KR20040025689A - Improved method and apparatus for bi-directionally polishing a workpiece - Google Patents

Abstract

The chemical mechanical polishing apparatus and method according to the invention is a part of the polishing pad 130 which is placed under tension between the supply spool 160 and the receiving spool 162 so that it does not deteriorate, a single drive considering efficient bidirectional linear motion. The system and other spools use a mechanism that provides tension to the supply spool or receiving spool that is locked during processing. If a new section of polishing pad is needed, the same motor 770 provided with tension is used to advance the polishing pad a predetermined amount. In addition, during processing, the feedback mechanism (Fig. 8) is used to ensure that the tension of the polishing pad is kept constant.

Description

IMPROVED METHOD AND APPARATUS FOR BI-DIRECTIONALLY POLISHING A WORKPIECE}

Chemical mechanical polishing (CMP) of materials for VLSI and ULSI applications has important and wide applications in the semiconductor industry. CMP is a process of planarizing and polishing semiconductor wafers that combines chemical removal of layers such as insulators, metals, and photoresists with physical polishing or buffering of the wafer layer surface. In general, CMP is used to planarize surfaces during the wafer fabrication process and is to provide an overall plan view of the wafer surface. For example, in the wafer fabrication process, CMP is used to planarize / polish the raised profile in a multilevel metal interconnection scheme. To achieve the desired flatness of the wafer surface, one must not contaminate the desired surface. In addition, the CMP process should avoid falling away by polishing the positions of the functional circuit components.

Now, a conventional system for chemical mechanical polishing of semiconductor wafers will be described. Conventional CMP processes require placing the wafer on a holder that rotates about a first axis and descending onto a polishing pad that rotates in an opposite direction about a second axis. The wafer holder presses the wafer against the polishing pad during the planarization process. Typically, a polishing agent, or slurry, is supplied to the polishing pad to polish the wafer. In another conventional CMP process, the wafer holder places and presses the wafer against the belt-shaped polishing pad, while the pad continues to move in the same linear direction with respect to the wafer. So-called belt polishing pads are movable in one continuous path during this polishing process. These conventional polishing processes may further include a conditioning station located in the path of the polishing pad that conditions the pad during polishing. Factors that need to be controlled to achieve the desired flatness and flatness include polishing time, pressure between wafer and pad, rotation speed, slurry particle size, slurry feed rate, slurry chemistry and pad material.

Although the CMP process described above is widely used and accepted in the semiconductor industry, problems remain. For example, the problem remains of anticipating and controlling the speed and uniformity with which the process removes material from the substrate. As a result, CMP is a labor intensive and expensive process because the thickness and uniformity of the layers on the substrate surface must be constantly monitored to prevent over or inconsistent polishing of the wafer surface.

U. S. Patent No. 6,103, 628, filed by the applicant of the present invention, discloses a reverse linear chemical mechanical polisher (also called a bidirectional linear chemical mechanical polisher) that operates to use bidirectional linear movement to perform chemical mechanical polishing. To start. In use, the rotating wafer carrier in the polishing area holds the wafer to be polished.

Benefits for polishing a semiconductor wafer, including a system that does not degrade the front of the wafer, a system that provides a more efficient drive system that produces inverted linear (or bidirectional linear) motion, and a system that provides more effective tensioning of the polishing belt. There is still a need for more efficient and lower cost methods and apparatus.

The present invention relates to the manufacture of semiconductor wafers, and more particularly, to a method and apparatus for polishing a semiconductor wafer or workpiece with high planarity and high uniformity at high bidirectional linearity or reciprocation speed. will be. In particular, the present invention includes a bidirectional linear chemical mechanical polishing comprising a moving portion of a disposed polishing belt that is not deteriorated even when supported in a support mechanism disposed between a supply spool and a receiving spool. Relates to a device. A system and method for driving a bidirectional linear chemical mechanical polishing apparatus are also provided, and a system and method for tensioning a polishing pad in a chemical mechanical polishing apparatus are provided.

These and other advantages of the present invention will become more apparent from the more detailed description of the preferred and exemplary embodiments of the invention in conjunction with the accompanying drawings.

1 illustrates a bidirectional linear polisher according to the present invention;

2 is a simplified illustration of a drive mechanism providing a new part of a polishing pad according to the present invention;

3A and 3B are side and cross-sectional views of a polishing apparatus including a drive mechanism for providing a new portion of a polishing pad according to the present invention;

4 is a perspective view of a pad drive system including a horizontal slide member that is movable horizontally on a stationary casting using drive components according to the present invention;

5 illustrates a polishing pad path through the components of a casting taking into account the processing region resulting in bidirectional linear movement of the polishing pad;

6 illustrates a side view of a horizontal slide member and drive system according to the present invention;

7A and 7B illustrate tension and incremental mechanisms in accordance with the present invention;

8 illustrates a controller used to control tension and incremental mechanisms in accordance with the present invention; And

9 is a flowchart illustrating a preferred operation using a tensioning and incrementing apparatus in accordance with the present invention.

The present invention overcomes the identified limitations and provides an improved method and apparatus for polishing a workpiece in both directions. Therefore, many advantages can be obtained by using the present invention including the following.

An advantage of the present invention is to provide a method and apparatus for polishing a semiconductor wafer in a uniform plan view.

Another advantage of the present invention is to provide a method and apparatus for polishing a semiconductor wafer with a pad having high bidirectional linearity or reciprocation speed.

Another advantage of the present invention is to provide a polishing method and system for providing a "fresh" polishing pad in the wafer polishing area, thereby improving polishing efficiency and yield.

Another advantage of the present invention is to provide a drive system that provides incremental movement to a polishing pad disposed between the supply spool and the receiving spool, the polishing being carried by a support mechanism used to hold a portion of the polishing pad. It operates on a portion of the polishing pad disposed between the supply spool and the receiving spool in a manner that does not degrade the front of the pad, thereby maximizing the life of the polishing pad.

Another advantage of the present invention is to provide a single casting housing a polishing pad comprising a supply spool, a receiving spool and a pad path roller.

These and other and other advantages, single or in combination, of the present invention are obtained by providing a method and apparatus for polishing a wafer with a pad having a high bidirectional linear velocity. The present invention includes a belt fastened to a polishing pad or mechanism that utilizes the pad or belt to reciprocate, ie move at high speed in both the front and back directions. As it polls the wafer, constant bidirectional movement of the polishing pad or belt provides good flatness and uniformity across the wafer surface. During polishing to the moving part of the pad, and when a new part of the pad is required, the pad is moved through a drive system that includes a roller that touches the back of the pad, thus eliminating the source of frictional force other than the wafer being polished. Thereby maximizing the life of the polishing pad. In one embodiment of the invention, the roller touches only the back side of the pad so that the roller lowers the pad surface.

In yet another embodiment, the present invention provides the above advantages with a method and apparatus for generating bidirectional linear polishing using a flexible pad. In one embodiment, the horizontal drive assembly moves a horizontal slide member that is horizontally movable over a rail attached to a single casting. If feed spool, receiving spool and pad path roller are included, there is an opening in the casting. The drive assembly converts the rotational motion of the motor into horizontal bidirectional linear movement of the horizontal slide member. When the polishing pad is properly locked in place, preferably attached between the supply spool and the receiving spool, horizontal bidirectional linear movement of the horizontal slide member creates a corresponding horizontal bidirectional linear movement of a portion of the polishing pad. Thus, the portion of the polishing pad disposed in the polishing region of the chemical mechanical polishing apparatus can polish the top surface of the wafer using bidirectional linear movement of the portion of the polishing pad.

