AU2001265034A1 - Apparatus and process for cleaning a work piece - Google Patents

Apparatus and process for cleaning a work piece

Info

Publication number
AU2001265034A1
AU2001265034A1 AU2001265034A AU6503401A AU2001265034A1 AU 2001265034 A1 AU2001265034 A1 AU 2001265034A1 AU 2001265034 A AU2001265034 A AU 2001265034A AU 6503401 A AU6503401 A AU 6503401A AU 2001265034 A1 AU2001265034 A1 AU 2001265034A1
Authority
AU
Australia
Prior art keywords
cleaning
work piece
piece
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001265034A
Inventor
Glenn E. Peterson
Ned Teeny
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of AU2001265034A1 publication Critical patent/AU2001265034A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/10Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12Brushes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/10Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14Wipes; Absorbent members, e.g. swabs or sponges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/50Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/50Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/52Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/50Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/54Cleaning by methods involving the use of tools involving cleaning of the cleaning members using mechanical tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AU2001265034A 2000-05-24 2001-05-24 Apparatus and process for cleaning a work piece Abandoned AU2001265034A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/577,448 US6418584B1 (en) 2000-05-24 2000-05-24 Apparatus and process for cleaning a work piece
US09577448 2000-05-24
PCT/US2001/017145 WO2001089728A1 (en) 2000-05-24 2001-05-24 Apparatus and process for cleaning a work piece

Publications (1)

Publication Number Publication Date
AU2001265034A1 true AU2001265034A1 (en) 2001-12-03

Family

ID=24308785

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001265034A Abandoned AU2001265034A1 (en) 2000-05-24 2001-05-24 Apparatus and process for cleaning a work piece

Country Status (3)

Country Link
US (1) US6418584B1 (en)
AU (1) AU2001265034A1 (en)
WO (1) WO2001089728A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6651284B2 (en) * 2001-10-11 2003-11-25 Silicon Integrated Systems Corp. Scrubbing assembly for wafer-cleaning device
US7252099B2 (en) * 2003-09-05 2007-08-07 Nan Ya Technology Corporation Wafer cleaning apparatus with multiple wash-heads
US7345466B2 (en) * 2005-08-02 2008-03-18 Electroglas, Inc. Method and apparatus for cleaning a probe card
US7634820B2 (en) * 2006-01-20 2009-12-22 Sport Maska Inc. Adjustment mechanism for a helmet
US20070251035A1 (en) * 2006-05-01 2007-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Cleaning device
US7828001B2 (en) * 2007-01-23 2010-11-09 Lamb Douglas R Pad washing system with splash guard
US9211568B2 (en) * 2013-03-12 2015-12-15 Taiwan Semiconductor Manufacturing Company Limited Clean function for semiconductor wafer scrubber
US10504753B2 (en) * 2013-12-13 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
JP6684191B2 (en) * 2016-09-05 2020-04-22 株式会社Screenホールディングス Substrate cleaning apparatus and substrate processing apparatus including the same
CN111957632A (en) * 2020-08-14 2020-11-20 成都奥捷通信技术有限公司 Adapter end face cleaning device and cleaning method thereof
CN112145482B (en) * 2020-09-21 2022-06-21 福安市建达流体科技有限公司 Water pump case inside wall waste material clearing device
CN113600561B (en) * 2021-06-19 2022-07-12 江苏雅高酒店配套用品有限公司 Be used for clean dust collector of spinning machine surface
CN113894106B (en) * 2021-10-09 2023-01-13 杭州中欣晶圆半导体股份有限公司 Automatic feeding and discharging system of cleaning machine and operation method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182234A (en) 1982-04-17 1983-10-25 Dainippon Screen Mfg Co Ltd Washing apparatus allowing use of plural kinds of brushes
KR0150595B1 (en) * 1994-06-30 1998-12-01 이시다 아키라 Apparatus for cleaning a substrate and method for attaching/detaching a cleaning brushes
US5471726A (en) 1994-11-28 1995-12-05 Kaiser; Richard A. Buffing pad cleaning apparatus
KR100213992B1 (en) * 1995-05-12 1999-08-02 히가시 데쓰로 Cleaning apparatus
JP3447869B2 (en) 1995-09-20 2003-09-16 株式会社荏原製作所 Cleaning method and apparatus
JP2988366B2 (en) * 1996-03-28 1999-12-13 日本電気株式会社 Cleaning equipment
US5950327A (en) 1996-07-08 1999-09-14 Speedfam-Ipec Corporation Methods and apparatus for cleaning and drying wafers
KR19980022571A (en) * 1996-09-23 1998-07-06 김광호 Semiconductor Scrubber Equipment
US5870793A (en) 1997-05-02 1999-02-16 Integrated Process Equipment Corp. Brush for scrubbing semiconductor wafers
JP3320640B2 (en) 1997-07-23 2002-09-03 東京エレクトロン株式会社 Cleaning equipment
US5894622A (en) * 1997-12-31 1999-04-20 International Business Machines Corporation Brush conditioner wing

Also Published As

Publication number Publication date
US6418584B1 (en) 2002-07-16
WO2001089728A1 (en) 2001-11-29

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