AU2002230793A1 - Method and apparatus for cleaning a deposition chamber - Google Patents
Method and apparatus for cleaning a deposition chamberInfo
- Publication number
- AU2002230793A1 AU2002230793A1 AU2002230793A AU3079302A AU2002230793A1 AU 2002230793 A1 AU2002230793 A1 AU 2002230793A1 AU 2002230793 A AU2002230793 A AU 2002230793A AU 3079302 A AU3079302 A AU 3079302A AU 2002230793 A1 AU2002230793 A1 AU 2002230793A1
- Authority
- AU
- Australia
- Prior art keywords
- cleaning
- deposition chamber
- deposition
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70269700A | 2000-10-31 | 2000-10-31 | |
US09/702,697 | 2000-10-31 | ||
PCT/US2001/048051 WO2002037543A2 (en) | 2000-10-31 | 2001-10-30 | Method and apparatus for cleaning a deposition chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002230793A1 true AU2002230793A1 (en) | 2002-05-15 |
Family
ID=24822237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002230793A Abandoned AU2002230793A1 (en) | 2000-10-31 | 2001-10-30 | Method and apparatus for cleaning a deposition chamber |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2002230793A1 (en) |
WO (1) | WO2002037543A2 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0441368B1 (en) * | 1990-02-09 | 1996-05-08 | Applied Materials, Inc. | Method and device for removing excess material from a sputtering chamber |
JP2644912B2 (en) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | Vacuum processing apparatus and operating method thereof |
US5380414A (en) * | 1993-06-11 | 1995-01-10 | Applied Materials, Inc. | Shield and collimator pasting deposition chamber with a wafer support periodically used as an acceptor |
JPH0892764A (en) * | 1994-09-22 | 1996-04-09 | Nec Kyushu Ltd | Sputtering device |
US6103069A (en) * | 1997-03-31 | 2000-08-15 | Applied Materials, Inc. | Chamber design with isolation valve to preserve vacuum during maintenance |
TW460943B (en) * | 1997-06-11 | 2001-10-21 | Applied Materials Inc | Reduction of mobile ion and metal contamination in HDP-CVD chambers using chamber seasoning film depositions |
-
2001
- 2001-10-30 WO PCT/US2001/048051 patent/WO2002037543A2/en active Application Filing
- 2001-10-30 AU AU2002230793A patent/AU2002230793A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2002037543A3 (en) | 2003-03-27 |
WO2002037543A2 (en) | 2002-05-10 |
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