In yet another embodiment, the present invention provides a portion of a polishing pad disposed under tension between a supply spool and a receiving spool with a motor that provides tension to either the supply spool or the receiving spool and other spools that are locked during processing. . If a new portion of the polishing pad is required, the same motor that provided the tensile force is used to advance the polishing pad by a preset amount when connected to the receiving spool. In addition, during processing, a feedback mechanism is used to ensure that the tensile force of the polishing pad is kept constant.

The present invention relates to a CMP method and apparatus and a reduced foot-print capable of operating at high bidirectional linearity pads or reciprocating speeds. High bidirectional linear pad speed optimizes floor plan efficiency, while reduced foot-print reduces the cost of the polishing station. In addition, since the polishing pad is adapted to stroke in a bidirectional linear direction, this reduces the pad glazing effect which is a common problem in conventional CMP polishers. Because the pads travel in a bidirectional linear direction, the pads (or pads attached to the carrier) are substantially self-conditioned.

1 illustrates a processing region 120 for a bidirectional linear polishing apparatus. A portion of the bidirectional linear transfer pad 130 that polishes the wafer front side 112 of the wafer 110 in the processing region is driven by a drive mechanism. The wafer 110 is held in place by the wafer carrier 140 and may also rotate during polishing, as described herein.

Below the pad 130 is a platen support 150. In operation, due to the combination of the release of fluid, such as air and water, and the tension of the pad 130 or the combination of different fluids from the opening 154 disposed in the top surface 152 of the platen support 150, the pad ( The bidirectional movement of 130 is supported over platen support 150 in the processing area such that front surface 132 of pad 130 contacts front surface 112 of wafer 110 and back surface 134 of pad 130. Levitate on the top surface 152 of the platen support 150. While the portion of the pad 130 in the processing region is moved in a bi-linear manner (see reference numeral 136), the two ends of the pad 130 are respectively the source and target spools (illustrated in FIG. 5). 160, 162 is preferably connected, allowing the incremental portion of pad 130 to be placed into and then taken from the processing area.

In addition, in operation, various polishing agents or slurries having grinding particles without grinding particles may be introduced using the nozzle 180, depending on the type of the pad 130 and the kind of polishing. For example, the polishing pad 130 may include a soft erase embedded in the front surface 132, and may be embedded with a polishing agent in which no slurry is introduced, or instead of using the slurry. It can be used with a polishing pad 130 that does not include, and any other combination of pads, slurries, and / or polishing agents can be used. The polishing agent or slurry may comprise chemicals that oxidize the material and then mechanically remove it from the wafer. Polishing agents or slurries comprising colloidal silica, fumed silica, alumina particles and the like are generally used with grinding or non-grinding pads. As a result, the high profile on the wafer surface is removed until an extremely flat surface is achieved.

The polishing pad may vary depending on whether it includes soft erase, while in any polishing pad 130 according to the present invention, various fluid flows from various openings 154 on the platen support may vary in position on the wafer. Needs to be flexible and light enough to affect the polishing profile. In addition, the pad 130 may be made of a single body material which may or may not have a soft erase impregnated therein. By monolithic material is meant a single layer of material, or when more than one layer is introduced, means to maintain the flexibility as obtained by the thin polymeric material described herein. One example of a polishing pad that incorporates these features is a fixed grinding pad, such as MWR66, sold by 3M, having a thickness of 6.7 mils (0.0067 inches) and a density of 1.18 g / cm 3. Such polishing pads are made of a flexible material, such as a polymer, and typically the thickness of the pad should be in the range of 4 to 15 mils. Therefore, the fluid ejected from the openings 154 on the platen support 150 can be changed to less than 1 psi and, as will be described further below, a significant amount of polishing occurs on the front side 112 of the wafer 110 to be polished. Can affect. For pad 130, the environment in which pad 130, such as linear or bilinear, is used, or an inconsistent velocity environment, allows other pads to be used, although the same efficiency does not necessarily appear. In addition, pads having a configuration having a lower weight per cm 2 of the pad, such as less than 0.5 g / cm 2, combined with the kind of flexibility to achieve the polymerization pad can be accommodated.

Another consideration for the pad 130 is the width relative to the diameter of the wafer 110 to be polished, the width of which may substantially correspond to the width of the wafer 110 or may be greater or smaller than the width of the wafer 110. .

In addition, as will be seen later, the continuous pad 130 can be used to detect the removal of a layer of material from the front surface 112 of the wafer 110 being polished without any cut-out window. End point detection) and the implementation of a feedback loop based on the detected signal to ensure that the pad 130 is at a certain wavelength to ensure that the polishing performed is a wafer 110 with all its various regions polished to the desired degree. Preference is given to substantially optically transparent at.

The platen support 150 is made of a hard and also machineable material such as titanium, stainless steel or a hard polymeric material. The machinable material allows for the formation of an opening 154 and a channel through which the fluid is delivered to the opening 154 through the platen support 150. With liquid ejected from the opening 154, the platen support 150 can support the pad. In operation, the platen support 50 provides for the ejection of a fluid medium, preferably air, although water or other fluids may be used. Thus, this ejected fluid will cause the bilinear transfer pad 130 to float on the platen support 150 when the chemical mechanical polishing is being performed, and to be pushed against the wafer surface.

Hereinafter, the support plate which supports a polishing pad is demonstrated. The polishing pad is held against the wafer surface with the support of the support plate, which can be coated with a magnetic film. The back side of the support material to which the polishing pad is attached may also be coated with a magnetic film, thus allowing the polishing pad to float from the support plate while traveling at the desired speed. It is to be understood that other conventional methods may be used to lift the polishing pad from the support plate while polishing the wafer surface, such as air, porcelain, lubricating oil and / or any other suitable liquid.

2 is a simplified illustration of a drive mechanism providing a new part of a polishing pad according to the invention, which is provided for converting rotational movements into linear rising and falling movements. As shown, the two drive mounts 238, 240 are rotated, for example, due to the axle rotation illustrated by an axle 231 associated with the motor 232. To each of these drive mounts, moving conversion mechanisms 242 and 244 which are approximately 180 degrees from the phases attached to the drive mounts 238 and 240 are attached, respectively. Although slotted adapters are shown for converting rotational movements into linear movements, the mechanism can be configured in a variety of other ways, for example using a connecting rod. These mechanisms are supports, to which the different ends 210a and 210b of the polishing belt 210 are attached, respectively. Moreover, the polishing belt is preferably supported at a suitable position in the polishing area (not shown) by the support mechanism, in particular from the backside of the polishing belt, for example as shown by roller 212. Due to the rotation of the drive mounts 238 and 240, a complementary reciprocating linear movement is made, so that when the drive mount 238 moves in the upper linear direction, the drive mount 240 moves in the lower linear direction. Thus, by means of a polishing belt 210 properly positioned between the supply spool and the receiving spool (not shown), the movement of these drive mounts 238, 240 is a bidirectional linear movement in accordance with the present invention. Since the support mechanism supports the polishing belt from the back side, the polishing side (ie, front side) does not contact the support mechanism, and the source of friction other than the wafer being polished is minimized from the polishing side of the pad. Thus, the polishing side of the pad is not lowered by the support mechanism.

3A and 3B are side and cross-sectional views, respectively, of a particular implementation of the drive mechanism described above in accordance with the present invention with reference to FIG.

The polishing apparatus 300 includes a drive mechanism having a polishing belt 310 for polishing a wafer (not shown) supported by a bidirectional linear or inverted linearity, a wafer housing (not shown). The processing area 316 has a portion of the polishing belt 310 supported by the platen 323, the platen 323 is a "gimbaling" leveling / suspending a portion of the polishing belt 310 thereon. ) "Can be provided. In addition, air and magnetic bearings may be located below the processing region 316 to control the pressure between the portion of the polishing belt 310 and the wafer surface during the polishing process.

In addition to the processing area 316, the polishing apparatus 300 includes a supply spool 311, a receiving spool 315, shown at the top thereof as rollers 312a, 312b, 312c, 312d, 312e, 312f, 312g, 312h. And a polishing belt support mechanism 312. Rollers 312a, 312d, 312e, and 312h are fixed, while roller pairs 312b and 312c and roller pairs 312f and 312g are attached to respective drive supports 320 and 322, which are drive mechanisms 330 Are each shifted to complementary reciprocal linear movements obtained using The drive mechanism includes a motor 332 that drives the axle 336 via the belt 334, which will therefore drive each of the two drive mounts 338, 340, which thus elbows 342, 344. Provide a move to. Each end of the elbows 342 and 344 can rotate about pivot points such as pivot points 342a and 342b shown in FIG. 3B.

When the polishing belt 310 is provided between the supply spool 311 and the receiving spool 315, only the front surface of the polishing belt 310 comes into contact with the surface of the wafer or workpiece being polished, while the back surface of the polishing belt is described above. It can be clearly seen that various rollers 312 are brought into contact with various surfaces to ensure alignment.

As can be seen, the rotation of the axis associated with the motor 332 generates the rotation of the axis 336 corresponding to the belt 334 and the rotation of the two drive mounts 338, 340. Each of these drive mounts is attached to one of the elbows 342 and 344, and the attachment preferably has a phase difference of 180 degrees. Rotation of the drive mounts 338 and 340 causes a complementary reciprocating linear motion, so that when the drive support 320 moves upward in the linear direction, the drive support 322 moves downward in the linear direction. Thus, the polishing belt 310 is properly positioned between the supply spool 311 and the receiving pool 315 and attached to the drive supports 320 and 322 via roller pairs 312b, 312c and 312f, 312g. , The movement of the drive support (320, 322) is a two-way linear motion according to the present invention.

Advancement of the polishing belt 310 generates an incremental step portion movement or larger step movement, or moves while the polishing belt 310 polishes the wafer, or the polishing belt 310 moves on the wafer. Whether moving between polishing, the advancement of the polishing belt 310 causes the new portion of the polishing belt 310 to come out of the supply spool 311 and the already used portion to be wound on the receiving spool 315. The mechanism used to implement this movement is preferably a conventional clutch mechanism connected to the supply spool 311 and used to adjust the tension of the polishing belt 310 between the supply spool 311 and the receiving spool 315. Do.

After the section of the polishing belt 310 is used to polish one or more wafers in the processing area, a new section of the polishing belt 310 is supplied to the processing area in the manner described above. In this way, after one section of the polishing belt 310 is worn out and damaged, a new section can be used. Thus, using the present invention, all or most sections of the polishing belt 310 in the supply spool 311 can be used. The polishing belt 310 is progressively advanced so that a new section of the polishing belt 310 is fed into the processing area or a new section of the polishing belt 310 becomes a new portion at a time between polishing of the wafer. The portion of the polishing belt 310 in the polishing region and closest to the feed spool 311 that was in the polishing region and closest to the feed spool 311 was used the least.

A conventional second motor (not shown) is connected to the receiving spool 315 to simultaneously rotate so that a section of the polishing belt 310 can be pulled from the supply spool 311 to the receiving spool 315. For example, when the second motor is activated and the clutch resistance is properly adjusted, the second motor rotates the receiving spool 311 in such a way that a section or part of the polishing belt 310 is accommodated therein. In a similar manner, by providing proper motor torque and clutch resistance, the tension of the polishing belt 310 can be adjusted between the supply spool 311 and the receiving spool 315. This technique can be used to provide a suitable contact pressure between the polishing belt 310 and the wafer surface in the treatment region 316.

4-9 show an improved drive system 400, which provides a highly reliable smooth and continuous bi-linear reciprocating movement of the polishing pad portion. Referring to FIG. 5, a path 536 in which the polishing pad 530 moves within the pad drive system 400 between the supply spool 560 and the receiving spool 562 is illustrated. As shown, from the supply spool 560 and the alignment roller 514B, the path 536 passes through the top 528C and the bottom 528D of the right slide roller of the slide member 520, and has a rectangular shape. Through rollers 512A, 512B, 512C, and 512D, around the bottom 528B and top 528A of the left slide roller of the slide member 520, the alignment roller 514A and the receiving spool 562. Proceed to As can be seen with reference to points “A1, A2, B1, B2, C” in FIG. 5, the polishing pad 530 is properly locked in place and preferably, the supply spool 560 and the receiving spool 562. In the attached state, the horizontal bidirectional linear motion of the horizontal slide member 520 causes a corresponding horizontal bidirectional linear motion of the portion of the polishing pad. In particular, as the horizontal slide member 520 moves from right to left from the P1 position to the P2 position, the A1 point on the pad 530 is maintained at the same position relative to the receiving spool 562, but the A2 point is Will be moved through the left rollers 528A, 528B of the horizontal slide member 520. Similarly, point B1 on pad 530 will remain in the same position relative to feed spool 560, but point B2 will move through the right rollers 528D, 528C of the horizontal slide member 520. As can be seen, by this movement, point C will move linearly through the treatment area. Point C will move horizontally twice as much as the horizontal movement of the horizontal slide member 520. Movement of the horizontal slide member 520 in the opposite direction also moves point C of the polishing pad 530 in the opposite direction. Thus, the polishing pad portion (point C) disposed in the polishing region of the chemical mechanical polishing apparatus can polish the uppermost front surface of the wafer by using the bidirectional linear movement of the polishing pad 530 portion.

By way of the bidirectional linear pad movement mechanism and path 536 described above, a more detailed description of the components in the path 536 and the associated horizontal motion drive assembly 550 is provided below.

As further illustrated in FIGS. 4 and 6, the horizontal slide member 520 is movable horizontally across the rail 540. Rail 540 is attached to a casting 510 made of a metal, such as coated aluminum, which also has all other pad path generation components attached thereto. Accordingly, the various openings in the casting 510, as well as the large openings for the pin housing piece 522A and the roller housing 521, which are connected with the sidepieces 522B1 and 522B2 of the horizontal slide member 520, These pad paths, including supply spool 560 and receiving spool 562 (attached to their associated spool pins, respectively), as well as respective rollers 512A, 512B, 512C, 512D, 514A, 514B. It exists to contain the component. The rail 540, a portion of each side of the casting 510, provides a surface for mounting the rail 540 on which the horizontal slide member 520 moves. As illustrated in FIG. 6, the horizontal slide member 520 is mounted on the rail 540 using the carriage member 526. Carriage member 526 may be used to move the wafer in place movably above and below the rail and to reduce friction between rail 540 and horizontal slide member 520. The carriage member 526 may include a sliding element such as metal balls or cylinders (not shown) to facilitate the sliding action of the horizontal slide member 520.

As illustrated in FIGS. 4 and 6, for the horizontal slide member 520, the support structure 522 is formed by sidewalls 522B1 and 522B2 with a connecting piece 522A attached therebetween. The carriage member 526 is attached to the inside of the side walls 522B1 and 522B2. The roller housing 521 is also formed by slide pieces 521A1 and 521A2 having a connecting piece 521B therebetween. The roller housing 521 is supported by the support structure 522. In contrast, the side pieces 521A1 and 521A2 of the roller housing are attached to the side walls 522B1 and 522B2 of the support structure 522 using the support pieces 523. In the vicinity of the connecting piece 521B, it is the four rollers 528A to 528D attached between the two side pieces 521A1 and 521A2, which are the left rollers 528A, one side of the connecting piece 521B. 528B and right side rollers 528C and 528D on the other side of the connecting piece 521B.

In addition, the pin 530 is disposed downward from the pin connecting piece 522A as shown in FIG. 6, and the pin 530 is connected to a link 564 associated with the horizontal drive assembly 550 described later. Since the horizontal drive assembly 550 generates horizontal bidirectional linear motion of the pin 530, horizontal bidirectional linear motion of the entire horizontal slide member 520 occurs along the rail 540.

The horizontal drive assembly 550 as shown in FIG. 5 consists of a motor 552 that rotates the shaft 554. The shaft 554 is connected to the transmission assembly 556 which converts the rotational movement of the shaft 554 into the horizontal bidirectional linear movement of the horizontal slide member 520. In a preferred embodiment, the transmission assembly 556 includes a gearbox 558 that translates the horizontal rotation of the shaft 554 into the vertical rotation of the shaft 560. The shaft 560 is attached with a crank 562 to which one end 564A of the link 564 is attached, and the other end 564B of the link 564 is attached to the pin 530, thereby link 564. Relative rotation of the pin 530 in the other end 564B, and when this occurs, generates a horizontal bi-directional linear movement of the pin 530.

Thus, the operation of the horizontal drive assembly 550 results in a bidirectional linear motion of the horizontal slide member 520 and a corresponding horizontal bidirectional linear motion of the portion of the polishing pad 530 within the processing area.

In processing, the polishing pad can be locked in place between the supply spool 560 and the receiving spool 562. This allows the portion of the pad 530 in the processing area to move in a horizontal bidirectional linear manner, while the pad can be released so that other portions of the polishing pad move within the processing area, thereby increasing the incremental portion of the pad. Enter and exit the processing area.

While working with the pad 530 locked in place at both the supply spool 560 and the receiving spool 562, more effective results are obtained by using a tensioning mechanism at one end of the portion of the pad 530 in cooperation with the drive system. It is known that it can be lost. In particular, as illustrated in FIGS. 7A and 7B, the processing system is shown as a necessary part for illustration, which is a horizontal slide member comprising rollers 728A, 728B connected to each other using a connecting piece 722. 720. The polishing pad 530 passes through the horizontal slide member roller 728B from the supply spool 760 and the alignment roller 714B in a pad path 536 similar to the path described above with reference to FIG. 712A) and through the horizontal slide member roller 728A to the receiving spool 762 via the alignment roller 714A. However, it should be noted that this simplified version is not preferred because part of the front of the pad 530 touches the rollers 728A, 728B.

7A and 7B, belt 772 is coupled between tensioning and incrementing motor 770 and receiving spool 762, hereinafter referred to as motor 770. FIG. . Also illustrated is a lock mechanism 780, such as a clamp mechanism. In this embodiment, the tension of the pad is preset to lock the supply spool 760 using the locking device 780 and to rotate the receiving spool 762 connected to the motor 770 via the belt 772. It can be obtained by activating the motor 770 with the torque value. Incrementing the pad also locks to release the supply spool 760 until, for example, the used section of the pad is wound around the receiving spool 762 and a new pad section reaches the treatment area. This is accomplished by releasing the instrument and rotating the motor 770, preferably at a low rpm.

8 shows in more detail a control system for controlling the tensioning and increasing motor 770 and the locking mechanism 780. As shown, the power of motor 770 and controller 820 is provided by power source 810, which provides appropriate power to driver 824 along line 814, and lines 812. As such, different suitable power may be provided to the controller 820. Controller 820 includes a computer or some form of microcontroller, as is well known in the art. In addition, the line 822 from the controller inputs a preset torque value as the torque signal to the motor control unit 804 and, in particular, the torque control unit 826. The preset torque value for the motor 770 will have a torque value that is less than 10% of the torque value ratio of the locking mechanism 780. Line 823 from the torque control unit inputs a torque signal to the driver 824. Line 816 returns a torque signal received from driver 824 to the controller for feedback or self-check purposes. If no magnetic check is required, line 816 is removed. As described below, the torque signal is used to maintain the tension on the receiving spool 762 at a predetermined level during processing. Driver 824 applies the torque value as electric current to motor 770 via line 828a.

However, if the pad needs to be increased, the motor 770 is preferably rotated at a low rpm, with the appropriate signal from the controller, and the pad is advanced. As the motor rotates, a predetermined number of encoder pulses are generated per revolution. The encoder pulse generated by the motor 770 is fed back to the driver 824 via line 828b and then fed back from driver 824 to controller 820 via line 828c. When counting the pulses, because they are advanced by the motor 770, the controller 820 passes over a portion of the pad. In one example, one rotation of the motor 770 advances the pad 280 mm. An exemplary motor is model number SG255SA-GA05ACC, which is produced by Yaskawa Electric Co in Tokyo, Japan. In this particular example, motor 770 generates 8192 pulses per revolution. These pulses are sent sequentially to the driver. However, since the motor 770 can rotate at a predetermined speed when performing tensioning, the encoder pulse is generally ignored by the controller, but the pad is forced by the locking mechanism 280 on the supply spool. It cannot move.

Upon receiving an external signal such as the torque signal described above and a process sequence instruction, the controller 820 generates control signals along the line 822 that are used in the motor control unit 804 to control the motor 770. do. In particular, the generated signal is not only a tension signal used for supplying the motor control unit 804 with an indication of an appropriate amount of power supplied to the motor 770 to obtain a predetermined tension on the receiving spool 562 during processing. , ON / OFF signal is included. The controller 820 also generates a brake signal along the line 830, which preferably passes through the relay 832 to the locking mechanism 780, which lock mechanism feeds spool 560. It is preferably implemented as an electromagnetic clamp brake used to lock the in place. The monitor 840 such as a keyboard and the user input device 850 may also be connected to the controller 820.

The motor control unit 804 includes a driver and a torque adjusting unit 826. The power supplied to the driver 824 changes in accordance with the signal generated by the torque adjustment unit 826.

Tensioning and increasing operation of the portion of the pad 530 according to the present invention is described below with reference to the flowchart illustrated in FIG. 9 and other figures described above.

In processing as illustrated, initially at step 901, the controller 820 provides an OFF signal to both the motor control unit 804 and the locking mechanism 780. This freely rotates both the supply spool 760 and the receiving spool 762, thus allowing initial threading of the pad 530 through the pad path 536 as described above with reference to FIG. 7A. Once threading and processing have occurred, step 920 follows, where the time controller 820 provides the ON signal to the locking mechanism 780 and then provides the tension signal to the motor control unit 804 so that the tension signal can be obtained. The motor 770 is turned on and tensioned on the receiving spool 762. Thus, the supply spool 760 is locked, and the receiving spool 762 remains tensioned and thus includes a portion of the pad 530 in the treatment area 120 illustrated in FIG. The entire portion of the pad 530 is properly tensioned.

Thereafter, step 930 is started and processing is performed. In processing, for example, controller 820 initiates a bidirectional linear movement of pad 530 using pad drive system 500 described above with reference to FIG. 5. In processing, using a particular portion of the pad 530 can generally process several wafers 110 and turn the pad drive system 500 on and off.

However, at some point, a portion of the pad 530 used for polishing may need to be replaced and another portion of the pad provided. As described above, it is anticipated that incremental or continuous portions may also be provided while a new portion of the pad 530 is provided as a whole. If some new portion of the pad 530 from the supply spool 760 is needed, the same operation is applied. In particular, the controller 820 first provides an OFF signal to the motor control unit so that the motor 770 can be turned off. Thereafter, step 940 is provided in which an OFF signal is provided to the locking mechanism 780, thereby turning off the brake and releasing the supply spool 760. Then, step 960 is followed, where the controller 820 signals the motor control unit 804 to increase the pad 530 by a predetermined amount, which is the linear distance that the pad 530 should be moved to. Corresponds to. In response to the signal, the motor control unit 804 turns on the motor 770 and rotates the receiving spool 762 to advance the pad. As mentioned above, the specific amount by which the pad is increased can be determined by encoder pulses generated by rotating the motor 770. Once the pad is advanced, step 920 is resumed so that the supply spool 760 can be locked and the receiving spool can be tensioned as described above.

The above description illustrates not only the increase of the pad 530, but also the preferred method of providing tension using the same motor in the processing of the portion of the pad 530 in the processing area. Although it has been described to tension the receiving spool 762 and lock the supply spool 760 during processing, it is also possible to tension the supply spool 760 and locking the receiving spool 762 during processing to implement the present invention. It will be understood as one of the other methods.

Tensioning and incremental processing is preferably achieved using one motor 770, but in the case of two motors, tensioning such as one attached to the receiving spool, the other attached to the supply spool and the like; It will be appreciated that various batches for incremental processing may exist.

The second embodiment of the present invention having a receiving and feeding spool can use various numbers of rollers, various kinds of driving mechanisms, etc., which cooperate to provide bidirectional linear motion or rotational motion, within the spirit and scope of the present invention. I will understand that. In addition, other similar components and devices may replace those described above.

Further, as illustrated in the first and second embodiments, the layout or geometry of the polishing pad / belt for the wafer may be changed from the position illustrated in the text to other positions. For example, the polishing pad / belt may be positioned over the wafer, and the polishing pad / belt may be positioned perpendicular to the wafer.

In the foregoing description and the appended claims, the terms "wafer surface" and "surface of the wafer" are not limited to the surface of the wafer prior to processing, and include conductors, oxidized metals, oxides, spin-on glasses, ceramics, and the like. It will be understood that it also includes the surface of any layer formed on the wafer.

While various preferred embodiments of the invention have been described for illustrative purposes, those skilled in the art will understand that various modifications, additions, and / or substitutions may be made without departing from the scope and spirit of the invention as set forth in the claims.

The specification of the present invention includes at least the following features.

1. A method for providing bidirectional linear polishing, comprising: providing a polishing belt on a support mechanism between a supply area and a receive area, the polishing belt having a first end; And a second end and a polishing surface and a back side, wherein the first end is initially out of the supply area and connected to the receiving area, wherein the second end remains connected to the supply area. step; Polishing a portion of the polishing belt linearly in both directions within the polishing area; Advancing the polishing belt to obtain another portion to be used for polishing, the polishing belt being advanced above the support mechanism such that the polishing surface of the polishing belt is not degraded by the support mechanism. Advancing the belt; Polishing another portion of the polishing belt by linearly moving in both directions; And repeating the advancing and polishing steps using another part.

2. The method according to the above, wherein the advancing includes advancing the polishing belt over a plurality of rollers in the support mechanism for supporting the polishing belt from the backside of the polishing belt rather than the polishing surface of the polishing belt. It is characterized by.

3. The method according to the above, further comprising introducing a first workpiece into the polishing area before polishing with the portion of the polishing belt; Removing the first workpiece when polishing of the first workpiece is completed; And introducing a second workpiece into the polishing area prior to polishing using another portion of the polishing belt.

4. The method according to the above, characterized in that during the polishing step, tensioning the portion of the polishing belt in the polishing area is also included.

5. The method according to the above, wherein the applying of the tension is characterized by using a plurality of rollers disposed between the supply region and the receiving region.

6. The method according to the above, wherein the polishing using the portion of the polishing belt comprises: moving the portion bidirectionally linearly by vertically reciprocating a plurality of first rollers; Rotating a plurality of second rollers about a stationary axis to provide the polishing area therebetween; And maintaining contact between the portion of the polishing belt and the workpiece within the polishing region.

7. The method according to the above, wherein the generating step is implemented by converting a rotational motion into a linear motion using a drive system.

8. The method according to the above, wherein the polishing step using the another portion of the polishing belt comprises: moving the second portion bidirectionally linearly by vertically reciprocating a plurality of first rollers; Rotating a plurality of second rollers about a stationary axis to provide the polishing area therebetween; And maintaining contact between the workpiece and the another portion of the polishing belt in the polishing region.

9. The method according to the above, wherein the steps occurring during the polishing with the part and during the polishing with the another part are performed using a drive system to convert the rotational motion into a linear motion. Characterized in that implemented.

10. The method according to the above, wherein the step of vertically reciprocating the plurality of first rollers is such that when one or more rollers are moved vertically in one direction, the at least one other roller is vertically moved in the opposite direction. It is done.

11. The method according to the above, wherein the advancing step is characterized by progressively advancing to the further part such that there is an overlap between the part and the other part.

12. The method according to the above, characterized in that during the advancing step, the previously used part is received into the receiving area and a new part comes out of the supply area.

13. The method according to the above, wherein the polishing step is characterized by performing polishing polishing.

14. The method according to the above, wherein the polishing step is characterized by performing non-polishing polishing.

15. The method according to the above, characterized in that during the polishing step, the act of simultaneously providing a force on the back side of the polishing belt in the polishing area occurs.

16. The method according to the above, wherein providing the force is characterized by applying air.

17. The method according to the above, wherein the polishing step is characterized by the use of a polishing belt having a width greater than the width of the workpiece in operation.

18. The method according to the above, wherein the polishing is characterized by using a polishing belt having a width smaller than the width of the workpiece in operation.

19. The method according to the above, wherein the advancing step is characterized by progressively advancing to the further part such that there is an overlap between the part and the other part.

20. The method according to the above, characterized in that during the advancing step, the previously used portion is received into the receiving region and a new portion comes out of the supply region.

21. The method according to the above, wherein the polishing step is characterized by performing polishing polishing.

22. The method according to the above, wherein the polishing step is characterized by performing non-polishing polishing.

23. The method according to the above, characterized in that during the polishing step, the act of simultaneously providing a force to the back side of the polishing belt in the polishing area occurs.

24. The method according to the above, wherein providing the force is characterized by applying air.

25. The method according to the above, wherein the polishing step is characterized by the use of a polishing belt having a width greater than the width of the workpiece in operation.

26. The method according to the above, wherein the polishing step is characterized by the use of a polishing belt having a width smaller than the width of the workpiece in operation.

27. A polishing apparatus adapted to polish using a polishing belt having a first end and a second end, and a polishing surface and a back side, comprising: a receiving area to which the first end of the polishing belt can be connected; A supply region to which the second end of the polishing belt can be connected; A support structure for providing a path of the polishing belt to move between the receiving area and the supply area, such that a workpiece processing area is present along the path, wherein the polishing surface of the polishing belt is configured to support the polishing belt. Said support structure configured not to be used by the support structure; A first drive mechanism that can be polished bidirectionally by linearly moving a portion of the polishing belt in the processing region in both directions; And another portion of the polishing belt is located in the treatment region and can be used to bidirectionally linearly polish another portion of the polishing belt in the treatment region so as to advance the polishing belt. And a second driving mechanism provided.

28. The apparatus according to the above, further comprising a tensioning mechanism for tensioning the portion of the polishing belt in the polishing region.

29. The apparatus according to the above, wherein the tensioning mechanism is a clutch.

30. The apparatus according to the above, wherein the support structure comprises a plurality of rollers disposed on a polishing belt path exiting between the supply region and the receiving region, the polishing belt being advanced by advancing the plurality of rollers. Only the back side of the polishing belt, not the polishing surface of the belt, is characterized in that the contact with the plurality of rollers.

31. The apparatus according to the above, wherein the plurality of rollers comprises a plurality of first rollers reciprocating vertically to move the portion bidirectionally linearly; And a plurality of second rollers rotating about the stationary axis, wherein the polishing area is provided therebetween.

32. The apparatus according to the above, wherein the plurality of first rollers comprises at least one roller vertically moving in one direction and at least one further roller vertically moving in the other direction.

33. The apparatus according to the above, characterized in that the first drive mechanism converts the rotary motion into linear motion at two different ends of the polishing belt.

34. The apparatus according to the above, wherein the first drive mechanism comprises: a motor; One or more axles that can be rotated using the motor; A pair of drive mounts coupled to the at least one axle; And a pair of polishing belt attachment mechanisms such that each polishing belt attachment mechanism is connected between an end of the polishing belt and another one of the pair of drive mounts, the rotation of one or more axles using the motor, And rotation of a pair of drive mounts and a reciprocating linear motion of the end of the polishing belt and the pair of polishing belt attachment mechanisms.

35. The method according to the above, wherein the step of polishing by moving the portion of the polishing belt in both directions within the polishing area comprises moving the portion of the polishing belt over the support mechanism so that only the rear side of the polishing belt is moved. Contact with the support mechanism; Polishing by moving the second portion of the polishing belt in both directions within the polishing area, by moving the another portion of the polishing belt over the support mechanism so that only the backside of the polishing belt contacts the support mechanism. It is characterized by that.

36. The method according to the above, wherein each of the providing and advancing steps of the polishing belt comprises a first end and a second end of the polishing belt such that the portion and the other portion can each be moved during the polishing step. Characterized in that the position.

37. The method according to the above, characterized in that during the polishing step, tensioning the portion of the polishing belt in the polishing area is also included.

38. The method according to the above, wherein during the polishing step, the first end and the second end of the polishing belt remain stationary in the supply area and the receiving area, respectively.

39. The method according to the above, characterized in that during the polishing step, tensioning the portion of the polishing belt in the polishing area is also included.

40. The method according to the above, wherein each of the polishing steps further comprises lifting a portion of the polishing belt onto a platen in the polishing region to generate contact. Polishing between the front side and the front side of the workpiece is performed.

41. The method according to the above, wherein each of the polishing steps further comprises lifting a portion of the polishing belt onto a platen in the polishing region to generate contact. Polishing between the front side and the front side of the workpiece is performed.

42. The apparatus according to the above, wherein the support structure supports the portion of the polishing belt so that the polishing surface of the polishing belt is not used by the support structure supporting the portion of the polishing belt, Said portion of the polishing belt is characterized in that it is used for polishing bidirectionally linearly in said processing region.

43. The apparatus according to the above, wherein the receiving region is positioned with a first end of the polishing belt and the supply region with a second end of the polishing belt, so that the portion and the other portion are each treated by the process. And to be moved bidirectionally linearly by the first drive mechanism in order to polish bidirectionally linearly in the area.

44. The apparatus according to the above, wherein the second driving mechanism tensions the portion of the polishing belt and the another portion within the processing region when the portion and the further portion are each within the processing region. It is characterized in that it further provides a.

45. The apparatus according to the above, wherein the second driving mechanism is further configured to further include the portion of the polishing belt and the further portion within the processing region when the portion and the further portion of the polishing belt are each within the processing region. It is characterized in that it further provides a tension to the other part.

46. A method of generating a bidirectional linear motion of a portion of a polishing pad disposed in a processing area used for chemical mechanical polishing of a workpiece, the method comprising: generating a rotational motion of a drive shaft; Converting a rotational movement on the drive shaft into a bidirectional linear movement of a slide member; And generating a bidirectional linear motion of the portion of the polishing pad in the processing region corresponding to the bidirectional linear motion of the slide member, wherein the polishing is performed when chemically and mechanically polishing the workpiece. A bidirectional linear movement of the part of the pad is used.

47. The method according to the above, wherein during the generating step, the polishing pad is arranged between the supply spool and the receiving spool.

48. The method according to the above, wherein during the generating step, the polishing pad passes through rollers disposed on the slide member.

49. The method according to the above, wherein the converting step provides horizontal bidirectional linear motion of the slide member, and wherein the generating step comprises horizontal bidirectional linear motion of the portion of the polishing pad within the processing area. It is characterized by providing.

50. The method according to the above, wherein the portion of the polishing pad is moved horizontally at least twice as long as the slide member moves horizontally.

51. The method according to the above, characterized in that the portion of the polishing pad moves more than the slide member.

52. The method according to the above, wherein the generating step comprises providing a pad path on the plurality of rollers.

53. The method according to the above, wherein the pad path provides that only the rear surface of the polishing pad is in physical contact with the plurality of rollers.

54. The method according to the above, wherein during the generating step, the polishing pad passes through rollers disposed on the slide member.

55. The method according to the above, wherein the converting step provides horizontal bidirectional linear motion of the slide member, and wherein the generating step comprises horizontal bidirectional linear motion of the portion of the polishing pad within the processing area. It is characterized by providing.

56. The method according to the above, wherein the portion of the polishing pad is moved horizontally at least twice as long as the slide member moves horizontally.

57. The method according to the above, wherein the portion of the polishing pad moves more than the slide member.

58. The method according to the above, wherein the generating step comprises providing a pad path on the plurality of rollers.

59. The method according to the above, wherein the pad path provides that only the rear surface of the polishing pad is in physical contact with the plurality of rollers.

60. An apparatus for generating bidirectional linear motion in a predetermined region having a portion of a polishing pad corresponding to a treatment region used for chemical mechanical polishing of a workpiece using a solution, the apparatus comprising: a drive assembly including a rotatable shaft; And a slide member movable within the slide area, the slide member mechanically coupled to the drive assembly such that rotation of the rotatable shaft produces a bilinear movement of the slide member, wherein the polishing pad is Disposed through the slide member such that the bilinear movement of the slide member produces a corresponding bilinear movement of the portion of the polishing pad, wherein the bilinear movement of the portion of the polishing pad causes the workpiece to be subjected to chemical mechanical It is characterized in that it is used when polishing.

61. The apparatus according to the above, wherein the drive assembly comprises: a gearbox coupled to the rotatable shaft and comprising another rotatable shaft; A crank coupled to the another rotatable shaft; And a link coupled between the link and the slide member.

62. The apparatus according to the above, wherein the slide member comprises a plurality of rollers.

63. The apparatus according to the above, wherein the bilinear movement of the slide member is horizontal.

64. The apparatus according to the above, characterized in that the bilinear movement of the part of the polishing pad in the treatment area is horizontal.

65. The apparatus according to the above, further comprising a plurality of rollers providing a pad path between the supply spool and the receiving spool.

66. The apparatus according to the above, wherein the plurality of rollers are arranged such that the pad path provides that only the backside of the polishing pad is in physical contact with the plurality of rollers.

67. A drive assembly providing a path for horizontal linear movement of a portion of a polishing pad in a processing region, wherein the polishing pad is disposed between the supply spool and the receiving spool, the drive assembly comprising a rotatable shaft. A driving device; A single metal casting further comprising a horizontal slide area and comprising an opening; A plurality of rollers attached to the supply spool and the receiving spool, wherein the polishing pad can be disposed therebetween and the plurality of rollers disposed within the opening on the casting pin; And a horizontal slide member mechanically coupled to the drive and coupled to the polishing pad such that rotation of the rotatable shaft produces a horizontal movement of the slide member and generates a horizontal linear motion of the polishing pad. Characterized in that it comprises a.

68. The apparatus according to the above, wherein the horizontal slide member is moved in a bilinear direction of movement and is capable of generating a horizontal bilinear movement of the portion of the polishing pad.

69. The apparatus according to the above, wherein the drive device comprises: a gearbox coupled to the rotatable shaft and comprising another rotatable shaft; A crank coupled to the another rotatable shaft; And a link coupled between the link and the horizontal slide member.

70. The apparatus according to the above, characterized in that the horizontal slide member further comprises a plurality of rails attached to the horizontally movable casting.

71. A method of tensioning a portion of a polishing pad in a treatment area, the method comprising: a polishing pad having a portion disposed in the treatment area, one end of which is attached to the supply spool and the other end of which is attached to the receiving spool. Providing; Locking one of the supply spool and the receiving spool such that movement of the corresponding end of the polishing pad does not occur; And tensioning a corresponding other end of the polishing pad from the other one of the supply spool and the receiving spool using a tensioning mechanism, and using another drive mechanism to make a bilinear of the portion of the polishing pad in the processing region. While the movement occurs, the polishing pad is characterized in that it is tensioned by the tension mechanism.

72. The method according to the above, further comprising: locking the supply spool; Tensioning the tension from the receiving spool; And incrementally moving the polishing pad, wherein another portion is disposed within the treatment area, and wherein the incrementally moving step includes the tension to move the polishing pad incrementally. It is characterized by using a mechanism.

73. The method according to the above, wherein the step of incrementally moving comprises:

Removing tension from the receiving spool; Releasing said supply spool; And incrementally moving the polishing pad using the tensioning mechanism while the supply spool is released.

74. The method according to the above, wherein the tensioning step comprises the steps of: continuously monitoring the tension applied to the polishing pad; And continuously adjusting the tension based on the continuously monitored tension.

75. The method according to the above, wherein the step of continuously monitoring the tension is characterized by monitoring the current supplied to the motor used in the tensioning step.

76. The method according to the above, wherein the tensioning step uses a motor to tension the receiving spool and to move the polishing pad incrementally.

77. The method according to the above, wherein the providing further comprises providing a plurality of rollers and another plurality of rollers disposed on the slide member.

78. The method according to the above, wherein the providing comprises providing a pad path in which only the rear surface of the polishing pad is in physical contact with the plurality of rollers and the plurality of further rollers.

79. The method according to the above, wherein the tensioning step is characterized by using a motor to tension the receiving spool and to incrementally move the polishing pad.

80. The method according to the above, wherein the tensioning step is characterized by tensioning the entire part of the polishing pad disposed between the supply spool and the receiving spool.

81. The method according to the above, wherein the pad path passes over the plurality of rollers and the another plurality of rollers.

82. The method according to the above, wherein the tensioning step comprises the steps of: continuously monitoring the tension applied to the polishing pad; And continuously adjusting the tension based on the continuously monitored tension.

83. The method according to the above, wherein the step of continuously monitoring the tension is characterized by monitoring the current supplied to the motor used in the tensioning step.

84. The method according to the above, wherein the tensioning step uses a motor to tension the receiving spool and to move the polishing pad incrementally.

85. An apparatus for tensioning and increasing a portion of a polishing pad in a treatment region for use in chemical mechanical polishing of a workpiece using a solution, comprising: a drive assembly including a rotatable shaft; A slide member movable within a slide region, the rotation of the movable shaft being mechanically coupled to the drive assembly such that the linear movement of the slide member is generated, and the polishing pad is disposed through the slide member to provide the slide The slide member causing the bilinear movement of the member to produce a corresponding bilinear movement of the portion of the polishing pad; Feed spool; Receiving spool; A plurality of rollers creating a pad path between the supply spool and the receiving spool; And a tensioning mechanism for providing tension to the receiving spool and thus to the portion of the polishing pad, when the portion of the polishing pad is used to chemically polish the workpiece.

86. The apparatus according to the above, wherein the tensioning mechanism is coupled to the receiving spool.

87. The apparatus according to the above, further comprising a locking mechanism coupled to the supply spool.

88. The apparatus according to the above, further comprising a controller for controlling the tension provided by the tensioning mechanism.

89. The apparatus according to the above, characterized in that the controller receives a feedback signal to assist in controlling the tension provided by the tensioning mechanism.

90. The apparatus according to the above, characterized in that the tensioning mechanism further provides for increasing the polishing pad.

91. The apparatus according to the above, wherein the tensioning mechanism increases the polishing pad when the locking mechanism releases the supply spool.

Claims (56)

