WO2002100594A8 - Improved method and apparatus for bi-directionally polishing a workpiece - Google Patents

Improved method and apparatus for bi-directionally polishing a workpiece

Info

Publication number
WO2002100594A8
WO2002100594A8 PCT/US2002/018827 US0218827W WO02100594A8 WO 2002100594 A8 WO2002100594 A8 WO 2002100594A8 US 0218827 W US0218827 W US 0218827W WO 02100594 A8 WO02100594 A8 WO 02100594A8
Authority
WO
WIPO (PCT)
Prior art keywords
spool
polishing pad
tension
polishing
directionally
Prior art date
Application number
PCT/US2002/018827
Other languages
French (fr)
Other versions
WO2002100594A1 (en
Inventor
Homayoun Talieh
Konstantin Volodarsky
Jalal Ashjaee
Douglas W Young
Vulf Perlov
Efrain Velazquez
Mark Henderson
Bernard M Frey
Original Assignee
Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/880,730 external-priority patent/US6464571B2/en
Priority claimed from US10/126,464 external-priority patent/US6589105B2/en
Priority claimed from US10/126,469 external-priority patent/US6634935B2/en
Application filed by Nutool Inc filed Critical Nutool Inc
Priority to JP2003503399A priority Critical patent/JP2004528998A/en
Priority to EP02746526A priority patent/EP1395392A1/en
Priority to KR1020037016337A priority patent/KR100665748B1/en
Priority to AU2002316240A priority patent/AU2002316240A1/en
Publication of WO2002100594A1 publication Critical patent/WO2002100594A1/en
Publication of WO2002100594A8 publication Critical patent/WO2002100594A8/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B24B21/22—Accessories for producing a reciprocation of the grinding belt normal to its direction of movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A chemical mechanical polishing apparatus and method uses a portion of a polishing pad (130) that is disposed under tension between a supply spool (160) and a receive spool (162) such that it will not degrade, a single drive system that allows for efficient bi-directional linear motion, and a mechanism that provides tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor (770) that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism (fig 8) is used to ensure that the tension of the polishing pad is consistently maintained.
PCT/US2002/018827 2001-06-12 2002-06-12 Improved method and apparatus for bi-directionally polishing a workpiece WO2002100594A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003503399A JP2004528998A (en) 2001-06-12 2002-06-12 Improved method and apparatus for polishing workpieces in two directions
EP02746526A EP1395392A1 (en) 2001-06-12 2002-06-12 Improved method and apparatus for bi-directionally polishing a workpiece
KR1020037016337A KR100665748B1 (en) 2001-06-12 2002-06-12 Improved method and apparatus for bi-directionally polishing a workpiece
AU2002316240A AU2002316240A1 (en) 2001-06-12 2002-06-12 Improved method and apparatus for bi-directionally polishing a workpiece

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US09/880,730 US6464571B2 (en) 1998-12-01 2001-06-12 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
US09/880,730 2001-06-12
US10/126,464 2002-04-18
US10/126,464 US6589105B2 (en) 1998-12-01 2002-04-18 Pad tensioning method and system in a bi-directional linear polisher
US10/126,469 US6634935B2 (en) 1998-12-01 2002-04-18 Single drive system for a bi-directional linear chemical mechanical polishing apparatus
US10/126,469 2002-04-18

Publications (2)

Publication Number Publication Date
WO2002100594A1 WO2002100594A1 (en) 2002-12-19
WO2002100594A8 true WO2002100594A8 (en) 2003-02-20

Family

ID=27383427

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/018827 WO2002100594A1 (en) 2001-06-12 2002-06-12 Improved method and apparatus for bi-directionally polishing a workpiece

Country Status (7)

Country Link
EP (1) EP1395392A1 (en)
JP (1) JP2004528998A (en)
KR (1) KR100665748B1 (en)
CN (1) CN1638919A (en)
AU (1) AU2002316240A1 (en)
TW (1) TW552177B (en)
WO (1) WO2002100594A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8821214B2 (en) 2008-06-26 2014-09-02 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same
KR101011220B1 (en) * 2010-07-02 2011-01-26 연세대학교 산학협력단 Steel girder
CN102490111B (en) * 2011-11-24 2014-06-11 上海华力微电子有限公司 Fixed abrasive chemical-mechanical grinding device
CN102699796B (en) * 2012-05-14 2014-12-03 宁波霍思特精密机械有限公司 Grinding device for gate of high temperature alloy casting
CN103722470A (en) * 2014-01-26 2014-04-16 福建长江工业有限公司 Method for guaranteeing consistency of polishing performances of products and grinding and polishing equipment
TWI574778B (en) * 2015-02-11 2017-03-21 國立勤益科技大學 Polishing machine
CN109015306B (en) * 2018-09-10 2020-05-22 安徽鑫艺达抛光机械有限公司 Feeding device of polishing equipment
CN111941201B (en) * 2020-08-21 2021-12-07 许昌学院 High-precision manufacturing device for Fabry-Perot interferometer mirror plate
CN115284140B (en) * 2022-08-17 2023-11-17 昆山新莱洁净应用材料股份有限公司 BPE sanitary pipe fitting batch polishing device and polishing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3844249C2 (en) * 1988-09-19 1994-02-24 Marunaga & Co Ltd Belt grinder
JPH05177523A (en) * 1991-06-06 1993-07-20 Commiss Energ Atom Stretched fine abrasive platelet and abrasive apparatus provided with improved wafer supporting head
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US6103628A (en) * 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
US6464571B2 (en) * 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
EP1025955B1 (en) * 1999-02-04 2005-04-13 Applied Materials, Inc. Chemical mechanical polishing with a moving polishing sheet
US6520833B1 (en) * 2000-06-30 2003-02-18 Lam Research Corporation Oscillating fixed abrasive CMP system and methods for implementing the same

Also Published As

Publication number Publication date
JP2004528998A (en) 2004-09-24
AU2002316240A1 (en) 2002-12-23
TW552177B (en) 2003-09-11
KR20040025689A (en) 2004-03-24
EP1395392A1 (en) 2004-03-10
WO2002100594A1 (en) 2002-12-19
CN1638919A (en) 2005-07-13
KR100665748B1 (en) 2007-01-09

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