996-12-04 | 1999-12-15 | 구자홍 | 음극선관용 스프링 구조 |
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