A method for providing bidirectional linear polishing, Providing a polishing belt on a support mechanism between a supply area and a receive area, the polishing belt having a first end and a second end and a polishing surface and a back side; Providing the polishing belt such that the first end is initially out of the supply region and connected to the receiving region and the second end remains connected to the supply region; Polishing a portion of the polishing belt linearly in both directions within the polishing area; Advancing the polishing belt to obtain another portion to be used for polishing, the polishing belt being advanced above the support mechanism such that the polishing surface of the polishing belt is not degraded by the support mechanism. Advancing the belt; Polishing another portion of the polishing belt by linearly moving in both directions; And And repeating the advancing and polishing steps using another portion. The method of claim 1, And the advancing step advances the polishing belt over a plurality of rollers in the support mechanism for supporting the polishing belt from the backside of the polishing belt rather than the polishing surface of the polishing belt. The method of claim 2, Introducing a first workpiece into the polishing area prior to polishing with the portion of the polishing belt; Removing the first workpiece when polishing of the first workpiece is completed; And And introducing a second workpiece into the polishing area prior to polishing using another portion of the polishing belt. The method of claim 3, And during said polishing step, tensioning said portion of said polishing belt within said polishing area. The method of claim 4, wherein The applying of the tension comprises: using a plurality of rollers disposed between the supply region and the receiving region. The method of claim 2, And wherein said advancing step progressively advances to said another portion such that there is an overlap between said portion and said another portion. The method of claim 1, During the advancing step, the previously used portion is received into the receiving region, and a new portion comes out of the supply region. The method of claim 2, During the polishing step, simultaneously providing a force to the back side of the polishing belt in the polishing area. The method of claim 8, And providing the force comprises applying air. The method of claim 1, And wherein said advancing step progressively advances to said another portion such that there is an overlap between said portion and said another portion. The method of claim 1, During the advancing step, the previously used portion is received into the receiving region, and a new portion comes out of the supply region. The method of claim 1, Moving the portion of the polishing belt in both directions within the polishing area to polish, by moving the portion of the polishing belt over the support mechanism such that only the back side of the polishing belt is in contact with the support mechanism; Polishing by moving the second portion of the polishing belt in both directions within the polishing area, by moving the another portion of the polishing belt over the support mechanism so that only the backside of the polishing belt contacts the support mechanism. Polishing method, characterized in that. The method of claim 12, Wherein each step of providing and advancing the polishing belt comprises positioning a first end and a second end of the polishing belt such that the portion and the other portion can each be moved during the polishing step. . The method of claim 13, During the polishing step, ends of the polishing belt not used for polishing remain wound in the supply area and the receiving area, respectively, so that the polishing surface of the polishing belt wound in the supply area and the receiving area is wound during the polishing step. Polishing method characterized in that it does not deteriorate. The method of claim 14, A plurality of moveable and rotatable rollers of the support mechanism during the step of moving and polishing the portion of the polishing belt in both directions within the polishing area, the portion of the polishing belt contacts only the backside of the portion of the polishing belt. Is moved using; A plurality of said support mechanisms in contact with said second part of said polishing belt only in the back of said another part of said polishing belt during the step of bidirectionally moving and polishing said another portion of said polishing belt within said polishing region. Polishing method characterized in that it is moved using a rotatable roller and a movement. The method of claim 15, And during said polishing step, tensioning said portion of said polishing belt and said another portion within said polishing region, respectively. The method of claim 13, During the polishing step, the first end and the second end of the polishing belt remain stationary in the supply area and the receiving area, respectively. The method of claim 17, And during said polishing step, tensioning said portion of said polishing belt within said polishing area. The method of claim 18, The polishing step further comprises: lifting a predetermined portion of the polishing belt onto a platen in the polishing area to generate contact, wherein polishing between the front of the polishing belt and the front of the workpiece is performed. Polishing method, characterized in that. The method of claim 12, The polishing step further comprises: lifting a predetermined portion of the polishing belt onto a platen in the polishing area to generate contact, wherein polishing between the front of the polishing belt and the front of the workpiece is performed. Polishing method, characterized in that. The method of claim 20, A plurality of moveable and rotatable rollers of the support mechanism during the step of moving and polishing the portion of the polishing belt in both directions within the polishing area, the portion of the polishing belt contacts only the backside of the portion of the polishing belt. Is moved using; A plurality of said support mechanisms in contact with said second part of said polishing belt only in the back of said another part of said polishing belt during the step of bidirectionally moving and polishing said another portion of said polishing belt within said polishing region. Polishing method characterized in that it is moved using a rotatable roller and a movement. A polishing apparatus adapted to polish using a polishing belt having a first end and a second end, and a polishing surface and a back side, A receiving area to which the first end of the polishing belt can be connected; A supply region to which the second end of the polishing belt can be connected; A support structure for providing a path of the polishing belt to move between the receiving area and the supply area, such that a workpiece processing area is present along the path, wherein the polishing surface of the polishing belt is configured to support the polishing belt. Said support structure configured not to be used by the support structure; A first drive mechanism that can be polished bidirectionally by linearly moving a portion of the polishing belt in the processing region in both directions; And Another portion of the polishing belt is located in the processing region and provided for advancing the polishing belt so that it can be used to bidirectionally linearly polish another portion of the polishing belt in the processing region. And a second driving mechanism. The method of claim 22, And a tensioning mechanism for tensioning said portion of said polishing belt within said polishing region. The method of claim 22, The support structure includes a plurality of rollers disposed on a polishing belt path exiting between the supply region and the receiving region, wherein the polishing belt advances the plurality of rollers, thereby polishing the polishing belt rather than the polishing surface of the polishing belt. Polishing device, characterized in that only the back of the contact with the plurality of rollers. The method of claim 22, The support structure supports the portion of the polishing belt so that the polishing surface of the polishing belt is not used by the support structure supporting the portion of the polishing belt, while the portion of the polishing belt is the treatment area. A polishing apparatus, characterized in that it is used to polish bidirectionally within. The method of claim 25, By positioning a first end of the polishing belt in the receiving region and a second end of the polishing belt in the supply region, so that the portion and the further portion are each polished bidirectionally and linearly in the processing region. And a bidirectional linear movement by the first driving mechanism. The method of claim 26, The second driving mechanism further provides for tensioning the portion of the polishing belt and the another portion within the processing region when the portion and the further portion are each within the processing region. Polishing device. The method of claim 22, The second drive mechanism further provides for tensioning the portion of the polishing belt and the another portion within the treatment region when the portion and the further portion of the polishing belt are each within the treatment region. Polishing apparatus, characterized in that. A method of generating a bidirectional linear motion of a portion of a polishing pad disposed in a processing area used for chemical mechanical polishing of a workpiece, the method comprising: Generating a rotational movement of the drive shaft; Converting a rotational movement on the drive shaft into a bidirectional linear movement of a slide member; And Generating a bidirectional linear motion of the portion of the polishing pad in the processing region in correspondence with the bidirectional linear motion of the slide member, wherein the polishing pad, when chemically and mechanically polishing the workpiece, Bi-directional linear motion of said portion of is used. The method of claim 29, During the generating step, the polishing pad passes through rollers disposed on the slide member. The method of claim 30, Said converting step provides horizontal bidirectional linear motion of said slide member and said generating step provides horizontal bidirectional linear motion of said portion of said polishing pad within said processing region. The method of claim 30, And said portion of said polishing pad moves more than said slide member. 33. The method of claim 32, The pad path provides that only the back surface of the polishing pad is in physical contact with the plurality of rollers. The method of claim 29, Said converting step provides horizontal bidirectional linear motion of said slide member and said generating step provides horizontal bidirectional linear motion of said portion of said polishing pad within said processing region. The method of claim 29, And said portion of said polishing pad moves more than said slide member. The method of claim 29, The pad path provides that only the back surface of the polishing pad is in physical contact with a plurality of rollers on the pad in the generating step. An apparatus for generating bidirectional linear motion in a region having a portion of a polishing pad corresponding to a treatment region used for chemical mechanical polishing of a workpiece using a solution, the apparatus comprising: A drive assembly comprising a rotatable shaft; And A slide member movable within a slide region, the slide member being mechanically coupled to the drive assembly such that rotation of the rotatable shaft produces a bilinear movement of the slide member, The polishing pad is disposed through the slide member such that the bilinear movement of the slide member produces a corresponding bilinear movement of the portion of the polishing pad, the bilinear movement of the portion of the polishing pad being the work. A device, which is used when polishing water mechanically and mechanically. The method of claim 37, The drive assembly, A gearbox coupled to the rotatable shaft and including another rotatable shaft; A crank coupled to the another rotatable shaft; And And a link coupled between the link and the slide member. The method of claim 38, And the slide member comprises a plurality of rollers. The method of claim 39, And bilinear movement of the slide member is horizontal. The method of claim 40, And a plurality of rollers providing a pad path between the supply spool and the receiving spool. The method of claim 41, wherein And the plurality of rollers are arranged such that the pad path provides that only the backside of the polishing pad is in physical contact with the plurality of rollers. In a method of applying tension to a portion of a polishing pad in a treatment region, Providing a polishing pad having a portion disposed in the processing area, one end attached to the supply spool and the other end attached to the receiving spool; Locking one of the supply spool and the receiving spool such that movement of the corresponding end of the polishing pad does not occur; And A tensioning device is used to tension the corresponding other end of the polishing pad from the other one of the supply spool and the receiving spool, and bilinear movement of the portion of the polishing pad within the treatment area using another drive mechanism. While the polishing pad is tensioned by the tensioning mechanism. The method of claim 43, Locking the supply spool; Tensioning the tension from the receiving spool; And Further comprising incrementally moving said polishing pad, wherein another portion is disposed within said processing region, and said incrementally moving step comprises said tensioning mechanism to incrementally move said polishing pad. Method for using the. The method of claim 44, The incrementally moving step, Removing tension from the receiving spool; Releasing said supply spool; And Incrementally moving the polishing pad with the tensioning mechanism while the supply spool is released. The method of claim 43, The tensioning step, Continuously monitoring the tension applied to the polishing pad; And Continuously adjusting the tension based on the continuously monitored tension. 47. The method of claim 46 wherein The tensioning step uses a motor to tension the receiving spool and to incrementally move the polishing pad. The method of claim 47, The providing step further comprises providing a plurality of rollers and another plurality of rollers disposed on the slide member. The method of claim 43, The pad path passes over the plurality of rollers and the another plurality of rollers. A device for tensioning and increasing a portion of a polishing pad in a treatment region used for chemical mechanical polishing of a workpiece using a solution, A drive assembly comprising a rotatable shaft; A slide member movable within a slide region, the rotation of the movable shaft being mechanically coupled to the drive assembly such that the linear movement of the slide member is generated, and the polishing pad is disposed through the slide member to provide the slide The slide member causing the bilinear movement of the member to produce a corresponding bilinear movement of the portion of the polishing pad; Feed spool; Receiving spool; A plurality of rollers creating a pad path between the supply spool and the receiving spool; And And when the portion of the polishing pad is used to chemically polish the workpiece, a tensioning mechanism for providing tension to the receiving spool and thus the portion of the polishing pad. 51. The method of claim 50, The tensioning mechanism is coupled to the receiving spool. The method of claim 51, And a locking mechanism coupled to the supply spool. The method of claim 52, wherein And a controller for controlling the tension provided by the tensioning mechanism. The method of claim 52, wherein And the controller receives a feedback signal to assist in controlling the tension provided by the tensioning mechanism. The method of claim 52, wherein The tensioning mechanism further provides for increasing the polishing pad. The method of claim 55, And the tensioning mechanism increases the polishing pad when the locking mechanism releases the supply spool.