AU2001265361A1 - Apparatus and method for spinning a work piece - Google Patents
Apparatus and method for spinning a work pieceInfo
- Publication number
- AU2001265361A1 AU2001265361A1 AU2001265361A AU6536101A AU2001265361A1 AU 2001265361 A1 AU2001265361 A1 AU 2001265361A1 AU 2001265361 A AU2001265361 A AU 2001265361A AU 6536101 A AU6536101 A AU 6536101A AU 2001265361 A1 AU2001265361 A1 AU 2001265361A1
- Authority
- AU
- Australia
- Prior art keywords
- spinning
- work piece
- piece
- work
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Spinning Or Twisting Of Yarns (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/586,207 US6363623B1 (en) | 2000-06-02 | 2000-06-02 | Apparatus and method for spinning a work piece |
US09586207 | 2000-06-02 | ||
PCT/US2001/018109 WO2001093316A2 (en) | 2000-06-02 | 2001-06-04 | Apparatus and method for spinning a work piece |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001265361A1 true AU2001265361A1 (en) | 2001-12-11 |
Family
ID=24344763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001265361A Abandoned AU2001265361A1 (en) | 2000-06-02 | 2001-06-04 | Apparatus and method for spinning a work piece |
Country Status (3)
Country | Link |
---|---|
US (1) | US6363623B1 (en) |
AU (1) | AU2001265361A1 (en) |
WO (1) | WO2001093316A2 (en) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6578853B1 (en) * | 2000-12-22 | 2003-06-17 | Lam Research Corporation | Chuck assembly for use in a spin, rinse, and dry module and methods for making and implementing the same |
US6752442B2 (en) * | 2001-11-09 | 2004-06-22 | Speedfam-Ipec Corporation | Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector |
US7032287B1 (en) * | 2002-07-19 | 2006-04-25 | Nanometrics Incorporated | Edge grip chuck |
US20040094187A1 (en) * | 2002-11-15 | 2004-05-20 | Lee Yong Ho | Apparatus and method for holding a semiconductor wafer using centrifugal force |
US7306002B2 (en) * | 2003-01-04 | 2007-12-11 | Yong Bae Kim | System and method for wet cleaning a semiconductor wafer |
US20070232072A1 (en) * | 2003-04-18 | 2007-10-04 | Bo Zheng | Formation of protection layer on wafer to prevent stain formation |
US20050020077A1 (en) * | 2003-04-18 | 2005-01-27 | Applied Materials, Inc. | Formation of protection layer by dripping DI on wafer with high rotation to prevent stain formation from H2O2/H2SO4 chemical splash |
US20050000173A1 (en) * | 2003-07-02 | 2005-01-06 | Vkr Holding A/S | Skylight with sealing gasket |
DE102004036435B4 (en) * | 2003-08-07 | 2007-08-30 | Nanophotonics Ag | Holding device for disc-shaped objects |
KR100672937B1 (en) * | 2004-07-19 | 2007-01-24 | 삼성전자주식회사 | Apparatus for treating semiconductor substrates |
US10179351B2 (en) | 2005-02-07 | 2019-01-15 | Planar Semiconductor, Inc. | Method and apparatus for cleaning flat objects with pulsed liquid jet |
TWM285024U (en) * | 2005-09-28 | 2006-01-01 | Micro Digital Automation Corp | Spin cleaning mechanism of photomasks |
KR100695229B1 (en) * | 2005-10-26 | 2007-03-14 | 세메스 주식회사 | Spin chuck |
US9732416B1 (en) | 2007-04-18 | 2017-08-15 | Novellus Systems, Inc. | Wafer chuck with aerodynamic design for turbulence reduction |
US8419964B2 (en) * | 2008-08-27 | 2013-04-16 | Novellus Systems, Inc. | Apparatus and method for edge bevel removal of copper from silicon wafers |
US8172646B2 (en) * | 2009-02-27 | 2012-05-08 | Novellus Systems, Inc. | Magnetically actuated chuck for edge bevel removal |
KR101055601B1 (en) * | 2011-01-25 | 2011-08-09 | 주식회사 쓰리디플러스 | Spin chuck for manufacturing substrate |
JP5712782B2 (en) * | 2011-05-13 | 2015-05-07 | 株式会社Sumco | Susceptor support shaft for epitaxial wafer growth apparatus and epitaxial growth apparatus |
US9421617B2 (en) | 2011-06-22 | 2016-08-23 | Tel Nexx, Inc. | Substrate holder |
US9117856B2 (en) | 2011-07-06 | 2015-08-25 | Tel Nexx, Inc. | Substrate loader and unloader having an air bearing support |
US9038262B2 (en) * | 2012-02-23 | 2015-05-26 | Beijing Sevenstar Electronics Co., Ltd. | Device for holding disk-shaped articles and method thereof |
JP5962981B2 (en) * | 2012-08-24 | 2016-08-03 | 株式会社Screenホールディングス | Substrate rotation holding device and substrate processing apparatus |
JP6562507B2 (en) * | 2015-09-28 | 2019-08-21 | 株式会社Screenホールディングス | Substrate holding device and substrate processing apparatus having the same |
US10373858B2 (en) | 2016-04-06 | 2019-08-06 | Lam Research Corporation | Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal |
CN106373918A (en) * | 2016-09-30 | 2017-02-01 | 无锡宏纳科技有限公司 | Wafer clamping device with sliding card position device |
US10704142B2 (en) * | 2017-07-27 | 2020-07-07 | Applied Materials, Inc. | Quick disconnect resistance temperature detector assembly for rotating pedestal |
CN109248894A (en) * | 2018-12-03 | 2019-01-22 | 杭州众硅电子科技有限公司 | A kind of fastening structure for rinsing, cleaning with the equipment of dry wafer |
CN111312644A (en) * | 2020-02-26 | 2020-06-19 | 厦门通富微电子有限公司 | Automatic wafer alignment device and etching machine |
CN111508889A (en) * | 2020-03-13 | 2020-08-07 | 宁波润华全芯微电子设备有限公司 | Wafer bearing table for clamping wafer by using centrifugal force |
CN112846521B (en) * | 2020-12-31 | 2024-03-12 | 大族激光科技产业集团股份有限公司 | Clamp and laser marking system |
CN116783695A (en) * | 2021-01-12 | 2023-09-19 | 应用材料公司 | Clamping mechanism for fixing substrate on carrier |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4651440A (en) | 1986-05-16 | 1987-03-24 | Eastman Kodak Company | Spin drying apparatus |
JPH0590238A (en) * | 1991-09-27 | 1993-04-09 | Dainippon Screen Mfg Co Ltd | Substrate rotary holding jig of pivoted substrate treating device |
US5350427A (en) * | 1993-06-14 | 1994-09-27 | Varian Associates, Inc. | Wafer retaining platen having peripheral clamp and wafer lifting means |
US5364474A (en) | 1993-07-23 | 1994-11-15 | Williford Jr John F | Method for removing particulate matter |
US5518542A (en) * | 1993-11-05 | 1996-05-21 | Tokyo Electron Limited | Double-sided substrate cleaning apparatus |
US5863348A (en) * | 1993-12-22 | 1999-01-26 | International Business Machines Corporation | Programmable method for cleaning semiconductor elements |
JP3556043B2 (en) | 1996-03-19 | 2004-08-18 | 株式会社荏原製作所 | Substrate drying equipment |
US5775000A (en) | 1996-05-13 | 1998-07-07 | Ebara Corporation | Substrate gripper device for spin drying |
US5851041A (en) * | 1996-06-26 | 1998-12-22 | Ontrak Systems, Inc. | Wafer holder with spindle assembly and wafer holder actuator |
US5778554A (en) | 1996-07-15 | 1998-07-14 | Oliver Design, Inc. | Wafer spin dryer and method of drying a wafer |
JP3831043B2 (en) * | 1997-01-24 | 2006-10-11 | 東京エレクトロン株式会社 | Rotation processing device |
US5974681A (en) * | 1997-09-10 | 1999-11-02 | Speedfam-Ipec Corp. | Apparatus for spin drying a workpiece |
US6167893B1 (en) * | 1999-02-09 | 2001-01-02 | Novellus Systems, Inc. | Dynamic chuck for semiconductor wafer or other substrate |
-
2000
- 2000-06-02 US US09/586,207 patent/US6363623B1/en not_active Expired - Lifetime
-
2001
- 2001-06-04 WO PCT/US2001/018109 patent/WO2001093316A2/en active Application Filing
- 2001-06-04 AU AU2001265361A patent/AU2001265361A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2001093316A3 (en) | 2002-06-20 |
WO2001093316A2 (en) | 2001-12-06 |
US6363623B1 (en) | 2002-04-02 |
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