AU2002316240A1 - Improved method and apparatus for bi-directionally polishing a workpiece - Google Patents

Improved method and apparatus for bi-directionally polishing a workpiece

Info

Publication number
AU2002316240A1
AU2002316240A1 AU2002316240A AU2002316240A AU2002316240A1 AU 2002316240 A1 AU2002316240 A1 AU 2002316240A1 AU 2002316240 A AU2002316240 A AU 2002316240A AU 2002316240 A AU2002316240 A AU 2002316240A AU 2002316240 A1 AU2002316240 A1 AU 2002316240A1
Authority
AU
Australia
Prior art keywords
directionally
polishing
workpiece
improved method
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002316240A
Inventor
Jalal Ashjaee
Bernard M. Frey
Mark Henderson
Vulf Perlov
Homayoun Talieh
Efrain Velazquez
Konstantin Volodarsky
Douglas W. Young
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Nutool Inc
Original Assignee
ASM Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/880,730 external-priority patent/US6464571B2/en
Priority claimed from US10/126,464 external-priority patent/US6589105B2/en
Priority claimed from US10/126,469 external-priority patent/US6634935B2/en
Application filed by ASM Nutool Inc filed Critical ASM Nutool Inc
Publication of AU2002316240A1 publication Critical patent/AU2002316240A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B24B21/22—Accessories for producing a reciprocation of the grinding belt normal to its direction of movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2002316240A 2001-06-12 2002-06-12 Improved method and apparatus for bi-directionally polishing a workpiece Abandoned AU2002316240A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US09/880,730 2001-06-12
US09/880,730 US6464571B2 (en) 1998-12-01 2001-06-12 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
US10/126,469 2002-04-18
US10/126,464 2002-04-18
US10/126,464 US6589105B2 (en) 1998-12-01 2002-04-18 Pad tensioning method and system in a bi-directional linear polisher
US10/126,469 US6634935B2 (en) 1998-12-01 2002-04-18 Single drive system for a bi-directional linear chemical mechanical polishing apparatus
PCT/US2002/018827 WO2002100594A1 (en) 2001-06-12 2002-06-12 Improved method and apparatus for bi-directionally polishing a workpiece

Publications (1)

Publication Number Publication Date
AU2002316240A1 true AU2002316240A1 (en) 2002-12-23

Family

ID=27383427

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002316240A Abandoned AU2002316240A1 (en) 2001-06-12 2002-06-12 Improved method and apparatus for bi-directionally polishing a workpiece

Country Status (7)

Country Link
EP (1) EP1395392A1 (en)
JP (1) JP2004528998A (en)
KR (1) KR100665748B1 (en)
CN (1) CN1638919A (en)
AU (1) AU2002316240A1 (en)
TW (1) TW552177B (en)
WO (1) WO2002100594A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5596030B2 (en) 2008-06-26 2014-09-24 スリーエム イノベイティブ プロパティズ カンパニー Polishing pad having porous element and method for producing and using the same
KR101011220B1 (en) * 2010-07-02 2011-01-26 연세대학교 산학협력단 Steel girder
CN102490111B (en) * 2011-11-24 2014-06-11 上海华力微电子有限公司 Fixed abrasive chemical-mechanical grinding device
CN102699796B (en) * 2012-05-14 2014-12-03 宁波霍思特精密机械有限公司 Grinding device for gate of high temperature alloy casting
CN103722470A (en) * 2014-01-26 2014-04-16 福建长江工业有限公司 Method for guaranteeing consistency of polishing performances of products and grinding and polishing equipment
TWI574778B (en) * 2015-02-11 2017-03-21 國立勤益科技大學 Polishing machine
CN109015306B (en) * 2018-09-10 2020-05-22 安徽鑫艺达抛光机械有限公司 Feeding device of polishing equipment
CN111941201B (en) * 2020-08-21 2021-12-07 许昌学院 High-precision manufacturing device for Fabry-Perot interferometer mirror plate
CN115284140B (en) * 2022-08-17 2023-11-17 昆山新莱洁净应用材料股份有限公司 BPE sanitary pipe fitting batch polishing device and polishing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2636556A1 (en) * 1988-09-19 1990-03-23 Marunaga & Co Ltd
DE69206685T2 (en) * 1991-06-06 1996-07-04 Commissariat Energie Atomique Polishing machine with a tensioned fine grinding belt and an improved workpiece carrier head
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US6464571B2 (en) * 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
US6103628A (en) * 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
DE60019352T2 (en) * 1999-02-04 2006-05-11 Applied Materials, Inc., Santa Clara Chemical-mechanical polishing with a moving polishing cloth
US6520833B1 (en) * 2000-06-30 2003-02-18 Lam Research Corporation Oscillating fixed abrasive CMP system and methods for implementing the same

Also Published As

Publication number Publication date
TW552177B (en) 2003-09-11
WO2002100594A1 (en) 2002-12-19
EP1395392A1 (en) 2004-03-10
WO2002100594A8 (en) 2003-02-20
KR20040025689A (en) 2004-03-24
CN1638919A (en) 2005-07-13
JP2004528998A (en) 2004-09-24
KR100665748B1 (en) 2007-01-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase